Detection circuit, display substrate, display screen and electronic equipment

Abstract

The invention provides a detection circuit, a display substrate, a display screen and electronic equipment, and relates to the technical field of circuits, the detection circuit is applied to a circuit substrate, the circuit substrate comprises a wiring area and a bending area, the wiring area comprises N metal wires, the bending area extends along a first direction and is overlapped with a first part of the wiring area, the detection circuit comprises a first dummy line, a second dummy line and a third dummy line, the plurality of metal wires are distributed on the first side of the N metal wires and extend in the second direction; the second dummy lines are distributed on the second sides of the N metal wires and extend in the second direction; the first wire is connected between the first dummy wire and the second dummy wire; a third dummy line adjacent to the first dummy line; a fourth dummy line adjacent to the second dummy line; and the second wire is connected between the third dummy wire and the fourth dummy wire. Based on the scheme, when the output picture of the display substrate prepared based on the panel bending technology is abnormal, whether the display abnormality of the display panel is caused by panel bending or not is judged with relatively low difficulty.

Description

Technical Field

[0001] The present application relates to the field of circuit technology, and more specifically, to a detection circuit, a display substrate, a display screen and an electronic device. Background Art

[0002] At present, in order to improve the display effect, meet the demand for thin and light products, optimize space utilization and enhance design flexibility, the panel bending technology is usually used in the screen preparation process to bend the circuit components such as the driving signal lines and the screen substrate directly to the back of the display substrate, thereby significantly reducing the screen border width, increasing the screen-to-body ratio, and thus improving the visual experience. However, while the panel bending technology brings the above advantages, it also increases the possibility of screen circuit abnormalities during the screen preparation process.

[0003] However, during the bending process of the panel, positive resist needs to be coated on the front side of the bending area of ​​the panel, and the upper part of the bending area will also be covered by ink coated on the surface of the flexible glass substrate. This makes it difficult to determine whether the fault is caused by the bending of the panel or other reasons when there are display abnormalities or other faults on the screen. Summary of the invention

[0004] The present application provides a detection circuit, a display substrate, a display screen and an electronic device, which can determine with relatively low difficulty whether the display abnormality of the display panel is caused by panel bending when there is an abnormality in the output picture of the display substrate prepared based on the panel bending technology.

[0005] In a first aspect, a detection circuit is provided, which is applied to a circuit substrate, wherein the circuit substrate includes a routing area and a bending area, wherein N metal routing lines are arranged on a first surface of the routing area, wherein N is greater than 1, wherein the first ends of M metal routing lines of the N metal routing lines are connected to a first structural layer of the circuit substrate, wherein M is less than or equal to N, wherein the bending area extends along a first direction and overlaps with a first portion of the routing area, wherein the bending area is made of a flexible material and is used to bend the first portion along a second direction so as to connect the second ends of the M metal routing lines to a second structural layer of the circuit substrate, wherein the detection circuit includes: a first dummy element The first dummy line is distributed on the first side of the N metal lines and extends along the second direction; the second dummy line is distributed on the second side of the N metal lines and extends along the second direction, and the first side is opposite to the second side; the first line is located within the coverage of the bending area, and the first line is respectively connected to the first dummy line and the second dummy line; the third dummy line is adjacent to the first dummy line and extends along the second direction; the fourth dummy line is adjacent to the second dummy line and extends along the second direction; the second line is located within the coverage of the bending area, and the second line is respectively connected to the third dummy line and the fourth dummy line.

[0006] In combination with the first aspect, in certain implementations of the first aspect, the above-mentioned circuit substrate is a display substrate, the first routing line and the second routing line are located in a bottom shield metal (BSM) layer of the display substrate, and the vertical distance between the BSM layer and the first surface is greater than 0, and the above-mentioned detection circuit also includes: a first via hole, arranged in the routing area, and the first via hole is used to connect the first node of the first dummy line with the first node of the first routing line; a second via hole, arranged in the routing area, and the second via hole is used to connect the first node of the second dummy line with the first node of the first routing line; a third via hole, arranged in the routing area, and the third via hole is used to connect the first node of the third dummy line with the first node of the second routing line; a fourth via hole, arranged in the routing area, and the fourth via hole is used to connect the first node of the fourth dummy line with the first node of the second routing line.

[0007] In combination with the first aspect, in certain implementations of the first aspect, when the routing area is in a bending state, there is an overlapping portion between the projection of the first routing line and the top edge of the bending area in the third direction, and there is an overlapping portion between the projection of the second routing line and the bottom edge of the bending area in the third direction, and the third direction is perpendicular to the circuit substrate.

[0008] In combination with the first aspect, in some implementations of the first aspect, the first via hole and the second via hole are located outside the bending zone.

[0009] In combination with the first aspect, in certain implementations of the first aspect, the second node of the first dummy line is used to connect to the first end of the test device, and the second node of the second dummy line is used to connect to the second end of the test device; or, the second node of the third dummy line is used to connect to the first end of the test device, and the second node of the fourth dummy line is used to connect to the second end of the test device, and the test device is also used to detect whether the connected lines are conductive.

[0010] In combination with the first aspect, in some implementations of the first aspect, the second node of the first dummy line, the second node of the second dummy line, the second node of the third dummy line, and the second node of the fourth dummy line are located outside the bending zone.

[0011] In combination with the first aspect, in certain implementations of the first aspect, the circuit substrate is connected to the first circuit board, and the second node of the first dummy line, the second node of the second dummy line, the second node of the third dummy line, and the second node of the fourth dummy line are welded to the first circuit board.

[0012] In combination with the first aspect, in certain implementations of the first aspect, each of the M metal routes is divided into multiple sub-metal routes, the multiple sub-metal routes are located in the bending area, and the material and geometric parameters of at least one of the first dummy line, the second dummy line, the third dummy line, the fourth dummy line, the first route and the second route are respectively the same as those of the sub-metal routes.

[0013] In a second aspect, a display substrate is provided, comprising: a routing area, a first surface of which is provided with N metal routings, where N is greater than 1; a first structural layer, fixedly connected to the first ends of M of the N metal routings, where M is less than or equal to N; a bending area, extending along a first direction and overlapping with a first part of the routing area, the bending area being made of a flexible material and used to bend the first part along a second direction; a second structural layer, fixedly connected to the second ends of the M metal routings after being bent; and a detection circuit in any possible implementation manner of the detection circuit design of the first aspect above.

[0014] In a third aspect, a display screen is provided, which includes a display substrate in any possible implementation of the display substrate design of the second aspect.

[0015] In a fourth aspect, an electronic device is provided, which includes a display screen in any possible implementation of the display screen design of the third aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a cross-sectional view of a bent display substrate 100 applicable to an embodiment of the present application;

[0017] Figure 2 is a structural schematic diagram of a detection circuit 200 proposed in an embodiment of the present application;

[0018] Figure 3 It is a schematic diagram of the location of dummy lines of a display substrate applicable to an embodiment of the present application;

[0019] Figure 4 It is a structural diagram of another detection circuit 200 proposed in an embodiment of the present application. DETAILED DESCRIPTION

[0020] The technical solution in this application will be described below in conjunction with the accompanying drawings.

[0021] The embodiments of the present application will present various aspects, embodiments or features around a system including multiple devices, components, modules, etc. It should be understood and appreciated that each system may include additional devices, components, modules, etc., and / or may not include all devices, components, modules, etc. discussed in conjunction with the figures. In addition, combinations of these schemes may also be used.

[0022] In addition, in the embodiments of the present application, words such as "exemplary" and "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplary" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of the word "exemplary" is intended to present concepts in a concrete way.

[0023] The business scenarios described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Ordinary technicians in this field can know that with the evolution of technology and the emergence of new business scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0024] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0025] In the embodiments of the present application, "at least one" refers to one or more, and "plurality" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can be represented by: including the existence of A alone, the existence of A and B at the same time, and the existence of B alone, where A and B can be singular or plural. The character " / " generally indicates that the previous and subsequent associated objects are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can be represented by: a, b, c, ab, ac, bc, or abc, where a, b, c can be single or multiple.

[0026] In the description of the embodiments of the present application, the directions or positional relationships indicated by terms such as "up", "down", "left", "right", "inside", "outside", "vertical" and "horizontal" are defined relative to the directions or positions of the components schematically placed in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, rather than indicating or implying that the device or component referred to must have a specific direction, or be constructed and operated in a specific direction. They may change accordingly according to changes in the directions of the components placed in the drawings, and therefore cannot be understood as limitations on the present application.

[0027] In the embodiments of the present application, the same reference numerals are used to represent the same components or parts. For the same parts in the embodiments of the present application, only one of the parts or parts may be marked with a reference numeral in the figure. It should be understood that the reference numerals are also applicable to other identical parts or parts. In addition, the various parts in the drawings are not drawn to scale, and the sizes and dimensions of the parts shown in the drawings are only exemplary and should not be understood as limiting the present application.

[0028] With the popularity of portable electronic devices such as smartphones and tablets, consumers' requirements for the appearance and performance of electronic products are constantly increasing, and the market competition for display products is becoming increasingly fierce. Under this trend, the narrow frame design of display devices has become a popular trend.

[0029] In view of this, panel bending technology has been proposed. By bending the non-display area of ​​the display panel, the panel bending technology can significantly reduce the border width, making the display module more compact and beautiful, and also providing users with a more immersive viewing experience. That is, within a limited device size, it can provide users with a larger display area, thereby enabling users to obtain wider and richer visual content, meeting consumers' high quality and high performance requirements for display devices.

[0030] Panel bending technology mainly achieves the purpose of reducing the border width by bending the part of the display module in the non-display area. This technology allows manufacturers to design more compact and stylish display products without sacrificing the display area. However, during the panel bending process, the key structures of the display module such as the wiring and circuit need to be properly protected to ensure that they will not be damaged during the bending process.

[0031] To achieve this goal, manufacturers usually use one or more layers of protective materials, such as protective glue, in the relevant areas of the display module to cover and protect these key structures. However, during the panel bending process, some new problems may also be introduced, resulting in product display abnormalities. These abnormalities are collectively referred to as bending abnormalities in the embodiments of the present application.

[0032] In some possible embodiments, these display anomalies may include: incomplete picture display, no picture display, dark lines on the picture, or bright lines on the picture.

[0033] Figure 1 It is a cross-sectional view of a bent display substrate 100 applicable to an embodiment of the present application.

[0034] refer to Figure 1 As shown, the display substrate 100 includes:

[0035] A cover glass (CG) 110 has an ink layer 111 coated on its lower surface.

[0036] The first adhesive layer 120 is located under the cover glass 110 and is made of optically clear adhesive (OCA).

[0037] The polarizer (Pol) layer 130 is located under the first adhesive layer 120 and is used to control the direction of light passing through the display substrate 100 to display an image.

[0038] The first structure layer 140, also called the first panel (PNL) layer, is located below the polarization layer 130. The first structure layer 140 includes some core modules of the display substrate 100, such as a gate on array (GOA) circuit, etc., and the wiring used for being bent also includes a GOA wiring.

[0039] The first film layer 150 is located under the first structural layer 140 and serves as a transparent electrode. It can conduct current while allowing light to pass through. The first film layer 150 may be an indium tin oxide (ITO) film.

[0040] The screen cooling film (SCF) layer 155 is located below the first film layer 150 and is used to improve the heat dissipation performance of the display screen. The material may include graphite, nano-carbon, aluminum foil, etc.

[0041] The filling layer (spacer) 160 is located under the SCF layer 155, and serves as a support for the upper and lower structural layers and maintains the uniform distribution of the electric field inside the display. Through uniform support, the filling layer 160 can prevent the display from collapsing when used for a long time or subjected to external pressure, thereby protecting the integrity and display effect of the display.

[0042] The second film layer 170 is located below the filling layer 160 , and the physical parameters of the second film layer 170 are consistent with the physical parameters of the first film layer 150 .

[0043] The second structure layer 180 , also called the second PNL layer, is located below the second film layer 170 and is used to connect some bent metal traces led out from the first structure layer 140 .

[0044] The bending area can be made of a flexible material. Further, the bending area can include a flexible metal layer 190, which is used to receive some metal traces led out from the first structural layer 140, and by bending itself, these metal traces are bent synchronously, so that the lead-out ends of these metal traces can be connected to the corresponding ports of the second structural layer 180. After the flexible metal layer 190 is bent, it is necessary to attach an adhesive to the back of the flexible metal layer, such as Tape glue, PSA glue, Foam glue, etc., to fix the bent state of the flexible metal layer 190.

[0045] The thickness of the flexible metal layer 190 is usually smaller than that of the first structure layer 140 and the second structure layer 180. Therefore, there is a thickness difference at the connection end surfaces of the flexible metal layer 190 and the first structure layer 140 and the second structure layer 180 to form a groove structure. The embodiment of the present application defines the groove structure as a bending groove. Since there are two groove structures formed, when the display substrate 100 is in a bent state, the display substrate 100 includes a first bending groove (combined with the first bending groove). Figure 1 shown, also called upper bending groove) and second bending groove (combined Figure 1 As shown, it can also be called the lower bending groove). Most of the line breaks caused by panel bending occur in the lines at the bending groove.

[0046] It should be understood that when the display substrate 100 is in the unfolded state, the first structure layer 140 , the second structure layer 180 and the flexible metal layer 190 can be understood as belonging to the same metal layer.

[0047] In the above panel bending process, the following two parameters need to be strictly controlled:

[0048] 1. Bending accuracy: This parameter is used to measure whether the bending degree of the display panel meets the design requirements. Accurate bending accuracy can ensure that the module can maintain stable electrical connection and mechanical strength during assembly and use.

[0049] 2. The arc radius, also known as the R value, refers to the radius of the arc formed after the panel is bent. A reasonable R value helps reduce stress concentration, reduce the risk of circuit breakage, and improve the overall reliability of the module.

[0050] The application of panel bending technology also introduces some possible bending anomalies, which become one of the reasons for poor function of the display module. For example, when parameter deviations occur during the bending process of the display panel or the parameters do not meet the design requirements, it may cause problems such as poor electrical connection, reduced mechanical strength or even circuit breakage, thereby affecting the overall performance and reliability of the display module.

[0051] However, when a display abnormality is found in the display panel, it is not necessarily caused by the bending of the panel, but may be caused by other reasons. However, it is difficult to observe and analyze whether the abnormality is caused by the bending of the panel, because the connection between the flexible metal layer 190 and the first structural layer 140 and the second structural layer 180 needs to be bonded by positive adhesive, and the presence of positive adhesive makes it impossible to directly observe the bending state of the flexible metal layer 190 and whether there are defects in the circuit after bending; in addition, the arc surface formed by the bent flexible metal layer 190 is blocked by the ink layer 111 coated on the lower surface of the cover glass 110, which further increases the difficulty of observing the bending state of the flexible metal layer 190.

[0052] In order to visually observe whether there are any abnormalities such as breakage in the internal wiring of the flexible metal layer 190, the entire display substrate 100 needs to be unfolded again after being bent. However, during the unfolding process, it is very easy to cause new cracks or damage to the unfolded structural part, which increases the risk of defective products and further increases the difficulty of locating the cause of the display abnormality.

[0053] However, considering that the bending anomaly mentioned above usually occurs in GOA-related lines, the embodiment of the present application proposes a detection circuit, the routing of which spans across the related lines of the GOA circuit, and these lines are mainly distributed in the line bending area of ​​the display substrate, and the detection circuit also has a test port outside the bending area for testing the on-off of the detection circuit, and thus can indicate the on-off of the related lines of the GOA circuit through which the detection circuit routing passes. Then, after the display substrate is bent, if it is found that the image output by the display substrate has a display anomaly, then by connecting the test device to the reserved test port of the detection circuit, it can be determined whether the current detection circuit is turned on. If the detection circuit is broken, it means that the routing of the detection circuit is broken during the bending process of the panel, and then it can be determined that there is a high probability of a circuit breakage problem caused by the bending of the panel in the related lines through which the detection circuit routing passes, thereby reducing the difficulty of determining whether the display anomaly of the display panel is caused by the bending of the panel.

[0054] Figure 2 It is a structural diagram of a detection circuit 200 proposed in an embodiment of the present application. Figure 2 (a) is a schematic diagram of the unfolded structure of the circuit substrate before bending, which is a top view. Figure 2(b) is a schematic diagram of the cross-sectional structure of the circuit substrate after bending, which is a side view.

[0055] refer to Figure 2 As shown in (a), the detection circuit 200 is applied to a circuit substrate 300, and the circuit substrate 300 includes:

[0056] Routing area 310 and bending area 320;

[0057] Among them, the first surface of the wiring area 310 has N metal wirings 311, N is greater than 1, and the first ends 3111 of M metal wirings in the N metal wirings 311 are connected to the first structure layer 330 of the circuit substrate 300, M is less than or equal to N, wherein as a top view Figure 2 The structural surface presented in (a) includes a first surface of the routing area 310 .

[0058] The bending area 320 extends along the first direction and overlaps with the first portion of the routing area 310 . The bending area 320 is made of flexible material and is used to bend the first portion along the second direction to connect the second ends 3112 of the M metal routing lines to the second structural layer 340 of the circuit substrate 300 .

[0059] refer to Figure 2 As shown in (a), the detection circuit 200 proposed in the embodiment of the present application includes:

[0060] The first dummy line 210 is distributed on a first side of the N metal traces 311 and extends along the second direction;

[0061] The second dummy line 220 is distributed on the second side of the N metal traces 311 and extends along the second direction, with the first side being opposite to the second side;

[0062] The first routing line 250 is located within the coverage of the bending area 320, and the first routing line 250 is respectively connected to the first dummy line 210 and the second dummy line 220;

[0063] A third dummy line 230, adjacent to the first dummy line 210, and extending along the second direction;

[0064] a fourth dummy line 240 , adjacent to the second dummy line 220 , and extending along the second direction;

[0065] The second wiring 260 is located within the coverage of the bending area 320 , and the second wiring 260 is connected to the third dummy wire 230 and the fourth dummy wire 240 respectively.

[0066] It should be noted that the bending area 320 can be bent along the second direction, which can also be understood as the bending area 320 can be bent in a direction perpendicular to the circuit substrate. Figure 2Taking (b) in the figure as an example, the direction perpendicular to the circuit substrate is the third direction in the figure.

[0067] In some possible embodiments, the bending region 320 may include a flexible metal layer made of a flexible metal material.

[0068] In some possible embodiments, the lines of the first dummy line 210 to the fourth dummy line 240 of the present application can be of various line shapes, for example, Figure 2 As shown in (a), the line of the first dummy line 210 to the fourth dummy line 240 can be L-shaped, that is, one end of the first dummy line 210 to the fourth dummy line 240 is led out from the side of the routing area 310, or, it can also be other broken line shapes, so that one end of the first dummy line 210 to the fourth dummy line 240 is led out from the side of the routing area 310, or, the above-mentioned first dummy line 210 to the fourth dummy line 240 passes through the above-mentioned bending area 320, which can also be understood as the entire dummy line passing through the bending area 320, or crossing the bending area 320, for example, the first dummy line 210 to the fourth dummy line 240 is a straight line extending along the second direction, so that one end of the first dummy line 210 to the fourth dummy line 240 is led out from the bottom or top of the routing area 310.

[0069] For example, refer to Figure 2 As shown in (a) in FIG. 1 , the first direction is Figure 2 The horizontal direction in the plane shown in (a), the second direction is Figure 2 The vertical direction in the plane shown in (a), that is, the first direction and the second direction are in Figure 2 The planes shown in (a) are perpendicular to each other.

[0070] In some possible embodiments, for different circuit designs, the directions indicated by the first direction and the second direction can be adaptively adjusted. Figure 2 The description will be made using the first direction and the second direction shown as a reference.

[0071] In some possible embodiments, reference Figure 2 As shown in (a) in FIG. 1 , the first side of the N metal traces 311 refers to the left side or right side of the overlapping area (hereinafter referred to as the overlapping area) of the region formed by the N metal traces 311 and the bending area 320. When the first side of the N metal traces 311 refers to the left side of the overlapping area, then the second side of the N metal traces 311 refers to the right side of the overlapping area, and vice versa.

[0072] In some possible embodiments, the circuit substrate 300 is a display substrate, and the N metal traces 311 are GOA circuit traces. The circuit of the GOA circuit includes a GOA trace and a circuit trace for inputting GOA circuit related signals, for example, it may include a ground voltage (voltage source and sink, VSS) signal line, a positive power supply voltage (voltage drain drain, VDD) signal line or a data signal line, etc. If the display screen also has a touch function, it may also include a touch sensor panel (touch sensor panel, TSP) signal line. One end of the GOA trace is connected to the circuit trace layer of the display substrate (i.e., the first structure layer 330), and the other end of the GOA trace needs to be connected to another circuit trace layer of the display panel (i.e., the second structure layer 340) after the GOA circuit trace is bent, and some circuit traces for inputting GOA circuit related signals also need to be bent accordingly. It can be seen that the above-mentioned M metal traces correspond to the GOA traces in the GOA circuit, and the remaining (NM) metal traces correspond to the circuit traces in the GOA circuit for inputting GOA circuit related signals.

[0073] It should be understood that the first dummy line 210 to the fourth dummy line 240 mentioned above are also called dummy lines, which are arranged on both sides of the GOA circuit. For ease of understanding, the main functions of the dummy lines are described below.

[0074] Setting up dummy lines in the circuit helps ensure the consistency of circuit manufacturing. During the semiconductor manufacturing process, different areas may experience different exposure, etching, and deposition conditions. Adding dummy lines at the edge of the circuit / chip or in specific blank areas can ensure that the process conditions on the entire circuit / chip surface are as consistent as possible, thereby reducing manufacturing deviations caused by position differences.

[0075] Setting dummy lines in the circuit can also adjust the metal wiring density of the circuit / chip, which has a significant impact on the circuit manufacturing process: if the metal density of a certain area of ​​the circuit / chip is too high or too low, it may cause problems such as uneven etching and difficulty in flattening. By adding dummy lines at the edge of the circuit / chip or in a specific blank area, the metal density distribution of the entire circuit / chip surface can be adjusted to make the metal density of the entire circuit / chip surface more uniform, which helps to reduce the difficulty of implementing subsequent circuit manufacturing processes such as chemical mechanical polishing.

[0076] In addition, setting dummy lines in the circuit can also control the stress distribution of the circuit. If the stress distribution on the surface of the circuit / chip is uneven, it may cause damage to the circuit / chip or performance degradation. The dummy lines can serve as stress absorption layers or balance layers to control the stress distribution on the surface of the circuit / chip and prevent damage to the circuit / chip due to stress concentration.

[0077] And by adding dummy lines to the circuit, manufacturers can optimize process conditions across the entire circuit / chip surface and reduce damage caused by manufacturing deviations.

[0078] Figure 3 It is a schematic diagram of the location of dummy lines of a display substrate applicable to an embodiment of the present application.

[0079] Take the display substrate as an example, refer to Figure 3 As shown, some dummy lines are usually set in the GOA circuit (for example, on both sides of the GOA line) to obtain the beneficial effects mentioned in the above description on circuit preparation.

[0080] It can be seen that the first dummy line 210 to the fourth dummy line 240 can be dummy lines arranged on both sides of the GOA line. It can be seen that the implementation of this solution does not require a significant change in the circuit structure, and the circuit substrate under the conventional design can be reused to realize the structure of the detection circuit 200 proposed in the embodiment of the present application. Based on this solution, the detection circuit 200 proposed in the embodiment of the present application can be introduced into the display substrate without significantly changing the circuit design.

[0081] In some possible embodiments, the first node of the first dummy line 210 is connected to the first node of the first routing line 250, the first node of the second dummy line 220 is connected to the second node of the first routing line 250, the first end of the third dummy line 230 is connected to the first node of the second routing line 260, and the first node of the fourth dummy line 240 is connected to the second node of the second routing line 260.

[0082] In addition, the second node of the first dummy line 210 is used to connect the first end of the test equipment, and the second node of the second dummy line 220 is used to connect the second end of the test equipment; or, the second node of the third dummy line 230 is used to connect the first end of the test equipment, and the second node of the fourth dummy line 240 is used to connect the second end of the test equipment, and the test equipment is also used to detect whether the connected line is conductive.

[0083] In some possible embodiments, taking the first dummy line 210 as an example, the first node of the first dummy line 210 can be located at the end position of the first dummy line 210, or at the non-end position of the first dummy line 210; the second node of the first dummy line 210 can be located at the end position of the first dummy line 210, or at the non-end position of the first dummy line 210, and what needs to be satisfied is that the first node and the second node of the first dummy line 210 do not overlap. As for the node setting positions of the second dummy line 220, the third dummy line 230, the fourth dummy line 240, the first routing line 250 and the second routing line 260, the same is true, and no repetition is given here.

[0084] In some possible embodiments, for a loop, the dummy lines used to connect the two ports of the test device can be swapped. For example, the second node of the first dummy line 210 can also be used to connect the second end of the test device, and the second node of the second dummy line 220 can also be used to connect the first end of the test device.

[0085] In some possible embodiments, the above-mentioned test equipment may be an electronic parameter measurement (EPM) equipment, which is used to detect circuit characteristics by inputting electrical signals and outputting signals based on loop feedback. During the test, if the loop state is an open circuit state, it means that there is a problem of a broken circuit or poor connection in the loop, resulting in the signal being unable to be transmitted normally; if the loop state is a connected state, it means that there is no problem of a broken circuit or poor connection in the loop.

[0086] In some possible embodiments, the above-mentioned testing device may also be other devices that can be used to detect the continuity of the loop, such as an automatic resistance testing (ART) device. The ART device is used to detect the resistance of the loop connected to both ends of the device. During the test process, if the loop resistance is detected to be infinite, it means that there is a circuit break or poor connection in the loop, resulting in the detected loop resistance being infinite; if the loop resistance is detected to be a specific value, it means that there is no circuit break or poor connection in the loop.

[0087] It should be understood that based on the existing circuit board preparation technology, the thickness difference between the metal layer where the first routing 250 or the second routing 260 is located and the metal layer where the N metal routings 311 are located can be less than 1 μm. Therefore, when there is a routing break in the N metal routings 311 of the circuit substrate 300, it is usually accompanied by a corresponding first routing 250 or second routing 260 break, and vice versa.

[0088] It can be seen that the above-mentioned first dummy line 210, the first routing line 250 and the second dummy line 220 are used to form a loop, and the above-mentioned third dummy line 230, the second routing line 260 and the fourth dummy line 240 are used to form a loop. By detecting the continuity of these two loops, it can be determined whether the N metal routing lines 311 passed by the two loops are broken.

[0089] For example, when the circuit substrate 300 is a display substrate, the first routing line 250 and the second routing line 260 cross portions of the N metal routing lines 311 in the overlapping region. Then, after the bending zone 320 is bent, if there is a display abnormality in the picture output by the display substrate, the first end of the test device can be connected to the second node of the first dummy line 210, and the second end of the test device can be connected to the second node of the second dummy line 220 to detect whether the line from the first dummy line 210 to the first routing line 250 and then to the second dummy line 220 is conductive. If the line is detected to be disconnected, it means that at least one of the N metal routing lines 311 is broken during the bending process; if the line is detected to be normal, the first end of the test device can be connected to the second node of the third dummy line 230, and the second end of the test device can be connected to the second node of the fourth dummy line 240 to detect whether the line from the third dummy line 230 to the second routing line 260 and then to the fourth dummy line 240 is conductive. If the line is detected to be disconnected, it means that at least one of the N metal routing lines 311 is broken during the bending process; if the line is detected to be normal, it means that the abnormality of the picture output by the display substrate is not caused by the panel bending operation. During the entire testing phase, there is no need to unfold the bent panel again, which avoids circuit breakage caused by the panel unfolding operation.

[0090] Based on the above technical solution, by introducing a detection circuit inside the bendable display substrate, when there is an abnormality in the image output by the display substrate, even if the circuit substrate is in a bent state, the circuit included in the detection circuit can be tested by a test device to see whether it is conductive, which indirectly indicates whether there is a line break in the display substrate wiring area where the circuit passes, so that it can be determined whether the cause of the abnormal image output by the display substrate is due to a line break in the display substrate wiring area, reducing the difficulty of detection, and there is no need to unfold the bent display substrate again, avoiding the new line break caused by the unfolding process. Moreover, the detection circuit can be realized directly based on the dummy line set in the circuit substrate under the conventional design, without significantly changing the basic structure of the circuit substrate, which greatly reduces the difficulty of implementing the solution.

[0091] In some possible embodiments, considering that it is difficult to directly cross the first routing 250 and the second routing 260 across N metal routings 311 in the routing area 310 during the circuit preparation process, the embodiment of the present application further proposes a circuit structure in which the first routing 250 and the second routing 260 are arranged on a different layer from the first surface of the routing area 310. Taking the above-mentioned circuit substrate 300 as a display substrate as an example, the above-mentioned first routing 250 and the second routing 260 are located in the bottom shielding metal BSM layer of the display substrate, and the vertical distance between the BSM layer and the first surface of the routing area 310 is greater than 0.

[0092] In some possible embodiments, reference Figure 2 As shown in (a), since the first wiring 250 and the second wiring 260 are in different layers from the first dummy line 210 to the fourth dummy line 240, respectively, and cannot be directly connected, the detection circuit 200 further includes:

[0093] A first via 270 is provided in the routing area 310 , and the first via 270 is used to connect the first node of the first dummy line 210 with the first node of the first routing line 250 ;

[0094] A second via 280 is provided in the routing area 310 , and the second via 280 is used to connect the first node of the second dummy line 220 with the second node of the first routing line 250 ;

[0095] A third via 275 is provided in the routing area 310 , and the third via 275 is used to connect the first node of the third dummy line 230 with the first node of the second routing line 260 ;

[0096] The fourth via 285 is disposed in the routing area 310 . The fourth via 280 is used to connect the first node of the fourth dummy line 240 to the second node of the second routing line 260 .

[0097] It should be understood that the BSM layer is usually located at the bottom of the display panel, and is mainly used to shield electromagnetic interference from the bottom or other directions, to ensure the stability of the internal circuit of the display panel and the accuracy of signal transmission. On the one hand, the wiring design on the surface of the BSM layer is relatively simple, so it is easier to implement the manufacturing process to set the first wiring 250 and the second wiring 260 on the surface of the BSM layer for forming a loop with the dummy line. On the other hand, the BSM layer has good electrical conductivity, which can ensure the normal transmission of electrical signals in the first wiring 250 and the second wiring 260.

[0098] In some possible embodiments, of course, for display panels of different designs, the first wiring 250 or the second wiring 260 may also be disposed in other conductive layers of the display panel.

[0099] Similarly, when the circuit substrate 300 is other circuits, the first trace 250 and the second trace 260 may be disposed in other conductive layers in the circuit substrate 300 whose vertical distance from the first surface of the trace area 310 is greater than 0.

[0100] In some possible embodiments, the first via 270, the second via 280, the third via 275 and the fourth via 285 are located outside the bending zone 320. Based on this solution, it is possible to effectively avoid deformation of the vias during the bending process in the bending zone 320, resulting in abnormal connection between the dummy line passing through the via and the first routing line 250 or the second routing line 260.

[0101] In some possible embodiments, the second node of the first dummy line 210, the second node of the second dummy line 220, the second node of the third dummy line 230, and the second node of the fourth dummy line 240 may also be located outside the bending area 320. Based on this solution, the problem of the second end of each dummy line being blocked due to the bending of the bending area 320 can be effectively avoided, so that the test equipment can be more easily connected to the corresponding dummy line.

[0102] In some possible embodiments, the circuit substrate 300 can be connected to the first circuit board, and the second node of the first dummy line 210, the second node of the second dummy line 220, the second node of the third dummy line 230 and the second node of the fourth dummy line 240 can be soldered to the first circuit board.

[0103] In some possible embodiments, the first circuit board and the circuit substrate 300 are independent of each other.

[0104] In some possible embodiments, when the circuit substrate 300 is a display substrate, the first circuit board may be a flexible printed circuit (FPC), and the circuit substrate 300 and the first circuit board may be connected via a pad area of ​​a panel.

[0105] Based on the above technical solution, it is not necessary to lead out the second end of each dummy line separately, which can simplify the circuit design.

[0106] In some possible embodiments, the above Figure 2 Taking the detection circuit 200 shown as an example, when the routing area 310 is in a bending state, the first routing 250 and the top edge 321 of the bending area 320 have an overlapping portion in the projection in the third direction, and the second routing 260 and the bottom edge 322 of the bending area 320 have an overlapping portion in the projection in the third direction, wherein the third direction is perpendicular to the circuit substrate 300.

[0107] It should be understood that Figure 1The structure of the display substrate 100 shown is similar to that of Figure 2 As shown in (b), when the routing area 310 is in a bent state, the two ends of the routing area 310 are respectively connected to the circuit substrate 300 and can also be defined as bending grooves. Since the line breakage caused by the bending of the panel mostly occurs in the line at the bending groove position, it can be considered to set the first routing line 250 near the first bending groove of the circuit substrate 300 and the second routing line 260 near the second bending groove of the circuit substrate 300. When the routing area 310 is in a bent state, the projection of the first routing line 250 and the top edge 321 of the bending area 320 in the third direction overlaps, which means that the first routing line 250 is located near the first bending groove; similarly, the projection of the second routing line 260 and the bottom edge 322 of the bending area 320 in the third direction overlaps, which means that the second routing line 260 is located near the second bending groove.

[0108] In some possible embodiments, the above Figure 2 Taking the detection circuit 200 shown as an example, when the routing area 310 is in a bending state, the distance between the first routing line 250 and the end surface where the bending area 320 and the first structural layer 330 intersect is less than or equal to the first preset distance, and the distance between the second routing line 260 and the end surface where the bending area 320 and the second structural layer 340 intersect is less than or equal to the second preset distance, wherein the first preset distance and the second preset distance may be equal. When the above distance conditions are met, it is possible to make. When the routing area 310 is in a bending state, the first routing line 250 is located near the first bending groove, and the second routing line 260 is located near the second bending groove.

[0109] Based on the above technical solution, by respectively arranging the first routing line 250 and the second routing line 260 near the bending groove between the bending area and the non-bending area of ​​the circuit substrate 300, it can help increase the performance of the first routing line 250 and the second routing line 260 in sensing the line break in the bending area 320.

[0110] Figure 4 It is a structural diagram of another detection circuit 200 proposed in an embodiment of the present application.

[0111] Compared to Figure 2 The detection circuit 200 shown, Figure 4 The detection circuit 200 shown also includes:

[0112] a fifth dummy line 410 , adjacent to the third dummy line 230 , and extending along the second direction;

[0113] a sixth dummy line 420, adjacent to the fourth dummy line 240, and extending along the second direction;

[0114] The third wiring 430 is located within the coverage of the bending area 320 , and the third wiring 430 is connected to the fifth dummy wire 410 and the sixth dummy wire 420 respectively.

[0115] In addition, the detection circuit 200 further includes:

[0116] A fifth via hole 440 is provided in the routing area 310 , and the fifth via hole 440 is used to connect the first node of the fifth dummy line 410 with the first node of the third routing line 430 ;

[0117] The sixth via hole 450 is disposed in the routing area 310 , and is used to connect the first node of the sixth dummy line 420 with the second node of the third routing line 430 .

[0118] The second node of the fifth dummy line 410 is used to connect the first end of the test equipment, and the second node of the sixth dummy line 420 is used to connect the second end of the test equipment.

[0119] The third routing line 430 can be located in the middle of the first routing line 250 and the second routing line 260, and extend along the first direction, so that the formed detection loop passes through the metal routing line deployed in the middle of the bending area, thereby increasing the detection points of the detection circuit 200 for the N metal routing lines 311, so that the detection circuit 200 can detect the fault of the metal routing breakage occurring in the middle of the bending area.

[0120] In some possible embodiments, more detection circuits may be added on the basis of the above-mentioned detection circuit 200. The structure of each detection circuit is similar, that is, it includes two dummy lines distributed on both sides of the N metal lines 311 and a line extending along the first direction. This is not listed in the embodiments of the present application.

[0121] Based on the above technical solution, the detection points of the detection circuit 200 in the bending area 320 can be increased, and the line break caused by the bending operation can be detected more accurately.

[0122] In some possible embodiments, Figure 2 Taking the detection circuit 200 shown as an example, each of the M metal traces is divided into a plurality of sub-metal traces, and the plurality of sub-metal traces are located in the bending area 320. The material and geometric parameters of at least one of the first dummy line 210, the second dummy line 220, the third dummy line 230, the fourth dummy line 240, the first trace 250, and the second trace 260 are the same as those of the sub-metal traces. Similarly, when the detection circuit 200 is designed for other structures, the dummy lines and traces used can also be designed with the same material and geometric parameters as the sub-metal traces.

[0123] It should be understood that since each metal trace is divided into multiple sub-metal traces, the diameter or cross-sectional width of the sub-metal trace should be smaller than the metal trace. In circuit design, the purpose of dividing each metal trace into multiple sub-metal traces is: since the diameter or cross-sectional width of a single metal trace is large, it is not easy to deform during the bending process, has poor toughness, and is prone to line breakage; and after the metal trace is divided into multiple sub-metal traces, the diameter or cross-sectional width of a single sub-metal trace is small, so it is easy to deform during the bending process, has strong toughness, and is not prone to line breakage.

[0124] Based on the above technical solution, in the process of preparing the circuit substrate 300, the detection circuit 200 proposed in the embodiment of the present application can be prepared at the same time without changing the preparation process, so that the final product of the circuit substrate 300 directly includes the detection circuit 200, thereby reducing the difficulty of preparation.

[0125] In addition, the embodiment of the present application also proposes a display substrate, the structure of which is similar to the structure of the circuit substrate mentioned in the above embodiment. The display substrate includes: a routing area 310, the first surface of which is arranged with N metal routings 311, N is greater than 1; a first structural layer 330, fixedly connected to the first ends 3111 of M metal routings among the N metal routings 311, M is less than or equal to N; a bending area 320, extending along the first direction, overlapping with the first part of the routing area 310, the bending area 320 is a flexible material, and is used to bend the first part along the second direction; a second structural layer 340, fixedly connected to the second ends 3112 of the M metal routings after bending; and any one of the detection circuits 200 proposed in the embodiment of the present application.

[0126] In some possible embodiments, the bending area 320 may include a flexible metal material, and the flexible metal material portion may be understood as the flexible metal layer in the aforementioned embodiments.

[0127] In some possible embodiments, the above-mentioned wiring fixed connection method can be welding, bonding, crimping and other alternative fixed connection methods.

[0128] In some possible embodiments, the first structure layer 330 and the second structure layer 340 can also be understood as the panel (PNL) layer of the display substrate, and the PNL layer integrates the main functional components of the display panel, such as GOA, etc. The routing area 310 is some metal routings led out from the PNL layer, such as GOA routings, and routings for inputting relevant signals to GOA, etc. When the bending area 320 is in the unfolded state, the first structure layer 330 and the second structure layer 340 can be located at the same level.

[0129] It should be understood that due to the introduction of the detection circuit 200, when a display abnormality occurs on the display panel, the connection ports of the two dummy lines corresponding to the two dummy lines of the detection circuit 200 can be first connected through the test equipment to detect whether the loop formed by the two dummy lines and the wiring connecting the two are conductive. If not, it means that the current display abnormality may be caused by at least one metal wiring located in the bending area being broken due to the bending of the panel; if it is conductive, it means that the current display abnormality may not be caused by the bending operation of the panel.

[0130] The embodiment of the present application also provides a display screen, which includes the display panel provided in the above embodiment. Furthermore, the embodiment of the present application also provides an electronic device, which includes the display screen.

[0131] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0132] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0133] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0134] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0135] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0136] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0137] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A detection circuit, characterized in that: Applied to a circuit substrate, the circuit substrate comprises a routing area and a bending area, the first surface of the routing area is provided with N metal routings, the N is greater than 1, the first ends of M metal routings of the N metal routings are connected to the first structural layer of the circuit substrate, the M is less than or equal to the N, the bending area extends along a first direction and overlaps with a first part of the routing area, the bending area is made of a flexible material and is used to bend the first part along a second direction to connect the second ends of the M metal routings to the second structural layer of the circuit substrate, and the detection circuit comprises: A first dummy line, distributed on a first side of the N metal traces and extending along the second direction; A second dummy line, distributed on a second side of the N metal traces and extending along the second direction, the first side being opposite to the second side; A first routing line, located within the coverage of the bending area, the first routing line being connected to the first dummy line and the second dummy line respectively; a third dummy line, adjacent to the first dummy line and extending along the second direction; a fourth dummy line, adjacent to the second dummy line and extending along the second direction; The second routing line is located within the coverage of the bending area, and the second routing line is respectively connected to the third dummy line and the fourth dummy line.

2. The detection circuit according to claim 1, characterized in that: The circuit substrate is a display substrate, the first wiring and the second wiring are located on a bottom shielding metal BSM layer of the display substrate, a vertical distance between the BSM layer and the first surface is greater than 0, and the detection circuit further includes: A first via hole is provided in the routing area, and the first via hole is used to connect a first node of the first dummy line with a first node of the first routing line; A second via hole is provided in the routing area, and the second via hole is used to connect the first node of the second dummy line with the second node of the first routing line; A third via hole is provided in the routing area, and the third via hole is used to connect the first node of the third dummy line with the first node of the second routing line; A fourth via hole is provided in the routing area, and the fourth via hole is used to connect the first node of the fourth dummy line with the second node of the second routing line.

3. The detection circuit according to claim 2, characterized in that: When the routing area is in a bending state, there is an overlapping portion between the first routing and the projection of the top edge of the bending area in a third direction, and there is an overlapping portion between the second routing and the projection of the bottom edge of the bending area in the third direction, and the third direction is perpendicular to the circuit substrate.

4. The detection circuit according to claim 2 or 3, characterized in that: The first via hole, the second via hole, the third via hole and the fourth via hole are located outside the bending area.

5. The detection circuit according to any one of claims 1 to 4, characterized in that: The second node of the first dummy line is used to connect to the first end of the test equipment, and the second node of the second dummy line is used to connect to the second end of the test equipment; Alternatively, the second node of the third dummy line is used to connect to the first end of the test device, the second node of the fourth dummy line is used to connect to the second end of the test device, and the test device is also used to detect whether the connected lines are conductive.

6. The detection circuit according to claim 5, characterized in that: The second node of the first dummy line, the second node of the second dummy line, the second node of the third dummy line and the second node of the fourth dummy line are located outside the bending area.

7. The detection circuit according to claim 5 or 6, characterized in that: The circuit substrate is connected to the first circuit board, and the second node of the first dummy line, the second node of the second dummy line, the second node of the third dummy line and the second node of the fourth dummy line are welded to the first circuit board.

8. The detection circuit according to any one of claims 1 to 7, characterized in that: Each of the M metal routes is divided into multiple sub-metal routes, and the multiple sub-metal routes are located in the bending area. The material and geometric parameters of at least one of the first dummy line, the second dummy line, the third dummy line, the fourth dummy line, the first route and the second route are the same as those of the sub-metal route.

9. A display substrate, characterized in that: The display substrate comprises: A routing area, wherein N metal routing lines are arranged on a first surface of the routing area, where N is greater than 1; A first structural layer, fixedly connected to first ends of M metal wirings among the N metal wirings, where M is less than or equal to N; A bending area extending along the first direction and overlapping with the first part of the routing area, wherein the bending area is made of a flexible material and is used to bend the first part along the second direction; A second structural layer, fixedly connected to the second ends of the M bent metal traces; A detection circuit as claimed in any one of claims 1 to 8.

10. A display screen, characterized in that: The display screen comprises the display substrate as claimed in claim 9.

11. An electronic device, characterized in that: The electronic device comprises the display screen as claimed in claim 10.

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