High-speed copper conductor welding method

Abstract

The invention relates to the technical field of laser welding, in particular to a high-speed copper wire welding method. Comprising the following steps: shaping a high-speed copper wire to be welded; assembling the shaped high-speed copper conductor on a copper terminal; and the position of the blue-light semiconductor continuous laser is adjusted, so that emitted blue-light laser is focused to the joint of the high-speed copper wire and the copper terminal, and the copper wire and the copper terminal are welded. The high-speed copper wire welding mode is simple, the blue laser is adopted for welding the high-speed copper wire, the absorptivity and the welding effect of the laser welding copper wire can be improved, many problems existing in existing laser welding copper wires are solved, and the high-speed copper wire welding method has great popularization value.

Description

Technical Field

[0001] The invention relates to the technical field of laser welding, in particular to a high-speed copper wire welding method. Background Art

[0002] DAC high-speed cable (DAC for short) is a high-performance connection solution that uses copper wire materials and high-speed signal transmission technology. It is mainly used to connect ports between devices such as data center equipment, servers and network switches, providing high-speed, low-latency data transmission. It has the characteristics of low power consumption, easy installation and maintenance. DAC consists of two copper wire plugs, high-speed signal transmission circuits and external insulating shells. Connectors are bridges of communication in electronic circuits and are widely used in different fields including data communications, computers and peripherals, consumer electronics, automobiles, industry, medical, aerospace and military. A high-speed connector is a connector designed for transmitting high-frequency, high-speed data and signals. It is usually used to connect different electronic devices, modules or circuit boards to ensure reliable signal transmission.

[0003] DAC is a cable assembly with fixed connectors at both ends, which is widely used in local area networks, data centers and high-performance computer connections. DAC has become the most cost-effective high-speed interconnection solution by using copper cables instead of photoelectric conversion modules. In addition, the low power consumption of DAC copper cables means that no additional power consumption is required; finally, compared with optical cables, copper cables are cheaper, which is 2 to 5 times the cost of optical cables of the same length. These characteristics together have created a unique position for DAC direct-connect copper cables in today's high-speed interconnection solutions.

[0004] The biggest advantage of copper is its high electrical and thermal conductivity, which is also the biggest challenge of welding. The thermal conductivity of copper is ten times higher than that of common steel, requiring very strong energy input. Welding can be performed by laser, which can contribute high energy intensity in the interaction area. However, there are certain problems with laser welding. Generally, materials with high conductivity have high reflectivity. After the laser transfers energy to the workpiece by light conduction, the material with high reflectivity will emit most of the laser, resulting in a decrease in welding quality. More importantly, the lasers currently used in laser welding are all in the near-infrared spectrum. Reflective metals and most transparent materials can only absorb a small part of the infrared laser, which has led to great adjustments in the laser welding of such materials.

[0005] Research has found that, at present, only about 5% of the laser energy can be used to heat the materials in the copper welding process. The utilization rate of laser energy is very low. Moreover, since the material is heated from room temperature, the temperature rise range is very large, so high-power laser output equipment is required. Furthermore, the copper surface at room temperature will reflect almost all the laser light, and the reflected laser light will cause damage to the surrounding electronic components. In addition, since the copper material to be welded needs to be heated up sharply, if thermal conduction welding is used, it may cause the material to be overheated and damaged. The surface tension and viscosity of the copper material are very unstable, and the welding pool is very unstable. Therefore, laser welding of copper materials is prone to many welding defects, which seriously affects the welding quality and welding efficiency. Summary of the invention

[0006] The purpose of this application is to solve the shortcomings of the above-mentioned background technology and provide a high-speed copper wire welding method.

[0007] The technical solution of the present application is: a high-speed copper wire welding method, comprising the following steps:

[0008] To shape the high-speed copper wire to be welded;

[0009] Assembling the shaped high-speed copper conductor onto the copper terminal;

[0010] The position of the blue light semiconductor continuous laser is adjusted so that the emitted blue light laser is focused on the connection between the high-speed copper wire and the copper terminal, and the copper wire and the copper terminal are welded.

[0011] According to a high-speed copper wire welding method provided in the present application, the method for shaping the high-speed copper wire to be welded includes: placing the high-speed copper wire into a jig, and using the jig to process the side of the high-speed copper wire close to the end, so that the side of the high-speed copper wire close to the end forms a plane that can fit tightly with the copper terminal.

[0012] According to a high-speed copper wire welding method provided in the present application, the jig includes an upper shaping block and a lower shaping block located directly below the upper shaping block; the upper end surface of the lower shaping block is provided with a fixing groove for placing the high-speed copper wire; the lower end surface of the upper shaping block is provided with a shaping protrusion corresponding to the lower fixing groove; the shaping protrusion is a vertical protrusion structure with a flat lower end surface.

[0013] According to a high-speed copper wire welding method provided in the present application, the upper end surface of the lower shaping block is provided with a plurality of fixing grooves arranged at intervals along the lateral direction; the lower end surface of the upper shaping block is provided with a plurality of shaping protrusions arranged at intervals along the lateral direction corresponding to the lower fixing grooves.

[0014] According to a high-speed copper wire welding method provided in the present application, the method of assembling the shaped high-speed copper wire onto the copper terminal includes: bonding the plane of the high-speed copper wire processed by the jig to the copper terminal, and then installing the bonded high-speed copper wire and copper terminal onto a two-dimensional platform that can move horizontally.

[0015] According to a high-speed copper wire welding method provided by the present application, the method for adjusting the position of a blue light semiconductor continuous laser includes: installing the blue light semiconductor continuous laser on a vertically adjustable lifting platform, debugging the blue light semiconductor continuous laser, adjusting the positive defocus of the laser focus to 0.2mm~1mm, and adjusting the spot of the laser focus to 30μm~90μm.

[0016] According to a high-speed copper wire welding method provided by the present application, the power of the blue light semiconductor continuous laser is 100W to 500W, the collimation of the laser focusing head is 50mm to 150mm, and the laser focal length is 50mm to 150mm.

[0017] According to a high-speed copper wire welding method provided by the present application, the method of focusing the emitted blue light laser to the connection between the high-speed copper wire and the copper terminal includes: adjusting the blue light semiconductor continuous laser so that its emission power is 30W to 280W and the laser pulse width is 1ns to 100ns, so that the emitted laser acts on the connection between the high-speed copper wire and the copper terminal.

[0018] According to a high-speed copper wire welding method provided in the present application, a two-dimensional platform is used to adjust the position where the high-speed copper wire and the copper terminal are to be welded to be aligned with the laser focal point.

[0019] According to a high-speed copper wire welding method provided in the present application, the method for welding the copper wire and the copper terminal includes: a blue light semiconductor continuous laser emits laser to perform a welding operation on the high-speed copper wire and the copper terminal, and during the laser emission process, the two-dimensional platform remains stationary.

[0020] The advantages of the present application are as follows: 1. The present application is used for welding high-speed copper wires and copper terminals. The present application adopts blue laser for welding. The blue laser has less reflection on the welding of high-speed copper wires, and can better affect the welding operation of high-speed copper wires. The high-speed copper wires have a very high absorption rate of blue lasers, and the welding effect is greatly improved, and spatter-free welding of high-speed copper wires can be achieved. In the thermal conduction welding mode, uniform copper wires and small copper parts with a thickness of 0.3 mm can be repeatedly welded; and the present application shapes the copper wires and adjusts their welding structure, which can form a better welding effect;

[0021] 2. The shaping operation of the high-speed copper wire in the present application is very simple. By constructing a special jig and using the jig to compress and shape the high-speed copper wire, a plane can be formed at the connection between the high-speed copper wire and the copper terminal, thereby increasing the contact area at the connection between the high-speed copper wire and the copper terminal, and facilitating subsequent welding operations;

[0022] 3. The shaping fixture of the present application has a relatively simple structure, and can stably place the high-speed copper wire into the fixed groove, restrict the high-speed copper wire through the fixed groove, and form a plane on the high-speed copper wire through the shaping protrusion. The structure is simple and the shaping operation is very easy;

[0023] 4. The present application sets a plurality of shaping protrusions and fixing grooves on the jig, and the jig can perform one-time shaping according to the structure of the high-speed copper wire to be welded and the copper terminal, and can shape multiple high-speed copper wires at one time, greatly improving the shaping efficiency;

[0024] 5. This application greatly increases the contact area between the high-speed copper wire and the copper terminal by attaching the high-speed copper wire shaping plane to the copper terminal, which is convenient for subsequent welding and greatly improves the welding effect between the high-speed copper wire and the copper terminal. The high-speed copper wire and the copper terminal are placed on a two-dimensional platform, and the welding position can be adjusted by moving the two-dimensional platform, which is extremely convenient to operate.

[0025] 6. This application will debug the blue light semiconductor continuous laser before laser welding to ensure that the emitted blue light laser can weld the high-speed copper wire well. At the same time, considering the rapid temperature rise of the high-speed copper wire after absorbing the blue light laser, this application sets the positive defocus of the focusing focus to 0.2mm~1mm, which avoids the problem of high-temperature melting of the high-speed copper wire when it is directly at the laser focus point, so that the high-speed copper wire is welded in a suitable state, which improves the welding effect;

[0026] 7. The blue light semiconductor continuous laser selected in this application can be well applied to the welding operation of high-speed copper wires and copper terminals. The blue light semiconductor continuous laser is easy to obtain, and through a large number of experiments, the corresponding control parameters are obtained, which can be conveniently applied to the welding operation of the high-speed copper wire;

[0027] 8. This application sets parameters for the welding operation of high-speed copper wires. Through a large number of parameter summaries and analyses, the optimal parameters of the blue laser for welding high-speed copper wires are obtained. The blue laser described in this application can efficiently weld high-speed copper wires, ensuring excellent welding results.

[0028] 9. The present application adjusts the high-speed copper wire and the copper terminal in a plane by adjusting the two-dimensional platform, ensuring that the positions of the high-speed copper wire and the copper terminal to be welded are accurately aligned with the laser focusing head, avoiding the focusing error caused by moving the already adjusted focusing head again, and avoiding the problems of complex structure and difficulty in adjusting the laser focusing head;

[0029] 10. The present application maintains a stable and stationary state of the two-dimensional platform during the laser emission process to ensure that the laser can accurately weld the copper wires and copper terminals below. The present application adopts a single-point welding method, which is simple to operate and avoids the problem of complex laser structure caused by the need to adjust the laser focusing head, thereby reducing the complexity of the entire laser welding equipment.

[0030] The high-speed copper wire welding method of the present application is simple, and the blue light laser is used to weld the high-speed copper wire, which can improve the absorption rate and welding effect of the laser-welded copper wire, solves many problems existing in the existing laser-welded copper wire, and has great promotion value. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 : Schematic diagram of the fixture structure of this application;

[0032] Figure 2 : A schematic diagram of the structure of the high-speed copper wire after shaping of the present application;

[0033] Figure 3 : Schematic diagram of the connection between the high-speed copper wire and the copper terminal of the present application;

[0034] Figure 4 : Schematic diagram of the high-speed copper wire welding process of this application.

[0035] Among them: 1—upper shaping block; 2—lower shaping block; 3—stamping cylinder; 4—high-speed copper wire; 5—copper terminal. DETAILED DESCRIPTION

[0036] The embodiments of the present application are described in detail below, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0037] In the description of the present application, it should be understood that the terms "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] The present application is further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0040] The present application relates to a high-speed copper wire welding method. The present application is to weld the end of the high-speed copper wire to the copper terminal of the connector. Compared with the traditional infrared laser welding method, the present application adopts a blue laser for welding. The reflectivity of the high-speed copper wire to the infrared laser is higher, resulting in poor welding effect on the high-speed copper wire. The reflectivity of the high-speed copper wire to the blue laser is lower, and the absorption rate of the high-speed copper wire to the blue laser (wavelength of 455nm) is 45% to 55%. The absorption rate is higher and can achieve a good absorption effect. The high-speed copper wire can achieve a good welding effect under the action of the blue laser. In the blue laser welding process of the present application, the blue laser can be easily absorbed by the high-speed copper wire. After the high-speed copper wire of the present application is shaped, the blue laser welding can easily form a spatter-free solder joint conduction welding. At the same time, the continuous fiber blue laser can easily achieve precise control of the laser radiation energy by controlling the pulse width and laser power. In addition, due to the good absorption of blue laser by high-speed copper wire, uniform copper wire can be repeatedly welded in thermal conduction welding mode, and small copper parts with a thickness of up to 0.3mm can be efficiently welded. The use of blue laser beam welding can keep the process temperature constant between the melting and evaporation temperatures, and the welding effect has been greatly improved. Due to the stability and high absorption of the blue laser welding process, the blue wavelength can achieve high feed rates, thereby reducing heat loss caused by heat conduction and thermal expansion.

[0041] Specifically, a high-speed copper wire welding method of the present application is as follows: Figure 4 As shown, the following steps are included:

[0042] S1, shaping the high-speed copper wire 4 to be welded;

[0043] Since the high-speed copper wire 4 is a cylindrical structure, if the high-speed copper wire 4 is directly welded to the copper terminal 5 of the connector, the contact area between the high-speed copper wire 4 and the copper terminal 5 is very small (the high-speed copper wire 4 is a cylindrical structure, and directly contacts the copper terminal 5, and the contact position between the two is a line), which will lead to poor subsequent welding effect. By shaping the high-speed copper wire 4, the problem of too small contact area can be solved;

[0044] S2, assembling the shaped high-speed copper wire 4 onto the copper terminal 5;

[0045] The shaped high-speed copper wire 4 and the copper terminal 5 are assembled and bonded together to facilitate subsequent welding operations;

[0046] S3, adjusting the position of the blue light semiconductor continuous laser to focus the emitted blue light laser on the connection between the high-speed copper wire 4 and the copper terminal 5, and welding the high-speed copper wire 4 and the copper terminal 5;

[0047] The high-speed copper wire 4 has a good absorption rate for blue laser. After the blue laser acts on the high-speed copper wire 4, the high-speed copper wire 4 can be quickly heated up, so as to achieve the purpose of quickly welding the high-speed copper wire 4 to the copper terminal 5 of the connector.

[0048] In some embodiments of the present application, this embodiment optimizes the above step S1. Specifically, Figures 1 to 3 As shown, the jig for shaping the high-speed copper wire 4 in this embodiment, the jig in this embodiment includes an upper shaping block 1 and a lower shaping block 2 located directly below the upper shaping block 1, the upper end surface of the lower shaping block 2 is provided with a fixing groove for placing the high-speed copper wire 4, the lower end surface of the upper shaping block 1 is provided with a shaping protrusion corresponding to the lower fixing groove, and the shaping protrusion is a vertical protrusion structure with a flat lower end surface. A stamping cylinder 3 is installed at the upper end of the upper shaping block 1, and the stamping cylinder 3 drives the upper shaping block 1 to move vertically to stamp the high-speed copper wire 4 placed in the fixing groove below, thereby achieving the purpose of shaping the high-speed copper wire 4.

[0049] The specific shaping method is to place one end of the strip-shaped high-speed copper wire 4 to be welded into the fixed groove. The fixed groove of this embodiment is an arc-shaped groove structure. After the high-speed copper wire 4 is placed in the fixed groove, the lower half of the circumferential outer side surface of the end of the high-speed copper wire 4 to be welded is tightly fitted with the fixed groove; the stamping cylinder 3 drives the upper shaping block 1 to press down, and the upper shaping block 1 moves down until the lower end surface of the shaping protrusion of the upper shaping block 1 abuts against the upper half of the circumferential outer side surface of the end of the high-speed copper wire 4 to be welded. The stamping cylinder 3 continues to stamp downward, and the shaping protrusion squeezes the high-speed copper wire 4 downward. Since the material of the high-speed copper wire 4 itself is relatively soft, it can be deformed under the restriction of the shaping protrusion and the fixed groove under the stamping of the stamping cylinder 3. The upper end surface of the part of the high-speed copper wire 4 placed in the fixed groove is stamped into a plane that is completely fitted with the shaping protrusion; after the stamping is completed, the stamping cylinder 3 is lifted to take out the stamped high-speed copper wire 4 from the fixed groove.

[0050] After the high-speed copper wire 4 of this embodiment is shaped, the outer side of the circumference of the end portion to be welded is a plane, and the plane is the part in contact with the copper terminal 5. After the high-speed copper wire 4 is shaped, the cross-section of the end portion to be welded is a structure with a plane on one side and an arc on the other side, or a trapezoidal structure, which is mainly formed according to the structure of the fixing groove, as long as there is a plane in contact with the copper terminal 5.

[0051] In actual application, there are many copper terminals 5 on a connector, and there may be many high-speed copper wires 4 that need to be shaped at one time. In order to improve the efficiency of shaping, the upper end face of the lower shaping block 2 is provided with a plurality of fixing grooves arranged at intervals along the lateral direction, and the lower end face of the upper shaping block 1 is provided with a plurality of shaping protrusions arranged at intervals along the lateral direction corresponding to the lower fixing grooves. In this way, multiple high-speed copper wires 4 can be shaped at one time, and multiple high-speed copper wires 4 can be placed into the corresponding fixing grooves of the lower shaping block 2 at one time, and then multiple high-speed copper wires 4 can be stamped and formed at one time.

[0052] In some other embodiments of the present application, this embodiment optimizes the above-mentioned step S2. After the high-speed copper wire 4 is shaped, it is necessary to assemble the shaped high-speed copper wire 4 onto the copper terminal 5. In this embodiment, the plane of the high-speed copper wire 4 processed by the jig is bonded to the copper terminal 5, and then the bonded high-speed copper wire 4 and copper terminal 5 are installed on a two-dimensional platform that can be moved horizontally.

[0053] After the shaping is completed, the side of the end of the high-speed copper wire 4 to be welded has a plane, which is fitted together with the copper terminal 5. The shaped plane increases the contact area between the high-speed copper wire 4 and the copper terminal 5, which can improve the efficiency of heat conduction and the tightness of the welding connection during subsequent welding.

[0054] The high-speed copper wire 4 and the copper terminal 5 are tightly fitted together and then transferred to the two-dimensional platform. The two-dimensional platform is a loading platform for the high-speed copper wire 4 and the copper terminal 5. The high-speed copper wire 4 and the copper terminal 5 placed on the two-dimensional platform can be adjusted horizontally through the two-dimensional platform, so that the high-speed copper wire 4 and the copper terminal 5 can be conveniently adjusted to align with the laser focusing head.

[0055] In a further embodiment of the present application, this embodiment optimizes the above-mentioned step S3. Specifically, this embodiment will debug the laser after the high-speed copper wire 4 and the copper terminal 5 are assembled on the two-dimensional platform. This embodiment adopts a blue light semiconductor continuous laser. The blue light semiconductor continuous laser is installed on a lifting platform. The lifting platform is vertically adjustable. The horizontal directions are set to X and Y directions, and the vertical direction is set to Z direction. The two-dimensional platform of this embodiment can be adjusted in X and Y directions, and the lifting platform of this embodiment can be adjusted in Z direction. The blue light semiconductor continuous laser can be adjusted in Z direction through the lifting platform. The blue light semiconductor continuous laser of this embodiment can only be adjusted vertically.

[0056] The power of the blue semiconductor continuous laser of this embodiment is 100W to 500W, the collimation of the laser focusing head is 50mm to 150mm, and the laser focal length is 50mm to 150mm. During debugging, by adjusting the two-dimensional platform and the lifting platform to test that when the laser is the strongest, the position with the smallest light spot is the focus. The focus is the position with the largest energy on the laser beam. If the focus position is directly aligned with the high-speed copper wire 4, it may cause the high-speed copper wire 4 to burn (the huge energy of the laser is concentrated on the high-speed copper wire 4 in a short time, and the high-speed copper wire 4 heats up rapidly, which may cause damage to the high-speed copper wire 4). In order to avoid this situation, during the debugging process of this embodiment, the positive defocus of the laser focus is adjusted to 0.2mm to 1mm, that is, the focus of this embodiment is 0.2mm to 1mm directly above the high-speed copper wire 4 to be welded, and the spot of the laser focus is adjusted to 30μm to 90μm.

[0057] After debugging is completed, the high-speed copper wire 4 can be formally welded. According to the processing position coordinates of the high-speed copper wire 4 and the copper terminal 5 in the welding software, the parameters of the blue light semiconductor continuous laser are set, and the blue light semiconductor continuous laser is adjusted to have an emission power of 30W to 280W and a laser pulse width of 1ns to 100ns.

[0058] The blue light semiconductor continuous laser is triggered to emit laser, so that the emitted laser acts on the connection between the high-speed copper wire 4 and the copper terminal 5. Under the action of blue light laser radiation, the small size and high power density spot size control of the blue light semiconductor continuous laser focusing head can avoid laser fluctuations during the welding process, effectively suppress the formation of welding spatter and voids, and ensure the stability of welding quality.

[0059] After welding is completed, the laser is turned off, and the welding point between the high-speed copper wire 4 and the copper terminal 5 is cooled to form a solder joint. During the laser emission process, the two-dimensional platform remains stationary. There is no spatter on the surface of the solder joint, and the size of the solder joint is consistent.

[0060] If there are multiple solder joints on the high-speed copper wire 4 and the copper terminal 5, the two-dimensional platform can be adjusted to move the high-speed copper wire 4 and the copper terminal 5 to be soldered to align with the focusing head, and then the laser can be triggered again to solder the next solder joint.

[0061] During the laser emission process, the two-dimensional platform remains stationary.

[0062] During actual operation, the high-speed copper wire 4 is shaped by a jig, and one end of the strip-shaped high-speed copper wire 4 to be welded is placed in the fixed groove. After the high-speed copper wire 4 is placed in the fixed groove, the lower half of the circumferential outer side surface of the end of the high-speed copper wire 4 to be welded is tightly fitted with the fixed groove; the stamping cylinder 3 drives the upper shaping block 1 to press down, and the upper shaping block 1 moves down until the lower end surface of the shaping protrusion of the upper shaping block 1 abuts against the upper half of the circumferential outer side surface of the end of the high-speed copper wire 4 to be welded, and the stamping cylinder 3 continues to stamp downward, and the shaping protrusion squeezes the high-speed copper wire 4 downward. Under the stamping of the stamping cylinder 3, it can be deformed under the restriction of the shaping protrusion and the fixed groove, and the upper end surface of the part of the high-speed copper wire 4 placed in the fixed groove is stamped into a plane that is completely fitted with the shaping protrusion; after the stamping is completed, the stamping cylinder 3 is lifted, and the stamped high-speed copper wire 4 is taken out of the fixed groove; the plane of the high-speed copper wire 4 after shaping is fitted together with the copper terminal 5. , the high-speed copper wire 4 and the copper terminal 5 are tightly fitted together and then transferred to the two-dimensional platform together; by adjusting the two-dimensional platform and the lifting platform to test that when the laser is the strongest, the position with the smallest light spot is the focus, the positive defocus of the laser focus is adjusted to 0.2mm~1mm, and the light spot of the laser focus is adjusted to 30μm~90μm; set the parameters of the blue light semiconductor continuous laser, adjust the blue light semiconductor continuous laser to make its emission power 30W~280W and laser pulse width 1ns~100ns; trigger the blue light semiconductor continuous laser to emit laser, so that the emitted laser acts on the connection between the high-speed copper wire 4 and the copper terminal 5; after the welding is completed, turn off the laser, and the welding point of the high-speed copper wire 4 and the copper terminal 5 is cooled to form a weld, and the two-dimensional platform remains stationary during the laser emission process; if there are multiple welds or welding coordinates, follow the above process to operate one by one until all the welds are completed.

[0063] The above shows and describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present application. The present application may have various changes and improvements without departing from the spirit and scope of the present application, and these changes and improvements fall within the scope of the present application to be protected. The scope of protection claimed in the present application is defined by the attached claims and their equivalents.

Claims

1. A high-speed copper wire welding method, characterized in that: The following steps are involved: To shape the high-speed copper wire to be welded; Assembling the shaped high-speed copper conductor onto the copper terminal; The position of the blue light semiconductor continuous laser is adjusted so that the emitted blue light laser is focused on the connection between the high-speed copper wire and the copper terminal, and the copper wire and the copper terminal are welded.

2. A high-speed copper wire welding method as claimed in claim 1, characterized in that: The method for shaping the high-speed copper wire to be welded includes: placing the high-speed copper wire into a jig, and processing the side of the high-speed copper wire near the end by using the jig to form a plane that can be closely fitted with the copper terminal.

3. A high-speed copper wire welding method as claimed in claim 2, characterized in that: The jig comprises an upper shaping block and a lower shaping block directly below the upper shaping block; the upper end surface of the lower shaping block is provided with a fixing groove for placing a high-speed copper wire; the lower end surface of the upper shaping block is provided with a shaping protrusion corresponding to the lower fixing groove; the shaping protrusion is a vertical protrusion structure with a flat lower end surface.

4. A high-speed copper wire welding method as claimed in claim 3, characterized in that: The upper end surface of the lower shaping block is provided with a plurality of fixing grooves arranged at intervals in the transverse direction; the lower end surface of the upper shaping block is provided with a plurality of shaping protrusions arranged at intervals in the transverse direction and corresponding to the lower fixing grooves.

5. The high-speed copper wire welding method according to any one of claims 2 to 4, characterized in that: The method for assembling the shaped high-speed copper wire to the copper terminal includes: laminating the plane of the high-speed copper wire processed by the jig to the copper terminal, and then installing the laminating high-speed copper wire and copper terminal on a horizontally movable two-dimensional platform.

6. A high-speed copper wire welding method as claimed in claim 5, characterized in that: The method for adjusting the position of a blue light semiconductor continuous laser comprises: installing the blue light semiconductor continuous laser on a vertically adjustable lifting platform, debugging the blue light semiconductor continuous laser, adjusting the positive defocus of the laser focus to 0.2 mm to 1 mm, and adjusting the spot of the laser focus to 30 μm to 90 μm.

7. A high-speed copper wire welding method as claimed in claim 6, characterized in that: The power of the blue light semiconductor continuous laser is 100W-500W, the collimation of the laser focusing head is 50mm-150mm, and the laser focal length is 50mm-150mm.

8. A high-speed copper wire welding method as claimed in claim 7, characterized in that: The method for focusing the emitted blue laser to the connection between the high-speed copper wire and the copper terminal includes: adjusting the blue light semiconductor continuous laser to emit a laser with a power of 30W to 280W and a laser pulse width of 1ns to 100ns, so that the emitted laser acts on the connection between the high-speed copper wire and the copper terminal.

9. A high-speed copper wire welding method as claimed in claim 5, characterized in that: The two-dimensional platform is used to adjust the position where the high-speed copper wire and the copper terminal are to be welded and align with the laser focus point.

10. A high-speed copper wire welding method as claimed in claim 6, characterized in that: The method for welding the copper wire and the copper terminal comprises: a blue light semiconductor continuous laser emits laser to perform a welding operation on the high-speed copper wire and the copper terminal, and during the laser emission process, the two-dimensional platform remains stationary.

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