Dispensing control method and system of automatic die bonder

Abstract

The invention relates to the technical field of semiconductor packaging, in particular to a dispensing control method and system of an automatic die bonder. The method comprises the steps that under the condition that dispensing of a wafer of a previous model is completed, model identification information of a wafer of a next model is obtained, and target dispensing control parameters corresponding to the model identification information are obtained; and controlling the dispensing process of the wafer of the next model according to the target dispensing control parameter. According to the technical scheme, the target dispensing control parameters corresponding to the model identification information are adopted for dispensing, when the model of the wafer to be dispensed is changed, matching between the model of the wafer to be dispensed and the model of the wafer to be dispensed can be achieved more quickly, and the dispensing effect on the wafer is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a dispensing control method and system for an automatic die bonding machine. Background Art

[0002] In the semiconductor packaging process, the die bonder can achieve a fixed connection between the die and the substrate by dispensing glue on the die; the die is moved from a position outside the substrate to a position to be fixed in the substrate through a die gripping mechanism, and the die pre-placed on the substrate is filled with adhesive material through the dispensing head of the die bonder. The adhesive material can be, for example, epoxy resin, to achieve dispensing glue on the die.

[0003] In order to achieve the dispensing of wafers, in the relevant technology, for example, the Chinese patent application document with publication number CN116764891A, a dispensing motion control system for an automatic crystal bonding machine is provided, including: a human-computer interaction unit, which realizes the operation of the visual system, creates and edits the dispensing program, monitors the operating status of each system module and data feedback and analysis in real time through the combination of dispensing software and hardware circuits, performs feature matching between the image processed by the visual system and the template, automatically sets the dispensing parameters according to the matching results and sends them to the motion control unit, and collects and analyzes the dispensing process images at the same time to improve the setting of the dispensing parameters and the dispensing process; a motion control unit, which uses STM32 as the main controller and FPGA as the auxiliary controller to build a hardware platform and external circuits, and drives the stepper motor to drive the dispenser to move to the preset dispensing position for dispensing operation based on the dispensing parameters combined with the dispensing start condition detection results.

[0004] In the related technology, when dispensing glue on a chip, the image processed by the vision system is feature matched with the template, and the dispensing parameters are automatically set according to the matching results and sent to the motion control unit. Before the setting of the dispensing parameters is completed, there is a problem of poor dispensing effect on the chip, which affects the dispensing quality of the chip. Summary of the invention

[0005] In order to overcome the problem of poor glue dispensing effect on wafers in the related art, the present application provides a glue dispensing control method and system for an automatic die bonding machine.

[0006] According to a first aspect of an embodiment of the present application, a dispensing control method for an automatic crystal bonding machine is provided, comprising: upon completing the dispensing of a wafer of a previous model, obtaining the model identification information of a wafer of a later model, and obtaining the target dispensing control parameters corresponding to the model identification information; controlling the dispensing process of the wafer of the later model according to the target dispensing control parameters; wherein the target dispensing control parameters are determined in the following manner: dispensing the first wafer and the second wafer of the target model according to the initial dispensing control parameters, and obtaining the dispensing area ratio of the first wafer and the second wafer after dispensing ; The target model is the model indicated by the model identification information; when it is determined that there is at least one wafer with abnormal glue dispensing in the first wafer and the second wafer after glue dispensing according to the glue dispensing area ratio of the first wafer and the second wafer after glue dispensing, the outer contour difference value between the first wafer and the second wafer before glue dispensing is obtained; the outer contour difference value is used to characterize the degree of difference in the outer contour between the first wafer and the second wafer; according to the glue dispensing area ratio of the first wafer after glue dispensing, the glue dispensing area ratio of the second wafer after glue dispensing and the outer contour difference value, the initial glue dispensing control parameters are adjusted to obtain the target glue dispensing control parameters.

[0007] Optionally, the initial dispensing control parameters are adjusted to obtain the target dispensing control parameters, including: P = M × e a×C , P is the target dispensing control parameter, M is the initial dispensing control parameter, e is a natural constant, a is a preset positive number, C is an adjustment coefficient, C=D1×k1+D2×k2+D3×k3, D1 is the outer contour difference value, k1 is a first coefficient predetermined for the outer contour difference value, D2 is the difference value in the dispensing area ratio between the first wafer and the second wafer, k2 is a second coefficient predetermined for the difference value in the dispensing area ratio of different wafers after dispensing, D3 is the difference value between the specified dispensing area ratio and the dispensing area ratio of the first wafer, k3 is a third coefficient predetermined for the difference value between the specified dispensing area ratio and the dispensing area ratio of the wafer.

[0008] In this way, the adjustment of the initial dispensing control parameters is carried out according to the adjustment coefficient, and the adjustment coefficient is determined according to the difference value of the outer contour and the difference value of the dispensing area ratio. The adjustment of the initial dispensing control parameters can be better realized so as to obtain better dispensing effects when dispensing large quantities of chips in the target batch.

[0009] Optionally, the first coefficient, the second coefficient and the third coefficient are obtained in the following manner: taking the outer contour difference value between two different chips in the same batch as the first parameter value; taking the difference value in the proportion of glue spotting area between different chips in the same batch as the second parameter value, and taking the difference value between the proportion of specified glue spotting area of ​​the same batch and the proportion of glue spotting area of ​​the chips after glue spotting as the third parameter value; according to different values ​​of the same target parameter value and the corresponding glue spotting quality evaluation value, using variance analysis to determine the significance value corresponding to the target parameter value; the target parameter value is any one of the first parameter value, the second parameter value and the third parameter value; determining the sum of the significance values ​​corresponding to the first parameter value, the second parameter value and the third parameter value, and taking the ratio of the significance value corresponding to the target parameter value to the sum as the coefficient corresponding to the target parameter value.

[0010] Optionally, the proportion of the glue spot area of ​​the first chip and the second chip after glue dispensing is determined by the following method: obtaining a first surface image of the first chip after glue dispensing, and obtaining a second surface image of the second chip after glue dispensing; performing image segmentation on the glue spot area in the first surface image to obtain the first glue spot area, and performing image segmentation on the glue spot area in the second surface image to obtain the second glue spot area; taking the ratio of the area of ​​the first glue spot area to the specified glue spot area as the proportion of the glue spot area of ​​the first chip after glue dispensing; taking the ratio of the area of ​​the second glue spot area to the specified glue spot area as the proportion of the glue spot area of ​​the second chip after glue dispensing.

[0011] Optionally, the outer contour difference value between the first chip and the second chip before glue dispensing is obtained in the following manner: obtaining a third surface image of the first chip before glue dispensing, and obtaining a fourth surface image of the second chip before glue dispensing; the third surface image and the fourth surface image are pre-collected before glue dispensing; edge detection is performed on the third surface image to obtain a first edge image, and edge detection is performed on the fourth surface image to obtain a second edge image; the midpoint of the first edge image and the midpoint of the second edge image are placed at the same coordinate origin to determine the Chamfer distance between the outer edge pixel points in the first edge image and the outer edge pixel points in the second edge image, and the Chamfer distance is used as the outer contour difference value.

[0012] In this way, by determining the Chamfer distance between the outer edge pixel points in the first edge image and the outer edge pixel points in the second edge image, and using the Chamfer distance as the outer contour difference value, the outer contour of the first chip and the outer contour of the second chip can be better compared.

[0013] Optionally, the Chamfer distance is obtained by: W is the Chamfer distance, L1 is the number of outer edge pixels in the first edge image, A1 is the set of outer edge pixels in the first edge image, d(a, A2) is the shortest distance from outer edge pixel a in the first edge image to all edge pixels in the second edge image, L2 is the number of outer edge pixels in the second edge image, A2 is the set of outer edge pixels in the second edge image, and d(b, A1) is the shortest distance from outer edge pixel b in the second edge image to all edge pixels in the first edge image.

[0014] In this way, by determining the shortest distance from the outer edge pixel point in the first edge image to all edge pixel points in the second edge image, and determining the shortest distance from the outer edge pixel point in the second edge image to all edge pixel points in the first edge image, it is possible to conveniently characterize the degree of difference in the outer contour between the first chip and the second chip through the obtained Chamfer distance.

[0015] Optionally, the method further includes: when it is determined that there is no wafer with abnormal glue dispensing in the first wafer and the second wafer after glue dispensing based on the glue dispensing area ratio of the first wafer and the second wafer after glue dispensing, using the initial glue dispensing control parameter as the target glue dispensing control parameter.

[0016] In this way, when there is no wafer with abnormal glue dispensing in the first wafer and the second wafer after glue dispensing, the initial glue dispensing control parameter is used as the target glue dispensing control parameter, which can facilitate better glue dispensing of the target batch of wafers.

[0017] According to the second aspect of an embodiment of the present application, a dispensing control system for an automatic crystal bonding machine is provided, comprising: a processor and a memory, wherein the memory stores computer program instructions, and when the computer program instructions are executed by the processor, the steps of the dispensing control method for the automatic crystal bonding machine provided in the first aspect of the present application are implemented.

[0018] The technical solution provided by the embodiments of the present application may include the following beneficial effects: when the dispensing of a chip of a previous model is completed, the model identification information of the chip of a later model is obtained, and the target dispensing control parameters corresponding to the model identification information are obtained; according to the target dispensing control parameters, the dispensing process of the chip of the later model is controlled. Since the dispensing control parameters required between different batches of chips are different, the target dispensing control parameters corresponding to the model identification information are used for dispensing. When the model of the chip being dispensed changes, the matching with the model of the chip being dispensed can be achieved more quickly, thereby improving the dispensing effect on the chip.

[0019] At the same time, the target dispensing control parameters are obtained by adjusting the initial dispensing control parameters in advance according to the dispensing conditions of the two chips. The obtained target dispensing control parameters can better match the chip model indicated by the model identification information, thereby improving the dispensing effect on the chip.

[0020] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0022] Figure 1 is a flow chart of a dispensing control method of an automatic die bonding machine according to an exemplary embodiment;

[0023] Figure 2 is a flow chart of a process for determining target dispensing control parameters in an embodiment of the present application;

[0024] Figure 3 The figure is a schematic structural diagram of a dispensing control system of an automatic die bonding machine according to an exemplary embodiment. DETAILED DESCRIPTION

[0025] Here, exemplary embodiments are described in detail, and examples thereof are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application.

[0026] First, the application scenario of the embodiment of the present application is briefly introduced. In the application scenario of the present application, a die bonding machine can be used to dispense glue on the chip to achieve the connection between the chip and the substrate. However, when dispensing glue on the chip, the related technology usually adopts fixed dispensing control parameters to dispense glue on the chip, and the fixed dispensing control parameters are difficult to apply to chips of different sizes, resulting in poor dispensing effect on the chip.

[0027] Alternatively, the dispensing control parameters may be adjusted during the dispensing process. However, before the dispensing control parameters are adjusted, the wafers dispensed during the adjustment process may still have poor dispensing.

[0028] In view of the above technical problems, the present application provides a dispensing control method and system for an automatic die bonding machine. Figure 1 is a flow chart of a method for controlling glue dispensing of an automatic die bonder according to an exemplary embodiment, which can control the glue dispensing of the die bonder, such as Figure 1As shown, the method includes the following steps.

[0029] In step S101, when the dispensing of the wafer of the previous model is completed, the model identification information of the wafer of the next model is obtained, and the target dispensing control parameters corresponding to the model identification information are obtained.

[0030] The die bonding machine may include an image acquisition device, a wafer gripping mechanism, and a glue dispensing mechanism. The image acquisition device may realize the recognition of objects within the camera's field of view. For example, the position of the substrate within the camera's field of view may be determined so as to control the wafer gripping structure to move the wafer to the target position in the substrate.

[0031] The wafer grasping mechanism may be provided with a suction nozzle, which can grasp the wafer in the wafer holding device and move the grasped wafer to a target position in the substrate, and release the suction nozzle when the wafer reaches the target position in the substrate, so that the wafer is placed at the target position in the substrate.

[0032] When the target position of the chip in the substrate is determined, the dispensing mechanism of the die bonding machine can go to the position of the chip to perform dispensing operations. By controlling the adhesive material to fall and move, dispensing of the chip can be achieved.

[0033] In the process of dispensing glue on the wafer by the die bonding machine, it may involve dispensing glue on wafers of different models. The sizes of wafers of different models may be different, or the distribution of pins in chips of different models may be different. This makes it difficult to ensure that the wafers can achieve good dispensing effects when the same dispensing control parameters are used for dispensing glue on wafers of different models.

[0034] A model identification component can be set at the head or other position of the storage device for the chip that needs to be glued, and the model identification component carries the model identification information; for example, the model identification component can be a number, code, QR code, barcode, etc. corresponding to the model identification information, and the crystal bonding machine can use an image recognition device to obtain the model identification information carried in the number, code, QR code and barcode.

[0035] When switching the dispensing process of chips of different models, chips of the same model are usually placed in the same containing device. After completing the dispensing of the previous model of chips, the target dispensing control parameters corresponding to the model identification information can be obtained so that the die bonder can perform dispensing for the next model of chips.

[0036] The dispensing control parameter may refer to the amount of glue dispensed by the dispensing mechanism of the die bonding machine when it moves a unit distance. The dispensing control parameter may be adjusted by adjusting the dispensing speed of the dispensing mechanism and the speed of movement along the motion trajectory.

[0037] In step S102, the dispensing process of the wafer of the next model is controlled according to the target dispensing control parameters.

[0038] Different types of chips have corresponding dispensing control parameters, and chips in the same batch have consistent sizes. Therefore, the dispensing effect that can be achieved by the dispensing control parameters used when dispensing the chips can be improved. The dispensing control parameters are obtained through the model identification information obtained. Appropriate dispensing control parameters can be used when dispensing the chips, which can avoid the problem of poor dispensing effect on the chips.

[0039] Figure 2 is a flow chart of the process of determining the target dispensing control parameters in the embodiment of the present application, such as Figure 2 As shown, the following steps may be included.

[0040] In step S201, glue is dispensed on a first wafer and a second wafer of a target model according to initial glue dispensing control parameters, and the glue dispensing area ratios of the first wafer and the second wafer after glue dispensing are obtained; the target model is the model indicated by the model identification information.

[0041] The first chip and the second chip can be chips that have been pre-tested for dispensing the model indicated by the model identification information. The models of the first chip and the second chip are the same as the model indicated by the model identification information, so that when dispensing the target model of the chip, the target dispensing control parameters matching the model identification information are directly called to improve the dispensing effect on the target model of the chip.

[0042] Before dispensing glue on the first wafer and the second wafer, the image acquisition device of the die bonding machine or other equipment can capture the surface images of the first wafer and the second wafer before dispensing glue, and store them in the memory of the die bonding machine or other storage device so that the surface images before dispensing glue can be called later.

[0043] After completing the dispensing of the first wafer and the second wafer, the surface images of the first wafer and the second wafer after dispensing can be obtained, and the dispensing area ratio of the first wafer and the second wafer after dispensing can be determined through the surface images of the first wafer and the second wafer after dispensing.

[0044] In one embodiment, the proportion of the glue spot area of ​​the first chip and the second chip after glue dispensing is determined by the following method: obtaining a first surface image of the first chip after glue dispensing, and obtaining a second surface image of the second chip after glue dispensing; performing image segmentation on the glue spot area in the first surface image to obtain the first glue spot area, and performing image segmentation on the glue spot area in the second surface image to obtain the second glue spot area; taking the ratio of the area of ​​the first glue spot area to the specified glue spot area as the proportion of the glue spot area of ​​the first chip after glue dispensing; taking the ratio of the area of ​​the second glue spot area to the specified glue spot area as the proportion of the glue spot area of ​​the second chip after glue dispensing.

[0045] Since the chip and the adhesive material used for dispensing have different reflective abilities to light, the part of the chip after dispensing has different features in the surface image. The dispensing area in the surface image of the chip after dispensing can be determined by the difference in pixel values ​​between the pixel points of the chip itself and the part of the chip after dispensing.

[0046] For example, the segmentation threshold for threshold segmentation of the first surface image can be determined by the Otsu method, and the grayscale image of the first surface image can be threshold segmented by the determined segmentation threshold to obtain the first glue spot area where the glue spot area in the first surface image is located; referring to the acquisition process of the first glue spot area in the first surface image, the second glue spot area in the second surface image can be obtained.

[0047] When dispensing glue on a chip, the required designated dispensing area can be determined according to the batch identification information of the chip. The designated dispensing area is the desired dispensing area. The area of ​​the first dispensing area is the actual dispensing area for the first chip, and the area of ​​the second dispensing area is the actual dispensing area for the second chip.

[0048] The ratio of the area of ​​the first glue spot area to the specified glue spot area can be used to characterize the glue spot effect on the first chip; the ratio of the area of ​​the second glue spot area to the specified glue spot area can be used to characterize the glue spot effect on the second chip.

[0049] The first glue dispensing area may also refer to a glue dispensing area in the first wafer after glue dispensing whose glue dispensing width is within a specified width range, and the second glue dispensing area may also refer to a glue dispensing area in the second wafer after glue dispensing whose glue dispensing width is within a specified width range.

[0050] In this way, by determining the proportion of the glue dispensing area of ​​the first wafer and the second wafer after glue dispensing, it is helpful to determine the glue dispensing conditions of the first wafer and the second wafer, so as to obtain more accurate target glue dispensing control parameters for the target model of wafer.

[0051] In step S202, when it is determined that there is at least one wafer with abnormal glue dispensing in the first wafer and the second wafer after glue dispensing based on the glue dispensing area ratio of the first wafer and the second wafer after glue dispensing, the outer contour difference value of the first wafer and the second wafer before glue dispensing is obtained.

[0052] According to the proportion of the glue dispensing area of ​​the first wafer after glue dispensing, it can be determined whether there is any abnormality in the glue dispensing of the first wafer, for example, whether the proportion of the glue dispensing area is within a specified proportion range; when the proportion of the glue dispensing area is greater than the upper limit of the specified proportion range, it means that too much glue is dispensed on the first wafer; on the contrary, when the proportion of the glue dispensing area is less than the lower limit of the specified proportion range, it means that too little glue is dispensed on the first wafer.

[0053] Too much or too little glue dispensing is an abnormal glue dispensing situation. When the first chip has too little or too much glue dispensing, it means that when the first chip is glued according to the initial glue dispensing control parameters, there is a problem of poor glue dispensing effect.

[0054] By referring to the process of determining whether there is glue dispensing abnormality in the first wafer, it can be determined whether there is glue dispensing abnormality in the second wafer. In the case where there is at least one wafer with glue dispensing abnormality between the first wafer and the second wafer, for example, there is glue dispensing abnormality in the first wafer and there is no glue dispensing abnormality in the second wafer, and the initial glue dispensing control parameters are used for glue dispensing for the first wafer and the second wafer. Therefore, the difference in glue dispensing conditions between the first wafer and the second wafer may be caused by the difference between the first wafer and the second wafer.

[0055] If both the first chip and the second chip have dispensing abnormalities, and there is no difference in the outer contours of the first chip and the second chip, it means that the initial dispensing control parameters are not suitable for the size of the first chip or the second chip. The initial dispensing control parameters can be adjusted according to the dispensing performance of the first chip or the second chip to obtain the target dispensing control parameters suitable for the target batch of chips.

[0056] The outer contour difference value is used to characterize the degree of difference in the outer contours between the first chip and the second chip; the larger the outer contour difference value is, the greater the difference in the outer contours between the first chip and the second chip is; on the contrary, the smaller the outer contour difference value is, the smaller the difference in the outer contours between the first chip and the second chip is, and the more similar the outer contours of the two chips are.

[0057] In one embodiment, the outer contour difference value between the first wafer and the second wafer before glue dispensing is obtained in the following manner: a third surface image of the first wafer before glue dispensing is obtained, and a fourth surface image of the second wafer before glue dispensing is obtained; the third surface image and the fourth surface image are pre-collected before glue dispensing; edge detection is performed on the third surface image to obtain a first edge image, and edge detection is performed on the fourth surface image to obtain a second edge image; the midpoint of the first edge image and the midpoint of the second edge image are placed at the same coordinate origin to determine the Chamfer distance between the outer edge pixel point in the first edge image and the outer edge pixel point in the second edge image, and the Chamfer distance is used as the outer contour difference value.

[0058] The third surface image of the first chip before glue dispensing and the fourth surface image of the second chip before glue dispensing can be pre-acquired and stored before glue is dispensed on the first chip. The third surface image and the fourth surface image can be obtained from the memory or other storage device of the crystal bonding machine in which the third surface image and the fourth surface image are pre-stored.

[0059] Edge detection is a basic task in image processing and computer vision. Its purpose is to identify points in an image where the brightness changes significantly. These points usually correspond to the boundaries of objects. Image operators for edge detection can be Sobel operators, Prewitt operators, Canny operators, Laplacian operators, etc.

[0060] Placing the midpoint of the first edge image and the midpoint of the second edge image at the same coordinate origin facilitates comparison of outer edge pixel points in the first edge image with outer edge pixel points in the second edge image in the plane rectangular coordinate system where the coordinate origin is located. The outer edge pixel points in the edge image refer to the outermost outer edge pixel points located in the edge image.

[0061] Chamfer distance is a metric used to measure the difference between two geometric shapes. It is often used in computer vision and graphics. Chamfer distance is calculated based on the shortest distance between the edges of two shapes and can be used to compare the similarity between two contours or edge sets.

[0062] In this way, by determining the Chamfer distance between the outer edge pixel points in the first edge image and the outer edge pixel points in the second edge image, and using the Chamfer distance as the outer contour difference value, the outer contour of the first chip and the outer contour of the second chip can be better compared.

[0063] In one embodiment, the Chamfer distance is obtained by: W is the Chamfer distance, L1 is the number of outer edge pixels in the first edge image, A1 is the set of outer edge pixels in the first edge image, d(a, A2) is the shortest distance from outer edge pixel a in the first edge image to all edge pixels in the second edge image, L2 is the number of outer edge pixels in the second edge image, A2 is the set of outer edge pixels in the second edge image, and d(b, A1) is the shortest distance from outer edge pixel b in the second edge image to all edge pixels in the first edge image.

[0064] In the plane rectangular coordinate system where the first edge image and the second edge image are located, the set composed of outer edge pixel points in the first edge image can be taken as the first point set, and the set composed of outer edge pixel points in the second edge pixel points can be taken as the second point set.

[0065] For the target outer edge pixel point in the first point set, the shortest distance between the target outer edge pixel point and all the outer edge pixel points in the second point set can be determined. For different target outer edge pixel points in the first point set, the corresponding shortest distances can be determined respectively. Since the centers of the first edge image and the second edge image are placed at the coordinate origin, the smaller the shortest distance corresponding to the target outer edge pixel point, the closer the corresponding positions in the two edge images are. For example, the minimum shortest distance can be equal to 0.

[0066] In this way, by determining the shortest distance from the outer edge pixel point in the first edge image to all edge pixel points in the second edge image, and determining the shortest distance from the outer edge pixel point in the second edge image to all edge pixel points in the first edge image, it is possible to conveniently characterize the degree of difference in the outer contour between the first chip and the second chip through the obtained Chamfer distance.

[0067] In step S203, the initial glue dispensing control parameters are adjusted according to the glue dispensing area ratio of the first wafer after glue dispensing, the glue dispensing area ratio of the second wafer after glue dispensing, and the outer contour difference value to obtain the target glue dispensing control parameters.

[0068] When there is a wafer with abnormal glue dispensing in the first wafer and the second wafer after glue dispensing, it means that the initial glue dispensing control parameters do not match at least one of the first wafer and the second wafer. This mismatch may be caused by the difference between the first wafer and the second wafer, or may be caused by the size of the first wafer and the second wafer. Therefore, according to the glue dispensing area ratio of the first wafer after glue dispensing, the glue dispensing area ratio of the second wafer after glue dispensing and the outer contour difference value, it can provide a better reference for adjusting the initial glue dispensing control parameters, so as to better dispense the target batch of wafers when dispensing in large quantities.

[0069] In one embodiment, the initial dispensing control parameter is adjusted to obtain the target dispensing control parameter, including: P = M × e a×C , P is the target dispensing control parameter, M is the initial dispensing control parameter, e is a natural constant, a is a preset positive number, C is an adjustment coefficient, C=D1×k1+D2×k2+D3×k3, D1 is the outer contour difference value, k1 is a first coefficient predetermined for the outer contour difference value, D2 is the difference value in the dispensing area ratio between the first wafer and the second wafer, k2 is a second coefficient predetermined for the difference value in the dispensing area ratio of different wafers after dispensing, D3 is the difference value between the specified dispensing area ratio and the dispensing area ratio of the first wafer, k3 is a third coefficient predetermined for the difference value between the specified dispensing area ratio and the dispensing area ratio of the wafer.

[0070] The first coefficient is used to characterize the importance of the contour difference value for adjusting the initial dispensing control parameters, the second coefficient is used to characterize the importance of the difference in the dispensing area ratio of different chips after dispensing for adjusting the initial dispensing control parameters, and the third coefficient is used to characterize the importance of the difference between the specified dispensing area ratio and the dispensing area ratio of the chip for adjusting the initial dispensing control parameters.

[0071] The first coefficient, the second coefficient and the third coefficient can be pre-set according to actual needs; the specified glue spot area ratio can be the ratio of the actual glue spot area to the specified glue spot area when the glue spot effect is optimal. The specified glue spot area ratio can be, for example, between 0.95 and 1.05.

[0072] a is a preset positive number. The value of a can be set according to actual needs. The preset positive number is used to ensure that the adjustment amount of the initial dispensing control parameter is within a certain range. For example, the value of the preset positive number can be 2.

[0073] The difference in the percentage of glue area between the first chip and the second chip may refer to the absolute value of the difference between the percentage of glue area of ​​the first chip after glue dispensing and the percentage of glue area of ​​the second chip after glue dispensing, which is used to characterize the degree of difference between the percentage of glue area of ​​the first chip and the second chip after glue dispensing. Since the glue dispensing effects are different under different glue dispensing areas, the difference in the percentage of glue area between the first chip and the second chip can also characterize the degree of difference in the glue dispensing effects between the first chip and the second chip; the difference between the specified glue dispensing area percentage and the glue dispensing area percentage of the first chip may refer to the absolute value of the difference between the specified glue dispensing area percentage and the glue dispensing area percentage of the first chip.

[0074] In this way, the adjustment of the initial dispensing control parameters is carried out according to the adjustment coefficient, and the adjustment coefficient is determined according to the difference value of the outer contour and the difference value of the dispensing area ratio. The adjustment of the initial dispensing control parameters can be better realized so as to obtain better dispensing effects when dispensing large quantities of chips in the target batch.

[0075] In one embodiment, the first coefficient, the second coefficient and the third coefficient are obtained in the following manner: taking the outer contour difference value between two different chips in the same batch as the first parameter value; taking the difference value in the proportion of the glue spotting area of ​​different chips in the same batch as the second parameter value, and taking the difference value between the proportion of the specified glue spotting area of ​​the same batch and the proportion of the glue spotting area of ​​the chips after glue spotting as the third parameter value; according to different values ​​of the same target parameter value and the corresponding glue spotting quality evaluation value, using the variance analysis method to determine the significance value corresponding to the target parameter value; the target parameter value is any one of the first parameter value, the second parameter value and the third parameter value; determining the sum of the significance values ​​corresponding to the first parameter value, the second parameter value and the third parameter value, and taking the ratio of the significance value corresponding to the target parameter value to the sum as the coefficient corresponding to the target parameter value.

[0076] The first parameter value, the second parameter value and the third parameter are variables that affect the dispensing effect on the chip, and the dispensing quality can be characterized by the dispensing quality evaluation value. The significance values ​​of the first parameter value, the second parameter value and the third parameter value to the dispensing quality evaluation value can be determined respectively through variance analysis. The ratio of the significance value corresponding to the target parameter value to the total is used as the coefficient corresponding to the target parameter value, which can facilitate the integration of the significance values ​​of the three parameter values ​​and adjust the initial dispensing control parameters.

[0077] In one embodiment, when it is determined that there is no wafer with abnormal glue dispensing in the first wafer and the second wafer after glue dispensing based on the glue dispensing area ratio of the first wafer and the second wafer after glue dispensing, the initial glue dispensing control parameter is used as the target glue dispensing control parameter.

[0078] When there is no chip with abnormal glue dispensing in the first chip and the second chip after glue dispensing, it means that the initial glue dispensing control parameters can match the first chip and the second chip at the same time, and can achieve good glue dispensing effects on the first chip and the second chip at the same time. The initial glue dispensing control parameters can be used as target glue dispensing control parameters.

[0079] Alternatively, even if there are slight differences between the first wafer and the second wafer, dispensing the first wafer and the second wafer according to the initial dispensing control parameters can achieve good dispensing effects on the first wafer and the second wafer. Moreover, since the differences between different wafers in the same batch are usually within the allowable range, the initial dispensing control parameters can achieve better dispensing for the first wafer and the second wafer, and can also achieve good dispensing effects for other wafers in the same target batch.

[0080] In this way, when there is no wafer with abnormal glue dispensing in the first wafer and the second wafer after glue dispensing, the initial glue dispensing control parameter is used as the target glue dispensing control parameter, which can facilitate better glue dispensing of the target batch of wafers.

[0081] Through the dispensing control method of the automatic crystal bonding machine provided in the embodiment of the present application, after completing the dispensing of the previous model of the chip, the model identification information of the next model of the chip is obtained, and the target dispensing control parameters corresponding to the model identification information are obtained; according to the target dispensing control parameters, the dispensing process of the next model of the chip is controlled. Since the dispensing control parameters required between different batches of chips are different, the target dispensing control parameters corresponding to the model identification information are used for dispensing. When the model of the chip being dispensed changes, the matching with the model of the chip being dispensed can be achieved more quickly, thereby improving the dispensing effect on the chip.

[0082] At the same time, the target dispensing control parameters are obtained by adjusting the initial dispensing control parameters in advance according to the dispensing conditions of the two chips. The obtained target dispensing control parameters can better match the chip model indicated by the model identification information, thereby improving the dispensing effect on the chip.

[0083] Figure 3 FIG. 1 is a schematic diagram of a dispensing control system 1000 for an automatic die bonding machine according to an exemplary embodiment. Figure 3 The dispensing control system 1000 of the automatic crystal bonding machine includes: a processor 1100 and a memory 1200, wherein the memory 1200 stores computer program instructions, and when the computer program instructions are executed by the processor 1100, all or part of the steps of the dispensing control method of the automatic crystal bonding machine in the present application are implemented.

[0084] It should be understood that the features of some embodiments of the various applications described herein may be combined with each other, unless specifically stated otherwise.

[0085] Although terms such as "first", "second", and "third" may be used herein to describe various components, parts, regions, layers, or sections, these components, parts, regions, layers, or sections are not limited to these terms. Instead, these terms are only used to distinguish one component, part, region, layer, or section from another component, part, region, layer, or section. Therefore, without departing from the teachings of the examples described herein, the first component, part, region, layer, or section mentioned in the examples may also be referred to as the second component, part, region, layer, or section.

[0086] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description herein, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0087] In addition, the word "exemplary" is used herein to mean serving as an example, instance, or diagram. Any aspect or design described herein as "exemplary" is not necessarily to be understood as being advantageous over other aspects or designs. Instead, the use of the word exemplary is intended to present concepts in a concrete manner. As used herein, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or".

[0088] Likewise, although the present application has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art upon reading and understanding this specification and the accompanying drawings. With particular regard to the various functions performed by the components (e.g., elements, resources, etc.) described above, unless otherwise indicated, the terms used to describe such components are intended to correspond to any component (functionally equivalent) that performs the specific functions of the described components, even if not structurally equivalent to the disclosed structures.

[0089] Additionally, while particular features of the present application may have been disclosed with respect to only one of several implementations, such features may be combined with one or more other features of other implementations as may be desired and advantageous for any given or particular application.

[0090] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the invention disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary technical means in the art that are not disclosed in the present application, and the specification and embodiments are only considered as exemplary.

[0091] It will be appreciated that the present application is not limited to the exact construction that has been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof.

Claims

1. A dispensing control method for an automatic die bonding machine, characterized in that: include: When dispensing of a wafer of a previous model is completed, obtaining model identification information of a wafer of a subsequent model, and obtaining target dispensing control parameters corresponding to the model identification information; Controlling the dispensing process of the wafer of the latter model according to the target dispensing control parameters; Wherein, the target dispensing control parameter is determined by the following method: According to the initial dispensing control parameters, dispensing is performed on the first wafer and the second wafer of the target model, and the dispensing area ratios of the first wafer and the second wafer after dispensing are obtained; the target model is the model indicated by the model identification information; When it is determined that there is at least one wafer with abnormal glue dispensing in the first wafer and the second wafer after glue dispensing according to the proportion of the glue dispensing area of ​​the first wafer and the second wafer after glue dispensing, the outer contour difference value of the first wafer and the second wafer before glue dispensing is obtained; the outer contour difference value is used to characterize the degree of difference in the outer contour between the first wafer and the second wafer; According to the proportion of the glue spotting area of ​​the first wafer after glue spotting, the proportion of the glue spotting area of ​​the second wafer after glue spotting, and the outer contour difference value, the initial glue spotting control parameters are adjusted to obtain the target glue spotting control parameters.

2. The dispensing control method of the automatic die bonding machine according to claim 1, characterized in that: Adjusting the initial dispensing control parameters to obtain the target dispensing control parameters includes: P=M×e a×C , P is the target dispensing control parameter, M is the initial dispensing control parameter, e is a natural constant, a is a preset positive number, C is an adjustment coefficient, C=D1×k1+D2×k2+D3×k3, D1 is the outer contour difference value, k1 is a first coefficient predetermined for the outer contour difference value, D2 is the difference value in the dispensing area ratio between the first wafer and the second wafer, k2 is a second coefficient predetermined for the difference value in the dispensing area ratio of different wafers after dispensing, D3 is the difference value between the specified dispensing area ratio and the dispensing area ratio of the first wafer, k3 is a third coefficient predetermined for the difference value between the specified dispensing area ratio and the dispensing area ratio of the wafer.

3. The dispensing control method of the automatic die bonding machine according to claim 2, characterized in that: The first coefficient, the second coefficient and the third coefficient are obtained by: The difference in outer contours between two different wafers in the same batch is taken as the first parameter value; the difference in the percentage of the dispensing area of ​​different wafers in the same batch is taken as the second parameter value; and the difference between the percentage of the specified dispensing area and the percentage of the dispensing area of ​​the wafers after dispensing in the same batch is taken as the third parameter value; According to different values ​​of the same target parameter value and the corresponding dispensing quality evaluation value, the variance analysis method is used to determine the significance value corresponding to the target parameter value; The target parameter value is any one of the first parameter value, the second parameter value and the third parameter value; determine the sum of the significance values ​​corresponding to the first parameter value, the second parameter value and the third parameter value, and take the ratio of the significance value corresponding to the target parameter value to the sum as the coefficient corresponding to the target parameter value.

4. The dispensing control method of the automatic die bonding machine according to claim 1, characterized in that: The proportion of the glue dispensing area of ​​the first wafer and the second wafer after dispensing is determined by the following method: Acquire a first surface image of the first wafer after glue dispensing, and acquire a second surface image of the second wafer after glue dispensing; Performing image segmentation on the glue spotting area in the first surface image to obtain a first glue spotting area, and performing image segmentation on the glue spotting area in the second surface image to obtain a second glue spotting area; The ratio of the area of ​​the first glue spotting area to the specified glue spotting area is used as the glue spotting area ratio of the first chip after glue spotting; the ratio of the area of ​​the second glue spotting area to the specified glue spotting area is used as the glue spotting area ratio of the second chip after glue spotting.

5. The dispensing control method of the automatic die bonding machine according to claim 1, characterized in that: The difference in outer contours between the first wafer and the second wafer before dispensing is obtained by the following method: Acquire a third surface image of the first wafer before glue dispensing, and acquire a fourth surface image of the second wafer before glue dispensing; the third surface image and the fourth surface image are pre-collected before glue dispensing; Performing edge detection on the third surface image to obtain a first edge image, and performing edge detection on the fourth surface image to obtain a second edge image; The midpoint of the first edge image and the midpoint of the second edge image are placed at the same coordinate origin to determine the Chamfer distance between the outer edge pixel point in the first edge image and the outer edge pixel point in the second edge image, and the Chamfer distance is used as the outer contour difference value.

6. The dispensing control method of the automatic die bonding machine according to claim 5, characterized in that: The Chamfer distance is obtained by: W is the Chamfer distance, L1 is the number of outer edge pixels in the first edge image, A1 is the set of outer edge pixels in the first edge image, d(a, A2) is the shortest distance from outer edge pixel a in the first edge image to all edge pixels in the second edge image, L2 is the number of outer edge pixels in the second edge image, A2 is the set of outer edge pixels in the second edge image, and d(b, A1) is the shortest distance from outer edge pixel b in the second edge image to all edge pixels in the first edge image.

7. The dispensing control method of the automatic die bonding machine according to any one of claims 1 to 6, characterized in that: The method further comprises: When it is determined that there is no wafer with abnormal glue dispensing in the first wafer and the second wafer after glue dispensing based on the glue dispensing area ratio of the first wafer and the second wafer after glue dispensing, the initial glue dispensing control parameter is used as the target glue dispensing control parameter.

8. A dispensing control system for an automatic die bonding machine, characterized in that: include: A processor and a memory, wherein the memory stores computer program instructions, and when the computer program instructions are executed by the processor, the dispensing control method of the automatic crystal bonding machine according to any one of claims 1-7 is implemented.

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