Preparation method of organic silicon modified ultraviolet-moisture dual-curing material

Abstract

The invention relates to the technical field of material preparation, in particular to a preparation method of an organic silicon modified ultraviolet-moisture dual-curing material, the dual-curing material takes polymer polyol as a main body, diisocyanate is adopted for end sealing to obtain a prepolymer A containing an NCO group at the end part, and the prepolymer A is used for preparing an organic silicon modified ultraviolet-moisture dual-curing material. Reacting NCO at the end part of the prepolymer with OH of a hydroxyl acrylate monomer to obtain a prepolymer B containing an acrylic acid active group; modifying by ETM silane, and partially grafting by controlling reaction conditions to obtain a prepolymer C; and then carrying out photo-initiation-moisture curing. After the material is subjected to ultraviolet-moisture curing, a coating is high in hardness, strong in adhesive force, relatively high in elastic modulus and high in mechanical strength, and is suitable for being used for a long time in a temperature range of-40 to 120 DEG C.

Description

Technical Field

[0001] The invention relates to the technical field of material preparation, and in particular to a method for preparing an organosilicon-modified ultraviolet-moisture dual-curing material. Background Art

[0002] Photocuring refers to the curing process of monomers, oligomers or polymer matrices under light induction. It is generally used in the film-forming process and is an energy-saving, clean and environmentally friendly technology. Photocuring requires light induction to occur. For dark area curing without light, other curing processes are required. Therefore, light-dark dual curing technology has emerged.

[0003] The light-dark dual-curing technology combines light initiation with dark catalytic reaction, and completes product curing through two independent reactions. Among them, dark catalytic reactions include thermal curing, moisture curing and air curing. In the light-dark dual-curing technology, UV light can quickly shape the product system, and the dark catalytic reaction completely cures the non-illuminated area or the deep layer of the product to achieve a solid drying effect. The light-dark dual-curing technology has broadened the application of UV light curing in complex-shaped objects, filling systems and ultra-thick coatings. It has the characteristics of low cost and quick effect, and has attracted much attention. Among them, the UV-moisture dual-curing process is particularly outstanding because of its low energy consumption and wide adaptability.

[0004] UV-moisture dual curing includes two curing methods: free radical and cationic, and the reactive functional groups are unsaturated double bonds and epoxy groups respectively. The current mainstream process route is free radical-isocyanate dual curing, which has been widely used in coatings, inks, and adhesives, such as US patents (publication numbers US5234970 and US4424252). However, due to the presence of isocyanate groups, this route has problems such as causing skin allergies and producing carbon dioxide bubbles when in contact with free water. Therefore, material engineers have invented a free radical-siloxy dual curing route.

[0005] The free radical-siloxane dual curing process, the first step of curing is also UV light to initiate a free radical reaction, and the second step is to absorb moisture in the air through the siloxane group, remove small molecule alcohol, and condense and cure, such as the US patent (publication number US5516812) and the resin invented by Beijing University of Chemical Technology (publication number CN102408569B). The typical process is to use 3-(methacryloyloxy)propyltrimethoxysilane (KH570) to react with α, ω-dihydroxy polydimethylsiloxane or hydroxyl-containing silicone resin in the silanol group to remove methanol, introduce free radical curable acryloyloxy groups into the silicone oil or silicone resin molecules, and leave two silyl methoxy groups. Acryloyloxy groups can accept UV curing. The silyl methoxy groups on the polymer can absorb moisture in the air under the action of metal catalysts and hydrolyze and condense to cure. The reaction equation is as follows:

[0006]

[0007] The UV-moisture dual-curing material obtained by this process has limited free radicals and silyl methoxy content obtained by grafting KH570, because the hydroxy silicone oil only contains reactive groups at both ends of the chain. In addition, the silyl alkoxy group is greatly hindered by the steric hindrance of the acryloxy group, and the moisture reaction activity is relatively low. Because the main polymer is linear silicone oil, the intermolecular force is small, and the obtained adhesive layer has low body strength, hardness, and adhesion.

[0008] For this reason, a Chinese patent application (application publication number CN114292402A) discloses a UV moisture dual-curing silicone containing a urea structure, which is terminated by secondary amino silane, and the active hydrogen of the secondary amino group reacts with acrylic acid-isocyanate monomer to obtain a resin containing both light-cured unsaturated bonds and moisture-cured silanol groups. Because the molecular chain contains more urea groups, the intermolecular force is enhanced, and the strength, hardness, and adhesion of the cured colloid are better than the resin invented by Beijing University of Chemical Technology (publication number CN102408569B). However, the steric hindrance of the silanol group is greater, the moisture reaction activity is low, and the surface drying time is more than 12 hours. The reaction speed in the dark area is too low, which will reduce production efficiency.

[0009] Therefore, it is necessary to propose a new preparation process of silicone-modified UV-moisture dual-curing material to reduce the steric hindrance of the curing reaction and improve the mechanical strength and adhesion of the product. Summary of the invention

[0010] In order to overcome the above technical problems, the present invention provides a method for preparing a silicone-modified UV-moisture dual-curing material, using diisocyanate as a medium to connect a polyol resin with UV-curable unsaturated double bonds. Then, by quantitative addition with 1,1,3,3-tetramethyl-1-[2'-(trimethoxysilyl)ethyl]-disiloxane (abbreviated as ETM silane, CAS No. 137407-65-9, molecular weight 282.557), the proportion of UV-moisture curing groups is regulated, the steric hindrance of the curing reaction is reduced, and the mechanical strength and adhesion of the product are improved.

[0011] The technical solutions to the above technical problems are as follows:

[0012] The method for preparing a silicone-modified UV-moisture dual-curing material comprises the following steps:

[0013] S1: Add polymer polyol and diisocyanate into a reaction container at 80-100°C, mix well, and keep warm for 3-4 hours to obtain prepolymer A shown in formula I. The reaction equation is as follows:

[0014]

[0015] S2: Add hydroxy acrylic acid monomer to the prepolymer A obtained by the reaction in step S1, maintain 100±2°C, and titrate and analyze during the reaction until no NCO is detected, and convert all NCO groups on the prepolymer A molecules into acrylic acid groups. The reaction is completed to obtain prepolymer B shown in formula II. The reaction equation is as follows:

[0016]

[0017] S3: Add ETM silane to the prepolymer B after the reaction in step S2, react at 80-100°C for 2-4 hours under the action of platinum catalyst, convert part of the acrylic acid free radicals into silyl methoxy groups that can be hydrolyzed, and part of the grafted product is the prepolymer C shown in formula III. The reaction equation is as follows:

[0018]

[0019] S4: Add 10-30% of the mass of prepolymer C to the prepolymer C shown in formula III obtained in step S3, stir evenly, then add 2-4% of the mass of prepolymer C photoinitiator and 0.1-1% of the mass of prepolymer C moisture reaction catalyst, and then add additives, and obtain the final product after UV-moisture dual curing. Among them, the choice of active diluent is very wide, any single-functionality or multi-functionality free radical curing active diluent can be used, preferably a free radical curing active diluent with high activity, low odor, and low sensitization properties.

[0020] Specifically, the polymer polyol in step S1 is a polyester polyol or a polyether polyol with a molecular weight of 1000 to 8000, preferably a polyester polyol or a polyether polyol with a molecular weight of 2000 to 6000.

[0021] Wherein, the polyester polyol is polycaprolactone triol or polycarbonate diol;

[0022] The polyether polyol is polytetramethylene glycol, polypropylene oxide diol or polypropylene oxide triol.

[0023] Specifically, the diisocyanate in step S1 is any one of toluene diisocyanate (TDI), diphenylmethane diisocyanate (MDI), xylylene diisocyanate (XDI), isophorone diisocyanate (IPDI), and hexamethylene diisocyanate (HDI), or a mixture of several of them.

[0024] Specifically, the ratio of the reactive groups NCO of the diisocyanate to the reactive groups OH of the polymer polyol in step S1 is 1<α≤2.

[0025] Specifically, the hydroxy acrylic monomer in step S2 is any one of hydroxyethyl methacrylate (HEMA), hydroxyethyl acrylate (HEA), hydroxypropyl methacrylate (HPMA), hydroxypropyl acrylate (HPA), and pentaerythritol triacrylate (PETA), or a mixture of several of them.

[0026] Specifically, the ratio of the reactive groups NCO of the prepolymer A to the reactive groups OH of the hydroxylated acrylic monomer in step S2 is 0.9 to 1.0.

[0027] Specifically, the molar amount of the ETM silane in step S3 accounts for 20-60% of the molar amount of the acrylic acid groups in the prepolymer B; preferably 40-60%.

[0028] Furthermore, the platinum catalyst in step S3 is a Karstedt-type or Speier-type platinum catalyst.

[0029] Further, the photoinitiator in step S4 is one or a mixture of 2-hydroxy-2-methylphenylacetone (Darocure 1173), 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO), ethyl 2,4,6-trimethylbenzoylphenylphosphonate (TPO-L), benzoin dimethyl ether (651 or BDK), benzophenone (BP), 1-hydroxy-cyclohexyl benzophenone (184), α,α′-ethoxyacetophenone (DEAP) or α-aminoalkylphenone.

[0030] Furthermore, the moisture reaction catalyst in step S4 is any one or more of stannous octoate, dibutyltin dilaurate, dibutyltin diacetate, chelated tin, n-butyl titanate, and isopropyl titanate.

[0031] The beneficial effects of the present invention are:

[0032] The present invention adopts diisocyanate as a medium, connects a polyol resin with UV-curable unsaturated double bonds, then quantitatively adds ETM silane to the unsaturated double bonds, and adjusts the proportion of UV-moisture curing groups to obtain an organosilicon-modified ultraviolet-moisture dual-curing material, thereby solving the technical problems of poor mechanical strength and weak adhesion of the cured coating of materials whose main polymer structure is a linear polysiloxane prepolymer.

[0033] The product formula provided by the present invention has no NCO residue, low irritation, environmental protection and non-toxicity. If trimethoxyhydrogen silane is used instead of ETM silane, a modified material with similar performance can also be achieved, but since trimethoxyhydrogen silane itself has the defects of being flammable, volatile, acutely toxic, highly irritating to the skin and eyes, and having high safety risks in industrial production, ETM silane is selected as the modified silane.

[0034] In step S3 of the present invention, ETM silane is used to partially graft the terminal unsaturated double bonds, which can flexibly adjust the ratio of UV-curing and moisture-curing active groups and adjust the UV-curing and moisture-curing rates. The prepolymer C molecule terminal positions are connected with three Si-OMe, which reduces the reaction steric hindrance, has a high moisture reaction rate, and the coating can be surface-dried and fully dried faster.

[0035] According to the required use, the silicone-modified UV-humidity dual-curing material can be added with additives with other functions such as leveling agents, wetting agents, fluorescent indicators, pigments or dyes, and reinforcing fillers.

[0036] Silicone-modified UV-moisture dual-curing materials with different main chain structures and different molecular weights are suitable for different application scenarios. Low-viscosity silicone-modified UV-moisture dual-curing materials can be directly applied for electronic circuit board protection, furniture, home appliances, industrial protective coatings, etc. High-viscosity silicone-modified UV-moisture dual-curing materials can be used for shallow potting and sealing of parts in various scenarios.

[0037] The cured product has good adhesion, high body strength and hardness, excellent protective performance, and can be used for a long time in the temperature range of -40 to 120°C.

[0038] The present invention is further described in detail below in conjunction with specific implementation modes. DETAILED DESCRIPTION

[0039] Embodiment 1:

[0040] S1: under the reaction condition of 100° C., 0.0333 mol of polycarbonate diol with Mw=3000 and 0.0667 mol of toluene diisocyanate were added into the reaction container and mixed evenly, and the mixture was kept at this temperature for 3 hours to obtain prepolymer A;

[0041] S2: Add 0.0667 mol of hydroxyethyl methacrylate to the prepolymer A obtained by the reaction in step S1, maintain the temperature at 100±2° C., perform titration analysis during the reaction until no NCO is detected, and convert all NCO groups on the prepolymer A molecules into acrylic acid groups. The reaction is completed to obtain a prepolymer B shown in formula II;

[0042] S3: adding 0.02 mol of ETM silane to the prepolymer B after the reaction in step S2, reacting at 100° C. for 2 h under the action of 1 ppm of Karstedt platinum catalyst to convert part of the acrylic acid free radicals into silyl methoxy groups, and part of the grafted product is the prepolymer C shown in formula III;

[0043] S4: Weigh 80 parts of the prepolymer C shown in formula III obtained in step S3, add 20 parts of propoxylated glycerol triacrylate as an active diluent, add 4 parts of 2-hydroxy-2-methylphenylacetone, 2 parts of methyltrimethoxysilane as a dehydrating agent, 0.1 parts of dibutyltin dilaurate, and 1 part of a leveling wetting agent while stirring, and obtain the final product after UV-humidity dual curing; the addition of the dehydrating agent can protect the methoxy group introduced by ETM silane on the prepolymer C, reacting preferentially with the moisture introduced from other materials, thereby protecting the hydrolyzable groups on the resin.

[0044] Embodiment 2:

[0045] S1: under the reaction condition of 80° C., 0.05 mol of polyoxypropylene glycol with Mw=2000 and 0.0683 mol of diphenylmethane diisocyanate were added into the reaction container and mixed evenly, and the mixture was kept warm for reaction for 3.5 h to obtain prepolymer A;

[0046] S2: Add 0.0366 mol of hydroxyethyl acrylate to the prepolymer A obtained in step S1, maintain the temperature at 100±2° C., perform titration analysis during the reaction until no NCO is detected, and convert all NCO groups on the prepolymer A molecules into acrylic acid groups. The reaction is completed to obtain a prepolymer B shown in formula II;

[0047] S3: adding 0.0183 mol of ETM silane to the prepolymer B after the reaction in step S2, reacting at 80° C. for 4 h under the action of 3 ppm of Speier platinum catalyst, converting part of the acrylic acid free radicals into silyl methoxy groups, and the part of the grafted product is the prepolymer C shown in formula III;

[0048] S4: Weigh 80 parts of the prepolymer C shown in formula III obtained in step S3, add 20 parts of propoxylated glycerol triacrylate as an active diluent, add 2 parts of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and 1 part of ethyl 2,4,6-trimethylbenzoylphenylphosphonate, 2 parts of methyltrimethoxysilane, 0.3 parts of dibutyltin diacetate, and 1 part of a leveling wetting agent while stirring, and obtain the final product after UV-humidity dual curing.

[0049] Embodiment 3:

[0050] S1: under the reaction condition of 90° C., 0.0167 mol of polycaprolactone triol with Mw=8000 and 0.1 mol of xylylene diisocyanate were added into the reaction container and mixed evenly, and the mixture was kept warm for 4 hours to obtain prepolymer A;

[0051] S2: Add 0.1 mol of hydroxypropyl methacrylate to the prepolymer A obtained by the reaction in step S1, maintain the temperature at 100±2° C., perform titration analysis during the reaction until no NCO is detected, and convert all NCO groups on the prepolymer A molecules into acrylic acid groups. The reaction is completed to obtain a prepolymer B shown in formula II;

[0052] S3: adding 0.04 mol of ETM silane to the prepolymer B after the reaction in step S2, reacting at 90° C. for 3 h under the action of 5 ppm of Karstedt platinum catalyst, converting part of the acrylic acid free radicals into silyl methoxy groups, and the part of the grafted product is the prepolymer C shown in formula III;

[0053] S4: Weigh 80 parts of the prepolymer C shown in formula III obtained in step S3, add 20 parts of propoxylated glycerol triacrylate as a reactive diluent, add 2 parts of benzoin dimethyl ether, 1 part of α-aminoalkylphenone, 2 parts of methyltrimethoxysilane, 0.5 parts of chelated tin, and 1 part of a leveling wetting agent while stirring, and obtain the final product after UV-humidity dual curing.

[0054] Embodiment 4:

[0055] S1: under the reaction condition of 95° C., 0.02 mol of polytetrahydrofuran diol with Mw=6000 and 0.04 mol of isophorone diisocyanate were added into the reaction container and mixed evenly, and the mixture was kept warm for 3 hours to obtain prepolymer A;

[0056] S2: Add 0.04 mol of hydroxypropyl acrylate to the prepolymer A obtained in step S1, maintain the temperature at 100±2° C., perform titration analysis during the reaction until no NCO is detected, and convert all NCO groups on the prepolymer A molecules into acrylic acid groups. The reaction is completed to obtain a prepolymer B shown in formula II;

[0057] S3: adding 0.02 mol of ETM silane to the prepolymer B after the reaction in step S2, reacting at 100° C. for 2 h under the action of 7 ppm of Speier platinum catalyst to convert part of the acrylic acid free radicals into silyl methoxy groups, and part of the grafted product is the prepolymer C shown in formula III;

[0058] S4: Weigh 80 parts of the prepolymer C shown in formula III obtained in step S3, add 20 parts of propoxylated glycerol triacrylate as an active diluent, add 2 parts of benzophenone, 2 parts of methyltrimethoxysilane, 0.7 parts of n-butyl titanate, and 1 part of a leveling wetting agent while stirring, and obtain the final product after UV-humidity dual curing.

[0059] Embodiment 5:

[0060] S1: under the reaction condition of 85° C., 0.0167 mol of polypropylene oxide triol with Mw=1000 and 0.05 mol of hexamethylene diisocyanate were added into the reaction container and mixed evenly, and the mixture was kept at this temperature for 4 hours to obtain prepolymer A;

[0061] S2: Add 0.05 mol of pentaerythritol triacrylate to the prepolymer A obtained by the reaction in step S1, maintain the temperature at 100±2° C., perform titration analysis during the reaction until no NCO is detected, and convert all NCO groups on the prepolymer A molecules into acrylic acid groups. The reaction is completed to obtain a prepolymer B shown in formula II;

[0062] S3: adding 0.03 mol of ETM silane to the prepolymer B after the reaction in step S2, reacting at 90° C. for 3 h under the action of 10 ppm of Karstedt platinum catalyst to convert part of the acrylic acid free radicals into silyl methoxy groups, and part of the grafted product is the prepolymer C shown in formula III;

[0063] S4: Weigh 80 parts of the prepolymer C shown in formula III obtained in step S3, add 20 parts of propoxylated glycerol triacrylate as an active diluent, add 2 parts of 1-hydroxy-cyclohexyl benzophenone and 2 parts of α, α′-ethoxyacetophenone, 2 parts of methyltrimethoxysilane, 0.9 parts of isopropyl titanate, 0.1 parts of stannous octoate, 1 part of a leveling wetting agent while stirring, and obtain the final product after UV-humidity dual curing.

[0064] Embodiment 6:

[0065] S1 and S2 are the same as in Example 3;

[0066] S3: adding 0.02 mol of ETM silane to the prepolymer B after the reaction in step S2, reacting at 90° C. for 3 h under the action of 5 ppm of Karstedt platinum catalyst, converting part of the acrylic acid free radicals into silyl methoxy groups, and the part of the grafted product is the prepolymer C shown in formula III;

[0067] S4 is the same as Example 3.

[0068] Detection:

[0069] The coating adhesion of the products of Examples 1-6 was tested according to GB / T 9286-2021; the hardness of the products was tested according to the GB / T2411-2008 method; and the tensile strength and elongation of the products were tested according to the GB / T 528-2009 method.

[0070] The test results are shown in Table 1 below:

[0071] Table 1 Product performance test data of Examples 1 to 6

[0072]

[0073]

[0074] (1) In a dark environment, the temperature is 25°C and the humidity is 50-70% RH.

[0075] (2) The test sample first passes through a UV mercury lamp, 2000mJ / cm 2 After irradiation, the film was cured at 25°C and 50-70% RH for 7 days.

[0076] (3) The heat aging test shall be carried out in accordance with GB / T 3512-2014 Vulcanized rubber or thermoplastic rubber hot air accelerated aging and heat resistance test.

[0077] (4) Low temperature test: the cured sample is placed in a freezer and cured at 25°C for 4 hours before testing.

[0078] From the performance test data in Table 1, it can be seen that the organosilicon-modified UV-moisture dual-curing material prepared by the present invention has a lower energy required for UV curing as the resin functionality increases. Example 5 uses trifunctional pentaerythritol triacrylate to cap and then graft silane, and the product has high UV reaction activity, at 1000mJ / cm 2 The curing can be completed in the following manner, which is significantly lower than other embodiments.

[0079] The pure moisture surface drying speed is mainly affected by the Si-OMe content and the catalyst activity. In Example 3, the proportion of silane grafting is high, and the catalyst used is chelated tin, so the moisture surface drying speed is faster than that of other examples.

[0080] After fully curing through UV and moisture, it can be seen that the hardness of embodiment 1,3,4 is obviously higher than embodiment 2, and this is because embodiment 2 resin backbone is polypropylene oxide glycol, and ether bond cohesive energy is lower therein, and is easy to rotate, and the physical property obtained by curing is poor.Hardness and intensity are all lower than polyester diol, polytetrahydrofuran diol product.The hardness height and elongation at break of embodiment 5 are low, and this is because the resin functionality of pentaerythritol triacrylate end-capping is high, and the reason that cross-linking density is large.

[0081] Example 6 is based on Example 3, except that the molar ratio of ETM silane in acrylic acid groups in prepolymer B is reduced from 40% to 20%, while other conditions remain unchanged. As a result, the concentration of acrylic acid photocurable groups remaining in the main polymer structure is higher, so the energy required for UV curing is low and the speed is fast. The moisture curing time will be extended accordingly, but the moisture reaction can still be completed. After both are fully cured, the tensile strength and hardness of Example 6 are significantly increased compared with Example 3, while the elongation at break is decreased.

[0082] It can be seen from the data in Table 1 that after heat aging at 120°C, the strength and elongation of Examples 2 and 5 are reduced to varying degrees. This is because the polyether bond energy is low and the chain breaks after high-temperature aging. In other Examples 1, 3, 4, and 6, the products obtained from polyester and polytetrahydrofuran have increased tensile strength after heat aging because the small amount of residual active groups continue to cross-link at high temperatures, which is also accompanied by a slight decrease in elongation at break. Therefore, it is recommended to avoid using polyether polyols for resin synthesis for long-term high temperature resistance requirements, and polycaprolactone and polytetrahydrofuran are preferred.

[0083] After the low temperature test, the samples were intact without cracking, stickiness or powdering. After returning to room temperature, the physical property test data were basically consistent with those before aging, and the slight difference in the data was considered to be caused by measurement errors.

[0084] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any simple modification or equivalent changes made to the above embodiments based on the technical essence of the present invention shall fall within the protection scope of the present invention.

Claims

1. A method for preparing a silicone-modified UV-moisture dual-curing material, characterized in that: The following steps are involved: S1: Add polymer polyol and diisocyanate into a reaction container at 80-100°C, mix well, and keep warm for 3-4 hours to obtain prepolymer A shown in formula I. The reaction equation is as follows: S2: Add hydroxy acrylic acid monomer to the prepolymer A obtained in step S1, maintain 100±2°C, and perform titration analysis during the reaction until no NCO is detected. The reaction is complete to obtain the prepolymer B shown in formula II. The reaction equation is as follows: S3: adding 1,1,3,3-tetramethyl-1-[2'-(trimethoxysilyl)ethyl]-disiloxane to the prepolymer B after the reaction in step S2, reacting at 80-100° C. for 2-4 hours under the action of a platinum catalyst, and a partial grafted product is a prepolymer C shown in formula III; the molar number of the 1,1,3,3-tetramethyl-1-[2'-(trimethoxysilyl)ethyl]-disiloxane accounts for 20-60% of the molar number of acrylic acid groups in the prepolymer B; The reaction equation is as follows: S4: Add active diluent to the prepolymer C shown in formula III obtained in step S3, stir evenly, then add 2-4% of the mass of the prepolymer C photoinitiator and 0.1-1% of the mass of the prepolymer C moisture reaction catalyst, and then add additives, and obtain the final product after UV-moisture dual curing.

2. The method for preparing the organosilicon-modified UV-moisture dual-curing material according to claim 1, characterized in that: The polymer polyol described in step S1 is a polyester polyol or a polyether polyol with a molecular weight of 1000 to 8000; wherein the polyester polyol is a polycaprolactone triol or a polycarbonate diol; and the polyether polyol is a polytetramethylene glycol, a polypropylene oxide diol or a polypropylene oxide triol.

3. The method for preparing the organosilicon-modified UV-moisture dual-curing material according to claim 1, characterized in that: The diisocyanate described in step S1 is any one of toluene diisocyanate, diphenylmethane diisocyanate, xylylene diisocyanate, isophorone diisocyanate, and hexamethylene diisocyanate, or a mixture of several of them.

4. The method for preparing the organosilicon-modified UV-moisture dual-curing material according to claim 1, characterized in that: The ratio of the reactive groups NCO of the diisocyanate to the reactive groups OH of the polymer polyol in step S1 is 1<α≤2.

5. The method for preparing the organosilicon-modified UV-moisture dual-curing material according to claim 1, characterized in that: The hydroxy acrylic monomer described in step S2 is any one of hydroxyethyl methacrylate, hydroxyethyl acrylate, hydroxypropyl methacrylate, hydroxypropyl acrylate, and pentaerythritol triacrylate, or a mixture of several of them.

6. The method for preparing the organosilicon-modified UV-moisture dual-curing material according to claim 1, characterized in that: The ratio of the reactive group NCO of the prepolymer A to the reactive group OH of the hydroxy acrylic acid monomer described in step S2 is 0.9 to 1.

0.

7. The method for preparing the organosilicon-modified UV-moisture dual-curing material according to claim 1, characterized in that: The molar number of 1,1,3,3-tetramethyl-1-[2'-(trimethoxysilyl)ethyl]-disiloxane described in step S3 accounts for 40 to 60% of the molar number of acrylic acid groups in prepolymer B.

8. The method for preparing the organosilicon-modified UV-moisture dual-curing material according to claim 1, characterized in that: The platinum catalyst described in step S3 is a Karstedt-type or Speier-type platinum catalyst.

9. The method for preparing the organosilicon-modified UV-moisture dual-curing material according to claim 1, characterized in that: The photoinitiator described in step S4 is one or a mixture of 2-hydroxy-2-methylphenylacetone, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, ethyl 2,4,6-trimethylbenzoylphenylphosphonate, benzoin dimethyl ether, benzophenone, 1-hydroxy-cyclohexyl benzophenone, α,α′-ethoxyacetophenone or α-aminoalkylphenone.

10. The method for preparing the organosilicon-modified UV-moisture dual-curing material according to claim 1, characterized in that: The moisture reaction catalyst in step S4 is any one or more of stannous octoate, dibutyltin dilaurate, dibutyltin diacetate, chelated tin, n-butyl titanate, and isopropyl titanate.

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