Welding fixture for integrated circuit chip production

Abstract

The invention provides a welding clamp for integrated circuit chip production, and belongs to the field of integrated circuit chip processing, the welding clamp comprises a base, an adjusting assembly is mounted on the base, a supporting plate is mounted on the adjusting assembly, and a chip body is mounted on the supporting plate; a clamping assembly; the clamping assembly comprises a sliding cavity formed in the supporting plate, the inner wall of the sliding cavity is rotationally connected with a two-way screw rod, and two sliding blocks are slidably connected into the sliding cavity. The two side walls of a chip body are clamped through the two connecting frames, the stability of the chip body is improved, welding work of a user is facilitated, the chip bodies of different sizes can be clamped, the practicability of the device is improved, the chip bodies can be pressed through a pressing rod, the stability of the chip bodies is further improved, and the chip bodies can be conveniently welded. And meanwhile, the buffer assembly can prevent the chip body from being damaged due to excessive stress after the pressing rod is in contact with the chip body.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit chip processing, and in particular to a welding fixture for producing integrated circuit chips. Background Art

[0002] In the production process of integrated circuit chips, bare chips need to be welded to a carrier. In this process, the industry mainly uses eutectic welding technology to weld bare chips: the carrier that carries the bare chip is mainly a molybdenum copper sheet or a tungsten copper sheet. The operator first applies eutectic solder paste to the carrier, and then places the bare chip on the solder paste to complete the welding process.

[0003] In the existing technology, operators usually place the carrier directly on the heating table. Due to the lack of a clamping device to fix the carrier, the operator cannot fix the carrier for eutectic welding, making it difficult to ensure the product yield. If too much force is used during the welding process, the welding wire may poke the integrated circuit chip and cause it to move, affecting the subsequent production quality and efficiency. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a welding fixture for producing integrated circuit chips.

[0005] An embodiment of the present invention provides a welding fixture for producing integrated circuit chips, comprising:

[0006] A base, on which an adjustment component is installed, on which a support plate is installed, and on which a chip body is installed;

[0007] The two wheels are connected in a direction of rotation with a plurality of rotating shafts, and the two rotating shafts are connected in a direction of rotation with a plurality of rotating shafts.

[0008] Furthermore, the pressing assembly includes a fixing plate, the fixing plate is fixedly connected to the upper end surface of the connecting frame, the connecting frame is provided with a working cavity, the side wall of the supporting frame is rotatably connected to the first bevel gear, the first bevel gear is fixedly connected to the rotating gear, the lower end surface of the connecting frame is rotatably connected to the second bevel gear, the first bevel gear and the second bevel gear are meshed with each other, the fixing plate is provided with two lifting grooves, the two lifting grooves are slidably connected with lifting blocks, a connecting plate is fixedly connected between the two lifting blocks, the connecting plate is provided with two sliding grooves, the two sliding grooves are provided with buffer assemblies, and the two buffer assemblies A pressing rod is installed on each punch assembly, and two one-way screws are rotatably penetrated on the connecting frame, and the two one-way screws are rotatably connected to the inner wall of the working chamber, and the two one-way screws are rotatably penetrated through the fixed plate, and the two one-way screws are respectively rotatably connected to the inner walls of the two lifting grooves, and the two one-way screws are respectively threaded through the two lifting blocks, and the second bevel gear is fixedly connected to one of the one-way screws, and the side walls of the two one-way screws are fixedly connected to the first sprocket, and the two first sprockets are driven by the first chain, and the side wall of the support plate is rotatably penetrated by a second handle, and one end of the second handle is fixedly connected to the spline shaft.

[0009] Furthermore, the buffer assembly includes a buffer spring fixedly connected to the inner wall of the sliding groove, the pressing rod is fixedly connected to the buffer spring, the inner wall of the sliding groove is provided with two limit grooves, the side wall of the pressing rod is fixedly connected with two limit blocks, and the two limit blocks are respectively slidably connected in the two limit grooves.

[0010] Furthermore, the adjusting assembly includes a group of fixed cylinders fixedly connected to the upper end surface of the base, a group of the fixed cylinders are slidably connected with sliding columns, a rotating cavity is opened in the base, a supporting cylinder is fixedly connected to the upper end surface of the base, an adjusting column is slidably connected in the supporting cylinder, a threaded rod is rotatably penetrated through the base, one end of the threaded rod is rotatably connected to the inner wall of the rotating cavity, one end of the threaded rod is rotatably penetrated through the fixed cylinder, the threaded rod is threadedly connected to the adjusting column, the rotating cavity and the side wall of the threaded rod are rotatably connected with a second sprocket, the two second sprockets are driven by a second chain, a group of the sliding columns and the adjusting columns are fixedly connected to the support plate, a third handle is rotatably penetrated through the base, and one end of the third handle is fixedly connected to one of the second sprockets.

[0011] Furthermore, the first handle, the second handle and the third handle are all provided with an anti-slip pad layer.

[0012] Furthermore, the lower end surface of the base is provided with anti-slip textures.

[0013] Furthermore, a buffer layer is provided on an end surface of the pressing rod close to the base.

[0014] Furthermore, the inner wall of the connecting frame is provided with anti-slip patterns.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The user places the chip body on the support plate, and then rotates the first handle to rotate the bidirectional screw, and the sliding blocks are close in the sliding cavity, so that the two connecting frames clamp the two side walls of the chip body, which improves the stability of the chip body, facilitates the user to perform welding work, and can clamp chip bodies of different sizes, thereby improving the practicality of the device.

[0017] 2. After the connecting frame clamps the chip body, the user turns the second handle to make the spline shaft start to rotate, and then the one-way screw starts to rotate, and the lifting block descends in the lifting slot, causing the pressing rod to descend, and the pressing rod can press the chip body, further improving the stability of the chip body and the quality of welding work.

[0018] 3. When the pressing rod contacts the chip body, the buffer spring contracts, causing the pressing rod to slowly contact the chip body, preventing the pressing rod from directly contacting the chip body and preventing the chip body from being damaged by excessive force after the pressing rod contacts the chip body.

[0019] 4. When the user rotates the third handle, the threaded rod starts to rotate, so that the adjustment column can be raised and lowered in the support tube, thereby realizing the lifting and lowering of the support plate, which is convenient for the user to adjust the height of the support plate according to his own operating habits, thereby improving the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic structural stereoscopic diagram of a welding fixture for producing integrated circuit chips according to an embodiment of the present invention.

[0021] Figure 2 It is a three-dimensional cross-sectional view of the sliding cavity structure of a welding fixture for producing integrated circuit chips described in an embodiment of the present invention.

[0022] Figure 3 It is a three-dimensional cross-sectional view of the working chamber structure of a welding fixture for producing integrated circuit chips described in an embodiment of the present invention.

[0023] Figure 4 It is a three-dimensional cross-sectional view of the sliding groove structure of a welding fixture for producing integrated circuit chips described in an embodiment of the present invention.

[0024] Figure 5 It is a three-dimensional cross-sectional view of the rotating cavity structure of a welding fixture for producing integrated circuit chips described in an embodiment of the present invention.

[0025] Figure 6 for Figure 3A magnified view of the structure in the middle.

[0026] In the above drawings: 1 base, 2 support plate, 3 chip body, 4 sliding cavity, 5 bidirectional screw, 6 sliding block, 7 sliding port, 8 spline shaft, 9 support frame, 10 rotating gear, 11 connecting frame, 12 fixed plate, 13 working cavity, 14 first bevel gear, 15 second bevel gear, 16 lifting groove, 17 lifting block, 18 connecting plate, 19 sliding groove, 20 pressing rod, 21 one-way screw, 22 first sprocket, 23 first chain, 24 buffer spring, 25 limit groove, 26 limit block, 27 fixed cylinder, 28 rotating cavity, 29 adjusting column, 30 threaded rod, 31 second sprocket, 32 second chain. DETAILED DESCRIPTION

[0027] The technical solution of the present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0028] like Figure 1-Figure 6 As shown, the embodiment of the present invention provides a welding fixture for integrated circuit chip production, comprising:

[0029] Base 1, the lower end surface of the base 1 is provided with anti-slip lines, which improves the stability of the device, an adjustment component is installed on the base 1, a support plate 2 is installed on the adjustment component, and a chip body 3 is installed on the support plate 2. The chip body 3 is a prior art and will not be described here;

[0030] The clamping assembly comprises a sliding cavity 4 opened on the support plate 2, the inner wall of the sliding cavity 4 is rotatably connected with a bidirectional screw 5, two sliding blocks 6 are slidably connected in the sliding cavity 4, the bidirectional screw 5 threadedly penetrates the two sliding blocks 6, a sliding opening 7 is opened on the inner wall of the sliding cavity 4 on the side away from the base 1, a spline shaft 8 is rotatably connected to the inner wall of the sliding cavity 4, the side walls of the two sliding blocks 6 are fixedly connected with a support frame 9, the two support frames 9 are rotatably connected with a rotating gear 10, the two rotating gears 10 are meshed with the spline shaft 8, the upper end surfaces of the two sliding blocks 6 are fixedly connected with a connecting frame 11, the two connecting frames 11 slide in one of the sliding openings 7, the side wall of the support plate 2 is rotatably penetrated with a first grip, the first grip is fixedly connected to the bidirectional screw 5, and a pressing assembly is installed on the two connecting frames 11, and the inner wall of the connecting frame 11 is provided with an anti-slip pattern, which improves the friction between the connecting frame 11 and the chip body 3 and improves the stability of the chip body 3;

[0031] The pressing assembly includes a fixed plate 12, which is fixedly connected to the upper end surface of the connecting frame 11, and a working chamber 13 is opened on the connecting frame 11. The side wall of the support frame 9 is rotatably connected to the first bevel gear 14, and the first bevel gear 14 is fixedly connected to the rotating gear 10. The lower end surface of the connecting frame 11 is rotatably connected to the second bevel gear 15, and the first bevel gear 14 and the second bevel gear 15 are meshed with each other. Two lifting grooves 16 are opened on the fixed plate 12, and lifting blocks 17 are slidably connected in the two lifting grooves 16. A connecting plate 18 is fixedly connected between the two lifting blocks 17. The connecting plate 18 has two sliding grooves 19, and buffer components are installed in the two sliding grooves 19. The two buffer components A pressing rod 20 is installed on each of the components. Two one-way screws 21 are rotatably penetrated on the connecting frame 11. The two one-way screws 21 are rotatably connected to the inner wall of the working chamber 13. The two one-way screws 21 are rotatably penetrated by the fixing plate 12. The two one-way screws 21 are rotatably connected to the inner walls of the two lifting grooves 16 respectively. The two one-way screws 21 are threadedly penetrated by the two lifting blocks 17 respectively. The second bevel gear 15 is fixedly connected to one of the one-way screws 21. The side walls of the two one-way screws 21 are fixedly connected to the first sprockets 22. The two first sprockets 22 are driven by the first chain 23. The side wall of the support plate 2 is rotatably penetrated by a second grip, and one end of the second grip is fixedly connected to the spline shaft 8.

[0032] The buffer assembly includes a buffer spring 24 fixedly connected to the inner wall of the sliding groove 19, the pressing rod 20 is fixedly connected to the buffer spring 24, the inner wall of the sliding groove 19 is provided with two limit grooves 25, the side wall of the pressing rod 20 is fixedly connected with two limit blocks 26, the two limit blocks 26 are respectively slidably connected in the two limit grooves 25, and a buffer cushion layer is provided on one end surface of the pressing rod 20 close to the base 1 to prevent the pressing rod 20 from crushing the chip body 3;

[0033] The adjusting assembly includes a group of fixed cylinders 27 fixedly connected to the upper end surface of the base 1, a group of sliding columns are slidably connected in the fixed cylinders 27, a rotating cavity 28 is opened in the base 1, a supporting cylinder is fixedly connected to the upper end surface of the base 1, an adjusting column 29 is slidably connected in the supporting cylinder, a threaded rod 30 is rotatably penetrated on the base 1, one end of the threaded rod 30 is rotatably connected to the inner wall of the rotating cavity 28, one end of the threaded rod 30 is rotatably penetrated through the fixed cylinder 27, the threaded rod 30 is threadedly connected to the adjusting column 29, the rotating cavity 28 and the side walls of the threaded rod 30 are rotatably connected to the second sprocket 31, the two second sprockets 31 are driven by a second chain 32, a group of sliding columns and the adjusting column 29 are fixedly connected to the supporting plate 2, a third grip is rotatably penetrated on the base 1, one end of the third grip is fixedly connected to one of the second sprockets 31, and the first grip, the second grip and the third grip are all provided with anti-slip pads, which are convenient for users to rotate the first grip, the second grip and the third grip, thereby improving the portability of the device.

[0034] The detailed working process of the present invention is as follows:

[0035] The user first places the device in the designated workplace, and then the user turns the third handle, which drives one of the second sprockets 31 to start rotating, and then under the transmission of the second chain 32, the other second sprocket 31 starts rotating, causing the threaded rod 30 to start rotating, causing the adjusting column 29 to slide in the supporting tube, and at the same time, the sliding column slides in the fixed tube 27, so that the support plate 2 can be raised and lowered, which is convenient for the user to adjust the height of the support plate 2 according to their own operating habits, thereby improving the practicality of the device. Then the user places the chip body 3 on the support plate 2, and then the user turns the first handle, which drives the bidirectional screw 5 to rotate, and the sliding block 6 can be close to each other in the sliding cavity 4, so that the two connecting frames 11 are close to each other, and the connecting frame 11 can clamp the two side walls of the chip body 3, thereby improving the stability of the chip body 3, making it convenient for the user to perform welding work, and can clamp chip bodies 3 of different sizes, thereby improving the practicality of the device. The utility model is that after the connecting frame 11 clamps the chip body 3, the user rotates the second handle to make the spline shaft 8 start to rotate, and the spline shaft 8 drives the rotating gear 10 to rotate, and then the first bevel gear 14 starts to rotate, and the second bevel gear 15 can rotate, and one of the one-way screws 21 starts to rotate, and then the first sprocket 22 starts to rotate, and then under the transmission of the first chain 23, the other first sprocket 22 starts to rotate, and the other one-way screw 21 can start to rotate, and the lifting block 17 descends in the lifting groove 16, so that the pressing rod 20 descends, and the pressing rod 20 can press the chip body 3, further improving the stability of the chip body 3 and the work quality of the welding work. When the pressing rod 20 contacts the chip body 3, the buffer spring 24 contracts, so that the pressing rod 20 slowly contacts the chip body 3, preventing the pressing rod 20 from directly contacting the chip body 3, and avoiding the chip body 3 from being damaged by excessive force after the pressing rod 20 contacts the chip body 3.

[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution of the present invention, which should be included in the scope of the claims of the present invention.

Claims

1. A welding fixture for integrated circuit chip production, characterized in that: include: A base (1), an adjustment component is mounted on the base (1), a support plate (2) is mounted on the adjustment component, and a chip body (3) is mounted on the support plate (2); The clamping assembly comprises a sliding cavity (4) opened on the support plate (2), the inner wall of the sliding cavity (4) is rotatably connected with a bidirectional screw (5), two sliding blocks (6) are slidably connected in the sliding cavity (4), the bidirectional screw (5) threads penetrate the two sliding blocks (6), a sliding opening (7) is opened on the inner wall of the sliding cavity (4) away from the base (1), the inner wall of the sliding cavity (4) is rotatably connected with a spline shaft (8), and the side walls of the two sliding blocks (6) are fixedly connected to the support The two support frames (9) are both rotatably connected with a rotating gear (10), and the two rotating gears (10) are meshed with the spline shaft (8). The upper end surfaces of the two sliding blocks (6) are both fixedly connected with a connecting frame (11), and the two connecting frames (11) slide in one of the sliding openings (7). The side wall of the support plate (2) is rotatably penetrated by a first handle, and the first handle is fixedly connected to the bidirectional screw (5). The two connecting frames (11) are both installed with a pressing assembly.

2. A welding fixture for producing integrated circuit chips according to claim 1, characterized in that: in: The pressing assembly comprises a fixing plate (12), wherein the fixing plate (12) is fixedly connected to the upper end surface of the connecting frame (11), the connecting frame (11) is provided with a working chamber (13), the side wall of the supporting frame (9) is rotatably connected to a first bevel gear (14), the first bevel gear (14) is fixedly connected to the rotating gear (10), the lower end surface of the connecting frame (11) is rotatably connected to a second bevel gear (15), the first bevel gear (14) and the second bevel gear (15) are meshed with each other, the fixing plate (12) is provided with two lifting grooves (16), the two lifting grooves (16) are both slidably connected with lifting blocks (17), a connecting plate (18) is fixedly connected between the two lifting blocks (17), the connecting plate (18) is provided with two sliding grooves (19), the two sliding grooves (19) are both provided with buffer assemblies, and the two Each of the buffer assemblies is provided with a pressing rod (20); two one-way screws (21) are rotatably penetrated on the connecting frame (11); the two one-way screws (21) are rotatably connected to the inner wall of the working chamber (13); the two one-way screws (21) are rotatably penetrated to the fixed plate (12); the two one-way screws (21) are respectively rotatably connected to the inner walls of two lifting grooves (16); the two one-way screws (21) are respectively threadedly penetrated to the two lifting blocks (17); the second bevel gear (15) is fixedly connected to one of the one-way screws (21); the side walls of the two one-way screws (21) are both fixedly connected to a first sprocket (22); the two first sprockets (22) are driven by a first chain (23); a second handle is rotatably penetrated on the side wall of the support plate (2); one end of the second handle is fixedly connected to the spline shaft (8).

3. A welding fixture for producing integrated circuit chips according to claim 2, characterized in that: in: The buffer assembly comprises a buffer spring (24) fixedly connected to the inner wall of the sliding groove (19); the pressing rod (20) is fixedly connected to the buffer spring (24); the inner wall of the sliding groove (19) is provided with two limit grooves (25); the side wall of the pressing rod (20) is fixedly connected with two limit blocks (26); the two limit blocks (26) are respectively slidably connected in the two limit grooves (25).

4. A welding fixture for producing integrated circuit chips according to claim 3, characterized in that: in: The adjustment assembly comprises a group of fixed cylinders (27) fixedly connected to the upper end surface of the base (1), a group of sliding columns are slidably connected in the fixed cylinders (27), a rotating cavity (28) is opened in the base (1), a supporting cylinder is fixedly connected to the upper end surface of the base (1), an adjusting column (29) is slidably connected in the supporting cylinder, a threaded rod (30) is rotatably penetrated on the base (1), one end of the threaded rod (30) is rotatably connected to the inner wall of the rotating cavity (28), and one end of the threaded rod (30) is rotatably connected to the inner wall of the rotating cavity (28). The end of the sliding column (29) is rotatably passed through the fixed cylinder (27), the threaded rod (30) is threadedly connected to the adjusting column (29), the rotating chamber (28) and the side wall of the threaded rod (30) are both rotatably connected to the second sprocket (31), and the two second sprockets (31) are driven by a second chain (32), a group of the sliding column and the adjusting column (29) are fixedly connected to the support plate (2), and a third handle is rotatably passed through the base (1), and one end of the third handle is fixedly connected to one of the second sprockets (31).

5. A welding fixture for producing integrated circuit chips according to claim 4, characterized in that: in: The first handle, the second handle and the third handle are all provided with anti-skid pad layers.

6. The welding fixture for producing integrated circuit chips according to claim 1, characterized in that: in: The lower end surface of the base (1) is provided with anti-slip patterns.

7. The welding fixture for producing integrated circuit chips according to claim 2, characterized in that: in: A buffer layer is provided on one end surface of the pressing rod (20) close to the base (1).

8. The welding fixture for producing integrated circuit chips according to claim 1, characterized in that: in: The inner wall of the connecting frame (11) is provided with anti-slip patterns.

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