Cascadable multi-axis control circuit board with strong expansibility

Abstract

The invention discloses a cascading multi-axis control circuit board with high expansibility, and relates to the technical field of automatic control. The device comprises a power supply part, a core processing unit, a high-speed differential digital interface, a digital and analog input / output module, a serial communication module, an expansion interface module and the like. The core processing unit is composed of a DSP and an FPGA, and high-speed data interaction is achieved through an EMIF interface. When existing functions cannot meet requirements, function expansion can be carried out through the expansion interface, and a single function expansion mode and a parallel or serial cascade expansion mode are supported. A hollow structure and crossed drainage strips are designed in the circuit board to form a water cooling channel. And in cooperation with a cooling pump shell, a centrifugal shifting plate, a heat absorption sheet, a heat dissipation copper plate and other assemblies, air cooling and liquid cooling modes are combined, and efficient heat dissipation is achieved. The design solves the problem of low efficiency of a traditional heat dissipation mode, and is particularly suitable for electronic components with high heat productivity. And meanwhile, the adaptability of the system is improved due to the flexible expansion capability.

Description

Technical Field

[0001] The invention relates to the technical field of automatic control, in particular to a cascadable multi-axis control circuit board with strong expansibility. Background Art

[0002] The existing multi-axis control circuit board (hereinafter referred to as the control board) has fixed functions and poor scalability. If new user needs are encountered, the circuit board needs to be redesigned. However, since the newly designed circuit board has not undergone long-term testing and verification, it is impossible to find design flaws and defects in reliability and stability in time. If it is put into the product project, it will seriously affect the product quality. In addition, the heat dissipation of electronic components mainly depends on installing a heat sink above the components, such as a heat sink or a fan. This method can only take away the heat from the surface of the component, and cannot effectively dissipate the heat generated by the contact surface between the component and the circuit board, resulting in low heat dissipation efficiency. Especially for electronic devices with high heat generation, traditional heat dissipation methods are difficult to meet their heat dissipation needs and may cause overheating failures. Summary of the invention

[0003] In order to overcome the defects of the above-mentioned prior art, the present invention provides the following technical solutions: a highly expansible and cascadable multi-axis control circuit board, which is composed of a power supply part, a core processing unit part, a high-speed differential digital interface part, a digital input part, a digital output part, an analog input part, an analog output part, a serial communication part, an expansion interface part and a circuit board body; the power supply part generates the power required for the normal operation of each part of the circuit board; the core processing unit part is composed of a DSP and an FPGA, which are connected through a high-speed parallel interface EMIF to realize data interaction, the DSP is mainly used for data processing and algorithm implementation, and the FPGA is used for interface management and function expansion; the high-speed differential digital interface part converts the common Biss-C, SSI, End The differential signals such as at are converted into single-ended signals and transmitted to the FPGA for data reading; the digital input / output part converts the external level signal into the level received / controlled by the FPGA and inputs it into the FPGA; the analog input / output part is mainly composed of AD / DA chips, and the FPGA controls the AD / DA chips to complete the digital / analog and analog / digital conversion; the serial communication part is composed of RS232 and RS422 transceiver chips to realize the reception and transmission of communication data; the expansion interface is composed of the FPGA's IO, a bidirectional level conversion chip and a dip switch. The FPGA performs logic implementation, the level conversion chip completes the conversion between the FPGA's IO level and the TTL level, and the dip switch completes the selection of the master / slave signal of the expansion interface.

[0004] Preferably, the expansion interface is implemented using 16 IO pins of the FPGA, and is configured as a control and data bus for functional expansion, as well as multiple groups of serial communication buses in cascade form, and a multi-bit-width parallel bus form as needed; the control and data signals for functional expansion configure the 16 IO pins of the FPGA as the control and data signals required for the expansion circuit board; the FPGA of the control board implements interface management and data interaction of the corresponding expansion circuit board, and transmits it to the DSP through the EMIF bus, thereby realizing direct control of the expansion circuit board by the control board; the cascade form of functional expansion is a complex form of expansion, and the expansion circuit board also includes an FPGA chip to realize the expansion interface function; the control board is set to the main circuit board through the dip switch, and the expansion circuit board is the slave circuit board, and they communicate with each other via a multi-bit-width parallel bus or a serial bus.

[0005] Preferably, the cascading of two circuit boards is realized in a multi-bit-width parallel cascade form, and the 16 IO pins of the FPGA are configured as a 1-bit-width time synchronization signal, an 8-bit-width DATA data signal, a 1-bit-width CS chip select signal, a 1-bit-width R / W read / write signal, and a 5-bit-width ADDR address signal; the time synchronization signal is used to realize the time synchronization of the circuit board; the DATA data signal is used to transmit data; the CS chip select signal is used to be set as the main board to select the slave board; the R / W read / write signal is used to indicate the read and write operations of the main board to the slave board; the ADDR address signal is used to indicate the address of the read and write data.

[0006] Preferably, a multi-channel serial cascade form is used to realize a 1-master-3-slave circuit board cascade form, and the 16 IO pins of the FPGA are configured as a 1-bit wide time synchronization signal, 3 groups of SPI communication buses, each group is provided with a 1-bit wide CS chip select signal, a 1-bit wide MISO data signal, a 1-bit wide MOSI data signal and a 1-bit wide CLK clock signal; the time synchronization signal is used to realize the time synchronization of the circuit board; the CS chip select signal is used to be set as the main board to select the slave board; the MISO data signal is used to indicate the data input of the main circuit board and the data output of the slave circuit board; the MOSI data signal is used to indicate the data output of the main circuit board and the data input of the slave circuit board; the CLK clock signal indicates that the data is valid when it is aligned with its rising edge during data transmission.

[0007] Preferably, the interior of the circuit board body is hollow, and cross-disposed drainage bars are provided inside the circuit board body, so that a water channel is formed inside the circuit board body.

[0008] Preferably, a temperature control unit is connected to the inside of the circuit board body, and the temperature control unit includes a cooling pump shell. The cooling pump shell is connected to the inside of the circuit board body through a return pipe and a water suction pipe, so that the cooling pump shell and the water path inside the circuit board body form a circulation.

[0009] Preferably, a drainage chamber is fixed at the center position of the bottom surface of the inner wall of the cooling pump casing, the interior of the drainage chamber is connected to the interior of the water suction pipe, and a through hole is opened at the center of the drainage chamber, so that the water suction pipe is connected to the interior of the cooling pump casing through the drainage chamber; a permanent magnetic disk is rotatably provided on the inner wall of the drainage chamber, and the permanent magnetic disk cooperates with the drainage chamber and the cooling pump casing for rotational sealing, and a rotating disk is also rotatably installed on the drainage chamber, and the rotating disk, the drainage chamber and the cooling pump casing are coaxially arranged, and a plurality of centrifugal paddles are fixed on the rotating disk along its own radial direction, and heat absorbing plates are provided at the rotation center of all the centrifugal paddles, and the heat absorbing plates are fixed on the heat absorbing block.

[0010] Preferably, a sealing baffle is fixedly sealed on the top of the inner wall of the cooling pump housing, wherein the heat absorption block is fixed at the center position of the sealing baffle, a heat dissipation copper plate is fixed on the sealing baffle, the heat dissipation copper plate is in contact with or fixedly matched with the heat absorption block, and an electric valve is installed in series on the return pipe to adjust the flow rate of the coolant inside the return pipe.

[0011] Preferably, a heat sink is installed in series on the return pipe, a guide channel is fixedly provided on the side of the heat sink, an end of the guide channel away from the heat sink is fixed to the cooling pump casing, an air inlet is fixed at a position coaxial with the cooling pump casing on the guide channel, the air inlet is communicated with the inside of the guide channel, and a heat dissipation fan is rotatably installed on the air inlet; a transmission shaft is rotatably provided on the outer surface of the guide channel, wherein a bottom drive motor is fixed on the lower surface of the cooling pump casing, the top end of the transmission shaft is connected to the heat dissipation fan through a top transmission belt, the bottom end of the transmission shaft is connected to the output shaft of the bottom drive motor through a bottom transmission belt, and at the same time, the output shaft of the bottom drive motor is also fixedly matched with the permanent magnetic disk, and the permanent magnetic disk is magnetically matched with the rotating disk Compared with the prior art, the present invention has the following beneficial effects: (1) On the basis of ensuring the basic peripherals required for multi-axis control, the present invention adds a signal expansion interface, which can be connected to an expansion circuit board with other functions according to actual needs to expand the controller function and form a cascade form for expansion, thereby improving the wide applicability of the circuit board, effectively avoiding the design flaws and reliability and stability defects caused by redesigning the control circuit board, and improving product reliability; (2) The present invention forms an internal water channel by arranging a hollow structure and a cross-drainage strip inside the circuit board body. The coolant circulates in the water channel and can directly take away the heat from the contact surface of the electronic components and the circuit board. Compared with the traditional method of only installing a radiator above the components, this internal water cooling method can more comprehensively reduce the temperature, improve the heat dissipation efficiency, and ensure that the components can still operate stably in a high temperature environment; (3) The present invention combines two heat dissipation methods: liquid cooling and air cooling. The coolant transfers heat to the heat dissipation copper plate through the heat absorption sheet and the heat absorption block, and the heat dissipation fan introduces external cold air into the guide channel to force air cooling of the heat dissipation copper plate and the heat dissipation fin. The integration of multiple heat dissipation mechanisms ensures efficient heat dissipation and meets the heat dissipation requirements of high-power electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the functional modules of the circuit board of the present invention.

[0013] Figure 2 It is a schematic diagram of the function expansion of the present invention.

[0014] Figure 3 It is a schematic diagram of the multi-bit width parallel cascade form of the present invention.

[0015] Figure 4 It is a schematic diagram of the serial cascade form of the present invention.

[0016] Figure 5 It is a schematic diagram of the circuit board body of the present invention.

[0017] Figure 6 Schematic diagram of the distribution of drainage strips of the present invention.

[0018] Figure 7 For the present invention Figure 6 Schematic diagram of the structure at point A in the middle.

[0019] Figure 8 It is a structural schematic diagram of the bottom driving motor of the present invention.

[0020] Fig. 9 It is a schematic diagram of the structure of the flow guide channel of the present invention.

[0021] Fig.10 This is a schematic diagram of the cooling pump casing structure of the present invention.

[0022] In the figure: 101-circuit board body; 102-drainage strip; 103-return pipe; 104-heat sink; 105-flow guide channel; 106-cooling pump housing; 107-water suction pipe; 108-cooling fan; 109-air inlet; 110-top transmission belt; 111-transmission shaft; 112-bottom drive motor; 113-bottom transmission belt; 114-heat dissipation copper plate; 115-sealing partition; 116-heat absorbing block; 117-heat absorbing sheet; 118-centrifugal paddle; 119-rotating disk; 120-permanent magnetic disk; 121-drainage chamber. DETAILED DESCRIPTION

[0023] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0024] The present invention provides a cascadable multi-axis control circuit board with strong expansibility, which consists of a power supply part, a core processing unit part, a high-speed differential digital interface part, a digital input part, a digital output part, an analog input part, an analog output part, a serial communication part, an expansion interface part and a circuit board body 101.

[0025] The power supply part generates the power required for the normal operation of each part of the circuit board; the core processing unit part is composed of DSP and FPGA, which realize data interaction through the high-speed parallel interface EMIF connection. DSP mainly performs data processing and algorithm implementation, and FPGA performs interface management and function expansion; the high-speed differential digital interface part converts common differential signals such as Biss-C, SSI, Endat into single-ended signals and transmits them to FPGA for data conversion; the digital input / output part converts the external level signal into a level that can be received / controlled by FPGA and inputs it into FPGA; the analog input / output part is mainly composed of AD / DA chips, and FPGA controls AD / DA chips to complete digital / analog and analog / digital conversion; the serial communication part is composed of RS232 and RS422 transceiver chips to realize the reception and transmission of communication data; the expansion interface is composed of FPGA's IO, bidirectional level conversion chip and a dip switch. FPGA performs logic implementation, the level conversion chip completes the conversion between FPGA's IO level and TTL level, and the dip switch completes the selection of the master / slave signal of the expansion interface.

[0026] When controlling the motor, the FPGA first collects information from the high-speed differential digital interface, digital input, analog input, and serial communication circuit, and transmits the relevant data to the DSP through the EMIF interface. The DSP performs corresponding algorithm processing on the angle measurement, IO, and analog information according to the communication instructions; then returns the IO output, analog output, operating status and other information to the FPGA through the EMIF bus. The FPGA controls the corresponding circuits to realize IO output, analog output, and communication data output, and realizes motor control and status monitoring.

[0027] If the existing functions of the control panel cannot meet the project requirements, the functions need to be expanded through the expansion interface. If the expansion function is simple and has low complexity, Figure 2 As shown in the figure, a single function expansion is performed. At this time, only a single function circuit board needs to be designed to be connected to the control board through the expansion interface. The FPGA of the control board implements the interface management and data interaction of the corresponding expansion circuit board, and then transmits it to the DSP through the EMIF bus to realize the direct control of the control board over the expansion circuit board.

[0028] If there are many functions to be expanded and the complexity is high, it is necessary to adopt cascade expansion to expand the functions of the control board. The cascade expansion circuit board also contains an FPGA chip to realize the expansion interface function. The control board is set as the main circuit board through the dip switch, and the expansion circuit board is the slave circuit board. They communicate with each other through a multi-bit wide parallel bus or serial bus; cascade expansion is divided into parallel cascade expansion and serial cascade expansion; the characteristics of parallel cascade expansion are fast data transmission, but the data types are limited; the characteristics of serial cascade expansion are slow data transmission, but the data types are diverse, and can be selected according to actual needs.

[0029] The multi-bit width parallel cascade form can realize the cascade of two control circuit boards, such as Figure 3 As shown in the figure, the 16 IO pins of the FPGA are configured as a 1-bit wide time synchronization signal, an 8-bit wide DATA data signal, a 1-bit wide CS chip select signal, a 1-bit wide R / W read / write signal, and a 5-bit wide ADDR address signal; the time synchronization signal is used to synchronize the time of the cascaded slave circuit board with the master circuit board; the DATA data signal is used to transmit data; the CS chip select signal is used to set the main board to select the slave board; the R / W read / write signal is used to indicate the read and write operations of the main board to the slave board; and the ADDR address signal is used to indicate the address of the read and write data.

[0030] The multi-channel serial cascade form can realize the circuit board cascade form of 1 master and 3 slaves, such as Figure 4 As shown, the 16 IO pins of the FPGA are configured as a 1-bit wide time synchronization signal, 3 groups of SPI communication buses, each group is set with a 1-bit wide CS chip select signal, a 1-bit wide MISO data signal, a 1-bit wide MOSI data signal and a 1-bit wide CLK clock signal; the time synchronization signal is used to synchronize the cascaded slave circuit board with the master circuit board; the CS chip select signal is used to be set as the main board to select the slave board; the MISO data signal is used to indicate the data input of the master circuit board and the data output of the slave circuit board; the MOSI data signal is used to indicate the data output of the master circuit board and the data input of the slave circuit board; the CLK clock signal indicates that the data is valid when it is aligned with its rising edge during data transmission.

[0031] The inside of the circuit board body 101 is hollow, and cross-drainage strips 102 are arranged inside the circuit board body 101, so that a water path is formed inside the circuit board body 101. A temperature control unit is connected to the inside of the circuit board body 101, and the temperature control unit includes a cooling pump housing 106. The cooling pump housing 106 is connected to the inside of the circuit board body 101 through a return pipe 103 and a water suction pipe 107, so that the cooling pump housing 106 and the water path inside the circuit board body 101 form a circulation. A drainage chamber 121 is fixed at the center position of the bottom surface of the inner wall of the cooling pump casing 106, and the interior of the drainage chamber 121 is connected to the interior of the water suction pipe 107. A through hole is opened at the center of the drainage chamber 121, so that the water suction pipe 107 can communicate with the interior of the cooling pump casing 106 through the drainage chamber 121; a permanent magnetic disk 120 is rotatably provided on the inner wall of the drainage chamber 121, and the permanent magnetic disk 120 is rotatably sealed with the drainage chamber 121 and the cooling pump casing 106, and a rotating disk 119 is also rotatably installed on the drainage chamber 121, and the rotating disk 119, the drainage chamber 121 and the cooling pump casing 106 are coaxially arranged, and a plurality of centrifugal paddles 118 are fixed on the rotating disk 119 along its own radial direction, and the rotation center of all the centrifugal paddles 118 is provided with a heat absorbing plate 117, and the heat absorbing plate 117 is fixed on the heat absorbing block 116. A sealing partition 115 is fixedly sealed on the top of the inner wall of the cooling pump housing 106, wherein a heat absorption block 116 is fixed at the center position of the sealing partition 115, and a heat dissipation copper plate 114 is fixed on the sealing partition 115. The heat dissipation copper plate 114 is in contact with or fixedly matched with the heat absorption block 116, and an electric valve is installed in series on the return pipe 103 to adjust the flow rate of the coolant inside the return pipe 103. A heat sink 104 is installed in series on the return pipe 103, and a guide channel 105 is fixedly provided on the side of the heat sink 104. One end of the guide channel 105 away from the heat sink 104 is fixed to the cooling pump shell 106, and an air inlet 109 is fixed at a position coaxial with the cooling pump shell 106 on the guide channel 105. The air inlet 109 is communicated with the inside of the guide channel 105, and a cooling fan 108 is rotatably installed on the air inlet 109; a transmission shaft 111 is rotatably provided on the outer surface of the guide channel 105, wherein a bottom drive motor 112 is fixed on the lower surface of the cooling pump shell 106, the top end of the transmission shaft 111 is connected to the cooling fan 108 through a top transmission belt 110, and the bottom end of the transmission shaft 111 is connected to the output shaft of the bottom drive motor 112 through a bottom transmission belt 113, and at the same time, the output shaft of the bottom drive motor 112 is also fixedly matched with a permanent magnetic disk 120, and the permanent magnetic disk 120 is magnetically matched with the rotating disk 119.

[0032] The components on the circuit board body 101 will generate high temperature during operation. In order to ensure that the components are in normal working condition, the traditional method is to install heat dissipation devices on the components to dissipate heat for the components. However, the contact surface between the components and the circuit board body 101 cannot dissipate heat, so the heat dissipation efficiency is relatively low, especially when facing electronic devices with high heat generation. This device starts the bottom drive motor 112, and the output shaft of the bottom drive motor 112 drives the transmission shaft 111 to rotate through the bottom transmission belt 113. The transmission shaft 111 drives the cooling fan 108 to rotate through the top transmission belt 110. The rotation of the cooling fan 108 will send the external cold air into the guide channel 105, and this part of the cold air will flow to the heat sink 104 through the heat dissipation copper plate 114, and then pass through the heat sink 104 to discharge the guide channel 105. When the output shaft of the bottom driving motor 112 rotates, it will also drive the permanent magnetic disk 120 to rotate. The rotation of the permanent magnetic disk 120 drives the rotating disk 119 to rotate through magnetic force. The rotating disk 119 drives the centrifugal paddle 118 to rotate. The centrifugal paddle 118 will drive the coolant inside the cooling pump housing 106 to rotate. The rotation of the coolant will be subjected to centrifugal force and flow toward the inner wall edge of the cooling pump housing 106, and then flow out of the cooling pump housing 106 through the return pipe 103. This is because a gap is provided between the drainage chamber 121 and the cooling pump housing 106, and the gap is connected to the return pipe 103, but not to the water suction pipe 107. The coolant will enter the heat sink 104 through the return pipe 103 for cooling, and then enter the circulating circuit board body 101, and then flow back to the drainage chamber 121 through the water suction pipe 107, and re-enter the cooling pump housing 106 through the through hole in the middle of the drainage chamber 121. Due to the rotation of the centrifugal paddle 118, the pressure at the axis of the cooling pump housing 106 is relatively low. At the same time, the temperature of the coolant flowing back to the cooling pump housing 106 is relatively high, so it is necessary to dissipate the heat of the coolant with a relatively high temperature. The density of the high-temperature coolant is lower than that of the low-temperature coolant. Therefore, the rotating low-temperature coolant will directly flow to the inner wall of the cooling pump housing 106, and the high-temperature coolant will gather at the axis of the cooling pump housing 106 (an electric valve is arranged on the return pipe 103 to adjust the flow so that the pressure inside the cooling pump housing 106 is always in a high-pressure state, hindering or even blocking the flow of the coolant (adjusting the opening and closing amount and state of the electric valve according to actual conditions) to facilitate the separation of high and low temperature coolants). At the same time, the heat absorption plate 117 is arranged at the axis of the cooling pump housing 106, so the heat absorption plate 117 will absorb the temperature of the high-temperature coolant, and then transfer it to the heat dissipation copper plate 114 through the heat absorption block 116. At this time, the temperature of the high-temperature coolant is reduced, and then it flows to the inner wall of the cooling pump housing 106, and the external cold air will continue to dissipate heat to the heat dissipation copper plate 114 when flowing through the heat dissipation copper plate 114.

Claims

1. A cascadable multi-axis control circuit board with strong expandability, characterized in that: It is composed of a power supply part, a core processing unit part, a high-speed differential digital interface part, a digital input part, a digital output part, an analog input part, an analog output part, a serial communication part, an expansion interface part and a circuit board body (101); the power supply part generates the power required for the normal operation of each part of the circuit board; the core processing unit part is composed of a DSP and an FPGA, which are connected through a high-speed parallel interface EMIF to realize data interaction, the DSP mainly performs data processing and algorithm implementation, and the FPGA performs interface management and function expansion; the high-speed differential digital interface part converts common differential signals such as Biss-C, SSI, Endat into single-ended signals and transmits them to the FPGA for data reading; the digital input / output part converts external level signals into levels received / controlled by the FPGA and inputs them into the FPGA; the analog input / output part is mainly composed of an AD / DA chip, and the FPGA controls the AD / DA chip to complete digital / analog and analog / digital conversion; the serial communication part is composed of RS232 and RS422 transceiver chips to realize the reception and transmission of communication data; The expansion interface consists of the FPGA's IO, a bidirectional level conversion chip, and a DIP switch. The FPGA performs logic implementation, the level conversion chip completes the conversion between the FPGA's IO level and the TTL level, and the DIP switch completes the selection of the master / slave signal of the expansion interface.

2. The multi-axis control circuit board with strong expandability and cascadability according to claim 1, characterized in that: The expansion interface is implemented using 16 IO pins of FPGA, and is configured as function-expanded control and data buses, as well as multiple groups of serial communication buses and multi-bit-width parallel buses in cascade form as needed; the function-expanded control and data signals configure the 16 IO pins of FPGA as the control and data signals required by the expansion circuit board; the FPGA of the control board implements the interface management and data interaction of the corresponding expansion circuit board, and transmits it to the DSP through the EMIF bus, so as to realize the direct control of the expansion circuit board by the control board; the cascade form of function expansion is a complex form of expansion, and the expansion circuit board also contains an FPGA chip to realize the expansion interface function; the control board is set as the main circuit board through the dip switch, and the expansion circuit board is the slave circuit board, and they communicate with each other via a multi-bit-width parallel bus or a serial bus.

3. The multi-axis control circuit board with strong expandability and cascadability according to claim 2, characterized in that: The multi-bit width parallel cascade form realizes the cascade of two circuit boards, and configures the 16 IO pins of FPGA into 1-bit wide time synchronization signal, 8-bit wide DATA data signal, 1-bit wide CS chip select signal, 1-bit wide R / W read / write signal, and 5-bit wide ADDR address signal; the time synchronization signal is used to realize the time synchronization of the circuit board; the DATA data signal is used to transmit data; the CS chip select signal is used to set the main board to select the slave board; The R / W read / write signal is used to indicate the read / write operation of the main board to the slave board; the ADDR address signal is used to indicate the address of the read / write data.

4. The multi-axis control circuit board with strong expandability and cascadability according to claim 3, characterized in that: The multi-channel serial cascade form realizes the 1-master-3-slave circuit board cascade form, and configures the 16 IO pins of the FPGA into a 1-bit wide time synchronization signal, 3 groups of SPI communication buses, each group is set with a 1-bit wide CS chip select signal, a 1-bit wide MISO data signal, a 1-bit wide MOSI data signal and a 1-bit wide CLK clock signal; the time synchronization signal is used to realize the time synchronization of the circuit board; the CS chip select signal is used to be set as the main board to select the slave board; the MISO data signal is used to indicate the data input of the main circuit board and the data output of the slave circuit board; the MOSI data signal is used to indicate the data output of the main circuit board and the data input of the slave circuit board; the CLK clock signal indicates that the data is valid when it is aligned with its rising edge during data transmission.

5. The multi-axis control circuit board with strong expandability and cascadability according to claim 1, characterized in that: The interior of the circuit board body (101) is hollow, and cross-disposed drainage strips (102) are arranged inside the circuit board body (101), so that a water channel is formed inside the circuit board body (101).

6. The multi-axis control circuit board with strong expandability and cascadability according to claim 5, characterized in that: A temperature control unit is connected to the inside of the circuit board body (101), and the temperature control unit includes a cooling pump housing (106). The cooling pump housing (106) is connected to the inside of the circuit board body (101) via a return pipe (103) and a water suction pipe (107), so that a circulation is formed between the cooling pump housing (106) and the water path inside the circuit board body (101).

7. The cascadable multi-axis control circuit board with strong expandability according to claim 6, characterized in that: A drainage chamber (121) is fixed at the center of the bottom surface of the inner wall of the cooling pump casing (106); the interior of the drainage chamber (121) is connected to the interior of the water suction pipe (107); a through hole is opened at the center of the drainage chamber (121), so that the water suction pipe (107) is connected to the interior of the cooling pump casing (106) through the drainage chamber (121); A permanent magnetic disk (120) is rotatably mounted on the inner wall of the drainage chamber (121). The permanent magnetic disk (120) cooperates with the drainage chamber (121) and the cooling pump housing (106) in a rotatable seal. A rotating disk (119) is also rotatably mounted on the drainage chamber (121). The rotating disk (119), the drainage chamber (121) and the cooling pump housing (106) are coaxially arranged. A plurality of centrifugal paddles (118) are fixed on the rotating disk (119) along its radial direction. A heat absorbing plate (117) is mounted at the rotation center of all the centrifugal paddles (118). The heat absorbing plate (117) is fixed on the heat absorbing block (116).

8. The cascadable multi-axis control circuit board with strong expandability according to claim 7, characterized in that: A sealing baffle (115) is fixedly sealed at the top of the inner wall of the cooling pump housing (106), wherein a heat absorbing block (116) is fixed at the center of the sealing baffle (115), a heat dissipating copper plate (114) is fixed to the sealing baffle (115), the heat dissipating copper plate (114) is in contact with or fixedly matched with the heat absorbing block (116), and an electric valve is installed in series on the return pipe (103) for adjusting the flow of the coolant inside the return pipe (103).

9. The cascadable multi-axis control circuit board with strong expandability according to claim 8, characterized in that: A heat sink (104) is installed in series on the return pipe (103); a guide channel (105) is fixedly provided on the side of the heat sink (104); an end of the guide channel (105) away from the heat sink (104) is fixed to the cooling pump housing (106); an air inlet (109) is fixed on the guide channel (105) at a position coaxial with the cooling pump housing (106); the air inlet (109) is communicated with the interior of the guide channel (105); and a heat dissipation fan (108) is rotatably installed on the air inlet (109); A transmission shaft (111) is rotatably provided on the outer surface of the guide channel (105), wherein a bottom drive motor (112) is fixed to the lower surface of the cooling pump housing (106), the top end of the transmission shaft (111) is transmission-connected to the heat dissipation fan (108) via a top transmission belt (110), the bottom end of the transmission shaft (111) is transmission-connected to the output shaft of the bottom drive motor (112) via a bottom transmission belt (113), and the output shaft of the bottom drive motor (112) is also fixedly matched with the permanent magnetic disk (120), and the permanent magnetic disk (120) is magnetically matched with the rotating disk (119).

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