Display module

Abstract

The display module may include: a substrate on which a plurality of substrate electrode pads are disposed, the substrate including a plurality of pixel circuits connected to the plurality of substrate electrode pads; and a plurality of light emitting elements connected to the plurality of substrate electrode pads, in which, among the plurality of pixel circuits, the pixel circuit connected to the light emitting element close to the substrate edge is farther from the substrate edge than the light emitting element close to the substrate edge.

Description

Technical Field

[0001] The present disclosure relates to a display module, which includes a plurality of light emitting diodes and a plurality of pixel circuits for driving the plurality of light emitting diodes. Background Art

[0002] The display panel includes a substrate provided with a plurality of thin film transistors (TFTs) and a plurality of light emitting diodes mounted on the substrate. The plurality of light emitting diodes may be inorganic light emitting diodes that emit light by themselves. The plurality of light emitting diodes present various colors when they operate in units of pixels or sub-pixels. The operation of each pixel or sub-pixel is controlled by a plurality of TFTs. Each light emitting diode emits various colors, such as red, green, or blue. Summary of the invention Technical Solution

[0003] A display module is provided herein, which includes: a substrate on which a plurality of substrate electrode pads are arranged and the substrate includes a plurality of pixel circuits connected to the plurality of substrate electrode pads, wherein the plurality of pixel circuits include a first pixel circuit and a second pixel circuit, and wherein the plurality of substrate electrode pads include a first substrate electrode pad; and a plurality of light-emitting elements connected to the plurality of substrate electrode pads, the plurality of light-emitting elements include a first light-emitting element, wherein the first light-emitting element is electrically connected to the first substrate electrode pad, and the first pixel circuit is configured to control the first light-emitting element, wherein the first pixel circuit is closer to a first edge of the substrate than the second pixel circuit, and the first pixel circuit is farther away from the first edge of the substrate than the first light-emitting element.

[0004] In some embodiments, the substrate includes a plurality of data wirings, the plurality of data wirings are electrically connected to the first pixel circuits, respectively, and the plurality of data wirings are arranged farther from the first edge of the substrate than the first light emitting element.

[0005] In some embodiments, the substrate is a quadrilateral including a first edge, a second edge, a third edge, and a fourth edge.

[0006] In some embodiments, the substrate includes a first edge and a second edge, wherein the second edge is opposite to the first edge, and the plurality of pixel circuits are arranged closer to the second edge than the first light emitting element.

[0007] In some embodiments, the plurality of substrate electrode pads are electrically connected to corresponding pixel circuits through a plurality of connection wirings, respectively.

[0008] In some embodiments, the substrate includes a plurality of layers, and the plurality of data wirings and the plurality of connection wirings are arranged on different layers among the plurality of layers.

[0009] In some embodiments, a plurality of light emitting elements are uniformly arranged on a surface of the substrate, wherein the surface extends along a first direction and a second direction perpendicular to the first direction, and wherein the second pixel circuit controls the second light emitting element.

[0010] In some embodiments, the first edge is susceptible to physical impact during a manufacturing process, and the first pixel circuit further away from the first edge of the substrate than the first light emitting element is configured to reduce damage due to the physical impact.

[0011] In some embodiments, the first light-emitting element, the first pixel circuit, the second pixel circuit, and the second light-emitting element are respectively located at a first position, a second position, a third position, and a third position on a surface defined by a first direction and a second direction, wherein the first edge extends along the second direction, and wherein the first pixel circuit is located at a second position inward from the first position along the first direction.

[0012] In some embodiments, the display module includes a display driver integrated circuit (IC), wherein each of a plurality of layers extends along a first direction and a second direction, the plurality of layers are stacked along a third direction, a second pixel circuit and a second light emitting element are electrically connected to the display driver IC via a third instance of metal wiring stacked along the third direction and a third connecting wiring, a first pixel circuit is electrically connected to the display driver IC via a first instance of metal wiring stacked along the third direction and a first connecting wiring, and the first light emitting element is connected to the first pixel circuit via a third instance of metal wiring stacked along the third direction and a second connecting wiring.

[0013] In some embodiments, the first connection wiring and the second connection wiring are not located in a same layer of the plurality of layers.

[0014] In some embodiments, the first connection wiring and the third connection wiring are located in a same layer of the plurality of layers.

[0015] In some embodiments, the number of layers is four.

[0016] In some embodiments, the first light emitting element includes three sub-pixels, wherein the three sub-pixels correspond to red, green, and blue, respectively.

[0017] In some embodiments, the first light emitting element includes four sub-pixels, wherein the four sub-pixels correspond to red, green, blue, and green, respectively. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a block diagram showing a display device according to one or more embodiments of the present disclosure;

[0019] Figure 2is a plan view showing a display module according to one or more embodiments of the present disclosure;

[0020] Figure 3 Is magnification Figure 2 A diagram of portion A shown in FIG.

[0021] Figure 4 is along Figure 3 The cross-sectional view shown by the line BB' shown in FIG.

[0022] Figure 5 is a schematic cross-sectional view showing multiple layers of a display module according to one or more embodiments of the present disclosure;

[0023] Figure 6 According to some exemplary embodiments, Figure 2 an enlarged view of portion A of ; and

[0024] Figure 7a is with Figure 2 The same information is used for the sake of illustration. Figure 7b Provided together.

[0025] Figure 7b It is a supplement Figure 6 Elevation view of the enlarged plan view. DETAILED DESCRIPTION

[0026] Hereinafter, various embodiments will be described in more detail with reference to the accompanying drawings. The embodiments described in this specification may be modified in various ways. In addition, specific embodiments may be shown in the accompanying drawings and described in detail in the detailed description. However, the specific embodiments disclosed in the accompanying drawings are only for the purpose of making the various embodiments easy to understand. Therefore, the technical ideas of the present disclosure are not limited to the specific embodiments disclosed in the accompanying drawings, and the embodiments should be understood to include all equivalents or substitutes included in the ideas and technical scope of the present disclosure.

[0027] In addition, in the present disclosure, terms including ordinal numbers such as "first" and "second" may be used to describe various components, but these components are not limited by the aforementioned terms. The aforementioned terms are used only for the purpose of distinguishing one component from another.

[0028] In addition, in the present disclosure, terms such as "including" and "having" should be interpreted as indicating the presence of such characteristics, quantities, steps, operations, elements, components or combinations thereof described in the specification, but do not preclude the possibility of the presence or increase of one or more other characteristics, quantities, steps, operations, elements, components or combinations thereof. In addition, the description of an element "coupled to" or "connected to" another element in the present disclosure should be understood to mean that an element can be directly coupled or connected to another element, but another element can also exist between the elements. Conversely, the description of an element "directly coupled" or "directly connected" to another element can be interpreted to mean that there is no other element between the one element and the other element.

[0029] Furthermore, in the present disclosure, the expression “same” not only means that some features completely coincide with each other but also means that these features include differences taking into account a range of processing errors.

[0030] In addition to the above, when describing the present disclosure, if it is determined that the detailed description of related known functions or features may unnecessarily obscure the gist of the present disclosure, the detailed description will be deleted or omitted.

[0031] According to one or more embodiments of the present disclosure, a display module may include a substrate and a plurality of light emitting diodes arranged on the substrate for displaying an image.

[0032] According to one or more embodiments of the present disclosure, the light-emitting diode included in the display module may be an inorganic light-emitting diode having a size of 100 μm or less. For example, the inorganic light-emitting diode may be a micro-LED or a mini-LED, but is not limited thereto. Compared with an organic light-emitting diode (hereinafter referred to as "OLED"), an inorganic light-emitting diode has better brightness and luminous efficiency and a longer life. An inorganic light-emitting diode may be a semiconductor chip that can emit light by itself when power is supplied. Inorganic light-emitting diodes have a faster reaction speed, lower power consumption, and higher brightness. In the case where the inorganic light-emitting diode is a micro-LED, they may have a higher efficiency than LCD or OLED in converting electricity into photons. For example, compared with an LCD or OLED display, a micro-LED may have a higher "brightness per watt". Therefore, compared with an LED or OLED over 100 μm, a micro-LED can play the same brightness with about half the energy. In addition, micro-LEDs can achieve high resolution and excellent color, contrast, and brightness, so they can correctly express a wide range of colors and can achieve a clear screen that is brighter outdoors than indoors. In addition, micro LEDs are not prone to screen burn-in and generate little heat, so they can be guaranteed to have a long life without deformation.

[0033] According to one or more embodiments of the present disclosure, on a substrate, a TFT layer having a thin film transistor (TFT) circuit formed therein may be arranged on a first surface (e.g., the front surface of the substrate). On the substrate, a power supply circuit (which supplies power to the TFT circuit) and a data drive driver, a gate drive driver, and a timing controller (which controls each drive driver) may be arranged on a second surface (e.g., the rear surface of the substrate). In addition, on the substrate, a plurality of pixels may be arranged on the TFT layer. Each pixel may be driven by a TFT circuit.

[0034] According to one or more embodiments of the present disclosure, the TFT formed on the TFT layer may be a low temperature polysilicon (LTPS) TFT, a low temperature polycrystalline oxide (LTPO) TFT, or an oxide TFT.

[0035] According to one or more embodiments of the present disclosure, the substrate provided with the TFT layer may be a glass substrate, a substrate based on a flexible synthetic resin (e.g., polyimide (PI), polyethylene terephthalate (PET), polyether sulfone (PES), polyethylene naphthalate (PEN), polycarbonate (PC), etc.), or a ceramic substrate.

[0036] According to one or more embodiments of the present disclosure, the TFT layer of the substrate may be formed integrally with the first surface of the substrate, or manufactured in the form of a separate film and attached to the first surface of the substrate.

[0037] According to one or more embodiments of the present disclosure, the first surface of the substrate may be divided into an active area and an inactive area. The active area may be an area occupied by the TFT layer in the entire area of ​​the first surface of the substrate. The inactive area may be an area other than the active area in the entire area of ​​the first surface of the substrate.

[0038] According to one or more embodiments of the present disclosure, the edge region of the substrate may be the outermost region of the substrate. For example, the edge region of the substrate may include a region corresponding to the side surface of the substrate, some regions of the first surface of the substrate respectively adjacent to the side surface, and some regions of the second surface of the substrate. In the edge region of the substrate, a plurality of side surface wirings may be arranged, the plurality of side surface wirings electrically connecting the TFT circuit present on the first surface of the substrate and the drive circuit present on the second surface of the substrate.

[0039] According to one or more embodiments of the present disclosure, the substrate may be formed in a quadrilateral shape. For example, the substrate may be formed in a rectangular shape or a square shape.

[0040] According to one or more embodiments of the present disclosure, in addition to low temperature polysilicon (LTPS) TFT, the TFT disposed on the substrate may also be implemented as, for example, oxide TFT, Si TFT (polysilicon, a-silicon), organic TFT, graphene TFT, etc. For TFT, only P-type (or N-type) MOSFET can be manufactured and applied using Si wafer CMOS process.

[0041] According to one or more embodiments of the present disclosure, in the substrate, the TFT layer formed with the TFT circuit may be omitted. In this case, a plurality of micro IC chips acting as the TFT circuit may be mounted on the front surface of the substrate. In this case, the plurality of micro ICs may be electrically connected to a plurality of light emitting diodes arranged on the first surface of the substrate through wiring.

[0042] According to one or more embodiments of the present disclosure, a pixel driving method of a display module may be an active matrix (AM) driving method or a passive matrix (PM) driving method.

[0043] According to one or more embodiments of the present disclosure, a display module may be installed and applied to wearable devices, portable devices, handheld devices, and various electronic components or electronic parts requiring display.

[0044] According to one or more embodiments of the present disclosure, a plurality of display modules may be connected in a grid arrangement and may form a display device (eg, a monitor for a personal computer, a high-resolution television and signage (or digital signage), an electronic display, etc.).

[0045] According to one or more embodiments of the present disclosure, a pixel may include a plurality of light emitting diodes. In this case, a light emitting diode may be a sub-pixel. In the present disclosure, a "light emitting diode", a "light emitting element", a "micro-LED" and a "sub-pixel" may be used interchangeably to represent the same meaning.

[0046] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that a person of ordinary skill in the art to which the present disclosure belongs can easily implement the present disclosure. However, it should be noted that the present disclosure can be implemented in various different forms and is not limited to the embodiments described herein. In addition, in the accompanying drawings, in order to clearly illustrate the embodiments of the present disclosure, parts that are not related to the description are omitted, and throughout this specification, similar parts are represented by similar reference numerals.

[0047] Hereinafter, a display device according to one or more embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0048] Figure 1 is a block diagram illustrating a display device according to one or more embodiments of the present disclosure.

[0049] refer to Figure 1 , a display device 1 according to one or more embodiments of the present disclosure may include a display module 3 and a processor 5 .

[0050] The display module 3 can display various images. Here, the image is a concept including still images and / or moving images. The display module 3 can display various images such as broadcast content, multimedia content, etc. In addition, the display module 3 can display a user interface and icons.

[0051] The display module 3 may include a substrate 40 and a display driver integrated circuit (IC) 7 for controlling the substrate 40 .

[0052] The display driver IC 7 may include an interface module 7a, a memory 7b (e.g., a buffer memory), an image processing module 7c, or a mapping module 7d. The display driver IC 7 may, for example, receive image data or image information (including image control signals corresponding to commands for controlling image data) from other components of the display device 1 through the interface module 7a. For example, the image information may be received from the processor 5 (e.g., a main processor (e.g., an application processor)) or an auxiliary processor (e.g., a graphics processing device) that operates independently of the main processor function.

[0053] The display driver IC 7 may store at least some of the received image information in the memory 7b in units of, for example, frames. The image processing module 7c may, for example, perform pre-processing or post-processing (e.g., adjusting resolution, brightness, or size) on at least a portion of the image data based on characteristics of the image data or characteristics of the substrate 40. The mapping module 7d may generate a voltage value or a current value corresponding to the image data pre-processed or post-processed by the image processing module 7c. According to one or more embodiments of the present disclosure, for example, a voltage value or a current value may be generated based at least in part on the properties of pixels arranged on the substrate 40 (e.g., the arrangement of pixels (e.g., an RGB stripe structure or an RGB Pentile structure, or the size of each sub-pixel)). At least some pixels of the substrate 40 may be driven, for example, at least in part based on the voltage value or the current value, so that visual information corresponding to the image data (e.g., text, an image, or an icon) may be displayed through the substrate 40.

[0054] The display driver IC 7 may send a drive signal (eg, a driver drive signal, a gate drive signal, etc.) to the display based on the image information received from the processor 5 .

[0055] The display driver IC 7 may display an image based on the image signal received from the processor 5. As an example, the display driver IC 7 may generate a driving signal of a plurality of sub-pixels based on the image signal received from the processor 5, and display an image by controlling light emission of the plurality of sub-pixels based on the driving signal.

[0056] The display module 3 may further include a touch circuit (not shown). The touch circuit may include a touch sensor and a touch sensor IC for controlling the touch sensor. The touch sensor IC may, for example, control the touch sensor to detect a touch input or a hovering input for a specified position of the substrate 40. For example, the touch sensor IC may detect a touch input or a hovering input by measuring a signal change (e.g., voltage, amount of light, resistance, or amount of charge) of a signal for a specified position of the substrate 40. The touch sensor IC may provide information (e.g., position, area, pressure, or time) about the detected touch input or hovering input to the processor 5. According to one or more embodiments of the present disclosure, at least a portion of the touch circuit (e.g., a touch sensor IC) may be included as part of the display driver IC 7 or the substrate 40 or as part of another component (e.g., an auxiliary processor) arranged outside the display module 3.

[0057] The processor 5 may be implemented as a digital signal processor (DSP), a microprocessor, a graphics processing unit (GPU), an artificial intelligence (AI) processor, a neural processing unit (NPU), and a time controller (TCON) for processing digital image signals. However, the present disclosure is not limited thereto, and the processor 5 may include one or more of the following items: a central processing unit (CPU), a microcontroller unit (MCU), a microprocessing unit (MPU), a controller, an application processor (AP), or a communication processor (CP), and an ARM processor, or may be defined by these terms. In addition, the processor 5 may be implemented as a system on chip (SoC) or a large-scale integrated circuit (LSI) having a processing algorithm stored therein, or in the form of an application-specific integrated circuit (ASIC) or a field-programmable gate array (FPGA).

[0058] The processor 5 may drive an operating system or an application program, thereby controlling hardware or software components connected to the processor 5, and performing various types of data processing and operations. In addition, the processor 5 may load commands or data received from at least one of the other components onto a volatile memory and process them, and store various types of data in a nonvolatile memory.

[0059] The display module 3 may be a touch screen combined with a touch sensor, a flexible display, a rollable display and / or a three-dimensional display.

[0060] Figure 2 is a plan view showing a display module according to one or more embodiments of the present disclosure. Figure 3 A portion of a display module ( Figure 2 Figure 1 (part A) shown in Figure 1. Figure 4 is a cross-sectional view showing a portion of a display module according to one or more embodiments of the present disclosure (eg, along Figure 3 BB' line shown in the schematic cross-sectional view).

[0061] refer to Figure 2 and Figure 3 , the display module 3 may include a substrate 40 and a plurality of pixels 100 disposed on a first surface of the substrate 40. For example, the plurality of pixels 100 may be respectively arranged in pixel regions 101, which are arranged in a matrix form on the substrate 40. The pixel regions 101 may be logically divided regions, rather than physically divided regions.

[0062] On the substrate 40, a thin film transistor (TFT) circuit electrically connected to the plurality of pixels 100 may be disposed on the first surface. The TFT disposed on the substrate 40 may be an amorphous silicon (a-Si) TFT, a low temperature polycrystalline silicon (LTPS) TFT, a low temperature polycrystalline oxide (LTPO) TFT, a mixed oxide and polycrystalline silicon (HOP) TFT, a liquid crystal polymer (LCP) TFT, or an organic TFT (OTFT).

[0063] refer to Figure 3 , each of the plurality of pixels 100 may include at least three sub-pixels. The sub-pixels may be, for example, micro-LEDs, which are inorganic light-emitting diodes. Hereinafter, for ease of explanation, the sub-pixels will be referred to as micro-LEDs. Here, a micro-LED may be defined as an LED having a size of 100 μm or less or 30 μm or less.

[0064] Each pixel 100 may include a first micro LED 110 emitting light of a red wavelength band, a second micro LED 120 emitting light of a green wavelength band, and a third micro LED 130 emitting light of a blue wavelength band. For example, one pixel 100 may be arranged inside one pixel region 101. Among the pixel regions, in regions not occupied by the first micro LED 110, the second micro LED 120, and the third micro LED 130, a plurality of TFTs for driving the first micro LED 110, the second micro LED 120, and the third micro LED 130, respectively, may be arranged.

[0065] The first micro LED 110, the second micro LED 120, and the third micro LED 130 may be arranged in a row at a specific interval, but the present disclosure is not limited thereto. For example, the first micro LED 110, the second micro LED 120, and the third micro LED 130 may be arranged in the form of the letter L, or by a pentile RGBG method. The pentile RGBG method is a method of spatially arranging the number of red, green, and blue sub-pixels in a ratio of 1:1:2 (R:G:B) by utilizing the recognition characteristic that humans have a better ability to recognize green than to recognize blue. The pentile RGBG method can increase production and reduce unit cost. In addition, the pentile RGBG method can achieve high resolution in a small screen.

[0066] It is described that one pixel 100 includes three micro LEDs (e.g., first micro LED 110, second micro LED 120, third micro LED 130), but the present disclosure is not limited thereto. For example, one pixel 100 may include one micro LED, or may include four or more micro LEDs (e.g., red, green, blue, and white micro LEDs).

[0067] refer to Figure 4 , the micro LED may be constructed in a flip chip form, wherein the first electrode 111 and the second electrode 112 are arranged on an opposite surface 1102 of the light emitting surface 1101. For example, the first electrode 111 may be an anode electrode, and the second electrode 112 may be a cathode electrode.

[0068] On one surface of the substrate, a plurality of substrate electrode pads 41, 42 may be arranged in pairs at certain intervals. The plurality of substrate electrode pads 41, 42 may be electrically connected to the first electrode 111 and the second electrode 112 of the first micro LED 110, respectively.

[0069] Before transferring the first micro LED 110, the second micro LED 120, and the third micro LED 130 to the substrate, a bonding member 80 may be laminated on one surface of the substrate 40. The bonding member 80 may be, for example, an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP).

[0070] The bonding member 80 may include an adhesive layer 81 and a plurality of conductive balls 85 having a fine size, which are included in the adhesive layer 81. The adhesive layer 81 may be a resin composed of a thermosetting material (e.g., epoxy resin, polyurethane, or acrylic resin). The plurality of conductive balls 85 have a fine size (e.g., about 3 μm to 15 μm), and may include a conductive film (e.g., gold (Au), nickel (Ni), or lead (PD)) and polymer particles coated on the outer peripheral surface of polymer particles with a specific thickness.

[0071] After the first micro LED 110 is transferred to the substrate 40, it may be thermally pressed. In this case, the first electrode 111 and the second electrode 112 of the first micro LED 110 may be electrically connected to the corresponding substrate electrode pads 41, 42 respectively through a plurality of conductive balls 85. The first micro LED 110 may be firmly physically fixed to the substrate 40 through the adhesive layer 81 cured after thermal pressing. The second micro LED 120 and the third micro LED 130 may also be electrically and physically connected to the substrate 40 through the bonding member 80 in the same manner as the aforementioned first micro LED 110.

[0072] A plurality of pixel circuits for driving a plurality of micro LEDs may be provided on the substrate 40. One micro LED may be driven by one pixel circuit. One pixel circuit may include a capacitor and a plurality of TFTs, etc.

[0073] For example, the first micro LED 110 may be driven by the first pixel circuit 51. In this case, the first electrode 111 of the first micro LED 110 may be electrically connected to the first pixel circuit 51 through the first connection wiring 71. In addition, the second micro LED 120 may be electrically connected to the second pixel circuit 52 through the second connection wiring 72. The third micro LED 130 may be electrically connected to the third pixel circuit 53 through the third connection wiring 73.

[0074] The first pixel circuit 51, the second pixel circuit 52, and the third pixel circuit 53 can be electrically connected to the corresponding data wirings 61, 62, and 63, respectively. The fourth pixel circuit 51', the fifth pixel circuit 52', and the sixth pixel circuit 53' adjacent to the right side of the first pixel circuit 51, the second pixel circuit 52, and the third pixel circuit 53 can also be electrically connected to the corresponding data wirings 61', 62', and 63', respectively. For example, the data wirings (61, 62, 63, 61', 62', and 63') can also be as follows Figure 3 They are also arranged along the vertical direction of the substrate 40 .

[0075] In the display module 3, the pixels 100 adjacent to the left edge 401, the right edge 402, the upper edge 403, and the lower edge 404 of the substrate 40 among the plurality of micro LEDs arranged on the substrate 40 are susceptible to external impact during the manufacturing process. In the case where the external impact is applied to the left edge 401, the right edge 402, the upper edge 403, and the lower edge 404 of the display module 3, the TFT layer adjacent to the left edge 401, the right edge 402, the upper edge 403, and the lower edge 404 may be damaged. Due to the damage to the TFT layer, the first pixel circuit 51, the second pixel circuit 52, and the third pixel circuit 53 may be damaged, and the data wirings 71, 72, and 73 having a narrow width electrically connected to the first pixel circuit 51, the second pixel circuit 52, and the third pixel circuit 53 are easily disconnected. The data wirings 71, 72, and 73 may be signal lines having a long signal path. In the case where the data wirings 71, 72, and 73 are disconnected, image noise may be generated in the display module 3.

[0076] In order to improve such a problem, in one or more embodiments according to the present disclosure, the first pixel circuit 51, the second pixel circuit 52, and the third pixel circuit 53 for driving the pixel 100 (the first micro LED 110, the second micro LED 120, and the third micro LED 130) adjacent to the left edge 401 of the substrate 40 may be arranged farther from the left edge 401 than the pixel 100 of the substrate 40. The data wirings 71, 72, 73 having a narrow width electrically connected to the first pixel circuit 51, the second pixel circuit 52, and the third pixel circuit 53 may be arranged to correspond to the positions of the first pixel circuit 51, the second pixel circuit 52, and the third pixel circuit 53. Therefore, the data wirings 71, 72, 73 may be arranged farther from the left edge 401 than the pixel 100 of the substrate 40 in the same or similar manner as the first pixel circuit 51, the second pixel circuit 52, and the third pixel circuit 53.

[0077] As described above, the first pixel circuit 51, the second pixel circuit 52, and the third pixel circuit 53 and the data wirings 71, 72, 73 may be located at a position closer to the inside of the substrate 40 (or the right side of the substrate 40) than the position of the pair of substrate electrode pads to which the third micro LED 130 is connected. Therefore, damage to the first pixel circuit 51, the second pixel circuit 52, and the third pixel circuit 53 and disconnection of the data wirings 71, 72, 73 corresponding thereto due to an impact applied to the left edge of the display module 3 during the manufacturing process may be prevented or minimized.

[0078] According to one or more embodiments of the present disclosure, a plurality of pixel circuits adjacent to the right edge 402 of the substrate 40 and data wirings electrically connected to the plurality of pixel circuits, respectively, may be arranged at a position on the left side of the substrate 40 that is farther from the right edge 402 of the substrate than the position of the substrate electrode pad adjacent to the right edge 402 of the substrate. In addition, according to one or more embodiments of the present disclosure, a plurality of pixel circuits adjacent to the upper edge 403 of the substrate 40 and data wirings electrically connected to the plurality of pixel circuits, respectively, may be arranged at a position on the lower side of the substrate 40 that is farther from the upper edge 403 of the substrate 40 than the position of the substrate electrode pad adjacent to the upper edge 403 of the substrate. In addition, according to one or more embodiments of the present disclosure, a plurality of pixel circuits adjacent to the lower edge 404 of the substrate 40 and data wirings electrically connected to the plurality of pixel circuits, respectively, may be arranged at a position on the upper side of the substrate that is farther from the lower edge 404 of the substrate 40 than the position of the substrate electrode pad adjacent to the lower edge 404 of the substrate.

[0079] refer to Figure 3 , a fourth pixel circuit 51', a fifth pixel circuit 52', and a sixth pixel circuit 53' for driving another pixel 100' (for example, a fourth micro-LED 110', a fifth micro-LED 120', and a sixth micro-LED 130') may be arranged at a position corresponding to the substrate electrode pad to which the fourth micro-LED 110', the fifth micro-LED 120', and the sixth micro-LED 130' are connected. However, the present disclosure is not limited thereto, and the fourth pixel circuit 51', the fifth pixel circuit 52', and the sixth pixel circuit 53' may be arranged at a position on the right side of the substrate 40 that is farther away from the left edge 401 of the substrate 40 than the position of the substrate electrode pad to which the fourth, fifth, and sixth micro-LEDs 110', 120', 130' are connected.

[0080] Figure 5 is a schematic cross-sectional view illustrating multiple layers of a display module according to one or more embodiments of the present disclosure.

[0081] refer to Figure 5 On the substrate 40, pixel circuits 51, 52, 53, 51', 52', 53' (see Figure 3 ) of the substrate 40. The TFT layer may be formed in a plurality of layers on one surface of the substrate 40. For example, the TFT layer may include a TFT 410 and a first insulating layer 421, a second insulating layer 422, a third insulating layer 423, and a fourth insulating layer 424. In this case, the TFT 410 may be composed of a plurality of TFTs.

[0082] The TFT layer may include passivation layers 431 , 432 , 433 disposed between the second insulating layer 422 and the third insulating layer 423 , between the third insulating layer 423 and the fourth insulating layer 424 , and on an upper surface of the fourth insulating layer 424 , respectively.

[0083] The TFT layer may include a first metal wiring 411 , a second metal wiring 412 , a third metal wiring 413 , and a fourth metal wiring 414 arranged on different layers.

[0084] According to one or more embodiments of the present disclosure, for data wiring 61, 62, 63, 61', 62', 63' (refer to Figure 3 ), the first metal wiring 411 or the second metal wiring 412 can be used. In this case, for the connection wirings 71, 72, 73, 71', 72', 73' (refer to Figure 3 ), the third metal wiring 413 or the fourth metal wiring 414 may be used. Therefore, image noise generated due to coupling between the data wirings 61, 62, 63, 61', 62', 63' and the connection wirings 71, 72, 73, 71', 72', 73' may be minimized.

[0085] Figure 6 Shows Figure 2 A magnified view of part A. Figure 3 Similarly, the first pixel circuit 51 is toward the left edge 401. The sub-pixel 110 is connected to the first pixel circuit 51 via a connecting wiring 71. The first pixel circuit 51 is controlled by the display driver IC 7 via a data wiring 61. The pixel circuit adjacent to the right side of the first pixel circuit 51 is a second pixel circuit 51'. The connection of the second pixel circuit 51' to the sub-pixel 110' is schematically shown as a connecting wiring 71'. The light-emitting elements can be uniformly arranged above the surface of the substrate 40 in the xy plane. The x direction can be referred to as the first dimension, the y direction can be referred to as the second dimension, and the z direction can be referred to as the third dimension.

[0086] Figure 7a is with Figure 2 The same information is used for the sake of illustration. Figure 7b Provided together. Figure 7b It is a supplement Figure 6 Elevation view of the enlarged plan view. Figure 5 Similarly, examples of metal wiring 414, 413, 412 and 411 are shown as stacks of metal wiring. First pixel circuit 51 is located inward from edge 401 of substrate 40 relative to first subpixel 110. Second pixel circuit 51' and second subpixel 110' are located at substantially the same position.

[0087] A plurality of light emitting elements may be uniformly arranged above the surface of the substrate 40, see Figure 2 .

[0088] In some embodiments, the first edge 401 is susceptible to physical impact during the manufacturing process, and the first pixel circuit 51, which is farther away from the first edge of the substrate than the first light emitting element 110, is configured to reduce damage caused by the physical impact. For example, among the pixel elements, the data wiring 61 is relatively far from the edge 401 and is therefore less likely to be broken by such physical impact at the edge 401.

[0089] In some embodiments, the first light-emitting element 110, the first pixel circuit 51, the second pixel circuit 51' and the second light-emitting element 110' are respectively located at a first position, a second position, a third position and a third position on a surface defined by a first direction (x direction) and a second direction (y direction), wherein the first edge 401 extends along the second direction (y direction), and wherein the first pixel circuit 51 is located at a second position inward from the first position along the first direction (x direction).

[0090] In some embodiments, the display module includes a display driver integrated circuit (IC) 7, each of a plurality of layers extends along a first direction (x direction) and a second direction (y direction), a plurality of layers are stacked along a third direction (z direction), a second pixel circuit 51' and a second light emitting element 110' are electrically connected to the display driver IC 7 through a third instance of metal wiring stacked along the third direction and a third connecting wiring 61, a first pixel circuit 51 is electrically connected to the display driver IC 7 through a first instance of metal wiring stacked along the third direction and a first connecting wiring (61), and the first light emitting element 110 is connected to the first pixel circuit 51 through a third instance of metal wiring stacked along the third direction and a second connecting wiring 71.

[0091] In some embodiments, the first connection wiring and the second connection wiring are not located in the same layer of the plurality of layers. Figure 7b Elements 61 and 71 in.

[0092] In some embodiments, the first connection wiring and the third connection wiring are located in the same layer of the plurality of layers. Figure 7b Elements 61 and 61' in.

[0093] In some embodiments, the number of layers is four. Figure 5 and Figure 7b .

[0094] In some embodiments, the first light emitting element includes three sub-pixels, wherein the three sub-pixels correspond to red, green, and blue, respectively.

[0095] In some embodiments, the first light emitting element includes four sub-pixels, wherein the four sub-pixels correspond to red, green, blue, and green, respectively.

[0096] In some embodiments, the three sub-pixels include a first sub-pixel, the first sub-pixel is configured as a micro-LED, and the size of the micro-LED is approximately 35 microns by 25 microns.

[0097] In some embodiments, the first edge 401 extends along the second direction (y-direction), a distance from the first light emitting element 110 to the first pixel circuit 51 measured along the first direction (x-direction) is approximately 100 microns, and the second light emitting element 110 ′ and the second pixel circuit 51 ′ are located within 10 microns of each other measured along the first direction (x-direction).

[0098] In the above description, the present disclosure is described by an exemplary method. However, it should be noted that the terms used herein are only used to illustrate the present disclosure, and the terms should not be interpreted as limiting the present disclosure. In addition, various modifications and changes can be made to the present disclosure based on the above. Therefore, the present disclosure can be freely implemented within the scope of the attached claims, unless otherwise mentioned in this regard.

Claims

1. A display module, comprising: a substrate having a plurality of substrate electrode pads arranged thereon and comprising a plurality of pixel circuits connected to the plurality of substrate electrode pads, wherein the plurality of pixel circuits include a first pixel circuit and a second pixel circuit, and wherein the plurality of substrate electrode pads include a first substrate electrode pad; and a plurality of light emitting elements connected to the plurality of substrate electrode pads, the plurality of light emitting elements including a first light emitting element, wherein the first light emitting element is electrically connected to the first substrate electrode pad, and the first pixel circuit is configured to control the first light emitting element, The first pixel circuit is closer to the first edge of the substrate than the second pixel circuit, and the first pixel circuit is farther away from the first edge of the substrate than the first light-emitting element.

2. The display module according to claim 1, wherein: The substrate comprises: A plurality of data wirings are electrically connected to the first pixel circuits respectively, and The plurality of data wirings are arranged farther from a first edge of the substrate than the first light emitting element.

3. The display module according to claim 1, wherein: The substrate is a quadrilateral including a first edge, a second edge, a third edge, and a fourth edge.

4. The display module according to claim 1, in, The substrate includes the first edge and a second edge, wherein the second edge is opposite to the first edge, and The plurality of pixel circuits are arranged closer to the second edge than the first light emitting element.

5. The display module according to claim 2, wherein: The plurality of substrate electrode pads are electrically connected to corresponding pixel circuits through a plurality of connection wirings, respectively.

6. The display module according to claim 5, in, The substrate includes a plurality of layers, and The plurality of data wirings and the plurality of connection wirings are arranged on different layers of the plurality of layers.

7. The display module according to claim 6, wherein: The second pixel circuit is configured to control a second light emitting element among the plurality of light emitting elements, the plurality of light emitting elements being uniformly arranged over a surface of the substrate, and the surface extending along a first direction and a second direction perpendicular to the first direction.

8. The display module according to claim 7, wherein: The first edge is susceptible to physical impact during a manufacturing process, and the first pixel circuit, which is farther away from the first edge of the substrate than the first light emitting element, is configured to reduce damage due to the physical impact.

9. The display module according to claim 7, wherein: The first light-emitting element, the first pixel circuit, the second pixel circuit and the second light-emitting element are respectively located at a first position, a second position, a third position and a third position on a surface defined by the first direction and the second direction, wherein the first edge extends along the second direction, and wherein the first pixel circuit is located at the second position inward from the first position along the first direction.

10. The display module according to claim 7, further comprising a display driver integrated circuit IC, wherein: Each of the multiple layers extends along the first direction and the second direction, the multiple layers are stacked along a third direction, the second pixel circuit and the second light-emitting element are electrically connected to the display driver IC through a third instance of the metal wiring stacked along the third direction and a third connecting wiring, the first pixel circuit is electrically connected to the display driver IC through a first instance of the metal wiring stacked along the third direction and a first connecting wiring, and the first light-emitting element is connected to the first pixel circuit through a third instance of the metal wiring stacked along the third direction and a second connecting wiring.

11. The display module according to claim 10, wherein: The first connection wiring and the second connection wiring are not located in the same layer of the plurality of layers.

12. The display module according to claim 10, wherein: The first connection wiring and the third connection wiring are located in the same layer of the plurality of layers.

13. The display module according to claim 10, wherein: The number of layers is four.

14. The display module according to claim 1, wherein: The first light emitting element includes three sub-pixels, wherein the three sub-pixels correspond to red, green and blue, respectively.

15. The display module according to claim 1, wherein: The first light emitting element includes four sub-pixels, wherein the four sub-pixels correspond to red, green, blue and green, respectively.

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