Cutting device and crystal bar cutting method and equipment

Abstract

The invention provides a cutting device and a crystal bar cutting method and equipment. The device comprises a lifting control module, a laser cutting module and a linear cutting module. The laser cutting module comprises a plurality of laser emitters arranged in the first direction. The laser cutting module is used for pre-cutting the crystal bar at a first depth in a second direction to obtain a plurality of cutting openings; the lifting control module and the linear cutting module are arranged on the two sides of the laser cutting module in the second direction. The lifting control module is used for controlling the crystal bar to move along the second direction; the wire cutting module comprises two rotating shafts which are oppositely arranged and a cutting wire which winds the two rotating shafts by a preset number of turns; and a laser beam emitted by each laser emitter and the corresponding cutting line wound on the rotating shaft are positioned on a first plane. According to the scheme, the problems that the cutting knife feeding position is abnormal easily due to a linear cutting method, and the wafer quality is reduced easily due to a laser cutting method are solved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a cutting device, a crystal rod cutting method and equipment. Background Art

[0002] In the semiconductor manufacturing industry, wire cutting technology is used to cut crystal rods into slices to achieve the transformation from crystal rods to wafers. During the entire cutting process, the processing table carrying the crystal rod changes speed and descends, approaches the wire cutting machine, and cuts the crystal rod through the reciprocating cutting wire. During the cutting process, the speed of the crystal rod movement is determined by the contact length between the cutting wire and the crystal rod. The longer the contact, the slower the movement speed. That is, when cutting at the entry position, the contact length is short and the movement speed of the crystal rod is high, which can easily cause abnormal cutting at the entry position. Although the laser cutting method has the advantage of high cutting accuracy, the heat-affected zone is larger when the crystal rod diameter is larger, and the local high temperature will affect the quality of the wafer. Summary of the invention

[0003] The embodiments of the present invention provide a cutting device, a crystal rod cutting method and equipment, which are used to solve the problems in the prior art that the wire cutting method easily leads to abnormal cutting knife position, and the laser cutting method easily leads to reduced wafer quality.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] In a first aspect, an embodiment of the present invention provides a cutting device, comprising:

[0006] Lifting control module, laser cutting module and wire cutting module;

[0007] The laser cutting module comprises a plurality of laser emitters arranged along a first direction; the laser cutting module is used to pre-cut the crystal rod to a first depth along a second direction to obtain a plurality of cutting openings, the first direction is the axial direction of the crystal rod, and the second direction is the radial direction of the crystal rod; the first depth is smaller than the diameter of the crystal rod;

[0008] The lifting control module and the wire cutting module are arranged on both sides of the laser cutting module along the second direction; the lifting control module is used to control the movement of the crystal rod along the second direction;

[0009] The wire cutting module comprises two rotating shafts arranged opposite to each other and a cutting wire having a preset number of turns around the two rotating shafts; the wire cutting module is used for cutting the crystal rod from the cutting opening along the second direction;

[0010] The laser beam emitted by each laser emitter and the corresponding cutting line arranged around the rotating shaft are located on a first plane, and the first plane is a plane perpendicular to the first direction.

[0011] Furthermore, the number of the laser emitters is less than or equal to the number of turns of the cutting line around the rotating shaft.

[0012] Furthermore, the laser emission module further comprises: a detector for detecting the passage of the crystal rod, and sending a start instruction message to the laser emitter when the passage of the crystal rod is detected;

[0013] The detector is arranged on a side of the laser emission module away from the wire cutting module.

[0014] Furthermore, the first depth ranges from one fifth to one quarter of the diameter of the crystal rod.

[0015] Further, the laser cutting module comprises: a first laser emitter group and a second laser emitter group;

[0016] The first laser emitter group and the second laser emitter group are arranged opposite to each other along the first direction, and a distance between the first laser emitter group and the second laser emitter group is less than or equal to a distance between the two rotation axes.

[0017] Further, the first laser emitter group and the second laser emitter group each include a plurality of laser emitters, and the number of the laser emitters in the first laser emitter group is the same as the number of the laser emitters in the second laser emitter group.

[0018] Furthermore, the laser cutting module is arranged on one side of the wire cutting module through a support rod.

[0019] In a second aspect, an embodiment of the present invention provides a crystal rod cutting method, which is applied to the cutting device as described above, comprising:

[0020] Controlling the crystal rod to move toward the laser cutting module at a uniform speed through the lifting control module;

[0021] Starting the laser cutting module to cut the crystal rod to a first depth to obtain a cutting entrance;

[0022] Controlling the crystal rod to move toward the wire cutting module at a uniform speed by the lifting control module;

[0023] The crystal rod is cut from the cutting entrance by the cutting wire of the wire cutting module.

[0024] Furthermore, when the detector of the laser emission module detects that the crystal rod is approaching, a start instruction message is sent to the laser cutting module, so that the laser cutting module is started for a preset time after a preset time.

[0025] In a third aspect, an embodiment of the present invention provides a crystal rod cutting device, comprising: a transceiver, a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps of the crystal rod cutting method described above are implemented.

[0026] The beneficial effects of the present invention are:

[0027] The cutting device of the embodiment of the present invention pre-cuts the crystal rod by the laser cutting module to obtain a cutting opening, thereby avoiding abnormal cutting entry position caused by wire cutting; after pre-cutting the first depth by the laser cutting module, wire cutting is continued from the cutting opening to complete the cutting of the crystal rod. The cutting device of the embodiment of the present application can ensure that the cutting shape at the cutting opening is normal while avoiding the problem of excessive local temperature caused by laser cutting leading to reduced wafer quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram showing the structure of a cutting device according to an embodiment of the present invention;

[0029] Figure 2 A schematic diagram showing a first depth of cutting a crystal rod according to an embodiment of the present invention;

[0030] Figure 3 A schematic diagram showing the steps of a method for cutting a crystal rod according to an embodiment of the present invention;

[0031] Figure 4 A schematic diagram of a module of a crystal rod cutting device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0032] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will be described in detail in conjunction with the accompanying drawings and specific embodiments. In the following description, specific details such as specific configurations and components are provided only to help fully understand the embodiments of the present invention. Therefore, it should be clear to those skilled in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present invention. In addition, for clarity and brevity, the description of known functions and structures is omitted.

[0033] It should be understood that the references to "one embodiment" or "an embodiment" throughout the specification mean that the specific features, structures, or characteristics associated with the embodiment are included in at least one embodiment of the present invention. Therefore, the references to "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0034] The present invention aims to solve the problems in the prior art that the wire cutting method easily leads to abnormal cutting knife position, and the laser cutting method easily leads to reduced wafer quality, and provides a cutting device, a crystal rod cutting method and equipment.

[0035] like Figure 1 As shown, an embodiment of the present application provides a cutting device, comprising:

[0036] Lifting control module 1, laser cutting module and wire cutting module;

[0037] The laser cutting module comprises a plurality of laser emitters 2 arranged along a first direction; the laser cutting module is used to pre-cut the crystal rod 3 to a first depth along a second direction to obtain a plurality of cutting openings, the first direction is the axial direction of the crystal rod 3, and the second direction is the radial direction of the crystal rod 3; the first depth is less than the diameter of the crystal rod 3;

[0038] The lifting control module 1 and the wire cutting module are arranged on both sides of the laser cutting module along the second direction; the lifting control module is used to control the movement of the crystal rod 3 along the second direction;

[0039] The wire cutting module comprises two rotating shafts 41 arranged opposite to each other and a cutting wire 42 with a preset number of turns around the two rotating shafts; the wire cutting module is used to cut the crystal rod 3 from the cutting opening along the second direction;

[0040] The laser beam 21 emitted by each laser emitter 2 and the corresponding cutting line 42 arranged around the rotating shaft 41 are located on a first plane, and the first plane is a plane perpendicular to the first direction.

[0041] Optionally, the first direction is a horizontal direction, and the second direction is a vertical direction.

[0042] In an embodiment of the present application, the crystal rod is controlled by the lifting control module to move vertically downward, close to the laser cutting module, and the crystal rod is pre-cut by the laser beam emitted by the laser emitter, and the cutting depth is a first depth, and the cutting opening is obtained by cutting the first depth; after cutting the first depth, the laser emitter is turned off, and the lifting control module continues to move downward, close to the wire cutting module, and for each cutting opening cut by the laser emitter, the corresponding cutting line enters the crystal rod from the cutting opening, and continues to cut until the cutting is completed.

[0043] The cutting device of the embodiment of the present invention pre-cuts the crystal rod by the laser cutting module to obtain a cutting opening, thereby avoiding abnormal cutting entry position caused by wire cutting; after pre-cutting the first depth by the laser cutting module, wire cutting is continued from the cutting opening to complete the cutting of the crystal rod. The cutting device of the embodiment of the present application can ensure that the cutting shape at the cutting opening is normal while avoiding the problem of excessive local temperature caused by laser cutting leading to reduced wafer quality.

[0044] It should be noted that the first cutting depth can be achieved by controlling the on-time of the laser emitter; specifically:

[0045] The activation time of the laser emitter is determined according to the uniform motion speed of the lifting control module and the first depth.

[0046] In the embodiment of the present application, the on time of the laser emitter is the quotient of the first depth and the speed of the uniform motion of the lifting control module.

[0047] Optionally, the number of the laser emitters is less than or equal to the number of turns of the cutting wire around the rotating shaft.

[0048] In the embodiment of the present application, when the number of the laser emitters is equal to the number of turns of the cutting wire on the rotating shaft, the laser cutting module cuts N cutting openings on the crystal rod, and then the crystal rod is further cut from the cutting openings by N cutting wires, and finally N+1 cutting pieces are obtained;

[0049] Wherein, N is a positive integer.

[0050] It should be noted that the service life of the laser emitter is relatively long, and even if a failure occurs, it can be repaired or replaced, so the number of laser emitters is a fixed value; however, during the use of the wire cutter, the surface of the wire groove at the cutting wire introduction position or the lead-out position may be damaged, resulting in the need to move the introduction position or the lead-out position toward the center of the rotating shaft, resulting in the number of windings of the cutting wire on the rotating shaft gradually decreasing with the increase in usage time; therefore, by setting the number of the laser emitters to be less than the number of windings of the cutting wire on the rotating shaft, the number of the laser emitters can be equal to the number of windings of the cutting wire on the rotating shaft as the number of windings of the cutting wire gradually decreases, thereby ensuring that most positions of the crystal rod are cut by the laser cutting module and the wire cutting module.

[0051] Optionally, the laser emission module further includes: a detector, configured to detect the passage of the crystal rod, and send a start instruction message to the laser emitter when the passage of the crystal rod is detected;

[0052] The detector is arranged on a side of the laser emission module away from the wire cutting module.

[0053] Optionally, the start-up instruction information is used to instruct the laser emitter to turn on after a preset time.

[0054] Optionally, the preset time is determined by a vertical distance between the detector and a laser beam emitted by the laser emitter.

[0055] In the embodiment of the present application, the preset time is the quotient of the vertical distance and the speed of the uniform motion of the lifting control module.

[0056] The cutting device of the embodiment of the present application, by setting the detector, can accurately judge the time when the crystal rod approaches the laser cutting module, thereby determining the start time of the laser emitter to avoid pre-cutting failure of the cutting opening.

[0057] Optionally, the first depth ranges from one fifth to one quarter of the diameter of the crystal rod.

[0058] In the present application embodiment, Figure 2 As shown, the diameter of the crystal rod is 280 mm and the first depth is 60 mm.

[0059] The cutting device of the embodiment of the present application cuts the crystal rod to the first depth through the laser cutting module, which can not only avoid the light-shielding cutting depth being too deep and causing local high temperature, but also provide a cutting opening for the wire cutting module, which can simultaneously avoid cutting abnormalities caused by wire cutting.

[0060] Optionally, the laser cutting module comprises: a first laser emitter group and a second laser emitter group;

[0061] The first laser emitter group and the second laser emitter group are arranged opposite to each other along the first direction, and a distance between the first laser emitter group and the second laser emitter group is less than or equal to a distance between the two rotation axes.

[0062] Optionally, the first laser emitter group and the second laser emitter group each include a plurality of laser emitters, and the number of the laser emitters in the first laser emitter group is the same as the number of the laser emitters in the second laser emitter group.

[0063] Optionally, the laser emitters of the first laser emitter group and the laser emitters of the second laser emitter group are arranged alternately.

[0064] The cutting device of the embodiment of the present application avoids the shortage of the laser emitters due to space congestion by relatively arranging the first laser emitter group and the second laser emitter group, and can arrange more laser emitters, thereby improving the efficiency of crystal rod cutting.

[0065] Optionally, the laser cutting module is arranged on one side of the wire cutting module through a support rod 5 .

[0066] like Figure 3 As shown, the embodiment of the present application also provides a crystal rod cutting method, which is applied to the cutting device as described above, and includes the following steps:

[0067] Step 301, controlling the crystal rod to move toward the laser cutting module at a uniform speed through the lifting control module;

[0068] Step 302, starting the laser cutting module to cut the crystal rod to a first depth to obtain a cutting entrance;

[0069] Step 303, controlling the crystal rod to move toward the wire cutting module at a uniform speed through the lifting control module;

[0070] Step 304 , cutting the crystal rod from the cutting entrance using the cutting wire of the wire cutting module.

[0071] It should be noted that the first cutting depth can be achieved by controlling the on-time of the laser emitter; specifically:

[0072] The activation time of the laser emitter is determined according to the uniform motion speed of the lifting control module and the first depth.

[0073] In the embodiment of the present application, the on time of the laser emitter is the quotient of the first depth and the speed of the uniform motion of the lifting control module.

[0074] The crystal rod cutting method of the embodiment of the present invention pre-cuts the crystal rod by the laser cutting module to obtain a cutting opening, thereby avoiding abnormal cutting entry position caused by wire cutting; after pre-cutting the first depth by the laser cutting module, wire cutting is continued from the cutting opening to complete the cutting of the crystal rod. The cutting device of the embodiment of the present application can ensure that the cutting shape at the cutting opening is normal while avoiding the problem of excessive local temperature caused by laser cutting leading to reduced wafer quality.

[0075] Optionally, when the detector of the laser emission module detects that the crystal rod is approaching, a start instruction message is sent to the laser cutting module, so that the laser cutting module is started for a preset time after a preset time.

[0076] Optionally, the preset time is determined by a vertical distance between the detector and a laser beam emitted by the laser emitter.

[0077] In the embodiment of the present application, the preset time is the quotient of the vertical distance and the speed of the uniform motion of the lifting control module.

[0078] Optionally, the preset duration is determined according to the first depth and the uniform motion speed of the lifting control module.

[0079] Specifically, the preset time length is the quotient of the first depth and the speed of the uniform motion of the lifting control module.

[0080] The crystal rod cutting method of the embodiment of the present application, by setting the detector, can accurately judge the time when the crystal rod is close to the laser cutting module, thereby determining the start time of the laser emitter to avoid pre-cutting failure of the cutting opening.

[0081] like Figure 4 As shown, the embodiment of the present application also provides a crystal rod cutting device 400, including the following:

[0082] A first control module, used for controlling the crystal rod to move toward the laser cutting module at a uniform speed through the lifting control module;

[0083] A first cutting module, used for starting the laser cutting module to cut the crystal rod to a first depth to obtain a cutting entrance;

[0084] A second control module, used for controlling the crystal rod to move toward the wire cutting module at a uniform speed through the lifting control module;

[0085] The second cutting module is used to cut the crystal rod from the cutting entrance through the cutting wire of the wire cutting module.

[0086] The crystal rod cutting device of the embodiment of the present invention pre-cuts the crystal rod by the laser cutting module to obtain a cutting opening, thereby avoiding abnormal cutting entry position caused by wire cutting; after pre-cutting the first depth by the laser cutting module, wire cutting is continued from the cutting opening to complete the cutting of the crystal rod. The cutting device of the embodiment of the present application can ensure that the cutting shape at the cutting opening is normal while avoiding the problem of excessive local temperature caused by laser cutting leading to reduced wafer quality.

[0087] Optionally, an embodiment of the present invention further provides a crystal rod cutting device, comprising: a transceiver, a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the crystal rod cutting method described above when executing the computer program.

[0088] In addition, a specific embodiment of the present invention further provides a computer-readable storage medium on which a computer program is stored, and when the program is executed by a processor, the steps of the above-mentioned crystal rod cutting method are implemented. And the same technical effect can be achieved, so it will not be repeated here to avoid repetition.

[0089] The embodiment of the present application also provides a computer program product, including computer instructions. When the computer instructions are executed by a processor, the various processes of the above-mentioned crystal rod cutting method embodiment are implemented and the same technical effect can be achieved. To avoid repetition, they are not repeated here.

[0090] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary personnel in this technical field, several improvements and modifications can be made without departing from the principles described in the present invention. These improvements and modifications are also within the scope of protection of the present invention.

Claims

1. A cutting device, characterized in that: include: Lifting control module, laser cutting module and wire cutting module; The laser cutting module includes a plurality of laser emitters arranged along a first direction; The laser cutting module is used to pre-cut the crystal rod to a first depth along a second direction to obtain a plurality of cutting openings, wherein the first direction is the axial direction of the crystal rod, and the second direction is the radial direction of the crystal rod; the first depth is smaller than the diameter of the crystal rod; The lifting control module and the wire cutting module are arranged on both sides of the laser cutting module along the second direction; the lifting control module is used to control the movement of the crystal rod along the second direction; The wire cutting module comprises two rotating shafts arranged opposite to each other and a cutting wire having a preset number of turns around the two rotating shafts; the wire cutting module is used for cutting the crystal rod from the cutting opening along the second direction; The laser beam emitted by each laser emitter and the corresponding cutting line arranged around the rotating shaft are located on a first plane, and the first plane is a plane perpendicular to the first direction.

2. The cutting device according to claim 1, characterized in that The number of the laser emitters is less than or equal to the number of turns of the cutting wire around the rotating shaft.

3. The cutting device according to claim 1, characterized in that: The laser emission module further includes: a detector for detecting the passage of the crystal rod and sending a start instruction message to the laser emitter when the passage of the crystal rod is detected; The detector is arranged on a side of the laser emission module away from the wire cutting module.

4. The cutting device according to claim 1, characterized in that: The first depth ranges from one fifth to one quarter of the diameter of the crystal rod.

5. The cutting device according to claim 1, characterized in that: The laser cutting module comprises: a first laser emitter group and a second laser emitter group; The first laser emitter group and the second laser emitter group are arranged opposite to each other along the first direction, and a distance between the first laser emitter group and the second laser emitter group is less than or equal to a distance between the two rotation axes.

6. The cutting device according to claim 5, characterized in that The first laser emitter group and the second laser emitter group each include a plurality of laser emitters, and the number of the laser emitters in the first laser emitter group is the same as the number of the laser emitters in the second laser emitter group.

7. The cutting device according to claim 1, characterized in that The laser cutting module is arranged on one side of the wire cutting module through a support rod.

8. A method for cutting a crystal rod, applied to the cutting device according to any one of claims 1 to 7, characterized in that: include: Controlling the crystal rod to move toward the laser cutting module at a uniform speed through the lifting control module; Starting the laser cutting module to cut the crystal rod to a first depth to obtain a cutting entrance; Controlling the crystal rod to move toward the wire cutting module at a uniform speed by the lifting control module; The crystal rod is cut from the cutting entrance by the cutting wire of the wire cutting module.

9. The method for cutting a crystal rod according to claim 8, characterized in that: When the detector of the laser emission module detects that the crystal rod is approaching, a start instruction message is sent to the laser cutting module, so that the laser cutting module is started for a preset time after a preset time.

10. A crystal rod cutting device, comprising: A transceiver, a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the crystal rod cutting method as claimed in claim 8 or 9 when executing the computer program.

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