Chip packaging structure

Abstract

A chip packaging structure disclosed by the present invention comprises a shell, a packaging bottom plate, a packaging top plate, a soaking mechanism and a cover plate, the packaging bottom plate is provided with the packaging top plate, a top plate main body is embedded and fixedly connected with a heat conduction plate in a penetrating manner, the heat conduction plate is arranged on the upper end surface of a chip main body, the packaging top plate is provided with a soaking plate, and the soaking plate is arranged on the packaging top plate. Heat generated when the chip body works can be transmitted to the vapor chamber through the heat conducting plate, the vapor chamber is embedded and fixedly connected with a heat dissipation plate in a penetrating mode, the cover plate is provided with a heat dissipation through groove corresponding to the heat dissipation plate in position, and the heat dissipation plate is arranged in the heat dissipation through groove in a penetrating and sleeved mode. Heat generated when the chip body works can be dissipated through the heat dissipation plate, the device can still work for a long time in a high-power environment, the reliability of the device is improved, the heat dissipation plate is arranged in the heat dissipation through groove in the cover plate in a penetrating and sleeving mode, the device has good heat dissipation performance and good dust prevention performance at the same time, and the service life of the device is prolonged. The sealing requirement of chip packaging is met, and the maintenance cost of the device is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a chip packaging structure. Background Art

[0002] Chip packaging is the process of encapsulating the bare chip in a shell with a specific shape and pin structure to protect the physical structure of the chip and provide electrical connections and heat dissipation functions. The existing chip packaging structure cannot effectively dissipate heat in the high-power range, causing the chip temperature to rise, affecting stability and life.

[0003] The existing Chinese patent with authorization announcement number CN220341215U discloses a chip packaging structure. The utility model includes a packaging plastic package; functional pins, including a first pin, a second pin, a third pin, a fourth pin and a fifth pin respectively connected to the packaging plastic package; heat dissipation pins, including a seventh pin and an eighth pin respectively connected to the packaging plastic package; high-voltage pins, including a sixth pin and a ninth pin connected to the packaging plastic package; wherein the pin width of the heat dissipation pin is greater than the pin width of the functional pin, and the structure has good heat dissipation performance, takes into account the electrical isolation requirements of high and low voltage products, and can meet the packaging requirements of higher power ranges compared to traditional chip packaging structures.

[0004] The shortcomings of the above-mentioned existing technical solutions are: multi-chip integrated packaging is currently more common, and multi-chip integrated packaging allows multiple chips to be in a common working environment. In a high-power environment, the heat dissipation structure in the existing technology cannot meet the long-term operation of the chip. Summary of the invention

[0005] The purpose of the present invention is to provide a chip packaging structure to solve the technical problem that multi-chip integrated packaging is currently more common in the prior art. Multi-chip integrated packaging allows multiple chips to be in a common working environment. In a high-power environment, the heat dissipation structure in the prior art cannot meet the long-term operation of the chip.

[0006] The technical problem to be solved by the present invention can be achieved by the following technical solutions:

[0007] A chip packaging structure, comprising:

[0008] The heat-spreading mechanism comprises symmetrically distributed heat-spreading plates, each of which is penetrated, embedded and fixedly connected with a heat-dissipating plate;

[0009] The package bottom plate and the package top plate, the package bottom plate includes a bottom plate body, the bottom plate body is evenly distributed and provided with two pin through grooves, the two pin through grooves are fixedly connected with pins, the bottom plate body is provided with a chip body, both ends of the chip body are provided with wire bonding, the wire bonding is evenly distributed and welded with connection ends, the connection ends are welded with pins, the package top plate includes a top plate body, a heat conducting plate is embedded through and fixedly connected to the top plate body, and the heat conducting plate is provided on the upper end surface of the chip body;

[0010] The shell has symmetrically distributed and opening mounting grooves in the shell, a packaging bottom plate is arranged in the mounting grooves, a packaging top plate is arranged on the packaging bottom plate, a heat spreader is arranged on the packaging top plate, an alignment through groove is arranged in the mounting groove, both sides of the alignment through groove are evenly distributed and opening pin through groove one, the pin through groove two corresponds to the pin through groove one in position, a cover plate is clamped on the shell, a heat dissipation through groove corresponding to the position of the heat sink is arranged on the cover plate, and the heat sink is penetrated and sleeved in the heat dissipation through groove.

[0011] As a further solution of the present invention: a connecting strip is fixedly connected to the housing, and a clamping groove is provided on the connecting strip.

[0012] As a further solution of the present invention: the heat equalizing mechanism also includes a clamping plate, a heat equalizing tube is arranged between the clamping plate and the heat equalizing plate, one end of the heat equalizing tube is fixedly connected to the heat equalizing plate, and the other end of the heat equalizing tube is fixedly connected to the clamping plate.

[0013] As a further solution of the present invention: the clamping plate is clamped in the clamping groove, the lower end surface of the heat sink is in contact with the upper end surface of the heat conduction plate, and the clamping plate, the heat spreader, the heat spreader tube and the heat sink are all made of thermal conductive materials.

[0014] As a further solution of the present invention: a heat conducting block is embedded and fixedly connected on the end surface of the top plate body, the heat conducting block abuts against the heat spreader, a plurality of heat conducting blocks are evenly distributed on the top plate body, and heat conducting pins are fixedly connected to the lower ends of the heat conducting blocks.

[0015] As a further solution of the present invention: the heat-conducting pins correspond to each other in position, the heat-conducting pins are sleeved in pin slot 1 and pin slot 2, a heat-conducting gasket is arranged between the heat-conducting pins, and the heat-conducting pins are abutted against each other through the heat-conducting gasket.

[0016] As a further solution of the present invention: a card slot is provided on the shell, a card block is fixedly connected to the cover plate, and the card block of the cover plate is card-engaged with the card slot of the shell.

[0017] As a further solution of the present invention: an alignment block is fixedly connected to an end surface of the packaging base plate away from the chip body, and the alignment block is arranged in the alignment through groove.

[0018] Beneficial effects of the present invention:

[0019] 1. When the present invention is in use, the package bottom plate is arranged in the installation groove, the pin through groove 2 on the package bottom plate corresponds to the pin through groove 1 in the installation groove in position, the pins are fixedly connected in the pin through groove 2, and the pins can be sleeved in the pin through groove 1 in the installation groove in a one-to-one manner. By setting the alignment block and the alignment through groove, it is convenient for the package bottom plate to be aligned and installed in the installation groove, and the shaking of the package bottom plate in the installation groove can be reduced, and the pins can be prevented from bending. The package bottom plate is provided with a package top plate, and a heat conducting plate is embedded and fixedly connected to the top plate body, and the heat conducting plate is arranged on the upper end surface of the chip body. The package top plate is provided with Heat spreader, the heat generated by the chip body when it is working can be transferred to the heat spreader through the heat conduction plate, the heat spreader is embedded and fixedly connected with a heat sink, the cover is provided with a heat dissipation groove corresponding to the position of the heat sink, the heat sink is inserted into the heat dissipation groove, the heat generated by the chip body when it is working can be dissipated through the heat sink, so that the device can still work for a long time in a high-power environment, and the reliability of the device is improved. By inserting the heat sink into the heat dissipation groove on the cover, the device has good heat dissipation and dust resistance, meets the sealing requirements of the chip package, and reduces the maintenance cost of the device;

[0020] 2. When the present invention is in use, the package top plate is set on the package bottom plate, the heat-conducting pins are sleeved in the pin through grooves 1 and 2, a heat-conducting pad is set between the heat-conducting pins and the pins, the heat-conducting pins and the pins are abutted through the heat-conducting pads, the heat-conducting block and the heat-spreading plate are abutted, and the heat generated by the pins when working can be transferred to the heat-spreading plate through the heat-conducting block and the heat-conducting pins, and the heat can be dissipated through the heat dissipation plate, so as to further improve the reliability of the device, and after the connection terminals and pins of the chip body are welded, the chip body is made to work and generate heat, and the pins with poor soldering can be detected by observing the heating condition of the heat-conducting block on the package top plate with a thermal imager, so as to facilitate the detection of the chip body after welding;

[0021] 3. When the present invention is in use, the heat equalizing mechanism is arranged on the top plate of the package, the heat dissipation plate of the heat equalizing mechanism is inserted through the heat dissipation groove on the cover plate, the cover plate is clamped with the clamping groove of the shell through the clamping block, and the cover plate is clamped with the heat equalizing mechanism and the shell through the alignment of the cover plate, the alignment of the package bottom plate and the shell makes the overall packaging structure of the chip body easy to disassemble and assemble, and facilitates subsequent maintenance work. The heat equalizing mechanism can make the heat distribution between the chip bodies under different load states uniform, improve the reliability of the device, and enable the device to work for a longer time under a high load environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be further described below in conjunction with the accompanying drawings.

[0023] Figure 1 It is a schematic diagram of the structure of the present invention after assembly;

[0024] Figure 2 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 3 It is a schematic structural diagram of the connection relationship between the housing, the packaging bottom plate, the packaging top plate and the heat-dissipating mechanism of the present invention;

[0026] Figure 4 It is a schematic structural diagram of the connection relationship between the housing, the packaging bottom plate, and the packaging top plate of the present invention;

[0027] Figure 5 It is a schematic diagram of the three-dimensional structure of the housing and the connecting strip in the present invention;

[0028] Figure 6 The three-dimensional structure of the packaging base plate of the present invention is shown in FIG. Figure 1 ;

[0029] Figure 7 The three-dimensional structure of the packaging base plate of the present invention is shown in FIG. Figure 2 ;

[0030] Figure 8 The three-dimensional structure of the top plate of the package of the present invention is shown in FIG. Figure 1 ;

[0031] Fig. 9 The three-dimensional structure of the top plate of the package of the present invention is shown in FIG. Figure 2 ;

[0032] Fig.10 It is a schematic diagram of the three-dimensional structure of the heat equalizing mechanism of the present invention;

[0033] Fig.11 It is a schematic diagram of the three-dimensional structure of the cover plate of the present invention.

[0034] In the figure: 1. shell; 2. mounting groove; 3. alignment groove; 4. pin groove 1; 5. clamping slot; 6. package bottom plate; 61. bottom plate body; 62. chip body; 63. wire bonding; 64. connection end; 65. pin groove 2; 66. pin; 67. alignment block; 7. package top plate; 71. top plate body; 72. heat conducting plate; 73. heat conducting block; 74. heat conducting pin; 8. heat equalizing mechanism; 81. clamping plate; 82. heat equalizing plate; 83. heat equalizing pipe; 84. heat sink; 9. cover plate; 10. heat dissipation groove; 11. clamping block; 12. connecting strip; 13. clamping slot. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] like Figure 1-Figure 11 As shown, a chip packaging structure includes a heat-saturating mechanism 8, a packaging bottom plate 6 and a packaging top plate 7. The heat-saturating mechanism 8 includes symmetrically distributed heat-saturating plates 82, and the heat-saturating plates 84 are embedded and fixedly connected to the heat-saturating plates 82. The packaging bottom plate 6 includes a bottom plate body 61, and the bottom plate body 61 is evenly distributed and provided with second pin through grooves 65, and the second pin through grooves 65 are fixedly connected with pins 66. The bottom plate body 61 is provided with a chip body 62, and wire bonds 63 are provided at both ends of the chip body 62. The wire bonds 63 are evenly distributed and welded with connection ends 64, and the connection ends 64 are welded with pins 66. The packaging top plate 7 includes a top plate body 71, and the top plate body 71 is embedded and fixedly connected with a heat-conducting plate 72, and the heat-conducting plate 72 is provided on the upper end surface of the chip body 62.

[0037] A chip packaging structure also includes a shell 1, in which mounting grooves 2 are symmetrically distributed and opened, in which mounting grooves 2 are arranged a packaging bottom plate 6, on which packaging bottom plates 6 are arranged a packaging top plate 7, on which packaging top plates 7 are arranged a heat spreader 82, in which mounting grooves 2 are arranged an alignment groove 3, on both sides of which alignment grooves 3 are evenly distributed and opened a pin groove 1 4, pin groove 2 65 and pin groove 1 4 correspond one to one in position, a cover plate 9 is clamped on the shell 1, on which a heat dissipation groove 10 corresponding to the position of a heat dissipation plate 84 is opened, and the heat dissipation plate 84 is penetrated and sleeved in the heat dissipation groove 10.

[0038] A connecting strip 12 is fixedly connected to the outer shell 1, and a snap-in groove 13 is provided on the connecting strip 12. The heat equalizing mechanism 8 also includes a snap-in plate 81, and a heat equalizing tube 83 is arranged between the snap-in plate 81 and the heat equalizing plate 82. One end of the heat equalizing tube 83 is fixedly connected to the heat equalizing plate 82, and the other end of the heat equalizing tube 83 is fixedly connected to the snap-in plate 81. The snap-in plate 81 is snapped into the snap-in groove 13, and the lower end surface of the heat dissipation plate 84 is in contact with the upper end surface of the heat conducting plate 72. The snap-in plate 81, the heat equalizing plate 82, the heat equalizing tube 83 and the heat dissipation plate 84 are all made of heat-conducting materials.

[0039] A heat-conducting block 73 is embedded and fixedly connected to the end surface of the top plate body 71, and the heat-conducting block 73 is abutted against the heat spreader 82. Several heat-conducting blocks 73 are evenly distributed on the top plate body 71. The lower ends of the heat-conducting blocks 73 are fixedly connected to heat-conducting pins 74. The heat-conducting pins 74 correspond to the pins 66 in position one by one. The heat-conducting pins 74 are sleeved in the pin through groove 1 4 and the pin through groove 2 65. A heat-conducting gasket is arranged between the heat-conducting pin 74 and the pin 66, and the heat-conducting pin 74 is abutted against the pin 66 through the heat-conducting gasket.

[0040] The housing 1 is provided with a card slot 5 , and the cover plate 9 is fixedly connected with a card block 11 , and the card block 11 of the cover plate 9 is card-engaged with the card slot 5 of the housing 1 .

[0041] An alignment block 67 is fixedly connected to one end surface of the package base plate 6 away from the chip body 62. The alignment block 67 is arranged in the alignment groove 3. The alignment block 67 and the alignment groove 3 facilitate the alignment installation of the package base plate 6 in the installation groove 2.

[0042] In order to facilitate the understanding of the embodiments of this solution by those skilled in the art, the working principle of this solution is briefly described in combination with specific application scenarios:

[0043] When in use, the package base plate 6 is set in the mounting groove 2, and the pin through groove 2 65 on the package base plate 6 corresponds to the pin through groove 1 4 in the mounting groove 2 in position. The pin through groove 2 65 is fixedly connected with a pin 66, and the pin 66 can be sleeved in the pin through groove 1 4 in the mounting groove 2 in a one-to-one manner. By setting the alignment block 67 and the alignment through groove 3, it is convenient for the package base plate 6 to be aligned and installed in the mounting groove 2, and at the same time, the shaking of the package base plate 6 in the mounting groove 2 can be reduced to prevent the pin 66 from bending. The package base plate 6 is provided with a package top plate 7, and a heat conducting plate 72 is embedded and fixedly connected to the top plate body 71, and the heat conducting plate 72 is arranged on the upper end surface of the chip body 62. The heat spreader 82 can transfer the heat generated by the chip body 62 when it is working to the heat spreader 82 through the heat conducting plate 72. The heat spreader 82 is penetrated and embedded with a heat sink 84 and fixedly connected. The cover plate 9 is provided with a heat dissipation groove 10 corresponding to the position of the heat sink 84. The heat sink 84 is penetrated and sleeved in the heat dissipation groove 10. The heat generated by the chip body 62 when it is working can be dissipated through the heat sink 84, so that the device can still work for a long time in a high-power environment, thereby improving the reliability of the device. By penetrating and sleeved the heat sink 84 in the heat dissipation groove 10 on the cover plate 9, the device has good heat dissipation and dust resistance, which meets the sealing requirements of the chip package and reduces the maintenance cost of the device.

[0044] The package top plate 7 is arranged on the package bottom plate 6, and the heat-conducting pin 74 is sleeved in the pin through groove 1 4 and the pin through groove 2 65. A heat-conducting pad is arranged between the heat-conducting pin 74 and the pin 66. The heat-conducting pin 74 and the pin 66 are abutted through the heat-conducting pad, and the heat-conducting block 73 is abutted against the heat-spreading plate 82. The heat generated by the pin 66 when working can be transferred to the heat-spreading plate 82 through the heat-conducting block 73 and the heat-conducting pin 74, and the heat can be dissipated through the heat dissipation plate 84, so as to further improve the reliability of the device. After the connection terminal of the chip body 62 and the pin 66 are welded, the chip body 62 is made to work and generate heat. The heat condition of the heat-conducting block 73 on the package top plate 7 can be observed by a thermal imager to detect the pin 66 with a cold solder joint, so as to facilitate the detection of the chip body 62 after welding.

[0045] The heat equalizing mechanism 8 is arranged on the packaging top plate 7, and the heat dissipation plate 84 of the heat equalizing mechanism 8 passes through the heat dissipation groove 10 on the cover plate 9. The cover plate 9 is clamped with the clamping slot 5 of the shell 1 through the clamping block 11. The cover plate 9 is clamped with the heat equalizing mechanism 8 and the shell 1, and the alignment of the packaging bottom plate 6 and the shell 1 makes the overall packaging structure of the chip body 62 easy to disassemble and assemble, which is convenient for subsequent maintenance work. The heat equalizing mechanism 8 can make the heat distribution between the chip body 62 under different load states uniform, improve the reliability of the device, and enable the device to work for a longer time under a high load environment.

[0046] Several embodiments of the present invention are described in detail above, but the embodiments of the present invention are not limited thereto and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A chip packaging structure, characterized in that: include: The heat equalizing mechanism (8) comprises symmetrically distributed heat equalizing plates (82), each of which is penetrated by a heat dissipation plate (84) embedded in and fixedly connected to the heat equalizing plates (82); A packaging bottom plate (6) and a packaging top plate (7), wherein the packaging bottom plate (6) comprises a bottom plate body (61), the bottom plate body (61) is evenly distributed with two pin through grooves (65), each of which is fixedly connected with a pin (66), a chip body (62) is arranged on the bottom plate body (61), wire bonds (63) are arranged at both ends of the chip body (62), connection ends (64) are evenly distributed and welded on the wire bonds (63), and each of the connection ends (64) is welded with the pin (66), and the packaging top plate (7) comprises a top plate body (71), a heat conducting plate (72) is embedded through and fixedly connected to the top plate body (71), and the heat conducting plate (72) is arranged on the upper end surface of the chip body (62); A shell (1) is provided with mounting grooves (2) which are symmetrically distributed in the shell (1), a packaging bottom plate (6) is provided in each of the mounting grooves (2), a packaging top plate (7) is provided on each of the packaging bottom plates (6), a heat spreader (82) is provided on each of the packaging top plates (7), an alignment through groove (3) is provided in the mounting groove (2), pin through grooves (4) are evenly distributed on both sides of the alignment through groove (3), the pin through grooves (65) and the pin through grooves (4) correspond one to one in position, a cover plate (9) is clamped on the shell (1), a heat dissipation through groove (10) corresponding to the position of a heat dissipation plate (84) is provided on the cover plate (9), and the heat dissipation plate (84) is inserted through and sleeved in the heat dissipation through groove (10).

2. The chip packaging structure according to claim 1, characterized in that: A connecting strip (12) is fixedly connected to the housing (1), and a clamping groove (13) is provided on the connecting strip (12).

3. The chip packaging structure according to claim 1, characterized in that: The heat equalizing mechanism (8) also includes a clamping plate (81), a heat equalizing pipe (83) is provided between the clamping plate (81) and the heat equalizing plate (82), one end of the heat equalizing pipe (83) is fixedly connected to the heat equalizing plate (82), and the other end of the heat equalizing pipe (83) is fixedly connected to the clamping plate (81).

4. The chip packaging structure according to claim 3, characterized in that: The clamping plate (81) is clamped in the clamping groove (13), the lower end surface of the heat dissipation plate (84) is in contact with the upper end surface of the heat conduction plate (72), and the clamping plate (81), the heat spreader (82), the heat spreader tube (83) and the heat dissipation plate (84) are all made of heat-conducting materials.

5. The chip packaging structure according to claim 1, characterized in that: A heat conducting block (73) is embedded and fixedly connected to the end surface of the top plate body (71); the heat conducting block (73) is in contact with the heat spreader (82); a plurality of heat conducting blocks (73) are evenly distributed on the top plate body (71); and the lower ends of the heat conducting blocks (73) are fixedly connected to heat conducting pins (74).

6. The chip packaging structure according to claim 5, characterized in that: The heat-conducting pin (74) corresponds to the pin (66) in position. The heat-conducting pin (74) is sleeved in the first pin through slot (4) and the second pin through slot (65). A heat-conducting pad is provided between the heat-conducting pin (74) and the pin (66). The heat-conducting pin (74) and the pin (66) are in contact with each other through the heat-conducting pad.

7. The chip packaging structure according to claim 1, characterized in that: A card slot (5) is provided on the housing (1), a card block (11) is fixedly connected to the cover plate (9), and the card block (11) of the cover plate (9) is card-engaged with the card slot (5) of the housing (1).

8. The chip packaging structure according to claim 1, characterized in that: An alignment block (67) is fixedly connected to an end surface of the packaging base plate (6) away from the chip body (62), and the alignment block (67) is arranged in the alignment through groove (3).

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