Highly reliable magnetic device and electronic apparatus

Abstract

The application relates to the technical field of magnetic devices, and discloses a high-reliability magnetic device and electronic equipment. The high-reliability magnetic device comprises a magnetic core body, a middle column is arranged in the magnetic core body, a mounting seat is connected to one end of the magnetic core body facing a PCB, an adjusting control body is arranged on the mounting seat, one end of the adjusting control body abuts against the PCB, the mounting seat and the PCB form an adjusting control space through the adjusting control body, a winding coil is arranged on the middle column, a lead electrode extends from one side of the magnetic core body, the lead electrode and a bearing surface of the PCB have an adjustable inclination angle in the adjusting control space, and the end of the lead electrode and a first bonding pad on the bearing surface have a first adjustable gap. The application improves the reliability and safety of the magnetic device.

Description

Technical Field

[0001] The present application relates to the technical field of magnetic devices, and in particular to a high-reliability magnetic device and electronic equipment. Background Art

[0002] Magnetic components play a vital role in electronic devices and are widely used in power transmission, signal processing, energy conversion and other fields. They use the principle of electromagnetic induction to efficiently transmit or convert electrical energy into other forms of energy. They mainly include network transformers, inductors, common-mode chokes, etc. With the continuous development of market demand, the integration of PCB boards is getting higher and higher, the size of the reserved space pads for magnetic components is also getting smaller and smaller, and the weight of magnetic components is getting heavier.

[0003] In related technologies, the market has increasingly higher requirements for the reliability of magnetic devices. However, during the soldering process of magnetic devices to PCB boards, due to the weight of the devices and the increase in volume of the liquefied tin solder, there is a risk that the tin liquid will overflow from the soldering pad and contact the PIN pins of other devices on the PCB board, causing short circuit failures and PCB board malfunctions. This situation needs to be changed. Summary of the Invention

[0004] In view of this, the present application provides a high-reliability magnetic device and electronic equipment to improve the safety and reliability of the magnetic device.

[0005] To achieve the above objectives, according to the first aspect, the technical solution adopted is:

[0006] A high-reliability magnetic device, which is connected to a PCB board when used, comprising:

[0007] A magnetic core body, wherein a center column is provided in the magnetic core body;

[0008] A mounting base connected to one end of the magnetic core body facing the PCB board, the mounting base being provided with an adjustment control body, one end of the adjustment control body being in contact with the PCB board, and the mounting base and the PCB board forming an adjustment control space through the adjustment control body;

[0009] A winding coil is wound on the central column, and a lead electrode is extended on one side of the magnetic core body of the winding coil. The lead electrode maintains an adjustable inclination angle with the bearing surface of the PCB board within the adjustment control space, and the end of the lead electrode and the first solder pad on the bearing surface have a first adjustable gap.

[0010] The present application is further configured as follows: a patch electrode is embedded on a side of the mounting seat away from the lead electrode, and the patch electrode has a second adjustable gap with the second pad on the bearing surface within the adjustment control space.

[0011] The application is further configured that the third adjustable gap is between the mounting seat facing the side of the PCB and the first pad or the second pad on the bearing surface.

[0012] The application is further configured that the side of the mounting seat provided with the patch electrode is integrally connected with an auxiliary boss, the magnetic core body abuts against the inner wall of the auxiliary boss, and the patch electrode is designed in an L-shaped or C-shaped structure and attached to the outer wall of the auxiliary boss.

[0013] The application is further configured that the height of the adjustment control body in the first direction is the space height of the adjustment control space, the first direction is perpendicular to the bearing surface of the PCB, the adjustment control body is located on the center line of the magnetic core body in the first direction, and the first pad and the second pad are arranged on both sides of the adjustment control body on the bearing surface.

[0014] The application is further configured that the first adjustable gap includes the shortest distance between the end of the lead electrode and the first pad in the first direction, the second adjustable gap includes the shortest distance between the patch electrode and the second pad in the first direction, and the third adjustable gap includes the shortest distance between the mounting seat and the first pad or the second pad in the first direction.

[0015] The application is further configured that in the first direction, the first adjustable gap, the second adjustable gap and the third adjustable gap change synchronously with the change of the space height of the adjustment control space.

[0016] The application is further configured that in the second direction perpendicular to the first direction, the adjustable inclination angle of the lead electrode and the bearing surface ranges from 0.5° to 20°, and the height of the adjustment control body in the first direction ranges from 0.1 cm to 0.3 cm.

[0017] The application is further configured that one end of the adjustment control body is provided with at least one superimposed adjustment block, the superimposed adjustment block connects the adjustment control body and the bearing surface, and each superimposed adjustment block has the same preset thickness.

[0018] According to the second aspect, the technical scheme adopted is:

[0019] An electronic device comprises a PCB and a high-reliability magnetic device according to any one of the above embodiments, and the high-reliability magnetic device is connected to the PCB.

[0020] In summary, compared with the prior art, the present application discloses a high-reliability magnetic device and electronic device. The high-reliability magnetic device is connected to a PCB board when used, and includes a magnetic core body, a mounting seat and a winding coil. The mounting seat is connected to one end of the magnetic core body facing the PCB board, and the winding coil is wound on the middle column of the magnetic core body, wherein an adjustment control body is provided on the mounting seat, and the mounting seat and the PCB board form an adjustment control space through the adjustment control body, and the winding coil extends with a lead electrode on one side of the magnetic core body, and the lead electrode maintains an adjustable inclination angle with the bearing surface of the PCB board in the adjustment control space, and the end of the lead electrode and the first soldering pad on the bearing surface have a first adjustable gap, that is, through the above setting, the relative connection distance between the magnetic device and the PCB board is adjusted by adjusting the control space, and the reliable connection between the lead electrode and the first soldering pad is ensured by the first adjustable gap, thereby improving the reliability and safety of the magnetic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 is a schematic diagram of the three-dimensional structure of a high-reliability magnetic device according to an embodiment of the present application;

[0023] Figure 2 1 is a diagram illustrating an assembly structure of a high-reliability magnetic device and a PCB board according to an embodiment of the present application;

[0024] Figure 3 is a cross-sectional view of an assembly of a high-reliability magnetic device and a PCB board according to an embodiment of the present application;

[0025] Figure 4 yes Figure 2 A magnified view of part of the structure. DETAILED DESCRIPTION

[0026] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. When the following description refers to the drawings, identical numbers in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0027] It should be noted that, in this document, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined based on their explanation in the specific embodiment or further combined with the context of the specific embodiment.

[0028] It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.

[0029] In the subsequent description, the use of suffixes such as "module", "component" or "unit" to represent elements is only for the purpose of facilitating the description of the present application and has no specific meaning. Therefore, "module", "component" or "unit" can be used interchangeably.

[0030] In the description of this application, it should be noted that the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0031] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the description order of the following embodiments does not limit the priority order of the embodiments.

[0032] As described in the background technology, in the related art, during the soldering process of magnetic devices to PCB boards, due to the weight of the device and the increase in volume of the liquefied tin solder, there is a risk that the tin liquid will overflow from the soldering pad and contact the PIN pins of other devices on the PCB board, causing short circuit failures and PCB board malfunction. Based on this, the present application discloses a high-reliability magnetic device and electronic equipment.

[0033] Please refer to Figures 1 to 4 The high-reliability magnetic device 100 of the present application can be connected to a PCB board 200 when used, and includes a magnetic core body 1, a mounting base 3 and a winding coil 6.

[0034] During the specific implementation process, a middle column 2 is provided in the magnetic core body 1, the winding coil 6 is wound on the middle column 2, and the mounting seat 3 is connected to the end of the magnetic core body 1 facing the PCB board 200, wherein an adjustment control body 4 is provided on the mounting seat 3, one end of the adjustment control body 4 is in contact with the PCB board 200, and the mounting seat 3 forms an adjustment control space 5 with the PCB board 200 through the adjustment control body 4, and the winding coil 6 has a lead electrode 7 extending on one side of the magnetic core body 1, and the lead electrode 7 maintains an adjustable inclination angle a with the bearing surface 8 of the PCB board 200 in the adjustment control space 5, and the end of the lead electrode 7 and the first solder pad 9 on the bearing surface 8 have a first adjustable gap I.

[0035] In this embodiment, an adjustment control space 5 is constructed between the mounting base 3 and the PCB board 200 through the adjustment control body 4. This adjustment control space 5 can serve as a tin expansion space for soldering and assembling the high-reliability magnetic device 100 and the PCB board 200, that is, a buffer zone for the solder expansion of the high-reliability magnetic device 100 and the PCB board 200. At the same time, this space in this embodiment also allows slight deformation of the welding part during thermal expansion and contraction, thereby avoiding cracking or falling off of the solder joints due to stress concentration. Moreover, based on the supporting role of the adjustment control body 4, the high-reliability magnetic device 100 of this embodiment does not need to consider its own weight problem, that is, the pressure effect of the device's own weight on the tin liquid can be avoided, thereby preventing the tin liquid from overflowing from the soldering pad and contacting the PIN feet of other devices on the PCB board during the soldering and assembly of the high-reliability magnetic device 100 and the PCB board 200, thereby improving the safety and reliability of the device.

[0036] In addition, by designing the lead electrode 7 to maintain an adjustable inclination angle a with the bearing surface 8 of the PCB board 200 within the adjustment control space 5, it is ensured that the contact area between the lead electrode 7 and the first soldering pad 9 is gradually expanded. Then, between the lead electrode 7 and the first soldering pad 9, the tin filling material of the lead electrode 7 can be gradually increased from close to the first soldering pad 9 to far away from the first soldering pad 9, that is, the distribution of the solder is optimized, and the mechanical strength of the welding is improved, thereby improving the welding adhesion between the lead electrode 7 and the first soldering pad 9, avoiding loosening or falling off of the solder joint due to mechanical stress or thermal expansion and contraction, and ensuring that the lead electrode 7 is stably and firmly welded to the first soldering pad 9, thereby improving the safety and reliability of the device.

[0037] In addition, the end of the lead electrode 7 and the first soldering pad 9 on the bearing surface 8 have a first adjustable gap I. Then, in conjunction with the tin expansion space of the high-reliability magnetic device 100 and the PCB board 200, the solder can be allowed to have sufficient flow and expansion room when the lead electrode 7 and the first soldering pad 9 are soldered, thereby avoiding tin overflow caused by solder expansion during the welding process.

[0038] It should be noted that since the mounting base 3 carries the magnetic core body 1 and includes the adjustment control body 4, and the winding coil 6 is placed in the magnetic core body 1, the adjustment control space 5 and the first adjustable gap I have a synchronous adjustment relationship. Therefore, this embodiment can flexibly adjust the installation height of the magnetic device and the contact method between the high-reliability magnetic device 100 and the PCB board 200 by synchronously adjusting the adjustment control space 5 and the first adjustable gap I, thereby ensuring the optimal contact state between the lead electrode 7 and the first solder pad 9, ensuring that an appropriate amount of solder covers the soldering point and maintains the optimal contact area. This not only optimizes the welding effect, but also prevents excessive flow and overflow of solder, improves the welding strength and connection reliability, and the synchronous adjustment mechanism also improves the adaptability of the magnetic device, so that the high-reliability magnetic device 100 can be used on PCB boards of different thicknesses or specifications without changing the main structure of the magnetic device, thereby providing users with a wider range of choices and simplifying the installation and use process of the product.

[0039] During the specific implementation process, a patch electrode 10 is embedded on the side of the mounting seat 3 away from the lead electrode 7. The patch electrode 10 has a second adjustable gap II with the second solder pad 11 on the bearing surface 8 in the adjustment control space 5, that is, the adjustment control space 5 of this embodiment contains a first adjustable gap I (the gap between the lead electrode 7 and the first solder pad 9) and a second adjustable gap II (the gap between the patch electrode 10 and the second solder pad 11). Specifically, by adjusting the height of the adjustment control body 4, the sizes of the first adjustable gap I and the second adjustable gap II can be adjusted synchronously to ensure the amount of tin between the patch electrode 10 and the second solder pad 11, effectively preventing the solder from overflowing to other components due to liquid expansion during the welding process, avoiding the risk of short circuit, and ensuring the normal function of the PCB board 200. In addition, the coverage area of ​​the solder between the patch electrode 10 and the second solder pad 11 can be adjusted by adjusting the second adjustable gap II, thereby optimizing the welding strength of the patch electrode 10 and improving the reliability of the electrical connection.

[0040] Among them, the design of the first adjustable gap I and the second adjustable gap II can be suitable for PCB layouts of different heights. While providing flexible adjustment space for the welding of the patch electrode 10, it also enhances the welding compatibility and installation convenience of the device, ensuring the high reliability and safety of the magnetic device in different application environments.

[0041] Preferably, the side of the mounting seat 3 facing the PCB board 200 and the first solder pad 9 or the second solder pad 11 on the bearing surface 8 have a third adjustable gap III. Through the design of the third adjustable gap III, the mounting seat 3 can not only control the distance between the lead electrode 7 and the first solder pad 9 (first adjustable gap I) and the patch electrode 10 and the second solder pad 11 (second adjustable gap II) by adjusting the control body 4, but also control the isolation state between the mounting seat 3 and the bearing surface 8, reduce the electromagnetic interference path between the device and the PCB board, and ensure the air gap provided between the mounting seat 3 and the PCB board 200, which helps to reduce heat conduction caused by direct contact and reduce the thermal stress of the soldering point. At the same time, this gap can serve as a buffer zone to absorb the heat caused by temperature. The deformation caused by fluctuations or mechanical vibrations improves the durability of the device in the working environment, and due to the physical isolation space provided by the third adjustable gap III, the excess solder during the welding process is not easy to flow and accumulate between the mounting base 3 and the PCB board 200, avoiding the hidden danger of short circuit caused by solder overflow, further reducing the risk of electrical failure caused by excessive solder, and enhancing the safety of the device. In addition, the existence of the third adjustable gap III enables the mounting base 3 and the PCB board 200 to maintain a certain degree of independence, which helps to avoid stress transfer caused by rigid contact between the mounting base 3 and the PCB board 200, thereby reducing the risk of device displacement or loosening due to micro-deformation due to external force, thereby improving the mechanical stability of the entire magnetic device.

[0042] In one embodiment, the mounting base 3 is provided with a patch electrode 10 on one side integrally connected to an auxiliary boss 12, the magnetic core body 1 abuts against the inner wall of the auxiliary boss 12, and the patch electrode 10 is designed in an L-shaped or C-shaped structure and is attached to the outer wall of the auxiliary boss 12.

[0043] The auxiliary boss 12 provides additional support for the core body 1, making the connection between the core body 1 and the mounting base 3 more stable, thereby enhancing the installation stability of the entire device on the PCB board 200, and the L-shaped or C-shaped structure of the patch electrode 10 can better fit on the outer wall of the auxiliary boss 12, increasing the contact area of ​​the patch electrode 10 in the physical structure, thereby enhancing the mechanical adhesion and electrical connection reliability between the electrode and the mounting base 3, and the L-shaped or C-shaped design of the patch electrode 10 enables it to have a larger contact and welding area when soldered with the second pad 11. , and the patch electrode 10 is attached to the outer wall of the auxiliary boss 12, which can effectively prevent the electrode from warping or shifting due to changes in welding temperature, reduce the risk of damage caused by uneven force on the welding point, and thus extend the service life of the device. At the same time, the L-shaped or C-shaped patch electrode 10 structure helps to control the electromagnetic distribution of the electrode, thereby reducing the adverse effects of parasitic inductance or parasitic capacitance. The close fitting design of the auxiliary boss 12 and the patch electrode 10 helps to stabilize the electric field distribution, so that the magnetic device can exhibit better electromagnetic performance in high-frequency applications and reduce signal interference.

[0044] It can be understood that the working surface of the PCB board 200 facing the high-reliability magnetic device 100 is the bearing surface 8 of the PCB board 200, and the bearing surface 8 has a first solder pad 9 and a second solder pad 11 corresponding to the lead electrode 7 and the patch electrode 10 to facilitate the electrical connection between the high-reliability magnetic device 100 and the PCB board 200. In addition, in this embodiment, the bearing surface 8, the first solder pad 9 and the second solder pad 11 can all be designed to be parallel to the plane of the mounting base 3 or the magnetic core body 1.

[0045] It should be noted that this application constructs the XYZ spatial coordinates. Figure 1 For example, the X-axis direction can be regarded as the first direction, the Z-axis direction can be regarded as the second direction, and the Y-axis direction can be regarded as the third direction. The first direction can also be regarded as the direction perpendicular to the bearing surface 8 of the PCB board 200, the second direction can also be regarded as the left and right extension direction of the high-reliability magnetic device 100, and the third direction can also be regarded as the front and back extension direction of the high-reliability magnetic device 100. Of course, this embodiment is not limited to this. XYZ can also be any other directions perpendicular to each other in space in actual needs, which will not be repeated here.

[0046] In one embodiment, the height of the adjustment control body 4 in the first direction is the spatial height H of the adjustment control space 5, and the adjustment control body 4 is located on the center line of the magnetic core body 1 in the first direction, and the first solder pad 9 and the second solder pad 11 are arranged on both sides of the adjustment control body 4 on the bearing surface 8.

[0047] The adjustment control body 4 is arranged on the center line of the magnetic core body 1 in the first direction, which supports the entire magnetic device and ensures the stability of the device on the PCB 200, effectively balances the weight distribution of the device, prevents poor welding caused by the center of gravity deviation, and the first pad 9 and the second pad 11 are respectively located on the two sides of the adjustment control body 4 to form appropriate first adjustable gap I and second adjustable gap II in the adjustment control space 5, which ensures that the lead electrode 7 and the patch electrode 10 can obtain ideal welding amount and contact area during welding. By adjusting the height of the adjustment control body 4 in the first direction, that is, the space height H of the adjustment control space 5, the first adjustable gap I, the second adjustable gap II and the third adjustable gap III can be adjusted synchronously, that is, in the first direction, the first adjustable gap I, the second adjustable gap II and the third adjustable gap III change synchronously with the change of the space height H of the adjustment control space 5, thereby more accurately controlling the welding state and adhesion between the electrodes and the pads, avoiding problems such as tin overflow or poor contact, and eliminating the risk of PCB function caused by short circuit triggered by tin overflow from the source.

[0048] Preferably, the first adjustable gap I includes the shortest distance between the end of the lead electrode 7 and the first pad 9 in the first direction, the second adjustable gap II includes the shortest distance between the patch electrode 10 and the second pad 11 in the first direction, and the third adjustable gap III includes the shortest distance between the mounting seat 3 and the first pad 9 or the second pad 11 in the first direction.

[0049] In the specific implementation process, the adjustable angle a of the lead electrode 7 and the bearing surface 8 in the second direction is in the range of 0.5°-20°, so that the contact angle between the lead electrode 7 and the first pad 9 can be flexibly adjusted, and by optimizing the contact angle, the flowability and distribution of the tin liquid during welding can be improved, the uniformity of the tin solder on the pad can be ensured, the welding defects caused by excessive or insufficient tin liquid in local area can be reduced, the distribution of the solder can be optimized, and the mechanical strength of the welding can be improved, so that the welding adhesion between the lead electrode 7 and the first pad 9 can be improved, the solder joint can be prevented from loosening or falling off due to mechanical stress or thermal expansion and contraction, the lead electrode 7 can be stably and firmly welded on the first pad 9, the device safety and reliability can be improved, and the adjustable angle can make the magnetic device adapt to different welding processes and equipment requirements. Under different welding conditions, the adjustment of the adjustable angle a can achieve the best welding effect and improve the consistency and reliability of the welding quality.

[0050] In one embodiment, the adjustable angle a of the lead electrode 7 and the bearing surface 8 in the second direction is 5°.

[0051] In one embodiment, the adjustable angle a of the lead electrode 7 and the bearing surface 8 in the second direction ranges from 13°.

[0052] In the specific implementation, the height range of the adjustment control body 4 in the first direction includes 0.1cm-0.3cm, which is the height range of the adjustment control space 5, so that the high-reliability magnetic device 100 can adapt to different PCB height difference layouts and welding requirements, and the height range of the adjustment control body 4 in the first direction determines the height H of the adjustment control space 5, which affects the flow and diffusion of the tin liquid in the welding process. In the range of 0.1cm-0.3cm, sufficient expansion space can be provided for the tin solder to avoid overflow and short circuit caused by the increase in the volume of the tin liquid during welding.

[0053] In one embodiment, the height range of the adjustment control body 4 in the first direction is 0.2cm.

[0054] In one embodiment, one end of the adjustment control body 4 is provided with at least one superimposed adjustment block 13, and the superimposed adjustment block 13 connects the adjustment control body 4 and the bearing surface 8 of the PCB 200. Each superimposed adjustment block 13 has the same preset thickness, that is, the total height of the adjustment control body 4 can be flexibly adjusted according to actual needs by the superimposed adjustment block 13, and the space height H of the adjustment space 5 can be accurately controlled by increasing or decreasing the number of superimposed adjustment blocks 13, that is, the sizes of the first adjustable gap I, the second adjustable gap II and the third adjustable gap III are synchronously controlled, and each superimposed adjustment block 13 has the same preset thickness, which ensures the consistency between the blocks during adjustment.

[0055] Preferably, in order to facilitate the fixed connection relationship between the superimposed adjustment blocks 13, adjacent superimposed adjustment blocks 13 can be threadedly fixed.

[0056] The embodiment of the application also provides an electronic device, which can include a PCB 200 and a high-reliability magnetic device 100 according to any of the above embodiments. For other working principles and processes of the electronic device, refer to the description of the high-reliability magnetic device in the foregoing embodiments of the application.

[0057] The high-reliability magnetic device and the electronic device provided by the application are described in detail above, and the principles and implementation modes of the application are described by applying specific examples. It should be noted that the descriptions of the various embodiments in the application are each focused on, and the parts not described or recorded in a certain embodiment can be referred to the related description of other embodiments.

[0058] The above are only preferred embodiments of the present application and do not limit the patent scope of the present application. The various technical features of the technical solution of the present application can be arbitrarily combined. In order to make the description concise, all possible combinations of the various technical features in the above embodiments are not described. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, as long as there is no contradiction in the combination of these technical features, are also included in the patent protection scope of the present application.

Claims

1. A high-reliability magnetic device, which is connected to a PCB board when used, characterized in that: include: A magnetic core body, wherein a center column is provided in the magnetic core body; A mounting base connected to one end of the magnetic core body facing the PCB board, the mounting base being provided with an adjustment control body, one end of the adjustment control body being in contact with the PCB board, and the mounting base and the PCB board forming an adjustment control space through the adjustment control body; a winding coil wound on the central column, wherein the winding coil has a lead electrode extending on one side of the magnetic core body, the lead electrode maintains an adjustable inclination angle with the bearing surface of the PCB board within the adjustment control space, and an end of the lead electrode has a first adjustable gap with the first pad on the bearing surface; a patch electrode embedded in a side of the mounting base away from the lead electrode, the patch electrode having a second adjustable gap with the second pad on the carrying surface within the adjustment control space, and the size of the first adjustable gap and the second adjustable gap being synchronously adjusted by adjusting the height of the adjustment control body; The auxiliary boss is integrally connected to the side of the mounting base where the patch electrode is provided. The magnetic core body abuts against the inner wall of the auxiliary boss, and the patch electrode is designed in an L-shaped or C-shaped structure and is attached to the outer wall of the auxiliary boss.

2. The high reliability magnetic device according to claim 1, wherein A third adjustable gap is formed between the side of the mounting base facing the PCB board and the first soldering pad or the second soldering pad on the bearing surface.

3. The high reliability magnetic device according to claim 2, wherein: The height of the adjustment control body in the first direction is the spatial height of the adjustment control space, wherein the first direction is a direction perpendicular to the bearing surface of the PCB board, and the adjustment control body is located on the center line of the magnetic core body in the first direction, and the first solder pad and the second solder pad are arranged on both sides of the adjustment control body on the bearing surface.

4. The high reliability magnetic device according to claim 3, wherein: The first adjustable gap includes the shortest distance between the end of the lead electrode and the first pad in the first direction, the second adjustable gap includes the shortest distance between the patch electrode and the second pad in the first direction, and the third adjustable gap includes the shortest distance between the mounting base and the first pad or the second pad in the first direction.

5. The high reliability magnetic device according to claim 4, wherein: In the first direction, the first adjustable gap, the second adjustable gap, and the third adjustable gap change synchronously with changes in the spatial height of the adjustment control space.

6. The high reliability magnetic device according to claim 3, wherein: In a second direction perpendicular to the first direction, the adjustable inclination angle between the lead electrode and the bearing surface ranges from 0.5° to 20°, and the height of the adjustment control body in the first direction ranges from 0.1 cm to 0.3 cm.

7. The high reliability magnetic device according to claim 1, wherein: At least one superimposed adjustment block is provided at one end of the adjustment control body, and the superimposed adjustment block connects the adjustment control body and the bearing surface, and each of the superimposed adjustment blocks has the same preset thickness.

8. An electronic device, characterized in that: include: A PCB board and the high-reliability magnetic device according to any one of claims 1 to 7, wherein the high-reliability magnetic device is connected to the PCB board.

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