LED light-emitting device

Abstract

The invention relates to the technical field of LED light emitting, in particular to an LED light emitting device, which comprises a substrate, a plurality of blue light chips are uniformly arranged at the bottom of the groove; the plurality of purple light chips are arranged at the bottom of the groove and surround the plurality of blue light chips; the second fluorescent layer covers the surfaces of the plurality of purple light chips; the first fluorescent layer covers the surfaces of the second fluorescent layer and the plurality of blue light chips; and the first fluorescent layer and the second fluorescent layer are connected with the side wall of the groove through a connecting adhesive layer. According to the invention, the connecting glue layer is designed between the side wall of the groove and the fluorescent layer, so that the side wall of the groove and the fluorescent layer can be effectively bonded, and the peeling of the fluorescent layer caused by the influence of environmental factors such as cold and hot impact or moisture can be effectively reduced; the power density of the light-emitting device and the corresponding intensity of the light-emitting device are effectively guaranteed, eyesight can be protected, and the overall size is smaller.

Description

Technical Field

[0001] The invention relates to the technical field of LED lighting, and in particular to an LED lighting device. Background Art

[0002] With the continuous advancement of LED technology, the field of light-emitting devices is undergoing a profound change. People's demand for light-emitting devices is no longer limited to lighting itself, but pays more attention to its health, efficiency and adaptability. Especially in the current era of pursuing miniaturization and intelligence, the demand for high-power density light-emitting devices is becoming more and more urgent.

[0003] The blue light component in traditional light-emitting devices is often too high in the high color temperature area, which may pose a potential threat to the user's eyesight. Long-term exposure to high-intensity blue light may cause health problems such as retinal damage and decreased vision. As the size of various electronic devices and lighting fixtures continues to shrink, the power density requirements for light-emitting devices are also getting higher and higher.

[0004] Therefore, how to make the size of lighting equipment more compact while protecting vision health is a current research direction. Summary of the invention

[0005] (I) Purpose of the invention

[0006] The object of the present invention is to provide an LED lighting device which can protect eyesight and make the size of lighting equipment more miniaturized.

[0007] (II) Technical solution

[0008] To solve the above problems, the present invention provides an LED light-emitting device, comprising: a substrate, a connecting adhesive layer, a plurality of blue light chips, a first fluorescent layer, a plurality of purple light chips and a second fluorescent layer;

[0009] The substrate is provided with a groove;

[0010] A plurality of blue light chips are evenly arranged at the bottom of the groove;

[0011] A plurality of the purple light chips are arranged at the bottom of the groove and are arranged around a plurality of the blue light chips;

[0012] The second fluorescent layer covers the surfaces of the plurality of purple light chips;

[0013] The first fluorescent layer covers the second fluorescent layer and the surfaces of a plurality of the blue light chips;

[0014] The first fluorescent layer and the second fluorescent layer are connected to the side wall of the groove through the connecting adhesive layer.

[0015] In another aspect of the present invention, preferably, the groove is in a truncated cone shape, and the bottom area of ​​the groove is smaller than the top area of ​​the groove.

[0016] In another aspect of the present invention, preferably,

[0017] The bottom of the groove is circular, and a plurality of blue light chips are arranged in a rectangular array.

[0018] In another aspect of the present invention, preferably,

[0019] A plurality of the purple light chips are distributed around the rectangular array.

[0020] In another aspect of the present invention, preferably,

[0021] The first fluorescent layer includes yellow-green fluorescent powder, red fluorescent powder and far-infrared fluorescent powder configured in the first fluorescent layer;

[0022] The yellow-green phosphor emits yellow-green light when receiving the excitation light;

[0023] The red phosphor emits red light when receiving the excitation light;

[0024] The far-infrared fluorescent powder emits far-infrared light when receiving excitation light.

[0025] In another aspect of the present invention, preferably, the second fluorescent layer includes a blue-cyan fluorescent powder configured in the second fluorescent layer;

[0026] The blue-cyan phosphor emits blue-cyan light when receiving the excitation light.

[0027] In another aspect of the present invention, preferably, the thickness of the connecting adhesive layer is k, and the value range of k is 0.8 mm≤k≤1.5 mm.

[0028] In another aspect of the present invention, preferably,

[0029] The peak wavelength of the blue light chip is 440-460nm;

[0030] The peak wavelength of the purple light chip is 400-420nm.

[0031] In another aspect of the present invention, preferably, the peak wavelength of the yellow-green phosphor is in the 510-535nm band;

[0032] The peak wavelength of the red phosphor is in the 635-655nm band;

[0033] The peak wavelength of the far-infrared phosphor is in the 690-760nm band.

[0034] In another aspect of the present invention, preferably,

[0035] The peak wavelength of the blue-cyan phosphor is in the 447-495nm band.

[0036] (III) Beneficial effects

[0037] The above technical solution of the present invention has the following beneficial technical effects:

[0038] The present invention designs a connecting adhesive layer between the groove side wall and the fluorescent layer, which can effectively bond the groove side wall and the fluorescent layer, so that the light-emitting device can withstand a higher power density, and effectively reduce the peeling of the fluorescent layer due to environmental factors such as thermal shock or humidity, thereby effectively improving the thermal stability and service life of the light-emitting device; by designing the arrangement of the blue light chip and the purple light chip, the power density of the light-emitting device and the corresponding light-emitting device strength are effectively guaranteed, which can protect eyesight and make the overall size more miniaturized. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 is a cross-sectional view of the overall structure of an embodiment of the present invention;

[0040] Figure 2 This is a distribution diagram of a blue light chip and four purple light chips according to an embodiment of the present invention;

[0041] Figure 3 This is a distribution diagram of a blue light chip and six purple light chips according to an embodiment of the present invention;

[0042] Figure 4 This is an arrangement distribution diagram of a blue light chip and eight purple light chips according to an embodiment of the present invention;

[0043] Figure 5 is an emission spectrum diagram of a light emitting device according to an embodiment of the present invention and the prior art;

[0044] Reference numerals:

[0045] 1: substrate, 2: connecting adhesive layer, 3: blue light chip, 4: first fluorescent layer, 5: purple light chip, 6: second fluorescent layer, 1-1: groove. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present invention. In addition, in the following description, the description of well-known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present invention.

[0047] The accompanying drawings show schematic diagrams of structures according to embodiments of the present invention. These figures are not drawn to scale, and some details are magnified and some details may be omitted for the purpose of clarity. The shapes of various regions and layers shown in the figures and the relative sizes and positional relationships therebetween are only exemplary, and may deviate in practice due to manufacturing tolerances or technical limitations, and those skilled in the art may additionally design regions / layers with different shapes, sizes, and relative positions according to actual needs.

[0048] Obviously, the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] In the description of the present invention, it should be noted that the terms “first” and “second” are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0050] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0051] The present invention will be described in more detail below with reference to the accompanying drawings. In each of the accompanying drawings, the same elements are represented by similar reference numerals. For the sake of clarity, the various parts in the accompanying drawings are not drawn to scale.

[0052] Example

[0053] An LED light emitting device, Figure 1 FIG. 2 shows a cross-sectional view of the overall structure of an embodiment of the present invention; Figure 1 As shown,

[0054] The invention comprises: a substrate 1, a connecting adhesive layer 2, a blue light chip 3, a first fluorescent layer 4, a purple light chip 5 and a second fluorescent layer 6; a groove 1-1 is arranged on the substrate 1; the material of the substrate 1 is not limited here

[0055] The blue light chip 3 includes several, and several of the blue light chips 3 are evenly arranged at the bottom of the groove 1-1; the groove 1-1 designed on the substrate 1 not only provides a stable installation position for the blue light chip 3 and the purple light chip 5, but also optimizes the light emission path through its shape, which may help to improve the light effect and reduce light loss. The blue light chip 3 is evenly arranged at the bottom of the groove 1-1, reducing the appearance of light spots and dark areas, and improving the uniformity and comfort of lighting. The purple light chip 5 includes several, and several of the purple light chips 5 are arranged at the bottom of the groove 1-1, and several of the purple light chips 5 are arranged around several of the blue light chips 3; the second fluorescent layer 6 covers the surface of the several purple light chips 5; the first fluorescent layer 4 covers the second fluorescent layer 6 and the surface of several blue light chips 3; the first fluorescent layer 4 and the second fluorescent layer 6 are connected to the side wall of the groove 1-1 through the connecting glue layer 2. The connecting glue layer 2 is not only used to connect the first fluorescent layer 4 and the second fluorescent layer 6 to the side wall of the groove 1-1, but also plays a role in fixing and protecting the chip. It ensures the structural stability and reliability of the entire device. The connecting adhesive layer 2 can also be made of a light-transmitting material to reduce the loss of light during transmission and improve the light efficiency. The blue light chip and the purple light chip are controlled by two power supplies respectively. The purple light chip is located at the edge of the light-emitting device and is controlled separately. This position is far away from the high-power area of ​​blue light excitation, and the purple light chip is excited with a small current.

[0056] Further, in this embodiment, the groove 1-1 is set to be a truncated cone, and the bottom area of ​​the groove 1-1 is smaller than the top area of ​​the groove 1-1. The bottom of the groove 1-1 is set to be circular, and a plurality of the blue light chips 3 are arranged in a rectangular array. A plurality of the purple light chips 5 are distributed around the rectangular array; Figure 2 This is a distribution diagram of a blue light chip and four purple light chips according to an embodiment of the present invention;

[0057] Figure 3 This is a distribution diagram of a blue light chip and six purple light chips according to an embodiment of the present invention; Figure 4 : is an arrangement distribution diagram of a blue light chip and eight purple light chips according to an embodiment of the present invention; Figure 2 , Figure 3 and Figure 4 As shown, when the bottom of the groove 1-1 is set to be circular, the blue light chip array is set to cover the bottom area of ​​the groove 1-1 to the maximum extent, and the purple light chips 5 are distributed at the position where the rectangular array is not set at the bottom of the groove 1-1 according to different quantities, which is beneficial to the overall miniaturization of the light-emitting device.

[0058] Furthermore, in this embodiment, the structure of the first fluorescent layer 4 includes yellow-green fluorescent powder, red fluorescent powder and far-infrared fluorescent powder configured in the first fluorescent layer 4; the yellow-green fluorescent powder is used to emit yellow-green light when receiving excitation light; the red fluorescent powder is used to emit red light when receiving excitation light; the far-infrared fluorescent powder is used to emit far-infrared light when receiving excitation light. The peak wavelength of the yellow-green fluorescent powder is in the 510-535nm band; the peak wavelength of the red fluorescent powder is in the 635-655nm band; the peak wavelength of the far-infrared fluorescent powder is in the 690-760nm band.

[0059] The peak wavelength of the blue light chip 3 is 440-460nm; the peak wavelength of the purple light chip 5 is 400-420nm.

[0060] The structure of the second fluorescent layer 6 includes blue-cyan fluorescent powder configured in the second fluorescent layer 6; the blue-cyan fluorescent powder is used to emit blue-cyan light when receiving excitation light; the peak wavelength of the blue-cyan fluorescent powder is in the 447-495nm band.

[0061] The light-emitting device of this embodiment is a high-power density light-emitting device and has good light color performance. The light-emitting device is first required to have a high color rendering index, so the spectrum is required to cover a wide range and have good spectral continuity. The wavelength of the first red phosphor has a greater influence on the color rendering index. Considering the connection with the first yellow-green phosphor and the far-red phosphor, the conventional light-emitting device has a serious deficiency after 650nm. Long-wave light with a wavelength between 650 and 900 nanometers can improve mitochondrial performance. This embodiment supplements the spectrum deficiency of conventional LED light-emitting devices in the 650-780nm band. It can effectively reduce the age-related cell death rate in the retina; it can activate eye cells and promote normal nucleic acid synthesis; it can scavenge free radicals, improve and enhance cell function, dilate eye blood vessels, improve blood supply to the ciliary muscle, and improve vision.

[0062] Since the far-red phosphor, the first red phosphor, and the first yellow-green phosphor generally have good thermal stability and high conversion efficiency, the light-emitting device can withstand a greater light power density when excited by blue light. In addition, the light-emitting device can also have a stronger luminous flux and is not easily affected by the fact that the power of the light-emitting device cannot be too high due to the poor thermal stability of the phosphor. Therefore, the far-red phosphor, the first red phosphor, and the first yellow-green phosphor are mixed into the fluorescent layer above the blue light chip. Since the light efficiency of the first red phosphor is significantly reduced under the excitation of long-wave blue light, the purple light chip is controlled separately to provide a spectrum that supplements the purple light range, and a small amount of blue-cyan light is excited to fill the spectral gap of the light-emitting device and improve the light color performance of the light-emitting device. This process only generates less heat and can achieve the purpose of long-term use.

[0063] Furthermore, in designing the high-power density LED light-emitting device, the biggest problem of the high-power density LED light-emitting device is that during the application process, the fluorescent layer will be exposed to high temperature, or low temperature, humidity and other environments, and the fluorescent glue layer will be peeled off from the inner wall of the bracket. In addition, the connecting glue layer is a whitening agent added to the glue, which can protect the inner wall of the bracket from being damaged by ultraviolet light on the one hand, and on the other hand, it can improve the reflection efficiency of light, so that more light-emitting devices can be effectively emitted, and the overall luminous efficiency of the light-emitting device can be improved. The value range of the thickness k of the connecting glue layer is 1.05mm≤k≤1.15mm; the thickness of the connecting glue layer needs to be controlled. If the thickness of the connecting glue layer is too thin, it cannot play a good bonding role. If the thickness of the connecting glue layer is too thick, it will occupy more area in the groove, which will reduce the area where the chip of the light-emitting device can be laid, and the luminous intensity of the light-emitting device will be lowered.

[0064] The light emitting device of this embodiment produces a selected color temperature from 2700K to 6500K, and RA is at least 95. The relative value n of the blue light intensity of the light emitting device of this embodiment is n≤0.8; when the selected color temperature is about 2700K, n≤0.20; when the selected color temperature is about 3000K, n≤0.30; when the selected color temperature is about 4000K, n≤0.40; when the selected color temperature is about 5000K, n≤0.60; when the selected color temperature is about 6500K, n≤0.80.

[0065] Furthermore, the color temperature of the light emitting device of this embodiment is in the range of 2700-6500K, and the relative spectral intensity value m at 780nm is m≥0.45. When the selected color temperature is about 2700K, m≥0.98; when the selected color temperature is about 3000K, m≥0.90; when the selected color temperature is about 4000K, m≥0.80; when the selected color temperature is about 5000K, m≥0.64; when the selected color temperature is about 6500K, m≥0.45.

[0066] This embodiment designs a connecting adhesive layer between the groove side wall and the fluorescent adhesive layer, which can effectively bond the groove side wall and the fluorescent adhesive layer, so that the light-emitting device can withstand a higher power density, and effectively reduce the peeling of the fluorescent adhesive layer due to environmental factors such as cold and hot shock or humidity, and effectively improve the thermal stability of the light-emitting device and the service life of the light-emitting device. By designing blue light + yellow-green + red + far-red light, the power density of the light-emitting device and the corresponding light-emitting device intensity are effectively guaranteed, and the far-red light area is supplemented, so that the light-emitting device has good color rendering in the red part. Then compound low-power purple light + blue-cyan light to effectively supplement the purple light area, ensure the width of the spectrum, and improve the light color performance of the LED.

[0067] The high-power LED light-emitting device is described in detail below using several specific embodiments of a 4000K light-emitting device:

[0068] Comparative Example 1:

[0069] A light-emitting device comprises a purple light chip with a peak wavelength of 410nm, a blue light chip with a peak wavelength of 450nm and a fluorescent layer coated on the two chips. The manufacturing process is as follows: yellow-green fluorescent powder with a peak wavelength of 520nm and red fluorescent powder with a peak wavelength of 650nm are mixed evenly with packaging glue respectively and then coated on the blue light chip respectively, and the packaging is baked at 80℃ for 30min, 100℃ for 30min and 150℃ for 120min to obtain the light-emitting device. The photoelectric parameters thereof are tested, the color temperature is 4000K, the color rendering index is 96, the relative value of the intensity of the blue light at 450nm of the LED light-emitting device is n=1, and the relative spectral intensity value at 780nm is m=0.0015. After 100 cycles, including 10min at 150℃ and then quickly placed at -18℃ for 10min, this is one cycle; peeling occurs due to thermal shock.

[0070] Comparative Example 2:

[0071] A light-emitting device comprises a light emitting device with a peak wavelength of 410nm. The manufacturing process is as follows: blue phosphor with a peak wavelength of 447nm, yellow-green phosphor with a peak wavelength of 520nm and red phosphor with a peak wavelength of 650nm are mixed with packaging glue respectively and then coated on a blue light chip. The packaging is baked at 80°C for 30min, 100°C for 30min and 150°C for 120min to obtain the light-emitting device. The photoelectric parameters thereof are tested, with a color temperature of 4000K, a color rendering index of 96, a relative value of the intensity of blue light at 450nm of the LED light-emitting device n=0.95, and a relative spectral intensity value of m=0.002 at 780nm. After 85 cycles, the device is quickly placed at -18°C for 10min at 150°C for 10min, which constitutes one cycle. The device is peeled off after thermal shock.

[0072] Comparative Example 3:

[0073] A light-emitting device comprises two chips with peak wavelengths of 410nm and 450nm. The manufacturing process is as follows: blue phosphor with a peak wavelength of 447nm, yellow-green phosphor with a peak wavelength of 520nm and red phosphor with a peak wavelength of 650nm are mixed evenly with packaging glue respectively and then coated on a blue light chip. The packaging is baked at 80°C for 30min, 100°C for 30min and 150°C for 120min to obtain a light-emitting device. The photoelectric parameters thereof are tested, with a color temperature of 4000K, a color rendering index of 96, a relative value of the intensity of blue light at 450nm of the LED light-emitting device of n=0.8, and a relative spectral intensity value of m=0.0018 at 780nm. After 90 cycles, the device is quickly placed at -18°C for 10min at 150°C for 10min, which constitutes one cycle. Thermal shock occurs and peeling occurs.

[0074] Embodiment 1:

[0075] A light-emitting device includes a purple chip with a peak wavelength of 410nm, a blue chip with a peak wavelength of 450nm, and a fluorescent layer coated on the two chips. The manufacturing process is as follows: first, a connection glue layer is evenly coated along the side wall of the groove with a thickness of 1.2mm, and then placed in an oven at 150℃ for 20min to solidify the glue and tightly bond with the side wall of the groove. Then, a blue phosphor with a peak wavelength of 447nm is mixed with the encapsulation glue and dotted on the top of the purple chip, and then placed in an oven at 80℃ for 10min, 100℃ for 10min, and 150℃ for 10min to solidify the surface of the encapsulation glue. Then, the yellow-green phosphor, peak wavelength 520nm and red phosphor, peak wavelength 650nm and far-red phosphor, peak wavelength 798nm were mixed evenly with the packaging glue and coated on the blue light chip respectively. The package was baked at 80°C for 30min, 100°C for 30min and 150°C for 120min to obtain a light-emitting device. Its photoelectric parameters were tested, color temperature 4000K, color rendering index 98, relative value of blue light intensity at 450nm of the light-emitting device n=0.31, relative spectral intensity value at 780nm m=0.85, and no peeling occurred after 100 cycles of hot and cold shock.

[0076] In Examples 2-14, the preparation method is the same as that in Example 1, except that the parameters are adjusted according to their characteristics.

[0077] The preparation methods and performance test results of Examples 2-14 are shown in Table 1.

[0078] Table 1 Preparation methods and performance test results of Examples 2-18

[0079]

[0080]

[0081]

[0082] By comparing Examples 1-14 with Comparative Examples 1-3, it can be seen that the present invention has better comprehensive luminous performance than conventional LED light-emitting devices, effectively supplements the deficiency of the light-emitting device in the deep red light region, achieves low blue light, and the light-emitting device's resistance to cold and heat shock is greatly improved.

[0083] Figure 5 : is an emission spectrum diagram of a light emitting device according to an embodiment of the present invention and the prior art; Figure 5 As shown, by comparing Example 1 with Comparative Example 1, it can be seen that the blue light intensity of the light-emitting device of the present invention is greatly reduced compared with the conventional blue light-excited full-spectrum light-emitting device. The original relative intensity is reduced from nearly 1 to 0.31. The red light part is effectively compensated. And it has better aging performance under the same light power density.

[0084] By comparing Examples 1, 11-14 with Comparative Examples 2 and 3, it can be seen that the light-emitting device of the present invention has better aging performance than the conventional purple light-excited full-spectrum light-emitting device at the same light power density. In Comparative Example 2, the conventional purple light full spectrum began to peel off after 85 cycles of cold and hot shocks, while the light-emitting device of the present invention can still withstand 110 cycles of cold and hot shocks when the light power density is twice that of the conventional one. This is because the conventional purple light full spectrum needs to be matched with a large amount of blue powder to fill the blue spectrum position and stimulate the subsequent yellow-green light and red light. In this process, the amount of powder used is greatly increased, the conversion efficiency of the light-emitting device is reduced, and the heat generated cannot be exported as soon as possible, so the ability to resist cold and hot shocks is low. In Comparative Example 3, the blue light chip and the purple light chip are not separated. Affected by the performance disadvantages of the purple light chip, the performance of the blue light chip is not fully exerted, and because the half-peak width of both is narrow, the light color parameters are low. In the present invention, the purple light part only needs a small amount of electrical power to excite a small amount of blue powder, and the subsequent light intensity part is mainly contributed by the blue light chip to excite the yellow-green powder and red powder. In this process, the efficiency is improved and the heat is reduced. In addition, the connecting adhesive layer also plays a good linking role, further reducing the possibility of peeling.

[0085] The peak wavelength of the purple chip 5 is 400-420nm, and the peak wavelength of the blue chip 3 is 440-460nm. Considering the excitation wavelength of the phosphor, the best excitation of the red phosphor by the purple band is around 380nm. However, since most chips in the 380nm band are vertical chips at this stage, and the wavelength is short and the energy is low, and the technology maturity is low, the brightness itself is poor, while the 400-420nm chip band has high technology maturity and high brightness. Although the excitation efficiency is slightly lower than the 380nm band, the actual use effect is significantly higher than the 380nm band. In addition, the low purple band causes greater damage to silica gel, and the purple chip 5 band is 400-420nm. The best excitation of yellow-green phosphor is basically around 445nm, and the chips in this band are more mature, so the peak wavelength of the blue chip 3 is 440-460nm.

[0086] Examples 15-18, the preparation method is the same as Example 1, except that the parameters are adjusted according to their characteristics.

[0087] The preparation methods and performance test results of Examples 15-18 are shown in Table 2.

[0088] Table 2 Preparation methods and performance test results of Comparative Examples 1, 4-7 and Examples 15-18

[0089]

[0090]

[0091] The relative spectral intensity of the light-emitting device of the present invention at 2700K and a color rendering index of 98 at 450nm is only 0.13. The corresponding relative spectral intensity at 780nm can reach 0.984, and no cracking occurs after 130 cycles of thermal shock when the light power density is 1. The relative spectral intensity of the light-emitting device of Comparative Example 4 at 2700K and a color rendering index of 97 at 450nm is 0.29. The corresponding relative spectral intensity at 780nm is only 0.043, and cracking occurs after 90 cycles of thermal shock when the light power density is 1.

[0092] The relative spectral intensity of the light-emitting device of the present invention at 3000K and a color rendering index of 98 at 450nm is only 0.19. The corresponding relative spectral intensity at 780nm can reach 0.92, and no cracking occurs after 130 cycles of thermal shock when the light power density is 1. However, the relative spectral intensity of the light-emitting device in Comparative Example 5 at 3000K and a color rendering index of 97 at 450nm is 0.48. The corresponding relative spectral intensity at 780nm is only 0.042, and cracking occurs after 90 cycles of thermal shock when the light power density is 1.

[0093] The relative spectral intensity of the light emitting device of the present invention at 4000K and a color rendering index of 98 at 450nm is only 0.31. The corresponding relative spectral intensity at 780nm can reach 0.85, and no cracking occurs after 130 cycles of thermal shock when the light power density is 1. However, when the light emitting device in Comparative Example 1 is at 4000K and a color rendering index of 97, Figure 5 As shown in the figure, the relative spectral intensity at 450nm is 0.94, while the corresponding relative spectral intensity at 780nm is only 0.039, and when the optical power density is 1, cracking occurs after 90 cycles of thermal shock.

[0094] The light emitting device of the present invention has a relative spectral intensity of 0.54 at 450nm at 5000K and a color rendering index of 98. The corresponding relative spectral intensity at 780nm is 0.67, and no cracking occurs after 130 cycles of thermal shock when the light power density is 1. The light emitting device in Comparative Example 6 has a relative spectral intensity of 1.0 at 450nm at 5000K and a color rendering index of 97. The corresponding relative spectral intensity at 780nm is only 0.019, and cracking occurs after 90 cycles of thermal shock when the light power density is 1.

[0095] The light-emitting device designed by the present invention has a relative spectral intensity of 0.71 at 450nm when the temperature is 6500K and the color rendering index is 98. The corresponding relative spectral intensity at 780nm is 0.48, and no cracking occurs after 130 cycles of thermal shock when the light power density is 1. The light-emitting device in Comparative Example 7 has a relative spectral intensity of 1.0 at 450nm when the temperature is 6500K and the color rendering index is 97. The corresponding relative spectral intensity at 780nm is only 0.011, and cracking occurs after 90 cycles of thermal shock when the light power density is 1.

[0096] It should be understood that the above specific embodiments of the present invention are only used to illustrate or explain the principles of the present invention, and do not constitute a limitation of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. In addition, the appended claims of the present invention are intended to cover all changes and modifications that fall within the scope and boundaries of the appended claims, or the equivalent forms of such scope and boundaries.

[0097] In the above description, the technical details of patterning and etching of each layer are not described in detail. However, those skilled in the art should understand that various means in the prior art can be used to form layers, regions, etc. of desired shapes. In addition, in order to form the same structure, those skilled in the art can also design methods that are not completely the same as the methods described above.

[0098] The present invention has been described above with reference to the embodiments of the present invention. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention. The scope of the present invention is defined by the appended claims and their equivalents. Without departing from the scope of the present invention, a person skilled in the art may make various substitutions and modifications, which should all fall within the scope of the present invention.

[0099] Although the embodiments of the present invention have been described in detail, it should be understood that the various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention.

[0100] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. An LED light-emitting device, characterized in that: include: A substrate (1), a connecting adhesive layer (2), a plurality of blue light chips (3), a first fluorescent layer (4), a plurality of purple light chips (5) and a second fluorescent layer (6); The substrate (1) is provided with a groove (1-1); A plurality of blue light chips (3) are evenly arranged at the bottom of the groove (1-1); A plurality of purple light chips (5) are arranged at the bottom of the groove (1-1) and are arranged around a plurality of blue light chips (3); The second fluorescent layer (6) covers the surfaces of the plurality of purple light chips (5); The first fluorescent layer (4) covers the second fluorescent layer (6) and the surface of a plurality of the blue light chips (3); The first fluorescent layer (4) and the second fluorescent layer (6) are connected to the side wall of the groove (1-1) via the connecting adhesive layer (2).

2. The LED lighting device according to claim 1, characterized in that: The groove (1-1) is in the shape of a truncated cone, and the bottom area of ​​the groove (1-1) is smaller than the top area of ​​the groove (1-1).

3. The LED lighting device according to claim 1, characterized in that: The bottom of the groove (1-1) is circular, and a plurality of blue light chips (3) are arranged in a rectangular array.

4. The LED lighting device according to claim 3, characterized in that: A plurality of the purple light chips (5) are distributed around the rectangular array.

5. The LED lighting device according to claim 1, characterized in that: The first fluorescent layer (4) comprises yellow-green fluorescent powder, red fluorescent powder and far-infrared fluorescent powder arranged in the first fluorescent layer (4); The yellow-green phosphor emits yellow-green light when receiving the excitation light; The red phosphor emits red light when receiving the excitation light; The far-infrared fluorescent powder emits far-infrared light when receiving excitation light.

6. The LED lighting device according to claim 1, characterized in that: The second fluorescent layer (6) comprises a blue-cyan fluorescent powder arranged in the second fluorescent layer (6); The blue-cyan phosphor emits blue-cyan light when receiving the excitation light.

7. The LED lighting device according to claim 1, characterized in that: The thickness of the connecting adhesive layer (2) is k, and the value range of k is 0.8 mm ≤ k ≤ 1.5 mm.

8. The LED lighting device according to claim 1, characterized in that: The peak wavelength of the blue light chip (3) is 440-460nm; The peak wavelength of the ultraviolet chip (5) is 400-420nm.

9. The LED lighting device according to claim 5, characterized in that: The peak wavelength of the yellow-green phosphor is in the 510-535nm band; The peak wavelength of the red phosphor is in the 635-655nm band; The peak wavelength of the far-infrared phosphor is in the 690-760nm band.

10. The LED lighting device according to claim 6, characterized in that: The peak wavelength of the blue-cyan phosphor is in the 447-495nm band.

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