Back adhesive bonding method, back adhesive assembly and electronic equipment

Abstract

The invention provides a back adhesive bonding method, a back adhesive assembly and electronic equipment, and relates to the field of manufacturing. The back adhesive bonding method comprises the steps that a back adhesive assembly is obtained, the back adhesive assembly comprises frame type back adhesive, a first release film and a second release film, the first release film and the second release film are arranged on the first face of the frame type back adhesive, the first release film covers a first part of the frame type back adhesive, the second release film covers a second part of the frame type back adhesive, and the second part is located on the periphery of the first part; arranging the gum assembly in a jig, wherein the second surface of the frame-shaped gum is upward; adhering a cover plate to the second surface of the frame-shaped gum to form an assembly; the first surface of the frame-shaped gum faces upwards; tearing off the first release film; pasting the display screen to the first part of the frame-shaped gum; tearing off the second release film; and pasting the face shell to the second part of the frame-shaped gum. According to the scheme, the touch screen, the display screen and the face shell can be attached through one piece of gum, the utilization rate of gum materials can be increased, and the use cost of the gum is reduced.

Description

Technical Field

[0001] The present application relates to the field of manufacturing, and in particular to a back adhesive laminating method, a back adhesive assembly and an electronic device. Background Art

[0002] In the assembly of electronic devices, adhesive is usually used for the assembly of the cover plate, display screen and face shell. For example, when laminating the touch screen, display screen and face shell, two pieces of adhesive are usually required. First, the touch screen and display screen are laminated, and then the two are laminated to the face shell through another piece of adhesive. However, in the die-cutting process of each piece of adhesive material, usually only the outer adhesive frame part can be used in the laminating process, and the adhesive material in the middle part cannot be used and is treated as waste, resulting in a waste of resources and an increase in production costs.

[0003] In view of this, how to improve the utilization rate of the adhesive and reduce the cost of using the adhesive has become a technical problem that needs to be solved urgently. Summary of the invention

[0004] The present application provides a back glue laminating method, a back glue assembly and an electronic device, which can improve the utilization rate of the back glue and reduce the use cost of the back glue.

[0005] In a first aspect, a method for bonding an adhesive backing is provided, which is applied in a manufacturing process of an electronic device comprising at least a cover plate, a display screen and a face shell, the method comprising: obtaining an adhesive backing assembly, the adhesive backing assembly comprising: a frame-type adhesive backing and a first release film and a second release film arranged on a first surface of the frame-type adhesive backing, the first release film covering a first portion of the frame-type adhesive backing, the second release film covering a second portion of the frame-type adhesive backing, and the second portion being located outside the first portion; arranging the adhesive backing assembly in a jig with the second surface of the frame-type adhesive backing facing upward; pasting the cover plate to the second surface of the frame-type adhesive backing to form an assembly; turning over the assembly with the first surface of the frame-type adhesive backing facing upward; tearing off the first release film; pasting the display screen to the first portion of the frame-type adhesive backing; tearing off the second release film; pasting the face shell to the second portion of the frame-type adhesive backing.

[0006] Through the technical solution of the embodiment of the present application, a piece of frame-type adhesive can be used to achieve the bonding of the three components of the cover plate, the display screen and the face shell. By using the second side of the adhesive to bond the cover plate, and on the first side of the frame-type adhesive, a first release film covering the first part of the frame-type adhesive and a second release film covering the second part of the frame-type adhesive are provided, and they are torn off separately to achieve two releases, so that the first part of the frame-type adhesive is used to bond the display screen, and the second part of the frame-type adhesive is used to bond the face shell, and the bonding of multiple components using the same piece of adhesive is achieved. Compared with the method of using two pieces of adhesive to bond separately in the related art, the waste of the middle part of the adhesive material is reduced by half. Therefore, the technical solution of the embodiment of the present application can improve the utilization rate of the adhesive and reduce the cost of using the adhesive in the manufacturing process of electronic equipment.

[0007] In some possible implementations, the first release film is a surface-type release film, and at least one first tearing position is provided in the first release film; wherein tearing off the first release film comprises: tearing off the first release film through the at least one first tearing position.

[0008] In some possible embodiments, the second release film is a frame-type release film, and at least one corner of the second release film is extended with at least one second tear position; wherein tearing off the second release film includes: tearing off the second release film through the at least one second tear position.

[0009] In the above embodiment, the first hand-tear position and the second hand-tear position are provided to make the tearing of the first release film and the second release film more convenient and quick, thereby reducing the time required for tearing and optimizing the production process.

[0010] In some possible implementations, a positioning hole is provided on the second hand tearing position, and a positioning column is provided on the jig; wherein, the adhesive backing component is provided in the jig, including: positioning the adhesive backing component in the jig through the positioning hole and the positioning column.

[0011] In some possible implementations, the second release film is provided with at least three second hand-tear positions, and the at least three second hand-tear positions are provided at three corners of the second release film in a one-to-one correspondence.

[0012] Through the technical solutions of the above two embodiments, the positioning of the adhesive component during the adhesive bonding process can be achieved. When at least three second hand-tear positions are provided, the positioning holes on the at least three second hand-tear positions cooperate with the positioning posts of the jig to achieve three-point positioning, so that the adhesive component is accurately positioned and the bonding error caused by the adhesive position deviation is avoided.

[0013] In some possible implementations, at least one U-shaped hole is provided in the first release film to form a first hand-tear position.

[0014] In some possible implementations, a cutting line is provided between the U-shaped hole and the edge of the first release film.

[0015] The technical solution of the above embodiment simplifies the tearing process of the first release film. By setting a cutting line between the U-shaped hole and the first release film, the first release film can be broken at the cutting line during the tearing process, making the tearing process of the first release film smoother.

[0016] In some possible implementations, at least one first tearing position is located in an edge region of the first release film.

[0017] In some possible embodiments, obtaining the adhesive backing assembly includes: obtaining a first adhesive backing assembly, the first adhesive backing assembly including: a frame-type adhesive backing and a release film disposed on the first surface of the frame-type adhesive backing; cutting the release film to form an adhesive backing assembly including the first release film and the second release film.

[0018] In the technical solution of this embodiment, the obtained release film material of the adhesive backing assembly may be a first release film and a second release film that are independent of each other, or may be formed by cutting an integral part.

[0019] In some possible implementations, the adhesive assembly further includes a bottom film disposed on the second surface of the frame adhesive. Before the cover plate is adhered to the second surface of the frame adhesive to form an assembly, the adhesive bonding method further includes: tearing off the bottom film.

[0020] In the technical solution of this embodiment, the bottom film is provided to protect the frame-type adhesive from being contaminated during storage, transportation, and processing, and also to prevent the frame-type adhesive from being physically damaged by scratches, indentations, and the like.

[0021] In a second aspect, a back glue assembly is provided, including: a frame-type back glue; a first release film and a second release film, which are arranged on the first surface of the frame-type back glue, wherein the first release film covers the first part of the frame-type back glue, and the second release film covers the second part of the frame-type back glue, and the second part is located outside the first part.

[0022] In some possible implementations, the first release film is a surface-type release film, and at least one first hand-tear position is provided in the first release film.

[0023] In some possible implementations, the second release film is a frame-shaped release film, and at least one corner of the second release film is extended to be provided with at least one second hand-tear position.

[0024] In some possible implementations, a positioning hole is provided on the second hand-tearing position.

[0025] In some possible implementations, the second release film is provided with at least three second hand-tear positions, and the at least three second hand-tear positions are provided at three corners of the second release film in a one-to-one correspondence.

[0026] In some possible implementations, at least one U-shaped hole is provided in the first release film to form a first hand-tear position.

[0027] In some possible implementations, a cutting line is provided between the U-shaped hole and the edge of the first release film.

[0028] In some possible implementations, at least one first tearing position is located in an edge region of the first release film.

[0029] In some possible implementations, the adhesive backing assembly further includes: a base film disposed on the second surface of the frame-type adhesive backing.

[0030] According to a third aspect, an electronic device is provided, comprising: a frame-type adhesive backing, a cover plate, a display screen and a face shell; the outer portion of the first side of the frame-type adhesive backing is bonded to the face shell, and the inner portion of the first side of the frame-type adhesive backing is bonded to the display screen; and the second side of the frame-type adhesive backing is bonded to the cover plate.

[0031] In a fourth aspect, an electronic device is provided, comprising: a frame-type adhesive backing, a cover plate, a display screen and a surface shell; the frame-type adhesive backing is bonded to the cover plate, the display screen and the surface shell by the adhesive backing bonding method as in the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of an integrated plastic frame that has undergone a die-cutting process in the related art;

[0033] Figure 2 is a schematic diagram of an adhesive backing assembly provided in an embodiment of the present application;

[0034] Figure 3 It is a schematic diagram of a frame-type adhesive and a release film in an adhesive assembly provided in an embodiment of the present application;

[0035] Figure 4 This is a flow chart of a back adhesive laminating method provided in an embodiment of the present application;

[0036] Figure 5 It is an exploded schematic diagram of some components in an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0037] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification and appended claims of the present application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context.

[0038] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0039] The present application provides a back adhesive bonding method, a back adhesive assembly and an electronic device, wherein the electronic device includes but is not limited to a smart terminal, such as a mobile phone, a computer, a wearable device, etc. The electronic device generally includes: a display screen, a cover plate covering the display screen, and a face shell supporting the display screen and other components of the electronic device. The back adhesive in the present application can be used to bond the display screen, the cover plate and the face shell.

[0040] The technical solution in the present application will be described below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.

[0041] Figure 1 It is a schematic diagram of an integrated rubber frame that has undergone a die-cutting process in the related art.

[0042] During the assembly of electronic devices, adhesive is usually used to bond the cover, display and shell. During the bonding process, the cover and display are usually bonded first to form a cover and display assembly; then another piece of adhesive is used to bond the cover, display assembly and shell. Two pieces of adhesive are required for the entire bonding process.

[0043] In the related art adhesive die-cutting process, such as Figure 1 As shown, after die-cutting the adhesive material 110, an outer adhesive frame 120 and a middle portion 130 can be obtained. Only the outer adhesive frame 120 can be used, and the middle portion 130 cannot be used and can only be treated as waste. Therefore, in the manufacturing process of electronic equipment, the middle portions of the two adhesives are both discharged as waste, resulting in a great waste of resources, and also significantly reducing the utilization rate of the adhesive material, and increasing the use cost of the adhesive in the manufacturing process of electronic equipment.

[0044] As electronic equipment manufacturing places increasing demands on material conservation and process optimization, how to improve the utilization rate of adhesive materials and reduce the cost of adhesive during the bonding process of electronic equipment has become a key issue that needs to be addressed. Therefore, it is particularly important to propose a new adhesive bonding process to address this issue.

[0045] Figure 2 Schematic diagram of a back adhesive assembly 200 provided in an embodiment of the present application. Figure 2 As shown, the adhesive component 200 includes a release film 210 and a frame adhesive 220. The frame adhesive 220 has double-sided adhesiveness and is used in the bonding process of electronic devices.

[0046] The first surface of the frame-type adhesive backing 220 is covered with a release film 210 , the main function of which is to isolate and protect the adhesive backing and ensure that it is easy to peel off.

[0047] In some examples, the second surface of the frame-type adhesive 220 is provided with a bottom film 230 , and the first surface and the second surface are opposite surfaces.

[0048] In some embodiments, the area of ​​the bottom film 230 is much larger than the area of ​​the frame adhesive 220, and multiple frame adhesives 220 can be placed on one bottom film 230. Alternatively, in other embodiments, the area of ​​the bottom film 230 can also be equivalent to the outer edge area of ​​the frame adhesive 220. The bottom film 230 is used to provide environmental isolation for the frame adhesive 220, protect the adhesive layer from contamination during storage, transportation, and processing, and prevent the adhesive from being physically damaged by scratches, indentations, etc.

[0049] By respectively arranging the release film 210 and the bottom film 230 on both sides of the frame-type adhesive 220, it is possible to effectively avoid contamination and damage of the frame-type adhesive 220 during production and logistics, ensuring that the frame-type adhesive 220 remains clean and intact before use.

[0050] Figure 3 It is a schematic diagram of a frame-type adhesive 220 and a release film 210 in an adhesive assembly provided in an embodiment of the present application.

[0051] like Figure 3 As shown, Figure 3 (a) shows a schematic diagram of a frame-type adhesive 220 provided in an embodiment of the present application. Figure 3 (b) shows a schematic diagram of a release film 210 provided in an embodiment of the present application.

[0052] like Figure 3 As shown in (a) , the frame-shaped adhesive 220 is formed by die-cutting a piece of adhesive, and includes a first portion 221 located at the inner periphery and a second portion 222 located at the outer periphery.

[0053] In some examples, a camera avoidance hole 223 and a speaker avoidance hole 224 are provided on the frame-type adhesive backing 220 .

[0054] The arrangement of the camera avoidance hole 223 and the speaker avoidance hole 224 ensures that the subsequent assembly of the camera and the speaker is not affected after the frame-type adhesive 220 is assembled.

[0055] In some examples, other types of avoidance holes may be provided on the frame-type adhesive backing 220 according to the design requirements of each electronic device, and this application does not limit this.

[0056] like Figure 3 As shown in (b), the release film 210 is divided into a first release film 211 and a second release film 212. The first release film 211 is a surface-shaped film, covering the first part 221 of the adhesive and the hollow part inside the first part; the second release film 212 is a frame-shaped film, located outside the first release film, and covering the second part 222 of the adhesive.

[0057] The design of this release film allows for step-by-step lamination by releasing the frame-type adhesive twice during use. First, the first release film 211 is torn off to expose the first portion 221 of the first surface of the frame-type adhesive 220, which can be attached to the target surface. Then, the second release film 212 is torn off to expose the second portion 222 of the first surface of the frame-type adhesive 220, and the second portion 222 is attached to another target surface, thereby achieving the effect of attaching the first surface of a piece of adhesive twice.

[0058] In some examples, a first tearing position 213 is disposed on the first release film 211 .

[0059] The provision of the first tearing position 213 helps the user to easily grasp and tear off the first release film 211 when the user needs to use the first portion 221 of the frame-shaped adhesive 220 .

[0060] In some embodiments, the first tearing position 213 is realized by providing a U-shaped hole on the first release film 211 . By providing the U-shaped hole, a protrusion can be formed on the first release film 211 , and the protrusion serves as the first tearing position 213 .

[0061] The setting of the U-shaped hole can provide a clear gripping point on the first release film 211 , making the peeling process faster and more accurate, thereby significantly reducing the time required to tear off the first release film 211 .

[0062] In other embodiments, the first tearing position 213 may be configured in other forms that can facilitate tearing off the first release film 211 .

[0063] In some examples, the first tearing position 213 is located at an edge region of the first release film 211 .

[0064] In some examples, a cutting line 216 is further provided on the first release film 211 . The cutting line 216 is provided between the U-shaped hole and the edge of the first release film 211 .

[0065] By providing the cutting line 216 , during the tearing process of the first release film 211 , the first release film 211 is broken at the cutting line 216 , so that the tearing process of the first release film 211 is smoother.

[0066] In some examples, a second tearing position 214 is provided on at least one corner of the second release film 212 .

[0067] An extension is designed at the corner of the second release film 212, and the extension serves as a second tearing position 214. The provision of at least one second tearing position 214 can help the operator to easily peel off the second release film 212, exposing the second part 222 of the back adhesive for lamination.

[0068] In some examples, a positioning hole 215 is provided on the second tearing position 214 .

[0069] The position and layout of the positioning holes 215 are determined according to the specific assembly requirements of the electronic device and the configuration of the fixture. Before the electronic device is attached, the positioning holes 215 on the second release film 212 are used in conjunction with the positioning posts of the fixture used to position the adhesive backing assembly 200.

[0070] In some examples, the second release film 212 is provided with at least three second tear positions 214 , which are respectively provided at three corners of the second release film 212 , and each second tear position 214 is provided with a positioning hole 215 .

[0071] By providing at least three second tearing positions 214, multiple peeling points can be provided, saving the operator time in peeling the second release film 212. By cooperating with the positioning posts of the jig through at least one positioning hole 215 located in the second release film 212, three-point positioning can be achieved. This cooperation can ensure the precise positioning of the adhesive during the lamination process, thereby avoiding lamination errors caused by improper human operation.

[0072] In some specific embodiments, the second tearing position 214 is generally designed as a rounded rectangle. The rounded rectangle tearing position design can provide a good visual indication, facilitate tearing off the second release film 212, and avoid damaging the frame adhesive 220 during the peeling process.

[0073] Based on the above Figure 2 and Figure 3 The illustrated embodiment provides a back glue assembly 200, and the present application also provides a back glue bonding method for bonding a cover plate, a display screen, and a face shell in an electronic device. Figure 44 is a flow chart of a back adhesive laminating method 400 provided in an embodiment of the present application. The method 400 can be applied to an assembly line of electronic equipment.

[0074] like Figure 4 As shown, the method 400 may include the following steps:

[0075] S410, obtaining an adhesive backing component;

[0076] S420, placing the adhesive backing component in a fixture, with the second side of the frame-shaped adhesive backing facing upward;

[0077] S430, pasting the cover plate to the second surface of the frame-shaped adhesive to form an assembly;

[0078] S440, turning over the assembly, with the first side of the frame-shaped adhesive facing upward;

[0079] S450, tearing off the first release film;

[0080] S460, attaching the display screen to the first part of the frame adhesive;

[0081] S470, tearing off the second release film;

[0082] S480, stick the cover to the second part of the frame adhesive.

[0083] In step S410, the obtained adhesive backing assembly 200 may include: a frame-type adhesive backing 220 and a first release film 211 and a second release film 212 arranged on the first surface of the frame-type adhesive backing 220, the first release film 211 covers the first part 221 of the frame-type adhesive backing 220, the second release film 212 covers the second part 222 of the frame-type adhesive backing 220, and the second part 222 is located outside the first part 221. It can be understood that the relevant schemes of the frame-type adhesive backing 220, the first release film 211 and the second release film 212 in the adhesive backing assembly 200 can be referred to above. Figure 2 and Figure 3 The specific description of the illustrated embodiment will not be repeated here.

[0084] In some embodiments, the adhesive backing assembly 200 in which the first release film 211 and the second release film 212 are separated from each other can be directly obtained. Alternatively, in other embodiments, the first adhesive backing assembly can be obtained first, and the first adhesive backing assembly includes a complete release film, and the release film needs to be divided before forming the first release film 211 and the second release film 212. In this case, the above step S410 may include: obtaining the first adhesive backing assembly, the first adhesive backing assembly including: a frame-type adhesive backing 220 and a release film 210 disposed on the first surface of the frame-type adhesive backing; cutting the release film 210 to form the first release film 211 and the second release film 212.

[0085] That is, the release film 210 in the adhesive assembly 200 may be an independent first release film 211 and a second release film 212 , or may be an integral whole formed by cutting the release film 210 to form the first release film 211 and the second release film 212 .

[0086] In step S420 , the adhesive component 200 is placed in a laminating jig, with the second surface of the frame-shaped adhesive 220 facing upward.

[0087] In some examples, an extension portion is disposed on at least one corner of the second release film 212 to form at least one second tear-off position 214 , and a positioning hole 215 is disposed on the second tear-off position 214 .

[0088] In some embodiments, at least three corners of the second release film 212 are provided with second tearing positions 214 , and each second tearing position 214 is provided with a positioning hole 215 .

[0089] Positioning posts are arranged around the laminating jig, and the positions of the positioning posts correspond to the positioning holes 215 on the second tearing position 214. The positioning holes 215 and the positioning posts cooperate to position the adhesive backing component 200 in the jig, ensuring that the adhesive backing component 200 and the electronic device can be accurately aligned during the assembly process, and avoiding displacement of the adhesive backing component 200 due to external reasons during the laminating process.

[0090] In step S430 , the cover plate is adhered to the second surface of the frame-shaped adhesive 220 to form an assembly, thereby achieving adhesion between the second surface of the frame-shaped adhesive 220 and the cover plate.

[0091] In some examples, the adhesive component 200 obtained in S410 further includes a bottom film 230. Therefore, when the adhesive component 200 further includes the bottom film 230, the step S430 further includes the step of tearing off the bottom film 230 to expose the second surface of the frame adhesive 220.

[0092] S440, flip the assembly so that the first side of the frame adhesive faces upward. In this step, the assembled assembly is flipped in the jig so that the assembled face shell is located at the bottom of the jig, and the first side of the frame adhesive 220 and the first release film 211 and the second release film 212 located on the first side face upward, so as to perform the bonding process of the first side of the frame adhesive 220.

[0093] In step S450 , the first release film 211 is torn off to expose the first portion 221 of the frame-shaped adhesive 220 for subsequent lamination.

[0094] In some examples, at least one U-shaped hole is provided on the first release film 211 to form a protrusion, so as to form at least one first tear position 213. Step S450 may include: tearing off the first release film 211 through the first tear position 213. By providing the first tear position 213, it is possible to make the tearing off of the first release film 211 more convenient.

[0095] In some examples, a cutting line 216 is provided between the U-shaped hole and the edge of the first release film 211 . During the process of tearing off the first release film 211 , the first release film 211 is broken at the cutting line 216 , making the tearing process smoother.

[0096] Through step S460, the display screen is adhered to the first portion 221 of the frame-type adhesive 220, so that the cover plate and the display screen are bonded together through the frame-type adhesive 220 to form a bonded assembly of the cover plate and the display screen.

[0097] In step S470 , the second release film 212 is torn off to expose the second portion 222 of the frame-shaped adhesive 220 for subsequent lamination.

[0098] In some examples, the second release film 212 is provided with a second tear position 214, and step S470 may include: tearing off the second release film 212 through at least one second tear position 214. Pulling the second tear position 214 may speed up the process of tearing off the second release film 212.

[0099] Finally, through step S480 , the cover is adhered to the second portion 222 of the frame-shaped adhesive 220 .

[0100] Through the steps of the above method, the cover plate, the display screen and the face shell are assembled by only using one frame-shaped adhesive 220 .

[0101] This method effectively reduces the amount of adhesive used and the waste of the middle part, which can effectively reduce production costs. This innovative technology not only improves the utilization rate of materials, but also optimizes the production process, providing enterprises with a more economical and efficient solution.

[0102] The present application also provides an electronic device. Figure 5 It is an exploded schematic diagram of some components in an electronic device 500 provided in an embodiment of the present application.

[0103] like Figure 5 As shown, the electronic device 500 includes a cover plate 510, a frame-type adhesive 220, a display screen 520 and a cover 530 in sequence. Figures 2 to 3 The introduction in will not be repeated here.

[0104] In the electronic device 500 , the outer portion of the first surface of the frame adhesive 220 is bonded to the cover 530 , the inner portion of the first surface of the frame adhesive 220 is bonded to the display screen 520 ; and the second surface of the frame adhesive 220 is bonded to the cover plate 510 .

[0105] Optionally, the frame adhesive 220 can be Figure 4 The method of the illustrated embodiment is used to bond the cover plate 510 , the display screen 520 and the face shell 530 to complete the assembly of the electronic device 500 .

[0106] The frame-type adhesive 220 provided in the embodiment of the present application can be used not only in the bonding process of the cover plate 510, the display screen 520 and the surface shell 530, but also in other scenarios where bonding is required.

[0107] It is understandable that Figure 5 Only some components in the electronic device 500 are shown schematically. The electronic device 500 may further include other functional components such as a middle frame, a battery, and a main board according to actual needs. The present application does not limit the specific structure of the electronic device 500.

[0108] The electronic devices may be smart phones, traditional keypad phones, tablet computers, laptop computers, etc. These are just examples. Other electronic devices or electronic devices that may appear in the future that can be applied to this application should also be included in the protection scope of this application.

[0109] It should be understood that the specific examples in this article are only intended to help those skilled in the art better understand the embodiments of the present application, rather than to limit the scope of the embodiments of the present application.

[0110] It should also be understood that in the various embodiments of the present application, the size of the serial number of each process does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0111] It should also be understood that the various implementation methods described in this specification can be implemented individually or in combination, and the embodiments of the present application are not limited to this.

[0112] Unless otherwise specified, all technical and scientific terms used in the embodiments of the present application have the same meaning as those generally understood by technicians in the technical field of the present application. The terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit the scope of the present application. In the description of the present application, it should be noted that, unless otherwise specified, the meaning of "multiple" is more than two; the orientation or position relationship indicated by the terms "upper", "lower", "left", "right", "inside", "outside", etc. is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application. The term "and / or" used in the present application includes any and all combinations of one or more related listed items. The singular forms of "a", "above", and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0113] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A method for laminating adhesive backing, characterized in that: The method is applied in a manufacturing process of an electronic device including at least a cover plate, a display screen and a face shell, and the method comprises: Obtaining an adhesive component, the adhesive component comprising: a frame-type adhesive and a first release film and a second release film disposed on a first surface of the frame-type adhesive, wherein the first release film covers a first portion of the frame-type adhesive, and the second release film covers a second portion of the frame-type adhesive, and the second portion is located outside the first portion; The adhesive backing assembly is arranged in a fixture, with the second surface of the frame-shaped adhesive backing facing upwards; Adhere the cover plate to the second surface of the frame-shaped adhesive to form an assembly; Turning over the assembly, with the first side of the frame-shaped adhesive facing upward; tearing off the first release film; Adhere the display screen to the first part of the frame-type adhesive; removing the second release film; The face shell is adhered to the second part of the frame-type adhesive.

2. The method according to claim 1, characterized in that The first release film is a surface-type release film, and at least one first hand-tear position is provided in the first release film. Wherein, the step of tearing off the first release film comprises: The first release film is torn off through the at least one first tearing position; and / or, The second release film is a frame-shaped release film, and at least one corner of the second release film is extended to be provided with at least one second hand-tear position; The step of tearing off the second release film comprises: The second release film is torn off through the at least one second hand-tear position.

3. The method according to claim 2, characterized in that The second hand-tearing position is provided with a positioning hole, and the jig is provided with a positioning column; Wherein, the step of placing the adhesive backing component in a fixture comprises: The adhesive backing assembly is positioned in the fixture through the positioning holes and the positioning posts.

4. The method according to claim 3, characterized in that The second release film is provided with at least three second hand-tear positions, and the at least three second hand-tear positions are arranged at three corners of the second release film in a one-to-one correspondence.

5. The method according to claim 2, characterized in that: At least one U-shaped hole is provided in the first release film to form the first hand-tear position.

6. The method according to claim 5, characterized in that A cutting line is arranged between the U-shaped hole and the edge of the first release film.

7. The method according to claim 2, characterized in that The at least one first tearing position is located in an edge area of ​​the first release film.

8. The method according to any one of claims 1 to 7, characterized in that The step of obtaining the adhesive backing component comprises: Obtain a first adhesive component, the first adhesive component comprising: the frame-shaped adhesive and a release film disposed on a first surface of the frame-shaped adhesive; The release film is cut to form the adhesive backing assembly including the first release film and the second release film.

9. The method according to any one of claims 1 to 7, characterized in that The adhesive backing assembly further includes: a bottom film, which is arranged on the second surface of the frame-type adhesive backing; Before the cover plate is adhered to the second surface of the frame-shaped adhesive to form an assembly, the method further includes: The base film is peeled off.

10. A back adhesive component, characterized in that: include: Frame adhesive backing; The first release film and the second release film are arranged on the first surface of the frame-type adhesive, wherein the first release film covers the first part of the frame-type adhesive, and the second release film covers the second part of the frame-type adhesive, and the second part is located outside the first part.

11. The adhesive backing assembly according to claim 10, characterized in that: The first release film is a surface-type release film, and at least one first hand-tear position is provided in the first release film, and / or, The second release film is a frame-shaped release film, and at least one corner of the second release film is extended to be provided with at least one second hand-tear position.

12. The adhesive backing assembly according to claim 11, characterized in that: The second hand-tearing position is provided with a positioning hole.

13. The adhesive backing assembly according to claim 12, characterized in that: The second release film is provided with at least three second hand-tear positions, and the at least three second hand-tear positions are arranged at three corners of the second release film in a one-to-one correspondence.

14. The adhesive backing assembly according to claim 11, characterized in that: At least one U-shaped hole is arranged in the first release film to form a first hand-tear position.

15. The adhesive backing assembly according to claim 14, characterized in that: A cutting line is arranged between the U-shaped hole and the edge of the first release film.

16. The adhesive backing assembly according to claim 11, characterized in that: The at least one first tearing position is located in an edge area of ​​the first release film.

17. The adhesive backing assembly according to any one of claims 10 to 16, characterized in that: The adhesive backing assembly further includes: a bottom film, which is arranged on the second surface of the frame-type adhesive backing.

18. An electronic device, characterized in that: include: Frame adhesive, cover, display screen and face shell; The outer peripheral portion of the first surface of the frame-shaped adhesive is bonded to the face shell, and the inner peripheral portion of the first surface of the frame-shaped adhesive is bonded to the display screen; The second surface of the frame-shaped adhesive is bonded to the cover plate.

19. An electronic device, characterized in that: include: Frame adhesive, cover, display screen and face shell; The frame-type adhesive is bonded to the cover plate, the display screen and the face shell by the adhesive bonding method described in any one of claims 1 to 9.

Images