Plasma processing apparatus

Abstract

A plasma processing apparatus of the present invention includes a power feeding coil, a power receiving coil, and at least one driving system. The feed coil is disposed outside the plasma processing chamber. The power receiving coil is electrically connected to the power storage unit, and is capable of receiving electric power from the power feeding coil by electromagnetic induction coupling. The at least one drive system is capable of moving at least one of the power feeding coil and the power receiving coil to change a distance between the power feeding coil and the power receiving coil.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 356,713, filed on June 29, 2022, and entitled “Plasma Processing Apparatus,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] An exemplary embodiment of the present invention relates to a plasma processing apparatus. Background Art

[0004] A plasma processing device is used in plasma processing. The plasma processing device includes a chamber and a substrate support table (mounting table) arranged in the chamber. The substrate support table has a base (lower electrode) and an electrostatic chuck for holding the substrate. A temperature regulating element (such as a heater) for regulating the temperature of the substrate is provided inside the electrostatic chuck. In addition, a filter is provided between the temperature regulating element and the power supply for the temperature regulating element, and the filter can attenuate or block the high-frequency noise entering from the high-frequency electrode and / or other electrical components in the chamber to the power supply line and / or signal line and other lines. The following patent document 1 describes such a plasma processing device.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2015-173027 Summary of the invention

[0008] Technical problem to be solved by the invention

[0009] An exemplary embodiment of the present invention provides a technology capable of improving the transmission efficiency of electric power between a power feeding coil and a power receiving coil and suppressing high-frequency noise.

[0010] Means for solving technical problems

[0011] In an exemplary embodiment, a plasma processing device is provided. The plasma processing device includes a plasma processing chamber, a substrate support, a high-frequency power supply, an electrode or an antenna, an electric power consumption component, a power storage unit, a feeding coil, a power receiving coil, and at least one driving system. The substrate support is arranged in the plasma processing chamber. The high-frequency power supply is capable of generating high-frequency electric power. The electrode or the antenna is electrically connected to the high-frequency power supply and is capable of receiving high-frequency electric power to generate plasma from gas in the plasma processing chamber. The electric power consumption component is arranged in the plasma processing chamber or in the substrate support. The power storage unit is electrically connected to the electric power consumption component. The feeding coil is arranged outside the plasma processing chamber. The power receiving coil is electrically connected to the power storage unit and is capable of receiving electric power from the feeding coil through electromagnetic induction coupling. At least one driving system is capable of moving at least one of the feeding coil and the power receiving coil to change the distance between the feeding coil and the power receiving coil.

[0012] Effects of the Invention

[0013] According to an exemplary embodiment, it is possible to improve the transmission efficiency of electric power between a power feeding coil and a power receiving coil and suppress high frequency noise. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a diagram for explaining a configuration example of a plasma processing system.

[0015] Figure 2 This is a diagram for explaining a configuration example of a capacitive coupling type plasma processing apparatus.

[0016] Figure 3 FIG. 1 is a diagram schematically showing a plasma processing apparatus according to an exemplary embodiment.

[0017] Figure 4 FIG. 1 is a diagram schematically showing a plasma processing apparatus according to another exemplary embodiment.

[0018] Figure 5 FIG. 1 is a diagram schematically showing a plasma processing apparatus according to still another exemplary embodiment.

[0019] Figure 6 FIG. 1 is a diagram schematically showing a plasma processing apparatus according to still another exemplary embodiment.

[0020] Figure 7 FIG. 1 is a diagram schematically showing a plasma processing apparatus according to still another exemplary embodiment.

[0021] Figure 8 FIG. 1 is a diagram showing a power feeding unit according to an exemplary embodiment.

[0022] Fig. 9It is a diagram showing a power feeding coil unit and a power receiving coil unit according to an exemplary embodiment.

[0023] Fig.10 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to an exemplary embodiment.

[0024] Fig.11 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to an exemplary embodiment.

[0025] Fig.12 It is a diagram showing the impedance characteristics of the power receiving coil unit according to an exemplary embodiment.

[0026] Fig.13 is a diagram showing an RF filter according to an exemplary embodiment.

[0027] Fig.14 FIG. 1 is a diagram showing a rectifying and smoothing unit according to an exemplary embodiment.

[0028] Fig.15 is a diagram showing an RF filter according to an exemplary embodiment.

[0029] Fig.16 FIG. 1 is a diagram showing a communication unit of a power feeding unit and a communication unit of a rectifying and smoothing unit according to an exemplary embodiment.

[0030] Fig.17 FIG. 1 is a diagram schematically showing a plasma processing apparatus according to still another exemplary embodiment.

[0031] Fig.18 FIG. 1 is a diagram schematically showing a plasma processing apparatus according to still another exemplary embodiment.

[0032] Fig.19 FIG. 1 is a diagram showing a communication section of a power feeding section and a communication section of a rectifying and smoothing section according to another exemplary embodiment.

[0033] Fig. 20 FIG. 1 is a diagram schematically showing a plasma processing apparatus according to still another exemplary embodiment.

[0034] Fig.21 FIG. 1 is a diagram schematically showing a plasma processing apparatus according to still another exemplary embodiment.

[0035] Fig. 22 FIG. 1 is a diagram schematically showing a plasma processing apparatus according to still another exemplary embodiment.

[0036] Fig.23 (a) and Fig.23 (b) are diagrams showing a power storage unit according to an exemplary embodiment.

[0037] Fig.24 is a diagram showing a voltage controlled converter according to an exemplary embodiment.

[0038] Fig.25 It is a diagram showing a constant voltage control unit according to an exemplary embodiment.

[0039] Fig.26 It is a diagram showing a constant voltage control unit according to another exemplary embodiment.

[0040] Fig. 27 FIG. 1 is a diagram schematically showing a plasma processing apparatus according to still another exemplary embodiment.

[0041] Fig.28 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to another exemplary embodiment.

[0042] Fig.29 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0043] Fig.30 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0044] Fig.31 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0045] Fig.32 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0046] Fig.33 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0047] Fig.34 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0048] Fig.35 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0049] Fig.36 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0050] Fig.37 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0051] Fig.38 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0052] Fig.39 (a) is a cross-sectional view of a coil portion of an exemplary embodiment, Fig.39 (b) means Fig.39 (a) is a plan view of a plurality of ferrite components provided between a bottom plate and a heat conducting sheet in a coil portion.

[0053] Fig.40 (a) is a cross-sectional view of a coil portion of another exemplary embodiment, Fig.40 (b) means Fig.40 (a) is a plan view of a plurality of ferrite components provided between a bottom plate and a heat conducting sheet in a coil portion.

[0054] Fig.41 (a) is a cross-sectional view of a coil portion of yet another exemplary embodiment, Fig.41 (b) means Fig.41 (a) is a plan view of a plurality of ferrite components provided between a bottom plate and a heat conducting sheet in a coil portion.

[0055] Fig.42 (a) is a cross-sectional view of a coil portion of yet another exemplary embodiment, Fig.42 (b) means Fig.42 (a) is a plan view of a plurality of ferrite components provided between a bottom plate and a heat conducting sheet in a coil portion.

[0056] Fig.43 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0057] Fig.44 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0058] Fig.45 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0059] Fig.46 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0060] Fig.47 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0061] Fig.48 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0062] Fig.49 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0063] Fig.50 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0064] Fig.51 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0065] Fig.52 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0066] Fig.53 (a) Fig.53 (b) and Fig.53 (c) are diagrams showing examples of the positional relationship between the power feeding coil and the power receiving coil, respectively, and the inner ferrite member.

[0067] Fig.54 (a)~ Fig.54 (e) is a diagram showing various examples of the inner ferrite component.

[0068] Fig.55 (a)~ Fig.55 (c) is a diagram showing various examples of inner ferrite components.

[0069] Fig.56 (a)~ Fig.56 (b) is a diagram showing various examples of the inner ferrite component.

[0070] Fig.57 (a)~ Fig.57 (c) is a diagram showing various examples of ferrite components in the power feeding coil unit and the power receiving coil unit.

[0071] Fig.58 (a)~ Fig.58 (b) is a diagram showing various examples of ferrite components in the power feeding coil unit and the power receiving coil unit.

[0072] Fig.59 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0073] Fig.60 (a) means Fig.59 The figure shows an example of a heat sink for the power receiving coil unit. Fig.60 (b) means Fig.59 FIG. 2 is a diagram showing an example of a heat sink for a power feeding coil unit.

[0074] Fig.61 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0075] Fig.62 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0076] Fig.63 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0077] Fig.64 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0078] Fig.65 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0079] Fig.66 (a) is a cross-sectional view of a coil portion of another exemplary embodiment, Fig.66 (b) means Fig.66 (a) is a plan view of a cooling plate in a coil portion.

[0080] Fig.67 is a cross-sectional view of a coil portion according to still another exemplary embodiment.

[0081] Fig.68 Yes means Fig.67 A diagram of two cooling plates in a coil section is shown.

[0082] Fig.69 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment.

[0083] Fig.70 (a) is a cross-sectional view of a coil according to an exemplary embodiment, Fig.70 (b) is a cross-sectional view of a wire material of a coil according to an exemplary embodiment.

[0084] Fig.71 (a) is a cross-sectional view of a coil according to another exemplary embodiment, Fig.71 (b) is a cross-sectional view of a wire material of a coil according to another exemplary embodiment.

[0085] Fig.72 (a) is a cross-sectional view of a coil according to another exemplary embodiment, Fig.72 (b) is a cross-sectional view of a wire material of a coil according to yet another exemplary embodiment.

[0086] Fig.73 (a) is a cross-sectional view of a coil according to another exemplary embodiment, Fig.73 (b) is a cross-sectional view of a wire material of a coil according to yet another exemplary embodiment.

[0087] Fig.74 (a) and Fig.74 (b) are plan views of coils according to yet another exemplary embodiment.

[0088] Fig.75 (a) and Fig.75 (b) are plan views of coils according to yet another exemplary embodiment.

[0089] Fig.76 (a)~ Fig.76 (d) are cross-sectional views of coils according to still another exemplary embodiment.

[0090] Fig.77 (a) and Fig.77 (b) are cross-sectional views of coils according to still another exemplary embodiment.

[0091] Fig.78 (a) and Fig.78 (b) are cross-sectional views of coils according to still another exemplary embodiment.

[0092] Fig.79 is a cross-sectional view of a coil according to yet another exemplary embodiment.

[0093] Fig.80 is a cross-sectional view of a coil according to yet another exemplary embodiment.

[0094] Fig.81 (a) and Fig.81 (b) are cross-sectional views of coils according to still another exemplary embodiment. DETAILED DESCRIPTION

[0095] Hereinafter, various exemplary embodiments will be described in detail with reference to the accompanying drawings. In addition, in each of the drawings, the same reference numerals are given to the same or corresponding parts.

[0096] Figure 1: is a diagram for illustrating a structural example of a plasma processing system. In one embodiment, the plasma processing system includes a plasma processing device 1 and a control unit 2. The plasma processing system is an example of a substrate processing system, and the plasma processing device 1 is an example of a substrate processing device. The plasma processing device 1 includes a plasma processing chamber 10, a substrate support portion 11, and a plasma generating portion 12. The plasma processing chamber 10 has a plasma processing space. In addition, the plasma processing chamber 10 has: at least one gas supply port for supplying at least one processing gas to the plasma processing space; and at least one gas exhaust port for exhausting gas from the plasma processing space. The gas supply port is connected to the gas supply portion 20 described later, and the gas exhaust port is connected to the exhaust system 40 described later. The substrate support portion 11 is arranged in the plasma processing space and has a substrate supporting surface for supporting a substrate.

[0097] The plasma generating unit 12 is capable of generating plasma from at least one processing gas supplied into the plasma processing space. The plasma formed in the plasma processing space may be a capacitively coupled plasma (CCP: Capacitively Coupled Plasma), an inductively coupled plasma (ICP: Inductively Coupled Plasma), an ECR plasma (Electron-Cyclotron-Resonance Plasma: Electron Cyclotron Resonance Plasma), a helicon wave excited plasma (HWP: Helicon Wave Plasma) or a surface wave plasma (SWP: Surface Wave Plasma), etc. In addition, various types of plasma generating units including an AC (Alternating Current: Alternating Current) plasma generating unit and a DC (Direct Current: Direct Current) plasma generating unit may be used. In one embodiment, the AC signal (AC electric power) used in the AC plasma generating unit has a frequency in the range of 100kHz to 10GHz. Therefore, the AC signal includes an RF (Radio Frequency: Radio Frequency) signal and a microwave signal. In one embodiment, the RF signal has a frequency in the range of 100kHz to 150MHz.

[0098] The control unit 2 is capable of processing computer-executable commands, which are used to cause the plasma processing device 1 to perform the various steps described in the present invention. The control unit 2 is capable of controlling the various elements of the plasma processing device 1 to perform the various steps described herein. In one embodiment, a part or all of the control unit 2 may be included in the plasma processing device 1. The control unit 2 may include a processing unit 2a1, a storage unit 2a2, and a communication interface 2a3. The control unit 2 is implemented, for example, by a computer 2a. The processing unit 2a1 is capable of reading a program from the storage unit 2a2 and performing various control actions by executing the read program. The program may be pre-stored in the storage unit 2a2 or acquired via a medium when necessary. The acquired program is stored in the storage unit 2a2 and is read and executed from the storage unit 2a2 by the processing unit 2a1. The medium may be various storage media readable by the computer 2a, or a communication line connected to the communication interface 2a3. The processing unit 2a1 may be a CPU (Central Processing Unit). The storage unit 2a2 may include a RAM (Random Access Memory), a ROM (Read Only Memory), a HDD (Hard Disk Drive), an SSD (Solid State Drive), or a combination thereof. The communication interface 2a3 may communicate with the plasma processing device 1 via a communication line such as a LAN (Local Area Network).

[0099] Next, a configuration example of a capacitive coupling type plasma processing apparatus will be described as an example of the plasma processing apparatus 1 . Figure 2 This is a diagram for explaining a configuration example of a capacitive coupling type plasma processing apparatus.

[0100] A capacitively coupled plasma processing apparatus 1 includes a plasma processing chamber 10, a gas supply unit 20, a power supply 30, and an exhaust system 40. In addition, the plasma processing apparatus 1 includes a substrate support unit 11 and a gas introduction unit. The gas introduction unit is capable of introducing at least one processing gas into the plasma processing chamber 10. The gas introduction unit includes a shower head 13. The substrate support unit 11 is disposed in the plasma processing chamber 10. The shower head 13 is disposed above the substrate support unit 11. In one embodiment, the shower head 13 constitutes at least a portion of the ceiling of the plasma processing chamber 10. The plasma processing chamber 10 has a plasma processing space 10s defined by the shower head 13, the side wall 10a of the plasma processing chamber 10, and the substrate support unit 11. The plasma processing chamber 10 is grounded. The shower head 13 and the substrate support unit 11 are electrically insulated from the shell of the plasma processing chamber 10.

[0101] The substrate support portion 11 includes a main body 111 and a ring assembly 112. The main body 111 has: a central area 111a for supporting a substrate W; and an annular area 111b for supporting the ring assembly 112. A wafer is an example of a substrate W. The annular area 111b of the main body 111 surrounds the central area 111a of the main body 111 when viewed from above. The substrate W is arranged on the central area 111a of the main body 111, and the ring assembly 112 is arranged on the annular area 111b of the main body 111 in a manner surrounding the substrate W on the central area 111a of the main body 111. Therefore, the central area 111a is also referred to as a substrate support surface for supporting the substrate W, and the annular area 111b is also referred to as a ring support surface for supporting the ring assembly 112.

[0102] In one embodiment, the main body 111 includes a base 1110 and an electrostatic chuck 1111. The base 1110 includes a conductive component. The conductive component of the base 1110 can function as a lower electrode. The electrostatic chuck 1111 is arranged on the base 1110. The electrostatic chuck 1111 includes a ceramic component 1111a and an electrostatic electrode (also called an adsorption electrode, a chuck electrode, or a clamping electrode) 1111b arranged in the ceramic component 1111a. The ceramic component 1111a has a central area 111a. In one embodiment, the ceramic component 1111a also has an annular area 111b. In addition, other components surrounding the electrostatic chuck 1111, such as an annular electrostatic chuck or an annular insulating component, may also have an annular area 111b. In this case, the ring assembly 112 may be arranged on the annular electrostatic chuck or the annular insulating component, or may be arranged on both the electrostatic chuck 1111 and the annular insulating component. In addition, at least one RF / DC electrode coupled to the RF power supply 31 and / or DC power supply 32 described later may be arranged in the ceramic component 1111a. In this case, at least one RF / DC electrode can function as a lower electrode. In the case where a bias RF signal and / or DC signal described later is supplied to at least one RF / DC electrode, the RF / DC electrode is also referred to as a bias electrode. In addition, the conductive component of the base 1110 and at least one RF / DC electrode may function as a plurality of lower electrodes. In addition, the electrostatic electrode 1111b may function as a lower electrode. Therefore, the substrate support portion 11 includes at least one lower electrode.

[0103] The ring assembly 112 includes one or more ring-shaped components. In one embodiment, the one or more ring-shaped components include one or more edge rings and at least one cover ring. The edge ring is formed of a conductive material or an insulating material, and the cover ring is formed of an insulating material.

[0104] In addition, the substrate support portion 11 may include a temperature regulating module for regulating at least one of the electrostatic chuck 1111, the ring assembly 112 and the substrate to a target temperature. The temperature regulating module may include a heater, a heat transfer medium, a flow path 1110a or a combination thereof. A heat transfer fluid such as salt water or gas may flow in the flow path 1110a. In one embodiment, the flow path 1110a is formed in the base 1110, and one or more heaters are arranged in the ceramic part 1111a of the electrostatic chuck 1111. In addition, the substrate support portion 11 may include a heat transfer gas supply portion for supplying a heat transfer gas to the gap between the back side of the substrate W and the central area 111a.

[0105] The shower head 13 can introduce at least one processing gas from the gas supply part 20 into the plasma processing space 10s. The shower head 13 has at least one gas supply port 13a, at least one gas diffusion chamber 13b and a plurality of gas introduction ports 13c. The processing gas supplied to the gas supply port 13a can be introduced into the plasma processing space 10s from the plurality of gas introduction ports 13c through the gas diffusion chamber 13b. In addition, the shower head 13 includes at least one upper electrode. In addition, the gas introduction part may include, in addition to the shower head 13, one or more side gas injection parts (SGI: Side Gas Injector) installed in one or more openings formed on the side wall 10a.

[0106] The gas supply unit 20 may include at least one gas source 21 and at least one flow controller 22. In one embodiment, the gas supply unit 20 is capable of supplying at least one process gas from the gas source 21 corresponding to each other to the shower head 13 via the flow controller 22 corresponding to each other. Each flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. Moreover, the gas supply unit 20 may include at least one flow modulation device for modulating or pulsing the flow of at least one process gas.

[0107] The power supply 30 includes an RF power supply 31 coupled to the plasma processing chamber 10 via at least one impedance matching circuit. The RF power supply 31 can supply at least one RF signal (RF electric power) to at least one lower electrode and / or at least one upper electrode. Thus, plasma can be formed from at least one processing gas supplied to the plasma processing space 10s. Therefore, the RF power supply 31 can function as at least a part of the plasma generating unit 12. In addition, by supplying a bias RF signal to at least one lower electrode, a bias potential can be generated on the substrate W, and ion components in the formed plasma can be introduced (attracted) to the substrate W.

[0108] In one embodiment, the RF power supply 31 includes a first RF generating unit 31a and a second RF generating unit 31b. The first RF generating unit 31a is coupled to at least one lower electrode and / or at least one upper electrode via at least one impedance matching circuit, and can generate a source RF signal (source RF power) for plasma generation. In one embodiment, the source RF signal has a frequency in the range of 10 MHz to 150 MHz. In one embodiment, the first RF generating unit 31a can generate a plurality of source RF signals with different frequencies. The generated one or more source RF signals are supplied to at least one lower electrode and / or at least one upper electrode.

[0109] The second RF generating unit 31b is coupled to at least one lower electrode via at least one impedance matching circuit, and is capable of generating a bias RF signal (bias RF electric power). The frequency of the bias RF signal may be the same as or different from the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency lower than that of the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 100kHz to 60MHz. In one embodiment, the second RF generating unit 31b may be capable of generating a plurality of bias RF signals having different frequencies. The generated one or more bias RF signals are supplied to at least one lower electrode. In addition, in various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

[0110] In addition, the power supply 30 may include a DC power supply 32 coupled to the plasma processing chamber 10. The DC power supply 32 includes a first DC generating unit 32a and a second DC generating unit 32b. In one embodiment, the first DC generating unit 32a is connected to at least one lower electrode and is capable of generating a first DC signal. The generated first DC signal is applied to at least one lower electrode. In one embodiment, the second DC generating unit 32b is connected to at least one upper electrode and is capable of generating a second DC signal. The generated second DC signal is applied to at least one upper electrode.

[0111] In various embodiments, the first DC signal and the second DC signal may be pulsed. In this case, a sequence of voltage pulses is applied to at least one lower electrode and / or at least one upper electrode. The voltage pulse may have a pulse waveform in the shape of a rectangle, a trapezoid, a triangle, or a combination thereof. In one embodiment, a waveform generator for generating a sequence of voltage pulses from a DC signal is connected between the first DC generator 32a and at least one lower electrode. Therefore, the first DC generator 32a and the waveform generator constitute a voltage pulse generator. In the case where the second DC generator 32b and the waveform generator constitute a voltage pulse generator, the voltage pulse generator is connected to at least one upper electrode. The voltage pulse may have a positive polarity or a negative polarity. In addition, the sequence of voltage pulses may include one or more positive polarity voltage pulses and one or more negative polarity voltage pulses in one cycle. In addition, the first DC generator 32a and the second DC generator 32b may be provided in addition to the RF power supply 31, or the first DC generator 32a may be provided instead of the second RF generator 31b.

[0112] The exhaust system 40 can be connected to the gas exhaust port 10e provided at the bottom of the plasma processing chamber 10, for example. The exhaust system 40 can include a pressure regulating valve and a vacuum pump. The pressure in the plasma processing space 10s can be adjusted by the pressure regulating valve. The vacuum pump can include a turbomolecular pump, a dry pump, or a combination thereof.

[0113] In addition, in a capacitive coupling type plasma processing apparatus 1, an upper electrode is arranged in such a manner that a plasma processing space is located between the upper electrode and the substrate support portion 11. A high-frequency power source such as the first RF generating portion 31a is electrically connected to the upper electrode or the lower electrode in the substrate support portion 11. In the case where the plasma processing apparatus 1 is an inductive coupling type plasma processing apparatus, an antenna is arranged in such a manner that a plasma processing space is located between the antenna and the substrate support portion 11. A high-frequency power source such as the first RF generating portion 31a is electrically connected to the antenna. In the case where the plasma processing apparatus 1 is a plasma processing apparatus that generates plasma using surface waves such as microwaves, the antenna is arranged in such a manner that a plasma processing space is located between the antenna and the substrate support portion 11. A high-frequency power source such as the first RF generating portion 31a is electrically connected to the antenna via a waveguide.

[0114] Various exemplary embodiments of plasma processing apparatuses are described below. Each of the plasma processing apparatuses described below can supply power to at least one power consuming component in the chamber 10 by wireless power supply (electromagnetic induction coupling) and can have the same structure as the plasma processing apparatus 1 .

[0115] Figure 3 FIG. 1 is a diagram schematically showing a plasma processing apparatus according to an exemplary embodiment. Figure 3 The plasma processing apparatus 100A shown in FIG. 1 includes at least one high frequency power source 300, a power receiving coil unit 140, a power storage unit 160, and at least one power consumption component 240 (see FIG. 1 ). Fig.25 and Fig.26 The plasma processing apparatus 100A may further include a power feeding unit 120 , a power feeding coil unit 130 , a rectifying and smoothing unit 150 , a constant voltage control unit 180 (an example of a voltage control unit), a ground frame 110 , and a matching unit 301 .

[0116] At least one high frequency power source 300 includes a first RF generating section 31a and / or a second RF generating section 31b. At least one high frequency power source 300 is electrically connected to the substrate supporting section 11 via a matching section 301. The matching section 301 includes at least one impedance matching circuit.

[0117] The ground frame 110 includes the chamber 10 and is electrically grounded. The ground frame 110 electrically separates the space 110h (RF-Hot space) inside the ground frame 110 from the space 110a (air space) outside. The ground frame 110 surrounds the substrate support portion 11 arranged in the space 110h. In the plasma processing device 100A, the rectifying and smoothing portion 150, the power storage portion 160 and the constant voltage control portion 180 are arranged in the space 110h. In addition, in the plasma processing device 100A, the feeding portion 120, the feeding coil portion 130 and the receiving coil portion 140 are arranged in the space 110a.

[0118] The equipment arranged in the space 110a, namely the feeding unit 120, the feeding coil unit 130 and the receiving coil unit 140, etc., is covered by a metal shell formed of a metal such as aluminum, and the metal shell is grounded. Thus, it is possible to suppress the leakage of high-frequency noise caused by high-frequency electric power such as the first RF signal (source RF signal) and / or the second RF signal (bias RF signal). The metal shell and each power supply line have an insulation distance between them. In addition, in the following description, the high-frequency electric power such as the first RF signal and / or the second RF signal, that is, the high-frequency electric power transmitted to the feeding unit 120, is sometimes referred to as high-frequency noise, common mode noise or conductive noise.

[0119] The power feeding unit 120 is electrically connected between the AC power source 400 (e.g., industrial frequency AC power source) and the power feeding coil unit 130. The power feeding unit 120 can receive the frequency of the AC power from the AC power source 400, convert the frequency of the AC power into a transmission frequency, and thereby generate AC power having the transmission frequency, that is, transmission AC power.

[0120] The feeding coil unit 130 includes a feeding coil 131 (see Fig. 9 The power feeding coil 131 is electrically connected to the power feeding unit 120 . The power feeding coil 131 can receive the transmission AC power from the power feeding unit 120 and wirelessly transmit the transmission AC power to the power receiving coil 141 .

[0121] The power receiving coil unit 140 includes a power receiving coil 141 (see Fig. 9). The receiving coil 141 is electromagnetically inductively coupled to the feeding coil 131. Electromagnetic inductive coupling includes magnetic field coupling and electric field coupling. In addition, magnetic field coupling includes magnetic field resonance (also called magnetic resonance). The distance between the receiving coil 141 and the feeding coil 131 is set to be able to suppress common mode noise (conductive noise). In addition, the distance between the receiving coil 141 and the feeding coil 131 is set to be a distance that can supply power. The distance between the receiving coil 141 and the feeding coil 131 is set so that the attenuation of high-frequency electric power (i.e., high-frequency noise) between the receiving coil 141 and the feeding coil 131 becomes less than a threshold value, and the electric power from the feeding coil 131 can be received in the receiving coil 141. The threshold value of the attenuation amount is set to a value that can fully prevent damage or malfunction of the feeding unit 120. The threshold value of the attenuation amount is, for example, -20 dB. The transmission AC power received by the receiving coil unit 140 is output to the rectification and smoothing unit 150.

[0122] The rectifying and smoothing unit 150 is electrically connected between the power receiving coil unit 140 and the power storage unit 160. The rectifying and smoothing unit 150 generates DC power by performing full-wave rectification and smoothing on the AC power transmitted from the power receiving coil unit 140. The DC power generated by the rectifying and smoothing unit 150 is stored in the power storage unit 160. The power storage unit 160 is electrically connected between the rectifying and smoothing unit 150 and the constant voltage control unit 180. In addition, the rectifying and smoothing unit 150 may generate DC power by performing half-wave rectification and smoothing on the AC power transmitted from the power receiving coil unit 140.

[0123] The rectifying and smoothing unit 150 and the feeding unit 120 are electrically connected to each other via the signal line 1250. The rectifying and smoothing unit 150 sends an instruction signal to the feeding unit 120 via the signal line 1250. The instruction signal is a signal for instructing the feeding unit 120 to supply the transmitted AC power or stop the supply of the transmitted AC power. The instruction signal may include a state signal, an abnormality detection signal, and a cooling control signal for the feeding coil unit 130 and the receiving coil unit 140. The state signal is a voltage detector 155v (refer to Fig.14 ) and current detector 155i (refer to Fig.14 ) The value of the voltage, current, electric power and / or phase detected by the power supply 120. The abnormality detection signal is a signal for transmitting the failure of the rectification and smoothing unit 150 and / or the occurrence of temperature abnormality to the power supply 120. The cooling control signal is used to control the cooling mechanism provided in the power supply coil unit 130 and the power receiving coil unit 140. The cooling control signal controls the speed of the fan in the case of air cooling, for example. In addition, in the case of liquid cooling, the flow rate and / or temperature of the refrigerant are controlled.

[0124] The constant voltage control unit 180 applies a voltage to at least the power consumption component 240 using the electric power stored in the power storage unit 160. The constant voltage control unit 180 can control the application of the voltage to at least the power consumption component 240 and the stop thereof.

[0125] In the plasma processing apparatus 100A, the power receiving coil 141 can function as a filter for high-frequency noise caused by high-frequency electric power such as the first RF signal and / or the second RF signal, thereby suppressing the high-frequency noise from being transmitted to the power supply outside the plasma processing apparatus.

[0126] Reference Figure 4 . Figure 4 FIG. 1 is a diagram schematically showing another exemplary embodiment of a plasma processing apparatus. Figure 4 The plasma processing apparatus 100B shown will be described from the viewpoint of differences from the plasma processing apparatus 100A.

[0127] The plasma processing apparatus 100B further includes a voltage control converter 170. The voltage control converter 170 is a DC-DC converter, and is connected between the power storage unit 160 and the constant voltage control unit 180. The voltage control converter 170 can be configured to input a constant output voltage to the constant voltage control unit 180 even when a voltage fluctuation occurs in the power storage unit 160. In addition, the voltage fluctuation in the power storage unit 160 may occur as a voltage drop corresponding to the stored electric power, for example, when the power storage unit 160 is formed of an electric double layer.

[0128] Reference Figure 5 . Figure 5 FIG. 1 is a diagram schematically showing a plasma processing apparatus according to another exemplary embodiment. Figure 5 The plasma processing apparatus 100C shown will be described from the viewpoint of differences from the plasma processing apparatus 100B.

[0129] The plasma processing apparatus 100C further includes an RF filter 190. The RF filter 190 is connected between the rectifying and smoothing section 150 and the feeding section 120. The RF filter 190 constitutes a portion of the signal line 1250. The RF filter 190 has a characteristic of suppressing the transmission of high-frequency electric power (high-frequency noise) via the signal line 1250. That is, the RF filter 190 includes a low-pass filter having a high impedance to high-frequency noise (conductive noise) but having a characteristic of passing an indication signal of a relatively low frequency.

[0130] In the plasma processing device 100C, the power storage unit 160, the voltage control converter 170 and the constant voltage control unit 180 are formed as one body (integrated). That is, the power storage unit 160, the voltage control converter 170 and the constant voltage control unit 180 are all arranged in a single metal shell, or formed on a single circuit board. As a result, the lengths of a pair of power supply lines (positive line and negative line) connecting the power storage unit 160 and the voltage control converter 170 to each other are shortened. In addition, the lengths of a pair of power supply lines (positive line and negative line) connecting the power storage unit 160 and the voltage control converter 170 to each other can be made equal to each other. In addition, the lengths of a pair of power supply lines (positive line and negative line) connecting the voltage control converter 170 and the constant voltage control unit 180 to each other can be shortened. In addition, the lengths of a pair of power supply lines connecting the voltage control converter 170 and the constant voltage control unit 180 to each other can be made equal to each other. Therefore, it is possible to suppress malfunction and damage of the device caused by normal mode noise (potential difference between the positive line and the negative line). Furthermore, when other metal bodies are provided around the shell in the chamber 10 for shielding electromagnetic fields, the single shell may not be made of metal.

[0131] Reference Figure 6 . Figure 6 FIG. 1 is a diagram schematically showing a plasma processing apparatus according to another exemplary embodiment. Figure 6 The plasma processing apparatus 100D shown will be described from the viewpoint of differences from the plasma processing apparatus 100C.

[0132] The plasma processing apparatus 100D does not include the RF filter 190. In the plasma processing apparatus 100D, the rectifying and smoothing section 150 includes a communication section 151 as a wireless section. In addition, the feeding section 120 includes a communication section 121 as a wireless section. The above-mentioned instruction signal is transmitted between the rectifying and smoothing section 150 and the feeding section 120 using the communication section 151 and the communication section 121. The details of the communication section 121 and the communication section 151 will be described later.

[0133] Reference Figure 7 . Figure 7 FIG. 1 is a diagram schematically showing a plasma processing apparatus according to another exemplary embodiment. Figure 7 The plasma processing apparatus 100E shown will be described from the viewpoint of differences from the plasma processing apparatus 100D.

[0134] The plasma processing apparatus 100E further includes an RF filter 200. The RF filter 200 is connected between the power receiving coil unit 140 and the rectifying and smoothing unit 150. The RF filter 200 has a characteristic of reducing or blocking high frequency noise transmitted from the power receiving coil unit 140 to the power feeding coil 131 and the power feeding unit 120. The details of the RF filter 200 will be described later.

[0135] The structures of various components for wireless power supply in the plasma processing apparatus according to various exemplary embodiments will be described in detail below.

[0136] [Structure of the power feeding unit]

[0137] Figure 8 1 is a diagram showing a feeder according to an exemplary embodiment. As described above, the feeder 120 can receive the frequency of the AC power from the AC power source 400 and convert the frequency of the AC power into a transmission frequency, thereby generating a transmission AC power having the transmission frequency.

[0138] In one embodiment, the feeder 120 includes a control unit 122, a rectifying and smoothing unit 123, and an inverter 124. The control unit 122 is composed of a processor such as a CPU or a programmable logic device such as an FPGA (Field-Programmable Gate Array).

[0139] The rectifying and smoothing unit 123 includes a rectifying circuit and a smoothing circuit. The rectifying circuit includes, for example, a diode bridge. The smoothing circuit includes, for example, a line capacitor. The rectifying and smoothing unit 123 generates a DC power by performing full-wave rectification and smoothing on the AC power from the AC power supply 400. In addition, the rectifying and smoothing unit 123 may also generate a DC power by performing half-wave rectification and smoothing on the AC power from the AC power supply 400.

[0140] The inverter 124 generates a transmission AC power having a transmission frequency from the DC power output by the rectifying and smoothing section 123. The inverter 124 is, for example, a full-bridge inverter including a plurality of triacs or a plurality of switching elements (e.g., FETs). The inverter 124 generates the transmission AC power by ON / OFF control of the plurality of triacs or the plurality of switching elements by the control section 122. The transmission AC power output from the inverter 124 is output to the feeding coil section 130.

[0141] The feeding section 120 may further include a voltage detector 125v, a current detector 125i, a voltage detector 126v, and a current detector 126i. The voltage detector 125v detects a voltage value between a pair of power supply lines connecting the rectifying and smoothing section 123 and the inverter 124 to each other. The current detector 125i detects a current value between the rectifying and smoothing section 123 and the inverter 124. The voltage detector 126v detects a voltage value between a pair of power supply lines connecting the inverter 124 and the feeding coil section 130 to each other. The current detector 126i detects a current value between the inverter 124 and the feeding coil section 130. The voltage value detected by the voltage detector 125v, the current value detected by the current detector 125i, the voltage value detected by the voltage detector 126v, and the current value detected by the current detector 126i are notified to the control section 122.

[0142] The feeding unit 120 includes the above-mentioned communication unit 121. The communication unit 121 includes a driver 121d, a transmitter 121tx, and a receiver 121rx. The transmitter 121tx is a transmitter of a wireless signal or a transmitter of an optical signal. The receiver 121rx is a receiver of a wireless signal or a receiver of an optical signal. The communication unit 121 drives the transmitter 121tx through the driver 121d, and outputs the signal from the control unit 122 from the transmitter 121tx as a wireless signal or an optical signal. The signal output from the transmitter 121tx is transmitted to the communication unit 151 (see FIG. 151 ) described later. Fig.14 ) is received. In addition, the communication unit 121 receives a signal such as the above-mentioned instruction signal from the communication unit 151 through the receiver 121rx, and inputs the received signal to the control unit 122 via the driver 121d. The control unit 122 controls the inverter 124 in accordance with the instruction signal received from the communication unit 151 via the communication unit 121, the voltage value detected by the voltage detector 125v, the current value detected by the current detector 125i, the voltage value detected by the voltage detector 126v, and the current value detected by the current detector 126i, thereby switching the output and stopping of the transmission of AC power.

[0143] [Power feeding coil section and power receiving coil section]

[0144] Reference Figures 9 to 11 . Figures 9 to 11 Each of the figures shows a power feeding coil unit and a power receiving coil unit according to an exemplary embodiment. Fig. 9As shown, the feeding coil unit 130 may include a resonant capacitor 132a and a resonant capacitor 132b in addition to the feeding coil 131. The resonant capacitor 132a is connected between one of a pair of power supply lines that connect the feeding unit 120 and the feeding coil unit 130 to each other and one end of the feeding coil 131. The resonant capacitor 132b is connected between the other of the pair of power supply lines and the other end of the feeding coil 131. The feeding coil 131, the resonant capacitor 132a and the resonant capacitor 132b constitute a resonant circuit for the transmission frequency. That is, the feeding coil 131, the resonant capacitor 132a and the resonant capacitor 132b have a resonant frequency that is substantially consistent with the transmission frequency. In addition, the feeding coil unit 130 may not include any of the resonant capacitor 132a and the resonant capacitor 132b.

[0145] like Fig.10 and Fig.11 As shown, the feeding coil unit 130 may further include a metal shell 130g. The metal shell 130g has an open end and is grounded. The feeding coil 131 is arranged in the metal shell 130g in a manner to ensure the insulation distance. The feeding coil unit 130 may further include a heat sink 134, a ferrite component 135 and a thermally conductive sheet 136. The heat sink 134 is arranged in the metal shell 130g and supported by the metal shell 130g. The ferrite component 135 is arranged on the heat sink 134. The thermally conductive sheet 136 is arranged on the ferrite component 135. The feeding coil 131 is arranged on the thermally conductive sheet 136 and is opposite to the receiving coil 141 across the open end of the metal shell 130g. As shown in FIG. Fig.11 As shown, a resonant capacitor 132a and a resonant capacitor 132b may also be housed in the metal housing 130g.

[0146] like Fig. 9 As shown, the power receiving coil unit 140 includes a power receiving coil 141. The power receiving coil 141 can be electromagnetically inductively coupled with the power feeding coil 131. In addition to the power receiving coil 141, the power receiving coil unit 140 may include a resonant capacitor 142a and a resonant capacitor 142b. The resonant capacitor 142a is connected between one of a pair of power supply lines extending from the power receiving coil unit 140 and one end of the power receiving coil 141. The resonant capacitor 142b is connected between the other of the pair of power supply lines and the other end of the power receiving coil 141. The power receiving coil 141, the resonant capacitor 142a, and the resonant capacitor 142b constitute a resonant circuit for the transmission frequency. That is, the power receiving coil 141, the resonant capacitor 142a, and the resonant capacitor 142b have a resonant frequency that is substantially consistent with the transmission frequency. In addition, the power receiving coil unit 140 may not include any of the resonant capacitor 142a and the resonant capacitor 142b.

[0147] like Fig.10 and Fig.11As shown, the power receiving coil unit 140 may further include a metal shell 140g. The metal shell 140g has an open end and is grounded. The power receiving coil 141 is arranged in the metal shell 140g in a manner to ensure the insulation distance. The power receiving coil unit 140 may further include a spacer 143, a heat sink 144, a ferrite component 145 and a thermally conductive sheet 146. The spacer 143 is arranged in the metal shell 140g and is supported by the metal shell 140g. The spacer 143 will be described later. The heat sink 144 is arranged on the spacer 143. The ferrite component 145 is arranged on the heat sink 144. The thermally conductive sheet 146 is arranged on the ferrite component 145. The power receiving coil 141 is arranged on the thermally conductive sheet 146, and is opposite to the power feeding coil 131 across the open end of the metal shell 140g. As shown in FIG. Fig.11 As shown, a resonant capacitor 142a and a resonant capacitor 142b may also be housed in the metal housing 140g.

[0148] The spacer 143 is formed of a dielectric and is provided between the power receiving coil 141 and the metal casing 140g (ground). The spacer 143 can provide a spatial parasitic capacitance between the power receiving coil 141 and the ground.

[0149] [Impedance characteristics of the power receiving coil]

[0150] Reference Fig.12 . Fig.12 It is a diagram showing the impedance characteristics of the power receiving coil unit according to an exemplary embodiment. Fig.12 140g represents the impedance characteristics of the power receiving coil unit 140 according to the thickness of the spacer 143. The thickness of the spacer 143 corresponds to the distance between the heat sink 144 and the metal housing 140g. Fig.12 As shown, the power receiving coil unit 140 can adjust the frequency f according to the thickness of the spacer 143. H and frequency f L Therefore, according to the power receiving coil unit 140, high impedance can be provided at the frequencies of two high-frequency electric powers used in the plasma processing device, such as the first RF signal and the second RF signal. In addition, high impedance can be obtained in the power receiving coil unit 140, so the loss of high-frequency electric power can be suppressed, and a high processing rate (for example, etching rate) can be obtained.

[0151] [RF filter 200]

[0152] Reference Fig.13 . Fig.13 FIG. 1 is a diagram showing an RF filter according to an exemplary embodiment. Fig.13As shown, the RF filter 200 is connected between the power receiving coil unit 140 and the rectifying and smoothing unit 150. The RF filter 200 includes an inductor 201a, an inductor 201b, a terminal capacitor 202a, and a terminal capacitor 202b. One end of the inductor 201a is connected to the resonant capacitor 142a, and the other end of the inductor 201a is connected to the rectifying and smoothing unit 150. One end of the inductor 201b is connected to the resonant capacitor 142b, and the other end of the inductor 201b is connected to the rectifying and smoothing unit 150. The terminal capacitor 202a is connected between one end of the inductor 201a and the ground. The terminal capacitor 202b is connected between one end of the inductor 201b and the ground. The inductor 201a and the terminal capacitor 202a form a low-pass filter. In addition, the inductor 201b and the terminal capacitor 202b form a low-pass filter. The RF filter 200 can provide high impedance at the frequencies of two high frequency electric powers used in a plasma processing device, such as the first RF signal and the second RF signal, thereby suppressing the loss of high frequency electric power and achieving a high processing rate (eg, etching rate).

[0153] [Rectifier and Smoothing Department]

[0154] Reference Fig.14 . Fig.14 1 is a diagram showing a rectifying and smoothing unit of an exemplary embodiment. In one embodiment, the rectifying and smoothing unit 150 includes a control unit 152, a rectifying circuit 153, and a smoothing circuit 154. The rectifying circuit 153 is connected between the power receiving coil unit 140 and the smoothing circuit 154. The smoothing circuit 154 is connected between the rectifying circuit 153 and the power storage unit 160. The control unit 152 is composed of a processor such as a CPU or a programmable logic device such as an FPGA (Field-Programmable Gate Array). In addition, the control unit 152 may be the same as the control unit 122 or different.

[0155] The rectifier circuit 153 outputs power generated by full-wave rectifying the AC power from the power receiving coil unit 140. The rectifier circuit 153 is, for example, a diode bridge. Alternatively, the rectifier circuit 153 may output power generated by half-wave rectifying the AC power from the power receiving coil unit 140.

[0156] The smoothing circuit 154 generates DC power by smoothing the power from the rectifying circuit 153. The smoothing circuit 154 may include an inductor 1541a, a capacitor 1542a, and a capacitor 1542b. One end of the inductor 1541a is connected to one of a pair of inputs of the smoothing circuit 154. The other end of the inductor 1541a is connected to the positive output (V OUT+The positive output of the rectifying and smoothing unit 150 is connected via a positive line 160p (see Fig.23 (a) and Fig.23 (b)) is connected to one end of each of one or more capacitors of the power storage unit 160.

[0157] One end of the capacitor 1542a is connected to one of the pair of inputs of the smoothing circuit 154 and one end of the inductor 1541a. The other end of the capacitor 1542a is connected to the other of the pair of outputs of the smoothing circuit 154 and the negative output (V OUT- The negative output of the rectifying and smoothing unit 150 is connected via a negative line 160m (see Fig.23 (a) and Fig.23 (b)) is connected to the other end of each of the one or more capacitors of the power storage unit 160. One end of the capacitor 1542b is connected to the other end of the inductor 1541a. The other end of the capacitor 1542b is connected to the other of the pair of outputs of the smoothing circuit 154 and the negative output (V OUT- )connect.

[0158] The rectifying and smoothing unit 150 may further include a voltage detector 155v and a current detector 155i. The voltage detector 155v detects a voltage value between a positive output and a negative output of the rectifying and smoothing unit 150. The current detector 155i detects a current value between the rectifying and smoothing unit 150 and the power storage unit 160. The voltage value detected by the voltage detector 155v and the current value detected by the current detector 155i are notified to the control unit 152. The control unit 152 generates the above-mentioned instruction signal in accordance with the electric power stored in the power storage unit 160. For example, when the electric power stored in the power storage unit 160 is less than the first threshold value, the control unit 152 generates an instruction signal for instructing the feeding unit 120 to supply power, that is, output and transmit AC electric power. The first threshold value is, for example, the electric power consumption of a load such as the electric power consumption component 240. In addition, it may be a value obtained by multiplying the electric power consumption of the load such as the electric power consumption component 240 by a certain value (for example, a value in a range of 1 to 3) in consideration of a margin. On the other hand, when the electric power stored in the power storage unit 160 is greater than the second threshold value, the control unit 152 generates an instruction signal for instructing the power feeding unit 120 to stop supplying power, that is, to stop outputting and transmitting AC electric power. The second threshold value is a value that does not exceed the limit storage electric power of the power storage unit 160. The second threshold value is, for example, a value obtained by multiplying the limit storage electric power of the power storage unit 160 by a certain value (for example, a value less than 1).

[0159] The rectifying and smoothing section 150 includes the above-mentioned communication section 151. The communication section 151 includes a driver 151d, a transmitter 151tx, and a receiver 151rx. The transmitter 151tx is a transmitter of a wireless signal or a transmitter of an optical signal. The receiver 151rx is a receiver of a wireless signal or a receiver of an optical signal. The communication section 151 drives the transmitter 151tx through the driver 151d, so that a signal from the control section 122 such as an instruction signal is output from the transmitter 151tx as a wireless signal or an optical signal. The signal output from the transmitter 151tx is received by the communication section 121 of the feeding section 120. In addition, the communication section 151 receives a signal from the communication section 121 through the receiver 151rx, and inputs the received signal to the control section 152 via the driver 151d.

[0160] [RF filter 190]

[0161] Reference Fig.15 . Fig.15 FIG. 1 is a diagram showing an RF filter 190 according to an exemplary embodiment. Fig.15 As shown, the signal line 1250 may include a first signal line electrically connecting the signal output (Tx) of the feed section 120 with the signal input (Rx) of the rectifying and smoothing section 150, and a second signal line electrically connecting the signal input (Rx) of the feed section 120 with the signal output (Tx) of the rectifying and smoothing section 150. The signal line 1250 may include a signal line connecting the first reference voltage terminal (VCC) of the feed section 120 with the first reference voltage terminal (VCC) of the rectifying and smoothing section 150, and a signal line connecting the second reference voltage terminal (GND) of the feed section 120 with the second reference voltage terminal (GND) of the rectifying and smoothing section 150. The signal line 1250 may be a shielded cable covered by a shield of ground potential. In this case, the plurality of signal lines constituting the signal line 1250 may be covered by the shield one by one, or may be covered by the shield together. The RF filter 190 provides a low-pass filter to each of the plurality of signal lines constituting the signal line 1250. The low-pass filter may be an LC filter including an inductor and a capacitor. The inductor of the low-pass filter constitutes a portion of the corresponding signal line. The capacitor is connected between one end of the inductor connected to the feeder 120 and the ground. By using the RF filter 190, it is possible to suppress the transmission of high-frequency electric power (high-frequency noise) via the signal line 1250 between the rectifying and smoothing unit 150 and the feeder 120.

[0162] [Communication section of the power feeding section and communication section of the rectifying and smoothing section]

[0163] Reference Figure 16 to Figure 18 . Fig.16 FIG. 1 is a diagram showing a communication unit of a power feeding unit and a communication unit of a rectifying and smoothing unit according to an exemplary embodiment. Fig.17 and Fig.18 Each of the figures schematically shows a plasma processing apparatus according to another exemplary embodiment. Figure 6 , Figure 7 , Fig.16 , Fig.17 and Fig.18 As shown, the communication unit 121 and the communication unit 151 can be configured to transmit signals such as the above-mentioned indication signal between each other via wireless communication. Communication via wireless communication can also be performed by optical communication. In the case where the communication unit 121 and the communication unit 151 transmit signals between them via wireless communication, the communication unit 121 and the communication unit 151 can be arranged in any position as long as there is no obstruction between them. According to the examples shown in these figures, the RF filter 190 is not required. In addition, in the case including Figure 16 to Figure 18 In various exemplary embodiments of the examples shown, the signal line 1250 may be a shielded cable covered by a shield at ground potential. In this case, the plurality of signal lines constituting the signal line 1250 may be covered by the shield individually or together.

[0164] Reference Figure 19 to Figure 22 . Fig.19 FIG. 1 is a diagram showing a communication section of a power feeding section and a communication section of a rectifying and smoothing section according to another exemplary embodiment. Figure 20 to Figure 22 Each of the figures schematically shows a plasma processing apparatus according to another exemplary embodiment. Figure 19 to Figure 22 As shown in the figure, the communication unit 121 and the communication unit 151 can be configured to transmit a signal (optical signal) such as the above-mentioned instruction signal between each other via the optical fiber 1260, that is, by optical fiber communication. In the case where the communication unit 121 and the communication unit 151 transmit signals between them via the optical fiber 1260, the communication unit 121 and the communication unit 151 can be arranged at any position as long as the bending radius of the optical fiber 1260 is within the allowable range. In the examples shown in these figures, the RF filter 190 is also not required.

[0165] [Electricity storage unit]

[0166] Reference Fig.23 (a) and Fig.23 (b). Fig.23 (a) and Fig.23 (b) and (c) are diagrams showing a storage unit of an exemplary embodiment. Fig.23 As shown in (a), the power storage unit 160 includes a capacitor 161. The capacitor 161 is connected between a pair of power supply lines, that is, a positive line 160p and a negative line 160m. The positive line 160p is connected from the positive output (V OUT+) extends toward the load. The negative line 160m extends from the negative output (V OUT- ) extends toward the load. Capacitor 161 may be a polarized capacitor. Capacitor 161 may also be a double-layer battery or a lithium-ion battery.

[0167] like Fig.23 As shown in (b), the storage unit 160 may include a plurality of capacitors 161. The plurality of capacitors 161 are connected in series between the positive line 160p and the negative line 160m. The plurality of capacitors 161 may have the same electrostatic capacitance as each other, or may have electrostatic capacitances different from each other. Each of the plurality of capacitors 161 may be a polarized capacitor. Each of the plurality of capacitors 161 may also be an electric double layer battery or a lithium ion battery. The storage unit 160 needs to be used under the condition that the total value of the input voltage corresponding thereto and the line potential difference caused by normal mode noise is lower than the allowable input voltage. In the case where the storage unit 160 includes a plurality of capacitors 161 connected in series, the allowable input voltage of the storage unit 160 becomes higher. Therefore, according to Fig.23 In the example shown in (b), the noise resistance of the power storage unit 160 is improved.

[0168] [Voltage Control Converter]

[0169] Reference Fig.24 . Fig.24 1 is a diagram showing a voltage control converter according to an exemplary embodiment. The voltage control converter 170 is a DC-DC converter. The voltage control converter 170 is connected between the power storage unit 160 and the constant voltage control unit 180. The positive line 160p is connected to the positive input (V IN+ ) is connected. The negative line 160m is connected to the negative input (V IN- ) connection. The positive output (V OUT+ ) and the positive input (V IN+ ) is connected. The negative output (V OUT- ) and the negative input (V IN- )connect.

[0170] The voltage control converter 170 may include a control unit 172, a low pass filter 173, a transformer 174, and a capacitor 175. The low pass filter 173 may include an inductor 1731a, a capacitor 1732a, and a capacitor 1732b. One end of the inductor 1731a is connected to the positive input (V IN+ ) is connected. The other end of the inductor 1731a is connected to one end of the primary side coil of the transformer 174. One end of the capacitor 1732a is connected to one end of the inductor 1731a and the positive input (VIN+ ) is connected. The other end of the capacitor 1732a is connected to the negative input (V IN- ) is connected. One end of the capacitor 1732b is connected to the other end of the inductor 1731a. The other end of the capacitor 1732b is connected to the negative input (V IN- )connect.

[0171] The transformer 174 includes a primary coil 1741, a secondary coil 1742, and a switch 1743. The other end of the primary coil 1741 is connected to the negative input (V IN- ) is connected. One end of the secondary side coil 1742 is connected to one end of the capacitor 175 and the positive output (V OUT+ The other end of the secondary coil 1742 is connected to the other end of the capacitor 175 and the negative output (V OUT- )connect.

[0172] The driver 1744 is connected to the switch 1743. The driver 1744 turns the switch 1743 on and off. When the switch 1743 is closed, that is, when the other end of the primary side coil 1741 and the negative input (V IN- ) is in the on state, the other end of the primary side coil 1741 is connected to the negative input (V IN- ) is connected, and the DC power from the voltage control converter 170 is supplied to the constant voltage control unit 180. On the other hand, when the switch 1743 is turned off, that is, the other end of the primary side coil 1741 is connected to the negative input (V IN- ) is in a non-conducting state, the other end of the primary side coil 1741 is connected to the negative input (V IN- ) is disconnected, and the supply of DC power from the voltage control converter 170 to the constant voltage control unit 180 is cut off.

[0173] The voltage control converter 170 may further include a voltage detector 176v and a current detector 176i. The voltage detector 176v detects a voltage value between both ends of the secondary side coil 1742 or a voltage value between the positive output and the negative output of the voltage control converter 170. The current detector 176i measures a current value between the other end of the secondary side coil 1742 and the negative output of the voltage control converter 170. The voltage value detected by the voltage detector 176v and the current value detected by the current detector 176i are notified to the control unit 172. In addition, the control unit 172 may be the same as or different from at least one of the control unit 122 and the control unit 152.

[0174] When the voltage value detected by the voltage detector 176v is greater than the threshold value, the control unit 172 controls the driver 1744 to cut off the supply of DC power from the voltage control converter 170 to the constant voltage control unit 180. The voltage value between the positive output and the negative output of the voltage control converter 170 is the sum of the output voltage value of the voltage control converter 170 and the line potential difference caused by the normal mode noise. In this embodiment, it is possible to suppress the damage of the load of the voltage control converter 170 caused by the overvoltage caused by the line potential difference caused by the normal mode noise.

[0175] [Constant pressure control unit]

[0176] Reference Fig.25 and Fig.26 . Fig.25 and Fig.26 The constant voltage control unit 180 is connected between the power storage unit 160 and at least one power consumption component 240 and can control the application of voltage (application of DC voltage) to at least one power consumption component 240 and stop thereof.

[0177] The constant voltage control unit 180 includes a control unit 182 and at least one switch 183. The positive input (V IN+ ) is connected to the power consumption component 240 via the switch 183. The negative input (V IN- ) is connected to the electric power consumption component 240. The switch 183 is controlled by the control unit 182. When the switch 183 is closed, the DC voltage from the constant voltage control unit 180 is applied to the electric power consumption component 240. When the switch 183 is opened, the application of the DC voltage from the constant voltage control unit 180 to the electric power consumption component 240 is stopped. In addition, the control unit 182 may be the same as or different from at least any one of the control unit 122, the control unit 152, and the control unit 172.

[0178] exist Fig.25 and Fig.26 In the illustrated embodiment, the plasma processing apparatus includes a plurality of power consumption components 240. The constant voltage control unit 180 includes a control unit 182 and a plurality of switches 183. The positive input (V IN+ ) is connected to a plurality of power consumption components 240 via a plurality of switches 183. The negative input (V IN- ) is connected to multiple power consumption components 240.

[0179] exist Fig.25 and Fig.26In the illustrated embodiment, the plurality of electric power consumption components 240 may include a plurality of heaters (resistance heating elements). The plurality of heaters may be disposed within the substrate support portion 11. Fig.25 In the illustrated embodiment, a plurality of resistors 260 are arranged near each of the plurality of heaters. Each of the plurality of resistors 260 has a resistance value that changes according to temperature. Each of the plurality of resistors 260 is, for example, a thermistor. Each of the plurality of resistors 260 is connected in series with a reference resistor (not shown). The constant voltage control unit 180 includes a plurality of measuring units 184. Each of the plurality of measuring units 184 can apply a reference voltage to the series connection of a corresponding resistor among the plurality of resistors 260 and a reference resistor to detect a voltage value between both ends of the resistor. Each of the plurality of measuring units 184 notifies the control unit 182 of the detected voltage value. The control unit 182 determines the temperature of the area where the corresponding heater among the plurality of heaters is arranged from the notified voltage value, and controls the application of the DC voltage to the corresponding heater so that the temperature of the area approaches the target temperature. In addition, an optical fiber thermometer may be arranged instead of the plurality of resistors 260. In this case, wiring between the plurality of resistors 260 and the plurality of measuring units 184 is not required, and therefore, the influence of high-frequency conductive noise on the electric power consumption component 240 can be eliminated.

[0180] exist Fig.26 In the illustrated embodiment, the constant voltage control unit 180 includes a voltage detector 185v and a plurality of current detectors 185i. The voltage detector 185v detects the voltage value applied to each of the plurality of heaters. The plurality of current detectors 185i measure the value of the current supplied to the corresponding heater among the plurality of heaters, that is, the current value. The plurality of measuring units 184 determine the resistance value of the corresponding heater among the plurality of heaters based on the current value detected by the corresponding current detector among the plurality of current detectors 185i and the voltage value detected by the voltage detector 185v. The control unit 182 determines the temperature of each of the plurality of areas where the plurality of heaters are respectively configured based on the resistance value detected by each of the plurality of heaters. The control unit 182 controls the application of the DC voltage to each of the plurality of heaters so that the temperature of each of the plurality of areas approaches the target temperature.

[0181] [Exemplary Embodiment of Variable Gap Between Power Feeding Coil and Power Receiving Coil]

[0182] Below, refer to Figure 27 to Figure 37 , various exemplary embodiments regarding a variable gap between a power feeding coil and a power receiving coil are described. Fig. 27 FIG. 1 is a diagram schematically showing a plasma processing apparatus according to still another exemplary embodiment. Figure 28 to Figure 37 These are diagrams respectively showing a power feeding coil unit and a power receiving coil unit according to other exemplary embodiments. Figure 28 to Figure 37The feeding coil unit and the receiving coil unit shown in each example can be Fig. 27 The plasma processing apparatus 100G shown is adopted.

[0183] Next, for Fig. 27 The plasma processing device 100G shown in FIG. Figure 7 The plasma processing apparatus 100G is described from the perspective of differences from the plasma processing apparatus 100E. The plasma processing apparatus 100G includes a drive system 340d and a sensor 340m in addition to the same configuration as the plasma processing apparatus 100E.

[0184] The driving system 340 d can move at least one of the power feeding coil 131 and the power receiving coil 141 to change the distance between the power feeding coil 131 and the power receiving coil 141 , that is, the length of the gap between the power feeding coil 131 and the power receiving coil 141 .

[0185] The drive system 340d includes at least one actuator. The at least one actuator is composed of a hydraulic or pneumatic cylinder, a motor or a piezoelectric element. The drive system 340d may include a plurality of actuators. The drive system 340d may detect the parallelism of the feeding coil 131 and the receiving coil 141 through the sensor 340m, and control at least one actuator in accordance with the detection result of the sensor 340m so that the feeding coil 131 and the receiving coil 141 remain parallel to each other.

[0186] According to the plasma processing apparatus 100G, the distance between the feeding coil 131 and the receiving coil 141 can be changed, thereby improving the power transmission efficiency between the feeding coil 131 and the receiving coil 141 and suppressing high-frequency noise (or conductive noise) from the receiving coil 141 to the feeding coil 131.

[0187] In one embodiment, the control unit 122 of the feeding unit 120 receives supply status information about the supply or stop of high-frequency electric power from the high-frequency power supply 300. The control unit 122 determines whether to supply high-frequency electric power from the high-frequency power supply 300 or stop its supply based on the supply status information. During the supply of high-frequency electric power from the high-frequency power supply 300, the control unit 122 controls the drive system 340d so that the distance between the feeding coil 131 and the receiving coil 141 is set to a relatively large distance. Thus, the conductive noise can be suppressed. During the supply stop of high-frequency electric power from the high-frequency power supply 300, the control unit 122 controls the drive system 340d so that the distance between the feeding coil 131 and the receiving coil 141 is set to a relatively small distance. Thus, the transmission efficiency of electric power between the feeding coil 131 and the receiving coil 141 can be improved.

[0188] In one embodiment, when the power level of the high-frequency electric power from the high-frequency power source 300 specified in the processing plan is above a predetermined level, the control unit 2 controls the drive system 340d via the control unit 122 so that the distance between the feeding coil 131 and the receiving coil 141 is set to a relatively large distance. Thus, the conductive noise can be suppressed. In addition, when the power level of the high-frequency electric power from the high-frequency power source 300 specified in the processing plan is less than a predetermined level, the control unit 2 controls the drive system 340d via the control unit 122 so that the distance between the feeding coil 131 and the receiving coil 141 is set to a relatively small distance. Thus, the transmission efficiency of the electric power between the feeding coil 131 and the receiving coil 141 can be improved.

[0189] In one embodiment, the control unit 2 controls the drive system 340d via the control unit 122 so that the distance between the feeding coil 131 and the receiving coil 141 is set to a distance determined according to the frequency of the high-frequency electric power from the high-frequency power source 300 specified in the processing plan. In this way, the distance between the feeding coil 131 and the receiving coil 141 can be set to an appropriate distance according to the frequency of the high-frequency electric power, the transmission efficiency of the electric power between the feeding coil 131 and the receiving coil 141 can be improved, and the high-frequency noise from the receiving coil 141 to the feeding coil 131 can be suppressed.

[0190] Next, Fig.28 The feeding coil unit 130 and Fig.10 The illustrated embodiment also includes a metal housing 130g, a feeding coil 131, a heat sink 134, a ferrite component 135, and a heat conducting sheet 136. The feeding coil unit 130 further includes a fan 130f.

[0191] The metal casing 130g is grounded. The metal casing 130g defines a shielding space 130s, and the power feeding coil 131 is accommodated in the shielding space 130s. The metal casing 130g extends on the back side of the power feeding coil 131 relative to the power receiving coil 141, and surrounds the outer periphery of the power feeding coil 131.

[0192] The metal shell 130g includes a back wall 130gb and a side wall 130gs. The back wall 130gb and the side wall 130gs define a shielding space 130s. The back wall 130gb is in a substantially flat plate shape and extends on the back side of the feeding coil 131 relative to the receiving coil 141. The side wall 130gs has a cylindrical shape such as a square cylinder or a cylindrical shape and extends from the back wall 130gb to the receiving coil unit 140. The side wall 130gs surrounds the outer periphery of the feeding coil 131.

[0193] A heat sink 134 , a ferrite member 135 , and a thermally conductive sheet 136 are disposed in this order within the shield space 130s and between the back wall 130gb and the feeding coil 131 .

[0194] The opening at the front end of the side wall 130gs of the metal case 130g is closed by the insulating plate 130i. The insulating plate 130i is formed of a resin such as PEEK (polyetheretherketone) or PPS (polyphenylene sulfide).

[0195] A plurality of vent holes 130gh are formed on the side wall 130gs. In addition, a fan 130f is arranged along the side wall 130gs on the outside of the metal shell 130g. The fan 130f can be an air supply fan or an exhaust fan. The fan 130f can form an air flow from the outside of the metal shell 130g through the plurality of vent holes 130gh and the shielding space 130s to the outside of the metal shell 130g. Thus, the feeding coil 131 and the ferrite component 135 can be cooled.

[0196] The power receiving coil unit 140 and Fig.10 The illustrated embodiment also includes a metal case 140g, a power receiving coil 141, a spacer 143, a heat sink 144, a ferrite member 145, and a heat conducting sheet 146. The power receiving coil unit 140 further includes a fan 140f.

[0197] The metal casing 140g is grounded. The metal casing 140g defines a shielding space 140s, and the power receiving coil 141 is accommodated in the shielding space 140s. The metal casing 140g extends on the back side of the power receiving coil 141 with respect to the power feeding coil 131, and surrounds the outer periphery of the power receiving coil 141.

[0198] The metal housing 140g includes a back wall 140gb and a side wall 140gs. The back wall 140gb and the side wall 140gs define a shielding space 140s. The back wall 140gb is in a substantially flat plate shape and extends on the back side of the receiving coil 141 relative to the feeding coil 131. The side wall 140gs has a cylindrical shape such as a square cylinder or a cylindrical shape and extends from the back wall 140gb toward the feeding coil unit 130. The side wall 140gs surrounds the outer periphery of the receiving coil 141.

[0199] A spacer 143 , a heat sink 144 , a ferrite member 145 , and a thermally conductive sheet 146 are disposed in this order within the shield space 140 s and between the back wall 140 gb and the power receiving coil 141 .

[0200] The opening at the front end of the side wall 140gs of the metal case 140g is closed by the insulating plate 140i. The insulating plate 140i is formed of a resin such as PEEK or PPS.

[0201] A plurality of ventilation holes 140gh are formed in the side wall 140gs. In addition, a fan 140f is arranged along the side wall 140gs on the outside of the metal shell 140g. The fan 140f can be an air supply fan or an exhaust fan. The fan 140f can form an air flow from the outside of the metal shell 140g through the plurality of ventilation holes 140gh and the shielding space 140s to the outside of the metal shell 140g. In this way, the power receiving coil 141 and the ferrite component 145 can be cooled.

[0202] exist Fig.28 In the illustrated embodiment, the driving system 340 d can move the power feeding coil unit 130 to change the length of the gap between the power feeding coil 131 and the power receiving coil 141 .

[0203] Next, for Figure 29 to Figure 37 The various embodiments shown, from relative Fig.28 The different aspects of the embodiments shown are described in detail. Figure 29 to Figure 37 In each of the illustrated embodiments, the power feeding coil unit 130 and the power receiving coil unit 140 are formed as one body. The power feeding coil 131 of the power feeding coil unit 130 and the power receiving coil 141 of the power receiving coil unit 140 are arranged in a shielded space provided by at least one metal shell. At least one metal shell is grounded to electromagnetically shield the shielded space from the external space. At least one ferrite component is provided in the shielded space. At least one ferrite component seals the space for accommodating the power feeding coil 131 and the power receiving coil 141.

[0204] Next, for Fig.29 The embodiment shown, from relative to Fig.28 The different aspects of the embodiments shown are described in detail. Fig.28 In the illustrated embodiment, two metal cases are used as at least one metal case, namely, a metal case 130g (first metal case) of the power feeding coil unit 130 and a metal case 140g (second metal case) of the power receiving coil unit 140.

[0205] The metal shell 130g and the metal shell 140g are arranged so that the front ends of their side walls face each other, and an insulating plate 34i is sandwiched between the front ends of their side walls. That is, the shielding space 130s of the metal shell 130g and the shielding space 140s of the metal shell 140g are separated by the insulating plate 34i. The insulating plate 34i is formed of a resin such as PEEK or PPS.

[0206] The side wall 130gs includes a flange 130gf, and the side wall 140gs includes a flange 140gf. The metal shell 130g and the metal shell 140g are positioned and fixed to each other by the positioning pin 34p in a state where the flange 130gf and the flange 140gf face each other or abut each other and are electrically conductive. As a result, the winding axes of the feeding coil 131 and the receiving coil 141 are consistent, and the parallelism of the feeding coil 131 and the receiving coil 141 can be mechanically ensured. Therefore, a technology that can improve the transmission efficiency of electric power between the feeding coil 131 and the receiving coil 141 can be provided.

[0207] The heat sink 134, the back side 1351 of the ferrite component 135, and the heat conducting sheet 136 are sequentially arranged in the shielding space 130s and between the back wall 130gb and the feeding coil 131. The ferrite component 135 is arranged in the shielding space 130s to define a space 135s open on the insulating plate 34i side. The feeding coil 131 is arranged in the space 135s.

[0208] The back side portion 1351 (first back side portion) of the ferrite component 135 is in a substantially flat plate shape and extends on the back side of the feeding coil 131. The ferrite component 135 further includes a side wall portion 1353 (first side wall portion). The side wall portion 1353 has a cylindrical shape such as a square cylinder shape or a cylindrical shape and extends from the back side portion 1351 to the insulating plate 34i. The side wall portion 1353 surrounds the outer periphery of the feeding coil 131. A heat conducting sheet 137 may be arranged between the side wall portion 1353 and the feeding coil 131 so as to surround the outer periphery of the feeding coil 131. The front end of the side wall portion 1353 and the front end of the side wall portion 1454 described later face each other with the insulating plate 34i sandwiched therebetween. In addition, the back side portion 1351 and the side wall portion 1353 may be formed of a single member, or the back side portion 1351 and the side wall portion 1353 may be formed of different members.

[0209] In the shielding space 140s, between the back wall 140gb and the power receiving coil 141, a spacer 143, a heat sink 144, a back side portion 1452 of a ferrite component 145, and a heat conducting sheet 146 are sequentially arranged. The ferrite component 145 is arranged in the shielding space 140s, and defines a space 145s that is open on the insulating plate 34i side. The power receiving coil 141 is arranged in the space 145s.

[0210] The back surface portion 1452 (second back surface portion) of the ferrite component 145 is in a substantially flat plate shape and extends on the back surface side of the power receiving coil 141. The ferrite component 145 further includes a side wall portion 1454 (second side wall portion). The side wall portion 1454 has a cylindrical shape such as a square cylinder shape or a cylindrical shape and extends from the back surface portion 1452 to the insulating plate 34i. The side wall portion 1454 surrounds the outer periphery of the power receiving coil 141. A heat conducting sheet 147 may be arranged between the side wall portion 1454 and the power receiving coil 141 so as to surround the outer periphery of the power receiving coil 141. The front end of the side wall portion 1454 and the front end of the side wall portion 1353 face each other with the insulating plate 34i interposed therebetween. In addition, the back surface portion 1452 and the side wall portion 1454 may be formed of a single member, or the back surface portion 1452 and the side wall portion 1454 may be formed of different members.

[0211] exist Fig.29 In the embodiment of the present invention, the driving system 340d can move the feeding coil assembly to change the length of the gap between the feeding coil 131 and the receiving coil 141. The feeding coil assembly includes the feeding coil 131, the heat sink 134, the ferrite component 135, the heat conducting sheet 136 and the heat conducting sheet 137.

[0212] according to Fig.29 The power feeding coil unit 130 and the power receiving coil unit 140 shown in the figure can suppress high frequency noise from leaking to the outside by the metal casings 130g and 140g. In addition, it can suppress foreign matter from entering the inside of each of the power feeding coil unit 130 and the power receiving coil unit 140.

[0213] In addition, the leakage of magnetic flux can be suppressed by the ferrite component 135 and the ferrite component 145. Therefore, even without increasing the number of turns of each of the feeding coil 131 and the receiving coil 141, high power supply efficiency between the feeding coil 131 and the receiving coil 141 can be obtained. Therefore, the resistance value of each of the feeding coil 131 and the receiving coil 141 can be reduced. In addition, the feeding coil 131 and the receiving coil 141 can be miniaturized.

[0214] In addition, the ferrite component 135 and the ferrite component 145 each have a side wall portion, and therefore have a relatively large volume. Therefore, even if the ferrite component 135 and the ferrite component 145 each generate heat due to the conductive noise, the temperature rise is small. In addition, the ferrite component 135 and the ferrite component 145 each have a relatively large volume, and therefore have a relatively large inductance. The relatively large inductance of the ferrite component 135 and the ferrite component 145 and the small resistance value of the feeding coil 131 and the receiving coil 141 can bring about a high Q value of the feeding coil 131 and the receiving coil 141. Therefore, it is possible to ensure a high transmission efficiency of electric power between the feeding coil 131 and the receiving coil 141.

[0215] In addition, the ferrite component 135 and the ferrite component 145 can each be formed of manganese-zinc ferrite, nickel-zinc ferrite or nanocrystalline soft magnetic material. In this case, when the transmission frequency is below 1 MHz, a high confinement effect of the magnetic flux at the transmission frequency can be obtained by high magnetic permeability, and the conductive noise can be efficiently converted into heat.

[0216] Next, for Fig.30 The embodiment shown, from relative to Fig.29 The different aspects of the embodiments shown are described in detail. Fig.30 In the illustrated embodiment, a single metal shell 340g is used as the at least one metal shell.

[0217] The metal casing 340g is grounded. The metal casing 340g defines a shielding space 340s, and the power feeding coil 131 and the power receiving coil 141 are accommodated in the shielding space 340s.

[0218] The metal shell 340g includes a first back wall 340g1, a second back wall 340g2, and a side wall 340g3. The first back wall 340g1, the second back wall 340g2, and the side wall 340g3 define a shielding space 340s. The first back wall 340g1 is in the shape of a substantially flat plate, and extends on the back side of the feeding coil 131 relative to the receiving coil 141. The second back wall 340g2 is in the shape of a substantially flat plate, and extends on the back side of the receiving coil 141 relative to the feeding coil 131. The side wall 130gs has a cylindrical shape such as a square cylinder shape or a cylindrical shape, and extends from the first back wall 340g1 to the second back wall 340g2. The side wall 130gs surrounds the outer periphery of the feeding coil 131 and the outer periphery of the receiving coil 141.

[0219] The heat sink 134 , the back surface portion 1351 of the ferrite member 135 , and the thermally conductive sheet 136 are arranged in this order within the shield space 340 s and between the first back surface wall 340 g 1 and the power feeding coil 131 .

[0220] Furthermore, in the shield space 340s and between the second rear wall 340g2 and the power receiving coil 141, the spacer 143, the heat sink 144, the rear surface portion 1452 of the ferrite member 145, and the thermally conductive sheet 146 are arranged in this order.

[0221] The ferrite component 135 and the ferrite component 145 are arranged in the shielding space 340s. The side wall portion 1353 of the ferrite component 135 extends outside the side wall portion 1454 of the ferrite component 145. The ferrite component 135 and the ferrite component 145 define a closed space 345s by surrounding the side wall portion 1454 with the side wall portion 1353. The power feeding coil 131 and the power receiving coil 141 are arranged in the space 345s.

[0222] In addition, a fan 340f is disposed along the outer side of the metal shell 340g. The fan 340f may be a blower fan or an exhaust fan. Fig.30 In the example of FIG. 3 , the fan 340f is arranged along the side wall 340g3. The fan 340f can form an airflow from the outside of the metal housing 340g through the plurality of vents 340gh of the metal housing 340g and the shielding space 340s to the outside of the metal housing 340g. Fig.30 In the example, a plurality of ventilation holes 340gh are formed in the side wall 340g3.

[0223] exist Fig.30 In the embodiment, the driving system 340d can move the feeding coil assembly to change the length of the gap between the feeding coil 131 and the receiving coil 141. The feeding coil assembly includes the feeding coil 131, the heat sink 134, the ferrite component 135, the heat conducting sheet 136, and the heat conducting sheet 137. By moving the feeding coil assembly using the driving system 340d, the side wall portion 1353 moves along the outer peripheral surface of the side wall portion 1454.

[0224] according to Fig.30 The power feeding coil unit 130 and the power receiving coil unit 140 shown in the figure can suppress the leakage of high frequency noise to the outside by the metal casing 340g. In addition, it can suppress the intrusion of foreign matter into the inside of each of the power feeding coil unit 130 and the power receiving coil unit 140.

[0225] Next, for Fig.31 The embodiment shown, from relative to Fig.30 The different aspects of the embodiments shown are described in detail. Fig.31 In the illustrated embodiment, a plurality of ventilation holes 340gh are formed on the first rear wall 340g1 and the second rear wall 340g2. Fig.31 In the illustrated embodiment, the fan 340f is disposed along the second rear wall 340g2 outside the metal housing 340g.

[0226] exist Fig.31In the illustrated embodiment, the heat sink 134, the back surface portion 1351, the heat conducting sheet 136, and the power feeding coil 131 provide a first gas flow path connecting the space between the power feeding coil 131 and the power receiving coil 141 to the plurality of vents 340gh of the first back surface wall 340g1. In addition, the heat sink 144, the back surface portion 1452, the heat conducting sheet 146, and the power receiving coil 141 provide a second gas flow path connecting the space between the power feeding coil 131 and the power receiving coil 141 to the plurality of vents 340gh of the second back surface wall 340g2.

[0227] exist Fig.31 In the illustrated embodiment, the fan 340f is an air supply fan that can form an air flow that reaches the outside of the metal case 340g via the plurality of vents 340gh of the second rear wall 340g2, the second gas flow path, the space between the power receiving coil 141 and the power feeding coil 131, the first gas flow path, and the plurality of vents 340gh of the first rear wall 340g1. Thus, the power feeding coil 131, the ferrite component 135, the power receiving coil 141, and the ferrite component 145 can be cooled.

[0228] Next, for Fig.32 The embodiment shown, from relative to Fig.31 The different aspects of the embodiments shown are described in detail. Fig.32 In the embodiment shown, the feeding coil unit 130 includes a bottom plate 138 instead of the heat sink 134. The bottom plate 138 is, for example, a glass epoxy substrate. In addition, in the feeding coil unit 130, the ferrite component 135 is roughly plate-shaped like the back portion 1351 described above, and extends on the back side of the feeding coil 131. The bottom plate 138 may have at least one hollow portion on the contact surface with the ferrite component 135. In this case, the cooling efficiency of the ferrite component 135 can be improved.

[0229] The receiving coil unit 140 includes a bottom plate 148 instead of the heat sink 144. The bottom plate 148 is, for example, a glass epoxy substrate. In addition, in the receiving coil unit 140, the side wall portion 1454 of the ferrite component 145 extends from the back portion 1452 toward the feeding coil unit 130 side, surrounding the outer periphery of the feeding coil 131, the outer periphery of the heat conducting sheet 136, and the outer periphery of the ferrite component 135. The bottom plate 148 may have at least one hollow portion on the contact surface with the ferrite component 145. In this case, the cooling efficiency of the ferrite component 145 can be improved.

[0230] exist Fig.32In the embodiment of the present invention, the driving system 340d can move the feeding coil assembly to change the length of the gap between the feeding coil 131 and the receiving coil 141. The feeding coil assembly includes the feeding coil 131, the bottom plate 138, the ferrite component 135 and the heat conducting sheet 136. The feeding coil assembly can move in the area surrounded by the side wall portion 1454.

[0231] In the above Fig.30 and Fig.31 In an embodiment of the present invention, the side wall portions of the two ferrite components are arranged in a nested manner. Fig.32 In the embodiment of the present invention, in the metal housing 340g, a single side wall portion 1454 surrounds the power feeding coil 131 and the power receiving coil 141. Fig.32 In the embodiment of the present invention, the width of the ferrite component in the metal shell 340g is small. Fig.32 The embodiment can reduce the width of the metal shell 340g.

[0232] Next, for Fig.33 The embodiment shown, from relative to Fig.32 The different aspects of the embodiments shown are described in detail. Fig.33 In the illustrated embodiment, the ferrite member 145 has a substantially plate shape similar to the above-described back surface portion 1452 , and extends on the back surface side of the power receiving coil 141 .

[0233] The ferrite member 135 includes the above-mentioned back portion 1351 and side wall portion 1353. The side wall portion 1353 extends from the back portion 1351 toward the power receiving coil portion 140 and surrounds the outer periphery of the power receiving coil 141, the outer periphery of the heat conducting sheet 146, and the outer periphery of the ferrite member 145.

[0234] exist Fig.33 In the embodiment of the present invention, the driving system 340d can move the feeding coil assembly to change the length of the gap between the feeding coil 131 and the receiving coil 141. The feeding coil assembly includes the feeding coil 131, the bottom plate 138, the ferrite component 135 and the heat conducting sheet 136. The feeding coil 131, the ferrite component 135 and the heat conducting sheet 136 of the feeding coil assembly can be moved in a manner such that the ferrite component 145 is located in the area surrounded by the side wall portion 1353.

[0235] Next, for Fig.34 The embodiment shown, from relative to Fig.32 The different aspects of the embodiments shown are described in detail. Fig.34 In the illustrated embodiment, the fan 340f is disposed along the first rear wall 340g1 outside the metal housing 340g.

[0236] Next, for Fig.35 The embodiment shown, from relative to Fig.34 The different aspects of the embodiments shown are described in detail. Fig.35 In the illustrated embodiment, the drive system 340d is capable of moving the power receiving coil assembly to change the length of the gap between the power feeding coil 131 and the power receiving coil 141. The power receiving coil assembly includes the power receiving coil 141, the bottom plate 148, the ferrite component 145, and the heat conducting sheet 146. The power receiving coil assembly can be moved in a manner such that the power feeding coil 131, the ferrite component 135, and the heat conducting sheet 136 are located in the area surrounded by the side wall portion 1454. In addition, Fig.35 The embodiment shown is to Fig.32 The drive system 340d and the fan 340f of the embodiment shown are structured by exchanging positions. Fig.33 The positions of the drive system 340d and the fan 340f of the embodiment can also be similarly swapped.

[0237] Next, for Fig.36 The embodiment shown, from relative to Fig.34 The different aspects of the embodiments shown are described in detail. Fig.36 In the illustrated embodiment, two drive systems 340d are used. One of the two drive systems 340d can move the feeding coil assembly to change the distance between the feeding coil 131 and the receiving coil. The other of the two drive systems 340d can move the receiving coil assembly to change the distance between the feeding coil 131 and the receiving coil. The receiving coil assembly includes the receiving coil 141, the bottom plate 148, the ferrite component 145 and the heat conduction sheet 146.

[0238] Next, for Fig.37 The embodiment shown, from relative to Fig.36 The different aspects of the embodiments shown are described in detail. Fig.37 In the embodiment shown, the ferrite component 145 is substantially plate-shaped like the back portion 1452 described above, and extends on the back side of the power receiving coil 141. In addition, a ferrite component 1345 constituting the side wall portion is used. The ferrite component 1345 is cylindrical and fixed to the metal case 340g. Fig.37 In the embodiment of the present invention, the two drive systems 340d can move the feeding coil assembly and the receiving coil assembly in the area surrounded by the ferrite member 1345 constituting the side wall portion. Alternatively, the drive system 340d may be composed of only one drive system, and can move either the feeding coil assembly or the receiving coil assembly in the area surrounded by the ferrite member 1345 constituting the side wall portion.

[0239] [Exemplary Embodiment of Using a Variable Capacitor as a Resonant Capacitor]

[0240] Next, various embodiments of resonant capacitors in each of the power feeding coil unit 130 and the power receiving coil unit 140 that can change the length of the gap between the power feeding coil 131 and the power receiving coil 141 are described. In only one or both of the power feeding coil unit 130 and the power receiving coil unit 140, at least one resonant capacitor may be a variable capacitor.

[0241] Reference Fig. 9 For example, in Fig. 9 In the feeding coil unit 130 shown, one of the resonant capacitors 132a and 132b may be a variable capacitor. Alternatively, both the resonant capacitors 132a and 132b may be variable capacitors. When the resonant capacitors 132a and 132b are variable capacitors, they may have the same electrostatic capacitance as each other or different electrostatic capacitances from each other.

[0242] exist Fig. 9 In the power receiving coil unit 140 shown, one of the resonant capacitors 142a and 142b may be a variable capacitor. Alternatively, both the resonant capacitors 142a and 142b may be variable capacitors. When the resonant capacitors 142a and 142b are variable capacitors, they may have the same electrostatic capacitance as each other or different electrostatic capacitances from each other.

[0243] In addition, Fig. 9 In the illustrated embodiment, the resonant capacitor 132a and the resonant capacitor 142a may each be a variable capacitor. Alternatively, the resonant capacitor 132b and the resonant capacitor 142b may each be a variable capacitor. Alternatively, the resonant capacitor 132a, the resonant capacitor 132b, the resonant capacitor 142a, and the resonant capacitor 142b may each be a variable capacitor.

[0244] Reference Fig.38 . Fig.38 1 is a diagram showing a feeding coil unit and a receiving coil unit according to another exemplary embodiment. In another embodiment, two or more resonant capacitors may be connected in parallel to the feeding coil 131. Alternatively or in addition, another two or more resonant capacitors may be connected in parallel to the receiving coil 141.

[0245] exist Fig.38In an embodiment, two or more resonant capacitors 132a are connected in parallel between one end of the feeding coil 131 and the feeding unit 120. Two or more resonant capacitors 132b are connected in parallel between the other end of the feeding coil 131 and the feeding unit 120. Two or more resonant capacitors 142a are connected in parallel to one end of the receiving coil 141. In addition, two or more resonant capacitors 142b are connected in parallel to the other end of the receiving coil 141. At least one of the two or more resonant capacitors 132a may be a variable capacitor. At least one of the two or more resonant capacitors 132b may be a variable capacitor. At least one of the two or more resonant capacitors 142a may be a variable capacitor. In addition, at least one of the two or more resonant capacitors 142b may be a variable capacitor.

[0246] In addition, Fig.38 In a modified example of the embodiment, only a single resonant capacitor 142a may be connected to one end of the receiving coil 141, or only a single resonant capacitor 142b may be connected to the other end of the receiving coil 141. In addition, only a single resonant capacitor 132a may be connected to one end of the feeding coil 131. Alternatively, only a single resonant capacitor 132b may be connected to the other end of the feeding coil 131.

[0247] exist Fig.38 In another variation of the embodiment, only a single resonant capacitor 132a may be connected to one end of the feeding coil 131, or only a single resonant capacitor 132b may be connected to the other end of the feeding coil 131. In addition, only a single resonant capacitor 142a may be connected to one end of the receiving coil 141. Alternatively, only a single resonant capacitor 142b may be connected to the other end of the receiving coil 141.

[0248] exist Fig.38 In another modified example of the embodiment, only a single resonant capacitor 132a may be connected to one end of the power feeding coil 131, or only a single resonant capacitor 142a may be connected to one end of the power receiving coil 141. Alternatively, only a single resonant capacitor 132b may be connected to the other end of the power feeding coil 131, or only a single resonant capacitor 142b may be connected to the other end of the power receiving coil 141.

[0249] In the case where at least one of the feeding coil unit 130 and the receiving coil unit 140 includes at least one variable capacitor as a resonant capacitor, the electrostatic capacitance of the at least one variable capacitor can be changed according to the distance between the feeding coil 131 and the receiving coil 141. Thus, correction can be made so that the circuit including the feeding coil 131 in the feeding coil unit 130 forms a resonant circuit for the transmission frequency. In addition, correction can be made so that the circuit including the receiving coil 141 in the receiving coil unit 140 forms a resonant circuit for the transmission frequency. In addition, the electrostatic capacitance of the at least one variable capacitor corresponding to the distance between the feeding coil 131 and the receiving coil 141 can be set from the control unit 2 via the control unit 122.

[0250] [Exemplary Embodiment of Countermeasures against Conductive Noise Caused by Ferrite Components in Power Feeding Coil Section and Power Receiving Coil Section]

[0251] Below, refer to Fig.39 (a) Fig.39 (b) Fig.40 (a) Fig.40 (b) Fig.41 (a) Fig.41 (b) Fig.42 (a) and Fig.42 (b). Fig.39 (a) is a cross-sectional view of a coil portion of an exemplary embodiment, Fig.39 (b) means Fig.39 (a) is a plan view of a plurality of ferrite components provided between a bottom plate and a heat conducting sheet in a coil portion. Fig.39 (a) indicates that along Fig.39 (b) is a cross section of the coil portion of the XXXIXA-XXXIXA wire. Fig.40 (a) is a cross-sectional view of a coil portion of another exemplary embodiment, Fig.40 (b) means Fig.40 (a) is a plan view of a plurality of ferrite components provided between a bottom plate and a heat conducting sheet in a coil portion. Fig.40 (a) indicates that along Fig.40 (b) is a cross section of the coil portion of the XLA-XLA wire. Fig.41 (a) is a cross-sectional view of a coil portion of yet another exemplary embodiment, Fig.41 (b) means Fig.41 (a) is a plan view of a plurality of ferrite components provided between a bottom plate and a heat conducting sheet in a coil portion. Fig.41 (a) indicates that along Fig.41 (b) is a cross section of the coil portion of the XLIA-XLIA wire. Fig.42 (a) is a cross-sectional view of a coil portion of yet another exemplary embodiment, Fig.42 (b) means Fig.42 (a) is a plan view of a plurality of ferrite components provided between a bottom plate and a heat conducting sheet in a coil portion. Fig.42 (a) indicates that along Fig.42 The structure of the coil unit 500 shown in these figures can be adopted as a structure arranged inside a metal casing in at least one of the power feeding coil unit 130 and the power receiving coil unit 140.

[0252] The coil unit 500 includes a coil 501, a spacer 503, a bottom plate 508, a plurality of ferrite components 505, and a heat conduction sheet 506. The coil 501 is used as a feeding coil 131 in the feeding coil unit 130 and as a receiving coil 141 in the receiving coil 141. The spacer 503 supports the bottom plate 508. The bottom plate 508 is, for example, a glass epoxy substrate. A plurality of ferrite components 505 are provided between the bottom plate 508 and the coil 501. The heat conduction sheet 506 is provided between each of the plurality of ferrite components 505 and the coil 501. The coil unit 500 provides a hole 500h for leading a lead wire from the coil 501 from the coil 501 to a space under the bottom plate 508.

[0253] exist Fig.39 (a) and Fig.39 In the embodiment shown in (b), the plurality of ferrite components 505 form a single segment (stage) and are arranged in a direction perpendicular to the main surface of the bottom plate 508. The plurality of ferrite components 505 are arranged to avoid the hole 500h. Fig.39 (a) and Fig.39 In the embodiment shown in (b), the coil unit 500 further includes an inner ferrite component 507 . The inner ferrite component 507 is arranged inside the coil 501 .

[0254] exist Fig.40 (a) and Fig.40 In the embodiment shown in (b), the plurality of ferrite components 505 form two segments. The plurality of ferrite components 505 may also form three or more segments. In each segment, the plurality of ferrite components 505 are arranged along a direction orthogonal to the main surface of the bottom plate 508. The plurality of ferrite components 505 are arranged to avoid the hole 500h. Fig.40 (a) and Fig.40 In the embodiment shown in (b), the inner ferrite component 507 may be arranged inside the coil 501 or may not be arranged inside the coil 501.

[0255] exist Fig.41 (a) and Fig.41 In the embodiment shown in (b), the plurality of ferrite components 505 form a single segment and are arranged along a first direction orthogonal to the main surface of the bottom plate 508. The plurality of ferrite components 505 are arranged avoiding the hole 500h. Some of the plurality of ferrite components 505 are arranged on both sides of the hole 500h in a second direction orthogonal to the main surface of the bottom plate 508 and orthogonal to the first direction. Fig.41 (a) and Fig.41 In the embodiment shown in (b), the inner ferrite component 507 may be arranged inside the coil 501 or may not be arranged inside the coil 501.

[0256] exist Fig.42 (a) and Fig.42 In the embodiment shown in (b), the plurality of ferrite components 505 form two segments. The plurality of ferrite components 505 may also form three or more segments. In each segment, the plurality of ferrite components 505 are arranged along a first direction perpendicular to the main surface of the bottom plate 508. The plurality of ferrite components 505 are arranged avoiding the hole 500h. Some of the plurality of ferrite components 505 are arranged on both sides of the hole 500h in a second direction perpendicular to the main surface of the bottom plate 508 and perpendicular to the first direction. Fig.42 (a) and Fig.42 In the embodiment shown in (b), the inner ferrite component 507 may be arranged inside the coil 501 or may not be arranged inside the coil 501.

[0257] In addition, in each embodiment, the plurality of ferrite components 505 and the inner ferrite component 507 may be formed of manganese-zinc ferrite, nickel-zinc ferrite, or nanocrystalline soft magnetic material.

[0258] exist Fig.39 (a) Fig.39 (b) Fig.40 (a) Fig.40 (b) Fig.41 (a) Fig.41 (b) Fig.42 (a) and Fig.42 In each embodiment shown in (b), all ferrite components bring a large total volume to the coil unit 500. Therefore, even if heat is generated in these ferrite components due to high-frequency noise, the temperature rise of these ferrite components is small. Therefore, as a high-frequency electric power such as the first RF signal and / or the second RF signal, a high-frequency electric power with a large power level can be used. In addition, the structure of the coil unit 500 can be adopted in both the feeding coil unit 130 and the receiving coil unit 140. Alternatively, the structure of the coil unit 500 can be adopted only in the receiving coil unit 140, which is particularly prone to generating heat caused by eddy currents caused by conductive noise.

[0259] [Exemplary Embodiments of Inner Ferrite Members in the Power Feeding Coil Section and the Power Receiving Coil Section]

[0260] Below, refer to Figures 43 to 58 , various exemplary embodiments of the inner ferrite member in the integrated feeding coil unit 130 and the receiving coil unit 140 are described. The inner ferrite member extends from the inner area of ​​one of the feeding coil 131 and the receiving coil 141 to the inner area of ​​the other coil. The inner ferrite member can be formed of manganese-zinc ferrite, nickel-zinc ferrite, or nanocrystalline soft magnetic material.

[0261] By using the inner ferrite component, the Q value of each of the feeding coil 131 and the receiving coil 141, the coupling coefficient between the feeding coil 131 and the receiving coil 141, and the transmission efficiency of the electric power between the feeding coil 131 and the receiving coil 141 can be improved. Therefore, by using the inner ferrite component, the performance of wireless power supply can be improved. In addition, the distance between the feeding coil 131 and the receiving coil 141 can be extended, and the conductive noise from the receiving coil 141 to the feeding coil 131 can be reduced. In addition, the feeding coil 131 and the receiving coil 141 can be miniaturized while ensuring the desired Q value.

[0262] Fig.43 FIG. 1 is a diagram showing a power feeding coil unit and a power receiving coil unit according to another exemplary embodiment. Fig.43 The embodiment shown, from relative to Fig.30 The different aspects of the implementation methods are described in detail. Fig.43 In the illustrated embodiment, drive system 340d is not utilized.

[0263] exist Fig.43 In the embodiment, the heat sink 134, the back portion 3451 (first portion) of the ferrite component 345, and the heat conducting sheet 136 are sequentially arranged in the shielding space 340s and between the first back wall 340g1 and the feeding coil 131. The back portion 3451 is in a substantially flat plate shape and extends on the back side of the feeding coil 131.

[0264] In addition, the spacer 143, the heat sink 144, the back surface portion 3452 (second portion) of the ferrite member 345, and the heat conducting sheet 146 are sequentially arranged in the shield space 340s and between the second back surface wall 340g2 and the power receiving coil 141. The back surface portion 3452 is in a substantially flat plate shape and extends on the back surface side of the power receiving coil 141.

[0265] The ferrite member 345 is disposed in the shielding space 340s to define a closed space 345s. The power feeding coil 131 and the power receiving coil 141 are disposed in the space 345s.

[0266] The ferrite component 345 further includes a side wall portion 3453 (third portion). The side wall portion 3453 has a cylindrical shape such as a square cylinder shape or a cylindrical shape, and extends from the back portion 3451 to the back portion 3452. The side wall portion 3453 surrounds the outer periphery of the feeding coil 131 and the outer periphery of the receiving coil 141. A heat conducting sheet 347 may be arranged between the feeding coil 131 and the receiving coil 141 and the side wall portion 3453 so as to surround the outer periphery of the feeding coil 131 and the outer periphery of the receiving coil 141. In addition, the back portion 3451, the back portion 3452, and the side wall portion 3453 may be formed of a single component. Alternatively, the back portion 3451, the back portion 3452, and the side wall portion 3453 may be formed of different components.

[0267] Moreover, in Fig.43 In the embodiment, the columnar inner ferrite component 348 extends from the back surface portion 3451 of the ferrite component 345 to the back surface portion 3452 of the ferrite component 345 through the inner area of ​​the feeding coil 131 and the inner area of ​​the receiving coil 141 .

[0268] according to Fig.43 In the embodiment, the leakage of magnetic flux can be suppressed by the ferrite component 345. Therefore, even without increasing the number of turns of each of the feeding coil 131 and the receiving coil 141, high power supply efficiency between the feeding coil 131 and the receiving coil 141 can be obtained. Therefore, the resistance value of each of the feeding coil 131 and the receiving coil 141 can be reduced. In addition, the feeding coil 131 and the receiving coil 141 can be miniaturized.

[0269] In addition, the ferrite component 345 has a side wall portion, and therefore has a relatively large volume. Therefore, even if the ferrite component 345 generates heat due to the conductive noise, the temperature rise is small. In addition, the ferrite component 345 has a relatively large volume, and therefore has a relatively large inductance. The relatively large inductance of the ferrite component 345 and the small resistance values ​​of the feeding coil 131 and the receiving coil 141 can bring about a high Q value of the feeding coil 131 and the receiving coil 141. Therefore, it is possible to ensure a high transmission efficiency of the electric power between the feeding coil 131 and the receiving coil 141.

[0270] In addition, the ferrite component 345 can be formed of manganese-zinc ferrite, nickel-zinc ferrite or nanocrystalline soft magnetic material. In this case, when the transmission frequency is below 1 MHz, a high confinement effect of the magnetic flux at the transmission frequency can be obtained by high magnetic permeability, and the conductive noise can be efficiently converted into heat.

[0271] Fig.44FIG. 1 is a diagram showing a power feeding coil unit and a power receiving coil unit according to another exemplary embodiment. Fig.44 The embodiment shown, from relative to Fig.43 The different aspects of the implementation methods are described in detail. Fig.44 In the embodiment, the inner ferrite component 348 penetrates the back surface portion 3451 of the ferrite component 345 and the back surface portion 3452 of the ferrite component 345. The inner ferrite component 348 extends from the heat sink 134 through the area inside the feeding coil 131 and the area inside the receiving coil 141 to the heat sink 144.

[0272] Fig.45 FIG. 1 is a diagram showing a power feeding coil unit and a power receiving coil unit according to another exemplary embodiment. Fig.45 The embodiment shown, from relative to Fig.30 The embodiments are described from different perspectives.

[0273] exist Fig.45 In the illustrated state, the inner ferrite member 348 extends from the back surface portion 1452 through the area inside the power reception coil 141 to the area inside the power feeding coil 131 .

[0274] and Fig.30 Similarly to the embodiment of the present invention, the feeding coil 131, the heat sink 134, the ferrite component 135, the heat conducting sheet 136 and the heat conducting sheet 137 of the feeding coil unit 130 can be moved by the driving system 340d in a direction approaching the receiving coil unit 140 (hereinafter referred to as the "approaching direction") and in a direction away from the receiving coil unit 140 (hereinafter referred to as the "away direction"). Fig.45 In the illustrated state, when the driving system 340 d moves the feeding coil 131 , the heat sink 134 , the ferrite member 135 , the thermally conductive sheet 136 , and the thermally conductive sheet 137 toward each other, one end of the inner ferrite member 348 can come into contact with the back surface portion 1351 .

[0275] Fig.46 FIG. 1 is a diagram showing a power feeding coil unit and a power receiving coil unit according to another exemplary embodiment. Fig.46 The embodiment shown, from relative to Fig.45 The different aspects of the implementation methods are described in detail. Fig.46 In the embodiment of the present invention, the inner ferrite component 348 extends from the back surface portion 1351 through the area inside the feeding coil 131 to the area inside the receiving coil 141. When the feeding coil 131, the heat sink 134, the ferrite component 135, the thermally conductive sheet 136, the thermally conductive sheet 137, and the inner ferrite component 348 are moved in a direction close to each other by the driving system 340d, the other end of the inner ferrite component 348 can abut against the back surface portion 1452.

[0276] Fig.47 FIG. 1 is a diagram showing a power feeding coil unit and a power receiving coil unit according to another exemplary embodiment. Fig.47 The embodiment shown, from relative to Fig.45 The different aspects of the implementation methods are described in detail. Fig.47 In the illustrated embodiment, the inner ferrite member 348 extends from the back portion 1452 through the area inside the power receiving coil 141 and the area inside the power feeding coil 131 to the back portion 1351. When the power feeding coil 131, the heat sink 134, the ferrite member 135, the heat conducting sheet 136, and the heat conducting sheet 137 are moved in the approaching direction by the driving system 340d, one end of the inner ferrite member 348 can pass through the through hole of the back portion 1351 and abut against the heat sink 134. In addition, by providing an inner hole in the heat sink 134, one end of the inner ferrite member 348 can also pass through the through hole of the back portion 1351 and abut against the inside of the heat sink 134.

[0277] Fig.48 FIG. 1 is a diagram showing a power feeding coil unit and a power receiving coil unit according to another exemplary embodiment. Fig.48 The embodiment shown, from relative to Fig.46 The different aspects of the implementation methods are described in detail. Fig.48 In the embodiment of the present invention, the inner ferrite component 348 extends from the back surface portion 1351 through the area inside the feeding coil 131 and the area inside the receiving coil 141 to the back surface portion 1452. When the feeding coil 131, the heat sink 134, the ferrite component 135, the heat conducting sheet 136, the heat conducting sheet 137, and the inner ferrite component 348 are moved in a direction of approaching by the driving system 340d, the other end of the inner ferrite component 348 can pass through the through hole of the back surface portion 1452 and abut against the heat sink 144. In addition, by providing an inner hole in the heat sink 144, the other end of the inner ferrite component 348 can also pass through the through hole of the back surface portion 1452 and abut against the inside of the heat sink 144.

[0278] Fig.49 and Fig.50 1 and 10 are diagrams showing a power feeding coil unit and a power receiving coil unit according to another exemplary embodiment. Fig.49 and Fig.50 The embodiments shown in each example are as follows: Fig.45 The different aspects of the implementation methods are described in detail. Fig.49 and Fig.50 In each embodiment, a columnar inner ferrite component 3481 and a columnar inner ferrite component 3482 are used instead of the inner ferrite component 348. In addition, Fig.49The length of the inner ferrite component 3481 in the embodiment is greater than Fig.50 The length of the inner ferrite component 3481 in the embodiment is short. In addition, Fig.49 The length of the inner ferrite component 3482 in the embodiment is greater than Fig.50 The length of the inner ferrite component 3482 in the embodiment is long. Fig.49 and Fig.50 As shown, the length of the inner ferrite component 3481 can be shorter than the length of the inner ferrite component 3482, or can be longer than the length of the inner ferrite component 3482.

[0279] The inner ferrite member 3481 passes through the inner area of ​​the feeding coil 131 from the back surface 1351 and protrudes from the feeding coil 131 toward the receiving coil 141. The inner ferrite member 3482 passes through the inner area of ​​the receiving coil 141 from the back surface 1452 and protrudes from the receiving coil 141 toward the feeding coil 131.

[0280] When the driving system 340d moves the feeding coil 131, the heat sink 134, the ferrite component 135, the heat conducting sheet 136, the heat conducting sheet 137 and the inner ferrite component 3481 in a direction approaching each other, the front end of the inner ferrite component 3481 can abut against the front end of the inner ferrite component 3482.

[0281] Fig.51 FIG. 1 is a diagram showing a power feeding coil unit and a power receiving coil unit according to another exemplary embodiment. Fig.51 The embodiment shown, from relative to Fig.49 The different aspects of the implementation methods are described in detail. Fig.51 In the state shown, the front end of the inner ferrite component 3481 is located on a plane including the front end of the inner ferrite component 3482. Fig.51 In the illustrated embodiment, the inner ferrite component 3482 provides an inner hole extending from its front end to the interior of the inner ferrite component 3482.

[0282] When the driving system 340d moves the feeding coil 131, the heat sink 134, the ferrite member 135, the heat conducting sheet 136, the heat conducting sheet 137, and the inner ferrite member 3481 in the approaching direction, the front end portion of the inner ferrite member 3481 is received in the inner hole of the inner ferrite member 3482. Alternatively, the inner ferrite member 3481 may also be provided with an inner hole, and the front end portion of the inner ferrite member 3482 may also be received in the inner hole of the inner ferrite member 3481.

[0283] Fig.52 FIG. 1 is a diagram showing a power feeding coil unit and a power receiving coil unit according to another exemplary embodiment. Fig.52 The embodiment shown, from relative to Fig.45 The embodiments are described from different perspectives.

[0284] exist Fig.52 In the embodiment shown, the feeding coil unit 130 includes a bottom plate 138 instead of the heat sink 134. The bottom plate 138 is, for example, a glass epoxy substrate. In addition, in the feeding coil unit 130, the ferrite component 135 is roughly plate-shaped like the back portion 1351 described above, and extends on the back side of the feeding coil 131. The bottom plate 138 may have at least one hollow portion on the contact surface with the ferrite component 135. In this case, the cooling efficiency of the ferrite component 135 can be improved.

[0285] The receiving coil unit 140 includes a bottom plate 148 instead of the heat sink 144. The bottom plate 148 is, for example, a glass epoxy substrate. In addition, in the receiving coil unit 140, the side wall portion 1454 of the ferrite component 145 extends from the back portion 1452 toward the feeding coil unit 130 side, surrounding the outer periphery of the feeding coil 131, the outer periphery of the heat conducting sheet 136, and the outer periphery of the ferrite component 135. The bottom plate 148 may have at least one hollow portion on the contact surface with the ferrite component 145. In this case, the cooling efficiency of the ferrite component 145 can be improved.

[0286] When the driving system 340d moves the feeding coil 131, the bottom plate 138, the ferrite component 135, the heat conducting sheet 136 and the inner ferrite component 3481 in the approaching direction, the front end of the inner ferrite component 348 passes through the through hole of the bottom plate 138 and protrudes from the bottom plate 138 toward the first back wall 340g1.

[0287] In addition, Fig.52 In the illustrated embodiment, the fan 340f is disposed along the second rear wall 340g2. A plurality of ventilation holes 340gh are formed in the first rear wall 340g1 and the second rear wall 340g2.

[0288] Below, refer to Fig.53 (a) Fig.53 (b) and Fig.53 (c). Fig.53 (a) Fig.53 (b) and Fig.53 (c) are diagrams showing examples of the positional relationship between the power feeding coil and the power receiving coil, respectively, and the inner ferrite member.

[0289] like Fig.53As shown in (a) of FIG. 1 , the inner ferrite component 348 may be in contact with the power feeding coil 131 and the power receiving coil 141 . In addition, the inner ferrite component 3481 may be in contact with the power feeding coil 131 , and the inner ferrite component 3482 may be in contact with the power receiving coil 141 .

[0290] like Fig.53 As shown in (b), the inner ferrite component 348 may extend from the inner area of ​​the feeding coil 131 and not reach the inner area of ​​the receiving coil 141. Alternatively, the inner ferrite component 348 may not extend from the inner area of ​​the receiving coil 141 but reach the inner area of ​​the feeding coil 131.

[0291] like Fig.53 As shown in (c), the inner ferrite component 348 may not be in contact with the power feeding coil 131 and the power receiving coil 141. In addition, the inner ferrite component 3481 may not be in contact with the power feeding coil 131, and the inner ferrite component 3482 may not be in contact with the power receiving coil 141.

[0292] Below, refer to Fig.54 (a)~ Fig.54 (e). Fig.54 (a)~ Fig.54 (e) is a diagram showing various examples of inner ferrite components. Fig.54 As shown in (a) of FIG. 1 , the inner ferrite component 348 may be a single prism. The inner ferrite component 3481 and the inner ferrite component 3482 may each be a single prism.

[0293] like Fig.54 As shown in (b) of FIG. 1 , the inner ferrite component 348 may be a prism composed of two or more prisms. The inner ferrite component 3481 and the inner ferrite component 3482 may each be a prism composed of two or more prisms.

[0294] like Fig.54 As shown in (c), the inner ferrite component 348 may be in the shape of a rectangular parallelepiped, or may have an inner hole or be hollow. The inner ferrite component 348 may also be composed of several plates. In addition, the inner ferrite component 3481 and the inner ferrite component 3482 may each be in the shape of a rectangular parallelepiped, or may have an inner hole or be hollow. The inner ferrite component 3481 and the inner ferrite component 3482 may each be composed of several plates.

[0295] like Fig.54 As shown in (d) of FIG. 1 , the inner ferrite component 348 may have a cylindrical shape. The inner ferrite component 3481 and the inner ferrite component 3482 may each have a cylindrical shape. Fig.54As shown in (e), the inner ferrite component 348 may have a cylindrical shape. The inner ferrite component 3481 and the inner ferrite component 3482 may each have a cylindrical shape.

[0296] Below, refer to Fig.55 (a)~ Fig.55 (c) and Fig.56 (a)~ Fig.56 (b). Fig.55 (a)~ Fig.55 (c) and Fig.56 (a)~ Fig.56 (b) is a diagram showing various examples of inner ferrite components. Fig.55 (a)~ Fig.55 (c) and Fig.56 (a)~ Fig.56 (b) are plan views showing the front end faces of the inner ferrite components.

[0297] like Fig.55 As shown in (a) of FIG. 1 , the inner ferrite component 348 may have a rectangular parallelepiped shape. Fig.55 As shown in (a), the inner ferrite component 348 may also be in a lattice shape. In addition, the inner ferrite component 348 may be formed by a plurality of plates. The plurality of spaces provided in the inner ferrite component 348 may be arranged evenly or unevenly. Alternatively, the inner ferrite component 348 may be formed by inserting one or more components having different shapes into one or more spaces provided therein. The different shapes may be, for example, cylindrical.

[0298] like Fig.55 (b) and Fig.55 As shown in (c), the inner ferrite component 348 may be formed of a plurality of components. Fig.55 (b) and Fig.55 In each of the examples of (c), each of the plurality of components has a cylindrical shape. Fig.55 As shown in (b), multiple components can be arranged parallel to each other and two-dimensionally. Fig.55 As shown in (c), the multiple components can be arranged in parallel to each other and surround a space. The multiple components can each have a cylindrical shape. Alternatively, one or more of the multiple components can have a cylindrical shape, and the other components can have a cylindrical shape.

[0299] Furthermore, the number, shape, and arrangement of the plurality of inner ferrite members 348 can be appropriately selected according to the shape of the inner region of each of the power feeding coil 131 and the power receiving coil 141. Fig.56 As shown in (a) of FIG. 1 , the shape of the plurality of components of the inner ferrite component 348 may be a hexagonal prism. Fig.56 As shown in (b), the inner ferrite component 348 can have any shape formed by a plurality of plate-like portions. In addition, the inner ferrite component 3481 and the inner ferrite component 3482 can each be configured similarly to any of the various examples described above with respect to the inner ferrite component 348.

[0300] Below, refer to Fig.57 (a)~ Fig.57 (c) and Fig.58 (a)~ Fig.58 (b). Fig.57 (a)~ Fig.57 (c) and Fig.58 (a)~ Fig.58 (b) is a diagram showing various examples of ferrite components in the power feeding coil unit and the power receiving coil unit.

[0301] like Fig.57 As shown in (a) of FIG. 1 , the inner ferrite component 348 may be formed integrally with the back surface portion 1452 or the back surface portion 3452. Alternatively, the inner ferrite component 3482 may be formed integrally with the back surface portion 1452 or the back surface portion 3452.

[0302] like Fig.57 As shown in (b) of FIG. 1 , the inner ferrite component 348 may be formed integrally with the back surface portion 1351 or the back surface portion 3451. Alternatively, the inner ferrite component 3481 may be formed integrally with the back surface portion 1351 or the back surface portion 3451.

[0303] like Fig.57 As shown in (c), the inner ferrite component 348 may be formed integrally with the back surface portion 1351 and the back surface portion 1452. The inner ferrite component 348 may be formed integrally with the back surface portion 3451 and the back surface portion 3452.

[0304] like Fig.58 As shown in (a), the inner ferrite component 348 may be formed integrally with the back portion 1452 and the side wall portion 1454. The inner ferrite component 348 may be formed integrally with the back portion 3452 and the side wall portion 3453. In addition, the inner ferrite component 3482 may be formed integrally with the back portion 1452 and the side wall portion 1454. The inner ferrite component 3482 may be formed integrally with the back portion 3452 and the side wall portion 3453.

[0305] like Fig.58As shown in (b), the inner ferrite component 348 may be formed integrally with the back portion 1351 and the side wall portion 1353. The inner ferrite component 348 may be formed integrally with the back portion 3451 and the side wall portion 3453. In addition, the inner ferrite component 3481 may be formed integrally with the back portion 1351 and the side wall portion 1353. The inner ferrite component 3481 may be formed integrally with the back portion 3451 and the side wall portion 3453.

[0306] [Exemplary Embodiment of Cooling Mechanism for Power Feeding Coil Unit and Power Receiving Coil Unit]

[0307] Below, refer to Figures 59 to 69 , various exemplary embodiments of the cooling mechanism for the feeding coil unit 130 and the receiving coil unit 140 are described. The cooling mechanism cools the coils and ferrite components such as the feeding coil 131 and the receiving coil 141. The cooling mechanism can suppress damage to the components in the feeding coil unit 130 and the receiving coil unit 140. In addition, since the ferrite component is cooled by the cooling mechanism, high-frequency electric power with a high power level can be used as high-frequency electric power such as the first RF signal and the second RF signal.

[0308] Fig.59 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment. Fig.60 (a) means Fig.59 The figure shows an example of a heat sink for the power receiving coil unit. Fig.60 (b) means Fig.59 An example of a heat sink for a feeding coil portion is shown in FIG. Fig.59 In the embodiment shown, the drive system 340d is not used. Fig.28 The embodiments shown are identical.

[0309] Including Fig.28 and Fig.59 In various embodiments of the embodiments shown respectively, Fig.60 As shown in (b), the heat sink 134 includes a plurality of fins 134f. The plurality of fins 134f and the plurality of gaps are arranged alternately and in parallel with each other. Fig.60 As shown in (a), the heat sink 144 includes a plurality of fins 144f. The plurality of fins 144f and the plurality of gaps are arranged alternately and in parallel with each other.

[0310] exist Fig.28 and Fig.59 In the respective embodiments shown, the fan 130f is an air supply fan. Fig.59As shown by the arrow in the middle, it is possible to form an airflow that reaches the outside of the feeding coil unit 130 from the plurality of vent holes 130gh through the plurality of gaps alternately formed with the plurality of fins 134f. Fig.59 As shown by the arrow in the middle, the fan 130f can form an airflow that passes through the space between the feeding coil 131 and the insulating plate 130i and reaches the outside of the feeding coil unit 130 from the plurality of vents 130gh. As a result, the feeding coil 131 and the ferrite component 135 are cooled. In addition, the fan 130f can also be an exhaust fan. In the case where the fan 130f is an exhaust fan, it can form an airflow in the feeding coil unit 130 that is similar to the airflow in the feeding coil unit 130. Fig.59 The airflow is in the opposite direction to the airflow indicated by the arrow.

[0311] exist Fig.28 and Fig.59 In the respective embodiments shown, the fan 140f is an air supply fan. Fig.59 As shown by the middle arrow, it is possible to form an airflow that reaches the outside of the power receiving coil unit 140 from the plurality of vent holes 140gh through the plurality of gaps alternately formed with the plurality of fins 144f. Fig.59 As shown by the arrow in the middle, the fan 140f can form an airflow that passes through the space between the power receiving coil 141 and the insulating plate 140i and reaches the outside of the power receiving coil unit 140 from the plurality of vents 140gh. As a result, the power receiving coil 141 and the ferrite component 145 are cooled. In addition, the fan 140f can also be an exhaust fan. In the case where the fan 140f is an exhaust fan, it can form an airflow in the power receiving coil unit 140 that is in contact with the insulating plate 140i. Fig.59 The airflow is in the opposite direction to the airflow indicated by the arrow.

[0312] Fig.61 FIG. 1 is a diagram showing a power feeding coil unit and a power receiving coil unit according to another exemplary embodiment. Fig.61 The embodiment shown, from relative to Fig.59 The embodiments are described from different perspectives.

[0313] exist Fig.61 In the illustrated embodiment, some of the plurality of vent holes 130gh are formed in the back wall 130gb. The fan 130f is provided along the back wall 130gb on the outside of the metal housing 130g. The heat sink 134, the ferrite component 135, the heat conducting sheet 136 and the feed coil 131 provide a first gas flow path connecting the space between the feed coil 131 and the insulating plate 130i and the plurality of vent holes 130gh of the back wall 130gb.

[0314] In addition, Fig.61In the illustrated embodiment, some of the plurality of vent holes 140gh are formed in the back wall 140gb. The fan 140f is provided along the back wall 140gb on the outside of the metal housing 140g. The heat sink 144, the ferrite component 145, the heat conducting sheet 146 and the power receiving coil 141 provide a second gas flow path connecting the space between the power receiving coil 141 and the insulating plate 140i and the plurality of vent holes 140gh of the back wall 140gb.

[0315] exist Fig.61 In the embodiment shown, the fan 130f is an air supply fan. Fig.61 As shown by the arrow in the middle, it is possible to form an airflow from the plurality of vent holes 130gh of the side wall 130gs to the outside of the feeding coil unit 130 through the plurality of gaps alternating with the plurality of fins 134f. Fig.61 As shown by the arrows in the figure, the fan 130f can form an airflow from the plurality of vents 130gh of the side wall 130gs through the first gas flow path and the space between the feeding coil 131 and the insulating plate 130i to the outside of the feeding coil unit 130. As a result, the feeding coil 131 and the ferrite component 135 are cooled. In addition, the fan 130f can also be an exhaust fan. In the case where the fan 130f is an exhaust fan, it can form an airflow in the feeding coil unit 130 that is similar to the air flow in the feeding coil unit 130. Fig.61 The airflow is in the opposite direction to the airflow indicated by the arrow.

[0316] exist Fig.61 In the embodiment shown, the fan 140f is an air supply fan. Fig.61 As shown by the middle arrow, an airflow can be formed to reach the outside of the power receiving coil unit 140 from the plurality of vent holes 140gh of the side wall 140gs through the plurality of gaps alternating with the plurality of fins 144f. Fig.61 As shown by the arrow in the figure, the fan 140f can form an airflow from the plurality of vents 140gh of the side wall 140gs through the second gas flow path and the space between the power receiving coil 141 and the insulating plate 140i to the outside of the power receiving coil unit 140. As a result, the power receiving coil 141 and the ferrite component 145 are cooled. In addition, the fan 140f can also be an exhaust fan. In the case where the fan 140f is an exhaust fan, it can form an airflow in the power receiving coil unit 140 that is similar to the air flow in the power receiving coil unit 140. Fig.61 The airflow is in the opposite direction to the airflow indicated by the arrow.

[0317] Fig.62 FIG. 1 is a diagram showing a power feeding coil unit and a power receiving coil unit according to another exemplary embodiment. Fig.62 The embodiment shown, from relative to Fig.29 The different aspects of the embodiments shown are described in detail. Fig.62In the embodiment shown, the drive system 340d is not used. Fig.62 In the illustrated embodiment, the front end of the side wall portion 1353 extends to the insulating plate 34i, and the front end of the side wall portion 1353 and the front end of the side wall portion 1454 face each other with the insulating plate 34i interposed therebetween. Fig.62 Other structures and Fig.29 The corresponding structures of the illustrated embodiments are identical.

[0318] exist Fig.62 In the illustrated embodiment, in order to form the airflow indicated by the arrow, a plurality of vents are formed in the side wall portion 1353 of the ferrite member 135 and the heat conducting sheet 137. In addition, in order to form the airflow indicated by the arrow, a plurality of vents are formed in the side wall portion 1454 of the ferrite member 145 and the heat conducting sheet 147. The plurality of vents in the side wall portion 1353 and the side wall portion 1454 are each small in size in order to ensure the sealing effect of the magnetic flux in the side wall portion 1353 and the side wall portion 1454.

[0319] exist Fig.62 In the embodiment shown, the fan 130f is an air supply fan. Fig.62 As shown by the arrow in the middle, it is possible to form an airflow that reaches the outside of the feeding coil unit 130 from the plurality of vent holes 130gh through the plurality of gaps alternately formed with the plurality of fins 134f. Fig.62 As shown by the middle arrow, the fan 130f can form an airflow from the plurality of air holes 130gh to the outside of the feeding coil unit 130 through the plurality of air holes of the side wall portion 1353 and the heat conducting sheet 137 and the space between the feeding coil 131 and the insulating plate 34i. As a result, the feeding coil 131 and the ferrite component 135 are cooled. In addition, the fan 130f can also be an exhaust fan. In the case where the fan 130f is an exhaust fan, it can form an airflow in the feeding coil unit 130 that is in contact with the heat conducting sheet 137. Fig.62 The airflow is in the opposite direction to the airflow indicated by the arrow.

[0320] exist Fig.62 In the embodiment shown, the fan 140f is an air supply fan. Fig.62 As shown by the middle arrow, it is possible to form an airflow from the plurality of vent holes 140gh to the outside of the power receiving coil unit 140 via the plurality of gaps alternately formed with the plurality of fins 144f. Fig.62As shown by the middle arrow, the fan 140f can form an airflow from the multiple vents 140gh through the multiple vents of the side wall portion 1454 and the heat conducting sheet 147, and the space between the power receiving coil 141 and the insulating plate 34i to the outside of the power receiving coil portion 140. As a result, the power receiving coil 141 and the ferrite component 145 are cooled. In addition, the fan 140f can also be an exhaust fan. In the case where the fan 140f is an exhaust fan, it can form an airflow in the power receiving coil portion 140. Fig.62 The airflow is in the opposite direction to the airflow indicated by the arrow.

[0321] Fig.63 FIG. 1 is a diagram showing a power feeding coil unit and a power receiving coil unit according to another exemplary embodiment. Fig.63 The embodiment shown, from relative to Fig.62 The embodiments are described from different perspectives.

[0322] exist Fig.63 In the illustrated embodiment, some of the plurality of vents 130gh are formed in the back wall 130gb. The fan 130f is provided along the back wall 130gb on the outside of the metal housing 130g. The heat sink 134, the ferrite component 135, the heat conducting sheet 136 and the feed coil 131 provide a first gas flow path connecting the space between the feed coil 131 and the insulating plate 34i and the plurality of vents 130gh of the back wall 130gb.

[0323] In addition, Fig.63 In the illustrated embodiment, some of the plurality of vent holes 140gh are formed in the back wall 140gb. The fan 140f is provided along the back wall 140gb on the outside of the metal housing 140g. The heat sink 144, the ferrite component 145, the heat conducting sheet 146 and the power receiving coil 141 provide a second gas flow path connecting the space between the power receiving coil 141 and the insulating plate 34i and the plurality of vent holes 140gh of the back wall 140gb.

[0324] exist Fig.63 In the embodiment shown, the fan 130f is an air supply fan. Fig.63 As shown by the arrow in the middle, it is possible to form an airflow from the plurality of vent holes 130gh of the side wall 130gs to the outside of the feeding coil unit 130 through the plurality of gaps alternating with the plurality of fins 134f. Fig.63As shown by the middle arrow, the fan 130f can form an airflow from the multiple vents 130gh of the side wall 130gs through the first gas flow path, the space between the feeding coil 131 and the insulating plate 34i, and the multiple vents of the side wall 1353 and the heat conduction sheet 137 to the outside of the feeding coil unit 130. As a result, the feeding coil 131 and the ferrite component 135 are cooled. In addition, the fan 130f can also be an exhaust fan. In the case where the fan 130f is an exhaust fan, it can form an airflow in the feeding coil unit 130 that is similar to the air flow path of the first gas flow path, the space between the feeding coil 131 and the insulating plate 34i, and the multiple vents of the side wall 1353 and the heat conduction sheet 137. Fig.63 The airflow is in the opposite direction to the airflow indicated by the arrow.

[0325] exist Fig.63 In the embodiment shown, the fan 140f is an air supply fan. Fig.63 As shown by the arrow in the middle, it is possible to form an airflow from the plurality of vent holes 140gh of the side wall 140gs to the outside of the power receiving coil unit 140 through the plurality of gaps alternately formed with the plurality of fins 144f. Fig.63 As shown by the arrow in the middle, an airflow can be formed to reach the outside of the power receiving coil unit 140 from the multiple air holes 140gh of the side wall 140gs via the second gas flow path, the space between the power receiving coil 141 and the insulating plate 34i, and the multiple air holes of the side wall 1454 and the heat conducting sheet 147. As a result, the power receiving coil 141 and the ferrite component 145 are cooled. In addition, the fan 140f can also be an exhaust fan. In the case where the fan 140f is an exhaust fan, a gas flow that is in contact with the power receiving coil unit 140 can be formed. Fig.63 The airflow is in the opposite direction to the airflow indicated by the arrow.

[0326] Fig.64 It is a diagram showing a power feeding coil unit and a power receiving coil unit according to still another exemplary embodiment. Fig.64 The embodiment shown is similar to the embodiment shown in FIG. 1 except that the inner ferrite component 348 is not used. Fig.43 The embodiment shown is the same. Fig.64 In the illustrated embodiment, in order to form airflow as indicated by arrows, a plurality of vent holes are formed in the side wall portion 3453 of the ferrite member 345 and the heat conducting sheet 347. The plurality of vent holes in the side wall portion 3453 have a small size in order to ensure the sealing effect of the magnetic flux in the side wall portion 3453.

[0327] exist Fig.64 In the embodiment shown, the fan 340f is an air supply fan. Fig.64 As shown by the arrow in the middle, it is possible to form an airflow that reaches the outside of the feeding coil unit 130 from the plurality of vent holes 340gh through the plurality of gaps alternately formed with the plurality of fins 134f of the heat sink 134. Fig.64As shown by the middle arrow, it is possible to form an airflow that reaches the outside of the power receiving coil unit 140 from the plurality of vent holes 340gh through the plurality of gaps that alternate with the plurality of fins 144f of the heat sink 144. Fig.64 As shown by the arrow in the middle, the fan 340f can form an airflow from the multiple air vents 340gh to the outside of the feeding coil unit 130 and the receiving coil unit 140 through the multiple air vents of the side wall portion 3453 and the heat conduction sheet 347 and the space between the feeding coil 131 and the receiving coil 141. As a result, the feeding coil 131, the ferrite component 345 and the receiving coil 141 are cooled. In addition, the fan 340f can also be an exhaust fan. In the case where the fan 340f is an exhaust fan, it can form an airflow in the feeding coil unit 130 and the receiving coil unit 140. Fig.64 The airflow is in the opposite direction to the airflow indicated by the arrow.

[0328] Fig.65 FIG. 1 is a diagram showing a power feeding coil unit and a power receiving coil unit according to another exemplary embodiment. Fig.65 The embodiment shown, from relative to Fig.64 The embodiments are described from different perspectives.

[0329] exist Fig.65 In the illustrated embodiment, some of the plurality of vent holes 340gh are formed in the first rear wall 340g1 and the second rear wall 340g2. Fig.65 In the illustrated embodiment, the fan 130f is disposed outside the metal housing 340g along the first rear wall 340g1. In addition, the fan 140f is disposed outside the metal housing 340g along the second rear wall 340g2.

[0330] exist Fig.65 In the embodiment of the present invention, the heat sink 134, the back surface 3451 of the ferrite component 345, the heat conducting sheet 136, and the power feeding coil 131 provide a first gas flow path connecting the space between the power feeding coil 131 and the power receiving coil 141 to the plurality of vents 340gh of the first back surface wall 340g1. In addition, the heat sink 144, the back surface 3452 of the ferrite component 345, the heat conducting sheet 146, and the power receiving coil 141 provide a second gas flow path connecting the space between the power feeding coil 131 and the power receiving coil 141 to the plurality of vents 340gh of the second back surface wall 340g2.

[0331] exist Fig.65 In the embodiment shown, the fan 130f is an air supply fan. Fig.65 As shown by the middle arrow, it is possible to form an airflow from the plurality of vent holes 130gh of the side wall 340g3 to the outside of the feeding coil unit 130 through the plurality of gaps alternating with the plurality of fins 134f. Fig.65As shown by the middle arrow, the fan 130f can form an airflow from the multiple vents 340gh of the side wall 340g3 through the first gas flow path, the space between the feeding coil 131 and the receiving coil 141, and the multiple vents of the side wall 3453 and the heat conduction sheet 347 to the outside of the feeding coil unit 130. As a result, the feeding coil 131 and the ferrite component 345 are cooled. In addition, the fan 130f can also be an exhaust fan. In the case where the fan 130f is an exhaust fan, it can form an airflow in the feeding coil unit 130 that is similar to the air flow path of the first gas flow path, the space between the feeding coil 131 and the receiving coil 141, and the multiple vents of the side wall 3453 and the heat conduction sheet 347. Fig.65 The airflow is in the opposite direction to the airflow indicated by the arrow.

[0332] exist Fig.65 In the embodiment shown, the fan 140f is an air supply fan. Fig.65 As shown by the arrow in the middle, it is possible to form an airflow from the plurality of vent holes 340gh of the side wall 340g3 to the outside of the power receiving coil unit 140 through the plurality of gaps alternately formed with the plurality of fins 144f. Fig.65 As shown by the arrow in the middle, an airflow can be formed to reach the outside of the power receiving coil unit 140 from the multiple air holes 340gh of the side wall 340g3 through the second gas flow path, the space between the power receiving coil 141 and the power feeding coil 131, and the multiple air holes of the side wall portion 3453 and the heat conducting sheet 347. As a result, the power receiving coil 141 and the ferrite component 345 are cooled. In addition, the fan 140f can also be an exhaust fan. In the case where the fan 140f is an exhaust fan, a gas flow that is similar to that of the fan 140f can be formed in the power receiving coil unit 140. Fig.65 The airflow is in the opposite direction to the airflow indicated by the arrow.

[0333] Fig.66 (a) is a cross-sectional view of a coil portion of another exemplary embodiment, Fig.66 (b) means Fig.66 (a) is a plan view of a cooling plate in a coil portion. Fig.66 The coil unit 500 shown in (a) can be used as at least one of the power feeding coil unit 130 and the power receiving coil unit 140 .

[0334] like Fig.66 As shown in (a), the coil portion 500 includes a metal shell 500g, and the fan 500f includes a coil 501, a radiator 504, a ferrite component 505 and a cooling plate 509. The metal shell 500g is used as the metal shell 130g, the metal shell 140g or the metal shell 340g. The opening at the front end of the side wall of the metal shell 500g can be closed by an insulating plate 500i. A plurality of vents 500gh such as a plurality of vents 130gh, 140gh or 340gh are formed in the metal shell 500g. In addition, the fan 500f is used as the fan 130f, 140f or 340f.

[0335] The coil 501 serves as the feeding coil 131 in the feeding coil section 130 and as the receiving coil 141 in the receiving coil 141. The heat sink 504 serves as the heat sink 134 in the feeding coil section 130 and as the heat sink 144 in the receiving coil 141. The ferrite member 505 is provided between the heat sink 504 and the coil 501.

[0336] The cooling plate 509 is provided between the ferrite component 505 and the coil 501. The cooling plate 509 may be in contact with one or both of the ferrite component 505 and the coil 501. The cooling plate 509 is a hollow plate, and a refrigerant is stored in a space 509h inside the cooling plate 509. The coil 501 and the ferrite component 505 are cooled by the cooling plate 509. Fig.66 In the example of (a), the outer diameter of the cooling plate 509 is the same as the outer diameter of the coil 501, but the outer diameter of the space 509h may be the same as the outer diameter of the coil 501. In this case, the outer diameter of the cooling plate 509 is larger than the outer diameter of the coil 501. In addition, the cooling plate 509 may be formed of an insulating member such as ceramic. In addition, the refrigerant is a fluid and may be a dielectric. The refrigerant may include at least one selected from water, salt water and air.

[0337] Fig.67 is a cross-sectional view of a coil portion according to still another exemplary embodiment. Fig.68 Yes means Fig.67 The following is a diagram of two cooling plates in the coil section. Fig.67 The coil portion shown is from relative to Fig.66 The following will describe the differences of the coil portion shown in (a).

[0338] Fig.67 The coil portion 500 shown includes two cooling plates 509a and 509b instead of the cooling plate 509. The cooling plates 509a and 509b are arranged on the back side of the coil 501. The ferrite component 505 is arranged between the cooling plate 509b and the coil 501. The cooling plate 509b may be in contact with the ferrite component 505. The cooling plate 509a is arranged between the ferrite component 505 and the coil 501. The cooling plate 509a may be in contact with one or both of the ferrite component 505 and the coil 501.

[0339] like Fig.68 As shown, the cooling plate 509a has a refrigerant flow path 509af inside thereof. In addition, the cooling plate 509b has a refrigerant flow path 509bf inside thereof.

[0340] A cooling unit 500c is provided outside the coil portion 500. The cooling unit 500c supplies refrigerant to the refrigerant flow paths 509af and 509bf, and recovers the refrigerant from the refrigerant flow paths 509af and 509bf. The coil 501 and the ferrite component 505 are cooled by cooling plates 509a and 509b. In addition, the refrigerant is a fluid and may be a dielectric. The refrigerant may include at least one selected from water, brine and air. In one embodiment, the cooling unit 500c may be connected to the inlet of the refrigerant flow path 509af. In addition, the outlet of the refrigerant flow path 509af may be connected to the inlet of the refrigerant flow path 509bf. Moreover, the outlet of the refrigerant flow path 509bf may be connected to the cooling unit 500c.

[0341] Fig.69 FIG. 1 is a diagram showing a power feeding coil unit and a power receiving coil unit according to another exemplary embodiment. Fig.69 An exemplary embodiment of Fig.64 The embodiments are described from different perspectives.

[0342] exist Fig.69 In the exemplary embodiment, a cooling plate 509b is provided between the feeding coil 131 and the back surface 3451 of the ferrite component 345 instead of the heat conducting sheet 136. The cooling plate 509b may be in contact with one or both of the feeding coil 131 and the back surface 3451 of the ferrite component 345. In addition, a cooling plate 509a is provided between the receiving coil 141 and the back surface 3452 of the ferrite component 345 instead of the heat conducting sheet 146. The cooling plate 509a may be in contact with one or both of the receiving coil 141 and the back surface 3452 of the ferrite component 345.

[0343] The cooling plate 509a has a refrigerant flow path 509af therein (see Fig.68 ). In addition, the cooling plate 509b has a refrigerant flow path 509bf inside thereof (see Fig.68 ).

[0344] A cooling unit 500c is provided outside the power feeding coil unit 130 and the power receiving coil unit 140. The cooling unit 500c supplies refrigerant to the refrigerant flow paths 509af and 509bf, and recovers refrigerant from the refrigerant flow paths 509af and 509bf. The power feeding coil 131, the ferrite component 345, and the power receiving coil 141 are cooled by the cooling plates 509a and 509b. In addition, the refrigerant is a fluid and may be a dielectric. The refrigerant may contain at least one selected from water, brine, and air. In one embodiment, the cooling unit 500c may be connected to the inlet of the refrigerant flow path 509af. In addition, the outlet of the refrigerant flow path 509af may be connected to the inlet of the refrigerant flow path 509bf. Moreover, the outlet of the refrigerant flow path 509bf may be connected to the cooling unit 500c.

[0345] [Exemplary Embodiments of Power Feeding Coil and Power Receiving Coil]

[0346] Below, refer to Fig.70 (a)~ Fig.81 (b) of the present invention describes various exemplary embodiments of the coil 501 that can be used as the feeding coil 131 and the receiving coil 141, respectively. The inner diameter of the coil 501 of each of the various exemplary embodiments can be less than 150 mm, and the outer diameter can be less than 350 mm. In addition, in order to achieve a high coupling coefficient, the winding direction of the feeding coil 131 and the winding direction of the receiving coil 141 can be opposite to each other.

[0347] Fig.70 (a) is a cross-sectional view of a coil according to an exemplary embodiment, Fig.70 (b) is a cross-sectional view of a wire material of a coil according to an exemplary embodiment. Fig.70 (a) and Fig.70 The wire 521 of the coil 501 shown in (b) is wound around the central axis of the coil 501 from the inside to the outside in a manner of forming a single layer. The wire 521 is composed of a plurality of stacked wires 522 and has a rectangular cross-sectional shape. The plurality of wires 522 are respectively flat wires. The plurality of wires 522 are bundled into layers in a direction from the inside of the coil 501 toward the outside. Each of the plurality of wires 522 may be covered with an insulating film such as polyurethane.

[0348] Fig.71 (a) is a cross-sectional view of a coil according to another exemplary embodiment, Fig.71 (b) is a cross-sectional view of a wire material of a coil according to another exemplary embodiment. Fig.71 (a) and Fig.71 The coil 501 shown in (b) is from relative to Fig.70 (a) and Fig.70The following describes the different points of view of the coil 501 shown in (b). Fig.71 (a) and Fig.71 In the coil 501 shown in (b), the plurality of wires 522 constituting the wire 521 are rectangular wires. Fig.71 (a) and Fig.71 In the coil 501 shown in (b) , a plurality of wires 522 constituting a wire 521 are bundled in a layered manner along the thickness direction of the coil 501 .

[0349] Fig.72 (a) is a cross-sectional view of a coil according to another exemplary embodiment, Fig.72 (b) is a cross-sectional view of a wire material of a coil according to another exemplary embodiment. Fig.72 (a) and Fig.72 The coil 501 shown in (b) is from relative to Fig.70 (a) and Fig.70 The following describes the different points of view of the coil 501 shown in (b). Fig.72 (a) and Fig.72 In the coil 501 shown in (b), the plurality of wires 522 constituting the wire 521 have a rectangular cross-sectional shape. The plurality of wires 522 are arranged two-dimensionally in a direction from the inside to the outside of the coil 501 and in a thickness direction of the coil 501 so as to be in close contact with each other.

[0350] exist Fig.70 (a)~ Fig.72 In each of the various coils 501 shown in (b), the wire 521 is composed of a plurality of wires 522 and has a larger cross-sectional area than a single-wire wire having a circular cross-sectional shape. Therefore, each of these coils 501 has a high inductance. In addition, the wire 521 is composed of a plurality of wires 522, and therefore, the AC resistance component of the coil 501 is smaller than the AC resistance component of the coil composed of a single-wire wire.

[0351] Fig.73 (a) is a cross-sectional view of a coil according to another exemplary embodiment, Fig.73 (b) is a cross-sectional view of a wire material of a coil according to another exemplary embodiment. Fig.73 (a) and Fig.73 The coil 501 shown in (b) is from relative to Fig.70 (a) and Fig.70 The following describes the differences of the coil 501 shown in (b).

[0352] exist Fig.73 (a) and Fig.73In the coil 501 shown in (b), the wire 521 is a Litz wire, and has a plurality of wires 522. The plurality of wires 522 constituting the wire 521 have a rectangular cross-sectional shape. The plurality of wires 522 are arranged two-dimensionally in a manner close to each other along the direction from the inside to the outside of the coil 501 and the thickness direction of the coil 501. The insulating coating of the wire 521 is formed, for example, of polyester fiber.

[0353] exist Fig.73 (a) and Fig.73 In the coil 501 shown in (b), the wire 521 is composed of a plurality of wires 522 and has a larger cross-sectional area than a general Litz wire. Therefore, each of these coils 501 has a high inductance. In addition, a general Litz wire has a circular cross-sectional shape, and the plurality of wires constituting the Litz wire also have a circular cross-sectional shape. In addition, Fig.73 (a) and Fig.73 The coil 501 shown in (b) has a larger cross-sectional area than a general Litz wire, and therefore can have a larger number of wires than a general Litz wire. Therefore, the AC resistance component of the coil 501 is smaller than the AC resistance component of a coil made of a general Litz wire.

[0354] In addition, according to Fig.73 (a) and Fig.73 The coil 501 shown in (b) can make the deformation amount generated in the wire 521 smaller than the deformation amount generated in the general Litz wire even if the wire 521 is stretched so that the adjacent turns of the wire 521 are closely attached and the wire 521 is wound. Fig.73 (a) and Fig.73 The coil 501 shown in (b) can suppress a part of the multiple turns of the wire 521 from floating in the thickness direction of the coil 501 relative to the other turns.

[0355] Fig.74 (a) and Fig.74 (b) are plan views of coils according to yet another exemplary embodiment. Fig.75 (a) and Fig.75 (b) are plan views of coils according to still another exemplary embodiment. The planar shape of the coil 501 is not limited, and as shown in these figures, it can be selected from various shapes.

[0356] like Fig.74 As shown in (a), the planar shape of the coil 501 may be annular, and the wire 521 may be wound into a spiral shape around the central axis of the coil 501. Fig.74 As shown in (b), the planar shape of the coil 501 can be a square ring, and the wire 521 can be wound around the central axis of the coil 501 from the inside to the outside.

[0357] like Fig.75 As shown in (a), the planar shape of the coil 501 may be a combination of a square ring shape and a circular ring shape. The wire 521 is wound around the central axis of the coil 501 from the inside to the outside in a manner that provides a circular ring-shaped portion inside the square ring-shaped portion of the coil 501. Fig.75 As shown in (b), the planar shape of the coil 501 may be a C-shape or a horseshoe shape.

[0358] Fig.76 (a)~ Fig.76 (d) are cross-sectional views of coils according to yet another exemplary embodiment. Fig.76 As shown in (a), the wire 521 of the coil 501 can be wound in such a way that the intervals between turns of the wire 521 in the coil 501 are equal. Fig.76 As shown in (b), the wire 521 of the coil 501 may also be wound in a manner such that the spacing between the turns is unequal. Fig.76 As shown in (c), adjacent turns of the wire 521 of the coil 501 can be in close contact. Fig.76 As shown in (d), the wire 521 of the coil 501 can be wound in a manner such that the component 523 is interposed between the turns. The component 523 can be formed of a magnetic material or a dielectric. The height of the component 523 can be the same as or different from the height of the wire 521. The width of the component 523 can be the same as or different from the width of the wire 521.

[0359] Fig.77 (a) and Fig.77 (b) are cross-sectional views of coils according to yet another exemplary embodiment. Fig.77 (a) and Fig.77 As shown in (b), in the coil 501, the wire 521 can be wound in a manner to form a plurality of layers. The plurality of layers can be as follows Fig.77 The separation can be as shown in (a) or as Fig.77 (b) as shown in FIG.

[0360] Fig.78 (a) and Fig.78 (b) are cross-sectional views of coils according to yet another exemplary embodiment. Fig.78 (a) and Fig.78 As shown in (b), the cross-sectional shape of the coil 501 may have a convex shape or a concave shape. For example, the cross-sectional shape of the coil 501 may be a cone or a dome.

[0361] Fig.79 FIG. 4 is a cross-sectional view of a coil according to another exemplary embodiment. Fig.79As shown, in the coil 501, the wire 521 can be wound in a manner of forming a plurality of layers. In at least one of the plurality of layers, the wire 521 can be wound in a manner of having a component 523 between turns. The component 523 can be formed of a magnetic material or a dielectric. The height of the component 523 can be the same as or different from the height of the wire 521. The width of the component 523 can be the same as or different from the width of the wire 521.

[0362] Fig.80 is a cross-sectional view of a coil according to yet another exemplary embodiment. Fig.81 (a) and Fig.81 (b) and (c) are cross-sectional views of a coil according to another exemplary embodiment. As shown in these figures, in the coil 501, the wire 521 can be wound into a spiral shape. The spacing between the turns of the wire 521 can be equal or unequal. Fig.80 As shown, adjacent turns of wire 521 can be close together. Fig.81 (a) and Fig.81 As shown in (b), adjacent turns of the wire 521 may also be separated. Fig.81 As shown in (b), the wire 521 can be fixed by a comb-shaped component 524. Component 524 can be formed of an insulating material, such as a resin such as PEEK or PPS. Alternatively, component 524 can also be formed of a magnetic material. Component 524 can be composed of a single component or a plurality of components.

[0363] Various exemplary embodiments have been described above, but the present invention is not limited to the exemplary embodiments described above, and various additions, omissions, substitutions, and changes may be made. In addition, elements in different embodiments may be combined to form other embodiments.

[0364] Here, various exemplary embodiments included in the present invention are described in the following [E1] to [E12].

[0365] [E1]

[0366] A plasma processing device, characterized in that it comprises:

[0367] a plasma processing chamber;

[0368] a substrate support disposed within the plasma processing chamber;

[0369] A high frequency power source capable of generating high frequency electrical power;

[0370] an electrode or antenna electrically connected to the high frequency power source and capable of receiving the high frequency electric power to generate plasma from a gas in the plasma processing chamber;

[0371] an electric power consumption component disposed in the plasma processing chamber or in the substrate support;

[0372] an electric storage unit electrically connected to the electric power consumption component;

[0373] A feeding coil disposed outside the plasma processing chamber;

[0374] a power receiving coil electrically connected to the power storage unit and capable of receiving electric power from the power feeding coil through electromagnetic induction coupling; and

[0375] At least one driving system is capable of moving at least one of the power feeding coil and the power receiving coil to change the distance between the power feeding coil and the power receiving coil.

[0376] [E2]

[0377] The plasma processing device according to E1 is characterized in that it also includes:

[0378] at least one metal housing capable of providing a shielded space and accommodating the feeding coil and the receiving coil in the shielded space; and

[0379] At least one ferrite member arranged in the shielding space is provided so as to close the space in which the power feeding coil and the power receiving coil are arranged.

[0380] [E3]

[0381] The plasma processing device according to E2 is characterized in that:

[0382] The at least one metal housing comprises:

[0383] a first metal casing extending on the rear side of the power feeding coil relative to the power receiving coil and surrounding the outer periphery of the power feeding coil; and

[0384] The second metal casing extends on the rear side of the power receiving coil relative to the power feeding coil and surrounds the outer periphery of the power receiving coil.

[0385] [E4]

[0386] The plasma processing device according to E2 is characterized in that: the at least one metal shell is a single shell capable of providing the shielding space, extending on the back side of the feeding coil relative to the receiving coil, extending on the back side of the receiving coil relative to the feeding coil, and surrounding the outer periphery of the feeding coil and the outer periphery of the receiving coil.

[0387] [E5]

[0388] The plasma processing device according to E3 is characterized in that:

[0389] The at least one ferrite component comprises:

[0390] a first back surface portion disposed on the back surface side of the feeding coil;

[0391] a first side wall portion extending from the first back surface portion so as to surround an outer circumference of the feeding coil;

[0392] a second back surface portion provided on the back surface side of the power receiving coil; and

[0393] a second side wall portion extending from the second back surface portion so as to surround the outer circumference of the power receiving coil,

[0394] One of the first side wall portion and the second side wall portion extends outside the other of the first side wall portion and the second side wall portion,

[0395] The feeding coil, the first back portion and the first side wall portion constitute a feeding coil assembly.

[0396] The power receiving coil, the second back surface portion and the second side wall portion constitute a power receiving coil assembly.

[0397] The at least one drive system is capable of moving at least one of the power feeding coil assembly and the power receiving coil assembly.

[0398] [E6]

[0399] The plasma processing device according to E5 is characterized in that: the at least one driving system is capable of moving at least one of the feeding coil assembly and the receiving coil assembly in a manner such that one of the first side wall portion and the second side wall portion moves along the outer peripheral surface of the other of the first side wall portion and the second side wall portion.

[0400] [E7]

[0401] The plasma processing device according to E4 is characterized in that:

[0402] The at least one ferrite component comprises:

[0403] a first back surface portion disposed on the back surface side of the feeding coil;

[0404] a first side wall portion extending from the first back surface portion so as to surround an outer circumference of the feeding coil;

[0405] a second back surface portion provided on the back surface side of the power receiving coil; and

[0406] a second side wall portion extending from the second back surface portion so as to surround the outer circumference of the power receiving coil,

[0407] One of the first side wall portion and the second side wall portion extends outside the other of the first side wall portion and the second side wall portion,

[0408] The feeding coil, the first back portion and the first side wall portion constitute a feeding coil assembly.

[0409] The power receiving coil, the second back surface portion and the second side wall portion constitute a power receiving coil assembly.

[0410] The at least one drive system is capable of moving at least one of the power feeding coil assembly and the power receiving coil assembly.

[0411] [E8]

[0412] The plasma processing device according to E7 is characterized in that: the at least one driving system is capable of moving at least one of the feeding coil assembly and the receiving coil assembly in a manner such that the one of the first side wall portion and the second side wall portion moves along the outer peripheral surface of the other of the first side wall portion and the second side wall portion.

[0413] [E9]

[0414] The plasma processing device according to E4 is characterized in that:

[0415] The at least one ferrite component comprises:

[0416] a first back surface portion disposed on the back surface side of the feeding coil;

[0417] a second back surface portion provided on the back surface side of the power receiving coil; and

[0418] a side wall portion extending from one of the first back side portion and the second back side portion and surrounding the power feeding coil, the power receiving coil, and the other of the first back side portion and the second back side portion,

[0419] The feeding coil and the first back portion constitute a feeding coil assembly,

[0420] The power receiving coil and the second back surface portion constitute a power receiving coil assembly.

[0421] The at least one drive system is capable of moving at least one of the power feeding coil assembly and the power receiving coil assembly.

[0422] [E10]

[0423] The plasma processing device according to E4 is characterized in that:

[0424] The at least one ferrite component comprises:

[0425] a first back surface portion disposed on the back surface side of the feeding coil;

[0426] a second back surface portion provided on the back surface side of the power receiving coil; and

[0427] a side wall portion surrounding the power feeding coil, the power receiving coil, the first back surface portion, and the second back surface portion,

[0428] The feeding coil and the first back portion constitute a feeding coil assembly,

[0429] The power receiving coil and the second back surface portion constitute a power receiving coil assembly.

[0430] The at least one driving system is capable of moving at least one of the power feeding coil assembly and the power receiving coil assembly in a region surrounded by the side wall portion.

[0431] [E11]

[0432] The plasma processing apparatus according to any one of E2 to E10, wherein the at least one ferrite component includes at least one inner ferrite component extending from an area inside the power receiving coil to an area inside the power receiving coil.

[0433] [E12]

[0434] The plasma processing apparatus according to any one of E1 to E11, characterized in that it further comprises: at least one variable capacitor connected to the power feeding coil, which is used to form a resonant circuit with the power feeding coil for the transmission frequency of the electric power transmitted between the power feeding coil and the power receiving coil; and

[0435] At least one variable capacitor connected to the power receiving coil is used to form a resonance circuit with the power receiving coil for the transmission frequency.

[0436] It should be understood from the above description that the various embodiments of the present invention are described in this specification for the purpose of illustration, and various changes can be made without departing from the scope and spirit of the present invention. Therefore, the various embodiments disclosed in this specification are not intended to be limited, and the true scope and spirit are represented by the attached claims.

[0437] Description of Reference Numerals

[0438] 1… plasma processing apparatus, 10… chamber, 11… substrate supporting portion, 110… ground frame, 120… power feeding portion, 130… power feeding coil portion, 130g… metal casing, 131… power feeding coil, 135… ferrite component, 140… power receiving coil portion, 140g… metal casing, 141… power receiving coil, 145… ferrite component, 150… rectifying and smoothing portion, 160… power storage portion, 170… voltage control converter, 180… constant voltage control portion, 240… power consumption component, 300… high frequency power supply, 340d… driving system.

Claims

1. A plasma processing device, characterized in that: include: a plasma processing chamber; a substrate support disposed within the plasma processing chamber; A high frequency power source capable of generating high frequency electrical power; an electrode or antenna electrically connected to the high frequency power source and capable of receiving the high frequency electric power to generate plasma from a gas in the plasma processing chamber; an electric power consumption component disposed in the plasma processing chamber or in the substrate support; an electric storage unit electrically connected to the electric power consumption component; A feeding coil disposed outside the plasma processing chamber; a power receiving coil electrically connected to the power storage unit and capable of receiving electric power from the power feeding coil through electromagnetic induction coupling; and At least one driving system is capable of moving at least one of the power feeding coil and the power receiving coil to change the distance between the power feeding coil and the power receiving coil.

2. The plasma processing device according to claim 1, characterized in that: Also includes: at least one metal shell, which can provide a shielding space and accommodate the feeding coil and the receiving coil in the shielding space; and At least one ferrite member arranged in the shielding space is provided so as to close the space in which the power feeding coil and the power receiving coil are arranged.

3. The plasma processing device according to claim 2, wherein: The at least one metal housing comprises: a first metal casing extending on the rear side of the power feeding coil relative to the power receiving coil and surrounding the outer periphery of the power feeding coil; and The second metal casing extends on the rear side of the power receiving coil relative to the power feeding coil and surrounds the outer periphery of the power receiving coil.

4. The plasma processing apparatus according to claim 2, wherein: The at least one metal casing is a single casing capable of providing the shielding space, extends on the back side of the feeding coil relative to the receiving coil, extends on the back side of the receiving coil relative to the feeding coil, and surrounds the outer periphery of the feeding coil and the outer periphery of the receiving coil.

5. The plasma processing apparatus according to claim 3, wherein: The at least one ferrite component comprises: a first back surface portion disposed on the back surface side of the feeding coil; a first side wall portion extending from the first back surface portion so as to surround an outer circumference of the feeding coil; a second back surface portion provided on the back surface side of the power receiving coil; and a second side wall portion extending from the second back surface portion so as to surround the outer circumference of the power receiving coil, One of the first side wall portion and the second side wall portion extends outside the other of the first side wall portion and the second side wall portion, The feeding coil, the first back portion and the first side wall portion constitute a feeding coil assembly. The power receiving coil, the second back surface portion and the second side wall portion constitute a power receiving coil assembly. The at least one drive system is capable of moving at least one of the power feeding coil assembly and the power receiving coil assembly.

6. The plasma processing apparatus according to claim 5, wherein: The at least one driving system can move at least one of the power feeding coil assembly and the power receiving coil assembly so that the one of the first side wall portion and the second side wall portion moves along the outer peripheral surface of the other of the first side wall portion and the second side wall portion.

7. The plasma processing apparatus according to claim 4, wherein: The at least one ferrite component comprises: a first back surface portion disposed on the back surface side of the feeding coil; a first side wall portion extending from the first back surface portion so as to surround an outer circumference of the feeding coil; a second back surface portion provided on the back surface side of the power receiving coil; and a second side wall portion extending from the second back surface portion so as to surround the outer circumference of the power receiving coil, One of the first side wall portion and the second side wall portion extends outside the other of the first side wall portion and the second side wall portion, The feeding coil, the first back portion and the first side wall portion constitute a feeding coil assembly. The power receiving coil, the second back surface portion and the second side wall portion constitute a power receiving coil assembly. The at least one drive system is capable of moving at least one of the power feeding coil assembly and the power receiving coil assembly.

8. The plasma processing apparatus according to claim 7, wherein: The at least one driving system can move at least one of the power feeding coil assembly and the power receiving coil assembly so that the one of the first side wall portion and the second side wall portion moves along the outer peripheral surface of the other of the first side wall portion and the second side wall portion.

9. The plasma processing apparatus according to claim 4, wherein: The at least one ferrite component comprises: a first back surface portion disposed on the back surface side of the feeding coil; a second back surface portion provided on the back surface side of the power receiving coil; and a side wall portion extending from one of the first back side portion and the second back side portion and surrounding the power feeding coil, the power receiving coil, and the other of the first back side portion and the second back side portion, The feeding coil and the first back portion constitute a feeding coil assembly, The power receiving coil and the second back surface portion constitute a power receiving coil assembly. The at least one drive system is capable of moving at least one of the power feeding coil assembly and the power receiving coil assembly.

10. The plasma processing apparatus according to claim 4, wherein: The at least one ferrite component comprises: a first back surface portion disposed on the back surface side of the feeding coil; a second back surface portion provided on the back surface side of the power receiving coil; and a side wall portion surrounding the power feeding coil, the power receiving coil, the first back surface portion, and the second back surface portion, The feeding coil and the first back portion constitute a feeding coil assembly, The power receiving coil and the second back surface portion constitute a power receiving coil assembly. The at least one driving system is capable of moving at least one of the power feeding coil assembly and the power receiving coil assembly in a region surrounded by the side wall portion.

11. The plasma processing apparatus according to any one of claims 2 to 10, characterized in that: The at least one ferrite component includes at least one inner ferrite component extending from a region inside the power reception coil to a region inside the power reception coil.

12. The plasma processing apparatus according to any one of claims 1 to 10, wherein: Also includes: at least one variable capacitor connected to the power feeding coil for constituting a resonance circuit together with the power feeding coil for a transmission frequency of electric power transmitted between the power feeding coil and the power receiving coil; and At least one variable capacitor connected to the power receiving coil is used to form a resonance circuit with the power receiving coil for the transmission frequency.

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