Photovoltaic cell and circuit board integrated connection method and prepared photovoltaic power generation module

Abstract

The invention discloses a method for integrated connection of a photovoltaic cell and a circuit board and a prepared photovoltaic power generation module, a process method for connecting a lower electrode of the photovoltaic cell with a circuit bonding pad based on a composite material power connection mode is adopted, and the composite material is of a three-layer structure: metal-POE adhesive film-metal. As the metal adopts a series of conductive metal and alloy metal such as copper foil, aluminum, silver and gold with the thickness range of 1-100 microns, the metal has excellent flexibility. And meanwhile, due to metal connection, the conductive performance is excellent, and the connection strength is great. And the use requirement of the flexible power supply system in the subsequent process or application can be met.

Description

Technical Field

[0001] The present invention belongs to the technical field of power supply, and in particular relates to a method for integrating and connecting a photovoltaic cell with a circuit board and a prepared photovoltaic power generation module. Background Art

[0002] In micro-sized photovoltaic systems, in order to achieve electrical and structural connections between photovoltaic solar cells and management circuits, photovoltaic cells need to be welded on flexible circuit boards. There are currently two main methods. The first is to use interconnection strips. Since the device and circuit of this method are completely discrete, the integration is very low. The second method is to use colloidal materials such as conductive glue or conductive silver paste to connect photovoltaic solar cells to management circuits to achieve electrical and mechanical interconnection. Although this method improves the integration, due to the conductive glue material and process characteristics, its conductivity, thickness and softness have certain shortcomings. In particular, the most flexible power generation system needs to pass a large current energy and is very sensitive to the connection conductivity. Therefore, a more advanced connection method is needed. Summary of the invention

[0003] In order to solve the technical problems existing in the known technology, the present invention provides a method for integrated connection of photovoltaic cells and circuit boards and a prepared photovoltaic power generation module, which adopts a process method for connecting the lower electrode of the photovoltaic cell with the circuit pad based on a composite material power connection method, wherein the composite material is a three-layer structure: metal-POE film-metal. Since the metal adopts a series of conductive metals and alloy metals such as copper foil, aluminum, silver, gold, etc. with a thickness ranging from 1 to 100 microns, it has excellent flexibility. At the same time, because it is a metal connection, its conductivity is excellent and the connection strength is extremely large. It can meet the use requirements of the flexible power supply system in subsequent processes or applications.

[0004] The technical solution adopted by the present invention is: a method for integrating a photovoltaic cell with a circuit board, comprising the following steps:

[0005] (1) Ultrasonic cleaning of photovoltaic cells and circuit boards for more than 5 minutes to remove grease and dust;

[0006] (2) Preparation of three-layer composite material-circuit board: The three-layer composite material structure is metal foil, POE film and metal foil from bottom to top. The POE film is in the shape of a long strip. At least one pair of metal foils is arranged alternately in the length direction of the POE film. Each pair of metal foils passes through the POE film and is connected to each other. The outer edges of the metal foils are located inside the POE film. The cleaned circuit board is taken out and the three-layer composite material is placed on a circuit board of the same size as the POE film. The hot press is turned on and the circuit board with the three-layer composite material is placed in the hot press and taken out after the hot pressing is completed.

[0007] (3) The lower surfaces of the cleaned photovoltaic cells are mounted on the metal foil on the three-layer composite material structure of the three-layer composite material-circuit board, and POE film and ETFE film are laid on the upper surface of the photovoltaic cells in sequence, and they are put into a laminator for lamination to obtain a photovoltaic power generation module.

[0008] In step (2), hot pressing is performed at 100° C.-150° C. for 10 min-20 min.

[0009] In step (3), lamination is performed at a temperature of 130-150° C., a pressure of 1-1.5 MPa, and a time of 0.5-1 h.

[0010] In step (2), the metal foil in the three-layer composite material structure has a thickness of 1-100 microns and a length of 1-50 millimeters; the POE film has a thickness of 1-100 microns and a length and width of 1-100 millimeters.

[0011] The circuit board is a flexible circuit board, using an FPC circuit board with a temperature resistance of more than 240°C; the photovoltaic cell is a flexible photovoltaic cell, including flexible and bendable III-V photovoltaic cells, ultra-thin silicon solar cells, copper indium gallium selenide solar cells, and perovskite solar cells, with a cell area of ​​1mm 2 -60cm 2 .

[0012] In step (2), an object having a flat surface and a certain weight which does not damage the heat press is used for pressing.

[0013] Each pair of metal foils is connected to each other through the POE adhesive film to form a "[" shape.

[0014] The metal foil is a conductive metal such as copper, aluminum, silver, gold, or an alloy metal.

[0015] The photovoltaic power generation module is prepared by the above method.

[0016] The advantages and positive effects of the present invention are:

[0017] 1. The composite material-based power connection technology is used to connect the lower electrode of the battery to the circuit pad, which has excellent conductivity, high connection strength, good flexibility and high temperature resistance.

[0018] 2. The two metal foil layers are connected by covering the circuit board with POE film, which makes it easy to achieve uniform thickness and uniform force. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the electrical connection of the composite material structure of the flexible photovoltaic cell and the FPC circuit board of the present invention;

[0020] Figure 2It is an enlarged schematic diagram of the structural layer of the composite material of the present invention.

[0021] In the figure, 1-encapsulation layer; 101-ETFE film; 102-POE film; 2-photovoltaic cell; 201-photovoltaic cell upper electrode; 202-photovoltaic cell functional layer; 203-photovoltaic cell lower electrode; 3-composite material structure layer; 301-ultra-thin metal foil; 302-POE film; 4-FPC circuit board. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0023] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0024] In addition, the terms "first", "second", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features.

[0025] Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0026] In the description of the invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the invention can be understood according to specific circumstances.

[0027] The electrical devices, controllers, etc. described in the present invention are all conventionally configured, and the electrical connection method is also conventionally connected.

[0028] like Figure 1-2As shown, the method for integrating the photovoltaic cell and the circuit board of the present invention comprises the following steps:

[0029] (1) Ultrasonic cleaning of the photovoltaic cell 2 and the circuit board 4 for more than 5 minutes to remove grease and dust;

[0030] (2) Preparation of three-layer composite material-circuit board: The three-layer composite material structure is metal foil 301, POE film 302 and metal foil 301 from bottom to top. The POE film 302 is long and strip-shaped. At least one pair of metal foils 301 is arranged alternately in the length direction of the POE film 302. Each pair of metal foils 301 passes through the POE film 302 and is connected to each other. The outer edges of the metal foils are located inside the POE film. The cleaned circuit board 4 is taken out, and the three-layer composite material is placed on the circuit board 4 of the same size as the POE film; the hot press is turned on, and the circuit board 4 with the three-layer composite material is placed in the hot press, and taken out after the hot pressing is completed;

[0031] (3) The lower surfaces of the cleaned photovoltaic cells 2 are mounted on the metal foil 301 on the three-layer composite material structure of the three-layer composite material-circuit board, and the POE adhesive film 302 and the ETFE film 101 are laid on the upper surface of the photovoltaic cells 2 in sequence to form an encapsulation layer 1, which are then put into a laminator for lamination to obtain a photovoltaic power generation module.

[0032] In step (2), hot pressing is performed at 100° C.-150° C. for 10 min-20 min.

[0033] In step (3), lamination is performed at a temperature of 130-150° C., a pressure of 1-1.5 MPa, and a time of 0.5-1 h.

[0034] In step (2), in the three-layer composite material structure, the metal 301 has a thickness of 1-100 microns and a length of 1-50 mm; the POE film 302 has a thickness of 1-100 microns and a length and width of 1-100 mm.

[0035] The circuit board 4 is a flexible circuit board, using an FPC circuit board, with a temperature resistance of more than 240°C; the photovoltaic cell is a flexible photovoltaic cell, including flexible and bendable III-V photovoltaic cells, ultra-thin silicon solar cells, copper indium gallium selenide solar cells, and perovskite solar cells, with a cell area of ​​1mm 2 -60cm 2 .

[0036] In step (2), an object having a flat surface and a certain weight which does not damage the heat press is used for pressing.

[0037] Each pair of metal foils 301 is connected to each other through the POE film 302 to form a “[” shape.

[0038] The metal foil is a conductive metal such as copper, aluminum, silver, gold, or an alloy metal.

[0039] The photovoltaic power generation module is prepared by the above method.

[0040] In order to further understand the content, features and effects of the present invention, the following embodiments are given as examples and described in detail with reference to the accompanying drawings:

[0041] In order to realize the composite material structure connection process, it is necessary to achieve adhesion with the composite material metal foil structure on both the lower electrode of the photovoltaic cell and the FPC circuit board pad. The thickness of the metal foil structure in the composite material layer is 1 to 100 microns and the length is 1-50 mm; POE film: thickness 1-100 microns, length and width are both 1-100 mm.

[0042] The photovoltaic cells used are flexible and bendable solar cells such as III-V photovoltaic cells, ultra-thin silicon solar cells, copper indium gallium selenide solar cells, and perovskite solar cells. The lower electrode of the photovoltaic cell is a metal layer with good conductivity.

[0043] The FPC circuit board used is a high temperature resistant material, with a temperature resistance of more than 240 degrees Celsius. The pads on the circuit are copper, with an area slightly larger than the photovoltaic cell area, and the border is expanded by 0.01-2mm;

[0044] The specific manufacturing steps are as follows:

[0045] (1) Place the photovoltaic cell and the circuit board in acetone and perform ultrasonic cleaning for more than 5 minutes to remove grease and dust;

[0046] (2) Prepare a three-layer composite material structure according to the scale of the circuit board: metal foil-POE film-metal foil for standby (metal foil includes but is not limited to copper foil, aluminum, silver, gold and other conductive metals and alloy metals), the thickness of the metal foil structure is 1 to 100 microns, the length is 1-50 mm, the POE film: 1-100 microns, the length and width are both 1-100 mm. The three-layer composite material structure from bottom to top is metal foil, POE film and metal foil, the two metal foils are connected to each other through the film, the cleaned circuit board is taken out, and the three-layer composite material is placed on the circuit board;

[0047] (3) Turn on the hot press, place the circuit board with the three-layer composite material in the hot press, and press it with a series of objects such as metal plates that will not damage the hot press and have a flat surface and a certain weight. Set the hot press to a temperature of 100° C. to 150° C. for 10 min to 20 min, perform hot pressing, and take it out after the hot pressing is completed;

[0048] (4) Mount the cleaned photovoltaic cell on the three-layer composite material structure of the circuit board and perform lamination packaging. POE film and ETFE film are sequentially laid on the upper surface of the flexible photovoltaic cell, and are placed in a laminator for lamination: lamination is performed at a temperature of 130-150°C, a pressure of 1-1.5MPa, and a time of 0.5-1h. After lamination, the cell is taken out to obtain a flexible photovoltaic power generation module.

[0049] Example 1

[0050] (1) Place the rigid photovoltaic cell and PCB circuit board that meet the requirements in acetone and perform ultrasonic cleaning for 5 minutes to remove grease and dust;

[0051] (2) Prepare a three-layer composite material structure according to the scale of the circuit board: metal foil-POE film-metal foil for standby (metal foil includes but is not limited to copper foil, aluminum, silver, gold and other conductive metals and alloy metals). The metal foil structure has a thickness of 60 microns and a length of 20 mm. The POE film has a thickness of 40 microns and a length and width of 80 mm. The three-layer composite material structure from bottom to top is metal foil, POE film and metal foil. The two metal foils are connected to each other through the film. Take out the cleaned circuit board and place the three-layer composite material on the circuit board;

[0052] (3) Turn on the hot press, place the circuit board with the three-layer composite material in the hot press, and press it with a series of objects such as metal plates that will not damage the hot press and have a flat surface and a certain weight. Set the hot press at 130° C. for 15 minutes to perform hot pressing, and take it out after the hot pressing is completed;

[0053] (4) Mount the cleaned photovoltaic cell on the three-layer composite material structure of the circuit board and laminate and encapsulate it. POE film and ETFE film are laid on the upper surface of the flexible photovoltaic cell in sequence, and they are put into a laminator for lamination: lamination is carried out at a temperature of 150°C, a pressure of 1.5MPa, and a time of -1h. After lamination, it is taken out to obtain a flexible photovoltaic power generation module.

[0054] Example 2

[0055] (1) Place the flexible photovoltaic cell and PCB circuit board that meet the requirements into acetone and perform ultrasonic cleaning for 5 minutes to remove grease and dust;

[0056] (2) Prepare a three-layer composite material structure according to the scale of the circuit board: metal foil-POE film-metal foil for standby (metal foil includes but is not limited to copper foil, aluminum, silver, gold and other conductive metals and metals). The metal foil structure has a thickness of 60 microns and a length of 20 mm. The POE film has a thickness of 40 microns and a length and width of 80 mm. The three-layer composite material structure from bottom to top is metal foil, POE film and metal foil, and the two metal foils are connected to each other through the film. Take out the cleaned circuit board and place the three-layer composite material on the circuit board;

[0057] (3) Turn on the hot press, place the circuit board with the three-layer composite material in the hot press, and press it with a series of objects such as metal plates that will not damage the hot press and have a flat surface and a certain weight. Set the hot press at 130° C. for 15 minutes to perform hot pressing, and take it out after the hot pressing is completed;

[0058] (4) Mount the cleaned photovoltaic cell on the three-layer composite material structure of the circuit board and laminate and encapsulate it. POE film and ETFE film are laid on the upper surface of the flexible photovoltaic cell in sequence, and they are put into a laminator for lamination: lamination is carried out at a temperature of 150°C, a pressure of 1.5MPa, and a time of 1h. After lamination, it is taken out to obtain a flexible photovoltaic power generation module.

[0059] Example 3

[0060] (1) Place the rigid photovoltaic cell and FPC circuit board that meet the requirements into acetone and perform ultrasonic cleaning for 5 minutes to remove grease and dust;

[0061] (2) Prepare a three-layer composite material structure according to the scale of the circuit board: metal foil-POE film-metal foil for standby (metal foil includes but is not limited to copper foil, aluminum, silver, gold and other conductive metals and metals). The metal foil structure has a thickness of 60 microns and a length of 20 mm. The POE film has a thickness of 40 microns and a length and width of 80 mm. The three-layer composite material structure from bottom to top is metal foil, POE film and metal foil, and the two metal foils are connected to each other through the film. Take out the cleaned circuit board and place the three-layer composite material on the circuit board;

[0062] (3) Turn on the hot press, place the circuit board with the three-layer composite material in the hot press, and press it with a series of objects such as metal plates that will not damage the hot press and have a flat surface and a certain weight. Set the hot press at 130° C. for 15 minutes to perform hot pressing, and take it out after the hot pressing is completed;

[0063] (4) Mount the cleaned photovoltaic cell on the three-layer composite material structure of the circuit board and laminate and encapsulate it. POE film and ETFE film are laid on the upper surface of the flexible photovoltaic cell in sequence, and they are put into a laminator for lamination: lamination is carried out at a temperature of 150°C, a pressure of 1.5MPa, and a time of 1h. After lamination, it is taken out to obtain a flexible photovoltaic power generation module.

[0064] Example 4

[0065] (1) Place the flexible photovoltaic cell and FPC circuit board that meet the requirements into acetone and perform ultrasonic cleaning for 5 minutes to remove grease and dust;

[0066] (2) Prepare a three-layer composite material structure according to the scale of the circuit board: metal foil-POE film-metal foil for standby (metal foil includes but is not limited to copper foil, aluminum, silver, gold and other conductive metals and metals). The metal foil structure has a thickness of 60 microns and a length of 20 mm. The POE film has a thickness of 40 microns and a length and width of 80 mm. The three-layer composite material structure from bottom to top is metal foil, POE film and metal foil, and the two metal foils are connected to each other through the film. Take out the cleaned circuit board and place the three-layer composite material on the circuit board;

[0067] (3) Turn on the hot press, place the circuit board with the three-layer composite material in the hot press, and press it with a series of objects such as metal plates that will not damage the hot press and have a flat surface and a certain weight. Set the hot press at 130° C. for 15 minutes to perform hot pressing, and take it out after the hot pressing is completed;

[0068] (4) Mount the cleaned photovoltaic cell on the three-layer composite material structure of the circuit board and laminate and encapsulate it. POE film and ETFE film are laid on the upper surface of the flexible photovoltaic cell in sequence, and they are put into a laminator for lamination: lamination is carried out at a temperature of 150°C, a pressure of 1.5MPa, and a time of 1h. After lamination, it is taken out to obtain a flexible photovoltaic power generation module.

[0069] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for integrating a photovoltaic cell with a circuit board, characterized in that: The following steps are involved: (1) Ultrasonic cleaning of photovoltaic cells and circuit boards for more than 5 minutes to remove grease and dust; (2) Preparation of three-layer composite material-circuit board: The three-layer composite material structure is metal foil, POE film and metal foil from bottom to top. The POE film is in the shape of a long strip. At least one pair of metal foils is arranged alternately in the length direction of the POE film. Each pair of metal foils passes through the POE film and is connected to each other. The outer edges of the metal foils are located inside the POE film. The cleaned circuit board is taken out, and the three-layer composite material is placed on a circuit board of the same size as the POE film. The hot press is turned on, and the circuit board with the three-layer composite material is placed in the hot press. After the hot pressing is completed, it is taken out; (3) The lower surfaces of the cleaned photovoltaic cells are mounted on the metal foil on the three-layer composite material structure of the three-layer composite material-circuit board, and POE film and ETFE film are laid on the upper surface of the photovoltaic cells in sequence, and they are put into a laminator for lamination to obtain a photovoltaic power generation module.

2. The method for integrating a photovoltaic cell with a circuit board according to claim 1, characterized in that: In step (2), hot pressing is performed at 100° C.-150° C. for 10 min-20 min.

3. The method for integrating a photovoltaic cell with a circuit board according to claim 1, characterized in that: In step (3), lamination is performed at a temperature of 130-150° C., a pressure of 1-1.5 MPa, and a time of 0.5-1 h.

4. The method for integrating photovoltaic cells and circuit boards according to claim 1, characterized in that: In step (2), the metal foil in the three-layer composite material structure has a thickness of 1-100 microns and a length of 1-50 millimeters; the POE film has a thickness of 1-100 microns and a length and width of 1-100 millimeters.

5. The method for integrating and connecting a photovoltaic cell with a circuit board according to claim 1, characterized in that: The circuit board is a flexible circuit board, using an FPC circuit board with a temperature resistance of more than 240°C; the photovoltaic cell is a flexible photovoltaic cell, including flexible and bendable III-V photovoltaic cells, ultra-thin silicon solar cells, copper indium gallium selenide solar cells, and perovskite solar cells, with a cell area of ​​1mm 2 -60cm 2 .

6. The method for integrating a photovoltaic cell with a circuit board according to claim 2, characterized in that: In step (2), an object having a flat surface and a certain weight which does not damage the heat press is used for pressing.

7. The method for integrating and connecting a photovoltaic cell with a circuit board according to claim 1, characterized in that: Each pair of metal foils is connected to each other through the POE film to form a "[" shape.

8. The method for integrating a photovoltaic cell with a circuit board according to claim 1, characterized in that: The metal foil is a conductive metal such as copper, aluminum, silver, gold, or an alloy metal.

9. A photovoltaic power generation module prepared by the method according to any one of claims 1 to 7.

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