Water vapor spraying device and high-temperature furnace assembly

Abstract

The invention belongs to the field of water vapor injection, and discloses a water vapor injection device and a high-temperature furnace assembly.The water vapor injection device comprises a shell, an injector, a water storage device and a perforated plate; the ejector is arranged in the shell, a mounting hole is formed in the middle of the ejector, and a plurality of ejection holes surrounding the mounting hole are formed in the ejector; the water storage device is arranged in the mounting hole; the water storage device is arranged in the shell, the perforated plate is arranged in the shell and installed above the water storage device, a plurality of through holes are formed in the perforated plate, the through holes are communicated with the water storage device, and a distance is formed between the top surface of the perforated plate and the inner top surface of the shell. The water vapor is sprayed to the high-temperature furnace for cooling, so that the furnace body of the high-temperature furnace can be prevented from being corroded, and the airflow environment in the furnace is prevented from being disturbed.

Description

Technical Field

[0001] The invention relates to the technical field of water vapor injection, in particular to a water vapor injection device and a high-temperature furnace component. Background Art

[0002] The steam injection device is mainly used to provide steam, which can be used to participate in chemical reactions, cool high-temperature furnaces, and conduct laboratory research in universities. Machines working in high-temperature environments such as gas furnaces or incinerators usually encounter heat concentration that exceeds the range that the machine itself can withstand, resulting in a reduction in the life of the machine. In the prior art, it is usually directly injected with coolant (water) and water-cooled wall cooling. Direct injection of liquid water can easily cause corrosion to the furnace body, reduce the service life of the furnace body, and disrupt the airflow environment in the furnace, affecting the normal operation of the furnace. Summary of the invention

[0003] The purpose of the present application is to provide a water vapor injection device and a high-temperature furnace assembly, which can avoid corrosion to the furnace body of the high-temperature furnace and avoid disturbing the airflow environment in the furnace by injecting water vapor into the high-temperature furnace to cool it down.

[0004] The technical solutions provided by this application are as follows:

[0005] In one aspect, a water vapor injection device is provided, comprising:

[0006] shell;

[0007] An injector is arranged in the housing, a mounting hole is arranged in the middle of the injector, and a plurality of injection holes surrounding the mounting hole are arranged on the injector;

[0008] A water storage tank is arranged in the installation hole;

[0009] A porous plate is arranged in the shell and installed above the water reservoir. The porous plate is provided with a plurality of through holes, the through holes are connected to the water reservoir, and a top surface of the porous plate is spaced apart from an inner top surface of the shell.

[0010] In some embodiments, the water storage device includes a water storage body and a water inlet pipe, the water storage body is disposed in the mounting hole, one end of the water inlet pipe is connected to the water storage body, and the other end extends out of the housing.

[0011] In some embodiments, the water storage body includes a water storage bottom plate and a water storage side plate, the water storage bottom plate and the water storage side plate are connected to form a water storage chamber, and the porous plate is installed on the water storage chamber;

[0012] A water inlet cavity is provided in the water storage side plate, the water inlet pipe is communicated with the water inlet cavity, and one end of the water inlet cavity close to the water storage bottom plate is communicated with the water storage chamber.

[0013] In some embodiments, the water inlet cavity is annular and is arranged along the circumference of the water storage side plate;

[0014] An inner side wall of one end of the water storage side plate close to the water storage bottom plate is provided with an annular opening arranged along the circumference of the water storage side plate, and the annular opening communicates the water inlet cavity with the water storage chamber.

[0015] In some embodiments, the bottom surface of the water reservoir is flush with the ejector, the top surface of the water reservoir extends out of the ejector, and the porous plate is mounted on the top surface of the water reservoir.

[0016] In some embodiments, the bottom surface of the housing is open;

[0017] The bottom surface of the shell extends to outside the bottom surface of the injector along the height direction of the shell; or the bottom surface of the shell is flush with the injector.

[0018] In some embodiments, the injection hole is a conical hole or a fan-shaped hole, and the end of the injection hole with a smaller bottom area is arranged toward the top surface of the shell, and the end of the injection hole with a larger bottom area is arranged toward the bottom surface of the shell.

[0019] In some embodiments, the ejector and the porous plate are made of ceramic, and the housing and the water reservoir are made of stainless steel.

[0020] In some embodiments, a heater is further included, wherein the heater is disposed in the housing and is used to heat the water storage tank.

[0021] On the other hand, a high temperature furnace assembly is also provided, comprising a high temperature furnace and the water vapor injection device described in any one of the above embodiments, wherein the housing is connected to the high temperature furnace.

[0022] The technical effect of the present application is that the water vapor injection device of the present application can be installed on a high-temperature furnace, liquid water is introduced into the water reservoir, and the water reservoir heats the liquid water to form high-temperature water vapor by absorbing the heat of the high-temperature furnace or the heat of the heater. The high-temperature water vapor forms a uniform pressure steam flow through the porous plate, hits the inner top surface of the shell to form reverse water vapor, and then the water vapor is ejected downward to the high-temperature zone of the high-temperature furnace through the ejector, so as to achieve uniform cooling of the high-temperature furnace or add water vapor to the high-temperature furnace to participate in chemical reactions. The present application can avoid corrosion to the furnace body of the high-temperature furnace and disturb the airflow environment in the furnace by injecting water vapor into the high-temperature furnace to cool it down. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present application is further described in detail below with reference to the accompanying drawings and specific implementation methods:

[0024] Figure 1It is a structural schematic diagram of a water vapor injection device provided in an embodiment of the present application;

[0025] Figure 2 It is a schematic diagram of the structure of the ejector, water reservoir and porous plate provided in the embodiment of the present application;

[0026] Figure 3 is a schematic diagram of the structure of the ejector provided in an embodiment of the present application;

[0027] Figure 4 It is a schematic diagram of the structure of the porous plate provided in the embodiment of the present application;

[0028] Figure 5 It is a schematic diagram of the structure of the injector provided in the embodiment of the present application.

[0029] Description of Figure Numbers:

[0030] 100, housing; 200, ejector; 210, mounting hole; 300, water reservoir; 310, water inlet pipe; 320, water storage bottom plate; 330, water storage side plate; 331, water inlet cavity; 332, annular opening; 340, water storage chamber; 400, porous plate; 410, through hole; 500, water vapor receiving cavity. DETAILED DESCRIPTION

[0031] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0032] In order to more clearly illustrate the application embodiments or technical solutions in the prior art, the specific implementation methods of the present application will be described below with reference to the accompanying drawings. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings and other implementation methods can be obtained based on these drawings without creative work.

[0033] In order to simplify the drawings, only the parts related to the present application are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one of the parts with the same structure or function is schematically drawn or marked. In this article, "one" not only means "only one", but also means "more than one".

[0034] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0035] In this document, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] In the embodiments shown in the drawings, directional indications (such as up, down, left, right, front, and back, etc.) are not absolute but relative when describing the structure and movement of each component, and are not used to limit the direction of the product in actual use.

[0037] In addition, in the description of the present application, ordinal numbers, such as "first", "second", etc., are only used to distinguish and describe related objects, and cannot be understood as indicating or implying the relative importance or order between the related objects.

[0038] The water vapor injection device of the present application can be installed on a high-temperature furnace or a reaction furnace. The water vapor injection device injects water vapor into the high-temperature furnace, which can not only cool the high-temperature furnace to protect the high-temperature furnace from being burned due to excessive temperature, but also control the reaction temperature of the high-temperature furnace and increase the reaction materials for the high-temperature furnace, so that the water vapor participates in the chemical reaction in the high-temperature furnace. The present application can avoid corrosion to the furnace body of the high-temperature furnace and avoid disturbing the airflow environment in the furnace by injecting water vapor into the high-temperature furnace to cool it.

[0039] like Figures 1 to 4 As shown, the water vapor injection device includes a shell 100, an injector 200, a water reservoir 300 and a porous plate 400. The shell 100 can be used to connect with a high-temperature furnace; the injector 200 is arranged in the shell 100, a mounting hole 210 is provided in the middle of the injector 200, and a plurality of injection holes surrounding the mounting hole 210 are provided on the injector 200; the water reservoir 300 is arranged in the mounting hole 210; the porous plate 400 is arranged in the shell 100 and installed above the water reservoir 300, a plurality of through holes 410 are provided on the porous plate 400, the through holes 410 are connected with the water reservoir 300, and the top surface of the porous plate 400 is spaced from the inner top surface of the shell 100.

[0040] Specifically, the interior of the housing 100 is a hollow structure forming a cavity, and the ejector 200, the water reservoir 300 and the porous plate 400 are all arranged in the cavity of the housing 100. The housing 100 can be a cylindrical structure, a rectangular parallelepiped structure or an ellipsoidal structure, etc. The shape of the housing 100 is not specifically limited in this embodiment, as long as the ejector 200, the water reservoir 300 and the porous plate 400 can be installed. In this embodiment, the top of the housing 100 is closed and the bottom is open. The bottom of the housing 100 can be installed on a high-temperature furnace so that the water vapor formed in the housing can be ejected to the high-temperature furnace. In this embodiment, the housing 100 is made of a high-temperature resistant metal material, for example, the housing 100 is made of stainless steel to achieve high-temperature resistance.

[0041] The ejector 200 is an annular structure, for example, a circular ring or a rectangular ring, etc. The outer wall of the ejector 200 is fixedly mounted on the inner wall of the housing 100, and the inner ring of the ejector 200 forms a mounting hole 210 for mounting the water storage tank 300. The ejector 200 is provided with a plurality of ejection holes, and the plurality of ejection holes are evenly or unevenly arranged on the ejector 200. Preferably, the plurality of ejection holes are evenly arranged on the ejector 200, so that water vapor can be evenly ejected from the ejector 200 to the high temperature zone of the high temperature furnace. In this embodiment, the ejector 200 can be made of ceramic material to facilitate the production of multiple holes on the ejector 200 and to achieve high temperature resistance. Of course, the ejector 200 can also be made of metal materials such as stainless steel.

[0042] The water reservoir 300 is installed in the installation hole 210 of the ejector 200. Liquid water can be introduced into the water reservoir 300. The water reservoir 300 can be heated to form water vapor from the liquid water in the water reservoir 300. In this embodiment, there are at least two ways to heat the water reservoir 300. One is to set an independent heater in the housing 100. The heater heats the water reservoir 300 through an external heat source to form water vapor from the liquid water in the water reservoir 300. The other is to set the water vapor ejection device on the high-temperature furnace. The high-temperature furnace transfers heat to the water reservoir 300 to heat the water reservoir 300 and form water vapor from the liquid water in the water reservoir 300. Heating the water reservoir 300 by the high-temperature furnace can not only further cool the high-temperature furnace by absorbing heat to protect the high-temperature zone components of the high-temperature furnace from being burned by high temperature, but also make full use of the heat of the high-temperature furnace to avoid heat waste. In this embodiment, the water storage container 300 can be made of metal material, such as stainless steel, to achieve high temperature resistance.

[0043] The porous plate 400 is disposed on the water reservoir 300. The porous plate 400 is provided with a plurality of through holes 410. The through holes 410 are in communication with the water reservoir 300. The water vapor generated in the water reservoir 300 can be output to the top of the porous plate 400 through the through holes 410. The plurality of through holes 410 are evenly or unevenly arranged on the porous plate 400. Preferably, the plurality of through holes 410 are evenly arranged on the porous plate 400 so that the water vapor generated in the water reservoir 300 can be evenly output to the top of the porous plate 400. The aperture of the through hole 410 can be set according to the required resistance. For example, the aperture of the through hole 410 can be 0.5 mm to 1 mm so that the water vapor can evenly pass through the through holes 410 on the porous plate 400. The top surface of the porous plate 400 is spaced from the inner top surface of the housing 100 to form a water vapor receiving chamber 500. The water vapor generated by the water reservoir 300 is output to the water vapor receiving chamber 500 upward through the through hole 410 and then reversed, and then ejected downward through the ejector 200. The height of the water vapor receiving chamber 500 can be designed according to the overall size of the water vapor ejection device. The height of the water vapor receiving chamber 500 is not too high to avoid the water vapor ejected from the porous plate 400 from being unable to hit the inner top surface of the housing 100 and forming reverse water vapor, while avoiding wasting space and causing the overall volume of the entire water vapor ejection device to be too large. In this embodiment, a porous plate 400 is arranged on the water reservoir 300. The porous plate 400 can compress the water vapor so that the water vapor ejected into the water vapor receiving chamber 500 has a certain pressure. In addition, the porous plate 400 can also limit the water vapor ejection flow rate and output it evenly to the water vapor receiving chamber 500. In this embodiment, the porous plate 400 can be made of ceramic material to facilitate the production of porous properties on the porous plate 400 and achieve high temperature resistance. Of course, the porous plate 400 can also be made of metal materials such as stainless steel, or the porous plate 400 can be replaced with a porous medium.

[0044] The water vapor injection device of this embodiment can be installed on a high-temperature furnace. Liquid water is introduced into the water reservoir 300. The water reservoir 300 heats the liquid water to form high-temperature water vapor by absorbing the heat of the high-temperature furnace or the heat of the heater. The high-temperature water vapor forms a uniform pressure steam flow through the porous plate 400, hits the inner top surface of the outer shell 100 to form reverse water vapor, and then the water vapor is injected downward into the high-temperature zone of the high-temperature furnace through the injector 200, so as to achieve uniform cooling of the high-temperature furnace or add water vapor to the high-temperature furnace to participate in the chemical reaction.

[0045] In some embodiments, Figure 5As shown, the water storage 300 includes a water storage body and a water inlet pipe 310. The water storage body is arranged in the mounting hole 210, one end of the water inlet pipe 310 is connected to the water storage body, and the other end of the water inlet pipe 310 extends out of the housing 100. A through hole may be arranged on the side wall of the housing 100, one end of the water inlet pipe 310 is connected to the water storage body, and the other end of the water inlet pipe 310 passes through the through hole on the housing 100 and extends out of the housing 100, so as to continuously introduce liquid water into the water storage body. A sealing ring or a sealant is provided at the connection between the water inlet pipe 310 and the housing 100 for sealing to prevent water vapor leakage.

[0046] Further, such as Figure 5 As shown, the water storage body includes a water storage bottom plate 320 and a water storage side plate 330, the water storage bottom plate 320 and the water storage side plate 330 are connected to form a water storage chamber 340, and the porous plate 400 is installed on the water storage chamber 340; a water inlet chamber 331 is provided in the water storage side plate 330, and the water inlet pipe 310 is connected to the water inlet chamber 331, and one end of the water inlet chamber 331 close to the water storage bottom plate 320 is connected to the water storage chamber 340. A heater can be provided at the bottom of the water storage bottom plate 320, or the water storage bottom plate 320 is in contact with a high-temperature furnace, so as to absorb heat through the water storage bottom plate 320 and heat the liquid water in the water storage chamber 340. A water inlet chamber 331 is provided in the water storage side plate 330. The liquid water in the water inlet pipe 310 first enters the water inlet chamber 331. The bottom side of the water inlet chamber 331 is connected to the water storage chamber 340. The liquid water in the water inlet chamber 331 enters the water storage chamber 340 from the bottom surface of the water storage chamber 340 to disperse the liquid water heating surface and improve the heat exchange efficiency. By storing liquid water in the water storage chamber 340, the heat exchange time can be increased, so that the water storage 300 absorbs more heat from the high-temperature furnace, so as to better achieve cooling and increase the source of water vapor generation.

[0047] The water inlet chamber 331 is annular and is arranged along the circumference of the water storage side plate 330. The water inlet chamber 331 extends to the bottom of the water storage side plate 330. The inner wall of one end of the water storage side plate 330 close to the water storage bottom plate 320 is provided with an annular opening 332 arranged along the circumference of the water storage side plate 330. The annular opening 332 connects the water inlet chamber 331 with the water storage chamber 340. The liquid water in the water inlet chamber 331 can enter the water storage chamber 340 from the annular opening 332 on the inner wall at the bottom of the water storage side plate 330, that is, the liquid water enters the water storage chamber 340 from the bottom surface of the water storage chamber 340, so that the liquid water is in full contact with the water storage bottom plate 320 to improve the heat exchange efficiency.

[0048] In some embodiments, Figure 1 As shown, the bottom surface of the water reservoir 300 is flush with the ejector 200, the top surface of the water reservoir 300 extends out of the ejector 200, and the porous plate 400 is installed on the top surface of the water reservoir 300. The bottom surface of the water reservoir 300 is flush with the ejector 200, which facilitates the bottom surface of the water reservoir 300 to absorb the heat of the high-temperature furnace and makes it easier for the generated water vapor fluid to enter the high-temperature furnace.

[0049] Furthermore, the bottom surface of the housing 100 is open; the bottom surface of the housing 100 extends to the outside of the bottom surface of the ejector 200 along the height direction of the housing 100, or the bottom surface of the housing 100 is flush with the ejector 200. When the bottom surface of the housing 100 extends out of the ejector 200, a threaded structure may be provided on the inner side wall of the lower end of the housing 100, and the lower end of the housing 100 is threadedly connected to the high-temperature furnace, and the high-temperature furnace may extend into the housing 100, so that the water vapor injection device is installed on the high-temperature furnace. When the bottom surface of the housing 100 is flush with the ejector 200, a threaded structure may be provided on the outer side wall of the housing 100, and the bottom of the housing 100 extends into the high-temperature furnace, and the connection between the housing 100 and the high-temperature furnace can also be achieved.

[0050] In some embodiments, the injection hole is a conical hole or a fan-shaped hole, and the end of the injection hole with a small bottom area is arranged toward the top surface of the shell 100, and the end of the injection hole with a large bottom area is arranged toward the bottom surface of the shell 100, that is, the inlet size of the injection hole is small and the outlet size is large. The inlet of the injection hole is arranged toward the water vapor receiving chamber 500, and the outlet of the injection hole is arranged toward the high-temperature furnace. The inlet size of the injection hole can be 0.1mm to 0.3mm to increase the resistance, pressurize the water vapor, and make the water vapor evenly enter each injection hole to improve the uniformity of the injection. The injection hole is conical or fan-shaped, so that the injected water vapor has a certain diffusion angle. By adjusting the outlet shape and size of the injection hole, the diffusion angle and flow distribution of the jet flow can be controlled.

[0051] The present application also provides an embodiment of a high temperature furnace assembly, including a high temperature furnace and the water vapor injection device described in any of the above embodiments, wherein the housing 100 is connected to the high temperature furnace, and the housing 100 and the furnace body of the high temperature furnace can be connected by means of threads, buckles, etc. Further, the water storage 300 absorbs the heat of the high temperature furnace to heat the liquid water in the water storage to generate water vapor.

[0052] During use, the water vapor injection device is installed at the heat concentration point of the high-temperature furnace. When the high-temperature furnace is in operation, a certain flow of liquid water is injected into the water storage tank 300, and the liquid water is injected into the water storage chamber 340 of the water storage tank 300 in a ring shape through the annular opening 332 on the side wall of the water inlet cavity 331. The high-temperature furnace transfers heat to the water storage bottom plate 320 of the water storage tank 300, heats the liquid water in the water storage chamber 340 to form high-temperature water vapor, and forms a uniform pressure steam flow through the porous plate 400, hits the top surface of the shell 100 to form reverse water vapor, and sprays the water vapor evenly into the high-temperature zone of the high-temperature furnace through the annular injector 200.

[0053] During use, the water vapor injection device injects liquid water through the water inlet pipe 310, absorbs heat through the water storage bottom plate 320, heats the liquid water in the water storage chamber 340, and forms water vapor. On the one hand, it absorbs the heat of the high temperature zone of the high temperature furnace and outputs water vapor. The output water vapor can continue to play a role in the high temperature furnace or the reaction furnace, thereby improving the utilization of liquid water and heat. The water inlet chamber 331 structure is added to the water storage tank 300, so that the added liquid water flows into the water storage chamber 340 from the bottom layer to the upper layer first, thereby increasing the heat absorption efficiency; the addition of the porous plate 400 helps to create pressure, and forms a water vapor flow with a certain pressure to pass through the annular injector 200, thereby achieving the purpose of uniform spraying.

[0054] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0055] It should be noted that the above embodiments can be freely combined as needed. The above is only the preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present application, and these improvements and modifications should also be regarded as the protection scope of the present application.

Claims

1. A water vapor injection device, characterized in that: include: shell; An injector is arranged in the housing, a mounting hole is arranged in the middle of the injector, and a plurality of injection holes surrounding the mounting hole are arranged on the injector; A water storage tank is arranged in the installation hole; A porous plate is arranged in the shell and installed above the water reservoir. The porous plate is provided with a plurality of through holes, the through holes are connected to the water reservoir, and a top surface of the porous plate is spaced apart from an inner top surface of the shell.

2. A water vapor injection device according to claim 1, characterized in that: The water storage device comprises a water storage body and a water inlet pipe. The water storage body is arranged in the installation hole. One end of the water inlet pipe is communicated with the water storage body, and the other end extends out of the shell.

3. A water vapor injection device according to claim 2, characterized in that: The water storage body comprises a water storage bottom plate and a water storage side plate, the water storage bottom plate and the water storage side plate are connected to form a water storage chamber, and the porous plate is installed on the water storage chamber; A water inlet cavity is provided in the water storage side plate, the water inlet pipe is communicated with the water inlet cavity, and one end of the water inlet cavity close to the water storage bottom plate is communicated with the water storage chamber.

4. A water vapor injection device according to claim 3, characterized in that: The water inlet cavity is annular and arranged along the circumference of the water storage side plate; An inner side wall of one end of the water storage side plate close to the water storage bottom plate is provided with an annular opening arranged along the circumference of the water storage side plate, and the annular opening communicates the water inlet cavity with the water storage chamber.

5. A water vapor injection device according to any one of claims 1 to 4, characterized in that: The bottom surface of the water reservoir is flush with the ejector, the top surface of the water reservoir extends out of the ejector, and the porous plate is installed on the top surface of the water reservoir.

6. A water vapor injection device according to claim 5, characterized in that: The bottom surface of the housing is open; The bottom surface of the shell extends to outside the bottom surface of the injector along the height direction of the shell; or the bottom surface of the shell is flush with the injector.

7. A water vapor injection device according to any one of claims 1 to 4, characterized in that: The injection hole is a conical hole or a fan-shaped hole, and the end of the injection hole with a smaller bottom area is arranged toward the top surface of the shell, and the end of the injection hole with a larger bottom area is arranged toward the bottom surface of the shell.

8. A water vapor injection device according to any one of claims 1 to 4, characterized in that: The ejector and the porous plate are made of ceramic, and the shell and the water reservoir are made of stainless steel.

9. A water vapor injection device according to any one of claims 1 to 4, characterized in that: It also includes a heater, which is arranged in the shell and is used to heat the water storage tank.

10. A high temperature furnace assembly, characterized in that: It comprises a high-temperature furnace and the water vapor injection device according to any one of claims 1 to 9, wherein the shell is connected to the high-temperature furnace.

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