Display panel, preparation method of display panel and electronic equipment

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and electronic equipment, and relates to the technical field of display. In the display panel, in the direction away from a substrate, an isolation structure comprises a first isolation part and a second isolation part which are arranged in a stacked mode, a first electrode in a light emitting device is electrically connected with a pixel circuit in the substrate through a first via hole, and a protection part is located on the second isolation part. And the orthographic projection of the protection part on the substrate covers the orthographic projection of the first via hole on the substrate. Through the design, the second isolation part at the first via hole position can be protected through the protection part in the patterning process of the light-emitting device, and the situation that the second isolation part at the first via hole position is damaged due to the uneven surface in the etching process and even the first isolation part and the first electrode below the second isolation part are etched is avoided; it is ensured that the display effect of the display panel is not affected by etching damage, and the display stability of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for preparing a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) is considered to be the next generation display technology after liquid crystal display technology. It is widely used in various consumer electronic products such as smart phones, TVs, laptops, desktop computers, car displays, wearable devices, etc. due to its excellent color and picture quality, and has become the mainstream technology in display panels.

[0003] However, the process performance of current OLED display products needs to be further improved. Summary of the invention

[0004] In order to overcome the technical problems mentioned in the above technical background, the present application provides a display panel, a method for preparing a display panel, and an electronic device.

[0005] In a first aspect of the present application, a display panel is provided, the display panel comprising:

[0006] substrate;

[0007] an isolation structure, located on one side of the substrate, the isolation structure enclosing a plurality of isolation openings on the substrate, wherein in a direction away from the substrate, the isolation structure comprises a first isolation portion and a second isolation portion stacked, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate;

[0008] a light emitting device, at least partially located in the isolation opening, the light emitting device comprising a first electrode, the first electrode being electrically connected to a pixel circuit in the substrate through a first via hole, wherein an orthographic projection of the first via hole on the substrate is located within an orthographic projection of the isolation structure on the substrate;

[0009] A protection portion, wherein the protection portion is located at a side of the second isolation portion away from the substrate, and an orthographic projection of the protection portion on the substrate covers an orthographic projection of the first via hole on the substrate.

[0010] In a possible implementation of the present application, the display panel further includes a planarization layer located between the first electrode and the substrate, the planarization layer is provided with the first via hole, and the first electrode is connected to the pixel circuit through the first via hole of the planarization layer;

[0011] Preferably, the orthographic projection of the first via hole of the planarization layer on the substrate is located within the orthographic projection of the first isolation portion on the substrate;

[0012] Preferably, the pixel circuit comprises a transistor, and the first electrode is electrically connected to a source or a drain of the transistor through a first via hole of the planarization layer.

[0013] In a possible implementation of the present application, the display panel further includes a pixel defining layer, the pixel defining layer is located on a side of the first electrode away from the substrate, the pixel defining layer includes a pixel opening, and the pixel opening exposes a portion of the first electrode;

[0014] The isolation structure is located at a side of the pixel defining layer away from the substrate, and the pixel opening is connected to the isolation opening;

[0015] Preferably, part of the pixel definition layer is filled in the first via hole of the planarization layer;

[0016] Preferably, part of the isolation structure is also filled in the first via hole of the planarization layer;

[0017] Preferably, the light emitting device further comprises a light emitting material layer and a second electrode, and in a direction away from the substrate, the first electrode, the light emitting material layer and the second electrode are stacked in sequence, and the second electrode is electrically connected to the isolation structure;

[0018] Preferably, the second electrode overlaps the isolation structure;

[0019] Preferably, the second electrode overlaps the first isolation portion.

[0020] In a possible implementation of the present application, the isolation structure includes a first groove on a side away from the substrate, and an orthographic projection of the first groove on the substrate overlaps with an orthographic projection of the first via on the substrate;

[0021] Preferably, the orthographic projection of the first groove on the substrate is located within the orthographic projection of the first via hole on the substrate;

[0022] Preferably, the orthographic projection of the first groove on the substrate is located within the orthographic projection of the protection portion on the substrate.

[0023] In a possible implementation of the present application, the protection portion is formed with a second groove at the position of the first groove;

[0024] Preferably, the orthographic projection of the second groove on the substrate is located within the orthographic projection of the first groove on the substrate.

[0025] In a possible implementation of the present application, the material of the protection portion is the same as the material of the second isolation portion;

[0026] Preferably, the material of the protection portion and the second isolation portion includes titanium or molybdenum;

[0027] Preferably, an orthographic projection of the protection portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate.

[0028] In a possible implementation of the present application, in a direction perpendicular to the plane where the substrate is located, the thickness of the second isolation portion is 800 angstroms to 2500 angstroms, and the thickness of the protection portion is 400 angstroms to 2000 angstroms.

[0029] In a possible implementation manner of the present application, an orthographic projection of one of the first via holes on the substrate is correspondingly located within an orthographic projection of one of the protection portions on the substrate; or,

[0030] The orthographic projections of the plurality of first via holes on the substrate are correspondingly located within the orthographic projection of one protection portion on the substrate;

[0031] Preferably, the orthographic projection shape of the protection portion on the substrate includes a rectangle.

[0032] In a possible implementation of the present application, the isolation structure further includes a third isolation portion, and in a direction away from the substrate, the third isolation portion, the first isolation portion, and the second isolation portion are stacked in sequence;

[0033] The orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate;

[0034] Preferably, the orthographic projection of the third isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate;

[0035] Preferably, the light emitting device further comprises a light emitting material layer and a second electrode, and in a direction away from the substrate, the first electrode, the light emitting material layer and the second electrode are stacked in sequence, and the second electrode overlaps the third isolation portion;

[0036] Preferably, the material of the first isolation portion includes aluminum, silver or copper, and the material of the third isolation portion includes molybdenum or titanium.

[0037] In a possible implementation of the present application, the display panel further includes a first encapsulation layer;

[0038] The first encapsulation layer includes a plurality of encapsulation units;

[0039] Preferably, two adjacent packaging units of light-emitting devices of different colors are disconnected at a side of the isolation structure away from the substrate, and a gap exists between a portion of the packaging unit located at a side of the isolation structure away from the substrate and the isolation structure;

[0040] Preferably, two adjacent packaging units of light-emitting devices of the same color are connected to each other at a side of the isolation structure away from the substrate.

[0041] In a possible implementation of the present application, the orthographic projection of the protection portion on the substrate is located outside the orthographic projection of the packaging unit on the substrate; or,

[0042] An orthographic projection of the protection portion on the substrate partially overlaps with an orthographic projection of the packaging unit on the substrate.

[0043] In a possible implementation of the present application, the display panel further includes a second encapsulation layer, the second encapsulation layer is located on a side of the encapsulation unit away from the substrate, and the second encapsulation layer at least covers the encapsulation unit;

[0044] Preferably, the second encapsulation layer has a flat surface on a side away from the substrate;

[0045] Preferably, the display panel further comprises a third encapsulation layer, and the third encapsulation layer is located on a side of the second encapsulation layer away from the substrate;

[0046] Preferably, the first encapsulation layer and the third encapsulation layer are inorganic encapsulation layers, and the second encapsulation layer is an organic encapsulation layer.

[0047] In a second aspect of the present application, a method for preparing a display panel is further provided, the method comprising:

[0048] providing a substrate;

[0049] A conductive material layer is formed on the substrate, and the conductive material layer is patterned to form a first electrode electrically connected to the pixel circuit via a first via hole;

[0050] An isolation structure and a protective portion located on a side of the isolation structure away from the substrate are manufactured on the side of the first electrode away from the substrate, wherein the isolation structure encloses a plurality of isolation openings, and in a direction away from the substrate, the isolation structure includes a first isolation portion and a second isolation portion which are stacked, the orthographic projection of the first isolation portion on the substrate being within the orthographic projection of the second isolation portion on the substrate, and the orthographic projection of the protective portion on the substrate covering the orthographic projection of the first via on the substrate.

[0051] In a possible implementation of the present application, the step of manufacturing an isolation structure on a side of the first electrode away from the substrate and a protection portion located on a side of the isolation structure away from the substrate includes:

[0052] Sequentially forming a first isolation structure material layer and a second isolation structure material layer on a side of the first electrode away from the substrate;

[0053] Thinning a portion of the second isolation structure material layer, and using a portion of the non-thinned region protruding relative to the thinned region as the protection portion, wherein the orthographic projection of the non-thinned region of the second isolation structure material layer on the substrate covers the orthographic projection of the first via on the substrate;

[0054] The second isolation structure material layer and the first isolation structure material layer are patterned to obtain the isolation structure, wherein the isolation structure includes the second isolation portion formed by the patterned second isolation structure material layer and the first isolation portion formed by the patterned first isolation structure material layer.

[0055] In a possible implementation of the present application, the step of manufacturing an isolation structure on a side of the first electrode away from the substrate and a protection portion located on a side of the isolation structure away from the substrate includes:

[0056] Sequentially forming a first isolation structure material layer, a second isolation structure material layer and a protective material layer on a side of the first electrode away from the substrate;

[0057] Performing patterning on the protective material layer to form the protective portion;

[0058] The second isolation structure material layer and the first isolation structure material layer are patterned to obtain the isolation structure, wherein the isolation structure includes the second isolation portion formed by the patterned second isolation structure material layer and the first isolation portion formed by the patterned first isolation structure material layer.

[0059] In a possible implementation of the present application, before the step of manufacturing an isolation structure on a side of the first electrode away from the substrate and a protection portion located on a side of the isolation structure away from the substrate, the method further includes:

[0060] forming a pixel defining material layer on a side of the first electrode away from the substrate;

[0061] After the step of manufacturing an isolation structure on a side of the first electrode away from the substrate and a protection portion located on a side of the isolation structure away from the substrate, the method further includes:

[0062] The pixel defining material layer at the isolation opening is patterned to form a pixel defining layer including a pixel opening, wherein the pixel opening exposes a portion of the first electrode.

[0063] In a third aspect of the present application, an electronic device is provided, comprising a display panel according to any possible implementation of the first aspect, or a display panel prepared according to any possible implementation of the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0065] Figure 1 One of the distribution schematic diagrams of the isolation structure provided by this embodiment is illustrated;

[0066] Figure 2 Example Figure 1 One of the cross-sectional diagrams at the AA position;

[0067] Figure 3 Example Figure 1 The second cross-sectional diagram at the AA position;

[0068] Figure 4 Example Figure 1 The third cross-sectional diagram at the AA position;

[0069] Figure 5 One of the schematic diagrams of the orthographic projection relationship between the first via hole and the protection portion on the substrate is illustrated;

[0070] Figure 6 A second schematic diagram illustrating the orthographic projection relationship between the first via hole and the protection portion on the substrate;

[0071] Figure 7 A possible schematic diagram of an isolation structure is illustrated;

[0072] Figure 8 Example Figure 1 The fourth cross-sectional diagram at the AA position;

[0073] Fig. 9 Example Figure 1 The fifth cross-sectional diagram at the AA position;

[0074] Fig.10 A schematic diagram illustrating a process of a method for preparing a display panel provided in this embodiment;

[0075] Fig.11 for Fig.10 The corresponding process diagram;

[0076] Fig.12 Example Fig.10 A possible process flow chart corresponding to step S13;

[0077] Fig.13 Example Fig.10 Another possible process flow chart corresponding to step S13;

[0078] Fig.14 Part of the process flow chart of the method for manufacturing the display panel provided in this embodiment is illustrated.

[0079] Main icons: 1-display panel; 11-substrate; 108-first via hole; 111-pixel circuit; 12-isolation structure; 1201-isolation opening; 121-first isolation part; 122-second isolation part; 1221-first groove; 123-third isolation part; 13-light-emitting device; 131-first electrode; 132-light-emitting material layer; 133-second electrode; 14-protection part; 141-second groove; 15-planarization layer; 16-pixel defining layer; 1601-pixel opening; 171-first encapsulation layer; 1711-encapsulation unit; 172-second encapsulation layer; 173-third encapsulation layer; 20-conductive material layer; 301-first isolation structure material layer; 302-second isolation structure material layer; 40-protection material layer; 50-pixel defining material layer. DETAILED DESCRIPTION

[0080] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0081] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0082] Improving the density of light-emitting devices in a display panel (i.e., pixel density) is an important way to improve the display effect. However, the display panels currently made using fine metal evaporation mask (FMM) technology are unable to further increase the density of light-emitting devices due to technical limitations. After long-term research, the inventors found that in order to solve the technical problem that the density of light-emitting devices cannot be further increased, an isolation structure is set in some display panels. When the light-emitting material layer and the cathode are evaporated in the entire layer, the light-emitting material layer and the cathode can be disconnected at the isolation structure position. Through multiple evaporation and multiple etching processes, light-emitting devices of different colors can be formed in different isolation openings. The above process is also called light-emitting device patterning.

[0083] Patent CN118251982A, Patent 202410864269.8, Patent PCT / CN2024 / 098407, Patent PCT / CN2024 / 102783, Patent PCT / CN2024 / 098217, Patent PCT / CN2024 / 099419, Patent PCT / CN2024 / 099072, Patent CN117979755A, Patent CN117998900A, Patent C N117062489A, patent CN117580403A, patent CN116583155A, patent CN116669477A, ​​patent CN117396039A, patent CN116669480A, patent CN116600606A and patent CN117500332A record relevant technical solutions of isolation structure (or partition structure or isolation column) and packaging layer, and their contents are incorporated into this application by reference for reference.

[0084] In the above display panel, the display effect of the display panel may be affected by etching during the patterning process of the light emitting device.

[0085] In order to solve the above problems, the inventor innovatively designed the following technical solution, and the specific implementation scheme of the present application will be described in detail below in conjunction with the accompanying drawings. It should be noted that the defects existing in the above solutions in the prior art are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above technical problems and the solutions proposed in this embodiment below for the above problems should all be the contributions made by the inventor to the present application in the process of invention and creation, and should not be understood as the technical content known to those skilled in the art.

[0086] Please refer to Figure 1 and Figure 2 , Figure 1 The schematic diagram of the position distribution of the isolation structure and the isolation openings provided in this embodiment is illustrated. Figure 2 Example Figure 1In the present embodiment, the display panel 1 includes a substrate 11, an isolation structure 12 and a light-emitting device 13, wherein the substrate 11 is a multi-layer structure, the substrate 11 includes at least a plurality of conductive layers and an insulating layer located between adjacent conductive layers, a pixel circuit for providing a driving signal to the light-emitting device 13 is formed in the substrate 11, and the conductive layer can be a metal conductive layer.

[0087] The isolation structure 12 is located on one side of the substrate 11, and the isolation structure 12 encloses a plurality of isolation openings 1201 on the substrate 11. In the direction away from the substrate 11 (Z direction in the figure), the isolation structure 12 includes a first isolation portion 121 and a second isolation portion 122 arranged in a stacked manner, the orthographic projection of the first isolation portion 121 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11, and the second isolation portion 122 extends toward the corresponding isolation opening 1201 relative to the first isolation portion 121 to form an undercut structure (undercut structure), through which the light-emitting material layer and the electrode layer evaporated on the entire surface can be disconnected at this position, so as to form the film layer of the light-emitting device independently in different isolation openings 1201.

[0088] At least part of the light-emitting device 13 is located in the corresponding isolation opening 1201, and the light-emitting device 13 includes a first electrode 131, and the first electrode 131 is electrically connected to the pixel circuit 111 in the substrate 11 through the first via hole 108, wherein the orthographic projection of the first via hole 108 on the substrate 11 is located within the orthographic projection of the isolation structure 12 on the substrate 11, and the surface of the second isolation part 122 away from the substrate 11 will be uneven due to the existence of the first via hole 108 below, that is, the second isolation part 122 at the position corresponding to the first via hole 108 has an uneven surface. In the patterning process of the light-emitting device, the evaporated film layer is easy to form a film layer with uneven thickness at this position, and it is easy to over-etch and damage the second isolation part 122 and the first isolation part 121 and the first electrode 131 below it during etching, which will eventually cause the light-emitting device 13 to display poorly and affect the display effect.

[0089] The protection portion 14 is located on a side of the second isolation portion 122 away from the substrate 11 , and the orthographic projection of the protection portion 14 on the substrate 11 covers the orthographic projection of the first via hole 108 on the substrate 11 , that is, the protection portion 14 can cover the uneven surface of the second isolation portion 122 formed by the influence of the first via hole 108 .

[0090] In the above structure, the second isolation portion 122 at the position corresponding to the first via hole 108 can be protected by the protection portion 14 during the patterning process of the light-emitting device, so as to prevent the second isolation portion 122 at the position corresponding to the first via hole 108 from being damaged during the etching process due to the uneven surface, or even causing the first isolation portion 121 and the first electrode 131 thereunder to be etched, so that the light-emitting device 13 will not be affected by the above-mentioned etching damage and its light emission will be ensured, thereby ensuring the display effect of the display panel 1.

[0091] In this embodiment, please refer to Figure 3 The display panel 1 further includes a planarization layer 15 between the first electrode 131 and the substrate 11 . The planarization layer 15 is provided with a first via hole 108 . The first electrode 131 is electrically connected to the pixel circuit 111 in the substrate 11 through the first via hole 108 in the planarization layer 15 .

[0092] Optionally, the orthographic projection of the first via hole 108 of the planarization layer 15 on the substrate 11 is located within the orthographic projection of the first isolation portion 121 on the substrate 11 .

[0093] For example, in this embodiment, the pixel circuit 111 may include a transistor, and the first electrode 131 is electrically connected to a source or a drain of the transistor through the first via hole 108 of the planarization layer 15 .

[0094] For further information, please refer to Figure 4 The display panel 1 further includes a pixel defining layer 16, which is located on a side of the first electrode 131 away from the substrate 11, and includes a pixel opening 1601, which exposes a portion of the first electrode 131. The isolation structure 12 is located on a side of the pixel defining layer 16 away from the substrate 11, and the pixel opening 1601 is connected to the isolation opening 1201. Exemplarily, the orthographic projection of the pixel opening 1601 on the substrate 11 is located within the orthographic projection of the isolation opening 1201 on the substrate 11. In this embodiment, the pixel defining layer 16 may be an organic pixel defining layer or an inorganic pixel defining layer. Preferably, the pixel defining layer 16 is an inorganic pixel defining layer. When the pixel defining layer 16 is an inorganic pixel defining layer, the pixel defining layer 16 may be a single-layer structure of silicon oxide (SiOx) or silicon nitride (SiNx), or a stacked structure formed alternately of silicon oxide and silicon nitride.

[0095] Alternatively, if Figure 4 As shown, part of the pixel defining layer 16 is filled in the first via hole 108 of the planarization layer 16. In addition, part of the isolation structure 12 may also be filled in the first via hole 108 of the planarization layer 16.

[0096] Further, please refer again to Figure 4The light emitting device 13 further includes a light emitting material layer 132 and a second electrode 133. In a direction away from the substrate 11, the first electrode 131, the light emitting material layer 132 and the second electrode 133 are stacked in sequence, at least part of the first electrode 131 is exposed from the position of the pixel opening 1601, at least part of the second electrode 133 extends from the pixel opening 1601 through the pixel defining layer 16 to the side wall of the isolation structure 12 facing the isolation opening 1201, and the second electrode 133 is electrically connected to the isolation structure 12. Specifically, the second electrode 133 can overlap the isolation structure 12, and optionally, the second electrode 133 overlaps the first isolation portion 121. Exemplarily, the first electrode 131 can be an anode of the light emitting device 13, and the second electrode 133 can be a cathode of the light emitting device 13.

[0097] In this embodiment, the isolation structure 12 can enclose a plurality of isolation openings 1201. The setting of the isolation structure 12 can form film layers of light-emitting devices of different colors in different isolation openings 1201 without the need for a fine metal mask, thereby reducing the manufacturing cost of the display panel. The isolation structure 12 can isolate the light-emitting material layer 132 and the second electrode 133 in the light-emitting device 13, so that different light-emitting devices 13 are independent of each other, so as to improve the crosstalk between adjacent light-emitting devices 13 and enhance the display effect. Adjacent light-emitting devices 13 can be independently packaged to improve the packaging yield. At the same time, due to the existence of the isolation structure 12, the light-emitting material layer 132 and the second electrode 133 in the light-emitting device 13 of each color in the display panel can be first prepared on the entire surface and then patterned, thereby eliminating the fine metal mask to save the manufacturing cost of the display panel.

[0098] In this embodiment, please refer to Figure 4 , the side of the isolation structure 12 away from the substrate 11 includes a first groove 1221, that is, the undulating surface formed at the position corresponding to the second isolation portion 122 and the first via hole 108 is the first groove 1221, and the orthographic projection of the first groove 1221 on the substrate 11 overlaps with the orthographic projection of the first via hole 108 on the substrate 11. Optionally, the orthographic projection of the first groove 1221 on the substrate 11 is located within the orthographic projection of the first via hole 108 on the substrate 11.

[0099] In this embodiment, the orthographic projection of the first groove 1221 on the substrate 11 is located within the orthographic projection of the protection portion 14 on the substrate 11 , that is, the protection portion 14 completely covers the first groove 1221 .

[0100] Please refer again Figure 4The protection part 14 forms a second groove 141 at the position of the first groove 1221, that is, at least part of the protection part 14 forms the second groove 141 along the surface undulation of the first groove 1221. The orthographic projection of the second groove 141 on the substrate 11 is located within the orthographic projection of the first groove 1221 on the substrate 11.

[0101] The inventor has found that during the patterning process of the light-emitting device, when the film layer above the isolation structure 12 is removed by dry etching, the etching material will over-etch the second isolation portion 122, thereby causing the process failure mentioned in this application. For this reason, in this embodiment, the protection portion 14 can be made of a material resistant to dry etching, that is, the material of the protection portion 14 can include a material resistant to dry etching. In this embodiment, the material of the protection portion 14 can be the same as that of the second isolation portion 122, that is, the resistance to etching materials can be increased by increasing the thickness of the existing second isolation portion 122. The materials of the protection portion 14 and the second isolation portion 122 include titanium or molybdenum.

[0102] In this embodiment, the orthographic projection of the protection portion 14 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11, that is, the portion of the second isolation portion 122 close to the corresponding isolation opening 1201 may not be covered by the protection portion 14, thereby ensuring that the thickness of this portion of the second isolation portion 122 will not be thickened, which is beneficial to the subsequent production of the packaging unit, thereby ensuring the film forming effect of the packaging unit on this portion of the second isolation portion 122, so as to ensure the packaging effect of the packaging unit.

[0103] Please refer again Figure 4 , in a direction perpendicular to the plane of the substrate 11 (Z direction in the figure), the thickness d1 of the second isolation portion 122 is 800 angstroms to 2500 angstroms, and the thickness d2 of the protection portion 14 is 400 angstroms to 2000 angstroms. Exemplarily, the thickness d1 of the second isolation portion 122 includes 800 angstroms, 850 angstroms, 980 angstroms, 1250 angstroms, 1480 angstroms, 1650 angstroms, 1950 angstroms, 2280 angstroms or 2500 angstroms, and the thickness d2 of the protection portion 14 includes 400 angstroms, 450 angstroms, 680 angstroms, 900 angstroms, 1080 angstroms, 1250 angstroms, 1480 angstroms, 1650 angstroms, 1950 angstroms, 2000 angstroms, etc.

[0104] Please refer to Figure 5 and Figure 6 In a possible implementation of this embodiment, the orthographic projection of a first via hole 108 on the substrate 11 is correspondingly located within the orthographic projection of a protection portion 14 on the substrate 11, such as Figure 5As shown in FIG. 1 , nine first via holes 108 and nine protection portions 14 are illustrated, and one first via hole 108 corresponds to one protection portion 14. In another possible implementation of this embodiment, the orthographic projections of the plurality of first via holes 108 on the substrate 11 are correspondingly located within the orthographic projection of one protection portion 14 on the substrate 11, such as Figure 6 As shown, nine first via holes 108 and three protection parts 14 are illustrated, and three first via holes 108 correspond to one protection part 14, that is, the orthographic projections of the three first via holes 108 on the substrate 11 are located within the orthographic projection of one protection part 14 on the substrate 11. Optionally, the orthographic projection shape of the protection part 14 on the substrate 11 may be a rectangle.

[0105] For further information, please refer to Figure 7 The isolation structure 12 also includes a third isolation portion 123. In the direction away from the substrate 11, the third isolation portion 123, the first isolation portion 121 and the second isolation portion 122 are stacked in sequence, and the orthographic projection of the first isolation portion 121 on the substrate 11 is located within the orthographic projection of the third isolation portion 123 on the substrate 11, that is, the orthographic projection area of ​​the first isolation portion 121 on the substrate 11 is smaller than the orthographic projection area of ​​the third isolation portion 123 on the substrate 11, and the third isolation portion 123 will extend toward the corresponding isolation opening 1201 relative to the first isolation portion 121.

[0106] In this embodiment, the light emitting device 13 further includes a light emitting material layer 132 and a second electrode 133 . In a direction away from the substrate 11 , the first electrode 133 , the light emitting material layer 132 and the second electrode 133 are stacked in sequence, and the second electrode 133 overlaps the third isolation portion 123 .

[0107] In this embodiment, the material of the first isolation portion 121 includes aluminum, silver or copper, the material of the second isolation portion 122 includes titanium or molybdenum, and the material of the third isolation portion 123 includes molybdenum or titanium.

[0108] Please refer to Figure 8In this embodiment, the display panel 1 further includes a first encapsulation layer 171, and the first encapsulation layer 171 includes a plurality of encapsulation units 1711 for encapsulating different light-emitting devices 13. The encapsulation units 1711 are located on a side of the light-emitting device 13 away from the substrate 11, and the encapsulation units 1711 extend from the surface of the light-emitting device 13 through the first isolation portion 121 toward the side wall of the isolation opening 1201 to a side of the second isolation portion 122 away from the substrate 11. Optionally, two adjacent encapsulation units 1711 for encapsulating light-emitting devices 13 of different colors are disconnected on a side of the isolation structure 12 away from the substrate 11, and a gap exists between the encapsulation units 1711 located on a side of the isolation structure 12 away from the substrate 11 and the isolation structure 12 (i.e., the second isolation portion 122). Two adjacent encapsulation units 1711 for encapsulating light-emitting devices 13 of the same color are connected to each other on a side of the isolation structure 12 away from the substrate 11.

[0109] In this embodiment, the orthographic projection of the protection portion 14 on the substrate 11 is located outside the orthographic projection of the encapsulation unit 1711 on the substrate 11, or the orthographic projection of the protection portion 14 on the substrate 11 partially overlaps with the orthographic projection of the encapsulation unit 1711 on the substrate 11. With such a design, the film layer of the light-emitting device evaporated between the encapsulation unit 1711 and the second isolation portion 122 can be completely removed during the patterning process of the light-emitting device, thereby avoiding the problem of different color appearance of the display panel caused by the residual film layer.

[0110] For further information, please refer to Fig. 9 The display panel 1 further includes a second encapsulation layer 172, which is located on a side of the encapsulation unit 1711 away from the substrate 11, and at least covers the encapsulation unit 1711. Optionally, the second encapsulation layer 172 has a flat surface on a side away from the substrate 11.

[0111] Furthermore, the display panel 1 further includes a third encapsulation layer 173 , and the third encapsulation layer 173 is located on a side of the second encapsulation layer 172 away from the substrate 11 .

[0112] Optionally, the first encapsulation layer 171 and the third encapsulation layer 173 are inorganic encapsulation layers, and the second encapsulation layer 172 is an organic encapsulation layer. For example, the first encapsulation layer 171 and the third encapsulation layer 173 can be formed by chemical vapor deposition (CVD), and the second encapsulation layer 172 can be formed by inkjet printing (IJP).

[0113] It is understandable that the display panel 1 may also include a touch function layer, an optical adhesive layer, a polarizer, a cover plate and other film layers stacked in sequence on the side of the third packaging layer 173 away from the substrate 11. The above film layers are conventional film layers of the display panel and will not be described in detail here.

[0114] Based on the same inventive concept, this embodiment also provides a method for preparing a display panel, please refer to Fig.10 and Fig.11 ,in Fig.10 The schematic diagram of the process of manufacturing the display panel provided in this embodiment is shown in FIG. Fig.11 Example Fig.10 The corresponding process diagram is combined with the following Fig.10 and Fig.11 The method for manufacturing the display panel provided in this embodiment is described in detail.

[0115] Step S11, providing a substrate 11.

[0116] The substrate 11 is a multi-layer structure, and the substrate 11 includes at least a plurality of conductive layers and an insulating layer between adjacent conductive layers. The pixel circuit 111 in the substrate 11 is used to provide a driving signal for the light-emitting device 13. Exemplarily, the conductive layer includes a metal conductive layer. In this embodiment, the first via hole 108 can be manufactured through this step, wherein the first via hole 108 can expose the conductive layer or the pixel circuit connected to the pixel circuit.

[0117] Step S12 , manufacturing a conductive material layer 20 on the substrate 11 , and patterning the conductive material layer 20 to form a first electrode 131 connected to the pixel circuit 111 through the first via hole 108 .

[0118] In step S13 , an isolation structure 12 and a protection portion 14 located on a side of the isolation structure 12 away from the substrate 11 are manufactured on a side of the first electrode 131 away from the substrate 11 .

[0119] In this embodiment, the isolation structure 12 encloses a plurality of isolation openings 1201 on the substrate 11. In the direction away from the substrate 11, the isolation structure 12 includes a first isolation portion 121 and a second isolation portion 122 which are stacked, the orthographic projection of the first isolation portion 121 on the substrate 11 being located within the orthographic projection of the second isolation portion 122 on the substrate 11, and the second isolation portion 122 extending toward the corresponding isolation opening 1201 relative to the first isolation portion 121 to form an undercut structure, through which the light-emitting material layer and the electrode layer evaporated on the entire surface can be disconnected at this position, so as to form the film layer of the light-emitting device independently in different isolation openings 1201.

[0120] The display panel formed by the above-mentioned preparation method can protect the second isolation portion 122 at the position of the first via hole 108 through the protection portion 14 during the patterning process of the light-emitting device, thereby preventing the second isolation portion 122 at the position of the first via hole 108 from being damaged due to the uneven surface during the etching process or even causing the first isolation portion 121 and the first electrode 131 thereunder to be etched, thereby ensuring that the display effect of the display panel 1 will not be affected by the above-mentioned etching damage, thereby improving the display stability of the display panel 1.

[0121] In a possible implementation of this embodiment, please refer to Fig.12 , step S13 can be implemented in the following way.

[0122] First, a first isolation structure material layer 301 and a second isolation structure material layer 302 are sequentially formed on a side of the first electrode 131 away from the substrate 11 .

[0123] Next, a partial area in the second isolation structure material layer 302 is thinned, and the portion of the unthinned area that is raised relative to the thinned area is used as a protective portion 14, wherein the orthographic projection of the unthinned area in the second isolation structure material layer 302 on the substrate 11 covers the orthographic projection of the first via 108 on the substrate 11.

[0124] Then, the second isolation structure material layer 302 and the first isolation structure material layer 301 are patterned to obtain an isolation structure 12 .

[0125] In this embodiment, the isolation structure 12 includes a second isolation portion 122 formed by the patterned second isolation structure material layer 302 , and a first isolation portion 121 formed by the patterned first isolation structure material layer 301 .

[0126] In another possible implementation of this embodiment, please refer to Fig.13 , step S13 can be implemented in the following way.

[0127] First, a first isolation structure material layer 301 , a second isolation structure material layer 302 and a protective material layer 40 are sequentially formed on a side of the first electrode 131 away from the substrate 11 .

[0128] Next, the protective material layer 40 is patterned to form the protective portion 14 .

[0129] Then, the second isolation structure material layer 302 and the first isolation structure material layer 301 are patterned to obtain an isolation structure 12 .

[0130] In this embodiment, the isolation structure 12 includes a second isolation portion 122 formed by the patterned second isolation structure material layer 302 , and a first isolation portion 121 formed by the patterned first isolation structure material layer 301 .

[0131] For further information, please refer to Fig.14 Before step S13, the method for preparing a display panel provided in this embodiment further includes the following steps.

[0132] A pixel defining material layer 50 is formed on a side of the first electrode 131 away from the substrate 11 .

[0133] Please refer again Fig.14 After step S13, the method for preparing a display panel provided in this embodiment further includes the following steps.

[0134] The pixel defining material layer 50 at the isolation opening 1201 is patterned to form a pixel defining layer 16 including a pixel opening 1601 . The pixel opening 1601 exposes a portion of the first electrode 131 .

[0135] Based on the same inventive concept, an embodiment of the present application also provides an electronic device, which includes the display panel provided in the present application, or includes a display panel prepared by the display panel preparation method provided in the present embodiment. The electronic device may include a smart phone, a tablet computer, a vehicle-mounted display device, a smart wearable device, a television, a laptop computer, and other devices with a display function.

[0136] The embodiments of the present application provide a display panel, a method for preparing a display panel, and an electronic device. In the display panel, in the direction away from the substrate, the isolation structure includes a first isolation portion and a second isolation portion that are stacked, the first electrode in the light-emitting device is electrically connected to the pixel circuit in the substrate through a first via hole, the protection portion is located on the second isolation portion, and the orthographic projection of the protection portion on the substrate covers the orthographic projection of the first via hole on the substrate. With such a design, the second isolation portion at the position of the first via hole can be protected by the protection portion during the patterning process of the light-emitting device, so as to avoid the second isolation portion at the position of the first via hole being damaged during the etching process due to the uneven surface, or even causing the first isolation portion and the first electrode below it to be etched, thereby ensuring that the display effect of the display panel will not be affected by the above-mentioned etching damage, and improving the display stability of the display panel.

[0137] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; an isolation structure, located on one side of the substrate, the isolation structure enclosing a plurality of isolation openings on the substrate, wherein in a direction away from the substrate, the isolation structure comprises a first isolation portion and a second isolation portion stacked, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate; a light emitting device, at least partially located in the isolation opening, the light emitting device comprising a first electrode, the first electrode being electrically connected to a pixel circuit in the substrate through a first via hole, wherein an orthographic projection of the first via hole on the substrate is located within an orthographic projection of the isolation structure on the substrate; A protection portion, wherein the protection portion is located at a side of the second isolation portion away from the substrate, and an orthographic projection of the protection portion on the substrate covers an orthographic projection of the first via hole on the substrate.

2. The display panel according to claim 1, wherein: The display panel further includes a planarization layer located between the first electrode and the substrate, the planarization layer is provided with the first via hole, and the first electrode is electrically connected to the pixel circuit through the first via hole of the planarization layer; Preferably, the orthographic projection of the first via hole of the planarization layer on the substrate is located within the orthographic projection of the first isolation portion on the substrate; Preferably, the pixel circuit comprises a transistor, and the first electrode is electrically connected to a source or a drain of the transistor through a first via hole of the planarization layer.

3. The display panel according to claim 2, wherein: The display panel further includes a pixel defining layer, the pixel defining layer is located on a side of the first electrode away from the substrate, the pixel defining layer includes a pixel opening, and the pixel opening exposes a portion of the first electrode; The isolation structure is located at a side of the pixel defining layer away from the substrate, and the pixel opening is connected to the isolation opening; Preferably, part of the pixel definition layer is filled in the first via hole of the planarization layer; Preferably, part of the isolation structure is also filled in the first via hole of the planarization layer; Preferably, the light emitting device further comprises a light emitting material layer and a second electrode, and in a direction away from the substrate, the first electrode, the light emitting material layer and the second electrode are stacked in sequence, and the second electrode is electrically connected to the isolation structure; Preferably, the second electrode overlaps the isolation structure; Preferably, the second electrode overlaps the first isolation portion.

4. The display panel according to any one of claims 1 to 3, characterized in that: The isolation structure comprises a first groove on a side away from the substrate, wherein an orthographic projection of the first groove on the substrate overlaps with an orthographic projection of the first via hole on the substrate; Preferably, the orthographic projection of the first groove on the substrate is located within the orthographic projection of the first via hole on the substrate; Preferably, the orthographic projection of the first groove on the substrate is located within the orthographic projection of the protection portion on the substrate.

5. The display panel according to claim 4, wherein: The protection portion is formed with a second groove at the position of the first groove; Preferably, the orthographic projection of the second groove on the substrate is located within the orthographic projection of the first groove on the substrate.

6. The display panel according to any one of claims 1 to 3, characterized in that: The material of the protection part is the same as that of the second isolation part; Preferably, the material of the protection portion and the second isolation portion includes titanium or molybdenum; Preferably, an orthographic projection of the protection portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate.

7. The display panel according to any one of claims 1 to 3, characterized in that: In a direction perpendicular to the plane where the substrate is located, the thickness of the second isolation portion is 800 angstroms to 2500 angstroms, and the thickness of the protection portion is 400 angstroms to 2000 angstroms.

8. The display panel according to any one of claims 1 to 3, characterized in that: An orthographic projection of one of the first via holes on the substrate is correspondingly located within an orthographic projection of one of the protection portions on the substrate; or, The orthographic projections of the plurality of first via holes on the substrate are correspondingly located within the orthographic projection of one protection portion on the substrate; Preferably, the orthographic projection shape of the protection portion on the substrate includes a rectangle.

9. The display panel according to any one of claims 1 to 3, characterized in that: The isolation structure further includes a third isolation portion, and in a direction away from the substrate, the third isolation portion, the first isolation portion and the second isolation portion are stacked in sequence; The orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate; Preferably, the orthographic projection of the third isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate; Preferably, the light emitting device further comprises a light emitting material layer and a second electrode, and in a direction away from the substrate, the first electrode, the light emitting material layer and the second electrode are stacked in sequence, and the second electrode overlaps the third isolation portion; Preferably, the material of the first isolation portion includes aluminum, silver or copper, and the material of the third isolation portion includes molybdenum or titanium.

10. The display panel according to any one of claims 1 to 3, characterized in that: The display panel further includes a first encapsulation layer; The first encapsulation layer includes a plurality of encapsulation units; Preferably, two adjacent packaging units of light-emitting devices of different colors are disconnected at a side of the isolation structure away from the substrate, and a gap exists between a portion of the packaging unit located at a side of the isolation structure away from the substrate and the isolation structure; Preferably, two adjacent packaging units of light-emitting devices of the same color are connected to each other at a side of the isolation structure away from the substrate.

11. The display panel according to claim 10, wherein: The orthographic projection of the protection portion on the substrate is located outside the orthographic projection of the packaging unit on the substrate; or, An orthographic projection of the protection portion on the substrate partially overlaps with an orthographic projection of the packaging unit on the substrate.

12. The display panel according to claim 10, wherein: The display panel further includes a second encapsulation layer, the second encapsulation layer is located at a side of the encapsulation unit away from the substrate, and the second encapsulation layer at least covers the encapsulation unit; Preferably, the second encapsulation layer has a flat surface on a side away from the substrate; Preferably, the display panel further comprises a third encapsulation layer, and the third encapsulation layer is located on a side of the second encapsulation layer away from the substrate; Preferably, the first encapsulation layer and the third encapsulation layer are inorganic encapsulation layers, and the second encapsulation layer is an organic encapsulation layer.

13. A method for preparing a display panel, characterized in that: The method comprises: providing a substrate; A conductive material layer is formed on the substrate, and the conductive material layer is patterned to form a first electrode electrically connected to the pixel circuit via a first via hole; An isolation structure and a protective portion located on a side of the isolation structure away from the substrate are manufactured on the side of the first electrode away from the substrate, wherein the isolation structure encloses a plurality of isolation openings, and in a direction away from the substrate, the isolation structure includes a first isolation portion and a second isolation portion which are stacked, the orthographic projection of the first isolation portion on the substrate being within the orthographic projection of the second isolation portion on the substrate, and the orthographic projection of the protective portion on the substrate covering the orthographic projection of the first via on the substrate.

14. The method for preparing a display panel according to claim 13, wherein: The step of manufacturing an isolation structure on a side of the first electrode away from the substrate and a protection portion located on a side of the isolation structure away from the substrate comprises: Sequentially forming a first isolation structure material layer and a second isolation structure material layer on a side of the first electrode away from the substrate; Thinning a portion of the second isolation structure material layer, and using a portion of the non-thinned region protruding relative to the thinned region as the protection portion, wherein the orthographic projection of the non-thinned region of the second isolation structure material layer on the substrate covers the orthographic projection of the first via on the substrate; The second isolation structure material layer and the first isolation structure material layer are patterned to obtain the isolation structure, wherein the isolation structure includes the second isolation portion formed by the patterned second isolation structure material layer and the first isolation portion formed by the patterned first isolation structure material layer.

15. The method for preparing a display panel according to claim 13, wherein: The step of manufacturing an isolation structure on a side of the first electrode away from the substrate and a protection portion located on a side of the isolation structure away from the substrate comprises: Sequentially forming a first isolation structure material layer, a second isolation structure material layer and a protective material layer on a side of the first electrode away from the substrate; Performing patterning on the protective material layer to form the protective portion; The second isolation structure material layer and the first isolation structure material layer are patterned to obtain the isolation structure, wherein the isolation structure includes the second isolation portion formed by the patterned second isolation structure material layer and the first isolation portion formed by the patterned first isolation structure material layer.

16. The method for preparing a display panel according to claim 13, wherein: Before the step of manufacturing an isolation structure on a side of the first electrode away from the substrate and a protection portion located on a side of the isolation structure away from the substrate, the method further includes: forming a pixel defining material layer on a side of the first electrode away from the substrate; After the step of manufacturing an isolation structure on a side of the first electrode away from the substrate and a protection portion located on a side of the isolation structure away from the substrate, the method further includes: The pixel defining material layer at the isolation opening is patterned to form a pixel defining layer including a pixel opening, wherein the pixel opening exposes a portion of the first electrode.

17. An electronic device, characterized in that: A display panel comprising the display panel described in any one of claims 1 to 12, or a display panel prepared by the method for preparing a display panel described in any one of claims 13 to 16.

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