Display module, preparation method and display device

Abstract

The invention provides a display module, a preparation method and a display device. The display module comprises a substrate, a light-emitting device layer, an optical function layer and a transparent substrate which are arranged in a stacked mode. The orthographic projection of the light-emitting device layer on the substrate is located in the substrate; the orthographic projection of the optical functional layer on the substrate covers the orthographic projection of the luminescent device layer on the substrate; the orthographic projection of the transparent substrate on the substrate covers the orthographic projection of the optical functional layer on the substrate; the substrate is provided with a binding area, and the binding area and the light-emitting device layer are arranged on the same layer; the protection structure layer is arranged on one side, close to the transparent substrate, of the substrate; the protection structure layer surrounds the light emitting device layer, and the orthographic projection of the protection structure layer on the substrate covers the orthographic projection of the binding area on the substrate; the protection structure layer arranged on the substrate can shield and protect the substrate and the binding area in the preparation process of the display module, the integrity of the display module is guaranteed, and the product quality and the factory yield of the display module are improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module, a preparation method and a display device. Background Art

[0002] With the continuous updating and iteration of display technology, people have higher and higher requirements for near-eye displays, especially in the field of wearable displays. As an important component of wearable products, lightweight design of display modules has become an inevitable trend. In the manufacturing process of display modules, CG (Crystal glass) cutter wheels are usually used to cut wafer backplanes formed by CMOS (Complementary Metal Oxide Semiconductor) to form and serve as the substrate of display modules. Due to the high brittleness of CMOS wafer backplanes, when using a cutter wheel to cut them, there is a phenomenon of cracking or breaking of the cut parts caused by factors such as uneven force on the CMOS wafer, which reduces the integrity of the substrate formed by cutting, thereby affecting the overall quality and factory yield of the product. Summary of the invention

[0003] In view of this, the purpose of the present application is to provide a display module, a manufacturing method and a display device to solve some or all of the technical problems mentioned above.

[0004] Based on the above purpose, the present application provides a display module, comprising: a stacked base substrate, a light-emitting device layer, an optical function layer and a transparent substrate; the orthographic projection of the light-emitting device layer on the base substrate is located inside the base substrate; the orthographic projection of the optical function layer on the base substrate covers the orthographic projection of the light-emitting device layer on the base substrate; the orthographic projection of the transparent substrate on the base substrate covers the orthographic projection of the optical function layer on the base substrate; the base substrate is provided with a binding area, and the binding area is provided in the same layer as the light-emitting device layer;

[0005] A protective structure layer is arranged on a side of the base substrate close to the transparent substrate; the protective structure layer surrounds the light-emitting device layer, and its orthographic projection on the base substrate covers the orthographic projection of the binding area on the base substrate.

[0006] Based on the same inventive concept, the present application also provides a method for preparing a display module, comprising:

[0007] Providing a wafer backplane, forming a plurality of corresponding light-emitting device layers and binding areas on the wafer backplane, and forming an encapsulation layer on the surface of the light-emitting device layer to encapsulate and protect the light-emitting device layer;

[0008] A protective structure layer is formed on the surface of the wafer backplane, and an optical film is formed on a side of the packaging layer away from the wafer backplane, wherein the protective structure layer surrounds the light-emitting device layer, and its orthographic projection on the wafer backplane covers the orthographic projection of the binding area on the wafer backplane;

[0009] Thinning the side of the wafer backplane away from the light-emitting device layer, forming a plurality of pattern structures on the side of the wafer backplane away from the light-emitting device layer through a patterning process, so that cutting channels are formed between adjacent pattern structures;

[0010] Placing a cutter wheel in the cutting channel, using the cutter wheel to cut the wafer backplane and the protective structure layer, so as to cut the wafer backplane into a plurality of substrates, and removing the pattern structure by an etching process, wherein any of the substrates corresponds to one of the light-emitting device layers;

[0011] Providing a first carrier, synchronously transferring the plurality of substrates to the surface of the first carrier, and cutting the optical film into a plurality of optical functional layers using a laser cutting process, wherein any of the optical functional layers corresponds to one of the light-emitting device layers;

[0012] Providing a transparent cover plate, coating a flexible adhesive layer on the surface of the transparent cover plate, and sequentially removing the plurality of optical functional layers from the surface of the first carrier and adhering them to a side of the flexible adhesive layer away from the transparent cover plate;

[0013] Providing a second carrier, synchronously transferring the plurality of the substrates to the surface of the second carrier, and cutting the transparent cover into a plurality of transparent substrates using a cutter wheel, wherein any of the transparent substrates corresponds to one of the light-emitting device layers, and the orthographic projection of the transparent substrate on the substrate covers the orthographic projection of the optical functional layer on the substrate;

[0014] The second carrier is removed to obtain a plurality of display modules. Based on the same inventive concept, the present application also provides a display device, including the display module as described above.

[0015] From the above description, it can be seen that the display module, preparation method and display device provided by the present application are characterized in that a protective structure layer is arranged on the side of the base substrate close to the transparent substrate. The protective structure layer can shield and protect the base substrate and the binding area during the preparation of the display module, which can avoid the edge of the base substrate from cracking or breaking when the base substrate is formed by cutting with a knife wheel, and can prevent the performance of the base substrate and the wiring parts of the binding area from being damaged when the optical functional layer is formed by laser cutting, which is beneficial to ensuring the integrity of the display module and improving the overall quality and factory yield of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 This is a schematic diagram of the inter-layer distribution of the display module in this application;

[0018] Figure 2 A cross-sectional schematic diagram showing a module in this application;

[0019] Figure 3 This is a schematic diagram of the structure of the light-emitting device layer in this application;

[0020] Figure 4 A schematic diagram of a method for preparing a display module in this application;

[0021] Figure 5A-Figure 5P A process flow chart showing the preparation of the module in this application;

[0022] Figure 6 This is a schematic diagram of the wafer backplane after cutting in this application.

[0023] Description of reference numerals:

[0024] 100, substrate; 101, binding area;

[0025] 200, light emitting device layer; 210, first electrode layer; 220, light emitting layer; 230, second electrode layer;

[0026] 300, optical functional layer;

[0027] 400. Transparent substrate;

[0028] 500, protective structure layer; 510, flexible light shielding layer; 520, covering layer;

[0029] 600, flexible adhesive layer;

[0030] 710, encapsulation layer; 720, color filter layer; 721, color resistance;

[0031] 10. Wafer backplane; 20. Pattern structure; 21. Cutting channel; 30. Optical film; 40. Transparent cover; 51. Cutting wheel; 52. First carrier; 53. Second carrier. DETAILED DESCRIPTION

[0032] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0033] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0034] During the manufacturing process of the display module, the wafer backplane formed by CMOS needs to be cut to form the substrate required for the display module; however, since the CMOS wafer backplane is mainly formed of silicon-based materials, it is relatively brittle. When cutting with tools such as a cutter wheel, the working parameters of the cutter wheel are difficult to control, which will cause certain vibrations during the cutting process. At the same time, it is also easy to cause uneven force on the edge area of ​​the substrate formed by cutting, which in turn causes the wafer backplane to crack or break during the cutting process. These problems not only reduce the integrity of the substrate, but also directly affect the overall quality of the final product and the yield of the display module.

[0035] In view of this, the present application provides a display module, comprising a stacked base substrate 100, a light-emitting device layer 200, an optical function layer 300 and a transparent substrate 400; the orthographic projection of the light-emitting device layer 200 on the base substrate 100 is located inside the base substrate 100; the orthographic projection of the optical function layer 300 on the base substrate 100 covers the orthographic projection of the light-emitting device layer 200 on the base substrate 100; the orthographic projection of the transparent substrate 400 on the base substrate 100 covers the orthographic projection of the optical function layer 300 on the base substrate 100 Orthographic projection; the base substrate 100 is provided with a binding area 101, and the binding area 101 is arranged on the same layer as the light-emitting device layer 200; it also includes a protective structure layer 500, and the protective structure layer 500 is arranged on the side of the base substrate 100 close to the transparent substrate 400; the protective structure layer 500 surrounds the light-emitting device layer 200, and the orthographic projection of the base substrate 100 covers the orthographic projection of the binding area 101 on the base substrate 100, and the protective structure layer 500 is used to shield and protect the base substrate 100 and the binding area 101.

[0036] like Figure 1 and Figure 2As shown, the present application provides a display module with good quality and high yield; the display module includes a base substrate 100, a light-emitting device layer 200, an optical function layer 300 and a transparent substrate 400, wherein the base substrate 100 is used as a bearing body for the light-emitting device layer 200 and components such as a driving circuit, and plays a supporting and protective role, the light-emitting device layer 200 is arranged on one side of the base substrate 100, and can be connected to the driving circuit in the display module, and the light-emitting device layer 200 can be controlled to light up and extinguish through the driving circuit to provide the required light source for the display module; the optical function layer 300 is arranged on the side of the light-emitting device layer 200 away from the base substrate 100, and its orthographic projection on the base substrate 100 can cover the orthographic projection of the light-emitting device layer 200 on the base substrate 100, which is conducive to fully controlling the light of the light-emitting device layer 200; illustratively, the optical function layer 300 can be a polarizer, and the polarizer can be used to adjust the direction of the light emitted by the light-emitting device layer 200, and through Filter out unnecessary light to improve the image display effect and color effect of the display module; the transparent substrate 400 is arranged on a side away from the base substrate 100, and the orthographic projection of the transparent substrate 400 on the base substrate 100 covers the orthographic projection of the optical functional layer 300 on the base substrate 100, which can shield and protect the components and film layers between the base substrate 100 and the transparent substrate 400, and will not affect the normal display effect of the display module; exemplarily, the transparent substrate 400 can be formed of materials such as glass, which has good light transmittance and good protection effect, and also has the advantage of controlling the production cost of the display module; the base substrate 100 is also provided with a binding area 101, which is arranged on one side of the base substrate 100 and on the same side as the light-emitting device; specifically, the binding area 101 can be connected to the driving circuit on the base substrate 100, for connecting to an external circuit structure or IC chip, for driving the display module to work; exemplarily, the binding area 101 can be set as a bonding pad (binding wiring part), and can be connected to an external circuit structure or IC chip by welding.

[0037] In addition, the display module provided in the present application further includes a protective structure layer 500, which is arranged around the edge of the light-emitting device layer 200; Figure 5A-Figure 5PAs shown, when the display modules are prepared in batches, the wafer backplane 10 formed by COMS can be used to make the base substrate 100, and the wafer backplane 10 can be cut into a small-sized backplane structure using a cutter wheel 51 to be used as the base substrate 100 of the display module; in addition, the optical film 30 can be used as the raw material for making the optical functional layer 300, and the optical film 30 can be cut using a laser cutting process to cut the optical film 30 into multiple optical functional layers 300; therefore, in the preparation process of the display module, by providing a protective structure layer 500 on the base substrate 100, the stress generated during the cutting process can be dispersed, the concentration of stress at the cutting portion of the base substrate 100 can be reduced, the amplitude generated when the cutter wheel 51 cuts to form the base substrate 100, and the deformation degree of the cutting portion can be reduced, thereby reducing the possibility of cracking or breaking at the edge of the base substrate 100.

[0038] In addition, in addition to being arranged around the edge of the light-emitting device layer 200, the protective structure layer 500 has an orthographic projection on the base substrate 100 that covers the orthographic projection of the binding area 101 on the base substrate 100; when the optical function layer 300 is formed by laser cutting, part of the laser can reach the base substrate 100 and the surface of the binding area 101 after cutting the optical function layer 300; since the laser used for cutting has a high energy efficiency, if the laser is irradiated on the binding area 101, it is easy to cause damage to the surface of the binding area 101, affecting the connection performance between the display module and the external circuit structure; in addition, the base substrate 100 is formed by cutting the COMS wafer backplane 10, and the COMS wafer backplane 10 is a semiconductor material. Under the influence of the high-efficiency laser, the base substrate 100 is prone to thermal effects, which may cause The local temperature of the base substrate 100 increases, resulting in the generation and migration of hot carriers therein, which may affect the performance of the base substrate 100 at the least and cause irreversible damage such as lattice damage or phase change in the base substrate 100 at the worst. Therefore, a protective structure layer 500 is provided on the side of the base substrate 100 close to the transparent substrate 400. The protective structure layer 500 surrounds the light-emitting device layer 200, and the orthographic projection of the base substrate 100 covers the orthographic projection of the binding area 101 on the base substrate 100. Therefore, the laser irradiated during the cutting process of the optical functional layer 300 can be shielded, and the laser irradiation on the surface of the binding area 101 and damage to it can be avoided. At the same time, the laser irradiation on the base substrate 100 and affecting its working performance can also be avoided. This is beneficial to improving the overall quality of the display module and the product yield.

[0039] In some embodiments, the protective structure layer 500 includes a flexible shading layer 510, which is disposed on the side of the base substrate 100 close to the transparent substrate 400; the flexible shading layer 510 surrounds the light-emitting device layer 200, and the orthographic projection of the base substrate 100 and the orthographic projection of the binding area 101 on the base substrate 100 do not overlap, and is configured to shield and protect the optical functional layer 300 during the preparation of the display module, and is also configured to absorb stray light generated by the light-emitting device layer 200.

[0040] The protective structure layer 500 is disposed on the side of the base substrate 100 close to the transparent substrate 400, and can shield and protect the base substrate 100 and the binding area 101 disposed on the surface of the base substrate 100 during the display module preparation process, so as to improve the overall quality and factory yield of the display module; specifically, Figure 2 As shown, the protective structure layer 500 may include a flexible shading layer 510, which is arranged on a side of the base substrate 100 close to the transparent substrate 400; the flexible shading layer 510 surrounds the light emitting device layer 200, and the orthographic projection of the base substrate 100 does not overlap with the orthographic projection of the binding area 101 on the base substrate 100; wherein the flexible shading layer 510 can be formed of a flexible material, such as PI (Polyimide, polyimide), Acrylic Resin (acrylic resin), Polyester (polyester), Polyurethane (black polyurethane) and Epoxy Resin (epoxy resin), when the base substrate 100 is formed by cutting with the cutter wheel 51, due to the soft texture of the flexible shading layer 510, part of the vibration generated in the cutting process of the cutter wheel 51 can be absorbed, and the vibration amplitude transmitted to the base substrate 100 by the cutter wheel 51 can be reduced, which helps to protect the edge of the base substrate 100 formed by cutting from damage, and improves the overall flatness of the base substrate 100; at the same time, the use of a flexible film can make the stress generated in the cutting process more evenly distributed in the entire cutting area, which helps to reduce the risk of edge damage and reduce the probability of cracking or breaking at the cutting part of the base substrate 100, thereby shielding and protecting the optical functional layer 300 during the preparation of the display module, and improving the product quality of the display module.

[0041] In addition, during the preparation of the display module, it is necessary to use a laser to cut the optical function layer 300 of the display module; by setting the flexible shading layer 510 on the side close to the transparent substrate 400, and setting the flexible shading layer 510 around the light-emitting device layer 200, when the edge of the optical function layer 300 is cut by laser, part of the laser will irradiate the surface of the base substrate 100 and the binding area 101 after cutting the optical function layer 300; at this time, the flexible shading layer 510 can block and absorb the laser to prevent the laser from directly irradiating the surface of the base substrate 100, so as to prevent the laser from irradiating the base substrate 101. The surface of the board 100 produces a significant thermal effect, which is beneficial to ensuring the performance of the base substrate 100 and the overall quality of the display module; in addition, during the use of the display module, the light-emitting device layer 200 of the display module generates stray light in the area close to the base substrate 100, which is easy to cause light leakage in the display module. At this time, the flexible shading layer 510 arranged around the light-emitting device layer 200 can also absorb the stray light generated by the light-emitting device layer 200, thereby improving the display effect of the display module; illustratively, the flexible shading layer 510 can be formed of a dark-colored flexible material, such as BPI (Black Polyimide), Black Acrylic Resin, Black Polyester, Black Polyurethane and Black Epoxy Resin, so that during the preparation of the display module, it can not only block and protect the optical functional layer 300, but also absorb the stray light generated by the light-emitting device layer 200, which is beneficial to improving the overall performance of the display module.

[0042] In some embodiments, the protective structure layer 500 also includes a covering layer 520, which is disposed on the side of the binding area 101 away from the base substrate 100; the covering layer 520's orthographic projection on the base substrate 100 covers the orthographic projection of the binding area 101 on the base substrate 100, and is configured to shield and protect the covering layer 520 during the display module preparation process.

[0043] Specifically, the protective structure layer 500 can not only shield and protect the base substrate 100, but also shield and protect the binding area 101 disposed on one side of the base substrate 100; Figure 2As shown, the protective structure layer 500 also includes a covering layer 520, which is arranged on the side of the binding area 101 away from the base substrate 100, and the covering layer 520's orthographic projection on the base substrate 100 covers the orthographic projection of the binding area 101 on the base substrate 100, so that the covering layer 520 can completely cover the binding area 101; when the optical functional layer 300 is formed by laser cutting, part of the laser may also irradiate the surface of the binding area 101, thereby causing damage to the surface of the binding area 101. At this time, the covering layer 520 is used to block and protect the covering layer 520 during the preparation of the display module, and the laser irradiated on the surface of the covering layer 520 can be absorbed to avoid the laser directly irradiating the binding area 101 and causing the binding area 101 to be burned, which is beneficial to ensuring the overall quality of the display module.

[0044] In addition, the covering layer 520 is further explained in combination with the above-mentioned embodiment. Since the covering layer 520 is arranged on the side of the binding area 101 away from the base substrate 100, it is used to shield and protect the binding area 101; at the same time, since the display module needs to establish an electrical connection with the external circuit structure through the binding area 101, the covering layer 520 needs to be removed when necessary when the binding area 101 is electrically connected to the external circuit. Exemplarily, the covering layer 520 can be a solder resist layer, or a Black Polyurethane or Black Epoxy Resin, which not only has a good shading effect, but also is easy to scrape and clean later to expose the binding area 101, which will not be repeated here.

[0045] In some embodiments, the thickness of the base substrate 100 is 0.15 mm-0.3 mm, and the thickness of the transparent substrate 400 is 0.3 mm-0.5 mm.

[0046] Specifically, by providing a flexible protection structure on the base substrate 100, the problem of cracking or breaking of the edge of the base substrate 100 when the cutter wheel 51 cuts and forms the base substrate 100 can be reduced; at this time, the thickness of the base substrate 100 can be appropriately thinned, which can not only reduce the risk of breaking of the edge of the base substrate 100, but also facilitate the lightweight design of the base substrate 100, so as to make the display module thinner and lighter, thereby reducing the difficulty of cutting and improving the preparation efficiency of the display module; illustratively, the thickness of the base substrate 100 can be set to any thickness value between 0.15 mm and 0.3 mm, for example Such as 0.15mm, 0.20mm, 0.25mm or 0.3mm; similarly, to ensure that the transparent substrate 400 can provide good protection for the display module, the orthographic projection of the transparent substrate 400 on the base substrate 100 needs to cover the orthographic projection of the optical functional layer 300 on the base substrate 100, and needs to have a corresponding thickness. Exemplarily, the transparent substrate 400 can be set to any thickness value between 0.3mm and 0.5mm, such as 0.30mm, 0.35mm, 0.4mm, 0.45mm or 0.5mm, which will not be repeated here.

[0047] In some embodiments, the display module further includes a flexible adhesive layer 600 , which is disposed on a side of the transparent substrate 400 close to the base substrate 100 ; the orthographic projection of the flexible adhesive layer 600 on the base substrate 100 coincides with the orthographic projection of the transparent substrate 400 on the base substrate 100 .

[0048] Specifically, during the preparation of the display module, the cutter wheel 51 is required to cut the transparent cover plate 40 into transparent substrates 400, so as to protect the film layer and components in the display module through the transparent substrates 400; however, since the transparent cover plate 40 is usually made of materials such as glass, which is relatively brittle, it is easy to cause the cut part to crack or break when the cutter wheel 51 is used for cutting, thereby reducing the quality of the transparent substrate 400 and further reducing the product yield; Figure 2As shown, by arranging a flexible adhesive layer 600 in the display module, and arranging the flexible adhesive layer 600 on the side of the transparent substrate 400 close to the base substrate 100, the orthographic projection of the flexible adhesive layer 600 on the base substrate 100 coincides with the orthographic projection of the transparent substrate 400 on the base substrate 100. On the one hand, it is helpful to achieve full connection between the optical functional layer 300 and the transparent substrate 400, and improve the firmness of the connection between the two; on the other hand, when cutting to form the transparent substrate 400, by arranging the flexible adhesive layer 600 on the side of the transparent substrate 400 close to the base substrate 100, it can The flexible adhesive layer 600 can absorb the vibration generated by the cutter wheel 51 when cutting the transparent substrate 400, thereby reducing the amplitude generated during the cutting process of the transparent substrate 400; at the same time, since the flexible adhesive layer 600 can disperse the stress in the cutting area, it can prevent the transparent substrate 400 from stress concentration, and avoid the edge of the transparent substrate 400 from being broken or collapsed; in addition, when the transparent substrate 400 is formed by cutting, the cutter wheel 51 acts on the surface of the flexible adhesive layer 600, and the flexible adhesive layer 600 can be used to prevent the flexible adhesive layer 600 from being offset, thereby ensuring the accuracy of the cutting path, which is beneficial to improving the preparation quality of the display module.

[0049] It should be noted that, since the flexible adhesive layer 600 is used to connect the optical functional layer 300 and the transparent substrate 400, the flexible adhesive layer 600 may have stickiness, and when the flexible adhesive layer 600 around the edge of the optical functional layer 300 is sticky, it is not conducive to the rotation and cutting of the cutter wheel 51; therefore, after the transparent substrate 400 and the optical functional layer 300 are bonded, the flexible adhesive layer 600 may be cured to eliminate the stickiness of the surface of the flexible adhesive layer 600, so that the flexible adhesive layer 600 can play a corresponding protective role during the cutting process of the transparent substrate 400.

[0050] In some embodiments, the refractive index of the flexible adhesive layer 600 is the same as the refractive index of the transparent substrate 400; specifically, with respect to the display module, when the display module is used, the light generated by its light-emitting device layer 200 will sequentially pass through the encapsulation layer 710, the optical function layer 300 and the transparent substrate 400 to irradiate the outside of the display module, thereby realizing the display function; since the flexible adhesive layer 600 is used to bond the transparent substrate 400 and the optical function layer 300, the light will also pass through the flexible adhesive layer 600; by adopting a flexible adhesive layer 600 with the same refractive index as the transparent substrate 400, the integrity of the flexible adhesive layer 600 can be improved, which is beneficial to ensuring the clarity of the display module during the display process and preventing image distortion.

[0051] In addition, a light absorbing layer can be formed on the side of the flexible adhesive layer 600 away from the base substrate 100, so that the light absorbing layer is arranged on the same layer as the optical functional layer 300 and is arranged around the optical functional layer 300; the light absorbing layer can not only absorb the stray light emitted from the edge of the optical functional layer 300, but also absorb the stray light emitted from the edge of the transparent substrate 400, which helps to reduce the light leakage problem caused by the edge of the display module and improve the display effect of the display module.

[0052] In some embodiments, the light-emitting device layer 200 includes a first electrode layer 210, a light-emitting layer 220 and a second electrode layer 230 which are stacked, and the first electrode layer 210 is arranged on the same side as the binding area 101; an encapsulation layer 710 is arranged on the side of the light-emitting device layer 200 away from the base substrate 100; the orthographic projection of the encapsulation layer 710 on the base substrate 100 covers the orthographic projection of the light-emitting device layer 200 on the base substrate 100.

[0053] like Figure 3 As shown, with respect to the light-emitting device layer 200, the light-emitting device layer 200 can be used as the main light source of the display module; specifically, the light-emitting device layer 200 can include a first electrode layer 210, a light-emitting layer 220 and a second electrode layer 230 which are stacked in sequence, the first electrode layer 210 is arranged on the same layer as the binding area 101, and can be used as the anode layer of the display module, the second electrode can be set as a transparent electrode layer, and can be used as the cathode layer of the display module, the light-emitting layer 220 is located between the first electrode layer 210 and the second electrode layer 230, when the display module is powered on, the light-emitting layer 220 can be lit and generate light; an encapsulation layer 710 is also provided on the side of the second electrode layer 230 away from the base substrate 100, and the encapsulation can be used to encapsulate and protect the light-emitting device layer 200, and can play a role in electrical insulation, which is beneficial to ensuring the display effect of the display module.

[0054] In some embodiments, Figure 3 As shown, a color filter layer 720 can also be arranged between the encapsulation layer 710 and the optical functional layer 300. The color filter layer 720 can include color resists 721 of multiple different colors, and a black matrix structure can be arranged between different color resists 721. The color resists 721 can be used to filter the light generated by the light-emitting device layer 200, so that the light emitted through the color resist 721 has the same color as the color resist 721, thereby enabling the display module to achieve color display. At the same time, the black matrix structure arranged between adjacent color resists 721 can absorb stray light around the color resist 721, thereby avoiding crosstalk between light emitted through adjacent color resists 721 of different colors, thereby improving the color vividness of the display of the display module.

[0055] Based on the same inventive concept, Figure 4 as well as Figure 5A-Figure 6As shown, the present application also provides a method for preparing a display module, comprising:

[0056] S1: providing a wafer backplane 10, forming a plurality of corresponding light-emitting device layers 200 and a binding region 101 on the wafer backplane 10, and forming a packaging layer 710 on the surface of the light-emitting device layer 200 to encapsulate and protect the light-emitting device layer 200;

[0057] In this step, if Figure 5A-5C As shown, the display module provided by the present application can be prepared in batches. During specific implementation, a wafer backplane 10 formed by COMS can be provided as a raw material for manufacturing, and the wafer backplane 10 can be surface-treated to ensure good adhesion and flatness during subsequent film layer preparation; a plurality of light-emitting device layers 200 are formed on one side of the wafer backplane 10 by using a deposition process and a patterning process, and a binding area 101 corresponding to the light-emitting device layer 200 is formed on the wafer backplane 10 by a metal layer deposition process, so that the binding area 101 is arranged on the same layer as the light-emitting device layer 200; thereafter, a packaging layer 710 is formed on the surface of the light-emitting device layer 200 by using a yellow light process, so that the light-emitting device layer 200 is packaged and protected by the packaging layer 710.

[0058] S2: forming a protective structure layer 500 on the surface of the wafer backplane 10, and forming an optical film 30 on the side of the packaging layer 710 away from the wafer backplane 10, wherein the protective structure layer 500 surrounds the light-emitting device layer 200, and the orthographic projection of the wafer backplane 10 covers the orthographic projection of the binding area 101 on the wafer backplane 10;

[0059] In this step, if Figure 5D and Figure 5E As shown, after the packaging layer 710 is formed on the surface of the light-emitting device layer 200, a deposition process and a patterning process can be used to form a protective structure layer 500 between adjacent light-emitting device layers 200, and the protective structure layer 500 can cover the binding area 101 while being arranged around the light-emitting device layer 200 to cover and protect the light-emitting device layer 200 and the binding area 101; thereafter, an optical film 30 can be formed on the side of the packaging layer 710 away from the wafer backplane 10 by using a bonding process, so as to use the optical film 30 to control the light of the display module.

[0060] S3: thinning the side of the wafer back plate 10 away from the light emitting device layer 200, forming a plurality of pattern structures 20 on the side of the wafer back plate 10 away from the light emitting device layer 200 through a patterning process, so that a cutting channel 21 is formed between adjacent pattern structures 20;

[0061] In this step, if Figure 5F-5HAs shown, after the optical film 30 is formed on the side of the packaging layer 710 away from the light-emitting device layer 200, the wafer backplane 10 is inverted as a whole so that the side of the wafer backplane 10 away from the optical film layer is set upward; at this time, the Plasma process is used to thin the wafer backplane 10 to reduce the thickness of the wafer backplane 10 to 0.15mm-0.3mm; thereafter, a plurality of pattern structures 20 can be formed on the side of the wafer backplane 10 away from the light-emitting device layer 200 using a yellow light process; as for adjacent light-emitting device layers 200, a cutting channel 21 can be formed between adjacent light-emitting device layers 200, and the cutting channel 21 can accommodate and limit the cutter wheel 51, thereby improving the accuracy and uniformity of the cutter wheel 51 in cutting the wafer backplane 10.

[0062] S4: placing the cutter wheel 51 in the cutting channel 21, using the cutter wheel 51 to cut the wafer backplane 10 and the protective structure layer 500, so as to cut the wafer backplane 10 into a plurality of base substrates 100, and removing the pattern structure 20 by an etching process, wherein any base substrate 100 corresponds to a light-emitting device layer 200;

[0063] In this step, if Fig.5I As shown, after a cutting channel 21 is formed on a side of the wafer back plate 10 away from the light emitting device layer 200, a cutter wheel 51 is placed in the cutting channel 21, and the wafer back plate 10 and the protective structure layer 500 are cut by the cutter wheel 51 to cut the wafer back plate 10 into a plurality of substrate substrates 100, and then the pattern structure 20 is removed from the surface of the substrate substrate 100 by an etching process; specifically, the edge area of ​​the substrate substrate 100 formed by cutting the pattern structure 20 and the cutter wheel 51 is as shown in FIG. Figure 6 As shown, the edges of the cut substrate 100 are relatively neat and the yield is relatively high.

[0064] S5: providing a first carrier 52, transferring a plurality of substrates 100 to the surface of the first carrier 52 synchronously, and cutting the optical film 30 into a plurality of optical functional layers 300 by a laser cutting process, wherein any optical functional layer 300 corresponds to a light emitting device layer 200;

[0065] In this step, if Figure 5J-Figure 5L As shown, after cutting to form a plurality of substrate substrates 100, since they are connected to the surface of the same optical film 30, the plurality of substrate substrates 100 can be synchronously flipped. At this time, a first carrier 52 is provided, and the plurality of substrate substrates 100 are synchronously transferred to the surface of the first carrier 52; the optical film 30 is laser cut using a laser cutting process to cut the optical film 30 into a plurality of optical functional layers 300; wherein any optical functional layer 300 corresponds to a light-emitting device layer 200 and can fully cover the light-emitting device layer 200.

[0066] S6: providing a transparent cover plate 40, coating a flexible adhesive layer 600 on the surface of the transparent cover plate 40, removing the plurality of optical functional layers 300 from the surface of the first carrier 52 in sequence, and adhering the plurality of optical functional layers 300 to the side of the flexible adhesive layer 600 away from the transparent cover plate 40;

[0067] In this step, if Figure 5M As shown, a transparent cover plate 40 is provided, and the surface of the transparent substrate 400 is cleaned and smoothed, and a layer of flexible glue is coated on the surface of the transparent cover plate 40 by a coating process, and a plurality of optical function layers 300 are removed from the surface of the first carrier 52, and then adhered to the side of the flexible glue layer 600 away from the transparent cover plate 40 in a preset arrangement order, so that the optical function layer 300 is fully connected to the transparent cover plate 40, so that the transparent cover plate 40 can be cut into a plurality of transparent substrates 400 to protect the display module.

[0068] S7: providing a second carrier 53, synchronously transferring a plurality of base substrates 100 to the surface of the second carrier 53, and using a cutter wheel 51 to cut the transparent cover plate 40 into a plurality of transparent substrates 400, wherein any transparent substrate 400 corresponds to a light-emitting device layer 200, and the orthographic projection of the transparent substrate 400 on the base substrate 100 covers the orthographic projection of the optical functional layer 300 on the base substrate 100;

[0069] In this step, if Figure 5N-Figure 5O As shown, after a plurality of optical functional layers 300 are pasted to the surface of the transparent cover plate 40, the transparent cover plate 40 is pasted to the surface of the second carrier 53; the second carrier 53 is used as a supporting carrier, and the cutter wheel 51 is placed between the two base substrates 100 so that the cutter wheel 51 is against the surface of the flexible adhesive layer 600, and the transparent substrate 400 cover plate is cut by the cutter wheel 51, and is cut into a plurality of transparent substrates 400, and each transparent substrate 400 corresponds to a light-emitting device layer 200, and the orthographic projection of the transparent substrate 400 on the base substrate 100 covers the orthographic projection of the optical functional layer 300 on the base substrate 100, thereby effectively protecting the display module.

[0070] S8: Figure 5P As shown, the second carrier 53 is removed to obtain a plurality of display modules.

[0071] In some embodiments, in S6, multiple optical functional layers 300 are removed from the surface of the first carrier 52 in sequence and adhered to the side of the flexible adhesive layer 600 away from the transparent cover plate 40, and then the flexible adhesive layer 600 surrounding the optical functional layer 300 is cured, wherein the refractive index of the flexible adhesive layer 600 is the same as the refractive index of the transparent cover plate 40.

[0072] Specifically, after the side of the multiple optical functional layers 300 away from the base substrate 100 is synchronously adhered to the side of the flexible adhesive layer 600 away from the transparent cover plate 40, in order to avoid the flexible adhesive layer 600 from obstructing the cutting process of the cutter wheel 51, a curing process can be used to cure the flexible adhesive layer 600 around the edge of the optical functional layer 300. After the flexible adhesive layer 600 is cured, a film layer structure with a relatively soft texture can be formed, and the stickiness of the flexible adhesive layer 600 close to the base substrate 100 can be removed, thereby improving the integrity and overall quality of the transparent substrate 400; illustratively, the flexible adhesive layer 600 can be made of OCA (Optically Clear Adhesive), UV (ultraviolet) curing glue, PSA (Pressure Sensitive Adhesive) or LOCA (Liquid Optically Clear Adhesive), etc., which will not be repeated here.

[0073] Based on the same inventive concept, the present application also provides a display device, which includes the display module as above; since the display device applies the display module described above, it has all the advantages and beneficial effects of the display module; exemplarily, since the display module is a silicon-based display module, the display device can be a head-mounted display, a perspective augmented reality glasses, an eye-tracking display, a smart glasses and other display devices with display functions, which will not be repeated here.

[0074] It should be noted that the method of the embodiment of the present application can be performed by a single device, such as a computer or server. The method of this embodiment can also be applied to a distributed scenario and completed by multiple devices cooperating with each other. In the case of such a distributed scenario, one of the multiple devices can only perform one or more steps in the method of the embodiment of the present application, and the multiple devices will interact with each other to complete the described method.

[0075] It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0076] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application (including the claims) is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0077] In addition, to simplify the description and discussion, and in order not to make the embodiments of the present application difficult to understand, the known power supply / ground connection with each component may or may not be shown in the provided drawings. In addition, the device can be shown in the form of a block diagram to avoid making the embodiments of the present application difficult to understand, and this also takes into account the following fact, that is, the details of the implementation method of these block diagram devices are highly dependent on the platform to be implemented in the embodiments of the present application (that is, these details should be completely within the scope of understanding of those skilled in the art). In the case of elaborating specific details to describe the exemplary embodiments of the present application, it is obvious to those skilled in the art that the embodiments of the present application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.

[0078] Although the present application has been described in conjunction with specific embodiments thereof, many alternatives, modifications and variations of these embodiments will be apparent to those skilled in the art in light of the foregoing description.

[0079] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of the present application.

Claims

1. A display module, characterized in that: include: A base substrate, a light-emitting device layer, an optical functional layer and a transparent substrate are stacked; The orthographic projection of the light emitting device layer on the base substrate is located inside the base substrate; The orthographic projection of the optical functional layer on the base substrate covers the orthographic projection of the light emitting device layer on the base substrate; The orthographic projection of the transparent substrate on the base substrate covers the orthographic projection of the optical functional layer on the base substrate; the base substrate is provided with a binding area, and the binding area is provided in the same layer as the light-emitting device layer; A protective structure layer is arranged on a side of the base substrate close to the transparent substrate; The protection structure layer surrounds the light-emitting device layer, and its orthographic projection on the base substrate covers the orthographic projection of the binding area on the base substrate.

2. The display module according to claim 1, characterized in that: The protective structure layer comprises: A flexible shading layer is arranged on a side of the base substrate close to the transparent substrate; the flexible shading layer surrounds the light-emitting device layer, and the orthographic projection of the base substrate and the orthographic projection of the binding area on the base substrate do not overlap, and is configured to shield and protect the optical functional layer during the preparation of the display module, and is also configured to absorb stray light generated by the light-emitting device layer.

3. The display module according to claim 2, characterized in that: The protective structure layer also includes: The covering layer is arranged on a side of the binding area away from the base substrate; the orthographic projection of the covering layer on the base substrate covers the orthographic projection of the binding area on the base substrate, and is configured to shield and protect the covering layer during the preparation of the display module.

4. The display module according to claim 1, characterized in that: The thickness of the base substrate is 0.15 mm-0.3 mm, and the thickness of the transparent substrate is 0.3 mm-0.5 mm.

5. The display module according to claim 1, characterized in that: Also includes: The flexible adhesive layer is arranged on a side of the transparent substrate close to the base substrate; the orthographic projection of the flexible adhesive layer on the base substrate coincides with the orthographic projection of the transparent substrate on the base substrate.

6. The display module according to claim 5, characterized in that: The refractive index of the flexible adhesive layer is the same as the refractive index of the transparent substrate.

7. The display module according to claim 1, characterized in that: The light emitting device layer comprises: A first electrode layer, a light-emitting layer and a second electrode layer are stacked, wherein the first electrode layer is arranged on the same side as the binding area; an encapsulation layer is arranged on the side of the light-emitting device layer away from the base substrate, and the orthographic projection of the encapsulation layer on the base substrate covers the orthographic projection of the light-emitting device layer on the base substrate.

8. A method for preparing a display module, characterized in that: include: Providing a wafer backplane, forming a plurality of corresponding light-emitting device layers and binding areas on the wafer backplane, and forming an encapsulation layer on the surface of the light-emitting device layer to encapsulate and protect the light-emitting device layer; A protective structure layer is formed on the surface of the wafer backplane, and an optical film is formed on a side of the packaging layer away from the wafer backplane, wherein the protective structure layer surrounds the light-emitting device layer, and its orthographic projection on the wafer backplane covers the orthographic projection of the binding area on the wafer backplane; Thinning the side of the wafer backplane away from the light-emitting device layer, forming a plurality of pattern structures on the side of the wafer backplane away from the light-emitting device layer through a patterning process, so that cutting channels are formed between adjacent pattern structures; Placing a cutter wheel in the cutting channel, using the cutter wheel to cut the wafer backplane and the protective structure layer, so as to cut the wafer backplane into a plurality of substrates, and removing the pattern structure by an etching process, wherein any of the substrates corresponds to one of the light-emitting device layers; Providing a first carrier, synchronously transferring the plurality of substrates to the surface of the first carrier, and cutting the optical film into a plurality of optical functional layers using a laser cutting process, wherein any of the optical functional layers corresponds to one of the light-emitting device layers; Providing a transparent cover plate, coating a flexible adhesive layer on the surface of the transparent cover plate, and sequentially removing the plurality of optical functional layers from the surface of the first carrier and adhering them to a side of the flexible adhesive layer away from the transparent cover plate; Providing a second carrier, synchronously transferring the plurality of the substrates to the surface of the second carrier, and cutting the transparent cover into a plurality of transparent substrates using a cutter wheel, wherein any of the transparent substrates corresponds to one of the light-emitting device layers, and the orthographic projection of the transparent substrate on the substrate covers the orthographic projection of the optical functional layer on the substrate; The second carrier is removed to obtain a plurality of display modules.

9. The method for preparing a display module according to claim 8, characterized in that: The method of sequentially removing the plurality of optical functional layers from the surface of the first carrier and adhering the layers to a side of the flexible adhesive layer away from the transparent cover plate further comprises: The flexible adhesive layer surrounding the optical functional layer is cured, wherein the refractive index of the flexible adhesive layer is the same as the refractive index of the transparent cover plate.

10. A display device, characterized in that: Comprising a display module as described in any one of claims 1-7.

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