Light path deflection assembly, camera module and electronic equipment

Abstract

The invention relates to a light path deflection assembly, a camera module and electronic equipment. The optical path deflection assembly comprises an optical film and an optical conduction element, the optical conduction element comprises a first side surface, a second side surface and at least one reflective surface connected between the first side surface and the second side surface, the first side surface is parallel to the second side surface, and the optical conduction element is used for reflecting light through the reflective surface; at least one of the first side face and the second side face is provided with an optical thin film, and when light rays are incident to the optical thin film from the optical conduction element, the optical thin film absorbs the light rays, and according to the optical path deflection assembly, the camera module and the electronic equipment, the optical thin film is used for absorbing the light rays incident to the first side face or the second side face; therefore, the undesirable phenomenon that the light is reflected from the first side surface or the second side surface to enter the image sensor to cause fogging of an imaging picture is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of camera devices, and in particular to an optical path deflection component, a camera module and an electronic device. Background Art

[0002] With the development of mobile phone imaging, consumers have higher and higher requirements for the quality of photos and videos taken by mobile phones, especially for long-range shooting. The longer the focal length of the camera module required for long-range shooting, the larger the size of the camera module will be (especially the height dimension), which contradicts the thinness and lightness of the whole machine.

[0003] In the related art, a prism is usually used to achieve a periscope telephoto shooting effect, thereby utilizing the reflection and deflection of light by the prism to reduce the height size of the camera module.

[0004] However, under this structural setting, stray light can easily be transmitted to the image sensor through the prism, making the image foggy (referred to as "fogging phenomenon"), resulting in unclear imaging. Summary of the invention

[0005] The embodiments of the present application provide an optical path deflection component, a camera module and an electronic device to solve the problem of how to improve the fogging of the imaging picture.

[0006] On the one hand, the present application provides an optical path deflection component, the optical path deflection component comprising:

[0007] Optical films;

[0008] An optical conductive element, comprising a first side surface, a second side surface and at least one reflective surface connected between the first side surface and the second side surface, wherein the first side surface and the second side surface are parallel, and the optical conductive element is used to reflect light through the reflective surface;

[0009] The optical film is disposed on at least one of the first side surface and the second side surface, and when light is incident from the optical conductive element to the optical film, the optical film absorbs the light.

[0010] In one embodiment, the optical film includes a first anti-reflection film layer and a light-absorbing film layer, wherein the first anti-reflection film layer is sandwiched between the optical conductive element and the light-absorbing film layer, and the light-absorbing film layer is used to absorb light passing through the first anti-reflection film layer from the optical conductive element.

[0011] In one embodiment, the optical film includes a second anti-reflection film layer, which is disposed on a side of the light-absorbing film layer facing away from the first anti-reflection film layer, and the light-absorbing film layer is also used to absorb reflected light from the second anti-reflection film layer.

[0012] In one of the embodiments, the light absorbing film layer includes alternately arranged silicon dioxide layers and metal layers, and the refractive index of the metal layer is greater than the refractive index of the silicon dioxide layer.

[0013] In one embodiment, the refractive index of the metal layer is greater than or equal to 2, and the extinction coefficient is greater than or equal to 3.2.

[0014] In one embodiment, the material of the metal layer includes chromium, molybdenum or titanium.

[0015] In one embodiment, the thickness of the metal layer closer to the first anti-reflection film layer is smaller than the thickness of the metal layer farther from the metal layer, and the total thickness of the metal layers is greater than the thickness of the first anti-reflection film layer.

[0016] In one embodiment, the thickness of the optical film is 480nm~560nm, the average reflectivity of the optical film to visible light in the wavelength range of 400nm~700nm is less than or equal to 0.2%, and the maximum reflectivity is less than or equal to 0.6%.

[0017] In one embodiment, the optical transmission element includes at least one trapezoidal prism, and / or the optical transmission element includes at least one triangular prism.

[0018] On the other hand, the present application provides a camera module, which includes a lens, an image sensor and an optical path deflection assembly as described above, wherein the image sensor is spaced apart from the lens, and the optical path deflection assembly is used to deflect the light collected by the lens to the image sensor.

[0019] In one embodiment, the optical transmission element includes a light-transmitting surface, a bottom surface, a first light-reflecting surface, and a second light-reflecting surface, the light-transmitting surface is parallel to the bottom surface, the first side surface and the second side surface are connected between the light-transmitting surface and the bottom surface, and the first side surface and the second side surface are both perpendicular to the light-transmitting surface; the first light-reflecting surface and the second light-reflecting surface are both connected between the light-transmitting surface and the bottom surface, and the first light-reflecting surface and the second light-reflecting surface are both perpendicular to the first side surface; the first light-reflecting surface and the second light-reflecting surface are arranged to be inclined relative to the light-transmitting surface, the optical axis of the image sensor and the optical axis of the lens are both perpendicular to the light-transmitting surface, the lens is opposite to the first light-reflecting surface along its optical axis direction, and the image sensor is opposite to the second light-reflecting surface along its optical axis direction;

[0020] Wherein, the optical path deflection assembly is configured as follows: the light collected by the lens is reflected to the image sensor via the first reflecting surface and the second reflecting surface in sequence; or, the light-transmitting surface includes a first reflecting portion and a second reflecting portion arranged at intervals, and the optical path deflection assembly is configured as follows: the light collected by the lens is reflected to the image sensor via the first reflecting surface, the first reflecting portion, the bottom surface, the second reflecting portion and the second reflecting surface in sequence.

[0021] On the other hand, the present application provides an electronic device, which includes the optical path deflection component as described above.

[0022] In the above-mentioned optical path deflection assembly, camera module and electronic equipment, at least one of the first side surface and the second side surface of the optical transmission element is provided with an optical film, so that the optical film absorbs the light incident to the first side surface or the second side surface, thereby reducing the light reflected from the first side surface or the second side surface into the image sensor and causing the imaging screen to become foggy. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A schematic rear view of an electronic device in one embodiment.

[0025] Figure 2 It is a schematic structural diagram of a camera module in one embodiment.

[0026] Figure 3 It is a schematic structural diagram of a camera module in another embodiment.

[0027] Figure 4 It is a structural schematic diagram of a camera module in yet another embodiment.

[0028] Figure 5 It is a schematic diagram of the structure of the optical transmission element of the optical path deflection assembly in the camera module in one embodiment.

[0029] Figure 6 The diagram is a bottom-up structural diagram of an optical path deflection assembly of a camera module in one embodiment, in which anti-light absorption films are provided on both the first side and the second side of an optical transmission element.

[0030] Figure 7 It is a plan view schematic diagram of the anti-light absorption film of the optical path deflection component in the camera module in one embodiment.

[0031] Figure 8 The diagram is a schematic diagram of the structure when an anti-light absorption film is provided on the first side of the optical transmission element in the optical path deflection assembly of the camera module in one embodiment when viewed from above.

[0032] Fig. 9 The figure is a schematic diagram of the structure of the anti-light absorption film of the optical path deflection component in the camera module in one embodiment.

[0033] Fig.10 The diagram is a schematic diagram of the light-absorbing film layer structure of the anti-light-absorbing film in the optical path deflection assembly of the camera module in one embodiment.

[0034] Fig.11 It is a schematic diagram of the structure of the optical transmission element of the light path deflection assembly in the camera module in another embodiment.

[0035] Fig.12 The present invention is a schematic diagram of the structure of an optical transmission element of an optical path deflection assembly in a camera module in another embodiment.

[0036] Fig.13 A reflectivity curve diagram of an anti-light absorption film in a camera module in one embodiment.

[0037] Fig.14 The optical density value curve of the anti-light absorption film in the camera module in one embodiment.

[0038] Fig.15 The reflectivity curve diagram of the anti-light absorption film in the camera module in another embodiment.

[0039] Fig.16 The optical density value curve diagram of the anti-light absorption film in the camera module in another embodiment.

[0040] Fig.17 Schematic diagram of the structure of an electronic device in one embodiment.

[0041] Reference numerals:

[0042] 10. Electronic device; 11. Shell; 111. Translucent portion; 12. Decorative piece; 20. Camera module; 21. Lens; 22. Image sensor; 23. Light path deflection assembly; 231. Optical transmission element; 231a. Trapezoidal prism; 231b. Prism; 2311. First side surface; 2312. Second side surface; 2313. Translucent surface; 23131. First reflecting portion; 23132. Second reflecting portion; 2314. Bottom surface; 2315. First reflecting surface; 2316. Second reflecting surface; 232. Optical film; 2321. First anti-reflection film layer; 2322. Light absorbing film layer; M1. Silicon dioxide layer; M2. Metal layer; 2323. Second anti-reflection film layer; 24. Filter element. DETAILED DESCRIPTION

[0043] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0044] As used herein, "electronic device" refers to a device that can receive and / or send communication signals, including but not limited to a device that is connected via any one or more of the following connection methods:

[0045] (1) Connection via wired lines, such as Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, and direct cable connection;

[0046] (2) Via wireless interfaces, such as cellular networks, wireless local area networks (WLAN), digital television networks such as DVB-H networks, satellite networks, and AM-FM broadcast transmitters.

[0047] An electronic device configured to communicate via a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0048] (1) Satellite phone or cellular phone;

[0049] (2) Personal Communications System (PCS) terminals that can combine cellular radio telephones with data processing, fax, and data communications capabilities;

[0050] (3) Radiotelephone, pager, Internet / Intranet access, Web browser, notepad, calendar, Personal Digital Assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0051] (4) conventional laptop and / or handheld receivers;

[0052] (5) Conventional laptop and / or palmtop radiotelephone transceivers, etc.

[0053] See also Figure 1As shown, the electronic device 10 includes a housing 11, and the space enclosed by the housing 11 is used to set components of the electronic device 10 such as a camera module 20, a mainboard (not shown) and a battery (not shown). Among them, the mainboard can integrate the processor, power management module, storage unit and baseband chip of the electronic device 10. It can be understood that the electronic device 10 of the embodiment of the present application includes but is not limited to terminal devices such as mobile phones and tablet computers or other portable electronic devices 10.

[0054] In some embodiments, the housing 11 is provided with a light-transmitting portion 111, which may be a light inlet hole penetrating the housing 11, or a structural member such as glass or light-transmitting plastic. Taking the housing 11 provided with a light inlet hole as an example, the camera module 20 is arranged in the space enclosed by the housing 11, and the lens 21 of the camera module 20 is arranged corresponding to the light inlet hole, so that light outside the electronic device 10 can enter the lens 21 to meet the needs of the camera module 20 for imaging.

[0055] Combination Figure 2 As shown, the camera module 20 includes a lens 21, an image sensor 22 and an optical path deflection assembly 23. The image sensor 22 is spaced apart from the lens 21, and the lens 21 and the image sensor 22 are located on the same side of the optical path deflection assembly 23. The optical path deflection assembly 23 is used to deflect the light collected by the lens 21 to the image sensor 22.

[0056] The image sensor 22 includes but is not limited to a charge coupled device (CCD) or a complementary metal oxide semiconductor device (CMOS Sensor).

[0057] It should be noted that the number of times the light path deflection component 23 deflects the light can be 2 times, or 3 times or more.

[0058] For example, Figure 2 As shown, the light path deflection component 23 deflects the light collected by the lens 21 twice and then makes it incident on the image sensor 22 .

[0059] For example, Figure 3 As shown, the light path deflection component 23 deflects the light collected by the lens 21 three times and then makes it incident on the image sensor 22 .

[0060] For example, Figure 4 As shown, the light path deflection component 23 deflects the light collected by the lens 21 five times and then makes it incident on the image sensor 22 .

[0061] The number of times the light path deflection component 23 deflects the light can also be 7 times or more, which will not be described in detail here.

[0062] Combination Figures 2 to 4 As shown, as the number of times the light path deflection assembly 23 deflects the light increases, the propagation path of the light in the light path deflection assembly 23 increases, thereby increasing the focal length between the lens 21 and the image sensor 22, which is beneficial to the telephoto shooting effect. At the same time, by deflecting the light multiple times, the size of the light path deflection assembly 23 along the optical axis direction of the lens 21 (i.e., the thickness of the light path deflection assembly 23) can also be made smaller, thereby facilitating the reduction of the height of the camera module 20, so as to facilitate the miniaturization of the camera module 20.

[0063] In some embodiments, the camera module 20 further includes a filter element 24, which is disposed in the optical path of the light emitted from the optical path deflection assembly 23 to the image sensor 22. The filter element 24 is used to filter out interference light emitted from the optical path deflection assembly 23 to prevent the interference light from reaching the image sensor 22 and affecting normal imaging. In one embodiment, the filter element 24 may be an infrared cutoff filter.

[0064] The inventor found that during the multiple deflection of the light in the optical path deflection assembly 23, some of the light will be reflected in the optical path deflection assembly 23 and finally enter the image sensor 22, and this part of the light will cause the image of the image sensor 22 to be foggy, that is, this part of the light is the "stray light" that is not expected for the camera module 20. Through further research, the inventor found that this part of the stray light is mainly caused by the reflection of the light by the side of the optical path deflection assembly 23. Among them, the side can be understood as a surface that is roughly parallel to the optical axis of the lens 21. Specifically, the side is roughly parallel to the optical axis of the lens 21. Therefore, during the shooting process of the camera module 20, it is not expected to use the side to reflect the light collected by the lens 21 to the image sensor 22. In fact, since the light collected by the lens 21 is propagated in a cone shape, some of the light will be reflected by the side and enter the image sensor 22, causing adverse interference to the imaging of the image sensor 22.

[0065] Combination Figures 5 to 7 As shown, in the embodiment of the present application, the optical path deflection component 23 includes an optical conductive element 231 and an optical film 232. The optical conductive element 231 includes a first side surface 2311, a second side surface 2312, and at least one reflective surface connected between the first side surface 2311 and the second side surface 2312. The first side surface 2311 and the second side surface 2312 are parallel. The optical conductive element 231 is used to reflect the light through the reflective surface, so that the optical path deflection component 23 can deflect the light and change the propagation direction of the light.

[0066] The optical film 232 is disposed on at least one of the first side surface 2311 and the second side surface 2312. When light is incident from the optical conductive element 231 to the optical film 232, the optical film 232 absorbs the light. In this embodiment, the optical film 232 absorbs the light incident to the first side surface 2311 or the second side surface 2312, thereby reducing the undesirable phenomenon of fogging of the imaging screen caused by stray light generated by light reflected from the first side surface 2311 or the second side surface 2312.

[0067] It should be noted that, in the present application, since an optical film 232 is provided on at least one of the first side surface 2311 and the second side surface 2312, the fogging phenomenon of the imaging screen can be improved. In this way, the fogging phenomenon of the imaging screen can be improved without the need to cut grooves and apply ink on the groove walls on the first side surface 2311 and the second side surface 2312 of the optical conductive element 231. This avoids the problem that the structural strength of the optical conductive element 231 decreases due to the grooves, resulting in poor anti-drop performance.

[0068] In addition, compared to the related art, in consideration of the light from the first side 2311 and the second side 2312 entering the image sensor 22, the optical transmission element 231 is used to receive the optical light collection area of ​​the lens 21 and needs to set an ink silk screen area to block the light from entering the first side 2311 or the second side 2312, which will cause the area of ​​the light-transmitting area to shrink and cause the illumination at the edge of the image to decrease, resulting in the risk of dark edges. The optical path deflection structure of the present application can absorb light based on the optical film 232, reducing the light reflected from the first side 2311 or the second side 2312 into the image sensor 22. Therefore, in the embodiment of the present application, after the optical film 232 is set on the first side 2311 or the second side 2312, there is no need to worry about the light from entering the first side 2311 or the second side 2312, so that the area of ​​the light-transmitting area can be increased to improve the imaging effect.

[0069] In some embodiments, Figure 6 As shown, the first side surface 2311 and the second side surface 2312 may be both provided with an optical film 232, so that the light incident on the first side surface 2311 can be absorbed by the optical film 232 provided on the first side surface 2311, and the light incident on the second side surface 2312 can be absorbed by the optical film 232 provided on the second side surface 2312. In this way, stray light will not be reflected from the first side surface 2311 or the second side surface 2312 and enter the image sensor 22, thereby eliminating the reflected light from the first side surface 2311 or the second side surface 2312 entering the image sensor 22 and interfering with the imaging effect, so as to improve the fogging phenomenon of the imaging screen.

[0070] like Figure 8As shown, in some embodiments, the optical film 232 may be disposed only on the first side surface 2311 , so that the light incident on the first side surface 2311 will have a lower probability of reflection due to the action of the optical film 232 , thereby improving the fogging phenomenon of the imaging screen.

[0071] The optical film 232 includes a first anti-reflection film layer 2321 and a light absorbing film layer 2322. The first anti-reflection film layer 2321 is sandwiched between the optical conductive element 231 and the light absorbing film layer 2322, so that the light will reduce reflection when it enters the first anti-reflection film layer 2321. The light absorbing film layer 2322 is used to absorb the light that passes through the first anti-reflection film layer 2321 from the optical conductive element 231, so that the light absorbing film layer 2322 absorbs the light, thereby reducing the probability of the reflected light entering the optical conductive element 231 again and becoming stray light, thereby improving the fogging phenomenon of the imaging screen.

[0072] Combination Fig. 9 As shown, the optical film 232 includes a second anti-reflection film layer 2323, which is disposed on the side of the light absorbing film layer 2322 facing away from the first anti-reflection film layer 2321. The light absorbing film layer 2322 is also used to absorb the reflected light of the second anti-reflection film layer 2323.

[0073] In this embodiment, the light-absorbing film layer 2322 is arranged between the first anti-reflection film layer 2321 and the second anti-reflection film layer 2323, which can not only realize the anti-reflection effect of the first anti-reflection film layer 2321 and the second anti-reflection film layer 2323 on light, that is, reduce the reflection of light; at the same time, the light-absorbing film layer 2322 between the first anti-reflection film layer 2321 and the second anti-reflection film layer 2323 can fully absorb the two kinds of light between the two, thereby helping to improve the anti-reflection and absorption effect of the optical film 232 on light, and reduce the probability of light being reflected into the image sensor 22, which is beneficial to improve the fogging phenomenon of the imaging picture.

[0074] It should be noted here that based on the evanescent wave principle: the evanescent wave refers to a wave generated at the interface between two different media due to total reflection. The evanescent wave generated by total reflection penetrates into the optically sparse medium to a depth of about one wavelength, then flows along the interface for about half a wavelength before returning to the optically dense medium.

[0075] In the embodiment of the present application, if light is totally reflected from the optical conductive element 231 at the first side 2311 or the second side 2312, the evanescent wave generated by the total reflection will flow in the optical film 232, so that the light absorbing film layer 2322 in the optical film 232 can reduce the amount of light returning to the optical conductive element 231 by absorbing the evanescent wave, that is, the effect of reducing the reflectivity of the light is achieved, and the probability of the light reflecting from the first side 2311 or the second side 2312 to the image sensor 22 and causing fogging of the imaging screen is reduced, thereby improving the fogging phenomenon of the imaging screen.

[0076] Combination Fig.10 As shown, in some embodiments, the light absorbing film layer 2322 includes silicon dioxide layers M1 and metal layers M2 that are alternately arranged. That is, the light absorbing film layer 2322 includes multiple metal layers M2, and the multiple metal layers M2 are separated by silicon dioxide layers M1. In this way, the silicon dioxide layer M1 can improve the protection of the metal layer M2 by sandwiching the metal layer M2, reduce the probability of damage to the metal layer M2, and thus facilitate the metal layer M2 to absorb light stably, reduce the reflectivity of the first side 2311 or the second side 2312 provided with the optical film 232, and reduce the reflected light of the first side 2311 or the second side 2312 entering the image sensor 22 and causing the imaging screen to be fogged.

[0077] The refractive index of the metal layer M2 is greater than the refractive index of the silicon dioxide layer M1, so that when the light propagates in the light-absorbing film layer 2322, refraction will occur at the interface between the metal layer M2 and the silicon dioxide layer M1. When the incident angle of the light exceeds the critical angle, the light will be totally reflected at the metal layer M2 and the silicon dioxide layer M1. In this way, the evanescent wave generated by the total reflection flows in the metal layer M2 as much as possible to improve the absorption effect of the metal layer M2 on the evanescent wave, and further reduce the probability of the first side 2311 or the second side 2312 reflecting the light to the image sensor 22, so that the camera module 20 can obtain better image quality.

[0078] In some embodiments, the metal layer M2 has a refractive index greater than or equal to 2, and an extinction coefficient greater than or equal to 3.2.

[0079] For metal materials, the formula for the reflectivity of vertically incident light in air is as follows:

[0080]

[0081] Where R is the reflectivity, n is the refractive index, and k is the extinction coefficient.

[0082] According to the above formula, the reflectivity R is inversely proportional to the refractive index n of the metal material, and the absorptivity is proportional to the extinction coefficient k of the metal material. Therefore, in the embodiment of the present application, the refractive index of the metal layer M2 is greater than or equal to 2, and the extinction coefficient is greater than or equal to 3.2. In this way, the metal layer M2 has a large refractive index on the one hand and a large extinction coefficient on the other hand, so that low reflectivity and high absorptivity can be obtained, thereby reducing the reflected light entering the image sensor 22 and improving the fogging phenomenon of the imaging screen.

[0083] Furthermore, based on the fact that the reflectivity R is inversely proportional to the refractive index n of the metal material, the absorptivity is proportional to the extinction coefficient k of the metal material. The metal material used for the metal layer M2 of the present application has a large refractive index and a large extinction coefficient. For example, in some embodiments, the material of the metal layer M2 includes chromium, molybdenum or titanium. Thus, the metal layer M2 made of these materials can obtain low reflectivity and high absorptivity at the same time, so as to reduce the reflected light entering the image sensor 22 and improve the fogging phenomenon of the imaging screen.

[0084] In some embodiments, the thickness of the metal layer M2 closer to the first anti-reflection film layer 2321 is less than the thickness of the metal layer M2 farther from the metal layer M2. Therefore, after the light emitted from the optical conductive element 231 to the optical film 232 passes through the light absorbing film layer 2322 from the first anti-reflection film layer 2321, the propagation path of the light in the multi-layer metal layer M2 is to first pass through the thinner metal layer M2 and then pass through the thicker metal layer M2. Since the evanescent wave penetrates into the optically sparse medium to a depth of about one wavelength, and then flows along the interface for about half a wavelength before returning to the optically dense medium, the metal layer M2 farther from the first anti-reflection film layer 2321 is set to be thicker, which is conducive to absorbing the light wave at the corresponding wave crest position of the evanescent wave, thereby improving the light absorption effect.

[0085] It should be noted that, in this embodiment, the total thickness of the metal layer M2 is greater than the thickness of the first anti-reflection film layer 2321, so that the thickness of the metal layer M2 in the optical film 232 accounts for a sufficiently large proportion to improve the light absorption effect.

[0086] In some embodiments, the thickness of the optical film 232 is 480nm~560nm. The average reflectivity of the optical film 232 to visible light in the wavelength range of 400nm~700nm is less than or equal to 0.2%, and the maximum reflectivity is less than or equal to 0.6%. In this embodiment, through the configuration of the optical film 232, the totally reflected light corresponding to a wavelength value (e.g., 550nm) of the evanescent wave can be efficiently absorbed to reduce the reflectivity. In this way, the optical film 232 disposed on the first side 2311 and / or the second side 2312 of the optical conductive element 231 can reduce the probability of reflected light entering the image sensor 22, so as to improve the fogging phenomenon of the imaging screen.

[0087] In some embodiments, the first anti-reflection film layer 2321 may include a silicon dioxide layer and a titanium dioxide layer. The light absorbing film layer 2322 is disposed on the side of the titanium dioxide layer facing away from the silicon dioxide layer.

[0088] For ease of understanding, the layer structure of the optical film 232 is described below in conjunction with the structures of the first anti-reflection film layer 2321 and the light-absorbing film layer 2322 .

[0089] In some embodiments, the metal film in the light absorbing film layer 2322 is chromium (Cr) as an example. In combination with the following Table 1:

[0090] Table 1

[0091]

[0092] In Table 1, SIO2 represents the silicon dioxide layer M1, TIO2 represents the titanium dioxide layer, and Cr represents the metal layer M2 whose material is metal chromium. As can be seen from Table 1, the total thickness of the optical film 232 in Table 1 is 483.64nm, which is slightly less than one wavelength value of the evanescent wave (550nm). Among them, the silicon dioxide layer and the titanium dioxide layer of the first anti-reflection film layer 2321 are 15nm and 12.72nm thick respectively, and the thickness of the silicon dioxide layer M1 and the metal layer M2 alternately arranged in the light absorption film layer 2322 are 25.73nm, 4.04nm, 114.67nm, 9.59nm, 101.9nm, 150nm and 50nm.

[0093] At a reference wavelength λ=550 nm, the refractive index of SIO2 is 1.46, the refractive index of TIO2 is 2.45, the refractive index of Cr is 3.18, and the extinction coefficient of Cr is k=4.41. In some embodiments, the optical transmission element 231 may be made of H-K9L glass with a refractive index of 1.52.

[0094] By allowing the light in the optical conductive element 231 to be incident on the optical film 232 for optical testing, a reflectivity curve graph and an optical density value curve graph of the optical film 232 can be obtained.

[0095] Fig.13 The reflectivity curve of the optical film 232 is shown, with the horizontal axis being the wavelength and the vertical axis being the reflectivity. Fig.13As shown, according to the reflectivity curve of the optical film 232, it can be seen that the maximum reflectivity of the optical film 232 for visible light in the wavelength range of 400nm~700nm is 0.52% (at 400nm), and the average reflectivity is 0.15%. It can be seen that the reflectivity of the optical film 232 is low enough to effectively absorb light and reduce the reflection of light, thereby effectively reducing the reflection of light from the first side 2311 or the second side 2312 of the optical conductive element 231 to the image sensor 22, so as to reduce the probability of fogging of the imaging screen.

[0096] Combination Fig.14 The optical density value curve of the optical film 232 is shown, with the horizontal axis being the wavelength and the vertical axis being the OD value. It should be noted that the OD value is the abbreviation of optical density, which indicates the light density absorbed by the object being detected. Optical density has no dimension unit and is a logarithmic value. The calculation formula is OD=lg(incident light / transmitted light) or OD=lg(1 / transmittance).

[0097] Combination Fig.14 It can be seen that among the light incident from the optical conductive element 231 to the optical film 232, a portion of the light is absorbed when it enters the optical film 232. The maximum OD value of the optical film 232 for visible light in the wavelength range of 400nm to 700nm is 8.45 (at 490nm), and the average OD value is 7.69. Therefore, the optical film 232 can effectively absorb light to effectively reduce the first side surface 2311 or the second side surface 2312 from reflecting light to the image sensor 22, thereby reducing the probability of fogging of the imaging screen.

[0098] In another embodiment, the metal film in the light absorbing film layer 2322 is titanium (Ti) as an example. Combined with the following Table 2:

[0099] Table 2

[0100]

[0101] In Table 2, SIO2 represents the silicon dioxide layer M1, TIO2 represents the titanium dioxide layer, and Cr represents the metal layer M2 whose material is metal chromium. As can be seen from Table 2, the total thickness of the optical film 232 in Table 2 is 553.79nm, which is slightly larger than the wavelength value of the evanescent wave (550nm). Among them, the silicon dioxide layer and the titanium dioxide layer of the first anti-reflection film layer 2321 are 15nm and 11.28nm thick respectively, and the thickness of the silicon dioxide layer M1 and the metal layer M2 alternately arranged in the light absorption film layer 2322 are 23.49nm, 9.67nm, 101.94nm, 17.15nm, 75.26nm, 250nm and 50nm.

[0102] At a reference wavelength λ=550 nm, the refractive index of SIO2 is 1.46, the refractive index of TIO2 is 2.45, the refractive index of Ti is 2.0, and the extinction coefficient of Ti is k=2.27. In some embodiments, the optical transmission element 231 may be made of H-K9L glass with a refractive index of 1.52.

[0103] By allowing the light in the optical conductive element 231 to be incident on the optical film 232 for optical testing, a reflectivity curve graph and an optical density (Optical Density) value curve graph of the optical film 232 can be obtained.

[0104] Fig.15 The reflectivity curve of the optical film 232 is shown, with the horizontal axis being the wavelength and the vertical axis being the reflectivity. Fig.15 As shown, according to the reflectivity curve of the optical film 232, it can be seen that the maximum reflectivity of the optical film 232 for visible light in the wavelength range of 400nm~700nm is 0.12% (at 575nm), and the average reflectivity is 0.06%. It can be seen that the reflectivity of the optical film 232 is low enough to effectively absorb light and reduce the reflection of light, thereby effectively reducing the reflection of light from the first side 2311 or the second side 2312 of the optical conductive element 231 to the image sensor 22, so as to reduce the probability of fogging of the imaging screen.

[0105] Combination Fig.16 The optical density curve of the optical film 232 is shown, with the horizontal axis being the wavelength and the vertical axis being the OD value. Fig.16 It can be seen that among the light incident from the optical conductive element 231 to the optical film 232, a portion of the light is absorbed when it enters the optical film 232. The maximum OD value of the optical film 232 for visible light in the wavelength range of 400nm to 700nm is 6.75 (at 400nm), and the average OD value is 5.98. Therefore, the optical film 232 can effectively absorb light to effectively reduce the first side surface 2311 or the second side surface 2312 from reflecting light to the image sensor 22, thereby reducing the probability of fogging of the imaging screen.

[0106] Tables 1 and 2 above only illustrate the thickness of each layer structure of the optical film 232 in some embodiments. The thickness of the first anti-reflection film layer 2321 and the light absorption film layer 2322 of the present application is not limited thereto.

[0107] For example, in some embodiments, the metal layer M2 in the light absorbing film layer 2322 may be made of other metal materials such as molybdenum in addition to chromium or titanium. The metal layer M2 made of chromium material may be referred to as a "chromium layer", the metal layer M2 made of titanium material may be referred to as a "titanium layer", and the metal layer M2 made of molybdenum material may be referred to as a "molybdenum layer". Based on this, the metal layer M2 may include alternately arranged silicon dioxide layers M1 and chromium layers; or the metal layer M2 may include alternately arranged silicon dioxide layers M1 and titanium layers; or the metal layer M2 may include alternately arranged silicon dioxide layers M1 and molybdenum layers.

[0108] For the metal layer M2 made of different materials, its thickness in the light absorbing film layer 2322 can be adjusted accordingly.

[0109] In some embodiments, the thickness of the silicon dioxide layer of the first anti-reflection film layer 2321 is 10 nm to 20 nm, and the thickness of the titanium dioxide layer of the first anti-reflection film layer 2321 is 11 nm to 15 nm.

[0110] For example, the thickness of the silicon dioxide layer of the first anti-reflection film layer 2321 is 10 nm, and the thickness of the titanium dioxide layer of the first anti-reflection film layer 2321 is 11 nm. Alternatively, the thickness of the silicon dioxide layer of the first anti-reflection film layer 2321 is 20 nm, and the thickness of the titanium dioxide layer of the first anti-reflection film layer 2321 is 15 nm. Alternatively, the thickness of the silicon dioxide layer of the first anti-reflection film layer 2321 is 20 nm, and the thickness of the titanium dioxide layer of the first anti-reflection film layer 2321 is 11 nm.

[0111] The thickness of the silicon dioxide layer and the titanium dioxide layer in the first anti-reflection film layer 2321 are not described in detail here.

[0112] The thicknesses of the silicon dioxide layer M1 and the metal layer M2 alternately arranged in sequence in the light absorbing film layer 2322 are 20nm~27nm, 4nm~10nm, 90nm~115nm, 8nm~20nm, 75nm~110nm, 130nm~160nm and 45nm~55nm.

[0113] For example, the thickness of the silicon dioxide layer M1 and the metal layer M2 alternately arranged in the light absorbing film layer 2322 is 20nm, 4nm, 90nm, 8nm, 110nm, 160nm and 45nm. Alternatively, the thickness of the silicon dioxide layer M1 and the metal layer M2 alternately arranged in the light absorbing film layer 2322 is 27nm, 10nm, 90nm, 20nm, 75nm, 160nm and 55nm. Alternatively, the thickness of the silicon dioxide layer M1 and the metal layer M2 alternately arranged in the light absorbing film layer 2322 is 20nm, 10nm, 90nm, 20nm, 110nm, 130nm and 55nm. Alternatively, the thickness of the silicon dioxide layer M1 and the metal layer M2 alternately arranged in the light absorbing film layer 2322 is 27nm, 4nm, 115nm, 20nm, 75nm, 130nm and 45nm. Alternatively, the thicknesses of the silicon dioxide layer M1 and the metal layer M2 alternately arranged in sequence in the light absorbing film layer 2322 are 27 nm, 10 nm, 90 nm, 20 nm, 75 nm, 130 nm and 45 nm.

[0114] The thickness of the silicon dioxide layer and the titanium dioxide layer in the first anti-reflection film layer 2321 are not described in detail here.

[0115] In the embodiment of the present application, the optical transmission element 231 may be an integral prism or a combination of multiple prisms.

[0116] The optical transmission element 231 includes at least one trapezoidal prism, and / or the optical transmission element 231 includes at least one triangular prism.

[0117] For example, combined with Fig.11 As shown, the optical transmission element 231 includes a trapezoidal prism 231a and a triangular prism 231b. The cross section of the optical transmission element 231 formed by the combination of the triangular prism 231b and the trapezoidal prism 231a is trapezoidal. It can be understood that the optical transmission element 231 is a larger trapezoidal prism supported by the combination of the trapezoidal prism 231a and the triangular prism 231b. Fig.12 As shown, the optical transmission element 231 includes three trapezoidal prisms 231 a , and two trapezoidal prisms 231 a are combined to form a larger-sized trapezoidal prism.

[0118] The number and type of prisms in the optical transmission element 231 are not elaborated again, as long as the optical transmission element 231 as a whole can adapt to the deflection of the light collected by the lens 21 so that the light enters the image sensor 22 to meet the shooting needs of the camera module 20.

[0119] It should be noted that, in the embodiment where the optical transmission element 231 is composed of a plurality of prisms, the plurality of prisms may be connected first, and then the optical film 232 may be disposed on the first side surface 2311 or the second side surface 2312 of the optical transmission element 231. Alternatively, the optical film 232 may be disposed on the side surface of each prism separately, and then the plurality of prisms may be combined together. As long as the optical film 232 is disposed on the first side surface 2311 or the second side surface 2312 of the final optical transmission element 231, the optical film 232 may be used to reduce the amount of reflected light from the first side surface 2311 or the second side surface 2312 entering the image sensor 22, so as to improve the image fogging phenomenon.

[0120] The shape of the optical film 232 may be consistent with the shape of the first side surface 2311 and the second side surface 2312, so as to completely cover the first side surface 2311 or the second side surface 2312. Of course, in some embodiments, the optical film 232 only needs to cover the area of ​​the first side surface 2311 and the second side surface 2312 that is easy to reflect light to the image sensor 22 and interfere with imaging. Therefore, the coverage area of ​​the optical film 232 on the first side surface 2311 or the second side surface 2312 is not limited here.

[0121] For ease of understanding, the optical path configuration of the optical path deflection component 23 between the lens 21 and the image sensor 22 is described below in conjunction with the structure of the optical transmission element 231, but this does not mean that the structure of the optical path deflection component 23 of the present application and its optical path are limited to this.

[0122] Recombination Figures 2 to 4 As shown, the optical conductive element 231 includes a light-transmitting surface 2313 , a bottom surface 2314 , a first light-reflecting surface 2315 and a second light-reflecting surface 2316 . The light-transmitting surface 2313 is parallel to the bottom surface 2314, the first side surface 2311 and the second side surface 2312 are connected between the light-transmitting surface 2313 and the bottom surface 2314, and the first side surface 2311 and the second side surface 2312 are both perpendicular to the light-transmitting surface 2313; the first reflecting surface 2315 and the second reflecting surface 2316 are both connected between the light-transmitting surface 2313 and the bottom surface 2314, and the first reflecting surface 2315 and the second reflecting surface 2316 are both perpendicular to the first side surface 2311; the first reflecting surface 2315 and the second reflecting surface 2316 are inclined relative to the light-transmitting surface 2313, the optical axis of the image sensor 22 and the optical axis of the lens 21 are both perpendicular to the light-transmitting surface 2313, the lens 21 is opposite to the first reflecting surface 2315 along its optical axis, and the image sensor 22 is opposite to the second reflecting surface 2316 along its optical axis.

[0123] In some embodiments, in combination Figure 2As shown, the optical path deflection component 23 is configured such that the light collected by the lens 21 is reflected to the image sensor 22 via the first reflecting surface 2315 and the second reflecting surface 2316 in sequence.

[0124] It should be noted that the light reflected by the first reflecting surface 2315 and the second reflecting surface 2316 in sequence includes the situation where the light reflected by the first reflecting surface 2315 is directly incident on the second reflecting surface 2316 , and also includes the situation where the light emitted by the first reflecting surface 2315 is reflected by other surfaces of the optical transmission element 231 to the second reflecting surface 2316 .

[0125] For example, in some embodiments, the optical path deflection assembly 23 is configured such that the light collected by the lens 21 is reflected to the image sensor 22 via the first reflective surface 2315 , the light-transmitting surface 2313 , and the second reflective surface 2316 in sequence.

[0126] For example, in some embodiments, in combination Figure 4 As shown, the light-transmitting surface 2313 includes a first reflecting portion 23131 and a second reflecting portion 23132 that are spaced apart, and the optical path deflection assembly 23 is configured as follows: the light collected by the lens 21 is reflected to the image sensor 22 via the first reflecting surface 2315, the first reflecting portion 23131, the bottom surface 2314, the second reflecting portion 23132 and the second reflecting surface 2316 in sequence.

[0127] In the above-mentioned embodiments, the optical path deflection component 23 is used to realize multiple deflections of the light, thereby meeting the needs of telephoto shooting while realizing the miniaturization of the camera module 20.

[0128] refer to Fig.17 , Fig.17 The electronic device 10 is a schematic diagram of the structure of the electronic device 10 provided in the embodiment of the present application. The electronic device 10 may include a radio frequency (RF) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless fidelity (WiFi) module 507, a processor 508 including one or more processing cores, and a power supply 509. Those skilled in the art will understand that Fig.17 The structure of the electronic device 10 shown in the figure does not constitute a limitation on the electronic device 10, and the electronic device 10 may include more or less components than shown in the figure, or combine certain components, or arrange the components differently.

[0129] The radio frequency circuit 501 can be used to send and receive information, or receive and send signals during a call. In particular, after receiving the downlink information of the base station, it is handed over to one or more processors 508 for processing; in addition, the data related to the uplink is sent to the base station. Generally, the radio frequency circuit 501 includes but is not limited to an antenna, at least one amplifier, a tuner, one or more oscillators, a subscriber identity module (SIM) card, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, etc. In addition, the radio frequency circuit 501 can also communicate with the network and other devices through wireless communication. The wireless communication can use any communication standard or protocol, including but not limited to the Global System of Mobile Communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Messaging Service (SMS), etc.

[0130] The memory 502 can be used to store applications and data. The applications stored in the memory 502 contain executable codes. The applications can form various functional modules. The processor 508 executes various functional applications and data processing by running the applications stored in the memory 502. The memory 502 can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data created according to the use of the electronic device 10 (such as audio data, a phone book, etc.), etc. In addition, the memory 502 can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage devices. Accordingly, the memory 502 can also include a memory controller to provide the processor 508 and the input unit 503 with access to the memory 502.

[0131] The input unit 503 can be used to receive input digital, character information or user feature information (such as fingerprints), and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control. Specifically, in a specific embodiment, the input unit 503 may include a touch-sensitive surface and other input devices. The touch-sensitive surface, also known as a touch display screen or a touch pad, can collect user touch operations on or near it (such as operations performed by users using fingers, styluses, or any other suitable objects or accessories on or near the touch-sensitive surface), and drive corresponding connection devices according to a pre-set program. Optionally, the touch-sensitive surface may include a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch orientation, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then sends it to the processor 508, and can receive and execute commands sent by the processor 508.

[0132] The display unit 504 can be used to display information input by the user or information provided to the user and various graphical user interfaces of the electronic device 10, which can be composed of graphics, text, icons, videos and any combination thereof. The display unit 504 may include a display panel. Optionally, the display panel can be configured in the form of a liquid crystal display (LCD, Liquid Crystal Display), an organic light-emitting diode (OLED, Organic Light-Emitting Diode), etc. Further, the touch-sensitive surface may cover the display panel, and when the touch-sensitive surface detects a touch operation on or near it, it is transmitted to the processor 508 to determine the type of touch event, and then the processor 508 provides a corresponding visual output on the display panel according to the type of touch event. Although in Fig.17 In the embodiment, the touch sensitive surface and the display panel are used as two independent components to implement input and output functions, but in some embodiments, the touch sensitive surface and the display panel can be integrated to implement input and output functions. It can be understood that the display screen can include an input unit 503 and a display unit 504.

[0133] The electronic device 10 may also include at least one sensor 505, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel according to the brightness of the ambient light, and the proximity sensor may turn off the display panel and / or backlight when the electronic device 10 is moved to the ear. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally three axes), and can detect the magnitude and direction of gravity when stationary. It can be used for applications that identify the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc. that can also be configured in the electronic device 10, they will not be repeated here.

[0134] The audio circuit 506 can provide an audio interface between the user and the electronic device 10 through a speaker and a microphone. The audio circuit 506 can convert the received audio data into an electrical signal, transmit it to the speaker, and convert it into a sound signal for output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 506 and converted into audio data, and then the audio data is output to the processor 508 for processing, and then sent to another electronic device 10 through the radio frequency circuit 501, or the audio data is output to the memory 502 for further processing. The audio circuit 506 may also include an earphone socket to provide communication between an external earphone and the electronic device 10.

[0135] Wireless Fidelity (WiFi) is a short-range wireless transmission technology. The electronic device 10 can help users send and receive emails, browse web pages, and access streaming media through the wireless fidelity module 507, which provides users with wireless broadband Internet access. Fig.17 The wireless fidelity module 507 is shown, but it is understandable that it is not a necessary component of the electronic device 10 and can be omitted as needed without changing the essence of the invention.

[0136] The processor 508 is the control center of the electronic device 10. It uses various interfaces and lines to connect various parts of the entire electronic device 10. By running or executing applications stored in the memory 502 and calling data stored in the memory 502, it executes various functions of the electronic device 10 and processes data, thereby monitoring the electronic device 10 as a whole. Optionally, the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, and the modem processor mainly processes wireless communications. It is understandable that the above-mentioned modem processor may not be integrated into the processor 508.

[0137] The electronic device 10 also includes a power supply 509 for supplying power to various components. Preferably, the power supply 509 can be logically connected to the processor 508 through a power management system, so that the power management system can manage charging, discharging, and power consumption. The power supply 509 can also include one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0138] although Fig.17 Not shown, the electronic device 10 may also include a Bluetooth module, etc., which will not be described in detail here. In specific implementation, the above modules can be implemented as independent entities, or can be arbitrarily combined and implemented as the same or several entities. The specific implementation of the above modules can refer to the previous method embodiment, which will not be described in detail here.

[0139] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0140] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. An optical path deflection component, characterized in that: The optical path deflection component comprises: Optical films; An optical conductive element, comprising a first side surface, a second side surface and at least one reflective surface connected between the first side surface and the second side surface, wherein the first side surface and the second side surface are parallel, and the optical conductive element is used to reflect light through the reflective surface; The optical film is disposed on at least one of the first side surface and the second side surface, and when light is incident from the optical conductive element to the optical film, the optical film absorbs the light.

2. The optical path deflection assembly according to claim 1, characterized in that: The optical film comprises a first anti-reflection film layer and a light-absorbing film layer, wherein the first anti-reflection film layer is sandwiched between the optical conductive element and the light-absorbing film layer, and the light-absorbing film layer is used for absorbing light from the optical conductive element passing through the first anti-reflection film layer.

3. The optical path deflection assembly according to claim 2, characterized in that: The optical film comprises a second anti-reflection film layer, which is arranged on a side of the light-absorbing film layer facing away from the first anti-reflection film layer, and the light-absorbing film layer is further used for absorbing reflected light from the second anti-reflection film layer.

4. The optical path deflection assembly according to claim 2 or 3, characterized in that: The light absorbing film layer comprises silicon dioxide layers and metal layers which are alternately arranged, and the refractive index of the metal layer is greater than the refractive index of the silicon dioxide layer.

5. The optical path deflection assembly according to claim 4, characterized in that: The refractive index of the metal layer is greater than or equal to 2, and the extinction coefficient is greater than or equal to 3.

2.

6. The optical path deflection assembly according to claim 5, characterized in that: The material of the metal layer includes chromium, molybdenum or titanium.

7. The optical path deflection assembly according to claim 4, characterized in that: The thickness of the metal layer closer to the first anti-reflection film layer is smaller than the thickness of the metal layer farther from the metal layer, and the total thickness of the metal layers is greater than the thickness of the first anti-reflection film layer.

8. The optical path deflection assembly according to claim 1, characterized in that: The thickness of the optical film is 480nm~560nm, the average reflectivity of the optical film to visible light in the wavelength band of 400nm~700nm is less than or equal to 0.2%, and the maximum reflectivity is less than or equal to 0.6%.

9. The optical path deflection assembly according to claim 1, characterized in that: The optical transmission element includes at least one trapezoidal prism, and / or the optical transmission element includes at least one triangular prism.

10. A camera module, characterized in that: The camera module includes a lens, an image sensor and an optical path deflection assembly as described in any one of claims 1 to 9, wherein the image sensor is spaced apart from the lens, and the optical path deflection assembly is used to deflect the light collected by the lens to the image sensor.

11. The camera module according to claim 10, characterized in that: The optical transmission element comprises a light-transmitting surface, a bottom surface, a first light-reflecting surface and a second light-reflecting surface, the light-transmitting surface is parallel to the bottom surface, the first side surface and the second side surface are connected between the light-transmitting surface and the bottom surface, and the first side surface and the second side surface are both perpendicular to the light-transmitting surface; the first light-reflecting surface and the second light-reflecting surface are both connected between the light-transmitting surface and the bottom surface, and the first light-reflecting surface and the second light-reflecting surface are both perpendicular to the first side surface; the first light-reflecting surface and the second light-reflecting surface are arranged to be inclined relative to the light-transmitting surface, the optical axis of the image sensor and the optical axis of the lens are both perpendicular to the light-transmitting surface, the lens is opposite to the first light-reflecting surface along its optical axis direction, and the image sensor is opposite to the second light-reflecting surface along its optical axis direction; Wherein, the optical path deflection component is configured such that the light collected by the lens is reflected to the image sensor via the first reflecting surface and the second reflecting surface in sequence.

12. The camera module according to claim 11, characterized in that: The optical path deflection assembly is configured such that: the light collected by the lens is reflected to the image sensor via the first light reflecting surface, the light transmitting surface and the second light reflecting surface in sequence; Alternatively, the light-transmitting surface includes a first reflecting portion and a second reflecting portion that are spaced apart, and the optical path deflection assembly is configured such that the light collected by the lens is reflected to the image sensor via the first reflecting surface, the first reflecting portion, the bottom surface, the second reflecting portion and the second reflecting surface in sequence.

13. An electronic device, characterized in that: The electronic device includes a camera module as described in any one of claims 10-12.

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