Paster equipment adsorption platform control method and device, medium and equipment

Abstract

The invention relates to the technical field of chip mounter equipment, in particular to a chip mounter equipment adsorption platform control method and device, a medium and equipment. When it is recognized that the adsorption object, namely the PCB, reaches the target position, an effective adsorption surface corresponding to the adsorption object is obtained, and an adsorption instruction is generated according to the effective adsorption surface; the adsorption pump set and / or the adsorption channel valve set are / is controlled according to the adsorption instruction to form a negative pressure field with an adsorption sequence, the negative pressure field fixes an adsorption object to the surface of the adsorption platform, accurate adsorption can be achieved, only the subarea forming the effective adsorption face is adsorbed, elements of the subarea adjacent to the effective adsorption face are not affected, subarea accurate adsorption can be achieved, and the adsorption efficiency is improved. The surface mounting processes of adjacent surface mounting positions can be prevented from being mutually influenced, and elements are prevented from being pulled and deformed.

Description

Technical Field

[0001] The present application relates to the technical field of chip placement machine equipment, and in particular to a control method, device, medium and equipment for an adsorption platform of a chip placement machine. Background Art

[0002] During the mounting process, flexible printed circuit boards are prone to deformation and displacement due to the characteristics of their own materials. In particular, during the mounting process, the parts that are squeezed or impacted by external forces are more likely to deform. Since the mounting components on existing flexible printed circuit boards are very dense, once local deformation occurs, it will not only affect the local mounting quality, but also affect the adjacent mounting components. Even if the parts that are squeezed and impacted by external forces are deformed to a certain extent, the deformation can be recovered because the mounting has been completed and will not have a significant impact on the position. On the contrary, if the adjacent mounting positions are not mounted or are mounted, the mounting quality will be affected, that is, the mounted components are pulled by the deformation of the adjacent positions, causing the mounting to be offset, and the unmounted printed solder paste will be pulled by the deformation of the adjacent positions, causing the solder paste morphology to be deformed, and have an adverse effect on subsequent mounting.

[0003] Therefore, finding an appropriate control method for the adsorption platform of the patch equipment is an urgent problem to be solved by those skilled in the art. Summary of the invention

[0004] Based on this, in order to solve the problem in the prior art that the mounting processes of adjacent mounting positions are easily affected, the present application proposes a method, device, medium and equipment for controlling the adsorption platform of a mounting equipment, which can prevent the mounting processes of adjacent mounting positions from affecting each other and prevent components from being pulled and deformed.

[0005] In a first aspect, a method for controlling an adsorption platform of a patch device is provided, comprising the following steps:

[0006] Get the information of the adsorption object in place;

[0007] Obtain the effective adsorption surface corresponding to the adsorption object, and generate an adsorption instruction according to the effective adsorption surface;

[0008] According to the adsorption instruction, the adsorption pump group and / or the adsorption channel valve group are controlled to form a negative pressure field with an adsorption sequence, and the negative pressure field fixes the adsorption object on the surface of the adsorption platform.

[0009] In one embodiment, the step of obtaining the information of the adsorption object being in place comprises:

[0010] A displacement detector is set at a preset fixed position of the adsorption object, and the position information of the adsorption object is obtained through the displacement detector.

[0011] In one embodiment, the step of obtaining the effective adsorption surface corresponding to the adsorption object includes:

[0012] The edge graphic parameters of the adsorption object are obtained, and the effective adsorption surface of the adsorption platform is calculated according to the edge graphic parameters of the adsorption object, wherein the effective adsorption surface corresponds to the adsorption channel of the adsorption platform.

[0013] In one embodiment, the step of controlling the adsorption pump group to form a negative pressure field with an adsorption sequence according to the adsorption instruction includes:

[0014] Establishing a pressure difference relationship between each adsorption pump of the adsorption pump group and each adsorption hole on the corresponding adsorption channel;

[0015] According to the pressure difference relationship between the adsorption hole and the adsorption pump, the pressure difference projection relationship of the adsorption pump on the effective adsorption surface is obtained;

[0016] The pressure difference sequence of the adsorption pump group from the center to the edge on the effective adsorption surface is formed according to the pressure difference projection relationship, that is, the pressure difference of the adsorption holes close to the center of the effective adsorption surface is larger, and the pressure difference of the adsorption holes close to the edge of the effective adsorption surface is smaller, and on an adsorption channel, the pressure difference of the adsorption holes from the center to the edge gradually decreases.

[0017] In one embodiment, the step of controlling the adsorption channel valve group to form a negative pressure field with an adsorption sequence according to the adsorption instruction includes:

[0018] Establishing a position correspondence between each adsorption pump of the adsorption pump group and each adsorption hole on the corresponding adsorption channel;

[0019] Generate the switch sequence of the control valves of the adsorption holes on the adsorption channel according to the distance relationship between the adsorption holes and the adsorption pump;

[0020] According to the opening and closing sequence of the control valve of the adsorption holes on the adsorption channel, the adsorption holes at the center of the effective adsorption surface are opened first, and then the adsorption holes gradually away from the center are opened in sequence to form the adsorption hole opening sequence of the adsorption channel valve from the center to the edge.

[0021] In one embodiment, the step of controlling the adsorption pump group and / or the adsorption channel valve group to form a negative pressure field with an adsorption sequence according to the adsorption instruction includes:

[0022] Establish the pressure difference relationship between each adsorption pump of the adsorption pump group and each adsorption hole on the corresponding adsorption channel and the distance correspondence relationship between the adsorption hole and the adsorption pump;

[0023] According to the pressure difference relationship between the adsorption hole and the adsorption pump, the pressure difference projection relationship of the adsorption pump on the effective adsorption surface and the control valve switching sequence of the adsorption hole on the adsorption channel are obtained;

[0024] The pressure difference sequence of the adsorption pump from the center to the edge on the effective adsorption surface is formed according to the pressure difference projection relationship, and the adsorption holes are opened in a control valve switching sequence generated according to the distance relationship between the adsorption holes and the adsorption pump, so as to form a higher adsorption pressure at the center of the effective adsorption surface and the adsorption holes are opened first, and then the adsorption holes are opened outward in sequence according to the distance relationship of the adsorption channels, and the farther the adsorption holes are from the center, the smaller the pressure difference.

[0025] In one of the embodiments, an adsorption channel switching valve is further included, and the spatial arrangement of the adsorption channel is adjusted by the adsorption channel switching valve to form an adsorption system arranged from the inside to the outside or a U-shaped adsorption system, wherein the adsorption system includes at least one adsorption channel.

[0026] In a second aspect, a device for controlling an adsorption platform of a patch device is provided, comprising:

[0027] Acquisition module, to obtain the information of the adsorption object in place;

[0028] A generation module is used to obtain an effective adsorption surface corresponding to the adsorption object and generate an adsorption instruction according to the effective adsorption surface;

[0029] The adsorption module controls the adsorption pump group and / or the adsorption channel valve group according to the adsorption instruction to form a negative pressure field with an adsorption sequence, and the negative pressure field fixes the adsorption object on the surface of the adsorption platform.

[0030] In a third aspect, a readable storage medium stores a computer program, and when the computer program is executed by a processor, the processor executes the steps of the method for controlling the adsorption platform of a patch device as described in any one of the first aspects.

[0031] In a fourth aspect, a device comprises a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor executes the steps of the patch device adsorption platform control method as described in any one of the first aspects.

[0032] The control method, device, medium and equipment for the adsorption platform of the patch equipment provided by the present application have the beneficial effect compared with the prior art in that, by obtaining the information of the adsorption object in place; when it is identified that the adsorption object, i.e., the PCB board, has reached the target position, the effective adsorption surface corresponding to the adsorption object is obtained, and an adsorption instruction is generated according to the effective adsorption surface; according to the adsorption instruction, the adsorption pump group and / or the adsorption channel valve group are controlled to form a negative pressure field with an adsorption sequence, and the negative pressure field fixes the adsorption object on the surface of the adsorption platform, and can accurately adsorb, and only adsorb the partition forming the effective adsorption surface without affecting the components of the partition adjacent to the effective adsorption surface, and can accurately adsorb the partitions, and can avoid the placement processes of adjacent placement positions from affecting each other, and avoid the components from being pulled and deformed. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 A schematic flow chart of a method for controlling a patch device adsorption platform in one embodiment;

[0035] Figure 2 A schematic diagram of a module of a control device for an adsorption platform of a patch device in one embodiment. DETAILED DESCRIPTION

[0036] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of this application.

[0037] First, see Figure 1 As shown, a method for controlling an adsorption platform of a patch device is provided, comprising the following steps:

[0038] Get the information of the adsorption object in place;

[0039] Obtain the effective adsorption surface corresponding to the adsorption object, and generate an adsorption instruction according to the effective adsorption surface;

[0040] According to the adsorption instruction, the adsorption pump group and / or the adsorption channel valve group are controlled to form a negative pressure field with an adsorption sequence, and the negative pressure field fixes the adsorption object on the surface of the adsorption platform.

[0041] It should be noted that the sensor confirms that the adsorption object has been accurately placed at the preset position on the adsorption platform. The adsorption object is a PCB board. According to the identified effective adsorption surface, that is, the effective adsorption surface of the PCB board that needs to be adsorbed at present is identified, a specific adsorption control instruction is generated, including the adsorption force, without affecting the area adjacent to the current adsorption surface; the adsorption pump group and / or the adsorption channel valve group are controlled to be opened and closed. According to the adsorption instruction, the target area is adsorbed, the state of the negative pressure field is monitored in real time, and dynamic adjustments are made as needed to maintain a stable adsorption effect.

[0042] According to the control method of the adsorption platform of the patch equipment provided by the present application, compared with the prior art, the beneficial effect lies in that by obtaining the information of the adsorption object in place; when it is identified that the adsorption object, that is, the PCB board, has reached the target position, the effective adsorption surface corresponding to the adsorption object is obtained, and an adsorption instruction is generated according to the effective adsorption surface; according to the adsorption instruction, the adsorption pump group and / or the adsorption channel valve group are controlled to form a negative pressure field with an adsorption sequence, and the negative pressure field fixes the adsorption object on the surface of the adsorption platform, and can accurately adsorb, and only adsorb the partition forming the effective adsorption surface without affecting the components of the partition adjacent to the effective adsorption surface, and can accurately adsorb the partitions, and can avoid the placement processes of adjacent placement positions from affecting each other, and avoid the components from being pulled and deformed.

[0043] In one embodiment, the step of obtaining the information of the adsorption object being in place comprises:

[0044] A displacement detector is set at a preset fixed position of the adsorption object, and the position information of the adsorption object is obtained through the displacement detector.

[0045] It should be noted that the output signal of the displacement detector is connected to the control system of the patch device, and the control system receives and processes these signals in real time to determine whether the adsorption object is in place.

[0046] In one embodiment, the step of obtaining the effective adsorption surface corresponding to the adsorption object includes:

[0047] The edge graphic parameters of the adsorption object are obtained, and the effective adsorption surface of the adsorption platform is calculated according to the edge graphic parameters of the adsorption object, wherein the effective adsorption surface corresponds to the adsorption channel of the adsorption platform.

[0048] It should be noted that the adsorption object is scanned or photographed through a machine vision system or a high-precision sensor to obtain the graphic data of its edge; the obtained graphic data is processed to extract the edge contour line and calculate the relevant graphic parameters. According to the edge graphic parameters of the adsorption object, the position and size of the effective adsorption surface are calculated. The effective adsorption surface should cover those areas on the adsorption object that need to be stably fixed, while avoiding unnecessary adsorption force on parts that do not need to be adsorbed. The adsorption channel layout of the adsorption platform can be used, and the effective adsorption surface should correspond to the adsorption channel one by one or be appropriately matched to ensure that the adsorption force can be accurately transmitted and act on the adsorption object.

[0049] In one embodiment, the step of controlling the adsorption pump group to form a negative pressure field with an adsorption sequence according to the adsorption instruction includes:

[0050] Establishing a pressure difference relationship between each adsorption pump of the adsorption pump group and each adsorption hole on the corresponding adsorption channel;

[0051] According to the pressure difference relationship between the adsorption hole and the adsorption pump, the pressure difference projection relationship of the adsorption pump on the effective adsorption surface is obtained;

[0052] The pressure difference sequence of the adsorption pump group from the center to the edge on the effective adsorption surface is formed according to the pressure difference projection relationship, that is, the pressure difference of the adsorption holes close to the center of the effective adsorption surface is larger, and the pressure difference of the adsorption holes close to the edge of the effective adsorption surface is smaller, and on an adsorption channel, the pressure difference of the adsorption holes from the center to the edge gradually decreases.

[0053] It should be noted that the pressure difference from the center to the edge of the adsorption hole gradually decreases. On the one hand, the adsorption object can be adsorbed on the adsorption platform. On the other hand, if the pressure difference at the edge is too strong, it is easy to deform. The pressure difference from the center to the edge is set to gradually decrease while ensuring stable adsorption, protecting the edge of the adsorption object. By forming a pressure difference sequence from the center to the edge, it can ensure that the adsorption object maintains a stable posture during the adsorption process, reducing deformation or offset caused by uneven adsorption force.

[0054] In one embodiment, the step of controlling the adsorption channel valve group to form a negative pressure field with an adsorption sequence according to the adsorption instruction includes:

[0055] Establishing a position correspondence between each adsorption pump of the adsorption pump group and each adsorption hole on the corresponding adsorption channel;

[0056] Generate the switch sequence of the control valves of the adsorption holes on the adsorption channel according to the distance relationship between the adsorption holes and the adsorption pump;

[0057] According to the opening and closing sequence of the control valve of the adsorption holes on the adsorption channel, the adsorption holes at the center of the effective adsorption surface are opened first, and then the adsorption holes gradually away from the center are opened in sequence to form the adsorption hole opening sequence of the adsorption channel valve from the center to the edge.

[0058] It should be noted that by gradually forming negative pressure from the center to the edge, it is possible to ensure that the adsorbed object maintains a stable posture during the adsorption process and reduce deformation or offset caused by uneven adsorption force.

[0059] In one embodiment, the step of controlling the adsorption pump group and / or the adsorption channel valve group to form a negative pressure field with an adsorption sequence according to the adsorption instruction includes:

[0060] Establish the pressure difference relationship between each adsorption pump of the adsorption pump group and each adsorption hole on the corresponding adsorption channel and the distance correspondence relationship between the adsorption hole and the adsorption pump;

[0061] According to the pressure difference relationship between the adsorption hole and the adsorption pump, the pressure difference projection relationship of the adsorption pump on the effective adsorption surface and the control valve switching sequence of the adsorption hole on the adsorption channel are obtained;

[0062] The pressure difference sequence of the adsorption pump from the center to the edge on the effective adsorption surface is formed according to the pressure difference projection relationship, and the adsorption holes are opened in a control valve switching sequence generated according to the distance relationship between the adsorption holes and the adsorption pump, so as to form a higher adsorption pressure at the center of the effective adsorption surface and the adsorption holes are opened first, and then the adsorption holes are opened outward in sequence according to the distance relationship of the adsorption channels, and the farther the adsorption holes are from the center, the smaller the pressure difference.

[0063] It should be noted that by combining the pressure difference relationship and the position distance relationship to control the adsorption process, it is possible to ensure that the adsorbed object maintains a stable posture during the adsorption process and reduce the risk of deformation or displacement. By gradually building up negative pressure and controlling the opening order of the adsorption holes, the adsorption effect can be optimized, so that the adsorption force acts more evenly and effectively on the adsorption object.

[0064] In one of the embodiments, an adsorption channel switching valve is further included, and the spatial arrangement of the adsorption channel is adjusted by the adsorption channel switching valve to form an adsorption system arranged from the inside to the outside or a U-shaped adsorption system, wherein the adsorption system includes at least one adsorption channel.

[0065] It should be noted that the adsorption channel starts from the central area and gradually expands outward to form a radial structure. This layout is conducive to forming a pressure gradient from the center to the edge during the adsorption process, so that the adsorption force can act on the adsorption object gradually and evenly.

[0066] Second, see Figure 2 As shown, in one embodiment, a device for controlling an adsorption platform of a patch device is provided, comprising:

[0067] An acquisition module 100 is used to acquire information about the location of the adsorbed object;

[0068] A generation module 200 is used to obtain an effective adsorption surface corresponding to the adsorption object and generate an adsorption instruction according to the effective adsorption surface;

[0069] The adsorption module 300 controls the adsorption pump group and / or the adsorption channel valve group to form a negative pressure field with an adsorption sequence according to the adsorption instruction, and the negative pressure field fixes the adsorption object on the surface of the adsorption platform.

[0070] According to the control device for the adsorption platform of the patch equipment provided by the present application, compared with the prior art, the beneficial effect lies in that, by obtaining the information of the adsorption object in place; when it is identified that the adsorption object, i.e., the PCB board, has reached the target position, the effective adsorption surface corresponding to the adsorption object is obtained, and an adsorption instruction is generated according to the effective adsorption surface; according to the adsorption instruction, the adsorption pump group and / or the adsorption channel valve group are controlled to form a negative pressure field with an adsorption sequence, and the negative pressure field fixes the adsorption object on the surface of the adsorption platform, and can accurately adsorb, and only adsorb the partition forming the effective adsorption surface without affecting the components of the partition adjacent to the effective adsorption surface, and can accurately adsorb the partitions, and can avoid the placement processes of adjacent placement positions from affecting each other, and avoid the components from being pulled and deformed.

[0071] In the third aspect, in one of the embodiments, a readable storage medium stores a computer program, and when the computer program is executed by a processor, the processor executes the steps of the patch device adsorption platform control method as described in any one of the first aspects.

[0072] In the fourth aspect, in one of the embodiments, a device includes a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor executes the steps of the patch device adsorption platform control method as described in any one of the first aspects.

[0073] It should be noted that when an element is referred to as being "fixed on" or "set on" another component, it can be directly on the other component or indirectly set on the other component; when a component is referred to as being "connected to" another component, it can be directly connected to the other component or indirectly connected to the other component.

[0074] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" and "several" mean two or more, unless otherwise clearly and specifically defined.

[0075] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by this application.

[0076] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for controlling an adsorption platform of a patch device, characterized in that: The steps include: Get the information of the adsorption object in place; Obtain the effective adsorption surface corresponding to the adsorption object, and generate an adsorption instruction according to the effective adsorption surface; According to the adsorption instruction, the adsorption pump group and / or the adsorption channel valve group are controlled to form a negative pressure field with an adsorption sequence, and the negative pressure field fixes the adsorption object on the surface of the adsorption platform.

2. The method for controlling the adsorption platform of the patch equipment according to claim 1, characterized in that: The step of obtaining the information of the adsorption object being in place comprises: A displacement detector is set at a preset fixed position of the adsorption object, and the position information of the adsorption object is obtained through the displacement detector.

3. The method for controlling the adsorption platform of the patch equipment according to claim 1, characterized in that: The step of obtaining the effective adsorption surface corresponding to the adsorption object comprises: The edge graphic parameters of the adsorption object are obtained, and the effective adsorption surface of the adsorption platform is calculated according to the edge graphic parameters of the adsorption object, wherein the effective adsorption surface corresponds to the adsorption channel of the adsorption platform.

4. The method for controlling the adsorption platform of the patch equipment according to claim 1, characterized in that: The step of controlling the adsorption pump group to form a negative pressure field with an adsorption sequence according to the adsorption instruction includes: Establishing a pressure difference relationship between each adsorption pump of the adsorption pump group and each adsorption hole on the corresponding adsorption channel; According to the pressure difference relationship between the adsorption hole and the adsorption pump, the pressure difference projection relationship of the adsorption pump on the effective adsorption surface is obtained; The pressure difference sequence of the adsorption pump group from the center to the edge on the effective adsorption surface is formed according to the pressure difference projection relationship, that is, the pressure difference of the adsorption holes close to the center of the effective adsorption surface is larger, and the pressure difference of the adsorption holes close to the edge of the effective adsorption surface is smaller, and on an adsorption channel, the pressure difference of the adsorption holes from the center to the edge gradually decreases.

5. The method for controlling the adsorption platform of the patch equipment according to claim 1, characterized in that: The step of controlling the adsorption channel valve group to form a negative pressure field with an adsorption sequence according to the adsorption instruction includes: Establishing a position correspondence between each adsorption pump of the adsorption pump group and each adsorption hole on the corresponding adsorption channel; Generate the switch sequence of the control valves of the adsorption holes on the adsorption channel according to the distance relationship between the adsorption holes and the adsorption pump; According to the opening and closing sequence of the control valve of the adsorption holes on the adsorption channel, the adsorption holes at the center of the effective adsorption surface are opened first, and then the adsorption holes gradually away from the center are opened in sequence to form the adsorption hole opening sequence of the adsorption channel valve from the center to the edge.

6. The method for controlling the adsorption platform of the patch equipment according to claim 1, characterized in that: The step of controlling the adsorption pump group and / or the adsorption channel valve group to form a negative pressure field with an adsorption sequence according to the adsorption instruction includes: Establish the pressure difference relationship between each adsorption pump of the adsorption pump group and each adsorption hole on the corresponding adsorption channel and the distance correspondence relationship between the adsorption hole and the adsorption pump; According to the pressure difference relationship between the adsorption hole and the adsorption pump, the pressure difference projection relationship of the adsorption pump on the effective adsorption surface and the control valve switching sequence of the adsorption hole on the adsorption channel are obtained; The pressure difference sequence of the adsorption pump from the center to the edge on the effective adsorption surface is formed according to the pressure difference projection relationship, and the adsorption holes are opened in a control valve switching sequence generated according to the distance relationship between the adsorption holes and the adsorption pump, so as to form a higher adsorption pressure at the center of the effective adsorption surface and the adsorption holes are opened first, and then the adsorption holes are opened outward in sequence according to the distance relationship of the adsorption channels, and the farther the adsorption holes are from the center, the smaller the pressure difference.

7. The method for controlling the adsorption platform of the patch equipment according to claim 1, characterized in that: It also includes an adsorption channel switching valve, through which the spatial arrangement of the adsorption channel is adjusted to form an adsorption system arranged from the inside to the outside or a U-shaped adsorption system, wherein the adsorption system includes at least one adsorption channel.

8. A control device for an adsorption platform of a patch equipment, characterized in that: include: Acquisition module, to obtain the information of the adsorption object in place; A generation module is used to obtain an effective adsorption surface corresponding to the adsorption object and generate an adsorption instruction according to the effective adsorption surface; The adsorption module controls the adsorption pump group and / or the adsorption channel valve group according to the adsorption instruction to form a negative pressure field with an adsorption sequence, and the negative pressure field fixes the adsorption object on the surface of the adsorption platform.

9. A readable storage medium, characterized in that: A computer program is stored, and when the computer program is executed by a processor, the processor executes the steps of the method for controlling the adsorption platform of a patch device as described in any one of claims 1 to 7.

10. A device, characterized in that: It comprises a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor executes the steps of the patch device adsorption platform control method as described in any one of claims 1 to 7.

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