Ultra-precision polishing method and polishing equipment for fine structure of tungsten carbide optical mold

Abstract

The invention discloses an ultra-precision polishing method and polishing equipment for a tungsten carbide optical mold fine structure, a mold electrode is abutted against an optical mold, a cathode of a direct current power supply is connected with a fine polishing electrode, and the surface of a to-be-polished area of the optical mold comprises a fine structure area. The method comprises the steps that the spatial position and the geometric posture of a micro polishing electrode are adjusted, so that the interval between the micro polishing electrode and a to-be-polished area of the optical mold is smaller than a preset interval; an electrochemical solution with an alkaline medium is sprayed to the to-be-polished area of the optical mold through the nozzle, so that the to-be-polished area and the alkaline medium in the electrochemical solution sprayed to the to-be-polished area are subjected to electrochemical reaction, and the solid tungsten carbide material on the surface of the to-be-polished area is converted into free tungstate radicals and removed; and the to-be-polished area is polished. According to the method, ultra-precision deterministic polishing can be carried out on the fine structure area of the tungsten carbide optical mold.

Description

Technical Field

[0001] The invention relates to the technical field of ultra-precision polishing, and in particular to an ultra-precision polishing method and polishing equipment for a tungsten carbide optical mold microstructure. Background Art

[0002] At present, optical component replication technologies include hot pressing, compression molding and injection molding, which are highly efficient and low-cost, and are very suitable for mass production of optical components. The core premise is that optical molds with micron-level or even submicron-level surface accuracy are required. Tungsten carbide has excellent physical and chemical properties and is currently one of the top optical mold materials. Ultra-precision polishing is the last process before optical mold coating, which directly determines the surface accuracy of the optical mold.

[0003] However, with the development of the optoelectronic industry, higher and higher requirements are placed on the size and surface accuracy of the fine structure areas on optical components and their molds. For example, there is a small transition arc area with a radius of only 0.2 to 1 mm between the aspheric area and the plane area in the existing aspheric optical molds. Its geometric size is much smaller than the minimum processing area size of the existing ultra-precision deterministic polishing methods of optical molds such as small grinding head polishing, airbag polishing, and magnetorheological polishing. Therefore, it is impossible to polish the above-mentioned fine structure area according to the existing processing methods. Electrochemical / electrolytic polishing can theoretically achieve the polishing of the entire optical mold including the fine structure area, but it is impossible to polish specific local areas and improve the surface accuracy. In addition, the geometric features of the molds corresponding to micro-optical elements represented by micro-array optical elements are only sub-millimeter or even micron-level, and it is completely impossible to perform ultra-precision deterministic polishing in the above-mentioned way, which makes it difficult to manufacture through replication technology, low efficiency, high cost, and difficult to maintain consistent component quality, which hinders the further large-scale application of micro-optical elements.

[0004] Therefore, an ultra-precision polishing method for the microstructure of a tungsten carbide optical mold is needed to solve the problems existing in the above technical solutions. Summary of the invention

[0005] To this end, the present invention provides an ultra-precision polishing method and polishing equipment for the microstructure of a tungsten carbide optical mold to solve or at least alleviate the above problems.

[0006] According to one aspect of the present invention, there is provided an ultra-precision polishing method for a tungsten carbide optical mold microstructure, which is performed in a polishing device, wherein the polishing device comprises a nozzle, a mold electrode, a micro-polishing electrode, and a DC power supply, wherein the anode of the DC power supply is connected to the mold electrode, the mold electrode is in contact with the optical mold, and the cathode of the DC power supply is connected to the micro-polishing electrode, wherein the surface of the area to be polished of the optical mold comprises a micro-structure area, wherein the method comprises: adjusting the spatial position and geometric posture of the micro-polishing electrode so that the interval between the micro-polishing electrode and the area to be polished of the optical mold is less than a predetermined interval; spraying an electrochemical solution having an alkaline medium onto the area to be polished of the optical mold through the nozzle, so that the area to be polished undergoes an electrochemical reaction with the alkaline medium in the electrochemical solution sprayed on the area to be polished, so that the solid tungsten carbide material on the surface of the area to be polished is converted into free tungstate and removed, thereby achieving polishing of the area to be polished.

[0007] Optionally, in the ultra-precision polishing method of the tungsten carbide optical mold microstructure according to the present invention, the polishing equipment also includes: a base, a first support frame installed on the base, a main shaft, and a vacuum suction cup fixed to the main shaft, the main shaft is fixed to the first support frame through a connecting member, and the main shaft is suitable for driving the vacuum suction cup to rotate; before adjusting the spatial position and geometric posture of the micro-polishing electrode, it also includes: controlling the vacuum suction cup to be in a vacuum state so as to install the optical mold through the vacuum suction cup.

[0008] Optionally, in the ultra-precision polishing method of the tungsten carbide optical mold microstructure according to the present invention, the polishing equipment also includes a liquid tank and a peristaltic pump. The liquid tank is arranged directly below the optical mold and is suitable for receiving the electrochemical solution during the polishing process of the area to be polished. The peristaltic pump is connected to the liquid tank and the nozzle through an infusion tube; the electrochemical solution having an alkaline medium is sprayed onto the area to be polished of the optical mold through the nozzle, comprising: controlling the peristaltic pump to drive the electrochemical solution in the liquid tank to flow to the nozzle through the infusion tube, so that the electrochemical solution is sprayed on the area to be polished of the optical mold through the nozzle, and the electrochemical solution is suitable for falling into the liquid tank.

[0009] Optionally, in the ultra-precision polishing method of the tungsten carbide optical mold microstructure according to the present invention, the polishing equipment also includes a horizontal displacement platform and a posture bracket fixed to the horizontal displacement platform, and a micro-polishing electrode is fixed to the posture bracket; adjusting the spatial position and geometric posture of the micro-polishing electrode so that the interval between the micro-polishing electrode and the area to be polished of the optical mold is less than a predetermined interval, including: adjusting the spatial position and geometric posture of the micro-polishing electrode through the horizontal displacement platform and the posture bracket, and then adjusting the interval between the micro-polishing electrode and the surface of the area to be polished of the optical mold so that the interval between the micro-polishing electrode and the area to be polished of the optical mold is less than a predetermined interval.

[0010] Optionally, in the ultra-precision polishing method of the tungsten carbide optical mold microstructure according to the present invention, the method also includes: adjusting the spatial position and geometric posture of the micro-polishing electrode by the horizontal displacement platform and the posture bracket, and then adjusting the interval between the local area of ​​the surface of the area to be polished and the surface of the micro-polishing electrode, so as to adjust the removal rate of the solid tungsten carbide material in the local area.

[0011] Optionally, in the ultra-precision polishing method of the tungsten carbide optical mold microstructure according to the present invention, the method also includes: controlling the residence time of the micro-polishing electrode at the intervals of the local area on the surface of the area to be polished, so as to control the amount of solid tungsten carbide material removed from the local area.

[0012] Optionally, in the ultra-precision polishing method of the tungsten carbide optical mold microstructure according to the present invention, the polishing equipment also includes a displacement drive component connected to the horizontal displacement platform and a posture drive component connected to the posture bracket; the spatial position and geometric posture of the micro-polishing electrode are adjusted by the horizontal displacement platform and the posture bracket, including: controlling the displacement drive component to drive the horizontal displacement platform to move along the first horizontal direction or the second horizontal direction to drive the posture bracket and the micro-polishing electrode to move synchronously so as to adjust the spatial position of the micro-polishing electrode, the first horizontal direction is perpendicular to the second horizontal direction; controlling the posture drive component to drive the posture bracket to drive the micro-polishing electrode to move so as to adjust the geometric posture of the micro-polishing electrode.

[0013] Optionally, in the ultra-precision polishing method of the tungsten carbide optical mold microstructure according to the present invention, during the electrochemical reaction, the distance between the surface of the to-be-polished area of ​​the optical mold and the surface of the micro-polishing electrode changes continuously, wherein when the distance between the surface of the to-be-polished area of ​​the optical mold and the surface of the micro-polishing electrode is greater than a predetermined distance, the electrochemical reaction stops.

[0014] Optionally, in the ultra-precision polishing method of the tungsten carbide optical mold microstructure according to the present invention, the electrochemical reaction process is as follows:

[0015]

[0016] Optionally, in the ultra-precision polishing method of the tungsten carbide optical mold microstructure according to the present invention, the composition ratio of the electrochemical solution is as follows:

[0017] Potassium ferrocyanide (K3[Fe(CN)6]):potassium hydroxide (KOH):deionized water (DI) = 1:1:10.

[0018] Optionally, in the ultra-precision polishing method of the tungsten carbide optical mold microstructure according to the present invention, the microstructure is a millimeter-level or micrometer-level microstructure; the micro-polishing electrode is a millimeter-level or micrometer-level micro-polishing electrode.

[0019] Optionally, in the ultra-precision polishing method of the tungsten carbide optical mold microstructure according to the present invention, the microstructure area includes a transition arc area with a radius of 0.2 to 1 mm.

[0020] According to one aspect of the present invention, there is provided a polishing device, comprising: a nozzle, arranged above an optical mold, suitable for spraying an electrochemical solution having an alkaline medium onto an area to be polished of the optical mold, wherein the area to be polished of the optical mold includes a microstructure area; a mold electrode, abutting the optical mold; a micro-polishing electrode, the interval between the micro-polishing electrode and the area to be polished of the optical mold being less than a predetermined interval; a DC power supply, the anode of the DC power supply being connected to the mold electrode, and the cathode of the DC power supply being connected to the micro-polishing electrode, so that the area to be polished undergoes an electrochemical reaction with the alkaline medium in the electrochemical solution sprayed on the area to be polished, so that the solid tungsten carbide material on the surface of the area to be polished is converted into free tungstate and removed, thereby achieving polishing of the area to be polished.

[0021] Optionally, the polishing equipment according to the present invention further includes: a base, on which a first support frame is installed; a main shaft, which is fixed to the first support frame through a connecting member; a vacuum suction cup, which is fixed to the main shaft and is suitable for rotating when driven by the main shaft, and the vacuum suction cup is used to install the optical mold.

[0022] Optionally, the polishing equipment according to the present invention further includes: a liquid storage tank, arranged directly below the optical mold, suitable for receiving the electrochemical solution during the polishing process of the area to be polished; a peristaltic pump, connected to the liquid storage tank and the nozzle through an infusion tube; wherein the electrochemical solution in the liquid storage tank flows to the nozzle through the infusion tube under the drive of the peristaltic pump, so that the electrochemical solution is sprayed on the area to be polished of the optical mold through the nozzle and falls into the liquid storage tank.

[0023] Optionally, the polishing equipment according to the present invention also includes: a horizontal displacement platform; a posture bracket, which is fixed to the horizontal displacement platform, and the micro-polishing electrode is fixed to the posture bracket, so as to adjust the spatial position and geometric posture of the micro-polishing electrode through the horizontal displacement platform and the posture bracket, and then adjust the distance between the micro-polishing electrode and the surface of the area to be polished of the optical mold.

[0024] Optionally, in the polishing equipment according to the present invention, the horizontal displacement platform and the posture support are suitable for adjusting the spatial position and geometric posture of the micro-polishing electrode to adjust the interval between the local area of ​​the surface of the area to be polished and the surface of the micro-polishing electrode, so as to adjust the removal rate of solid tungsten carbide material in the local area.

[0025] Optionally, the polishing device according to the present invention also includes: a displacement drive component, connected to the horizontal displacement platform, suitable for driving the horizontal displacement platform to move along the first horizontal direction or the second horizontal direction, so as to drive the posture bracket and the micro-polishing electrode to move synchronously, so as to adjust the spatial position of the micro-polishing electrode, the first horizontal direction is perpendicular to the second horizontal direction; a posture drive component, connected to the posture bracket, suitable for driving the posture bracket to drive the micro-polishing electrode to move, so as to adjust the geometric posture of the micro-polishing electrode.

[0026] Optionally, in the polishing equipment according to the present invention, the surface of the area to be polished of the optical mold is an uneven surface, including a convex part, a flat part, and a concave part; wherein, the interval between the convex part and the surface of the micro-polishing electrode is smaller than the interval between the flat part and the surface of the micro-polishing electrode, and the interval between the flat part and the surface of the micro-polishing electrode is smaller than the interval between the concave part and the surface of the micro-polishing electrode, and during the electrochemical reaction, the discharge intensity of the convex part is greater than the discharge intensity of the flat part, and the discharge intensity of the flat part is greater than the discharge intensity of the concave part, so that the removal rate of the solid tungsten carbide material of the convex part of the surface of the area to be polished is greater than the removal rate of the solid tungsten carbide material of the flat part, and the removal rate of the solid tungsten carbide material of the flat part is greater than the removal rate of the solid tungsten carbide material of the concave part, so as to achieve the polishing of the uneven surface of the area to be polished and achieve the polishing of the area to be polished.

[0027] According to the technical solution of the present invention, an ultra-precision polishing method and polishing equipment for a microstructure of a tungsten carbide optical mold are provided, wherein the area to be polished of the optical mold includes a microstructure area, by connecting the anode of a DC power supply to a mold electrode, abutting the mold electrode to the optical mold, and connecting the cathode of the DC power supply to a micro-polishing electrode, while ensuring that the interval between the micro-polishing electrode and the area to be polished of the optical mold is less than a predetermined interval, spraying an electrochemical solution having an alkaline medium to the area to be polished through a nozzle, the area to be polished can electrochemically react with the alkaline medium in the electrochemical solution, so that the solid tungsten carbide material on the surface of the area to be polished is converted into free tungstate and removed, thereby realizing ultra-precision polishing of the area to be polished with a microstructure. It should be noted that the end of the micro-polishing electrode does not need to transfer a load, and the size of the end of the micro-polishing electrode can be flexibly adjusted to the millimeter level or micrometer level according to the size of the micro-structure area. In this way, based on the end of the micro-polishing electrode, ultra-precision deterministic polishing of the micro-structure area of ​​the tungsten carbide optical mold can be realized, thereby improving the overall surface accuracy of the optical mold and broadening the design space of the optical element. Furthermore, the present invention can realize ultra-precision deterministic polishing of optical molds corresponding to micro-optical elements represented by micro-array optical elements, which is beneficial to improving the manufacturing efficiency of micro-optical elements and reducing manufacturing costs.

[0028] In addition, the present invention can control the material removal efficiency of the local area by controlling and adjusting the interval between the local area of ​​the optical mold and the surface of the micro-polishing electrode, the residence time of the micro-polishing electrode at the interval of the local area, or the concentration of the electrochemical solution, thereby further realizing fully controllable deterministic polishing of the optical mold.

[0029] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] To achieve the above and related purposes, certain illustrative aspects are described herein in conjunction with the following description and accompanying drawings, which indicate various ways in which the principles disclosed herein can be practiced, and all aspects and their equivalents are intended to fall within the scope of the claimed subject matter. The above and other purposes, features and advantages of the present disclosure will become more apparent by reading the following detailed description in conjunction with the accompanying drawings. Throughout the present disclosure, the same reference numerals generally refer to the same parts or elements.

[0031] Figure 1 A schematic structural diagram of a polishing device 100 provided according to an embodiment of the present invention is shown;

[0032] Figure 2 A partially enlarged structural schematic diagram of a polishing device 100 provided according to an embodiment of the present invention is shown;

[0033] Figure 3 A schematic flow chart of an ultra-precision polishing method 300 for a tungsten carbide optical mold microstructure provided according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0034] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0035] In view of the problem that the existing ultra-precision polishing scheme cannot polish the fine structure of the optical mold and cannot polish a specific local area, the present invention proposes an ultra-precision polishing method for the fine structure of a tungsten carbide optical mold. Based on the end of the micro-polishing electrode, ultra-precision deterministic polishing of the fine structure area of ​​the tungsten carbide optical mold can be achieved, thereby improving the overall surface accuracy of the optical mold.

[0036] The ultra-precision polishing method for the tungsten carbide optical mold microstructure provided by the embodiment of the present invention can be performed in a polishing device. The polishing device of the present invention is first introduced below.

[0037] According to an embodiment of the present invention, the optical mold can be pre-installed on a polishing device, so that the surface of the area to be polished of the optical mold (including the fine structure area) can be ultra-precision polished by the polishing device. The surface of the area to be polished of the optical mold includes the fine structure area. That is, according to the polishing device of the present invention, the surface of the area to be polished of the tungsten carbide optical mold (including the fine structure area) can be ultra-precision polished.

[0038] Figure 1 A schematic structural diagram of a polishing device 100 provided according to an embodiment of the present invention is shown; Figure 2 A partially enlarged structural schematic diagram of a polishing device 100 provided according to an embodiment of the present invention is shown.

[0039] like Figure 1 and Figure 2 As shown, the polishing device 100 includes a nozzle 113, a mold electrode 112, a micro-polishing electrode 116, and a DC power supply 111. The anode of the DC power supply 111 is connected to the mold electrode 112, and the mold electrode 112 is in direct contact with the optical mold 114, so that the optical mold 114 serves as an anode. The cathode of the DC power supply 111 is connected to the micro-polishing electrode 116. Specifically, the anode of the DC power supply 111 can be connected to the mold electrode 112 through the wire 110, and the cathode of the DC power supply 111 can be connected to the micro-polishing electrode 116 through the wire 110.

[0040] It should be noted that there is a minute interval of millimeter or micrometer level between the micro-polishing electrode 116 and the area to be polished of the optical mold 114, and the interval between the micro-polishing electrode 116 and the area to be polished of the optical mold 114 is smaller than a predetermined interval.

[0041] The nozzle 113 is arranged above the optical mold 114 , and the electrochemical solution 120 having an alkaline medium can be sprayed onto the to-be-polished region of the optical mold 114 through the nozzle 113 .

[0042] In the process of spraying the electrochemical solution 120 containing alkaline medium to the to-be-polished area of ​​the optical mold 114 through the nozzle 113, under the action of the external electric field, the to-be-polished area of ​​the optical mold 114 as the anode can be connected to the alkaline medium (OH) in the electrochemical solution 120 sprayed on the to-be-polished area. - ) undergoes an electrochemical reaction, so that the solid tungsten carbide material (WC) on the surface of the area to be polished is converted into free tungstate (WO42-) and flows to the fine polishing electrode 116 serving as the cathode, thereby removing the solid tungsten carbide material on the surface of the area to be polished, thereby achieving polishing of the area to be polished.

[0043] It should be understood that the current loop of the above electrochemical reaction is as follows: DC power supply anode→wire→mold electrode→optical mold→electrochemical solution→micro-polished electrode→wire→DC power supply cathode.

[0044] It should be noted that the end of the micro-polishing electrode in the embodiment of the present invention (there is a small gap between it and the area to be polished of the optical mold 114) does not need to transfer load, so there is no constraint on the size design, and the size of the end of the micro-polishing electrode can be flexibly adjusted according to the size of the processing object (such as the micro-structure area) (for example, adjusted to the size of the millimeter or micron level). Since the end size of the micro-polishing electrode 116 is very small, the electric field strength is limited. Therefore, only when the gap between the micro-polishing electrode 116 and the area to be polished of the optical mold 114 is less than the predetermined gap, can it be ensured that the area to be polished and the alkaline medium in the electrochemical solution on the area to be polished undergo an electrochemical reaction. Based on this, it is also possible to achieve efficient removal of solid tungsten carbide material in a local area.

[0045] It should also be noted that, during the electrochemical reaction, as the solid tungsten carbide material on the surface of the area to be polished is continuously converted into free tungstate and removed, the radius of curvature of the surface of the area to be polished of the optical mold 114 also changes accordingly, and accordingly, the interval between the surface of the area to be polished of the optical mold 114 and the surface of the micro-polishing electrode also changes continuously. When the interval between the surface of the area to be polished of the optical mold 114 and the surface of the micro-polishing electrode is greater than the predetermined interval, the electrochemical reaction stops.

[0046] In the embodiment of the present invention, the microstructure may be a millimeter-level or micrometer-level microstructure, and the micro-polishing electrode 116 may be a millimeter-level or micrometer-level micro-polishing electrode.

[0047] In some embodiments, the fine structure region includes, for example, a transition arc region with a radius of 0.2-1 mm.

[0048] In some embodiments, the electrochemical reaction process is as follows:

[0049]

[0050] The composition ratio of the above electrochemical solution is as follows:

[0051] Potassium ferrocyanide (K3[Fe(CN)6]):potassium hydroxide (KOH):deionized water (DI) = 1:1:10.

[0052] In some embodiments, Figure 1 and Figure 2As shown, the polishing device 100 also includes a base 101, a spindle 104, and a vacuum suction cup 105. A DC power supply 111 can be fixedly mounted on the base 101. A first support frame 102 is mounted on the base 101, and the spindle 104 can be fixed on the first support frame 102 through a connector 103. The vacuum suction cup 105 is fixed to the spindle 104, and the spindle 104 can drive the vacuum suction cup 105 to rotate. The vacuum suction cup 105 can be used to install an optical mold 114. Specifically, the polishing device 100 can install or remove the optical mold 114 by controlling the ventilation state (whether ventilation) of the vacuum suction cup 105. Among them, the polishing device 100 can control the vacuum suction cup 105 to be in a vacuum state by exhausting air from the vacuum suction cup 105, thereby enabling the optical mold 114 to be installed on the spindle 104 of the polishing device 100; by ventilating the vacuum suction cup 105, the vacuum suction cup 105 can be controlled to be in a non-vacuum state, thereby enabling the optical mold 114 to be removed.

[0053] In some embodiments, Figure 1 and Figure 2 As shown, the polishing device 100 also includes a liquid tank 108 and a peristaltic pump 107. The liquid tank 108 can be arranged on the base 101, and the liquid tank 108 is arranged directly below the optical mold 114. The liquid tank 108 is used to receive the electrochemical solution during the polishing process of the area to be polished. The peristaltic pump 107 can be arranged on the base 101, and the peristaltic pump 107 can be connected to the liquid tank 108 and the nozzle 113 through the infusion tube 106.

[0054] In this embodiment, the electrochemical solution in the liquid tank 108 can flow to the nozzle 113 through the liquid infusion tube 106 under the drive of the peristaltic pump 107, and then the electrochemical solution can be sprayed on the area to be polished of the optical mold 114 through the nozzle 113, and then the electrochemical solution can fall into the liquid tank 108 to collect the electrochemical solution. In this way, the electrochemical solution can form a cycle between the liquid tank 108 and the area to be polished of the optical mold 114, and the electrochemical solution can be recycled.

[0055] In some embodiments, Figure 1 and Figure 2 As shown, the polishing device 100 further includes a horizontal displacement platform 118 and a posture bracket 115. The posture bracket 115 is fixed to the horizontal displacement platform 118, and the micro-polishing electrode 116 is fixed to the posture bracket 115, that is, the micro-polishing electrode 116 can be fixed to the horizontal displacement platform 118 through the posture bracket 115. Based on this, the spatial position and geometric posture of the micro-polishing electrode 116 can be adjusted by the horizontal displacement platform 118 and the posture bracket 115. By adjusting the spatial position and geometric posture of the micro-polishing electrode 116, the interval between the micro-polishing electrode 116 and the surface of the to-be-polished area of ​​the optical mold 114 can be adjusted.

[0056] In some embodiments, Figure 1 and Figure 2 As shown, the polishing device 100 further includes a second support frame 109, a third support frame 117, and a fourth support frame 119. The second support frame 109 is fixedly mounted on the base 101, the mold electrode 112 can be mounted on the second support frame 109 through the fourth support frame 119, and the horizontal displacement platform 118 can be mounted on the second support frame 109. The third support frame 117 is fixedly mounted on the horizontal displacement platform 118, and the posture support 115 is connected to the third support frame 117, that is, the posture support 115 can be fixedly mounted on the horizontal displacement platform 118 through the third support frame 117.

[0057] It should be noted that after the optical mold 114 is installed on the polishing device 100, the spatial position and geometric posture of the micro-polishing electrode 116 can be adjusted by the horizontal displacement platform 118 and the posture support 115, and then the interval between the micro-polishing electrode 116 and the surface of the area to be polished of the optical mold 114 can be adjusted so that the interval between the micro-polishing electrode 116 and the area to be polished of the optical mold 114 is less than the predetermined interval. Then, the electrochemical solution 120 with an alkaline medium can be sprayed to the area to be polished of the optical mold 114 through the nozzle 113, so that the area to be polished and the alkaline medium in the electrochemical solution 120 sprayed on the area to be polished undergo an electrochemical reaction.

[0058] It should be noted that, in the embodiment of the present invention, the smaller the distance between the surface of the to-be-polished area of ​​the optical mold 114 and the surface of the micro-polishing electrode, the higher the discharge intensity of the surface of the to-be-polished area, making the removal rate of the solid tungsten carbide material on the surface of the to-be-polished area faster.

[0059] In some embodiments, during the polishing process of the polishing device 100 on the optical mold 114, for the local area of ​​the surface of the optical mold 114 to be polished, the spatial position and geometric posture of the micro-polishing electrode 116 can be adjusted through the horizontal displacement platform 118 and the posture support 115 to adjust the interval between the local area of ​​the surface of the area to be polished and the surface of the micro-polishing electrode, so as to control and adjust the removal rate of the solid tungsten carbide material in the local area. In this way, the polishing control of the local area of ​​the optical mold can be achieved, and the deterministic ultra-precision polishing of the local area can be achieved.

[0060] It is worth noting that Figure 2As shown, from a microscopic perspective, the surface of the area to be polished of the optical mold 114 is an uneven surface, which includes a convex portion, a flat portion, and a concave portion. It can be understood that the interval between the convex portion and the surface of the micro-polishing electrode is smaller than the interval between the flat portion and the surface of the micro-polishing electrode, and the interval between the flat portion and the surface of the micro-polishing electrode is smaller than the interval between the concave portion and the surface of the micro-polishing electrode. Moreover, for a concave portion with a greater degree of concavity, the electrochemical solution may not completely infiltrate the surface of the concave portion. Therefore, during the electrochemical reaction, the discharge intensity of the convex portion is greater than the discharge intensity of the flat portion, and the discharge intensity of the flat portion is greater than the discharge intensity of the concave portion. Moreover, the greater the degree of upward convexity of the convex portion, the higher the discharge intensity of its tip. Based on this, the removal rate of solid tungsten carbide material in the raised part of the surface of the area to be polished is greater than the removal rate of solid tungsten carbide material in the flat part, and the removal rate of solid tungsten carbide material in the flat part is greater than the removal rate of solid tungsten carbide material in the recessed part, thereby achieving the purpose of polishing the area to be polished.

[0061] In addition, in some embodiments, during the polishing process of the optical mold 114 by the polishing device 100, the electrochemical reaction rate can be adjusted by adjusting the concentration of the electrochemical solution or the strength of the applied electric field, thereby adjusting the removal rate of the solid tungsten carbide material on the surface of the area to be polished.

[0062] In some embodiments, the polishing device 100 further includes a displacement drive component and a posture drive component (not shown in the figure). The displacement drive component is connected to the horizontal displacement platform 118, and the horizontal displacement platform 118 can be driven to move along the first horizontal direction or the second horizontal direction through the displacement drive component to drive the posture bracket 115 and the micro-polishing electrode 116 to move synchronously, thereby adjusting the spatial position of the micro-polishing electrode 116. The first horizontal direction is perpendicular to the second horizontal direction. The posture drive component is connected to the posture bracket 115, and the posture drive component can drive the posture bracket 115 to drive the micro-polishing electrode 116 to move, so as to adjust the geometric posture of the micro-polishing electrode 116. Based on this, it is possible to adjust the spatial position and geometric posture of the micro-polishing electrode 116 through the horizontal displacement platform 118 and the posture bracket 115, thereby adjusting the interval between the local area of ​​the surface of the area to be polished and the surface of the micro-polishing electrode.

[0063] In an embodiment of the present invention, the polishing device 100 can perform the ultra-precision polishing method 100 for the microstructure of a tungsten carbide optical mold to achieve ultra-precision deterministic polishing of the microstructure region of the tungsten carbide optical mold 114 .

[0064] According to the polishing device 100 provided by the embodiment of the present invention, the area to be polished of the optical mold includes a fine structure area, and the anode of the DC power supply is connected to the mold electrode, the mold electrode is abutted against the optical mold, and the cathode of the DC power supply is connected to the fine polishing electrode. Under the condition that the interval between the fine polishing electrode and the area to be polished of the optical mold is less than the predetermined interval, an electrochemical solution having an alkaline medium is sprayed to the area to be polished through a nozzle, and the area to be polished can be electrochemically reacted with the alkaline medium in the electrochemical solution, so that the solid tungsten carbide material on the surface of the area to be polished is converted into free tungstate and removed, thereby realizing ultra-precision polishing of the area to be polished with a fine structure. It should be noted that the end of the micro-polishing electrode does not need to transmit a load, and the size of the end of the micro-polishing electrode can be flexibly adjusted to the millimeter level or micrometer level according to the size of the fine structure area. In this way, based on the end of the micro-polishing electrode, ultra-precision deterministic polishing of the fine structure area of ​​the tungsten carbide optical mold can be realized, thereby improving the overall surface accuracy of the optical mold and broadening the design space of the optical element. Furthermore, the present invention can realize ultra-precision deterministic polishing of optical molds corresponding to micro-optical elements represented by micro-array optical elements, which is beneficial to improving the manufacturing efficiency of micro-optical elements and reducing manufacturing costs.

[0065] In addition, the present invention can control the material removal efficiency of the local area by controlling and adjusting the interval between the local area of ​​the optical mold and the surface of the micro-polishing electrode, the residence time of the micro-polishing electrode at the interval of the local area, or the concentration of the electrochemical solution, thereby further realizing fully controllable deterministic polishing of the optical mold.

[0066] Figure 3 The flowchart of an ultra-precision polishing method 300 for a tungsten carbide optical mold microstructure provided in accordance with an embodiment of the present invention is shown. The method 300 can be performed in the aforementioned polishing device 100 .

[0067] As described above, the polishing device 100 includes a nozzle 113, a mold electrode 112, a micro-polishing electrode 116, and a DC power supply 111. The nozzle 113 is arranged above the optical mold 114. The anode of the DC power supply 111 is connected to the mold electrode 112, and the mold electrode 112 is in direct contact with the optical mold 114, so that the optical mold 114 serves as an anode. The cathode of the DC power supply 111 is connected to the micro-polishing electrode 116. Specifically, the anode of the DC power supply 111 can be connected to the mold electrode 112 through the wire 110, and the cathode of the DC power supply 111 can be connected to the micro-polishing electrode 116 through the wire 110. It should be noted that there is a small gap of millimeter level or micrometer level between the micro-polishing electrode 116 and the area to be polished of the optical mold 114, and the gap between the micro-polishing electrode 116 and the area to be polished of the optical mold 114 is less than the predetermined gap.

[0068] like Figure 3 As shown, the ultra-precision polishing method 300 of a tungsten carbide optical mold microstructure includes the following steps 310-320.

[0069] Before executing step 310 , the optical mold 114 may be pre-installed on the polishing device 100 .

[0070] In step 310 , the spatial position and geometric posture of the micro-polishing electrode 116 are adjusted by the polishing device 100 so that the interval between the micro-polishing electrode 116 and the to-be-polished area of ​​the optical mold 114 is smaller than a predetermined interval.

[0071] In step 320, an electrochemical solution 120 having an alkaline medium is sprayed onto the area to be polished of the optical mold 114 through the nozzle 113 of the polishing device 100, so that the area to be polished undergoes an electrochemical reaction with the alkaline medium in the electrochemical solution 120 sprayed on the area to be polished. During the electrochemical reaction, the solid tungsten carbide material (WC) on the surface of the area to be polished of the optical mold 114 serving as the anode can be converted into free tungstate ions (WO42-) and removed, thereby achieving the effect of material removal, thereby enabling polishing of the area to be polished.

[0072] It should be noted that the end of the micro-polishing electrode in the embodiment of the present invention does not need to transfer load, so there is no constraint on the size design, and the size of the end of the micro-polishing electrode can be flexibly adjusted according to the size of the processing object (such as the micro-structure area) (for example, adjusted to the size of the millimeter or micron level). Since the end size of the micro-polishing electrode 116 is very small, the electric field strength is limited. Therefore, only when the interval between the micro-polishing electrode 116 and the area to be polished of the optical mold 114 is less than the predetermined interval, can it be ensured that the area to be polished and the alkaline medium in the electrochemical solution on the area to be polished undergo an electrochemical reaction. Based on this, it is also possible to achieve efficient removal of solid tungsten carbide material in a local area.

[0073] It should also be noted that, during the electrochemical reaction, as the solid tungsten carbide material on the surface of the area to be polished is continuously converted into free tungstate and removed, the radius of curvature of the surface of the area to be polished of the optical mold 114 also changes accordingly, and accordingly, the interval between the surface of the area to be polished of the optical mold 114 and the surface of the micro-polishing electrode also changes continuously. When the interval between the surface of the area to be polished of the optical mold 114 and the surface of the micro-polishing electrode is greater than the predetermined interval, the electrochemical reaction stops.

[0074] In the embodiment of the present invention, the microstructure may be a millimeter-level or micrometer-level microstructure, and the micro-polishing electrode 116 may be a millimeter-level or micrometer-level micro-polishing electrode.

[0075] In some embodiments, the fine structure region includes, for example, a transition arc region with a radius of 0.2-1 mm.

[0076] In some embodiments, the electrochemical reaction process is as follows:

[0077]

[0078] The composition ratio of the above electrochemical solution is as follows:

[0079] Potassium ferrocyanide (K3[Fe(CN)6]):potassium hydroxide (KOH):deionized water (DI) = 1:1:10.

[0080] In some embodiments, the polishing device 100 further includes a base 101, a spindle 104, and a vacuum suction cup 105. A DC power supply 111 can be fixedly mounted on the base 101. A first support frame 102 is mounted on the base 101, and the spindle 104 can be fixed to the first support frame 102 through a connector 103. The vacuum suction cup 105 is fixed to the spindle 104, and the spindle 104 can drive the vacuum suction cup 105 to rotate. The vacuum suction cup 105 can be used to install an optical mold 114. Specifically, the polishing device 100 can install or remove the optical mold 114 by controlling the ventilation state (whether ventilation) of the vacuum suction cup 105.

[0081] Before executing step 310 (adjusting the spatial position and geometric posture of the fine polishing electrode 116), the polishing device 100 can control the vacuum chuck 105 to be in a vacuum state, so as to install the optical mold 114 through the vacuum chuck 105. Specifically, the polishing device 100 can control the vacuum chuck 105 to be in a vacuum state by evacuating air from the vacuum chuck 105, thereby installing the optical mold 114 on the spindle 104 of the polishing device 100.

[0082] In some embodiments, the polishing device 100 further includes a liquid tank 108 and a peristaltic pump 107. The liquid tank 108 can be arranged on the base 101, and the liquid tank 108 is arranged directly below the optical mold 114. The liquid tank 108 is used to receive the electrochemical solution during the polishing process of the area to be polished. The peristaltic pump 107 can be arranged on the base 101, and the peristaltic pump 107 can be connected to the liquid tank 108 and the nozzle 113 through the infusion tube 106.

[0083] In this embodiment, in step 320, the specific method of spraying the electrochemical solution 120 having an alkaline medium onto the area to be polished of the optical mold 114 is as follows: the polishing device 100 can control the peristaltic pump 107 to drive the electrochemical solution in the liquid storage tank 108 to flow to the nozzle 113 through the infusion tube 106, and then spray the electrochemical solution onto the area to be polished of the optical mold 114 through the nozzle 113, and the electrochemical solution can then fall into the liquid storage tank 108 to collect the electrochemical solution.

[0084] In some embodiments, the polishing device 100 further includes a horizontal displacement platform 118 and a posture bracket 115 fixed to the horizontal displacement platform 118. The micro-polishing electrode 116 is fixed to the posture bracket 115, that is, the micro-polishing electrode 116 can be fixed on the horizontal displacement platform 118 through the posture bracket 115. Based on this, in step 310, the polishing device 100 can adjust the spatial position and geometric posture of the micro-polishing electrode 116 through the horizontal displacement platform 118 and the posture bracket 115, and then can adjust the interval between the micro-polishing electrode 116 and the surface of the area to be polished of the optical mold 114, so that the interval between the micro-polishing electrode 116 and the area to be polished of the optical mold 114 is less than the predetermined interval.

[0085] It should be noted that, in the embodiment of the present invention, the smaller the distance between the surface of the to-be-polished area of ​​the optical mold 114 and the surface of the micro-polishing electrode, the higher the discharge intensity of the surface of the to-be-polished area, making the removal rate of the solid tungsten carbide material on the surface of the to-be-polished area faster.

[0086] In some embodiments, during the polishing process of the polishing device 100 on the optical mold 114, the polishing device 100 can also adjust the spatial position and geometric posture of the micro-polishing electrode 116 for the local area of ​​the surface of the area to be polished of the optical mold 114 through the horizontal displacement platform 118 and the posture support 115 to adjust the interval between the local area of ​​the surface of the area to be polished and the surface of the micro-polishing electrode, so as to control and adjust the removal rate of the solid tungsten carbide material in the local area. In this way, the polishing control of the local area of ​​the optical mold can be achieved, and the deterministic ultra-precision polishing of the local area can be achieved.

[0087] In addition, during the polishing process of the optical mold 114 by the polishing device 100 , the polishing device 100 can also adjust the electrochemical reaction rate by adjusting the concentration of the electrochemical solution, thereby adjusting the removal rate of the solid tungsten carbide material on the surface of the area to be polished.

[0088] In some embodiments, during the polishing process of the polishing device 100 on the optical mold 114, the polishing device 100 can also control the residence time of the micro-polishing electrode 116 at the interval of the local area of ​​the surface of the area to be polished (i.e., the position less than the predetermined interval from the local area of ​​the surface of the area to be polished), so that the amount of solid tungsten carbide material removed from the local area can be controlled. It should be understood that the longer the residence time of the micro-polishing electrode 116, the more solid tungsten carbide material is removed from the local area.

[0089] It can be seen that in the embodiment of the present invention, the polishing equipment 100 can control the material removal efficiency of the local area by controlling and adjusting the interval between the local area of ​​the surface of the optical mold 114 to be polished and the surface of the micro-polishing electrode, the residence time of the micro-polishing electrode 116 at the local area interval, or the concentration of the electrochemical solution, thereby achieving deterministic ultra-precision polishing of the optical mold 114.

[0090] In some embodiments, the polishing device 100 further includes a displacement drive component connected to the horizontal displacement platform 118 and a posture drive component connected to the posture bracket 115. In step 310, the polishing device 100 can control the displacement drive component to drive the horizontal displacement platform 118 to move along the first horizontal direction or the second horizontal direction, so as to drive the posture bracket 115 and the micro-polishing electrode 116 to move synchronously through the horizontal displacement platform 118, thereby adjusting the spatial position of the micro-polishing electrode 116, where the first horizontal direction is perpendicular to the second horizontal direction. The polishing device 100 can also control the posture drive component to drive the posture bracket 115 to move, so as to drive the micro-polishing electrode 116 to move through the posture bracket 115, thereby adjusting the geometric posture of the micro-polishing electrode 116. Based on this, it is possible to adjust the spatial position and geometric posture of the micro-polishing electrode 116 through the horizontal displacement platform 118 and the posture bracket 115, thereby adjusting the interval between the local area of ​​the surface of the area to be polished and the surface of the micro-polishing electrode.

[0091] In some embodiments, the polishing device 100 further includes a control module, and the control logic and control-related steps in the above method 300 can be executed by the control module.

[0092] Thus, according to the ultra-precision polishing method 300 of the microstructure of the tungsten carbide optical mold provided by the embodiment of the present invention, the area to be polished of the optical mold includes a microstructure area, by connecting the anode of the DC power supply to the mold electrode, abutting the mold electrode to the optical mold, and connecting the cathode of the DC power supply to the micro-polishing electrode, while ensuring that the interval between the micro-polishing electrode and the area to be polished of the optical mold is less than the predetermined interval, spraying an electrochemical solution having an alkaline medium to the area to be polished through a nozzle, the area to be polished can be electrochemically reacted with the alkaline medium in the electrochemical solution, so that the solid tungsten carbide material on the surface of the area to be polished is converted into free tungstate and removed, thereby realizing ultra-precision polishing of the area to be polished with a microstructure. It should be noted that the end of the micro-polishing electrode does not need to transfer a load, and the size of the end of the micro-polishing electrode can be flexibly adjusted to the millimeter level or micrometer level according to the size of the micro-structure area. In this way, based on the end of the micro-polishing electrode, the micro-structure area of ​​the tungsten carbide optical mold can be ultra-precisely deterministically polished, thereby improving the overall surface accuracy of the optical mold and broadening the design space of the optical element. Furthermore, the present invention can realize ultra-precision deterministic polishing of optical molds corresponding to micro-optical elements represented by micro-array optical elements, which is beneficial to improving the manufacturing efficiency of micro-optical elements and reducing manufacturing costs.

[0093] In addition, the present invention can control the material removal efficiency of the local area by controlling and adjusting the interval between the local area of ​​the optical mold and the surface of the micro-polishing electrode, the residence time of the micro-polishing electrode at the interval of the local area, or the concentration of the electrochemical solution, thereby further realizing fully controllable deterministic polishing of the optical mold.

[0094] In addition, the embodiments of the present invention also disclose: A10, a method as described in any one of A1-A9, wherein the composition ratio of the electrochemical solution is as follows: potassium ferrocyanide (K3[Fe(CN)6]): potassium hydroxide (KOH): deionized water (DI) = 1:1:10. A11, a method as described in any one of A1-A10, wherein the microstructure is a millimeter-level or micrometer-level microstructure; the micro-polishing electrode is a millimeter-level or micrometer-level micro-polishing electrode. A12, a method as described in any one of A1-A11, wherein the microstructure area includes a transition arc area with a radius of 0.2 to 1 mm. B14, a polishing device as described in B13, wherein it also includes: a base, a first support frame is installed on the base; a main shaft, fixed to the first support frame by a connecting member; a vacuum suction cup, fixed to the main shaft, suitable for rotating under the drive of the main shaft, and the vacuum suction cup is used to install the optical mold. B15. The polishing equipment as described in B13 or B14, further comprising: a liquid storage tank, arranged directly below the optical mold, suitable for receiving the electrochemical solution during the polishing process of the area to be polished; a peristaltic pump, connected to the liquid storage tank and the nozzle through a liquid infusion tube; wherein the electrochemical solution in the liquid storage tank flows to the nozzle through the liquid infusion tube under the drive of the peristaltic pump, so that the electrochemical solution is sprayed on the area to be polished of the optical mold through the nozzle and falls into the liquid storage tank. B16. The polishing equipment as described in any one of B13-B15, further comprising: a horizontal displacement platform; a posture bracket, fixed to the horizontal displacement platform, and the micro-polishing electrode is fixed to the posture bracket, so that the spatial position and geometric posture of the micro-polishing electrode can be adjusted by the horizontal displacement platform and the posture bracket, thereby adjusting the interval between the micro-polishing electrode and the surface of the area to be polished of the optical mold. B17. The polishing device as described in B16, wherein the horizontal displacement platform and the posture bracket are suitable for adjusting the spatial position and geometric posture of the micro-polishing electrode, so as to adjust the interval between the local area of ​​the surface of the area to be polished and the surface of the micro-polishing electrode, so as to adjust the solid tungsten carbide material removal rate of the local area. B18. The polishing device as described in B16 or B17, wherein it also includes: a displacement drive component connected to the horizontal displacement platform, suitable for driving the horizontal displacement platform to move along the first horizontal direction or the second horizontal direction, so as to drive the posture bracket and the micro-polishing electrode to move synchronously, so as to adjust the spatial position of the micro-polishing electrode, the first horizontal direction is perpendicular to the second horizontal direction; a posture drive component connected to the posture bracket, suitable for driving the posture bracket to drive the micro-polishing electrode to move, so as to adjust the geometric posture of the micro-polishing electrode.B19. A polishing device as described in any one of B13-B18, wherein the surface of the area to be polished of the optical mold is an uneven surface, including a raised portion, a plane portion, and a recessed portion; wherein the interval between the raised portion and the surface of the micro-polishing electrode is smaller than the interval between the plane portion and the surface of the micro-polishing electrode, and the interval between the plane portion and the surface of the micro-polishing electrode is smaller than the interval between the recessed portion and the surface of the micro-polishing electrode, and during the electrochemical reaction, the discharge intensity of the raised portion is greater than the discharge intensity of the plane portion, and the discharge intensity of the plane portion is greater than the discharge intensity of the recessed portion, so that the removal rate of the solid tungsten carbide material of the raised portion of the surface of the area to be polished is greater than the removal rate of the solid tungsten carbide material of the plane portion, and the removal rate of the solid tungsten carbide material of the plane portion is greater than the removal rate of the solid tungsten carbide material of the recessed portion, so as to polish the uneven surface of the area to be polished to make it flat, and to polish the area to be polished.

[0095] In the description of this specification, unless otherwise clearly specified and limited, the terms "connected", "fixed", etc. should be understood in a broad sense. In addition, the directions or positional relationships indicated by the terms "front", "rear", "upper", "lower", "inner", "outer", "top", "bottom", etc. are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the equipment or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, cannot be understood as limiting the present invention.

[0096] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0097] Similarly, it should be understood that in order to streamline the present disclosure and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof.

[0098] Those skilled in the art should understand that the modules or units or components of the device in the examples disclosed herein may be arranged in the device as described in the embodiment, or alternatively may be located in one or more devices different from the device in the example.

[0099] Those skilled in the art will appreciate that the modules in the devices in the embodiments may be adaptively changed and arranged in one or more devices different from the embodiments. The modules or units or components in the embodiments may be combined into one module or unit or component, and furthermore may be divided into a plurality of submodules or subunits or subcomponents.

[0100] Furthermore, those skilled in the art will appreciate that although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features from different embodiments is meant to be within the scope of the present invention and to form different embodiments.

[0101] As used herein, unless otherwise specified, the use of ordinal numbers "first," "second," "third," etc. to describe common objects merely indicates that different instances of similar objects are involved, and is not intended to imply that the objects so described must have a given order in time, space, order, or in any other manner.

[0102] Although the present invention has been described according to a limited number of embodiments, it will be apparent to those skilled in the art, with the benefit of the above description, that other embodiments may be envisioned within the scope of the invention thus described. In addition, it should be noted that the language used in this specification is primarily selected for readability and instructional purposes, rather than for explaining or limiting the subject matter of the present invention.

Claims

1. An ultra-precision polishing method for a tungsten carbide optical mold microstructure is performed in a polishing device, the polishing device comprising a nozzle, a mold electrode, a micro-polishing electrode, and a DC power supply, wherein the anode of the DC power supply is connected to the mold electrode, the mold electrode is in contact with the optical mold, and the cathode of the DC power supply is connected to the micro-polishing electrode, and the surface of the optical mold to be polished includes a micro-structure area, wherein: The method comprises: Adjusting the spatial position and geometric posture of the micro-polishing electrode so that the interval between the micro-polishing electrode and the area to be polished of the optical mold is less than a predetermined interval; An electrochemical solution containing an alkaline medium is sprayed onto the area to be polished of the optical mold through the nozzle, so that the area to be polished undergoes an electrochemical reaction with the alkaline medium in the electrochemical solution sprayed on the area to be polished, so that the solid tungsten carbide material on the surface of the area to be polished is converted into free tungstate and removed, thereby achieving polishing of the area to be polished.

2. The method of claim 1, wherein: The polishing device further comprises: a base, a first support frame mounted on the base, a main shaft, and a vacuum suction cup fixed to the main shaft, wherein the main shaft is fixed to the first support frame through a connecting member, and the main shaft is suitable for driving the vacuum suction cup to rotate; Before adjusting the spatial position and geometric posture of the micro-polishing electrode, the method further includes: The vacuum chuck is controlled to be in a vacuum state so as to mount the optical mold through the vacuum chuck.

3. The method according to claim 1 or 2, wherein: The polishing device further comprises a liquid storage tank and a peristaltic pump. The liquid storage tank is arranged directly below the optical mold and is suitable for receiving the electrochemical solution in the polishing process of the area to be polished. The peristaltic pump is connected to the liquid storage tank and the nozzle through a liquid infusion tube. Spraying an electrochemical solution having an alkaline medium onto the area to be polished of the optical mold through the nozzle, comprising: The peristaltic pump is controlled to drive the electrochemical solution in the liquid storage tank to flow to the nozzle through the infusion tube, so that the electrochemical solution is sprayed on the polishing area of ​​the optical mold through the nozzle, and the electrochemical solution is suitable for falling into the liquid storage tank.

4. The method according to any one of claims 1 to 3, wherein: The polishing device also includes a horizontal displacement platform, a posture bracket fixed to the horizontal displacement platform, and the micro-polishing electrode is fixed to the posture bracket; Adjusting the spatial position and geometric posture of the micro-polishing electrode so that the interval between the micro-polishing electrode and the to-be-polished area of ​​the optical mold is less than a predetermined interval comprises: The spatial position and geometric posture of the micro-polishing electrode are adjusted by the horizontal displacement platform and the posture bracket, thereby adjusting the distance between the micro-polishing electrode and the surface of the area to be polished of the optical mold, so that the distance between the micro-polishing electrode and the area to be polished of the optical mold is smaller than the predetermined distance.

5. The method of claim 4, wherein: The method further comprises: The spatial position and geometric posture of the micro-polishing electrode are adjusted by the horizontal displacement platform and the posture support, thereby adjusting the distance between the local area of ​​the surface of the area to be polished and the surface of the micro-polishing electrode, so as to adjust the removal rate of the solid tungsten carbide material in the local area.

6. The method according to any one of claims 1 to 5, wherein: The method further comprises: The residence time of the micro-polishing electrode at the interval of the local area on the surface of the area to be polished is controlled so as to control the amount of solid tungsten carbide material removed in the local area.

7. The method according to claim 4 or 5, wherein: The polishing device also includes a displacement drive component connected to the horizontal displacement platform and a posture drive component connected to the posture bracket; The spatial position and geometric posture of the micro-polishing electrode are adjusted by the horizontal displacement platform and the posture support, including: Controlling the displacement driving assembly to drive the horizontal displacement platform to move along a first horizontal direction or a second horizontal direction, so as to drive the posture support and the micro-polishing electrode to move synchronously, so as to adjust the spatial position of the micro-polishing electrode, wherein the first horizontal direction is perpendicular to the second horizontal direction; The posture driving component is controlled to drive the posture bracket to drive the micro-polishing electrode to move, so as to adjust the geometric posture of the micro-polishing electrode.

8. The method according to any one of claims 1 to 7, wherein: During the electrochemical reaction, the distance between the surface of the optical mold's area to be polished and the surface of the micro-polishing electrode changes continuously, wherein when the distance between the surface of the optical mold's area to be polished and the surface of the micro-polishing electrode is greater than a predetermined distance, the electrochemical reaction stops.

9. The method according to any one of claims 1 to 8, wherein: The electrochemical reaction process is as follows:

10. A polishing device comprising: A nozzle is arranged above the optical mold and is suitable for spraying an electrochemical solution having an alkaline medium to a region to be polished of the optical mold, wherein the region to be polished of the optical mold includes a microstructure region; A mold electrode abuts against the optical mold; A micro-polishing electrode, the spacing between the electrode and the to-be-polished area of ​​the optical mold being smaller than a predetermined spacing; A DC power supply, wherein the anode of the DC power supply is connected to the mold electrode, and the cathode of the DC power supply is connected to the micro-polishing electrode, so that the area to be polished undergoes an electrochemical reaction with an alkaline medium in an electrochemical solution sprayed on the area to be polished, so that the solid tungsten carbide material on the surface of the area to be polished is converted into free tungstate and removed, thereby achieving polishing of the area to be polished.

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