PCB design method compatible with SOCKET crimping and SMT welding

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By adding steel mesh to the FILMMASK layer of SOCKET package and adding the second steel mesh for SMT coupling during the optical drawing setting stage, the existing PCB design method needs to be carried out when SMT welding and SOCKET crimping are required at the same time. The two design and production issues have achieved a PCB design that is compatible with the two welding methods, significantly shortening the design and production cycle.

CN119403039APending Publication Date: 2025-02-07EMDOOR ELECTRONICS TECH

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Patent Information

Application Number: CN202411376860.5
Authority / Receiving Office: CN · China
Patent Type: Applications(China)
Current Assignee / Owner
Filing Date: 2024-09-30
Publication Date: 2025-02-07

AI Technical Summary

Technical Problem

When existing PCB design methods require SMT welding and SOCKET crimping at the same time, two PCB design and production are required, resulting in an extended design and production cycle.

Method used

By adding steel mesh to the FILMMASK layer of SOCKET package, optimizing the SOCKET package, and adding the second steel mesh for SMT welding during the optical drawing setting stage, generating PCB design files compatible with SOCKET crimping and SMT welding.

Benefits of technology

The same package is compatible with two packaging forms (SOCKET crimping and SMT welding). Two welding methods can be realized in one PCB design and production, avoiding multiple modifications of files or output files, and significantly shortening the design and production cycle.

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Abstract

The invention discloses a PCB design method compatible with SOCKET crimping and SMT welding, and the method comprises the steps: S1, adding a steel mesh in an FILMMASK layer of SOCKET packaging, and completing the optimization of the SOCKET packaging; s2, the optimized SOCKET package is called during PCB design, in the light painting setting stage, besides a default first steel mesh light painting for SOCKET crimping, a second steel mesh light painting for SMT welding is additionally added, and an FILMMASK layer of the optimized SOCKET package is added into the second steel mesh light painting; and S3, after the PCB design is completed, outputting a first steel mesh light painting file containing the first steel mesh light painting and a second steel mesh light painting file containing the second steel mesh light painting. According to the invention, the same package is compatible with two packaging forms, and the design and production periods are greatly shortened.

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Description

Background Art

[0002] PCB (Printed Circuit Board), whose Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Packaging is an important production and processing link in its application.

[0003] In the actual PCB design process, there are two ways to solder BGA (Ball Grid Array) chips. One is to solder the chip directly to the PCB to achieve interconnection; the other is to use a suitable SOCKET (socket), put the BGA chip on the SOCKET, and then press the BGA and the PAD (pad, which is the part where the PCB board and the component pins are soldered together) on the PCB to achieve interconnection. The traditional PCB design method is to design two PCBs for two different soldering methods, one using SOCKET packaging and the other using SMT packaging, and output the corresponding photolithography files respectively.

[0004] However, in traditional PCB design, when both SMT soldering and SOCKET crimping are needed, PCB design needs to be done twice, and then PCB production also needs to be done twice, and PCB soldering also needs to be done twice, which means that the entire project needs to be done again from design to production, greatly extending the design and production cycle. Since conventional PCB design selects different packages according to needs, if both SMT soldering and SOCKET crimping are used, usually a PCB with one package is designed first, then the schematic diagram is changed, and then another package is called for PCB design, and then production. This will result in two PCB design files and two productions. Summary of the invention

[0005] In order to overcome the problem that in the existing PCB design practice, when both SMT welding and SOCKET crimping are required, the PCB design and production need to be performed twice, which prolongs the design and production cycle, the present invention provides a PCB design method that is compatible with SOCKET crimping and SMT welding.

[0006] The technical solution of the present invention is as follows:

[0007] A PCB design method compatible with SOCKET crimping and SMT soldering, comprising:

[0008] Step S1, adding a steel mesh in the FILMMASK layer of the SOCKET package to complete the optimization of the SOCKET package;

[0009] Step S2, calling the optimized SOCKET package during PCB design, in the photo-drawing setting stage, in addition to setting the default first steel mesh photo-drawing for SOCKET crimping, an additional second steel mesh photo-drawing for SMT welding is added, and the FILMMASK layer of the optimized SOCKET package is added to the second steel mesh photo-drawing;

[0010] Step S3: after the PCB design is completed, output a first stencil photo-painting file including the first stencil photo-painting and a second stencil photo-painting file including the second stencil photo-painting.

[0011] As a preferred solution of the present invention, the first stencil photo-drawing does not include stencil information of BGA devices, and the second stencil photo-drawing includes stencil information of BGA devices.

[0012] As a preferred solution of the present invention, the second stencil photo-painting includes all the information of the first stencil photo-painting.

[0013] As a preferred solution of the present invention, step S1 specifically includes the following sub-steps:

[0014] Step S11, making a solder mask window on the BGA PAD in the SOCKETMASK layer of the SOCKET package;

[0015] Step S12, setting the PASTETMASK layer of the SOCKET package to None by default;

[0016] Step S13, adding a steel mesh in the FILMMASK layer of the SOCKET package.

[0017] As a preferred solution of the present invention, the size of the steel mesh is the same as that of the BGAPAD.

[0018] As a preferred solution of the present invention, step S2 specifically includes the following sub-steps:

[0019] Step S21, adding the optimized SOCKET package to the PCB schematic, generating a netlist and importing it into the PCB, and implementing the call of the optimized SOCKET package;

[0020] Step S22, in the photo-drawing setting stage, setting the first steel mesh photo-drawing for the default SOCKET crimping and naming it;

[0021] Step S23, in the photo-painting setting stage, add a second steel mesh photo-painting for SMT welding and name it, the setting of the second steel mesh photo-painting is consistent with the first steel mesh photo-painting, and then add the optimized FILMMASK layer of the SOCKET package to the second steel mesh photo-painting.

[0022] As a preferred solution of the present invention, when the BGA device is placed on the TOP layer of the PCB, step S1 specifically includes the following sub-steps:

[0023] Step S11, making a solder mask window on the BGAPAD in the SOCKETMASK_TOP layer of the SOCKET package;

[0024] Step S12, setting the PASTETMASK_TOP layer of the SOCKET package to None by default;

[0025] Step S13, adding a steel mesh in the FILMMASK_TOP layer of the SOCKET package.

[0026] As a preferred solution of the present invention, step S2 specifically includes the following sub-steps:

[0027] Step S21, adding the optimized SOCKET package to the PCB schematic, generating a netlist and importing it into the PCB, and implementing the call of the optimized SOCKET package;

[0028] Step S22, in the photo-drawing setting stage, set the default first TOP layer steel mesh photo-drawing for SOCKET crimping and name it;

[0029] Step S23, in the photo-painting setting stage, add a second TOP layer steel mesh photo-painting for SMT welding and name it, the setting of the second TOP layer steel mesh photo-painting is consistent with the first TOP layer steel mesh photo-painting, and then add the optimized FILMMASK_TOP layer of the SOCKET package to the second TOP layer steel mesh photo-painting.

[0030] As a preferred solution of the present invention, in step S3, after the PCB design is completed, a first TOP layer steel mesh photo-drawing file containing the first TOP layer steel mesh photo-drawing and a second TOP layer steel mesh photo-drawing file containing the second TOP layer steel mesh photo-drawing are output.

[0031] As a preferred solution of the present invention, when the BGA device is placed on the BOTTOM layer of the PCB, step S1 specifically includes the following sub-steps:

[0032] Step S11, making a solder mask window on the BGAPAD in the SOCKETMASK_BOTTOM layer of the SOCKET package;

[0033] Step S12, setting the PASTETMASK_BOTTOM layer of the SOCKET package to None by default;

[0034] Step S13, adding a steel mesh in the FILMMASK_BOTTOM layer of the SOCKET package.

[0035] The present invention according to the above scheme has the following beneficial effects:

[0036] The present invention provides a PCB design method compatible with SOCKET crimping and SMT welding. By adding a steel mesh in a FILMMASK layer of a SOCKET package, the SOCKET package is optimized. Then, in the photo-drawing setting stage, in addition to setting a default first steel mesh photo-drawing for SOCKET crimping, a second steel mesh photo-drawing for SMT welding is additionally added to optimize the PCB output file, so that the same package is compatible with two package forms (SOCKET crimping and SMT welding). Two welding methods can be realized in one PCB design and production, and multiple file modifications or multiple file outputs are avoided, thereby greatly shortening the design and production cycle. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 A schematic flow chart of a PCB design method compatible with SOCKET crimping and SMT welding in one embodiment of the present invention;

[0038] Figure 2 In one embodiment of the present invention Figure 1 Specific flow diagram of step S1 in FIG.

[0039] Figure 3 In one embodiment of the present invention Figure 1 Specific flow diagram of step S2;

[0040] Figure 4 In another embodiment of the present invention Figure 1 Specific flow diagram of step S1 in FIG.

[0041] Figure 5 In another embodiment of the present invention Figure 1 Specific flow diagram of step S2 in FIG. DETAILED DESCRIPTION

[0042] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0043] It should be noted that the terms "including" and "having" and any variations thereof in the specification and claims of the present invention are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products or devices.

[0044] Please refer to Figure 1 This embodiment provides a PCB design method compatible with SOCKET crimping and SMT welding, including:

[0045] Step S1, add a steel mesh in the FILMMASK layer of the SOCKET package to complete the optimization of the SOCKET package, so as to facilitate the subsequent photo-painting settings and production requirements. In conventional PCB design, the welding information of all packages is set in the PASTEMASK layer by default, which is convenient for the unified setting and output of photo-painting. However, since the SOCKET package is crimped and does not require welding, there is no need to add the PASTEMASK layer, and the steel mesh cannot be added, because the addition of the steel mesh will cause the BGAPAD to be not flat enough, resulting in poor contact and other problems.

[0046] Step S2, call the optimized SOCKET package during PCB design. In the photo-drawing setting stage, in addition to setting the default first steel mesh photo-drawing for SOCKET crimping, add an additional second steel mesh photo-drawing for SMT welding, and add the FILMMASK layer of the optimized SOCKET package to the second steel mesh photo-drawing. Among them, the first steel mesh photo-drawing does not contain the steel mesh information of the BGA device, indicating that the BGA device is used for SOCKET crimping. In addition to all the information of the first steel mesh photo-drawing, the second steel mesh photo-drawing also contains the steel mesh information of the BGA device to indicate that the BGA device is used for SMT welding.

[0047] Step S3, after the PCB design is completed, output the first steel mesh photo-painting file containing the first steel mesh photo-painting and the second steel mesh photo-painting file containing the second steel mesh photo-painting. After the photo-painting file is output, if SOCKET crimping is selected (i.e., the BGA chip needs to be crimped onto the PCB with SOCKET), the first steel mesh photo-painting file is selected for production, and the first steel mesh photo-painting file does not contain the steel mesh of BGAPAD; if SMT welding is selected (i.e., the BGA chip needs to be welded to the PCB), the second steel mesh photo-painting file is selected for production, and the second steel mesh photo-painting file contains the steel mesh of BGAPAD, which is used for the patch factory to open the steel mesh for welding. If SOCKET crimping and SMT welding are selected at the same time, such as the BGA chip needs to be crimped onto a part of the PCB with SOCKET, and the BGA chip needs to be welded onto another part of the PCB, when the patch is placed at the welding factory, the patch factory can be told how many PCBs are needed to crimp the BGA onto the PCB with SOCKET, and how many PCBs are needed to weld the BGA onto the PCB. In this way, the patch factory can make steel mesh for production according to actual needs, and avoid re-modifying the PCB design files and re-outputting the photolithography files.

[0048] The above-mentioned PCB design method compatible with SOCKET crimping and SMT welding optimizes the SOCKET package by adding a steel mesh in the FILMMASK layer of the SOCKET package, and then in the photo-drawing setting stage, in addition to setting the default first steel mesh photo-drawing for SOCKET crimping, an additional second steel mesh photo-drawing for SMT welding is added to optimize the PCB output file, so that the same package is compatible with two package forms (SOCKET crimping and SMT welding). Two welding methods can be realized in one PCB design and production, and multiple file modifications or multiple file outputs are avoided, which greatly shortens the design and production cycle.

[0049] Please refer to Figure 2 In one embodiment, when the BGA device is placed on the TOP layer of the PCB, step S1 specifically includes the following sub-steps:

[0050] Step S11, make a solder mask window on the BGAPAD in the SOCKETMASK_TOP layer of the SOCKET package. In PCB design, the solder mask is used to cover the copper foil to prevent the copper foil from being unnecessarily soldered or short-circuited during welding. Opening a window refers to removing the solder mask to expose the copper foil, allowing solder to contact the copper foil. Making a solder mask window on the BGA PAD of the SOCKET package is to ensure that the BGA chip can be SOCKE crimped or SMT soldered to the BGAPAD of the PCB during the SOCKE crimping process or SMT welding. Among them, the window size is confirmed according to conventional operations, usually based on the actual size of the BGAPAD and the contact requirements of the SOCKET. Opening a window that is too small may result in poor contact, while opening a window that is too large may increase the risk of short circuit.

[0051] Step S12, the PASTETMASK_TOP layer of the SOCKET package is set to None by default, indicating that the PASTETMASK_TOP layer of the SOCKET package is closed. In PCB design, the PASTETMASK_TOP layer is used to define the solder paste coating area, that is, to instruct the placement machine in which area to apply solder paste. For SOCKET packaging, since it is a crimping method, solder paste is not required, so the layer setting is all set to None by default.

[0052] Step S13, add a steel mesh in the FILMMASK_TOP layer of the SOCKET package, so that the FILMMASK_TOP layer is used as a medium for adding steel mesh information to facilitate subsequent photolithography settings and production requirements. The steel mesh is used to control the coating shape and amount of solder paste in SMT welding to ensure the quality of solder joints. Among them, the size of the steel mesh is the same as the size of the BGAPAD to ensure that the solder paste can be accurately coated on the BGAPAD.

[0053] The above SOCKET package optimization step optimizes the steel mesh setting of the SOCKET package so that the optimized SOCKET package can meet both the SOCKET crimping mounting method and the SMT direct welding mounting method.

[0054] Please refer to Figure 3 In one embodiment, when the BGA device is placed on the TOP layer of the PCB, step S2 specifically includes the following sub-steps:

[0055] Step S21, adding the optimized SOCKET package to the PCB schematic, generating a netlist and importing it into the PCB, so as to call the optimized SOCKET package during PCB design.

[0056] Step S22, in the photo-painting setting stage, set the default first TOP layer steel mesh photo-painting for SOCKET crimping and name it, such as PASTTOP_SOCKET, to represent SOCKET crimping; and set other photo-painting layers according to the default rules.

[0057] Step S23, in the photo-painting setting stage, add a second TOP layer steel mesh photo-painting for SMT welding and name it, such as PASTTOP_SOLDERDOWN, which is used to represent STM welding. The setting of the second TOP layer steel mesh photo-painting is consistent with the first TOP layer steel mesh photo-painting, and then add the optimized SOCKET package FILMMASK_TOP layer to the second TOP layer steel mesh photo-painting. Among them, the first TOP layer steel mesh photo-painting does not contain the steel mesh information of the BGA device to indicate that the BGA device is used for SOCKET crimping. In addition to all the information of the first TOP layer steel mesh photo-painting, the second TOP layer steel mesh photo-painting also contains the steel mesh information of the BGA device to indicate that the BGA device is used for SMT welding.

[0058] In the above PCB design steps, by introducing two TOP layer steel mesh photo-paints with different purposes in PCB design, designers can flexibly choose the crimping or welding method of BGA devices according to needs, without redesigning the PCB or modifying a large number of settings; for PCB boards that need to support both SOCKET crimping and SMT welding, this design method allows manufacturers to quickly switch production methods when needed without having to replace the entire PCB board or make complex adjustments; by clearly distinguishing between steel mesh photo-paints used for SOCKET crimping and SMT welding, errors caused by confusion or misoperation during the production process are reduced, thereby reducing rework rate and production costs.

[0059] In one embodiment, when the BGA device is placed on the TOP layer of the PCB, in step S3, after the PCB design is completed, the first TOP layer steel mesh photo-painting file containing the first TOP layer steel mesh photo-painting and the second TOP layer steel mesh photo-painting file containing the second TOP layer steel mesh photo-painting are output. After the photo-painting file is output, the customer can choose different TOP layer steel mesh photo-painting files for production, steel mesh production and welding according to actual needs. If SOCKET crimping is selected (that is, the BGA chip needs to be crimped onto the PCB with SOCKET), the first TOP layer steel mesh photo-painting file is selected for production, and the first steel mesh photo-painting file does not contain the steel mesh of BGAPAD; if SMT welding is selected (that is, the BGA chip needs to be welded to the PCB), the second TOP layer steel mesh photo-painting file is selected for production, and the second TOP layer steel mesh photo-painting file contains the steel mesh of BGAPAD, which is used for the patch factory to open the steel mesh for welding.

[0060] Please refer to Figure 4 In another embodiment, when the BGA device is placed on the BOTTOM layer of the PCB, step S1 specifically includes the following sub-steps:

[0061] Step S11, making a solder mask window on the BGAPAD in the SOCKETMASK_BOTTOM layer of the SOCKET package, wherein the size of the window is determined according to conventional operations, usually based on the actual size of the BGAPAD and the contact requirements of the SOCKET.

[0062] Step S12, the PASTETMASK_BOTTOM layer of the SOCKET package is set to None by default, indicating that the PASTETMASK_BOTTOM layer of the SOCKET package is closed. In PCB design, the PASTETMASK_BOTTOM layer is used to define the solder paste coating area, that is, to instruct the placement machine in which area to apply solder paste. For SOCKET packaging, since it is a crimping method, solder paste is not required, so the layer setting is all set to None by default.

[0063] Step S13, add a steel mesh in the FILMMASK_BOTTOM layer of the SOCKET package, so that the FILMMASK_BOTTOM layer is used as a medium for adding steel mesh information, so as to facilitate subsequent photolithography settings and production requirements. The size of the steel mesh is the same as the size of the BGAPAD to ensure that the solder paste can be accurately coated on the BGAPAD.

[0064] The above SOCKET package optimization step optimizes the steel mesh setting of the SOCKET package so that the optimized SOCKET package can meet both the SOCKET crimping mounting method and the SMT direct welding mounting method.

[0065] Please refer to Figure 5 In another embodiment, when the BGA device is placed on the BOTTOM layer of the PCB, step S2 specifically includes the following sub-steps:

[0066] Step S21, adding the optimized SOCKET package to the PCB schematic, generating a netlist and importing it into the PCB, so as to call the optimized SOCKET package during PCB design.

[0067] Step S22, in the photo-painting setting stage, set the default first BOTTOM layer steel mesh photo-painting for SOCKET crimping and name it, such as PASTBOTTOM_SOCKET, to represent SOCKET crimping; and set other photo-painting layers according to the default rules.

[0068] Step S23, in the photo-painting setting stage, add a second BOTTOM layer steel mesh photo-painting for SMT welding and name it, such as PASTBOTTOM_SOLDERDOWN, which is used to represent STM welding. The setting of the second BOTTOM layer steel mesh photo-painting is consistent with the first BOTTOM layer steel mesh photo-painting, and then add the optimized SOCKET package FILMMASK_BOTTOM layer to the second BOTTOM layer steel mesh photo-painting. Among them, the first BOTTOM layer steel mesh photo-painting does not contain the steel mesh information of the BGA device, to indicate that the BGA device is used for SOCKET crimping. In addition to all the information of the first BOTTOM layer steel mesh photo-painting, the second BOTTOM layer steel mesh photo-painting also contains the steel mesh information of the BGA device to indicate that the BGA device is used for SMT welding.

[0069] The above PCB design steps, by introducing two BOTTOM layer steel mesh photo-paintings with different purposes in PCB design, allow designers to flexibly choose the crimping or welding method of BGA devices as needed, without redesigning the PCB or modifying a large number of settings; for PCB boards that need to support both SOCKET crimping and SMT welding, this design method allows manufacturers to quickly switch production methods when needed without having to replace the entire PCB board or make complex adjustments; by clearly distinguishing between steel mesh photo-paintings for SOCKET crimping and SMT welding, errors caused by confusion or misoperation during the production process are reduced, thereby reducing rework rates and production costs.

[0070] In another embodiment, when the BGA device is placed on the BOTTOM layer of the PCB, in step S3, after the PCB design is completed, the first BOTTOM layer steel mesh photo-painting file containing the first BOTTOM layer steel mesh photo-painting and the second BOTTOM layer steel mesh photo-painting file containing the second BOTTOM layer steel mesh photo-painting are output. After the photo-painting file is output, the customer can select different BOTTOM layer steel mesh photo-painting files for production, steel mesh production and welding according to actual needs. If SOCKET crimping is selected (i.e., the BGA chip needs to be crimped onto the PCB with SOCKET), the first BOTTOM layer steel mesh photo-painting file is selected for production, and the first steel mesh photo-painting file does not contain the steel mesh of BGA PAD; if SMT welding is selected (i.e., the BGA chip needs to be welded to the PCB), the second BOTTOM layer steel mesh photo-painting file is selected for production, and the second BOTTOM layer steel mesh photo-painting file contains the steel mesh of BGAPAD, which is used for the patch factory to open the steel mesh for welding.

[0071] It will be appreciated by those skilled in the art that various aspects of the present invention may be implemented as a system, method or program product. Therefore, various aspects of the present invention may be specifically implemented in the following forms, namely: a complete hardware implementation, a complete software implementation (including firmware, microcode, etc.), or a combination of hardware and software, which may be collectively referred to herein as a "circuit", "module" or "system".

[0072] According to the modules, submodules, units, and subunits of the present embodiment, any multiple or at least part of the functions of any multiple thereof can be implemented in one module. According to the modules, submodules, units, and subunits of the present embodiment, any one or more thereof can be split into multiple modules for implementation. According to the modules, submodules, units, and subunits of the present embodiment, any one or more thereof can be at least partially implemented as a hardware circuit, such as a field programmable gate array (FPGA), a programmable logic array (PLA), a system on a chip, a system on a substrate, a system on a package, an application specific integrated circuit (ASIC), or can be implemented by hardware or firmware of any other reasonable way of integrating or packaging the circuit, or implemented in any one of the three implementation modes of software, hardware, and firmware or in any appropriate combination of any of them. Alternatively, according to the modules, submodules, units, and subunits of the present embodiment, one or more thereof can be at least partially implemented as a computer program module, and when the computer program module is run, the corresponding function can be executed.

[0073] In one embodiment, the present invention provides a PCB design device compatible with SOCKET crimping and SMT soldering, which may include at least one processing unit and at least one storage unit. The storage unit stores a program code, and when the program code is executed by the processing unit, the processing unit executes the steps in the PCB design compatible with SOCKET crimping and SMT soldering according to various exemplary embodiments of the present invention described above in this specification. For example, the processing unit may execute the following steps: Figure 1 The process of PCB design method compatible with SOCKET pressing and SMT soldering is shown.

[0074] In one embodiment, the present invention provides a computer-readable medium storing computer-executable instructions for executing the steps in the PCB design method compatible with SOCKET crimping and SMT soldering according to various exemplary embodiments of the present invention described above in this specification.

[0075] The readable medium can be a readable signal medium or a readable storage medium. The readable storage medium can be, for example, - but not limited to - a system, device or device of electricity, magnetism, light, electromagnetic, infrared, or semiconductor, or any combination thereof. The readable signal medium can include a data signal propagated in a baseband or as a part of a carrier wave, wherein a readable program code is carried. The readable signal medium can also be any readable medium other than a readable storage medium, which can send, propagate or transmit a program used by an instruction execution system, device or device or used in combination with it. The program code contained on the readable medium can be transmitted with any appropriate medium, including - but not limited to - wireless, wired, optical cable, RF, etc., or any suitable combination thereof.

[0076] In addition, although the operations of the method of the present invention are described in a specific order in the drawings, this does not require or imply that the operations must be performed in this specific order, or that all the operations shown must be performed to achieve the desired results. Additionally or alternatively, some steps may be omitted, multiple steps may be combined into one step, and / or one step may be decomposed into multiple steps.

[0077] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the appended claims of the present invention.

[0078] The above is an exemplary description of the present invention in conjunction with the accompanying drawings. It is obvious that the implementation of the present invention is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the present invention, or the concept and technical solution of the present invention are directly applied to other occasions without improvement, they are all within the protection scope of the present invention.

Claims

1. A PCB design method compatible with SOCKET crimping and SMT welding, characterized in that: include: Step S1, adding a steel mesh in the FILMMASK layer of the SOCKET package to complete the optimization of the SOCKET package; Step S2, calling the optimized SOCKET package during PCB design, in the photo-drawing setting stage, in addition to setting the default first steel mesh photo-drawing for SOCKET crimping, an additional second steel mesh photo-drawing for SMT welding is added, and the FILMMASK layer of the optimized SOCKET package is added to the second steel mesh photo-drawing; Step S3: after the PCB design is completed, output a first stencil photo-painting file including the first stencil photo-painting and a second stencil photo-painting file including the second stencil photo-painting.

2. The PCB design method compatible with SOCKET crimping and SMT welding according to claim 1, characterized in that: The first stencil photo-drawing does not include stencil information of the BGA device, and the second stencil photo-drawing includes stencil information of the BGA device.

3. The PCB design method compatible with SOCKET crimping and SMT welding according to claim 1, characterized in that: The second stencil photo-painting includes all the information of the first stencil photo-painting.

4. The PCB design method compatible with SOCKET crimping and SMT welding according to claim 1, characterized in that: Step S1 specifically includes the following sub-steps: Step S11, making a solder mask window on the BGA PAD in the SOCKETMASK layer of the SOCKET package; Step S12, setting the PASTETMASK layer of the SOCKET package to None by default; Step S13, adding a steel mesh in the FILMMASK layer of the SOCKET package.

5. The PCB design method compatible with SOCKET crimping and SMT welding according to claim 4, characterized in that: The size of the steel mesh is the same as that of the BGA PAD.

6. The PCB design method compatible with SOCKET crimping and SMT welding according to claim 1, characterized in that: Step S2 specifically includes the following sub-steps: Step S21, adding the optimized SOCKET package to the PCB schematic, generating a netlist and importing it into the PCB, and implementing the call of the optimized SOCKET package; Step S22, in the photo-drawing setting stage, setting the first steel mesh photo-drawing for the default SOCKET crimping and naming it; Step S23, in the photo-painting setting stage, add a second steel mesh photo-painting for SMT welding and name it, the setting of the second steel mesh photo-painting is consistent with the first steel mesh photo-painting, and then add the optimized FILMMASK layer of the SOCKET package to the second steel mesh photo-painting.

7. The PCB design method compatible with SOCKET crimping and SMT welding according to claim 1, characterized in that: When the BGA device is placed on the TOP layer of the PCB, step S1 specifically includes the following sub-steps: Step S11, making a solder mask window on the BGA PAD in the SOCKETMASK_TOP layer of the SOCKET package; Step S12, setting the PASTETMASK_TOP layer of the SOCKET package to None by default; Step S13, adding a steel mesh in the FILMMASK_TOP layer of the SOCKET package.

8. The PCB design method compatible with SOCKET crimping and SMT welding according to claim 7, characterized in that: Step S2 specifically includes the following sub-steps: Step S21, adding the optimized SOCKET package to the PCB schematic, generating a netlist and importing it into the PCB, and implementing the call of the optimized SOCKET package; Step S22, in the photo-drawing setting stage, set the default first TOP layer steel mesh photo-drawing for SOCKET crimping and name it; Step S23, in the photo-painting setting stage, add a second TOP layer steel mesh photo-painting for SMT welding and name it, the setting of the second TOP layer steel mesh photo-painting is consistent with the first TOP layer steel mesh photo-painting, and then add the optimized FILMMASK_TOP layer of the SOCKET package to the second TOP layer steel mesh photo-painting.

9. The PCB design method compatible with SOCKET crimping and SMT welding according to claim 8, characterized in that: In step S3, after the PCB design is completed, a first TOP layer steel mesh photo-drawing file including the first TOP layer steel mesh photo-drawing and a second TOP layer steel mesh photo-drawing file including the second TOP layer steel mesh photo-drawing are output.

10. The PCB design method compatible with SOCKET crimping and SMT welding according to claim 1, characterized in that: When the BGA device is placed on the BOTTOM layer of the PCB, step S1 specifically includes the following sub-steps: Step S11, making a solder mask window on the BGA PAD in the SOCKETMASK_BOTTOM layer of the SOCKET package; Step S12, setting the PASTETMASK_BOTTOM layer of the SOCKET package to None by default; Step S13, adding a steel mesh in the FILMMASK_BOTTOM layer of the SOCKET package.