Carrier device and semiconductor processing apparatus

Abstract

This invention provides a support device and a semiconductor processing apparatus. The support device includes a fixed component and a rotatable rotating component disposed above the fixed component. The fixed component includes a first connecting surface, and the rotating component includes a supporting surface for supporting a wafer and a second connecting surface facing away from the supporting surface. The first connecting surface and the second connecting surface are fitted together. The fixed component includes a fixed body and a cooling channel disposed in the fixed body for supplying cooling liquid. The cooling channel cools the rotating component through heat exchange between the fixed body and the rotating component. With the support device provided by this invention, the wafer can rotate during processing while simplifying the sealing structure, improving the sealing effect, and effectively preventing cooling liquid leakage.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and more specifically, to a carrier device and semiconductor processing equipment. Background Technology

[0002] A wafer stage is a platform for placing wafers, comprising a three-pin lifting system, a fixing system, a temperature control system, an RF system, and sealing, among other components. The fixing system is crucial in ensuring the wafer doesn't move during etching. There are two types of fixing systems: mechanical and electrostatic. Mechanical wafer stages suffer from low edge utilization and poor temperature uniformity on the wafer surface. Wafer stages utilizing electrostatic adsorption, also known as electrostatic chucks (ESCs), effectively solve many of the technical problems associated with mechanically fixed wafer stages, thus enjoying wider application.

[0003] In the wafer processing process, electrostatic chucks are often rotated to improve the uniformity within the wafer. In addition, the wafer temperature needs to be controlled during processing to control the etching rate and etching uniformity. Cooling methods usually use coolant and cooling gas as cooling media.

[0004] However, since conventional electrostatic chucks need to rotate, the connection between the cooling medium from the supply source and the electrostatic chuck usually requires a dynamic seal. Therefore, the sealing method used is relatively complex, and the cooling liquid in the electrostatic chuck is prone to leakage when it rotates with the electrostatic chuck. Summary of the Invention

[0005] The present invention aims to at least solve the problems of the complex sealing methods used in the prior art and the easy leakage of cooling liquid in the electrostatic chuck when it rotates with the electrostatic chuck, and proposes a carrier device and semiconductor processing equipment.

[0006] To achieve the purpose of this invention, a support device is provided, the support device including a fixing component and a rotatable rotating component disposed above the fixing component, the fixing component including a first connecting surface, the rotating component including a supporting surface for supporting a wafer, and a second connecting surface opposite to the supporting surface, the first connecting surface and the second connecting surface being fitted together;

[0007] The fixing component includes a fixing body and a cooling channel disposed in the fixing body for the flow of cooling liquid. The cooling channel cools the rotating component through heat exchange between the fixing body and the rotating component.

[0008] Optionally, the cooling channel is disposed close to the first connecting surface.

[0009] Optionally, the fixing body is further provided with a first gas channel having an annular air outlet, the annular air outlet being disposed on the first connecting surface;

[0010] The rotating component includes a rotating body, in which a second gas channel is provided. The outlet of the second gas channel is located on the bearing surface. The inlet of the second gas channel is located on the second connecting surface and is connected to the annular outlet of the first gas channel. When the rotating body rotates, the inlet of the second gas channel moves along the extending direction of the annular outlet to maintain communication with the annular outlet.

[0011] Optionally, it further includes an annular sealing structure, the annular sealing structure including a ring body surrounding the rotating component and the fixing component, a sealing cavity between the inner circumferential surface of the ring body and the outer circumferential surface of the fixing body, a sealing liquid being disposed in the sealing cavity, the pressure of the sealing cavity being greater than or equal to the gas pressure in the first gas channel, and the liquid level of the sealing liquid being higher than the contact position between the outer periphery of the first connecting surface and the outer periphery of the second connecting surface.

[0012] Optionally, the sealing fluid may include liquid metal or kerosene.

[0013] Optionally, the first connecting surface includes a first plane and a first inclined plane arranged around the first plane, and the horizontal distance between the first inclined plane and the axis of the fixed body increases from top to bottom;

[0014] The second connecting surface includes a second plane and a second inclined plane disposed around the second plane, wherein the second plane is in contact with the first plane and the second inclined plane is in contact with the first inclined plane.

[0015] Optionally, the carrier device further includes a first electrode and / or a heating element, wherein the first electrode serves as an electrostatic adsorption electrode and / or a radio frequency feed electrode; the first electrode and / or the heating element are disposed in the fixed body.

[0016] Optionally, the carrier device further includes a first electrode and / or a heating element, wherein the first electrode serves as an electrostatic adsorption electrode and / or a radio frequency feed electrode; the first electrode and / or the heating element are disposed in the rotating component;

[0017] The support device further includes an electrical connection assembly, through which the first electrode and / or heating element are electrically connected to a corresponding power source outside the support device.

[0018] Optionally, the electrical connection assembly is fixedly connected to the fixed body, and a portion of the electrical connection assembly extends into the rotating component and has a first contact surface; the first electrode and / or heating element disposed in the rotating component has a second contact surface;

[0019] The first contact surface and the second contact surface are in electrical contact that can rotate relative to each other.

[0020] Optionally, the electrical connection assembly includes a conductive rod and a first contact, wherein the first contact is rotatably disposed in the rotating component and has the first contact surface;

[0021] The conductive rod is vertically arranged, and its lower end is fixedly connected to the fixed body. The conductive rod is used to electrically connect to a corresponding power source outside the bearing device. The upper end of the conductive rod extends into the rotating component and is fixedly connected to the first contact member, and is electrically conductive.

[0022] Optionally, the lower surface of the first electrode and / or the heating element is provided with a mounting recess, and a second contact is provided in the mounting recess. The second contact is annular, and the outer peripheral surface of the second contact is detachably connected to the inner peripheral surface of the mounting recess. The upper surface of the second contact is used as the second contact surface.

[0023] The first contact is located in the mounting recess, and the lower surface of the first contact serves as the first contact surface, and is rotatably electrically in contact with the upper surface of the second contact.

[0024] The upper end of the conductive rod passes through the annular hole of the second contact and extends into the mounting recess, and is fixedly connected to the first contact.

[0025] Optionally, the carrying device further includes a driving assembly for driving the rotating component to rotate about its rotation center;

[0026] The drive assembly includes a drive shaft and a rotary drive source. One end of the drive shaft passes through the fixed body and is connected to the center of the rotating component. The other end of the drive shaft is connected to the rotary drive source. The rotary drive source is used to drive the rotating component to rotate via the drive shaft.

[0027] Both the conductive rod and the first contact are eccentrically positioned relative to the drive shaft.

[0028] Optionally, the rotating component includes a rotating body, and the first electrode and / or heating element are made of a magnetic conductive material; or, it includes a magnetic material and a conductive material; or, the bottom of the rotating body is provided with a magnetic material layer; the fixing body is made of a non-magnetic material.

[0029] The supporting device further includes a driving assembly for driving the rotating component to rotate around its rotation center; the driving assembly includes a magnetic drive member disposed below the fixed body, and a rotation drive source for driving the magnetic drive member to rotate, the magnetic drive member being used to drive the rotating component to rotate by magnetic force during rotation.

[0030] Optionally, the carrying device further includes a driving assembly for driving the rotating component to rotate about its rotation center;

[0031] The driving assembly includes a driving shaft and a rotary driving source. One end of the driving shaft passes through the fixed body and at least one of the first electrode and the heating element disposed in the fixed body, and is connected to the center position of the rotating component. The other end of the driving shaft is connected to the rotary driving source. The rotary driving source is used to drive the rotating component to rotate through the driving shaft.

[0032] Optionally, the supporting device further includes a pin system, which includes at least three pins and a lifting assembly;

[0033] The fixed body includes a plurality of vertically arranged first through holes. The rotating component includes a rotating body, in which a plurality of second through holes are provided, penetrating the rotating body in a vertical direction. The plurality of second through holes correspond one-to-one with the plurality of first through holes. After the rotating component stops rotating, the first through holes and the second through holes are connected. The position of the ejector pin corresponds one-to-one with the first through holes. The lifting component is used to drive the ejector pin to pass through the first through holes and the second through holes in sequence, so that the tip of the ejector pin can pass through the bearing surface.

[0034] Optionally, a distance sensor is provided below one of the first through holes, and the orthographic projection of the distance sensor on the radial section of the first through hole is located inside the first through hole and does not overlap with the orthographic projection of the corresponding ejector pin on the radial section of the first through hole;

[0035] The distance sensor is used to detect whether the positions of the first through hole and the corresponding second through hole correspond.

[0036] As another technical solution, the present invention also provides a semiconductor processing equipment, including a carrier device disposed in the process chamber, wherein the carrier device adopts the carrier device provided by the present invention; the fixing component in the carrier device is fixed by a cantilever fixed at one end to the inner wall of the process chamber.

[0037] The present invention has the following beneficial effects:

[0038] The carrier device provided by this invention, through a rotatable rotating component disposed above a fixed component, can drive the wafer to rotate during processing, thereby enhancing the uniformity of wafer processing. Simultaneously, by aligning the first connecting surface of the fixed component with the second connecting surface of the rotating component, and by providing a cooling channel for coolant flow within the fixed body, heat exchange between the fixed body and the rotating component allows the coolant in the cooling channel to indirectly absorb the heat generated during wafer processing, resulting in a more uniform overall temperature of the wafer and thus achieving better processing results. Furthermore, by placing the cooling channel within the non-rotating fixed body, relatively independent of the rotating component, a static seal structure can be used to seal the cooling channel and the coolant supply device. Compared to traditional dynamic seal structures, static seal structures are simpler, simplifying the manufacturing and processing of the sealing components and reducing production and maintenance costs. Additionally, static sealing eliminates relative movement of components within the sealing area, achieving a better sealing effect than dynamic seals and effectively preventing coolant leakage. Therefore, the carrier device provided by the present invention can not only rotate the wafer during the processing to improve the process effect, but also simplify the sealing structure, effectively prevent the leakage of cooling liquid, and improve the stability and reliability of equipment operation.

[0039] The semiconductor processing equipment provided by the present invention, with the aid of the above-mentioned support device provided by the present invention, enables the wafer to rotate during the processing, while simplifying the sealing structure, improving the sealing effect, and effectively preventing leakage of cooling liquid. Attached Figure Description

[0040] Figure 1 This is a cross-sectional structural diagram of the support device and cooling channel used in this invention;

[0041] Figure 2 This is a schematic cross-sectional view of the first gas channel and the second gas channel in the bearing device used in this invention.

[0042] Figure 3 This is a top view of the first gas channel used in this invention;

[0043] Figure 4This is a partially enlarged view of the cross-section of the sealing cavity used in this invention;

[0044] Figure 5 This is a cross-sectional view of the first electrode used in this invention, which is disposed on a fixed component.

[0045] Figure 6 This is a cross-sectional view of the first electrode and the heating element used in this invention, which are simultaneously disposed on the fixed component.

[0046] Figure 7 This is a cross-sectional view of one embodiment of the present invention, in which the first electrode or heating element is disposed on a fixed component and the rotating component is driven by a drive shaft.

[0047] Figure 8 This is a cross-sectional view of the heating element used in this invention, which is disposed in the rotating component and the electrical connection assembly.

[0048] Figure 9 This is a cross-sectional view of the first electrode and heating element used in the present invention, which are simultaneously disposed in the rotating component and the electrical connection assembly.

[0049] Figure 10 This is a cross-sectional view of one embodiment of the invention in which the first electrode or heating element is disposed on the rotating component;

[0050] Figure 11 This is a partial structural cross-sectional view of the heating element used in this invention, which is disposed on the rotating component and driven by a magnetic drive component.

[0051] Figure 12 This is a cross-sectional view of one embodiment of the invention, in which the first electrode and heating element are disposed on the rotating component, and the rotating component is driven by a magnetic drive element.

[0052] Figure 13 for Figure 11 as well as Figure 12 A cross-sectional structural diagram showing the connection between the electrical connection assembly and the heating element;

[0053] Figure 14 for Figure 13 Explosion-decomposition diagram;

[0054] Figure 15 for Figure 8-10 A cross-sectional structural diagram showing the connection between the electrical connection assembly and the heating element;

[0055] Figure 16 for Figure 15 Explosion-decomposition diagram;

[0056] Figure 17 This is a schematic diagram of one embodiment of the ejector pin system used in this invention;

[0057] Figure 18 This is a top view of the ejector pin system.

[0058] Figure 19 This is a cross-sectional structural schematic diagram of one embodiment of the semiconductor processing equipment used in this invention.

[0059] Figure 20 This is a cross-sectional structural schematic diagram of another embodiment of the semiconductor processing equipment used in this invention.

[0060] Figure Labels

[0061] 10-Fixing component, 11-Fixing body, 12-Cooling channel, 13-First gas channel

[0062] 131-Annular air outlet, 132-Air inlet channel, 14-First through hole, 15-Ejector pin, 16-First plane, 17-First inclined plane, 20-Rotating component, 21-Rotating body, 21a-Annular protrusion, 22-Second gas channel, 221-Sub-channel, 222-Flow equalization channel, 223-Connecting channel, 23-Second through hole, 24-Second plane, 25-Second inclined plane, 31-First electrode, 32-Heating element, 32 1-First contact element, 33-Electrical connection assembly, 331-Second contact element, 332-Conductive rod, 34-Magnetic drive element, 35-Drive shaft, 40-Annular sealing structure, 41-Ring body, 42-Sealing fluid, 50-Process chamber, 51-Air inlet, 60-Upper electrode device, 70-Matching device, 71-RF source, 80-Rotary drive source, 90-Vacuum system, 100-Cooling gas supply device, 110-Lifting assembly

[0063] 120 - Cooling liquid supply device, 130 - Drive power supply, 140 - Heating element power supply, 150 - Electrostatic adsorption power supply. Detailed Implementation

[0064] To enable those skilled in the art to better understand the technical solutions of the present invention, the carrier device and semiconductor processing equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0065] Please see Figure 1 The supporting device provided in this embodiment of the invention includes a fixing component 10 and a rotatable rotating component 20 disposed above the fixing component 10. The fixing component 10 includes a first connecting surface, i.e. Figure 1 The surface of the fixed component 10 facing upwards, and the rotating component 20 including a bearing surface for supporting the wafer (i.e. Figure 1 The upward-facing surface of the rotating component 20, and the second connecting surface facing away from the bearing surface (i.e. Figure 1The first connecting surface and the second connecting surface are fitted together on the downward-facing surface of the rotating component 20. The fixing component 10 includes a fixing body 11 and a cooling channel 12 disposed in the fixing body 11 for supplying cooling liquid flow. The cooling channel 12 cools the rotating component 20 through heat exchange between the fixing body 11 and the rotating component 20. Figure 1 The location of the cooling channel 12 is shown only schematically and does not represent its actual shape and structure.

[0066] The carrier device provided in the embodiments of the present invention, such as Figure 1 As shown, the rotatable rotating component 20, positioned above the fixed component 10, can drive the wafer to rotate during processing, thereby enhancing the uniformity of wafer processing. Simultaneously, by aligning the first connecting surface of the fixed component 10 with the second connecting surface of the rotating component 20, and by providing a cooling channel 12 for coolant flow within the fixed body 11, heat exchange between the fixed body 11 and the rotating component 20 allows the coolant in the cooling channel 12 to absorb the heat generated during wafer processing, resulting in a more uniform overall temperature of the wafer and thus achieving better processing results. Furthermore, by placing the cooling channel 12 within the non-rotating fixed body 11, and making it relatively independent from the rotating component 20, a static seal structure can be adopted between the cooling channel 12 and the coolant supply device. Compared to traditional dynamic seal structures, static seal structures are simpler, simplifying the manufacturing and processing of the sealing components and reducing production and maintenance costs. Additionally, static seals eliminate relative movement of components within the sealing area, achieving a better sealing effect than dynamic seals and effectively preventing coolant leakage. Therefore, the carrier device provided in this embodiment of the invention can not only rotate the wafer during processing to improve the process effect, but also simplify the sealing structure, effectively prevent the leakage of cooling liquid, and improve the stability and reliability of equipment operation.

[0067] To improve cooling efficiency and enable the fixed body 11 to more effectively control the temperature of the rotating component 20, the cooling channel 12 is positioned close to the first connecting surface. This shortens the heat conduction distance between the coolant in the cooling channel 12 and the rotating component 20, improving heat exchange efficiency. Consequently, the carrier device can better control the temperature of the wafer, thereby improving the etching rate and etching uniformity. "Close to" means that, while ensuring a good seal and relative isolation between the cooling channel 12 and the external surface of the fixed body 11, the cooling channel 12 is positioned as close as possible to the first connecting surface. The cooling channel 12 may include multiple channels through which the coolant flows, and these channels are evenly distributed relative to the first connecting surface. The structure and layout are not limited, thereby achieving the effect of improving heat exchange efficiency and uniformity.

[0068] Furthermore, such as Figure 2 and Figure 3 As shown, in the aforementioned cooling channel 12 ( Figure 2 Based on the above (not shown), the fixed body 11 is further provided with a first gas channel 13 having an annular gas outlet 131, which is disposed on the first connecting surface; the rotating component 20 includes a rotating body 21, in which a second gas channel 22 is provided, and the outlet of the second gas channel 22 is disposed on the bearing surface; the inlet of the second gas channel 22 is disposed on the second connecting surface and is connected to the annular gas outlet 131 of the first gas channel 13, and when the rotating body 21 rotates, the inlet of the second gas channel 22 moves along the extension direction of the annular gas outlet 131 to maintain communication with the annular gas outlet 131. Specifically, in order to maintain communication between the second gas channel 22 and the first gas channel 13 while the second gas channel 22 rotates with the rotating body 21, the annular gas outlet 131 provided in the first gas channel 13 is used to ensure that the inlet of the second gas channel 22 can maintain communication with the annular gas outlet 131 when the rotating body 21 rotates. Cooling gas can be delivered to the bearing surface of the rotating component 20 through the connected first gas channel 13 and second gas channel 22. This allows the cooling gas to fill the gaps between the bearing surface and the wafers on it, achieving not only a cooling effect on the wafers themselves but also serving as a heat-conducting medium to enhance heat exchange between the wafers and the rotating component 20. It should be noted that since the wafer plasma processing takes place in a vacuum environment, and vacuum cannot conduct heat, and the wafers and bearing surface cannot achieve theoretically perfect flatness and complete fit, some small gaps still exist between them. The aforementioned cooling gas fills these small gaps.

[0069] Optional, such as Figure 2 and Figure 3 As shown, the second gas channel 22 includes multiple sub-channels 221, a uniform flow channel 222, and multiple connecting channels 223. The outlets of the multiple sub-channels 221 are all located on the bearing surface of the rotating component 20, and the inlets of the multiple sub-channels 221 are all connected to the uniform flow channel 222. The outlets of the multiple connecting channels 223 are all connected to the uniform flow channel 222, and the inlets of the multiple connecting channels 223 are all connected to the annular outlet 131. Further optionally, the inlets of the multiple connecting channels 223 are evenly arranged relative to the annular outlet 131. Additionally, optionally, as... Figure 2As shown, the first gas channel 13 includes an annular groove formed on the first connecting surface, serving as an annular outlet 131, and a plurality of inlet channels 132. One end of each inlet channel 132 communicates with the annular groove, and the other end is located on the surface of the fixed body 11 facing away from the first connecting surface, for connection to a gas source. Optionally, the plurality of inlet channels 132 are evenly distributed circumferentially along the annular outlet 131 to ensure a more uniform gas distribution within the annular outlet 131.

[0070] The rotating body 21 can rotate relative to the fixed body 11, and the docking position of the first gas channel 13 and the second gas channel 22 is also located on the two connecting surfaces of the rotating body 21 and the fixed body 11. To avoid potential leakage of cooling gas at this point, sealing methods such as sealing rings and loop seal structures can be used to seal the two connecting surfaces of the rotating body 21 and the fixed body 11. As an optional implementation, the sealing structure for sealing the two connecting surfaces of the rotating body 21 and the fixed body 11 is specifically as follows: Figure 4 As shown, the supporting device also includes an annular sealing structure 40. This annular sealing structure 40 includes a ring surrounding the rotating body 21 and the fixed body 11. A sealing cavity is formed between the inner circumferential surface of the ring and the outer circumferential surface of the fixed body 11. This sealing cavity is annular and contains a sealing fluid 42. The pressure in the sealing cavity is greater than or equal to the gas pressure in the first gas channel. The liquid level H1 of the sealing fluid 42 is higher than the height H2 at the contact point between the outer periphery of the first connecting surface and the outer periphery of the second connecting surface. The sealing cavity can be relatively isolated from the external vacuum environment using conventional sealing methods. Gas leakage can be prevented by ensuring that the pressure inside the sealing cavity is greater than or equal to the gas pressure in the first gas channel 13. The sealing fluid 42 can be a liquid substance with low volatility, such as liquid metal or kerosene. Mercury can be used as the liquid metal, but due to its toxicity, gallium and its compounds or alloys can also be used.

[0071] Furthermore, due to precision issues in the manufacturing process, extremely small gaps inevitably occur between the first and second connecting surfaces. To prevent the sealant 42 from flowing back through these tiny gaps, such as... Figure 4As shown, the first connecting surface includes a first plane 16 and a first inclined plane 17 surrounding the first plane 16. The horizontal distance between the first inclined plane 17 and the axis of the fixed body 11 increases from top to bottom. The second connecting surface includes a second plane 24 and a second inclined plane 25 surrounding the second plane 24. The second plane 24 is in contact with the first plane 16, and the second inclined plane 25 is in contact with the first inclined plane 17. By setting the first inclined plane 17 and the second inclined plane 25, the rotating body 21 can form an annular protrusion 21a protruding downward relative to the first plane 16 (and the second plane 24) around the fixed body 11. The height of the lower end of the annular protrusion 21a is the height H2 mentioned above. Since the height H2 is lower than the liquid level H1 of the sealing liquid 42, the annular protrusion 21a can both prevent gas leakage between the second plane 24 and the first plane 16 located on its inner side and prevent backflow of the sealing liquid 42 located on its outer side.

[0072] As an optional implementation method, such as Figures 5 to 7 As shown, the carrier device further includes a first electrode 31, which serves as an electrostatic adsorption electrode and / or an RF feed electrode; the first electrode 31 is disposed in the fixing body 11; and / or, the carrier device further includes a heating element 32, which is disposed in the fixing body 11. The first electrode 31 can serve as either an electrostatic adsorption electrode or an RF feed electrode alone, or it can simultaneously serve as both. The electrostatic adsorption electrode is used to fix the wafer to the carrier surface using electrostatic adsorption. The RF feed electrode is used to generate an RF bias voltage during processing that attracts plasma to move towards the wafer surface, so that the plasma processes the wafer fixed to the carrier surface. The heating element is used to heat the fixing body, thereby indirectly heating the wafer to achieve temperature control of the wafer. Multiple heating elements can be present, each disposed in a different section of the fixing body, to achieve more precise temperature control. By disposing of the first electrode 31 and the heating element 32 within the fixing body 11, their power supply lines can pass through the fixing component 10 and extend beyond the fixing body 11. Figure 5 The diagram shows the case where only the first electrode 31 is included. Figure 6 This illustrates the case where both the first electrode 31 and the heating element 32 are included. Figure 7 It shows in Figure 6 Based on this, the distribution of cooling channel 12, first gas channel 13 and second gas channel 22.

[0073] As another alternative implementation method, such as Figures 8-16As shown, the first electrode 31 and / or the heating element 32 can also be disposed in the rotating member 20. In this case, the supporting device further includes an electrical connection assembly 33. The first electrode 31 and / or the heating element 32 are electrically connected to a corresponding power source outside the supporting device through this electrical connection assembly 33. That is, the electrical connection assembly 33 is configured to maintain the electrical connection between the first electrode 31 and / or the heating element 32 and the corresponding external power source during the rotation of the rotating member 20. It is easy to understand that if both the first electrode 31 and the heating element 32 are disposed in the rotating member 20, then there are two electrical connection assemblies 33, and the first electrode 31 and the heating element 32 are respectively electrically connected to the corresponding external power source of the supporting device through two electrical connection assemblies 33.

[0074] The electrical connection component 33 that achieves this function can have various structures. For example, the electrical connection component 33 is fixedly connected to the fixed body 11, and a part of the electrical connection component 33 extends into the rotating body 21 and has a first contact surface. The first electrode 31 and / or heating element 32 disposed in the rotating body 21 have a second contact surface, which is rotatably electrically contacted with the first contact surface. Thus, the electrical connection component 33 can be electrically connected to the corresponding external power source through the power supply line disposed in the fixed body 11. At the same time, the first contact surface of the electrical connection component 33 can maintain rotatably electrical contact with the second contact surface of the first electrode 31 and / or heating element 32 during the continuous rotation of the rotating body 21, thereby achieving the goal of maintaining the electrical connection between the first electrode 31 and / or heating element 32 and the corresponding external power source during the rotation of the rotating component 20.

[0075] Specifically, such as Figure 15 and Figure 16 As shown, the electrical connection assembly 33 includes, for example, a conductive rod 332 and a first contact 331, wherein the first contact 331 is rotatably disposed in the rotating body 21 and has the aforementioned first contact surface (i.e., Figure 15 The first contact element 331 faces downwards; the conductive rod 332 is vertically arranged, and its lower end is fixedly connected to the fixed body 11. The conductive rod 332 is used for electrical connection with a corresponding power source outside the bearing device; the upper end of the conductive rod 332 extends into the rotating body 21 and is fixedly connected to the first contact element 331, and is electrically conductive. Thus, the conductive rod 332 can be electrically connected to a corresponding external power source through the power supply line provided in the fixed body 11. The first contact surface of the first contact element 331 can maintain a rotatable electrical contact with the second contact surface of the first electrode 31 and / or the heating element 32 during the continuous rotation of the rotating body 21, thereby achieving the goal of maintaining the electrical connection between the first electrode 31 and / or the heating element 32 and the corresponding external power source during the rotation of the rotating component 20.

[0076] Furthermore, such as Figures 13 to 14 As shown, taking the heating element 32 as an example of being electrically connected to an external power source via the aforementioned electrical connection assembly 33, the lower surface of the heating element 32 is provided with a mounting recess 32a. A second contact 321 is provided in this mounting recess 32a. The second contact 321 is annular, and its outer peripheral surface is detachably connected to the inner peripheral surface of the mounting recess 32a. For example, the outer peripheral surface of the second contact 321 and the inner peripheral surface of the mounting recess 32a are respectively provided with mating external and internal threads. The second contact 321 can be screwed into or out of the mounting recess 32a via the external thread. Of course, in practical applications, other detachable structures such as snap-fit ​​structures or plug-in structures can also be provided between the outer peripheral surface of the second contact 321 and the inner peripheral surface of the mounting recess 32a. This embodiment of the invention does not impose any particular limitations on this. The upper surface of the second contact 321 serves as the second contact surface; the first contact 331 is located in the mounting recess 32a, and the lower surface of the first contact 331 serves as the first contact surface, and is rotatably electrically contacted with the upper surface of the second contact 321; the upper end of the conductive rod 332 passes through the annular hole of the second contact 321 and extends into the mounting recess 32a, and is fixedly connected to the first contact 331. Through the above arrangement, while ensuring electrical contact between the first contact 331 and the second contact 321, the second contact 331 is also used to confine the first contact 321 within the mounting recess 32a, and the movement of the heating element 32 in the vertical direction is also restricted, thereby further restricting the movement of the rotating component 20 in the vertical direction and improving the motion stability of the rotating component 20.

[0077] Figures 11 to 14 An electrical connection assembly 33 is shown, which can be applied to a rotating body 21 that is not connected to a drive shaft 35, for example, by magnetic force to drive the rotating body 21 without the need for a drive shaft 35. In this case, the relative positions of the first contact 331 and the conductive rod 332 in the electrical connection assembly 33 with respect to the rotating body 21 do not need to consider the issue of avoiding the drive shaft 35. Preferably, the first contact 331 and the conductive rod 332 are located approximately at the center of the rotating body 21.

[0078] The method of using magnetic force to drive the rotating body 21 can be specifically as follows: Figure 11 and Figure 12As shown, the rotating component 20 includes a rotating body 21. The first electrode 31 and / or the heating element 32 are made of a magnetically conductive material, such as iron, nickel, cobalt, etc., which are conductive materials that can be attracted by the magnetic field generated by a magnet or electromagnet. Alternatively, the first electrode 31 and / or the heating element 32 may be made of both magnetic and conductive materials. The magnetic material may be, for example, iron, nickel, cobalt, etc., which are attracted by the magnetic field generated by a magnet or electromagnet, and the conductive material may be, for example, aluminum. The magnetic and conductive materials can be layered or mixed, as long as the first electrode 31 and / or the heating element 32 can be attracted by the magnetic field generated by a magnet or electromagnet and can also conduct electricity. This embodiment of the invention does not limit this. The fixing body 11 is made of a non-magnetic material. In another optional embodiment, the first electrode 31 and / or the heating element 32 may also be made of a conductive material, and a magnetic material layer is provided at the bottom of the rotating body 21, which can be attracted by the magnetic field generated by a magnet or electromagnet. In addition, the supporting device further includes a driving assembly for driving the rotating body 21 to rotate around its rotation center. The driving assembly includes a magnetic drive member 34 disposed below the fixed body 11, and a rotation drive source for driving the magnetic drive member 34 to rotate. The magnetic drive member 34, during rotation, drives the rotating body 21 to rotate through the attraction between its own magnetic field and the first electrode 31 and / or the heating element 32 (or with the aforementioned magnetic material layer). The magnetic drive member 34 is, for example, a magnet or an electromagnet composed of coils.

[0079] Figures 8 to 10 as well as Figure 15 and Figure 16 Another electrical connection assembly 33 is shown, which can be applied to the rotating body 21 connected to the drive shaft 35. In this case, the relative positions of the first contact 331 and the conductive rod 332 in the electrical connection assembly 33 with the rotating body 21 do not need to avoid the drive shaft 35, so as to ensure that the power supply of the first electrode 31 and / or the heating element 32 does not affect the rotation drive of the rotating body 21. The rotating body 21 and the electrical connection assembly 33 will be described in detail below with reference to a specific driving method.

[0080] Specifically, such as Figures 5 to 10As shown, the supporting device also includes a drive assembly for driving the rotating component 20 (i.e., the rotating body 21) to rotate around its rotation center. The drive assembly includes a drive shaft 35 and a rotation drive source. One end of the drive shaft 35 passes through the fixed body 11 and is connected to the center position of the rotating body 21. The other end of the drive shaft 35 is connected to the rotation drive source. The rotation drive source is used to drive the rotating component 20 to rotate via the drive shaft 35. The conductive rod 332 and the first contact 331 are both eccentrically arranged relative to the drive shaft 35. By using a drive method in which the rotating component 20 is driven to rotate via the drive shaft 35 by the rotation drive source, the structure is simple, and the rotation drive source, while providing driving force via the drive shaft 35, can also restrict the horizontal or longitudinal movement of the rotating component 20. The rotation drive source can be a rotary motor, etc.

[0081] In addition, such as Figure 17 and Figure 18 As shown, the supporting device also includes a pin system, which includes at least three pins 15 and a lifting assembly 110; the fixed body 11 includes a plurality of vertically arranged first through holes 14; the rotating body 21 is provided with a plurality of second through holes 23 extending vertically through the rotating body 21, the plurality of second through holes 23 corresponding one-to-one with the plurality of first through holes 14, and after the rotating component 20 stops rotating, the first through holes 14 and the second through holes 23 are connected; the position of the pins 15 corresponds one-to-one with the first through holes 14; the lifting assembly 110 is used to drive each pin 15 to rise and fall, and during rising and falling, it passes through the first through holes 14 and the second through holes 23 in sequence, so that the top of the pin 15 can be higher or lower than the supporting surface. Figure 18 As shown, multiple second through holes 23 can be evenly distributed along the circumference of the bearing surface, and multiple ejector pins 15 have the same height and can be driven synchronously, so that the ejector pin system can apply a uniform supporting force to the wafer and lift the wafer horizontally, preventing the wafer from slipping off the bearing surface during the lifting process.

[0082] The driving component for driving the rotating body 21 can be configured to drive the rotating body 21 to rotate to a position that connects the first through hole 14 and the second through hole 23 after the rotating body 21 stops rotating; or, the driving component for driving the rotating body 21 can be configured to directly reach the position that connects the first through hole 14 and the second through hole 23 when the rotating body 21 stops rotating. There are several ways to achieve the rotation of the rotating body 21 to the position that connects the first through hole 14 and the second through hole 23. For example, a distance sensor can be provided below one of the first through holes 14. When the rotating body 21 is located at the position where the first through hole 14 and the corresponding second through hole 23 are connected, the orthographic projection of the distance sensor on the radial section of the first through hole 14 is located inside the first through hole 14 and does not overlap with the orthographic projection of the corresponding ejector pin 15 on the radial section of the first through hole 14; the distance sensor is used to detect whether the positions of the first through hole 14 and the corresponding second through hole 23 correspond. By ensuring that the orthographic projection of the distance sensor and the corresponding ejector pin 15 on the radial section of the first through hole 14 does not overlap, when the positions of the first through hole 14 and the second through hole 23 correspond, the detection signal emitted by the distance sensor can pass through the gap between the ejector pin 15 and the first through hole 14. When the positions of the first through hole 14 and the second through hole 23 do not correspond, the detection signal emitted by the distance sensor will be blocked, thereby enabling the distance sensor to detect whether the positions of the first through hole 14 and the second through hole 23 correspond. The aforementioned distance sensor can be, for example, an infrared sensor, a laser sensor, etc.

[0083] In summary, the carrier device provided in this embodiment of the invention, through a rotatable rotating component disposed above the fixed component, can drive the wafer to rotate during processing, thereby enhancing the uniformity of wafer processing. Simultaneously, by fitting the first connecting surface of the fixed component to the second connecting surface of the rotating component, and by providing a cooling channel for coolant flow within the fixed body, heat exchange between the fixed body and the rotating component allows the coolant in the cooling channel to indirectly absorb the heat generated during wafer processing, resulting in a more uniform overall temperature of the wafer and thus achieving better processing results. Furthermore, by placing the cooling channel within the non-rotating fixed body, relatively independent of the rotating component, a static sealing structure can be used to seal the cooling channel and the coolant supply device. Compared to traditional dynamic sealing structures, static sealing structures are simpler, simplifying the manufacturing and processing of the sealing components and reducing production and maintenance costs. Additionally, static sealing eliminates relative movement of components within the sealing area, achieving a better sealing effect than dynamic sealing and effectively preventing coolant leakage. Therefore, the carrier device provided by the present invention can not only rotate the wafer during the processing to improve the process effect, but also simplify the sealing structure, effectively prevent the leakage of cooling liquid, and improve the stability and reliability of equipment operation.

[0084] As another technical solution, embodiments of the present invention also provide a semiconductor processing apparatus, such as... Figure 19 and Figure 20 As shown, the semiconductor processing equipment includes a process chamber 50 and a support device disposed within the process chamber 50. This support device employs the aforementioned support device provided in this embodiment of the invention. Furthermore, the fixing component 10 in the support device is fixed at one end to a cantilever 52 (its position is as shown in the diagram) on the inner wall of the process chamber 50. Figure 19 and Figure 20 (The dashed box in the figure is fixed, but does not represent the actual shape and structure.)

[0085] The semiconductor processing equipment provided in this embodiment of the invention, by means of the above-mentioned support device, enables the wafer to rotate during processing while simplifying the sealing structure, improving the sealing effect, and effectively preventing leakage of cooling liquid.

[0086] In some optional embodiments, at least one air inlet 51 is provided at the top of the process chamber 50 for introducing process gas into the process chamber 50; and radio frequency coils 60 are provided above the top wall and in the side wall of the process chamber 50. The radio frequency coils 60 are electrically connected to the radio frequency power supply 71 through a matching unit 70 to excite the process gas in the process chamber 50 to form plasma. It should be noted that the radio frequency coils 60 in the side wall of the process chamber 50 are arranged around the circumference of the process chamber 50 and are used together with the radio frequency coils 60 provided above the top wall of the process chamber 50 to achieve a better excitation effect.

[0087] In some alternative embodiments, in order to achieve better processing uniformity of the wafer, the carrier device may be positioned at the center of the process chamber 50 to make the processing more uniform.

[0088] Figure 19 and Figure 20 Two different implementations of the carrier device were used. Specifically, Figure 19 Adopted Figures 8 to 10 as well as Figure 15 and Figure 16 The rotating body is connected to the drive shaft via a supporting device. Figure 20 Adopted Figures 11 to 14 The rotating body shown is not connected to the load-bearing device of the drive shaft.

[0089] In some alternative embodiments, such as Figure 19 and Figure 20 As shown, taking the first electrode 31 and heating element 32 in the carrier device as an example, which are disposed in the rotating component 20, both the first electrode 31 and the heating element 32 are electrically connected to their respective external power sources through the electrical connection assembly 33. The first electrode 31 serves as both an electrostatic adsorption electrode and an RF feed electrode, and is electrically connected to the external electrostatic adsorption power source 150 (DC power source), and is also electrically connected to the RF power source 71 through the external matching adapter 70. The wires of the first electrode 31 and the heating element 32 can be led out through the cantilever 52 to the side wall of the process chamber 50, and extend through the side wall to the outside of the process chamber 50 to be electrically connected to the corresponding power source.

[0090] In some alternative embodiments, such as Figure 19 and Figure 20 As shown, the drive component in the bearing device has a rotation drive source 80 disposed in the cantilever 52, which is, for example, a motor. The power supply wire of the motor can be led out through the cantilever 52 to the side wall of the process chamber 50, and extends through the side wall to the outside of the process chamber 50 and is electrically connected to the drive power supply 130.

[0091] In addition, the cooling channel 12 and the first gas channel 13 in the fixed component 10 can be led out to the side wall of the process chamber 50 through the pipes provided in the cantilever 52, and extend through the side wall to the outside of the process chamber 50, and are respectively connected to the cooling gas supply device 100 and the cooling liquid supply device 120.

[0092] In some alternative embodiments, such as Figure 19 and Figure 20 As shown, the bottom of the process chamber 50 is provided with an exhaust port, which can also be connected to the vacuum system 90. The vacuum system 90 extracts the gas in the process chamber 50 through the exhaust port, so that the process chamber 50 is in a vacuum state.

[0093] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A load bearing device, characterized by, The carrier device includes a fixing component and a rotating component that is rotatable relative to the fixing component and is disposed above the fixing component. The fixing component includes a first connecting surface, and the rotating component includes a bearing surface for bearing the wafer and a second connecting surface opposite to the bearing surface. The first connecting surface and the second connecting surface are fitted together. The fixing component includes a fixing body and a cooling channel disposed in the fixing body for the flow of cooling liquid. The cooling channel cools the rotating component through heat exchange between the fixing body and the rotating component.

2. The bearing device according to claim 1, characterized in that, The cooling channel is located close to the first connecting surface.

3. The bearing device according to claim 1, characterized in that, The fixed body is also provided with a first gas channel having an annular air outlet, which is located on the first connecting surface. The rotating component includes a rotating body, in which a second gas channel is provided. The outlet of the second gas channel is located on the bearing surface. The inlet of the second gas channel is located on the second connecting surface and is connected to the annular outlet of the first gas channel. When the rotating body rotates, the inlet of the second gas channel moves along the extending direction of the annular outlet to maintain communication with the annular outlet.

4. The bearing device according to claim 3, characterized in that, It also includes an annular sealing structure, which includes a ring body surrounding the rotating component and the fixing component. A sealing cavity is formed between the inner circumferential surface of the ring body and the outer circumferential surface of the fixing body. A sealing liquid is provided in the sealing cavity. The pressure of the sealing cavity is greater than or equal to the gas pressure in the first gas channel. The liquid level of the sealing liquid is higher than the contact position between the outer periphery of the first connecting surface and the outer periphery of the second connecting surface.

5. The bearing device according to claim 4, characterized in that, The sealing fluid includes liquid metal or kerosene.

6. The bearing device according to claim 4, characterized in that, The first connecting surface includes a first plane and a first inclined plane arranged around the first plane, and the horizontal distance between the first inclined plane and the axis of the fixed body increases from top to bottom; The second connecting surface includes a second plane and a second inclined plane disposed around the second plane, wherein the second plane is in contact with the first plane and the second inclined plane is in contact with the first inclined plane.

7. The bearing device according to claim 1, characterized in that, The support device further includes a first electrode and / or a heating element, wherein the first electrode serves as an electrostatic adsorption electrode and / or a radio frequency feed electrode; the first electrode and / or the heating element are disposed in the fixed body.

8. The bearing device according to claim 1, characterized in that, The carrier device further includes a first electrode and / or a heating element, wherein the first electrode serves as an electrostatic adsorption electrode and / or a radio frequency feed electrode; the first electrode and / or the heating element are disposed in the rotating component; The support device further includes an electrical connection assembly, through which the first electrode and / or heating element are electrically connected to a corresponding power source outside the support device.

9. The bearing device according to claim 8, characterized in that, The electrical connection assembly is fixedly connected to the fixed body, and a portion of the electrical connection assembly extends into the rotating component and has a first contact surface; the first electrode and / or heating element disposed in the rotating component has a second contact surface; The first contact surface and the second contact surface are in electrical contact that can rotate relative to each other.

10. The bearing device according to claim 9, characterized in that, The electrical connection assembly includes a conductive rod and a first contact, wherein the first contact is rotatably disposed in the rotating component and has the first contact surface; The conductive rod is vertically arranged, and its lower end is fixedly connected to the fixed body. The conductive rod is used to electrically connect to a corresponding power source outside the bearing device. The upper end of the conductive rod extends into the rotating component and is fixedly connected to the first contact member, and is electrically conductive.

11. The bearing device according to claim 10, characterized in that, The lower surface of the first electrode and / or the heating element is provided with a mounting recess, and a second contact is provided in the mounting recess. The second contact is annular, and the outer peripheral surface of the second contact is detachably connected to the inner peripheral surface of the mounting recess. The upper surface of the second contact is used as the second contact surface. The first contact is located in the mounting recess, and the lower surface of the first contact serves as the first contact surface, and is rotatably electrically in contact with the upper surface of the second contact. The upper end of the conductive rod passes through the annular hole of the second contact and extends into the mounting recess, and is fixedly connected to the first contact.

12. The bearing device according to claim 11, characterized in that, The supporting device further includes a driving component, which is used to drive the rotating component to rotate about its rotation center; The drive assembly includes a drive shaft and a rotary drive source. One end of the drive shaft passes through the fixed body and is connected to the center of the rotating component. The other end of the drive shaft is connected to the rotary drive source. The rotary drive source is used to drive the rotating component to rotate via the drive shaft. Both the conductive rod and the first contact are eccentrically positioned relative to the drive shaft.

13. The bearing device according to any one of claims 8-11, characterized in that, The rotating component includes a rotating body, and the first electrode and / or heating element are made of a magnetic conductive material; or, they include a magnetic material and a conductive material; or, the bottom of the rotating body is provided with a magnetic material layer; the fixing body is made of a non-magnetic material. The supporting device further includes a driving assembly for driving the rotating component to rotate around its rotation center; the driving assembly includes a magnetic drive member disposed below the fixed body, and a rotation drive source for driving the magnetic drive member to rotate, the magnetic drive member being used to drive the rotating component to rotate by magnetic force during rotation.

14. The bearing device according to claim 7, characterized in that, The supporting device further includes a driving component, which is used to drive the rotating component to rotate about its rotation center; The driving assembly includes a driving shaft and a rotary driving source. One end of the driving shaft passes through the fixed body and at least one of the first electrode and the heating element disposed in the fixed body, and is connected to the center position of the rotating component. The other end of the driving shaft is connected to the rotary driving source. The rotary driving source is used to drive the rotating component to rotate through the driving shaft.

15. The bearing device according to claim 1, characterized in that, The supporting device also includes a pin system, which includes at least three pins and a lifting assembly; The fixed body includes a plurality of vertically arranged first through holes. The rotating component includes a rotating body, in which a plurality of second through holes are provided, penetrating the rotating body in a vertical direction. The plurality of second through holes correspond one-to-one with the plurality of first through holes. After the rotating component stops rotating, the first through holes and the second through holes are connected. The position of the ejector pin corresponds one-to-one with the first through holes. The lifting component is used to drive the ejector pin to pass through the first through holes and the second through holes in sequence, so that the tip of the ejector pin can pass through the bearing surface.

16. The bearing device according to claim 15, characterized in that, A distance sensor is provided below one of the first through holes. The orthographic projection of the distance sensor on the radial section of the first through hole is located inside the first through hole and does not overlap with the orthographic projection of the corresponding ejector pin on the radial section of the first through hole. The distance sensor is used to detect whether the positions of the first through hole and the corresponding second through hole correspond.

17. A semiconductor processing apparatus, characterized in that, The device includes a process chamber and a support device disposed within the process chamber, wherein the support device is the support device as described in any one of claims 1-16; the fixing component in the support device is fixed by a cantilever fixed at one end to the inner wall of the process chamber.

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