Circuit system model design method and device, electronic equipment and storage medium

Abstract

The invention provides a circuit system model design method and device, electronic equipment and a storage medium, and particularly relates to the technical field of circuit system model design. The method comprises the following steps: acquiring a circuit system design demand, analyzing the circuit system design demand, and generating a circuit board design demand package diagram, a circuit signal flow package diagram, a circuit board design package diagram and a functional module package diagram; determining first design information according to the circuit board design demand package diagram; determining second design information according to the function module package diagram; determining third design information according to the circuit board design package diagram; determining fourth design information according to the circuit signal flow packet diagram; and drawing according to the first design information, the second design information, the third design information and the fourth design information to obtain a circuit system model of the target circuit system. According to the method, the circuit system model can be automatically generated according to the circuit system design requirement, manpower is saved, and the drawing time of the circuit system model is saved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit system model design, and in particular to a circuit system model design method, device, electronic device and storage medium. Background Art

[0002] Circuit system models can simplify complex circuit systems into basic circuit elements, such as resistors, capacitors, inductors, etc. This simplification allows engineers and technicians to more easily analyze and understand the behavior of circuits, allowing for more efficient circuit design and optimization. With circuit system models, engineers can predict the behavior of circuits under different conditions. This helps avoid potential problems during the design phase and improves circuit reliability and performance. The ability to predict circuit behavior is one of the important goals of circuit system model design.

[0003] However, in the prior art, the design process of the circuit system model is completed manually, which is time-consuming and laborious. In addition, the design process is prone to errors, resulting in the circuit system model obtained not being consistent with the actual design requirements, which in turn results in functional deviations and causes unnecessary economic losses.

[0004] Therefore, the design process of the circuit system model is completed manually, which is time-consuming and labor-intensive.

[0005] Application Contents

[0006] In view of this, the purpose of this application is to provide a circuit system model design method, device, electronic device and storage medium to solve the above-mentioned problems, realize the independent design of circuit system models through simulation equipment, and save design time and manpower.

[0007] In a first aspect, an embodiment of the present application provides a circuit system model design method, which is applied to a simulation device, and the method includes:

[0008] Obtaining circuit system design requirements, and analyzing the circuit system design requirements to generate a circuit board design requirement package diagram, a circuit signal flow package diagram, a circuit board design package diagram, and a functional module package diagram;

[0009] Determine the first design information according to the circuit board design requirement package diagram; wherein the first design information includes at least one of the following: the function of the target circuit board in the first format, the power consumption of the target circuit board, the size of the target circuit board, the weight of the target circuit board, the operating temperature of the target circuit board, the external interface of the target circuit board, the data transmission line bandwidth of the target circuit board, the data processing frequency of the target circuit board and the data storage capacity of the target circuit board;

[0010] Determine the second design information according to the functional module package diagram; wherein the second design information is used to characterize the circuit modules of each target circuit board in the first format;

[0011] Determine the third design information according to the circuit board design package drawing; wherein the third design information is the attributes between each circuit module in the first format, the function of each circuit module, the attributes of each component in each circuit module and the connection relationship between each of the components;

[0012] Determine fourth design information according to the circuit signal flow packet diagram; wherein the fourth design information is the attribute and direction of the signal flow between each circuit module in the first format;

[0013] Drawing is performed according to the first design information, the second design information, the third design information and the fourth design information to obtain a circuit system model of the target circuit system.

[0014] Preferably, the circuit board design requirement package diagram is determined by:

[0015] Parsing the circuit system design requirements to generate target circuit board description information; wherein the target circuit board description information is used to represent the first design information in a second format;

[0016] The circuit board design requirement package diagram is drawn according to the target circuit board description information.

[0017] Preferably, the functional module package diagram is determined in the following manner:

[0018] Parsing the circuit system model design requirements to generate functional module description information; wherein the functional module description information is used to represent the second design information in a second format;

[0019] Draw the functional module package diagram according to the functional module description information.

[0020] Preferably, a preset circuit module is selected from a circuit module library according to the functional module description information, and the functional module package diagram is generated according to the preset circuit module.

[0021] Preferably, the circuit board design package diagram is determined by:

[0022] Parsing the circuit system model design requirements to generate circuit module description information; wherein the circuit module description information is used to represent the third design information in the second format;

[0023] The circuit board design package diagram is drawn according to the circuit module description information.

[0024] Preferably, the circuit signal flow packet diagram is determined by:

[0025] Parsing the circuit system model design requirements to generate signal flow description information; wherein the signal flow description information is used to characterize the fourth design information in the second format;

[0026] The circuit signal flow packet diagram is drawn according to the signal flow description information.

[0027] Preferably, the method further comprises:

[0028] Parsing the circuit system design requirements to generate a circuit system traceability matrix; wherein the circuit system traceability matrix is ​​used to represent the circuit system design requirements in a third format;

[0029] Verifying the circuit system model of the target circuit system through the circuit system traceability matrix to obtain a verification result;

[0030] If the verification result indicates that the circuit system model of the target circuit system does not meet the circuit system design requirement, the circuit system model of the target circuit system is modified.

[0031] The circuit system model design method provided by this application brings the following beneficial effects:

[0032] The present application provides a circuit system model design method, in which a simulation device draws according to first design information, second design information, third design information and fourth design information to obtain a circuit system model of a target circuit system. The first design information, the second design information, the third design information and the fourth design information are respectively determined by a circuit board design requirement package diagram, a circuit board design package diagram, a functional module package diagram and a circuit signal flow package diagram, and the circuit board design requirement package diagram, the circuit board design package diagram, the functional module package diagram and the circuit signal flow package diagram are obtained by analyzing the circuit system design requirements by the simulation device. The method can autonomously generate a circuit system model according to the circuit system design requirements, save manpower, save the drawing time of the circuit system model, avoid the drawing errors caused by the manual integration of the circuit system design requirements, and improve the accuracy of the circuit system model drawing.

[0033] In a second aspect, the present application also provides a circuit system model design device, the device comprising:

[0034] An acquisition module, used for acquiring circuit system design requirements;

[0035] A data processing module, used for analyzing the circuit system design requirements, generating a circuit board design requirements package diagram, a circuit signal flow package diagram, a circuit board design package diagram and a function module package diagram;

[0036] The data processing module is further used to determine the first design information according to the circuit board design requirement package diagram; wherein the first design information includes at least one of the following: the function of the target circuit board in the first format, the power consumption of the target circuit board, the size of the target circuit board, the weight of the target circuit board, the operating temperature of the target circuit board, the external interface of the target circuit board, the data transmission line bandwidth of the target circuit board, the data processing frequency of the target circuit board and the data storage capacity of the target circuit board; determine the second design information according to the functional module package diagram; wherein the second design information is used to characterize the circuit modules of each target circuit board in the first format; determine the third design information according to the circuit board design package diagram; wherein the third design information is the attributes between each circuit module in the first format, the functions of each circuit module, the attributes of each component in each circuit module and the connection relationship between each of the components; determine the fourth design information according to the circuit signal flow package diagram; wherein the fourth design information is the attributes and direction of the signal flow between each circuit module in the first format; draw according to the first design information, the second design information, the third design information and the fourth design information to obtain the circuit system model of the target circuit system.

[0037] The circuit system model design device provided in the embodiment of the present application has the same technical features as the circuit system model design method provided in the above-mentioned embodiment, so it can also solve the same technical problems and achieve the same technical effects.

[0038] In a third aspect, the present application also provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the beneficial effects of any of the methods described above are achieved, which will not be repeated here.

[0039] In a fourth aspect, the present application further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the beneficial effects of any of the methods described above are achieved, which will not be repeated here.

[0040] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or understood by practicing the present application. The purpose and other advantages of the present application are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0041] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0043] Figure 1 A schematic diagram of a circuit system model design method flow chart provided in an embodiment of the present application;

[0044] Figure 2 A schematic diagram of a package diagram provided for an embodiment of the present application;

[0045] Figure 3 A circuit board design requirements package diagram for a control and processing circuit board provided in an embodiment of the present application;

[0046] Figure 4 A diagram of the functional modules provided in the embodiments of the present application;

[0047] Figure 5 A circuit signal flow diagram provided for an embodiment of the present application;

[0048] Figure 6 Schematic diagram of the circuit system model provided in the embodiment of the present application

[0049] Figure 7 A module definition diagram provided for an embodiment of the present application;

[0050] Figure 8 An internal module diagram provided for an embodiment of the present application;

[0051] Fig. 9 A schematic diagram of a circuit system traceability matrix provided in an embodiment of the present application;

[0052] Fig.10 A schematic diagram of the structure of a circuit system model design device provided in an embodiment of the present application;

[0053] Fig.11 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0054] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0055] To facilitate understanding of this embodiment, the embodiments of the present application are described in detail below.

[0056] The present application embodiment provides a circuit system model design method, which is applied to a simulation device, such as Figure 1 As shown, Figure 1 A schematic diagram of a circuit system model design method provided in an embodiment of the present application. The method comprises the following steps:

[0057] S101, the simulation device obtains the circuit system design requirements, analyzes the circuit system design requirements, and generates a circuit board design requirement package diagram, a circuit signal flow package diagram, a circuit board design package diagram, and a functional module package diagram.

[0058] Specifically, the above-mentioned simulation device is provided with a SysML (Systems Modeling Language) model. The SysML model is a graphical modeling language that can provide a semantic basis for requirements, behaviors, structures and parameters (mathematical models) in system modeling, and can integrate other engineering analysis models. The SysML model has been widely used in MBSE (Model-Based Systems Engineering) practice to support the representation, analysis and design of complex systems. The above-mentioned circuit board design requirement package diagram, circuit signal flow package diagram, circuit board design package diagram and functional module package diagram all belong to the PKG (Package Diagram) function of the SysML model.

[0059] The circuit board design requirement package diagram is used to display the organizational structure and hierarchical relationship between each target circuit board; the circuit signal flow package diagram is used to display the properties and direction of the signal flow between each circuit module of each target circuit board; the circuit board design package diagram is used to display the organizational structure and hierarchical relationship between each circuit module and each target circuit board (including the connectors on the target circuit board); the functional module package diagram is used to display the organizational structure and hierarchical relationship of each circuit module.

[0060] like Figure 2 As shown, Figure 2 A schematic diagram of a package diagram provided for an embodiment of the present application. The staff inputs the circuit system design requirements into the SysML model of the simulation device so that the SysML model analyzes the circuit system design requirements and manages the above-mentioned circuit board design requirement package diagram, circuit board design package diagram, circuit signal flow package diagram and functional module package diagram through the package diagram function (including the diagram manager 203 in the manager 202).

[0061] S102, the simulation device determines first design information according to the circuit board design requirement package drawing.

[0062] Among them, the first design information includes at least one of the following: the function of the target circuit board in the first format, the power consumption of the target circuit board, the size of the target circuit board, the weight of the target circuit board, the operating temperature of the target circuit board, the external interface of the target circuit board, the data transmission line bandwidth of the target circuit board, the data processing frequency of the target circuit board and the data storage capacity of the target circuit board.

[0063] Specifically, the circuit board design requirement package diagram of the control processing circuit board is used as an example for introduction. Figure 3 As shown, Figure 3 A circuit board design requirement package diagram for a control and processing circuit board provided in an embodiment of the present application. The above-mentioned first design information is obtained by parsing the circuit board design requirement package diagram by a simulation device, and the first design information includes the functions of the target circuit board (control and processing circuit board) (the circuit board sends LVDS images through connector X2; the circuit board can convert 12V power supply to 3.3V, 1.8V, 1.2V, 1.0V; the circuit board can convert 12V power supply to power supply for each chip; the circuit board can provide 3.3V power supply; the circuit board is powered through connector X1; the circuit board has a core processor that can control each interface chip; the circuit board can receive time synchronization signals through the RS422 interface; the circuit board The board can send LVDS images, the interface chip uses jmx9247, the rate is 400Mbps); the power consumption of the target circuit board (the input voltage of the circuit board is 12V, the steady-state power consumption is not more than 18W, and the transient (10ms) power consumption is not more than 24W); the size of the target circuit board (not shown in the figure); the weight of the target circuit board (not shown in the figure); the operating temperature of the target circuit board (the operating environment temperature of the circuit board is -40℃~+70℃); the external interface of the target circuit board (not shown in the figure); the data transmission line bandwidth of the target circuit board (not shown in the figure); the data processing frequency of the target circuit board (not shown in the figure).

[0064] S103, the simulation device determines the second design information according to the functional module package diagram.

[0065] The second design information is used to characterize the circuit modules of each target circuit board in the first format.

[0066] Specifically, the circuit module of the target circuit board can be a single component or a CBB (Common Building Blocks). CBB is a combination of a series of standardized electronic components that can realize specific circuit functions. Figure 4 As shown, Figure 4The functional module package diagram provided for the embodiment of the present application includes: CBB_4644_Imported1, CBB_JFM7K325T_Imported1 and CBB-9247_Imported1.

[0067] The above CBB_4644_Imported1, CBB_JFM7K325T_Imported1 and CBB-9247_Imported1 are all CBB models.

[0068] S104, the simulation device determines third design information according to the circuit board design package drawing.

[0069] The third design information is the properties between the various circuit modules in the first format, the functions of the various circuit modules, the properties of the various components in the various circuit modules, and the connection relationship between the various components.

[0070] Specifically, the properties between the various circuit modules in the first format include: data transmission properties between the various circuit modules and power conversion properties between the various circuit modules. The functions between the various circuit modules in the first format include: logic operation functions between the various circuit modules, signal processing functions between the various circuit modules, and interface conversion functions between the various circuit modules. The above-mentioned circuit modules include multiple components, and the properties of each component include: the type of component and the value of the component, such as the resistance, capacitance, and inductance of the component. The connection relationship between the various components includes: series connection, parallel connection, mixed connection, and star connection.

[0071] S105: The simulation device determines fourth design information according to the circuit signal flow packet diagram.

[0072] The fourth design information is the properties and directions of the signal flows between the various circuit modules in the first format.

[0073] Specifically, Figure 5 As shown, Figure 5 A circuit signal flow packet diagram provided for an embodiment of the present application. The properties of the signal flow between the above-mentioned circuit modules include on-board power supply, control signal, clock frequency and data flow. The direction of the signal flow between each circuit module is set according to the connection relationship between each circuit module. Among them, the on-board power supply includes: +1.2V, +1.8V, +12V, +1V, +3.3V and GND, the control signals include: 9247, DE, PRE, PWDWN, RNG0, RNG1, the clock frequencies include: 20MHZ, 25MHZ and 50MHZ, and the data stream includes: LVDS_D[17:0], LVDS_IN, LVDS_OUT.

[0074] S106, the simulation device draws according to the first design information, the second design information, the third design information and the fourth design information to obtain a circuit system model of the target circuit system.

[0075] Specifically, the first design information, the second design information, the third design information and the fourth design information summarize the complete circuit system design requirements. After analysis and integration by the simulation equipment, the elements constituting the circuit system model can be accurately determined. The simulation equipment can visualize the circuit system model to make the circuit system model more intuitive. Figure 6 As shown, Figure 6 A schematic diagram of a circuit system model provided in an embodiment of the present application. The circuit system model includes: X1, X2, LVDS transmission module 601, K7 minimum system 602, HCE4664 module 603. With such a configuration, the simulation device can automatically draw a circuit system model through the first design information, the second design information, the third design information, and the fourth design information, thereby freeing up manpower and saving drawing time.

[0076] The embodiment of the present application provides a circuit system model design method, in which the simulation device draws according to the first design information, the second design information, the third design information and the fourth design information to obtain the circuit system model of the target circuit system. Wherein, the first design information, the second design information, the third design information and the fourth design information are respectively determined by the circuit board design requirement package diagram, the circuit board design package diagram, the functional module package diagram and the circuit signal flow package diagram, and the circuit board design requirement package diagram, the circuit board design package diagram, the functional module package diagram and the circuit signal flow package diagram are obtained by the simulation device analyzing the circuit system design requirements. In this method, only the staff needs to input the circuit system design requirements into the SysML model of the simulation device, and the SysML model can automatically integrate and analyze the circuit system design requirements, classify and manage the circuit system design requirements through the package diagram function, and obtain the circuit system model. Compared with the prior art, in which the circuit system design requirements are manually sorted and summarized to draw the circuit system model, the process of drawing the circuit system model in this method does not require human intervention. The method can autonomously generate a circuit system model according to the circuit system design requirements, saving manpower and time in drawing the circuit system model, avoiding drawing errors caused by manual integration of circuit system design requirements, and improving the accuracy of circuit system model drawing.

[0077] The following is an introduction to the method of determining the circuit board design requirement package diagram. The simulation device analyzes the circuit system design requirements, generates target circuit board description information, and draws the circuit board design requirement package diagram according to the target circuit board description information; wherein the target circuit board description information is used to represent the first design information in the second format.

[0078] Specifically, the target circuit board description information may be in XML format. The target circuit board description information is the design requirements for the target circuit board in the circuit system design requirements. The design requirements for the target circuit board in the circuit system design requirements are input into the SysML model in XML format, and after integration, analysis and visual conversion, a circuit board design requirements package diagram is generated.

[0079] In this method, in order to adapt the design requirements of the target circuit board in the above circuit system design requirements to the language environment of the SysML model, it is necessary to convert the design requirements of the target circuit board into XML format, that is, the target circuit board description information. The SysML model visualizes the target circuit board description information, that is, the circuit board design requirement package diagram, so as to intuitively display the design requirements of the target circuit board, improve the management convenience of the design requirements of the target circuit board, and enhance the understanding of the design requirements of the target circuit board.

[0080] The following describes a method for determining a functional module package diagram: The simulation device analyzes the circuit system model design requirements, generates functional module description information, and draws a functional module package diagram according to the functional module description information; wherein the functional module description information is used to represent the second design information in the second format.

[0081] Specifically, the simulation device parses the design requirements of the circuit module in the circuit system model design requirements to obtain the functional module description information, which includes both the entity information (specific attributes) of the individual components and the entity information (specific composition) of the CBB. The entity information (specific attributes) of each component and the entity information (specific composition) of the CBB are input into the SysML model, and after integration, analysis and visual conversion, a functional module package diagram is generated.

[0082] In this method, the SysML model visualizes the functional module description information, namely, the functional module package diagram, so as to intuitively display the design requirements for the circuit module, improve the management convenience of the design requirements for the circuit module, and enhance the understanding of the design requirements for the circuit module.

[0083] In one implementation, the simulation device selects a preset circuit module from a circuit module library according to the functional module description information, and generates a functional module package diagram according to the preset circuit module.

[0084] Specifically, the above-mentioned preset circuit module is CBB. The combination and connection mode of each electronic component in CBB is usually verified by a large number of experiments and tests, and the function is reliable. CBB can be repeatedly called from the circuit module library to construct a functional module package diagram.

[0085] This method can select CBBs in the circuit module library and present them in a concrete form in the form of a functional module package diagram, thereby improving the flexibility of generating the functional module package diagram.

[0086] The following is an introduction to the method of determining the circuit board design package diagram. The simulation device analyzes the circuit system model design requirements, generates circuit module description information, and draws the circuit board design package diagram according to the circuit module description information; wherein the circuit module description information is used to represent the third design information in the second format.

[0087] Specifically, the SysML model creates a BDD (Block Definition Diagram) in the circuit board design package diagram. Figure 7 As shown, Figure 7Module definition diagram provided for the embodiment of the present application. BDD can visualize the value attributes, full ports and connection relationships of X1, X2, LVDS transmission module 601, K7 minimum system 602 and HCE4664 module 603 based on the circuit module description information. For example: the value attributes of HCE4644 module 603 include: CBB_ID = 00001, input voltage = 4V ~ 14V, output voltage = 0.6V ~ 5.5V, single channel output current = 4A, working environment temperature = -55℃ ~ 125℃, quality level = N, GJB, G, application level = level III. The full port of HCE4644 module 603 includes: input voltage GND, output voltage 1 = A1, A2, A3, output voltage 2 = C1, D1, D2, output voltage 3 = F1, G1, G2, output voltage 4 = J1, K1, K2, PowerGood1 = C3, PowerGood2 = C2PowerGood1 = F2, PowerGood1 = J2, output enable 1 = C6, output enable 2 = F6, output enable 3 = J6 and output enable 4 = K7. The value attributes of the LVDS transmission module 601 include: maximum input clock frequency: 24MHZ, LVDS output frequency: 2.5MHZ~42MHZ, working environment temperature: -55℃~125℃, power supply voltage: 3.0V~3.6V, ESD: 4000V, quality level: B, GJB, G, manufacturer: China Electronics 58 Institute, application level: III, CBB_ID=00003, maximum power consumption=0.25W, maximum current=0.075A. The value attributes of the K7 minimum system 602 include: CBB_ID=00002, no DDR3, FLASH capacity 512Mbit, quality level: B, N, GJB, G, application level III, environment temperature: -55℃~125℃. The value attributes of X2 include: REF=X2, SAP=11000032156. The full ports of X2 include: P1, P2, P3, P4, P5, P6. The value attributes of X1 include: REF = X1, SAP = 11000012121. The full ports of X1 include: P1, P2, P3, P4, P5, P6. The connection relationship between X1, X2, LVDS transmission module 601, K7 minimum system 602 and HCE4664 module 603 is: X1 and X2 are connected to the above-mentioned control and processing circuit board, LVDS transmission module 601 and HCE4664 module 603 are connected to the control and processing circuit board, and K7 minimum system 602 is connected to the control and processing circuit board.

[0088] The SysML model creates an IBD (Internal Block Diagram) in the PCB design package diagram. Figure 8 As shown, Figure 8The internal module diagram provided for the embodiment of the present application. The interfaces of X1 in IBD include P1 and P2, the interfaces of X2 include P1, P2, P3, P4, P5 and P6, and the minimum system of K7 includes BANK0, BANK14, BANK15, BANK GND, BANKVCC and BANK12.

[0089] In order to adapt the design requirements on the circuit module in the above circuit system design requirements to the language environment of the SysML model, it is necessary to convert the design requirements on the circuit module into XML format, that is, circuit module description information.

[0090] In this method, the SysML model visualizes the circuit module description information to obtain BDD and IBD, which together constitute the circuit board design requirement package diagram, so as to intuitively display the design requirements for the circuit module, improve the management convenience of the design requirements for the circuit module, and enhance the understanding of the design requirements for the circuit module.

[0091] The following describes a method for determining a circuit signal flow packet diagram. The simulation device analyzes the circuit system model design requirements, generates signal flow description information, and draws the circuit signal flow packet diagram according to the signal flow description information; wherein the signal flow description information is used to represent the fourth design information in the second format.

[0092] Specifically, the signal flow description information may be in XML format. The signal flow description information is the design requirements for the signal flow between various circuit modules in the circuit system design requirements. The design requirements for the signal flow between various circuit modules in the circuit system design requirements are input into the SysML model in XML format, and after integration, analysis and visual conversion, a circuit signal flow package diagram is generated.

[0093] In this method, in order to adapt the design requirements for the signal flow between each circuit module in the above circuit system design requirements to the language environment of the SysML model, it is necessary to convert the design requirements for the signal flow between each circuit module into XML format, that is, signal flow description information. The SysML model visualizes the signal flow description information, that is, the circuit signal flow package diagram, so as to intuitively display the design requirements for the signal flow between each circuit module, improve the management convenience of the design requirements for the signal flow between each circuit module, and enhance the understanding of the design requirements for the signal flow between each circuit module.

[0094] In one embodiment, a simulation device analyzes the circuit system design requirements, generates a circuit system traceability matrix, verifies the circuit system model of the target circuit system through the circuit system traceability matrix, and obtains a verification result; if the verification result indicates that the circuit system model of the target circuit system does not meet the circuit system design requirements, the circuit system model of the target circuit system is modified; wherein the circuit system traceability matrix is ​​used to represent the circuit system design requirements in the third format.

[0095] Specifically, if Fig. 9 As shown, Fig. 9 A schematic diagram of a circuit system traceability matrix provided in an embodiment of the present application. Column 901 of the circuit system traceability matrix is ​​the name of the circuit system design requirement, and the upper right column 902 is the circuit system design requirement content (system element). If the intersection of columns 901 and 902 in the matrix indicates that the circuit system model of the target circuit system meets the circuit system design requirement, and if the intersection of columns 901 and 902 in the matrix does not occur, it indicates that the circuit system model of the target circuit system does not meet the circuit system design requirement.

[0096] This method determines whether the circuit system model of the target circuit system meets the circuit system design requirements through the circuit system traceability matrix, and can promptly prompt the staff to modify the circuit system model of the target circuit system that does not meet the circuit system design requirements to improve the accuracy of the circuit system model.

[0097] Based on the above method embodiment, the present application embodiment also provides a circuit system model design device. Fig.10 As shown, Fig.10 A schematic diagram of the structure of a circuit system model design device provided in an embodiment of the present application. The device includes an acquisition module 1001 and a data processing module 1002; wherein the functions of each module are as follows:

[0098] An acquisition module 1001 is used to acquire circuit system design requirements;

[0099] The data processing module 1002 is used to analyze the circuit system design requirements and generate a circuit board design requirement package diagram, a circuit signal flow package diagram, a circuit board design package diagram and a function module package diagram;

[0100] The data processing module 1002 is also used to determine the first design information according to the circuit board design requirement package diagram; wherein the first design information includes at least one of the following: the function of the target circuit board in the first format, the power consumption of the target circuit board, the size of the target circuit board, the weight of the target circuit board, the operating temperature of the target circuit board, the external interface of the target circuit board, the data transmission line bandwidth of the target circuit board, the data processing frequency of the target circuit board and the data storage capacity of the target circuit board; determine the second design information according to the function module package diagram; wherein the second design information is used to characterize the circuit modules of each target circuit board in the first format; determine the third design information according to the circuit board design package diagram; wherein the third design information is the attributes between each circuit module in the first format, the function of each circuit module, the attributes of each component in each circuit module and the connection relationship of each component; determine the fourth design information according to the circuit signal flow package diagram; wherein the fourth design information is the attributes and direction of the signal flow between each circuit module in the first format; draw according to the first design information, the second design information, the third design information and the fourth design information to obtain the circuit system model of the target circuit system.

[0101] Preferably, the data processing module 1002 is specifically used to parse the circuit system design requirements and generate target circuit board description information; wherein the target circuit board description information is used to represent the first design information in the second format;

[0102] The data processing module 1002 is specifically used to draw a circuit board design requirement package diagram according to the target circuit board description information.

[0103] Preferably, the data processing module 1002 is specifically used to parse the circuit system model design requirements and generate functional module description information; wherein the functional module description information is used to represent the second design information in the second format;

[0104] The data processing module 1002 is specifically used to draw a functional module package diagram according to the functional module description information.

[0105] Preferably, the acquisition module 1001 is further used to select a preset circuit module from a circuit module library according to the functional module description information;

[0106] The data processing module 1002 is also used to generate a functional module package diagram according to the preset circuit module.

[0107] Preferably, the data processing module 1002 is specifically used to parse the circuit system model design requirements and generate circuit module description information; wherein the circuit module description information is used to represent the third design information in the second format;

[0108] The data processing module 1002 is specifically used to draw a circuit board design package diagram according to the circuit module description information.

[0109] Preferably, the data processing module 1002 is specifically used to parse the circuit system model design requirements and generate signal flow description information; wherein the signal flow description information is used to represent the fourth design information in the second format;

[0110] Preferably, the data processing module 1002 is specifically configured to draw a circuit signal flow packet diagram according to the signal flow description information.

[0111] Preferably, the data processing module 1002 is further used to analyze the circuit system design requirements and generate a circuit system traceability matrix; wherein the circuit system traceability matrix is ​​used to represent the circuit system design requirements in the third format;

[0112] The data processing module 1002 is further used to verify the circuit system model of the target circuit system through the circuit system traceability matrix to obtain a verification result;

[0113] The data processing module 1002 is further configured to modify the circuit system model of the target circuit system if the verification result indicates that the circuit system model of the target circuit system does not meet the circuit system design requirements.

[0114] The circuit system model design device provided in the embodiment of the present application has the same technical features as the circuit system model design method provided in the above-mentioned embodiment, so it can also solve the same technical problems and achieve the same technical effects.

[0115] An embodiment of the present application also provides an electronic device, including a processor and a memory, wherein the memory stores machine executable instructions that can be executed by the processor, and the processor executes the machine executable instructions to implement the above-mentioned circuit system model design method.

[0116] See also Fig.11 As shown, the electronic device includes a processor 100 and a memory 101. The memory 101 stores machine executable instructions that can be executed by the processor 100. The processor 100 executes the machine executable instructions to implement the above-mentioned circuit system model design method.

[0117] Further, Fig.11 The electronic device shown further includes a bus 102 and a communication interface 103 , and the processor 100 , the communication interface 103 and the memory 101 are connected via the bus 102 .

[0118] Among them, the memory 101 may include a high-speed random access memory (RAM), and may also include a non-volatile memory (non-volatile memory), such as at least one disk storage. The communication connection between the system network element and at least one other network element is realized through at least one communication interface 103 (which can be wired or wireless), and the Internet, wide area network, local area network, metropolitan area network, etc. can be used. The bus 102 can be an ISA (Industrial Standard Architecture) bus, a PCI (Peripheral Component Interconnect) bus or an EISA (Enhanced Industry Standard Architecture) bus, etc. The above-mentioned bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Fig.11 Only one bidirectional arrow is used in the diagram, but this does not mean that there is only one bus or only one type of bus.

[0119] The processor 100 may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by the hardware integrated logic circuit or software instructions in the processor 100. The above processor 100 can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The methods, steps and logic block diagrams disclosed in the embodiments of the present application can be implemented or executed. The general processor can be a microprocessor or the processor can also be any conventional processor, etc. The steps of the method disclosed in the embodiments of the present application can be directly embodied as a hardware decoding processor for execution, or a combination of hardware and software modules in the decoding processor for execution. The software module may be located in a storage medium mature in the art, such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory, or an electrically erasable programmable memory, a register, etc. The storage medium is located in the memory 101, and the processor 100 reads the information in the memory 101 and completes the steps of the method of the above embodiment in combination with its hardware.

[0120] This embodiment also provides a machine-readable storage medium, which stores machine-executable instructions. When the machine-executable instructions are called and executed by a processor, the machine-executable instructions prompt the processor to implement the above-mentioned circuit system model design method.

[0121] The circuit system model design method, device, and computer program product of the electronic device provided in the embodiments of the present application include a computer-readable storage medium storing program code, and the instructions included in the program code can be used to execute the method described in the previous method embodiment. The specific implementation can be referred to the method embodiment, which will not be repeated here. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the system and device described above can refer to the corresponding process in the previous method embodiment, which will not be repeated here.

[0122] In addition, in the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances. If the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a non-volatile computer-readable storage medium that can be executed by a processor. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or the part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium and includes a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage media include: U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), disk or optical disk and other media that can store program codes.

[0123] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0124] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present application, which are used to illustrate the technical solutions of the present application, rather than to limit them. The protection scope of the present application is not limited thereto. Although the present application is described in detail with reference to the above-described embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-described embodiments within the technical scope disclosed in the present application, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A circuit system model design method, characterized in that: Applied to a simulation device, the method comprises: Obtaining circuit system design requirements, and analyzing the circuit system design requirements to generate a circuit board design requirement package diagram, a circuit signal flow package diagram, a circuit board design package diagram, and a functional module package diagram; Determine the first design information according to the circuit board design requirement package diagram; wherein the first design information includes at least one of the following: the function of the target circuit board in the first format, the power consumption of the target circuit board, the size of the target circuit board, the weight of the target circuit board, the operating temperature of the target circuit board, the external interface of the target circuit board, the data transmission line bandwidth of the target circuit board, the data processing frequency of the target circuit board and the data storage capacity of the target circuit board; Determine the second design information according to the functional module package diagram; wherein the second design information is used to characterize the circuit modules of each target circuit board in the first format; Determine the third design information according to the circuit board design package drawing; wherein the third design information is the attributes between each circuit module in the first format, the function of each circuit module, the attributes of each component in each circuit module and the connection relationship between each of the components; Determine fourth design information according to the circuit signal flow packet diagram; wherein the fourth design information is the attribute and direction of the signal flow between each circuit module in the first format; Drawing is performed according to the first design information, the second design information, the third design information and the fourth design information to obtain a circuit system model of the target circuit system.

2. The circuit system model design method according to claim 1, characterized in that: The circuit board design requirement package diagram is determined by the following method: Parsing the circuit system design requirements to generate target circuit board description information; wherein the target circuit board description information is used to represent the first design information in a second format; The circuit board design requirement package diagram is drawn according to the target circuit board description information.

3. The circuit system model design method according to claim 1, characterized in that: The functional module package diagram is determined in the following manner: Parsing the circuit system model design requirements to generate functional module description information; wherein the functional module description information is used to represent the second design information in a second format; Draw the functional module package diagram according to the functional module description information.

4. The circuit system model design method according to claim 3, characterized in that: A preset circuit module is selected from a circuit module library according to the functional module description information, and the functional module package diagram is generated according to the preset circuit module.

5. The circuit system model design method according to claim 1, characterized in that: The circuit board design package diagram is determined by: Parsing the circuit system model design requirements to generate circuit module description information; wherein the circuit module description information is used to represent the third design information in the second format; The circuit board design package diagram is drawn according to the circuit module description information.

6. The circuit system model design method according to claim 1, characterized in that: The circuit signal flow packet diagram is determined in the following manner: Parsing the circuit system model design requirements to generate signal flow description information; wherein the signal flow description information is used to characterize the fourth design information in the second format; The circuit signal flow packet diagram is drawn according to the signal flow description information.

7. The circuit system model design method according to claim 1, characterized in that: The method further comprises: Parsing the circuit system design requirements to generate a circuit system traceability matrix; wherein the circuit system traceability matrix is ​​used to represent the circuit system design requirements in a third format; Verifying the circuit system model of the target circuit system through the circuit system traceability matrix to obtain a verification result; If the verification result indicates that the circuit system model of the target circuit system does not meet the circuit system design requirement, the circuit system model of the target circuit system is modified.

8. A circuit system model design device, characterized in that: The device comprises: An acquisition module, used for acquiring circuit system design requirements; A data processing module, used for analyzing the circuit system design requirements, generating a circuit board design requirements package diagram, a circuit signal flow package diagram, a circuit board design package diagram and a function module package diagram; The data processing module is further used to determine the first design information according to the circuit board design requirement package diagram; wherein the first design information includes at least one of the following: the function of the target circuit board in the first format, the power consumption of the target circuit board, the size of the target circuit board, the weight of the target circuit board, the operating temperature of the target circuit board, the external interface of the target circuit board, the data transmission line bandwidth of the target circuit board, the data processing frequency of the target circuit board and the data storage capacity of the target circuit board; determine the second design information according to the functional module package diagram; wherein the second design information is used to characterize the circuit modules of each target circuit board in the first format; determine the third design information according to the circuit board design package diagram; wherein the third design information is the attributes between each circuit module in the first format, the functions of each circuit module, the attributes of each component in each circuit module and the connection relationship between each of the components; determine the fourth design information according to the circuit signal flow package diagram; wherein the fourth design information is the attributes and direction of the signal flow between each circuit module in the first format; draw according to the first design information, the second design information, the third design information and the fourth design information to obtain the circuit system model of the target circuit system.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the method described in any one of claims 1 to 7 are executed.

Images