Silicon wafer basket with adjustable spacing

Abstract

The invention discloses a spacing-adjustable silicon wafer flower basket, and relates to the technical field of silicon wafer flower baskets, the spacing-adjustable silicon wafer flower basket comprises flower basket end plates and flower basket supporting blocks, the number of the flower basket end plates is two, the flower basket supporting blocks are arranged between the two flower basket end plates, any one of the flower basket end plates is fixedly provided with a control device, the flower basket end plates are fixedly provided with handles, and the handles are fixedly arranged on the flower basket end plates. The distance-adjustable silicon wafer basket further comprises built-in grooves and distance adjusting grooves which are formed in the basket supporting blocks, a driving mechanism which is arranged on any basket end plate, a transmission part which is arranged on the driving mechanism, and a bearing mechanism which is arranged in the built-in grooves. Through cooperation of the driving mechanism, the transmission part and the bearing mechanism, the device can adjust the distance between the silicon wafer carrying blocks on the flower basket supporting block, so that silicon wafers loaded on the device can meet the requirements for the silicon wafer distance under different process conditions, and the applicability of the device is greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer flower baskets, in particular to a silicon wafer flower basket with adjustable spacing. Background Art

[0002] In the semiconductor manufacturing industry, silicon wafers are the core material for integrated circuit manufacturing, and their quality and integrity are critical to the performance of the final product. In order to ensure the safety of silicon wafers during handling, transportation, and storage, special baskets are usually used to load silicon wafers. These baskets not only play a protective role, but also must support efficient operating processes and be able to adapt to the needs of various process conditions. However, the traditional silicon wafer basket design has significant limitations, especially in terms of silicon wafer spacing adjustment: The design of traditional silicon wafer baskets is usually based on a fixed frame structure. This rigid design means that once production is completed, the spacing between silicon wafers is fixed and cannot be adjusted according to specific applications. For example, when facing silicon wafers of different thicknesses or slightly different edge shapes, the distance between silicon wafers cannot be flexibly adjusted, which is prone to contact or even collision, which may cause surface scratches or other forms of physical damage. In addition, if there is vibration or impact during transportation, the closely arranged silicon wafers are also more vulnerable to damage. This fixed structure greatly limits the versatility and flexibility of the basket, making it only suitable for silicon wafers of specific specifications, increasing the complexity and cost of inventory management; further, the traditional silicon wafer basket cannot be adjusted due to the non-adjustable spacing, which may lead to uneven heat distribution, affecting each silicon wafer to receive the same temperature treatment, thereby affecting the yield and product quality. Especially in some special processing steps, such as high-temperature diffusion, annealing and other processes, appropriate silicon wafer spacing is very important to ensure uniform heating and effective heat transfer. The existence of fixed spacing may hinder the effective conduction of heat, causing overheating or insufficient cooling in some areas, thus affecting the quality stability of the silicon wafers; in addition, an overly compact layout is not conducive to operators to inspect or remove individual silicon wafers, increasing the risk of contamination. If the space between silicon wafers is too small and the air circulation is poor, then dust and other particulate matter are more likely to deposit on the surface of the silicon wafers in a clean room with extremely high cleanliness requirements.

[0003] In summary, the silicon wafer flower basket in the prior art has brought many inconveniences and challenges to semiconductor manufacturing due to the lack of spacing adjustment function. It not only limits the application scope of the silicon wafer flower basket and increases production and operating costs, but also may cause silicon wafer damage, contamination, and poor heat treatment effects. Problems such as seriously affecting product quality, are urgently needed. Summary of the invention

[0004] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a silicon wafer flower basket with adjustable spacing, aiming to solve the above technical problems.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: A silicon wafer flower basket with adjustable spacing includes a flower basket end plate and a flower basket support block, wherein two flower basket end plates are provided, and the flower basket support block is provided between the two flower basket end plates. There are multiple flower basket support blocks, and both ends of the multiple flower basket support blocks are fixedly connected to adjacent flower basket end plates. A control device is fixedly provided on any flower basket end plate, and a handle is fixedly provided on the flower basket end plate. The silicon wafer flower basket with adjustable spacing also includes: A built-in groove is provided in the flower basket support block; The distance adjusting groove is formed on the surface of the flower basket support block, and the distance adjusting groove on each flower basket support block is connected with the built-in groove in the flower basket support block; A driving mechanism is arranged on any one of the flower basket end plates, and the driving mechanism is electrically connected to the control device; A transmission part, disposed on the driving mechanism, and used to transmit power of the driving mechanism; The carrying mechanism is arranged in the built-in groove, and the carrying mechanism is used for carrying the silicon wafer.

[0006] Preferably, the driving mechanism comprises: A support plate, fixedly arranged on any one of the flower basket end plates; The driving unit is arranged on the supporting plate, and the driving unit is electrically connected to the control device.

[0007] Preferably, the driving unit comprises: A driving motor is disposed on the support plate and is detachably fixedly connected to the support plate, and the driving motor is electrically connected to the control device; A driving shaft is rotatably disposed on the support plate, and one end of the driving shaft close to the driving motor is fixedly connected to the output end of the driving motor; The drive disc is arranged at one end of the drive shaft away from the drive motor, and the drive disc is fixedly connected to the drive shaft.

[0008] Preferably, the transmission part comprises: There are multiple transmission blocks, and the multiple transmission blocks are evenly distributed on the surface of the driving disk, and one end of the transmission block close to the driving disk is fixedly connected to the driving disk, and the number of the transmission blocks is equal to the number of the basket support blocks; An arc-shaped tooth plate, arranged at one end of the transmission block away from the driving disc, and the arc-shaped tooth plate is fixedly connected to the driving disc; There are multiple arc-shaped connecting blocks, and the multiple arc-shaped connecting blocks are respectively arranged between the arc-shaped tooth plates, and one end of the multiple arc-shaped connecting blocks close to the arc-shaped tooth plate is fixedly connected to the adjacent arc-shaped tooth plate.

[0009] Preferably, the carrying mechanism comprises: An adjusting portion, located in the built-in groove; The matching parts have multiple groups, and the multiple groups of matching parts are respectively arranged on the flower basket support blocks, and the matching parts are used to drive the rotating part to rotate; The bearing part is arranged on the adjusting part, and the bearing part is used for bearing the silicon wafer.

[0010] Preferably, the adjustment unit comprises: An adjusting shaft is located in the built-in groove and is rotatably connected to the flower basket support block; An adjusting column, disposed on the adjusting shaft and fixedly connected to the adjusting shaft; An annular groove is provided on the adjusting column; There are two adjustment groove groups, and the two adjustment groove groups are symmetrically distributed on both sides of the annular groove.

[0011] Preferably, the adjustment tank group includes: There are multiple spiral grooves, and the multiple spiral grooves are evenly distributed on the surface of the adjusting column. The pitch difference of adjacent spiral grooves is equal, and the spacing between the spiral grooves on both sides of the annular groove is equal to the spacing between adjacent spiral grooves.

[0012] Preferably, the matching portion comprises: A connecting shaft is rotatably arranged on the flower basket end plate provided with the support plate, and one end of the connecting shaft close to the adjusting shaft is fixedly connected to the adjusting shaft; The matching gear is arranged at one end of the connecting shaft away from the adjusting shaft, and the matching gear is fixedly connected to the connecting shaft.

[0013] Preferably, the bearing portion comprises: There are multiple sliding blocks, and the multiple sliding blocks are equidistantly arranged in the distance adjusting groove, and the sliding blocks are slidably connected to the distance adjusting groove; The pitch-adjusting shaft is rotatably arranged on the sliding block, and the pitch-adjusting shaft cooperates with the adjacent spiral groove and the annular groove, and the surface of the pitch-adjusting shaft extending into the spiral groove and the annular groove is provided with two symmetrically arranged ball grooves; A ball is disposed in the ball groove and is rollingly connected to the ball groove, and the ball is used to reduce the resistance encountered by the adjustable shaft when sliding in the spiral groove and the annular groove; The silicon wafer carrier is arranged at one end of the pitch-adjusting shaft away from the regulating shaft. The silicon wafer carrier is fixedly connected to the pitch-adjusting shaft. A silicon wafer carrier groove is provided on the surface of the silicon wafer carrier away from the pitch-adjusting shaft.

[0014] Preferably, a protective cover is fixedly provided on the end plate of the flower basket provided with the support plate.

[0015] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are: Through the cooperation among the driving mechanism, the transmission part and the bearing mechanism, the device can adjust the spacing between the silicon wafer carriers on the flower basket support block, so that the silicon wafers loaded on the device can be suitable for the requirements of the silicon wafer spacing under different process conditions, thereby greatly improving the applicability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0017] Figure 1 A schematic diagram of the three-dimensional structure of a silicon wafer flower basket with adjustable spacing is shown.

[0018] Figure 2 A front view of a silicon wafer basket with adjustable spacing is shown.

[0019] Figure 3 Shows Figure 2 Sectional view of AA.

[0020] Figure 4 Shows Figure 3 A schematic diagram of the enlarged local structure at point A in the middle.

[0021] Figure 5 Shows Figure 4 A magnified schematic diagram of the local structure at point B in the middle.

[0022] Figure 6 A right side view of a silicon wafer basket with adjustable spacing is shown.

[0023] Figure 7 A bottom view of a silicon wafer basket with adjustable spacing is shown.

[0024] Figure 8 An exploded view of a silicon wafer basket with adjustable spacing is shown.

[0025] Fig. 9 A partial structural schematic diagram of a silicon wafer flower basket with adjustable spacing is shown.

[0026] Fig.10 Shows Figure 8 Exploded view of the middle part of the structure.

[0027] Fig.11 Shows Fig.10 Enlarged schematic diagram of the local structure at point C in the middle.

[0028] Legend: 1. Flower basket end plate; 2. Flower basket support block; 3. Control device; 4. Handle; 5. Built-in groove; 6. Adjustable pitch groove; 7. Support plate; 8. Drive motor; 9. Drive shaft; 10. Drive disk; 11. Transmission block; 12. Arc tooth plate; 13. Arc connecting block; 14. Adjustment shaft; 15. Adjustment column; 16. Annular groove; 17. Spiral groove; 18. Connecting shaft; 19. Matching gear; 20. Sliding block; 21. Adjustable pitch shaft; 22. Ball groove; 23. Ball; 24. Silicon wafer carrier block; 25. Silicon wafer carrier groove; 26. Protective cover. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0031] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a component centered. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may also be a component centered. When a component is considered to be "set on" another component, it may be directly set on the other component or there may also be a component centered. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0033] Reference Figures 1 to 11 An embodiment of a silicon wafer flower basket with adjustable spacing according to the present invention is further described.

[0034] A silicon wafer flower basket with adjustable spacing includes a flower basket end plate 1 and a flower basket support block 2, wherein two flower basket end plates 1 are provided, and the flower basket support block 2 is provided between the two flower basket end plates 1. There are multiple flower basket support blocks 2, and both ends of the multiple flower basket support blocks 2 are fixedly connected to the adjacent flower basket end plates 1. A control device 3 is fixedly provided on any flower basket end plate 1, and a handle 4 is fixedly provided on the flower basket end plate 1. The silicon wafer flower basket with adjustable spacing also includes: A built-in groove 5 is provided in the flower basket support block 2; The distance adjusting groove 6 is formed on the surface of the flower basket support block 2, and the distance adjusting groove 6 on each flower basket support block 2 is connected to the built-in groove 5 in the flower basket support block 2; Reference Figures 1 to 11 , a driving mechanism is arranged on any one of the flower basket end plates 1, the driving mechanism is electrically connected to the control device 3, and the driving mechanism includes: A support plate 7 is fixedly arranged on any one of the flower basket end plates 1, and a protective cover 26 is fixedly arranged on the flower basket end plate 1 provided with the support plate 7; A driving unit is disposed on the support plate 7, the driving unit is electrically connected to the control device 3, and the driving unit includes: a driving motor 8, which is disposed on the supporting plate 7 and is detachably fixedly connected to the supporting plate 7, and the driving motor 8 is electrically connected to the control device 3; A driving shaft 9 is rotatably disposed on the support plate 7, and one end of the driving shaft 9 close to the driving motor 8 is fixedly connected to the output end of the driving motor 8; The driving disc 10 is disposed at one end of the driving shaft 9 away from the driving motor 8 , and the driving disc 10 is fixedly connected to the driving shaft 9 .

[0035] During operation, the control device 3 controls the drive motor 8 to start, so that the drive shaft 9 fixedly connected to the output end of the drive motor 8 rotates, driving the drive disk 10 fixedly connected to the drive shaft 9 to rotate, thereby transmitting power to the transmission part.

[0036] Reference Figures 1 to 11 , a transmission part is arranged on the driving mechanism, and the transmission part is used to transmit the power of the driving mechanism, and the transmission part includes: There are multiple transmission blocks 11, and the multiple transmission blocks 11 are evenly distributed on the surface of the driving disk 10, and one end of the transmission block 11 close to the driving disk 10 is fixedly connected to the driving disk 10, and the number of the transmission blocks 11 is equal to the number of the basket support blocks 2; An arc-shaped tooth plate 12 is disposed at one end of the transmission block 11 away from the driving disk 10, and the arc-shaped tooth plate 12 is fixedly connected to the driving disk 10; There are multiple arc-shaped connecting blocks 13 , and the multiple arc-shaped connecting blocks 13 are respectively arranged between the arc-shaped tooth plates 12 , and one end of the multiple arc-shaped connecting blocks 13 close to the arc-shaped tooth plate 12 is fixedly connected to the adjacent arc-shaped tooth plate 12 .

[0037] During operation, the rotation of the driving disc 10 causes the transmission block 11 arranged on the surface of the driving disc 10 to rotate around the axis of the driving disc 10, driving the arc-shaped toothed plate 12 fixedly connected to the transmission block 11 to rotate around the axis of the driving disc 10, thereby transmitting power to the bearing mechanism.

[0038] Reference Figures 1 to 11 , a carrying mechanism is arranged in the built-in groove 5, and the carrying mechanism is used to carry the silicon wafer, and the carrying mechanism includes: The adjusting part is located in the built-in groove 5, and the adjusting part includes: The adjusting shaft 14 is located in the built-in groove 5, and the adjusting shaft 14 is rotatably connected to the flower basket support block 2; An adjusting column 15 is disposed on the adjusting shaft 14 and fixedly connected to the adjusting shaft 14; An annular groove 16 is provided on the adjusting column 15; There are two adjustment groove groups, and the two adjustment groove groups are symmetrically distributed on both sides of the annular groove 16. The adjustment groove groups include: There are multiple spiral grooves 17, and the multiple spiral grooves 17 are evenly distributed on the surface of the adjusting column 15, the pitch difference of adjacent spiral grooves 17 is equal, and the spacing between the spiral grooves 17 on both sides of the annular groove 16 is equal to the spacing between adjacent spiral grooves 17; The matching part has multiple groups, and the multiple groups of matching parts are respectively arranged on the flower basket support block 2. The matching part is used to drive the rotating part to rotate. The matching part includes: A connecting shaft 18 is rotatably disposed on the flower basket end plate 1 provided with the support plate 7, and one end of the connecting shaft 18 close to the adjusting shaft 14 is fixedly connected to the adjusting shaft 14; A matching gear 19 is disposed at one end of the connecting shaft 18 away from the adjusting shaft 14, and the matching gear 19 is fixedly connected to the connecting shaft 18; Reference Figures 1 to 11 , a bearing part, arranged on the adjusting part, the bearing part is used to bear the silicon wafer, and the bearing part comprises: There are multiple sliding blocks 20, and the multiple sliding blocks 20 are equidistantly arranged in the distance adjusting groove 6, and the sliding blocks 20 are slidably connected to the distance adjusting groove 6; The spacing shaft 21 is rotatably disposed on the sliding block 20, and the spacing shaft 21 cooperates with the adjacent spiral groove 17 and the annular groove 16. The surface of the spacing shaft 21 extending into the spiral groove 17 and the annular groove 16 is provided with two symmetrically arranged ball grooves 22; A ball 23 is disposed in the ball groove 22 and is rollingly connected to the ball groove 22. The ball 23 is used to reduce the resistance encountered by the adjustable shaft 21 when sliding in the spiral groove 17 and the annular groove 16. It should be noted that, by providing the ball 23, when the spacing shaft 21 moves in the spiral groove 17, it is prevented from directly contacting the inner surface of the spiral groove 17, thereby greatly reducing the resistance encountered by the spacing shaft 21 when moving. At the same time, the provision of the ball 23 also prevents the spacing shaft 21 from being stuck when moving in the spiral groove 17, thereby improving the smoothness of the spacing shaft 21 when moving to a certain extent.

[0039] The silicon wafer carrier 24 is arranged at one end of the spacing axis 21 away from the adjustment axis 14. The silicon wafer carrier 24 is fixedly connected to the spacing axis 21. A silicon wafer loading groove 25 is provided on the surface of the silicon wafer carrier 24 away from the spacing axis 21. The silicon wafer loading groove 25 is used to support and limit the silicon wafer.

[0040] During operation, the meshing between the arc-shaped toothed plate 12 and the matching gear 19 causes the matching gear 19 to rotate, thereby driving the connecting shaft 18 fixedly connected to the matching gear 19 to rotate, causing the adjusting shaft 14 fixedly connected to the connecting shaft 18 to rotate, thereby driving the adjusting column 15 fixedly connected to the adjusting shaft 14 to rotate, and through the cooperation between the annular groove 16 and the spiral groove 17 on the adjusting column 15 and the distance adjusting shaft 21, the distance adjusting shafts 21 on both sides of the distance adjusting shaft 21 matched with the annular groove 16 slide in the distance adjusting groove 6 at an equal distance, thereby causing the distance adjusting shaft 21 matched with the spiral groove 17 to drive the silicon wafer carriers 24 to move at an equal distance, until the spacing between each silicon wafer carrier 24 is adjusted to the required spacing; It should be noted that, through the cooperation between the driving mechanism, the transmission part and the supporting mechanism, the device can adjust the spacing between each silicon wafer carrier 24 on the flower basket support block 2, so that the silicon wafers loaded on the device can be suitable for the requirements of the silicon wafer spacing under different process conditions, thereby greatly improving the applicability of the device.

[0041] Working principle: Refer to Figures 1 to 11When working, the spacing between the silicon wafer carriers 24 on the same silicon wafer connection block is adjusted according to actual needs. The specific process is as follows: the control device 3 controls the drive motor 8 to start, so that the drive shaft 9 fixedly connected to the output end of the drive motor 8 rotates, driving the drive disk 10 fixedly connected to the drive shaft 9 to rotate, so that the transmission block 11 arranged on the surface of the drive disk 10 rotates around the axis of the drive disk 10, driving the arc-shaped toothed plate 12 fixedly connected to the transmission block 11 to rotate around the axis of the drive disk 10, and through the meshing between the arc-shaped toothed plate 12 and the matching gear 19, the matching gear 19 is meshed. 9 rotates, thereby driving the connecting shaft 18 fixedly connected to the matching gear 19 to rotate, so that the adjusting shaft 14 fixedly connected to the connecting shaft 18 rotates, thereby driving the adjusting column 15 fixedly connected to the adjusting shaft 14 to rotate, and through the cooperation of the annular groove 16 and the spiral groove 17 on the adjusting column 15 with the distance adjusting shaft 21, the distance adjusting shafts 21 on both sides of the distance adjusting shaft 21 matched with the annular groove 16 slide in the distance adjusting groove 6 at an equal distance, and then the distance adjusting shaft 21 matched with the spiral groove 17 drives the silicon wafer carriers 24 to move at an equal distance, until the spacing between each silicon wafer carrier 24 is adjusted to the required spacing.

[0042] The above description of the embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A silicon wafer flower basket with adjustable spacing, comprising a flower basket end plate (1) and a flower basket support block (2), wherein two flower basket end plates (1) are provided, and the flower basket support block (2) is provided between the two flower basket end plates (1), and a plurality of flower basket support blocks (2) are provided, and both ends of the plurality of flower basket support blocks (2) are fixedly connected to adjacent flower basket end plates (1), characterized in that: A control device (3) is fixedly arranged on any one of the flower basket end plates (1), and a handle (4) is fixedly arranged on the flower basket end plate (1). The silicon wafer flower basket with adjustable spacing further comprises: A built-in groove (5) is provided in the flower basket support block (2); A distance adjusting groove (6) is formed on the surface of the flower basket support block (2), and the distance adjusting groove (6) on each flower basket support block (2) is connected to the built-in groove (5) in the flower basket support block (2); A driving mechanism is arranged on any one of the flower basket end plates (1), and the driving mechanism is electrically connected to the control device (3); A transmission part, disposed on the driving mechanism, and used to transmit power of the driving mechanism; A carrying mechanism is arranged in the built-in groove (5), and the carrying mechanism is used to carry the silicon wafer.

2. The spacing-adjustable silicon wafer basket according to claim 1, characterized in that: The driving mechanism comprises: A support plate (7) fixedly arranged on any one of the flower basket end plates (1); A drive unit is arranged on the support plate (7), and the drive unit is electrically connected to the control device (3).

3. The spacing-adjustable silicon wafer basket according to claim 2, characterized in that: The driving unit comprises: a drive motor (8), which is disposed on the support plate (7) and is detachably fixedly connected to the support plate (7); the drive motor (8) is electrically connected to the control device (3); A drive shaft (9) is rotatably disposed on the support plate (7), and one end of the drive shaft (9) close to the drive motor (8) is fixedly connected to an output end of the drive motor (8); The drive disc (10) is arranged at an end of the drive shaft (9) away from the drive motor (8), and the drive disc (10) is fixedly connected to the drive shaft (9).

4. The spacing-adjustable silicon wafer basket according to claim 3, characterized in that: The transmission part comprises: a transmission block (11), comprising a plurality of transmission blocks (11) uniformly distributed on the surface of the driving disk (10); an end of the transmission block (11) close to the driving disk (10) is fixedly connected to the driving disk (10); and the number of the transmission blocks (11) is equal to the number of the basket support blocks (2); An arc-shaped tooth plate (12) is arranged at one end of the transmission block (11) away from the driving disc (10), and the arc-shaped tooth plate (12) is fixedly connected to the driving disc (10); There are a plurality of arc-shaped connecting blocks (13), and the plurality of arc-shaped connecting blocks (13) are respectively arranged between the arc-shaped tooth plates (12), and one end of the plurality of arc-shaped connecting blocks (13) close to the arc-shaped tooth plates (12) is fixedly connected to an adjacent arc-shaped tooth plate (12).

5. The spacing-adjustable silicon wafer basket according to claim 4, characterized in that: The bearing mechanism comprises: An adjustment portion, located in the built-in groove (5); The matching parts have a plurality of groups, and the plurality of groups of matching parts are respectively arranged on the flower basket support block (2), and the matching parts are used to drive the rotating part to rotate; The bearing part is arranged on the adjusting part, and the bearing part is used for bearing the silicon wafer.

6. The spacing-adjustable silicon wafer basket according to claim 5, characterized in that: The adjustment unit comprises: An adjustment shaft (14) is located in the built-in groove (5), and the adjustment shaft (14) is rotatably connected to the flower basket support block (2); An adjustment column (15) is disposed on the adjustment shaft (14) and is fixedly connected to the adjustment shaft (14); An annular groove (16) is formed on the adjusting column (15); There are two adjustment groove groups, and the two adjustment groove groups are symmetrically distributed on both sides of the annular groove (16).

7. The spacing-adjustable silicon wafer basket according to claim 6, characterized in that: The regulating tank group comprises: There are a plurality of spiral grooves (17), and the plurality of spiral grooves (17) are evenly distributed on the surface of the adjusting column (15), the pitch difference between adjacent spiral grooves (17) is equal, and the spacing between the spiral grooves (17) and the annular grooves (16) on both sides of the annular groove (16) is equal to the spacing between adjacent spiral grooves (17).

8. The spacing-adjustable silicon wafer basket according to claim 7, characterized in that: The matching portion comprises: A connecting shaft (18) is rotatably mounted on a flower basket end plate (1) provided with a support plate (7), and one end of the connecting shaft (18) close to the adjusting shaft (14) is fixedly connected to the adjusting shaft (14); A matching gear (19) is arranged at an end of the connecting shaft (18) away from the adjusting shaft (14), and the matching gear (19) is fixedly connected to the connecting shaft (18).

9. The spacing-adjustable silicon wafer basket according to claim 8, characterized in that: The bearing portion comprises: A plurality of sliding blocks (20) are provided, and the plurality of sliding blocks (20) are equidistantly arranged in the distance-adjusting groove (6), and the sliding blocks (20) are slidably connected to the distance-adjusting groove (6); A spacing shaft (21) is rotatably disposed on the sliding block (20), and the spacing shaft (21) cooperates with the adjacent spiral groove (17) and the annular groove (16), and the surface of the spacing shaft (21) extending into the spiral groove (17) and the annular groove (16) is provided with two symmetrically arranged ball grooves (22); A ball (23) is disposed in the ball groove (22), and the ball (23) is rollingly connected to the ball groove (22), and the ball (23) is used to reduce the resistance encountered by the spacing shaft (21) when sliding in the spiral groove (17) and the annular groove (16); A silicon wafer carrier (24) is arranged at one end of the spacing axis (21) away from the adjustment axis (14); the silicon wafer carrier (24) is fixedly connected to the spacing axis (21); and a silicon wafer carrier groove (25) is provided on a surface of the silicon wafer carrier (24) away from the spacing axis (21).

10. The spacing-adjustable silicon wafer basket according to claim 9, characterized in that: A protective cover (26) is fixedly arranged on the flower basket end plate (1) provided with a support plate (7).

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