Electric connector

Abstract

The embodiment of the invention provides an electric connector. The electric connector comprises a connector body and a dustproof cover, the connector body comprises a base and a pin, the pin penetrates through the base, and a first end and a second end of the pin respectively extend out of two opposite sides of the base. The first end and the second end are two opposite ends of the pin. The dustproof cover and the base are connected to form a first cavity, and the first end of the pin extends into the first cavity. The dustproof cover comprises a top cover, the top cover is provided with a first surface and a second surface which are oppositely arranged, the first surface deviates from the connector body, and the second surface faces the connector body. The top cover is provided with a first heat conduction channel penetrating through the top cover, the first heat conduction channel penetrates through the first surface to form a first opening, the first heat conduction channel penetrates through the second surface to form a second opening, and the first opening and the second opening are staggered.

Description

Technical Field

[0001] Embodiments of the present application relate to the technical field of electrical connectors, and in particular, to an electrical connector. Background Art

[0002] As an important component for signal transmission of electronic devices, electrical connectors are used to install and connect active devices (such as chips) to transmit current or signals. With the rapid development of information technology, the requirements for signal transmission of electronic devices are increasing, and electrical connectors are beginning to be used in more and more fields. However, in the related art, fine dust particles will enter the electrical connector, resulting in poor electrical connection between the electrical connector and the chip, causing problems such as increased bit error rate and decreased rate of signal transmission. Summary of the invention

[0003] Embodiments of the present application provide an electrical connector to reduce the risk of poor electrical connection between the electrical connector and a chip.

[0004] On the one hand, an electrical connector is provided. The electrical connector includes a connector body and a dust cover. The connector body includes a base and a pin, the pin is arranged on the base, and the first end and the second end of the pin extend out of opposite sides of the base respectively. The first end and the second end are opposite ends of the pin. The dust cover is connected to the base to form a first cavity, and the first end of the pin extends into the first cavity. The dust cover includes a top cover, and the top cover has a first surface and a second surface arranged opposite to each other, the first surface faces away from the connector body, and the second surface faces the connector body. The top cover is provided with a first heat conduction channel passing through the top cover, the first heat conduction channel passes through the first surface to form a first opening, the first heat conduction channel passes through the second surface to form a second opening, and the first opening and the second opening are staggered.

[0005] In the electrical connector of the embodiment of the present application, since the first opening and the second opening are staggered, when dust falls from directly above the first opening, the dust cannot directly pass through the first heat conduction channel and fall into the first cavity, thereby reducing the dust entering the first cavity, reducing the dust falling on the pins, reducing the risk of poor electrical connection failure when the electrical connector body is subsequently connected to the chip, and reducing the bit error rate of signal transmission and the risk of a decrease in the signal transmission rate.

[0006] In some embodiments, the projection of the first opening on the second surface does not overlap with the second opening. In this case, when dust falls from directly above the first opening, most or almost all of the dust that falls will be blocked by the sidewall of the first heat conduction channel, reducing the probability of dust directly passing through the first heat conduction channel and falling into the first cavity, thereby further reducing the dust that enters the first cavity, reducing the dust that falls on the pins, and reducing the risk of poor electrical connection between the electrical connector body and the chip.

[0007] In some embodiments, the top cover includes a cover plate, the surface of the cover plate facing away from the connector body is the first surface, and the surface of the cover plate facing the connector body is the second surface. The first heat conduction channel runs through the cover plate and connects the first opening and the second opening. In this case, the top cover only includes a layer of cover plate, the top cover has a good thermal conductivity, which is conducive to heat transfer during the reflow soldering process, and the first heat conduction channel only runs through a layer of cover plate, the structure is simple, and it is easy to prepare.

[0008] In some embodiments, the top cover includes a first cover plate and a second cover plate, the first cover plate and the second cover plate are stacked, and there is a first gap between the first cover plate and the second cover plate. The surface of the first cover plate facing away from the connector body is the first surface, and the surface of the second cover plate facing the connector body is the second surface. The first heat conduction channel runs through the first cover plate and the second cover plate, and is connected to the first opening, the first gap and the second opening. In this case, the top cover only includes multiple layers of cover plates, and dust needs to pass through multiple layers of cover plates to enter the first cavity from the outside of the dust cover away from the first cavity, so that dust can be blocked layer by layer, further reducing the dust entering the first cavity, thereby reducing the dust falling on the pins, reducing the risk of poor electrical connection between the electrical connector body and the chip, and helping to reduce the bit error rate of signal transmission, as well as reducing the risk of a decrease in the rate of signal transmission.

[0009] In some embodiments, the dust cover further includes an adhesive layer, and the adhesive layer is disposed on the surface of the second cover plate facing the first cover plate. At this time, when dust enters the first gap from the side of the first cover plate away from the first cavity, part of the dust will be adsorbed on the adhesive layer to avoid entering the first cavity from the first gap, thereby further reducing the dust entering the first cavity, reducing the dust falling on the pins, and reducing the risk of poor electrical connection between the electrical connector body and the chip.

[0010] In some embodiments, the first heat conduction channel includes a first sub-channel and a second sub-channel, the first sub-channel runs through the first cover plate, and the second sub-channel runs through the second cover plate.

[0011] In some embodiments, the top cover has a first area and a second area, and the first area and the second area do not overlap. The first heat conduction channel runs through the first cover plate in the first area, and the first heat conduction channel does not overlap with the second area, and the production equipment can transfer the dust cover in the first area by vacuum adsorption. The second cover plate is also provided with a second heat conduction channel running through the second cover plate, and the second heat conduction channel runs through the second cover plate in the second area to improve the heat conduction efficiency.

[0012] In some embodiments, the diameter of the first opening is D1, and the height of the first gap is H1 along the direction from the first cover plate to the second cover plate; wherein H1≥D1. In this way, the distance between the first cover plate and the second cover plate (i.e., the height of the first gap) is large, and heat can quickly enter the first gap from the first opening and be transferred from the first gap to the second opening, and the heat conduction efficiency of the dust cover is high.

[0013] In some embodiments, the diameter of the first opening is D1, and the distance between two adjacent second openings is D2; wherein D2 ≥ D1. In this way, more first heat conduction channels can be opened on the top cover, the space utilization rate is high, the area ratio of the top cover occupied by the first heat conduction channels can be increased, and the heat conduction efficiency can be improved.

[0014] In some embodiments, the area of ​​the second opening is smaller than the area of ​​the first opening. In this case, the second subchannel of the second cover is narrower, the second cover has a better dustproof effect than the first cover, and the first cover has a better heat conduction effect than the second cover, so that the first cover and the second cover can block dust layer by layer at a higher heat conduction efficiency to achieve a better dustproof effect, thereby further reducing the dust entering the first cavity, reducing the dust falling on the pins, reducing the risk of poor electrical connection between the electrical connector body and the chip 32, and helping to reduce the bit error rate of signal transmission and the risk of reduced signal transmission rate.

[0015] In some embodiments, the thickness of the second cover plate is less than the thickness of the first cover plate. In this case, when the areas of the first opening and the second opening are the same, the thermal conductivity of the second cover plate is higher. Based on this, the thickness of the second cover plate is less than the thickness of the first cover plate, which is conducive to improving the thermal conductivity.

[0016] In some embodiments, the first heat conduction channel obliquely penetrates the top cover along a third direction. An angle is formed between the third direction and a fourth direction. The fourth direction is a direction from the first surface to the second surface.

[0017] In some embodiments, the dust cover further includes a blocking structure, and the blocking structure is located on at least a portion of the side wall of the first heat conducting channel. At this time, the blocking structure can prevent dust that falls on the side wall of the first heat conducting channel from moving into the first cavity. In this way, when dust enters the first heat conducting channel from the first opening and falls on the side wall of the first heat conducting channel, the dust can be blocked by the blocking structure, thereby preventing the dust from moving into the first cavity, further reducing the dust that enters the first cavity, reducing the dust that falls on the pins, and reducing the risk of poor electrical connection between the electrical connector body and the chip.

[0018] In some embodiments, the side wall of the first heat-conducting channel has a first portion, and the first opening exposes the first portion. The blocking structure is disposed on the first portion. At this time, dust falling from the first opening along a fourth direction (e.g., the direction of gravity) can be blocked by the blocking structure when falling on the first portion, thereby preventing the dust from moving into the first cavity, further reducing the dust entering the first cavity, reducing the dust falling on the pins, and reducing the risk of poor electrical connection between the electrical connector body and the chip.

[0019] In some embodiments, the opening shapes of the first opening and the second opening are rectangular, and the first heat-conducting channel includes a first side wall, a second side wall, a third side wall, and a fourth side wall connected end to end in sequence. The first opening exposes at least a portion of the first side wall, and the portion of the first side wall exposed by the first opening is the first portion, and the blocking structure is disposed on the first side wall. The first heat-conducting channel has a blocking structure on only one side of the side wall, and the blocking structure is disposed in a small area, and the structure is simple and easy to prepare.

[0020] In some embodiments, the blocking structure includes a plurality of pits formed on the side wall of the first heat conduction channel. At this time, when dust falls on the side wall of the first heat conduction channel, the dust can be adsorbed in the pits, thereby preventing the dust from moving along the side wall of the first heat conduction channel, reducing the dust entering the first cavity, reducing the dust falling on the pins, and reducing the risk of poor electrical connection between the electrical connector body and the chip.

[0021] In some embodiments, the blocking structure includes a plurality of blocking protrusions formed on the side wall of the first heat conducting channel, and the angle between the side of the blocking protrusion close to the first surface and the side wall of the first heat conducting channel is an acute angle. In this case, when dust falls on the side wall of the first heat conducting channel, the dust can be blocked by the blocking protrusions and stay between the blocking protrusions and the side wall of the first heat conducting channel, thereby preventing the dust from moving along the side wall of the first heat conducting channel, reducing the dust entering the first cavity, reducing the dust falling on the pins, and reducing the risk of poor electrical connection between the electrical connector body and the chip.

[0022] In some embodiments, a plurality of the blocking protrusions are arranged in an array. In this case, the blocking protrusions occupy a smaller area of ​​the first heat conduction channel, and the heat conduction effect is better. Alternatively, the blocking protrusions are strip structures or ring structures, and a plurality of the blocking protrusions are arranged at intervals along the third direction. In this case, the blocking protrusions can prevent more dust from moving along the side wall of the first heat conduction channel, and the dustproof effect is better.

[0023] In some embodiments, the diameter of the first opening is D1, and the thickness of the cover plate is H2, wherein H2 / D1≤2. In this case, the thickness of the cover plate is small, and the diameter of the first opening is small, which can prevent a lot of dust from entering the first cavity on the basis of better heat conduction effect, and achieve better dustproof effect.

[0024] In some embodiments, the angle between the third direction and the fourth direction is 30° to 60°. In this way, when the thickness of the cover plate is small, that is, the heat conduction effect is high, the staggered area between the first opening and the second opening can be larger.

[0025] In some embodiments, the dust cover further includes a side plate, which is arranged around the edge of the top cover and connected to the connector body. The side plate has a third surface and a fourth surface arranged opposite to each other, the third surface faces away from the first cavity, and the fourth surface faces the first cavity. The side plate is provided with a third heat conduction channel penetrating the side plate, the third heat conduction channel penetrates the third surface to form a third opening, the third heat conduction channel penetrates the fourth surface to form a fourth opening, and the third opening and the fourth opening are staggered.

[0026] In this case, since the third opening and the fourth opening are staggered, the third opening exposes at least a portion of the side wall of the third heat conducting channel, so that when dust falls from directly above the third opening, at least a portion of the dust will be blocked by the side wall of the third heat conducting channel, making it impossible for the dust to directly pass through the third heat conducting channel and enter the first cavity, thereby reducing the dust entering the first cavity, reducing the dust falling on the pins, reducing the risk of poor electrical connection between the electrical connector body and the chip, and reducing the bit error rate of signal transmission and the risk of a decrease in the signal transmission rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the present application, the following is a brief introduction to the drawings required for use in some embodiments of the present application. Obviously, the drawings described below are only drawings of some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not intended to limit the actual size of the product involved in the embodiments of the present application, the actual process of the method, the actual timing of the signal, etc.

[0028] Figure 1 A schematic diagram of the structure of an electrical connector provided in some embodiments of the present application;

[0029] Figure 2 for Figure 1 A sectional view along the section line AA';

[0030] Figure 3 A schematic diagram of the structure of a circuit board provided in some embodiments of the present application;

[0031] Figure 4 An exploded view of an electrical connector provided for some embodiments of the present application;

[0032] Figure 5 for Figure 4 A partial enlarged view of the middle A;

[0033] Fig. 6A A top view of a dust cover provided in some embodiments of the present application;

[0034] Figure 6B A top view of another dust cover provided for some embodiments of the present application;

[0035] Figure 7 for Figure 1 Another sectional view along section line AA';

[0036] Fig. 8A A top view of another dust cover provided for some embodiments of the present application;

[0037] Figure 8B A top view of another dust cover provided for some embodiments of the present application;

[0038] Fig. 9 A top view of a second cover plate of a dust cover provided in some embodiments of the present application;

[0039] Fig.10 for Fig. 6A A top view of a first heat conduction channel;

[0040] Fig.11 for Fig. 6A A sectional view along section line BB';

[0041] Fig.12 for Fig. 6A A sectional view along section line CC';

[0042] Fig.13 for Fig. 6A Another cross-sectional view along section line BB';

[0043] Fig.14for Fig. 6A Another cross-sectional view along section line BB';

[0044] Fig.15 for Fig.11 A top view of a first heat conducting channel at a first opening is shown;

[0045] Fig.16A for Fig.11 Another top view of a first heat conducting channel at a first opening is shown;

[0046] Fig. 16B for Fig.11 A top view of another first heat conducting channel at a first opening is shown;

[0047] Fig.17 A front view of a dust cover provided for some embodiments of the present application;

[0048] Fig.18 A side view of another dust cover provided for some embodiments of the present application;

[0049] Fig.19 for Fig.17 A sectional view along section line AA'. DETAILED DESCRIPTION

[0050] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments provided by the present application, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present application.

[0051] When describing some embodiments, the word "connection" and its derivative expressions may be used. For example, the term "connection" used when describing some embodiments should be understood in a broad sense, for example, it can be a mechanical connection or an electrical connection; it can be a fixed connection or a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this article can be understood according to specific circumstances.

[0052] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, "plurality" means two or more.

[0053] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 10°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 10°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, the difference between the two equalities is less than or equal to 10% of either one.

[0054] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include deviations in shape due to, for example, manufacturing. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0055] Figure 1 A schematic diagram of the structure of an electrical connector provided in some embodiments of the present application. Figure 2 for Figure 1 A sectional view along section line AA'.

[0056] See also Figure 1 Some embodiments of the present application provide an electrical connector 100, comprising a connector body 10 and a dust cover 20 disposed on one side of the connector body 10. The material of the dust cover 20 includes at least one of plastic, ceramic, and metal, but the embodiments of the present application are not limited thereto.

[0057] Combination Figure 2 The dust cover 20 is connected to the connector body 10 to form the first cavity 100A. The dust cover 20 can protect the electrical connector body 10 during transportation and storage, which can not only reduce the risk of physical damage to the electrical connector body 10, but also reduce dust from entering the first cavity 100A.

[0058] Figure 3 A schematic diagram of the structure of a circuit board provided for some embodiments of the present application. Figure 4 An exploded view of an electrical connector provided in accordance with some embodiments of the present application.

[0059] like Figure 3 As shown, the circuit board 30 includes a board body 31, a connector body 10 and a chip 32. The board body 31 is integrated with a conductive circuit, and the chip 32 is connected to the conductive circuit in the board body 31 through the connector body 10. That is, when the chip 32 is connected to the chip 32 using the electrical connector 100 of the present application, the dust cover 20 (see Figure 4 ) is removed, and after the chip 32 is connected to the connector body 10, the connector body 10 on the circuit board 30 is no longer equipped with the dust cover 20.

[0060] The circuit board 30 may be a mainboard in a server, and the chip 32 may include, for example, a central processing unit or a switching chip or any other chip 32 that needs to be replaced.

[0061] In some embodiments, see Figure 4 The connector body 10 includes a base 11 and a pin 12. The pin 12 is disposed on the base 11 and fixedly connected to the base 11, so that the base 11 can support and fix the pin 12 to prevent the pin 12 from displacement and deformation during operation.

[0062] In addition, the pin 12 penetrates the base 11, so that the first end and the second end of the pin 12 extend out of the opposite sides of the base 11 respectively. The first end and the second end are the opposite ends of the pin 12, and the opposite sides of the base 11 are the sides of the base 11 close to and away from the dust cover 20. The dust cover 20 is connected to the base 11 to form a first cavity 100A (see Figure 2 ), and the first end of the pin 12 extends into the first cavity 100A (see Figure 2 ).

[0063] At this time, the connector body 10 is connected to the chip 32 through the first end of the pin 12 and is connected to the conductive circuit in the board body 31 through the second end of the pin 12 , so that the chip 32 is connected to the conductive circuit in the board body 31 .

[0064] The material of the base 11 includes insulating material, for example, the material of the base 11 includes at least one of plastic, ceramic, and glass fiber. The material of the pin 12 includes conductive material, for example, the material of the pin 12 includes at least one of copper alloy, silver, gold, and stainless steel.

[0065] In some embodiments, Figure 4 As shown, the base 11 includes a bottom plate 110 and a plurality of positioning members 120, the pins 12 penetrate the bottom plate 110, and the two ends of the pins 12 extend out of opposite sides of the bottom plate 110. The plurality of positioning members 120 are disposed on one side of the bottom plate 110 close to the dust cover 20.

[0066] At this time, after the chip 32 is connected to the connector body 10 , the chip 32 can, for example, be arranged between multiple positioning members 120 and abut against multiple positioning members 120 to limit the position of the chip 32 by multiple positioning members 120 so that the chip 32 forms a good electrical connection with the pin 12 .

[0067] Figure 5 for Figure 4 A partial enlarged view of point A in the middle.

[0068] For example, Figure 4 As shown, the bottom plate 110 is rectangular, and the positioning members 120 are arranged at the four corners of the rectangle. Figure 5 Each positioning member 120 includes a first positioning plate 121 and a second positioning plate 122 connected to each other, and the first positioning plate 121 and the second positioning plate 122 are respectively located at two adjacent sides of the rectangle. Figure 3 ) is connected to the connector body 10, the first positioning plate 121 and the second positioning plate 122 can be connected to the chip 32 (see Figure 3 ) to abut against the chip 32 (see Figure 3 )Location.

[0069] On this basis, if Figure 5 As shown, the first positioning plate 121 may further include a first sub-plate 1211 and a second sub-plate 1212 , and the second positioning plate 122 may further include a third sub-plate 1221 and a fourth sub-plate 1222 .

[0070] The first sub-board 1211 and the third sub-board 1221 are connected, the height of the first sub-board 1211 is greater than the height of the second sub-board 1212, the height of the third sub-board 1221 is greater than the height of the fourth sub-board 1222, and the heights of the second sub-board 1212 and the fourth sub-board 1222 are equal. In this case, the dust cover 20 can also overlap the second sub-board 1212 and the fourth sub-board 1222, and abut against the first sub-board 1211 and the third sub-board 1221, so that the first sub-board 1211 and the third sub-board 1221 can limit the dust cover 20. In other words, the same positioning member 120 can be used to position and fix both the chip 32 and the dust cover 20, and the structure is simple.

[0071] In addition, if Figure 4 As shown, the bottom plate 110 may be provided with an avoidance hole 111 penetrating the bottom plate 110. In this case, the chip 32 (see Figure 3 ) is fixed to the connector body 10, the chip 32 (see Figure 3 ) included in the chip 32 (such as capacitors, resistors or transistors and other electronic circuits with specific functions) can be located in the avoidance hole 111 to avoid compression between the base plate 110 and the chip 32. Figure 4In the figure, the bottom plate 110 is provided with two avoidance holes 111 as an example for illustration, but the embodiments of the present application are not limited thereto.

[0072] In some embodiments, see Figure 4 The dust cover 20 and the connector body 10 can be connected by a snap-fit ​​structure, which is convenient for installation and removal. For example, the bottom plate 110 is provided with a plurality of snap-fit ​​grooves 101 at intervals in the circumferential direction, and the dust cover 20 is provided with a plurality of snap-fit ​​protrusions 102, which are snap-fitted with the snap-fit ​​grooves 101, so that the dust cover 20 is fixedly connected to the connector body 10.

[0073] On this basis, the dust cover 20 may also be provided with a mark 103, and the operator may determine the installation direction of the dust cover 20 according to the mark 103, which is conducive to improving the installation efficiency. Among them, the mark 103 may be a protrusion or a groove on the dust cover 20, and the shape of the protrusion or the groove may be set according to the actual situation. Figure 4 In the figure, the mark 103 is a triangular groove as an example for illustration.

[0074] In some embodiments, see Figure 4 The dust cover 20 includes a top cover 21 and a side plate 22. The side plate 22 is arranged around the edge of the top cover 21 and is connected to the connector body 10. Figure 2 The top cover 21 has a first surface 21A and a second surface 21B that are oppositely disposed. The first surface 21A faces away from the connector body 10 , and the second surface 21B faces toward the connector body 10 .

[0075] like Figure 2 and Figure 3 As shown, the top cover 21 is provided with a first heat conduction channel S1 penetrating the top cover 21 , so that when the connector body 10 is fixed to the board body 31 by reflow soldering, heat can be transferred through the first heat conduction channel S1 to weld the connector body 10 to the board body 31 .

[0076] In some embodiments, Figure 2 As shown, the first heat conduction channel S1 obliquely penetrates the top cover 21 along the third direction M, so that the first opening 201 and the second opening 202 are staggered. The structure of the first heat conduction channel S1 is simple and easy to prepare. There is an angle between the third direction M and the fourth direction Z. The fourth direction Z is the direction from the first surface 21A to the second surface 21B.

[0077] Exemplarily, the angle between the third direction M and the fourth direction Z is 30° to 60°, so that when the thickness of the cover plate 210 is small, that is, the heat conduction effect is high, the staggered area of ​​the first opening 201 and the second opening 202 is large, thereby achieving a better dustproof effect. For example, the angle between the third direction M and the fourth direction Z is any one of 30°, 35°, 40°, 45°, 50°, 55° and 60°, and the embodiments of the present application are not limited thereto.

[0078] Fig. 6A A top view of a dust cover provided in some embodiments of the present application. Figure 6B A top view of another dust cover provided for some embodiments of the present application. Fig. 6A The first opening 201 and the second opening 202 are rectangular. Figure 6B The first opening 201 and the second opening 202 are circular.

[0079] See also Figure 2 , Fig. 6A and Figure 6B The first heat conduction channel S1 penetrates the first surface 21A to form a first opening 201, and the first heat conduction channel S1 penetrates the second surface 21B to form a second opening 202. The first opening 201 and the second opening 202 are staggered. Here, staggered arrangement includes partial staggering and complete staggering.

[0080] The first opening 201 and the second opening 202 are partially staggered, which means that the projection (i.e., vertical projection) of the first opening 201 on the second surface 21B partially overlaps with the second opening 202. The first opening 201 and the second opening 202 are completely staggered, which means that the projection of the first opening 201 on the second surface 21B does not overlap with the second opening 202.

[0081] The first opening 201 and the second opening 202 have the same opening shape, and the shapes of the first opening 201 and the second opening 202 can be any one of a circular shape, an elliptical shape, or a polygonal shape.

[0082] In this case, if Figure 2 , Fig. 6A and Figure 6B As shown, since the first opening 201 and the second opening 202 are staggered, the first opening 201 at least exposes a portion of the side wall or the first heat conduction channel S1. Figure 7The portion of the middle top cover 21 with the second opening 202, such as the surface of the first cover plate 211 close to the second cover plate 212 mentioned below. In this way, when the dust falls from directly above the first opening 201, at least a part of the dust will be blocked by the side wall of the first heat conduction channel S1 or the portion of the top cover 21 with the second opening 202, so that the dust cannot directly pass through the first heat conduction channel S1 and fall into the first cavity 100A, thereby reducing the dust entering the first cavity 100A, reducing the dust falling on the pins 12, reducing the risk of poor electrical connection when the electrical connector body 10 is subsequently connected to the chip 32, and reducing the bit error rate of signal transmission and the risk of reduced signal transmission rate.

[0083] In some embodiments, Fig. 6A and Figure 6B As shown, the projection of the first opening 201 on the second surface 21B does not overlap with the second opening 202. In this case, when dust falls from directly above the first opening 201, most or almost all of the dust that falls will be blocked by the side wall of the first heat conduction channel S1, reducing the probability of dust directly falling into the first cavity 100A through the first heat conduction channel S1, thereby further reducing the dust that enters the first cavity 100A, reducing the dust that falls on the pins 12, and reducing the risk of poor electrical connection between the electrical connector body 10 and the chip 32.

[0084] In some embodiments, see Fig. 6A and Figure 6B , the plurality of first heat conduction channels S1 may be arranged in a plurality of rows and columns, for example, each row includes a plurality of first heat conduction channels S1 arranged along a first direction X, and each column includes a plurality of first heat conduction channels S1 arranged along a second direction Y. The first direction X intersects with the second direction Y, and the first direction X and the second direction Y are parallel to the first surface 21A. For example, the first direction X is perpendicular to the second direction Y, and the first direction X and the second direction Y are parallel to the first surface 21A. At this time, the arrangement of the first heat conduction channels S1 between different rows may also include the following two examples.

[0085] Example 1, such as Fig. 6A As shown, a plurality of first heat conduction channels S1 are arranged in a matrix form. The arrangement of the first heat conduction channels S1 is more regular, the processing method is simple, and the preparation cost can be reduced.

[0086] Example 2, such as Figure 6BAs shown, three adjacent first heat-conducting channels S1 form a triangular arrangement, and the centers of the first openings 201 of the three adjacent first heat-conducting channels S1 in FIG6 are connected to form a triangle. In this arrangement, the maximum diameters of the first heat-conducting channels S1 can be staggered, so that more first heat-conducting channels S1 can be opened on the top cover 21, the space utilization rate is high, and the area ratio of the first heat-conducting channels S1 to the top cover 21 can be increased, thereby improving the heat conduction efficiency.

[0087] In some embodiments, Figure 2 , Fig. 6A and Figure 6B As shown, the top cover 21 includes a cover plate 210, the surface of the cover plate 210 facing away from the connector body 10 is the first surface 21A, and the surface of the cover plate 210 facing the connector body 10 is the second surface 21B. The first heat conduction channel S1 runs through the cover plate 210 and connects the first opening 201 and the second opening 202. In this case, the top cover 21 can include only one layer of the cover plate 210, the top cover 21 has a good heat conduction effect, which is conducive to heat transfer during the reflow process, and the first heat conduction channel S1 only runs through one layer of the cover plate 210, the structure is simple, and it is easy to prepare.

[0088] Figure 7 for Figure 1 Another sectional view along section line AA'. Fig. 8A A top view of another dust cover provided for some embodiments of the present application. Figure 8B A top view of another dust cover provided for some embodiments of the present application. Fig. 8A The first opening 201 and the second opening 202 are rectangular. Figure 8B The first opening 201 and the second opening 202 are circular.

[0089] The above description is based on an example in which the top cover includes a cover plate 210. In other embodiments, such as Figure 7 , Fig. 8A and Figure 8BAs shown, the top cover 21 includes two cover plates 210, namely a first cover plate 211 and a second cover plate 212. The first cover plate 211 and the second cover plate 212 are stacked along the fourth direction Z, and there is a first gap 203 between the first cover plate 211 and the second cover plate 212. The surface of the first cover plate 211 facing away from the connector body 10 is the first surface 21A, and the surface of the second cover plate 212 facing the connector body 10 is the second surface 21B. Among them, the first heat conduction channel S1 runs through the first cover plate 211 and the second cover plate 212, and connects the first opening 201, the first gap 203 and the second opening 202. In this case, the top cover 21 includes two layers of cover plates 210. Dust enters the first cavity 100A from the outside of the dust cover 20 away from the first cavity 100A through the two layers of cover plates 210. This can block the dust layer by layer, further reducing the dust entering the first cavity 100A, thereby reducing the dust falling on the pin 12, reducing the risk of poor electrical connection between the electrical connector body 10 and the chip 32, and helping to reduce the bit error rate of signal transmission and the risk of a decrease in the signal transmission rate.

[0090] The configuration and technical effect of the first heat conduction channel S1 are the same as those described above. Moreover, the top cover 21 may also include more cover plates 210 , and the embodiment of the present application is not limited to two layers of cover plates 210 .

[0091] In addition, the first cover plate 211, the second cover plate 212 and the side plate 22 may be integrally formed, or may be fixedly connected to the side plate 22 by means of clamping, welding or the like.

[0092] The first heat conduction channel S1 includes a first sub-channel S11 and a second sub-channel S12 . The first sub-channel S11 passes through the first cover plate 211 , and the second sub-channel S12 passes through the second cover plate 212 .

[0093] On this basis, if Figure 7 As shown, the dust cover 20 may further include an adhesive layer 40, which is disposed on the surface of the second cover plate 212 facing the first cover plate 211. At this time, when dust enters the first gap 203 from the side of the first cover plate 211 away from the first cavity 100A, part of the dust will be adsorbed on the adhesive layer 40, avoiding entering the first cavity 100A from the first gap 203, thereby further reducing the dust entering the first cavity 100A, reducing the dust falling on the pins 12, and reducing the risk of poor electrical connection between the electrical connector body 10 and the chip 32. The adhesive layer 40 may be, for example, a glue layer.

[0094] In some embodiments, see Figure 7 , Fig. 8A and Figure 8B, the diameter of the first opening 201 is D1, and the height of the first gap 203 is H1 along the direction from the first cover plate 211 to the second cover plate 212. Wherein, H1≥D1. In this way, the distance between the first cover plate 211 and the second cover plate 212 (i.e., the height H1 of the first gap 203) is large, and heat can quickly enter the first gap 203 from the first opening 201, and be transferred from the first gap 203 to the second opening 202, and the heat conduction efficiency of the dust cover 20 is high.

[0095] The diameter D1 of the first opening 201 refers to the smallest radial length among all radial lengths passing through the center of the first opening 201 in a direction parallel to the first surface 21A.

[0096] For example, Figure 7 and Fig. 8A As shown, the opening shapes of the first opening 201 and the second opening 202 are rectangular, and the diameter D1 of the first opening 201 is the length of the short side of the rectangle. Figure 7 and Figure 8B As shown, the opening shapes of the first opening 201 and the second opening 202 are circular, and the diameter D1 of the first opening 201 is the diameter of the circle.

[0097] In some embodiments, see Figure 7 , Fig. 8A and Figure 8B , the diameter of the first opening 201 is D1, and the distance between two adjacent second openings 202 is D2. Wherein, D2 ≥ D1. In this way, the number of first heat conduction channels S1 on the top cover 21 can be increased, the space utilization rate is high, and the area ratio of the first heat conduction channels S1 to the top cover 21 can be increased, thereby improving the heat conduction efficiency.

[0098] For example, Fig. 8A and Figure 8B As shown, the opening shapes of the first opening 201 and the second opening 202 are rectangular, and the diameter D1 of the first opening 201 is the length of the short side of the rectangle. Fig. 8A and Figure 8B As shown, the opening shapes of the first opening 201 and the second opening 202 are circular, and the diameter D1 of the first opening 201 is the diameter of the circle.

[0099] For example, Fig. 8A and Figure 8B As shown, the distance D2 between two adjacent second openings 202 is 0.4 mm to 1 mm. For example, in the first direction X, the distance D2 between two adjacent second openings 202 is any one of 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm or 1 mm.

[0100] In some embodiments, see Figure 7 , Fig. 8A and Figure 8B , the area of ​​the second opening 202 is smaller than the area of ​​the first opening 201. At this time, the second subchannel S12 of the second cover plate 212 is narrower, the second cover plate 212 has a better dustproof effect than the first cover plate 211, and the first cover plate 211 has a better heat conduction effect than the second cover plate 212, so that the first cover plate 211 and the second cover plate 212 can block dust layer by layer under a higher heat conduction efficiency to achieve a better dustproof effect, thereby further reducing the dust entering the first cavity 100A, reducing the dust falling on the pin 12, reducing the risk of poor electrical connection between the electrical connector body 10 and the chip 32, and helping to reduce the bit error rate of signal transmission and the risk of reduced signal transmission rate.

[0101] In some embodiments, see Figure 7 , Fig. 8A and Figure 8B , the thickness of the second cover plate 212 is less than the thickness of the first cover plate 211. At this time, when the areas of the first opening 201 and the second opening 202 are the same, the heat conduction efficiency of the second cover plate 212 is higher. Based on this, the thickness of the second cover plate 212 is less than the thickness of the first cover plate 211, which is conducive to improving the heat conduction efficiency.

[0102] In the above embodiments, no matter the top cover 21 includes one layer of cover plate 210 or the top cover 21 includes two layers of cover plates 210 , the structures and arrangement of the first heat conduction channels S1 may be the same or different.

[0103] In some embodiments, see Figure 4 The top cover 21 has a first area 81 and a second area 82, and the first area 81 and the second area 82 do not overlap. In the automated production process, for example, when the chip 32 needs to be installed (see Figure 3 ), the production equipment can transfer the dust cover 20 by adsorbing it in the first area 81.

[0104] Fig. 9 A top view of a second cover plate of a dust cover provided in some embodiments of the present application.

[0105] like Figure 4 and Fig. 8A As shown, the first heat conduction channel S1 penetrates the first cover plate 211 in the first area 81 , and the first heat conduction channel S1 does not overlap with the second area 82 , so that the production equipment can transfer the dust cover 20 in the first area 81 by vacuum adsorption.

[0106] like Fig. 8A and Fig. 9As shown, the second cover plate 212 is further provided with a second heat conduction channel S2 penetrating the second cover plate 212 . The second heat conduction channel S2 penetrates the second cover plate 212 in the second region 82 to improve heat conduction efficiency.

[0107] The structure and arrangement of the second heat conducting channel S2 may be the same as the structure and arrangement of the first heat conducting channel S1 , and will not be described in detail in the embodiment of the present application.

[0108] The following takes the example that the top cover 21 includes a layer of cover plate 210 to exemplarily illustrate the structure of the first heat conduction channel S1 in some embodiments of the present application, but the embodiments of the present application are not limited thereto.

[0109] In some embodiments, Figure 2 , Fig. 6A and Figure 6B As shown, the diameter of the first opening 201 is D1, and the thickness of the cover plate 210 is H2. Among them, H2 / D1≤2. In this way, the thickness of the cover plate 210 is small, and the diameter of the first opening 201 is small, which can prevent a lot of dust from entering the first cavity 100A on the basis of good heat conduction effect, and play a good dustproof effect.

[0110] For example, Figure 7 and Fig. 8A As shown, the opening shapes of the first opening 201 and the second opening 202 are rectangular, and the diameter D1 of the first opening 201 is the length of the short side of the rectangle. For example, the width of the first opening 201 is less than or equal to 1.5 mm, such as the width of the first opening 201 is any one of 0.5 mm, 0.6 mm, 0.8 mm, 1 mm, 1.3 mm or 1.5 mm; the length of the first opening 201 is less than or equal to 5 mm, such as the length of the first opening 201 is any one of 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm or 5 mm. The thickness of the cover plate 210 is less than or equal to 1.5 mm.

[0111] For example, Figure 7 and Figure 8B As shown, the opening shapes of the first opening 201 and the second opening 202 are circular, and the diameter D1 of the first opening 201 is the diameter of the circle. For example, the diameter of the first opening 201 is 0.5 mm to 1.5 mm, such as the diameter of the first opening 201 is any one of 0.5 mm, 0.6 mm, 0.8 mm, 1 mm, 1.3 mm or 1.5 mm. The thickness of the cover plate 210 is less than or equal to 1.5 mm.

[0112] Fig.10 for Fig. 6A A top view of a first heat conduction channel in FIG.

[0113] In some embodiments, see Fig.10 The dust cover 20 includes a blocking structure 50, which is located in the first heat conduction channel S1 (see Fig. 6A ). At this time, the blocking structure 50 can block the heat from falling on the first heat conduction channel S1 (see Fig. 6A ) enters the first cavity 100A (see Figure 2 ).

[0114] In this way, when dust enters the first heat conducting channel S1 from the first opening 201 and falls on the side wall of the first heat conducting channel S1, the dust can be blocked by the blocking structure 50, thereby preventing the dust from moving into the first cavity 100A, further reducing the dust entering the first cavity 100A, reducing the dust falling on the pin 12, and reducing the risk of poor electrical connection between the electrical connector body 10 and the chip 32.

[0115] In some embodiments, see Figure 2 and Fig.10 , the side wall of the first heat conduction channel S1 has a first portion W10, the first opening 201 exposes the first portion W10, and the blocking structure 50 is disposed on the first portion 201. At this time, dust falling from the first opening 201 along the fourth direction Z (e.g., the direction of gravity) can be blocked by the blocking structure 50 when falling on the first portion W10, thereby preventing the dust from moving into the first cavity 100A, further reducing the dust entering the first cavity 100A, reducing the dust falling on the pins 12, and reducing the risk of poor electrical connection between the electrical connector body 10 and the chip 32.

[0116] In some embodiments, see Fig. 6A and Fig.10 The opening shapes of the first opening 201 and the second opening 202 are rectangular, and the first heat conduction channel S1 includes a first side wall W11, a second side wall W12, a third side wall W13, and a fourth side wall W14 connected end to end. The first opening 201 exposes at least a portion of the first side wall W11, and the portion of the first side wall W11 exposed by the first opening 201 is a first portion W10, and the blocking structure 50 is disposed on the first side wall W11.

[0117] Fig.11 for Fig. 6A A sectional view along section line BB'. Fig.12 for Fig. 6A A sectional view along section line CC'. Fig.13 for Fig. 6A Another sectional view along section line BB'.

[0118] Combination Fig.11 and Fig.12The blocking structure 50 can be arranged only on the first side wall W11, that is, the second side wall W12, the third side wall W13 and the fourth side wall W14 are not provided with the blocking structure 50, and the first heat conduction channel S1 has the blocking structure 50 on only one side of the side wall. The area where the blocking structure 50 is arranged is small, the structure is simple, and it is easy to prepare. Alternatively, refer to Fig.13 The blocking structure 50 can also be set on at least one of the second side wall W12, the third side wall W13 and the fourth side wall W14 to further reduce the dust entering the first cavity 100A, reduce the dust falling on the pin 12, and reduce the risk of poor electrical connection between the electrical connector body 10 and the chip 32. Fig.13 The middle blocking structure 50 may also be disposed on the third side wall W13 for illustration.

[0119] Some embodiments of the present application are schematically described below by taking the first side wall W11 provided with a blocking structure 50 as an example, but the embodiments of the present application are not limited thereto.

[0120] Fig.14 for Fig. 6A Another cross-sectional view along section line BB'.

[0121] In some embodiments, Fig.14 As shown, the blocking structure 50 includes a plurality of pits 510 formed on the side wall of the first heat conduction channel S1. At this time, when dust falls on the side wall of the first heat conduction channel S1, the dust can be adsorbed in the pits 510, thereby preventing the dust from moving along the side wall of the first heat conduction channel S1, reducing the dust entering the first cavity 100A, reducing the dust falling on the pins 12, and reducing the risk of poor electrical connection between the electrical connector body 10 and the chip 32. Exemplarily, the blocking structure 50 is a frosted surface formed on the side wall of the first heat conduction channel S1.

[0122] In other embodiments, Fig.11 As shown, the blocking structure 50 includes a plurality of blocking protrusions 520 formed on the side wall of the first heat conducting channel S1, and the angle between the side of the blocking protrusion 520 close to the first surface 21A and the side wall of the first heat conducting channel S1 is an acute angle. In this case, when dust falls on the side wall of the first heat conducting channel S1, the dust can be retained between the blocking protrusion 520 and the side wall of the first heat conducting channel S1 under the blocking effect of the blocking protrusion 520, thereby preventing the dust from moving along the side wall of the first heat conducting channel S1, reducing the dust entering the first cavity 100A, reducing the dust falling on the pin 12, and reducing the risk of poor electrical connection between the electrical connector body 10 and the chip 32.

[0123] The shape of the orthographic projection of the blocking protrusion 520 on the reference surface may be a rectangle, a triangle, a semicircle or other irregular shapes, but the embodiments of the present application are not limited thereto.

[0124] Fig.15 for Fig.11 A top view of a first heat conducting channel at a first opening is shown.

[0125] In some examples, such as Fig.15 As shown, a plurality of blocking protrusions 520 are arranged in an array. That is, a plurality of blocking protrusions 520 can be arranged at intervals along the circumference of the first heat conduction channel S1, and along the extension direction of the first heat conduction channel S1 (see Figure 2 In this case, the blocking protrusion 520 occupies a smaller area of ​​the first heat conduction channel S1, and the heat conduction effect is better. At this time, the shape of the projection of the blocking protrusion 520 on the first surface 21A can be a triangle, combined with Fig.10 The blocking protrusion 520 on the side wall of the first heat conducting channel S1 may be, for example, in the form of a barb.

[0126] Fig.16A for Fig.11 A top view of another first heat conducting channel at the first opening is shown. Fig. 16B for Fig.11 A top view of another first heat conducting channel at the first opening is shown.

[0127] In some examples, such as Fig.16A As shown, the blocking protrusion 520 is a strip-shaped structure, and a plurality of blocking protrusions 520 extend along the extension direction of the first heat conduction channel S1 (see Figure 2 The third direction M) interval setting in the middle. Or, Fig. 16B As shown, the blocking protrusion 520 is an annular structure, which surrounds the side wall of the first heat conduction channel S1, and a plurality of blocking protrusions 520 extend along the extension direction of the first heat conduction channel S1 (see Figure 2 In this case, the blocking protrusion 520 can prevent more dust from moving along the side wall of the first heat conduction channel S1, and the dustproof effect is better. At this time, the shape of the projection of the blocking protrusion 520 on the first surface 21A can be a rectangle.

[0128] Fig.17 A front view of a dust cover provided in some embodiments of the present application. Fig.18 A side view of a dust cover provided in some embodiments of the present application. Fig.19 for Fig.17 A sectional view along section line AA'.

[0129] In some embodiments, Figure 2As shown, the side plate 22 has a third surface 22A and a fourth surface 22B that are arranged opposite to each other, the third surface 22A is away from the first cavity 100A, and the fourth surface 22B is toward the first cavity 100A. The side plate 22 is provided with a third heat conduction channel S3 that runs through the side plate 22, so that when the connector body 10 is fixed to the board body 31 by reflow soldering, heat can also be transferred through the third heat conduction channel S3 to weld the connector body 10 to the board body 31.

[0130] Combination Fig.17 , Fig.18 and Fig.19 The third heat conducting channel S3 penetrates the third surface 22A to form a third opening 204, and the third heat conducting channel S3 penetrates the fourth surface 22B to form a fourth opening 205. The third opening 204 and the fourth opening 205 are staggered. Here, staggered arrangement includes partial staggering and complete staggering.

[0131] The third opening 204 and the fourth opening 205 are partially staggered, which means that the projection (i.e., vertical projection) of the third opening 204 on the fourth surface 22B partially overlaps with the fourth opening 205. The third opening 204 and the fourth opening 205 are completely staggered, which means that the projection of the third opening 204 on the fourth surface 22B does not overlap with the fourth opening 205.

[0132] In this case, since the third opening 204 and the fourth opening 205 are staggered, the third opening 204 exposes at least a portion of the side wall of the third heat conducting channel S3. In this way, when dust falls from directly above the third opening 204, at least a portion of the dust will be blocked by the side wall of the third heat conducting channel S3, so that the dust cannot directly pass through the third heat conducting channel S3 and enter the first cavity 100A, thereby reducing the dust entering the first cavity 100A, reducing the dust falling on the pin 12, reducing the risk of poor electrical connection between the electrical connector body 10 and the chip 32, and reducing the bit error rate of signal transmission and the risk of a decrease in the signal transmission rate.

[0133] The structure and arrangement of the third heat conducting channel S3 may be the same as the structure and arrangement of the first heat conducting channel S1 , and will not be described in detail in the embodiment of the present application.

[0134] In addition, the ratio of the sum of the areas of the first opening 201 and the third opening 204 to the sum of the areas of the first cover plate 210 and the side plate 22 is greater than or equal to 30%. For example, the ratio of the sum of the areas of the first opening 201 and the third opening 204 to the sum of the areas of the first cover plate 210 and the side plate 22 is 50%. In this way, the dust cover 20 has a higher thermal conductivity, which is beneficial for the connector body 10 to be fixed on the plate body 31 by reflow soldering.

[0135] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0136] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that a person skilled in the art can think of within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electrical connector, characterized in that: include: The connector body comprises a base and a pin, wherein the pin is arranged on the base, and a first end and a second end of the pin extend out of opposite sides of the base respectively; the first end and the second end are opposite ends of the pin; A dust cover is connected to the base to form a first cavity, and the first end of the pin extends into the first cavity; the dust cover includes a top cover, the top cover has a first surface and a second surface arranged opposite to each other, the first surface is away from the connector body, and the second surface faces the connector body; the top cover is provided with a first heat conduction channel passing through the top cover, the first heat conduction channel passes through the first surface to form a first opening, the first heat conduction channel passes through the second surface to form a second opening, and the first opening and the second opening are staggered.

2. The electrical connector according to claim 1, characterized in that: A projection of the first opening on the second surface does not overlap with the second opening.

3. The electrical connector according to claim 1 or 2, characterized in that: The top cover comprises a cover plate, the surface of the cover plate facing away from the connector body is the first surface, and the surface of the cover plate facing the connector body is the second surface; Wherein, the first heat conduction channel passes through the cover plate and communicates with the first opening and the second opening.

4. The electrical connector according to claim 1 or 2, characterized in that: The top cover comprises a first cover plate and a second cover plate, the first cover plate and the second cover plate are stacked, and a first gap is formed between the first cover plate and the second cover plate, the surface of the first cover plate facing away from the connector body is the first surface, and the surface of the second cover plate facing the connector body is the second surface; The first heat conduction channel passes through the first cover plate and the second cover plate, and is connected to the first opening, the first gap, and the second opening.

5. The electrical connector according to claim 4, characterized in that: The dustproof cover further includes an adhesive layer, and the adhesive layer is arranged on a surface of the second cover plate facing the first cover plate.

6. The electrical connector according to claim 4 or 5, characterized in that: The diameter of the first opening is D1, and the height of the first gap is H1 along the direction from the first cover plate to the second cover plate; wherein H1≥D1.

7. The electrical connector according to claim 3, characterized in that: The first heat conduction channel obliquely penetrates the top cover along a third direction; an angle is formed between the third direction and a fourth direction; and the fourth direction is a direction from the first surface to the second surface.

8. The electrical connector according to claim 7, characterized in that: The dust cover further includes a blocking structure, and the blocking structure is located on at least a portion of a side wall of the first heat conduction channel.

9. The electrical connector according to claim 7 or 8, characterized in that: The included angle between the third direction and the fourth direction is 30° to 60°.

10. The electrical connector according to any one of claims 1 to 9, characterized in that: The dust cover also includes: A side plate is arranged around the edge of the top cover and connected to the connector body; the side plate has a third surface and a fourth surface arranged opposite to each other, the third surface faces away from the first cavity, and the fourth surface faces the first cavity; the side plate is provided with a third heat conduction channel running through the side plate, the third heat conduction channel runs through the third surface to form a third opening, the third heat conduction channel runs through the fourth surface to form a fourth opening, and the third opening and the fourth opening are staggered.

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