Photoelectric sensor module detection device and method based on variable resistor matrix

Abstract

The invention discloses a photoelectric sensor module detection device and method based on a variable resistor matrix, and relates to the field of integrated circuit testing. The photoelectric sensor module generates a digital signal required by detection through a programmable logic device, the digital signal is converted into an analog signal through a digital-to-analog converter, and the analog signal is amplified by an amplifying circuit and then transmitted to a variable resistor matrix. And the variable resistor matrix consists of a plurality of variable resistors with independently adjustable resistance values, and is connected in parallel between the output end of the amplifying circuit and the probe card. Test probes in the probe card are connected with the variable resistors in a one-to-one correspondence mode, amplified analog signals are converted into currents to be input into pins of the photoelectric sensor module to be detected, output of a photoelectric sensor is simulated, and the peripheral module detection function under the condition that the sensor is not welded is achieved. According to the invention, the output signal of the photoelectric sensor is simulated through the probe card, so that the function of directly testing the peripheral module without the sensor is realized, the reusability is high, and a large amount of cost and time can be saved.

Description

Technical Field

[0001] The present invention relates to the field of integrated circuit testing, and in particular to a photoelectric sensor module detection device and method based on a variable resistor matrix. Background Art

[0002] Photoelectric sensor is a device that converts light signal into electrical signal. Its working principle is based on photoelectric effect. Photoelectric effect refers to the phenomenon that when light shines on certain substances, the electrons of the substance absorb the energy of photons and produce corresponding electrical effect. According to the different photoelectric effect phenomena, photoelectric effect can be divided into three categories: external photoelectric effect, internal photoelectric effect and photovoltaic effect. Photoelectric devices include phototubes, photomultiplier tubes, variable resistors, photodiodes, phototransistors, photocells, etc.

[0003] In actual use, photoelectric sensors cannot be used alone and must be used in conjunction with a photoelectric sensor module, which is used to provide power for the photoelectric sensor, control the sensor's working state, collect and process the data obtained by the sensor, etc.

[0004] The module design of photoelectric sensors usually includes sensor pads and peripheral modules. The peripheral modules include power supply, analog-to-digital conversion, main control chip and other modules. In actual engineering applications, peripheral modules need to be constantly modified to meet design requirements, and each modification requires re-welding of new photoelectric sensors for testing. However, photoelectric sensors are expensive and difficult to reuse, and many sensors are often wasted during the product testing phase. Summary of the invention

[0005] The purpose of the present invention is to solve the problem in the prior art that photoelectric sensors need to be re-soldered when peripheral modules are modified during the development of photoelectric sensor modules, and to provide a photoelectric sensor module detection device and method based on a variable resistor matrix, which is convenient for users to test the module function without soldering the sensor during the development stage of the photoelectric sensor module.

[0006] The specific technical solutions adopted by the present invention are as follows:

[0007] In a first aspect, the present invention provides a photoelectric sensor module detection device based on a variable resistor matrix, which includes a programmable logic device, a digital-to-analog converter, an amplifying circuit, a variable resistor matrix, and a probe card;

[0008] The programmable logic device is used to generate the digital signal required for detection by the photoelectric sensor module according to the built-in logic, and send it to the digital-to-analog converter through the output port;

[0009] The digital-to-analog converter is used to convert the received digital signal into an analog signal and send it to the amplification circuit;

[0010] The amplifier circuit is used to amplify the received analog signal and send it to the variable resistor matrix;

[0011] The variable resistor matrix is ​​used to form an array of multiple variable resistors whose resistance values ​​are independently controlled and adjusted, and all variable resistors are connected in parallel between the output end of the amplifier circuit and the probe card;

[0012] The probe card has test probes connected one-to-one with the variable resistors in the variable resistor matrix. After each variable resistor receives the amplified analog signal output by the amplifier circuit, it converts it into current and inputs it into the corresponding test probe; the different test probes in the probe card are used to input the electrical signals required for detection to different pins in the photoelectric sensor module to be detected, thereby simulating the output of the photoelectric sensor.

[0013] As a preferred embodiment of the above-mentioned first aspect, the test probe in the probe card is assembled by a needle sleeve and a probe body, the needle sleeve is fixedly welded on the probe card base, and the probe body has an elastic component so that the tip of the probe body can be elastically pressed onto the peripheral module of the photoelectric sensor to be detected.

[0014] As a preference of the first aspect above, the tip of the probe body is an arc-shaped tip.

[0015] As a preferred embodiment of the first aspect, the number of test probes in the probe card is not less than the number of pins that require input current in the photoelectric sensor module to be tested.

[0016] As a preferred embodiment of the first aspect, the variable resistors in the variable resistor matrix are varistors, photoresistors, thermistors or electrically controlled resistors.

[0017] As a preferred embodiment of the above-mentioned first aspect, the variable resistor matrix and the probe card have multiple paired groups, and different groups of variable resistor matrices and probe cards are connected in parallel to the output end of the amplifier circuit; each group of paired variable resistor matrix and probe card is used to independently detect a peripheral module of a photoelectric sensor.

[0018] As a preferred embodiment of the above-mentioned first aspect, the amplifier circuit is composed of an NPN-type transistor and a peripheral circuit, and the peripheral circuit includes a first resistor Rb1, a second resistor Rb2 and a third resistor Rb3; the output end of the digital-to-analog converter is connected to the collector of the transistor through the first resistor Rb1, and the external power supply VCC is connected to the emitter of the transistor through the second resistor Rb2. At the same time, the external power supply VCC is also connected to the base of the transistor through the third resistor Rb3, and the emitter of the transistor is grounded; each variable resistor in the variable resistor matrix is ​​connected to the collector of the transistor.

[0019] In a second aspect, the present invention provides a photoelectric sensor module detection method based on a variable resistor matrix, the photoelectric sensor module detection method is implemented using a photoelectric sensor module detection device based on a variable resistor matrix as described in any one of the first aspects above, and the method flow is as follows:

[0020] According to the detection requirements of the photoelectric sensor module, the programmable logic device is controlled to output a digital signal, the digital signal is first converted into an analog signal by a digital-to-analog converter, and then the analog signal is amplified by the amplifier circuit to be sufficient to drive the variable resistor matrix;

[0021] According to the detection requirements of the photoelectric sensor module, determine the current required to be input to each pin in the peripheral module of the photoelectric sensor to be detected, and then adjust the resistance value of each variable resistor in the variable resistor matrix so that the test probes on the probe card output the current required by all the pins in the peripheral module one by one;

[0022] Without soldering the photoelectric sensor, the test probe on the probe card is connected to the pin of the peripheral module of the photoelectric sensor to be tested, and each pin requiring input current is independently connected to a test probe whose output current meets the requirements of the pin, so as to detect the peripheral module.

[0023] As a preferred embodiment of the second aspect, when the peripheral module needs to be replaced, the resistance value of each variable resistor in the variable resistor matrix is ​​readjusted so that the test probes on the probe card output the current required by all pins in the new peripheral module one by one.

[0024] As a preferred embodiment of the second aspect, a plurality of detection tasks are executed sequentially or synchronously in the programmable logic device by setting output logic of signals in the time domain.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] 1. When developing a module with a photoelectric sensor, it is often necessary to conduct detailed testing on the module, and the design of the peripheral module needs to be constantly adjusted during the testing process. The existing testing scheme requires re-soldering the photoelectric sensor every time it is debugged, but the photoelectric sensor is relatively precise, expensive and difficult to reuse. The present invention simulates the output signal of the photoelectric sensor through a probe card, so that the function of the peripheral module can be directly tested without the sensor, saving a lot of cost and time.

[0027] 2. Compared with the traditional probe test method, the present invention can control the electrical signal of each test probe on each probe card through a variable resistor matrix, thereby simulating the output of the sensor under different conditions. This method can not only simulate the signal output of the sensor under any condition, but also the circuit is relatively simple, without the need for additional equipment, and is easy for developers to debug.

[0028] 3. The variable resistor matrix of the present invention can use varistors, photoresistors, thermistors, electrically controlled resistors, etc., which can be selected according to test conditions.

[0029] 4. The main control chip of the present invention is a programmable logic device FPGA chip, which can program the signal output logic as needed, and then output different digital signals according to the detection requirements of different modules, thereby improving the reusability of the detection device and further reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram of a photoelectric sensor module detection device based on a variable resistor matrix;

[0031] Figure 2 It is the connection circuit diagram between FPGA and digital-to-analog converter;

[0032] Figure 3 It is the connection circuit diagram of the amplifier circuit and the variable resistor matrix;

[0033] Figure 4 It is a schematic diagram of the structure of the test probe;

[0034] Figure 5 Schematic diagram of the probe card structure;

[0035] Figure 6 is a schematic diagram of the structure of the probe body;

[0036] Figure 7 The figure is a schematic diagram of the test process. DETAILED DESCRIPTION

[0037] In order to make the above-mentioned purpose, features and advantages of the present invention more obvious and easy to understand, the specific implementation mode of the present invention is described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below. The technical features in each embodiment of the present invention can be combined accordingly without conflicting with each other.

[0038] In the description of the present invention, it is to be understood that when an element is considered to be "connected" to another element, it may be directly connected to the other element or indirectly connected, that is, there are intermediate elements. On the contrary, when an element is said to be "directly" connected to another element, there are no intermediate elements.

[0039] like Figure 1 As shown, in a preferred embodiment of the present invention, a photoelectric sensor module detection device based on a variable resistor matrix is ​​provided, and the device includes a programmable logic device (FPGA), a digital-to-analog converter, an amplifier circuit, a variable resistor matrix and a probe card. The specific implementation form and mutual coordination relationship of each part in the photoelectric sensor module detection device are described in detail below.

[0040] In the above-mentioned photoelectric sensor module detection device, the programmable logic device is used to generate the digital signal required for the photoelectric sensor module detection according to the built-in logic, and send it to the digital-to-analog converter through the output port. The digital-to-analog converter is used to convert the received digital signal into an analog signal and send it to the amplifier circuit; the amplifier circuit is used to amplify the received analog signal and send it to the variable resistor matrix; the variable resistor matrix is ​​used to combine multiple variable resistors with independently controlled and adjusted resistance values ​​into an array, and all variable resistors are connected in parallel between the output end of the amplifier circuit and the probe card. The probe card has test probes connected to the variable resistors in the variable resistor matrix one by one. After each variable resistor receives the amplified analog signal output by the amplifier circuit, it converts it into a current and inputs it into the corresponding test probe. Moreover, different test probes in the probe card can input the electrical signals required for detection to different pins in the photoelectric sensor module to be detected, thereby simulating the output of the photoelectric sensor.

[0041] The specific forms of the above-mentioned programmable logic device (FPGA), digital-to-analog converter, amplifier circuit, variable resistor matrix and probe card can be designed according to actual detection requirements.

[0042] In an embodiment of the present invention, the connection circuit diagram of the programmable logic device FPGA and the digital-to-analog converter is as follows: Figure 2 As shown. The programmable logic device FPGA chip model can be xc7a35tfgg484-2. Users can control its GPIO port to output digital signals as needed, and the digital signals are connected to the digital-to-analog converter. Due to the flexibility of the FPGA chip, by configuring different numbers of output ports, the input requirements of most digital-to-analog converters can be met, and the chip is used as the main control chip of the system, which is responsible for controlling the working status of the system.

[0043] Continue to see Figure 2As shown, in the embodiment of the present invention, the model of the digital-to-analog converter can be DAC8562SDGSR. The function of the digital-to-analog converter is to output analog signals of different sizes to the amplification circuit according to different input digital signals. The relationship between the output signal and the input signal of the digital-to-analog converter is:

[0044]

[0045] in, is the output voltage of the digital-to-analog converter, is the input digital signal, It is the reference voltage of the digital-to-analog conversion chip. is the converter gain.

[0046] The SCLK, DIN, SYNC, CLR, and LDAC3 of the digital-to-analog converter are all connected to the GPIO port of the FPGA chip. AVDD is connected to a 3V3 power supply and is externally connected to two parallel capacitors C2 and C3. VOUTA is the output terminal of the digital / analog converter, which is used to connect to the amplifier circuit. VREFOUT is a reference voltage output terminal, which is used to output the reference voltage of the chip, and GND is a ground terminal. The specific parameters of capacitors C1, C2, and C3 can be adjusted according to actual conditions. In an embodiment of the present invention, the capacitance values ​​of capacitors C1, C2, and C3 can be set to 10μF, 100pF, and 0.1μF, respectively. When all the GPIO ports of the FPGA output high levels, the output voltage is the largest, and when all low levels are output, the output voltage is the smallest. Therefore, this method can accurately control the output of the digital-to-analog converter and improve the voltage stability of the digital-to-analog converter output.

[0047] In the embodiment of the present invention, the amplifier circuit is a circuit structure composed of a triode and an external resistor, and the connection circuit between the amplifier circuit and the variable resistor matrix is ​​as follows: Figure 3 The function of the amplifier circuit is to amplify the analog signal output by the digital-to-analog converter and improve its driving capability, so that the variable resistor matrix can work normally. Figure 3 As shown, the amplifier circuit is composed of an NPN transistor and a peripheral circuit, and the peripheral circuit includes a first resistor Rb1, a second resistor Rb2 and a third resistor Rb3. Assume that the output terminal of the digital-to-analog converter outputs an electrical signal , the output end of the digital-to-analog converter is connected to the collector of the transistor through the first resistor Rb1, the external power supply VCC is connected to the emitter of the transistor through the second resistor Rb2, and the external power supply VCC is also connected to the base of the transistor through the third resistor Rb3, and the emitter of the transistor is grounded. This method ensures that the transistor works in an amplification state. In the above-mentioned amplifier circuit, in order to prevent interference, one end of the input signal, the DC power supply, and the output signal are connected to the common end. In practical applications, the appropriate values ​​of Rb1, Rb2, and Rb3 can be set according to the models of different transistors and user needs, so that the transistor works in the amplification area. One end of the N variable resistors Rx1~RxN in the above-mentioned variable resistor matrix is ​​connected to the collector of the transistor, and the other end is connected to the emitter of the transistor grounded. Generally speaking, the specific values ​​of Rb1, Rb2, and Rb3 need to be determined comprehensively according to the model of the transistor, VCC, and load. In the embodiment of the present invention, Rb1=22kΩ, Rb2=100kΩ, and Rb3=5.1kΩ can be set. After setting the peripheral resistance and power supply of the amplifier circuit, the static operating point can be determined. The amplification factor of the amplifier circuit can be calculated by the following formula.

[0048]

[0049] At this time, the small current signal output by the digital-to-analog converter is amplified into a signal that can drive the circuit matrix.

[0050] It should be noted that the number of test probes in the probe card should not be less than the number of pins that need to input current in the photoelectric sensor module to be tested, and should at least be the same as the number of pins that need to input current in the photoelectric sensor module to be tested. The number of variable resistors in the variable resistor matrix is ​​consistent with the number of probes. If there are N variable resistors Rx1~RxN in the variable resistor matrix, then there should be at least N corresponding test probes in the probe card. The probes in the probe card contact the pad part of the module to be tested, thereby forming the circuit required for module testing. When testing the photoelectric sensor module, the user can change the resistance value of any resistor in the matrix. According to Ohm's law, the current flowing through the resistor will also change accordingly. In this way, the electrical signal input to each probe can be accurately controlled, so that the electrical signal output by the photoelectric sensor itself can be simulated by relying on the probe card, without the need to solder the photoelectric sensor on the peripheral module.

[0051] It should be noted that the circuit test probe is a tool used to contact and measure signals and voltages in electronic circuits. It is usually used to connect to specific points on a circuit board during debugging, testing or troubleshooting to check signal status, measure voltage, observe waveforms or perform other electrical tests. In the present invention, the test probe is used to input different electrical signals to the sensor module, thereby simulating the output of the sensor to achieve the function of testing the working status of the module.

[0052] In an embodiment of the present invention, the test probe structure designed in the probe card is as follows: Figure 4 As shown, the test probe is assembled from a needle sleeve 1 and a probe body 2. The needle sleeve 1 is fixedly welded to a probe card base 3 to form a Figure 5 The probe card structure shown. The needle sleeve 1 is used to fix the probe position, connect to the probe card and prevent external interference. The distribution of the test probes on the probe card base 3 can be designed according to the pin distribution in the actual peripheral module. The probe card base 3 on the upper part of the probe card can adopt a PCB circuit board, and part of the electrical processing module can be integrated on it to transmit electrical signals to the probe. The left side of the probe card base 3 is provided with a pin fixing buckle for connecting to the variable resistor matrix.

[0053] In addition, in the embodiment of the present invention, an elastic component can be arranged behind the tip of the probe body, so that the tip of the probe body 2 can be elastically pressed against the peripheral module of the photoelectric sensor to be detected. Figure 6 As shown, the probe body 2 uses a spring-shaped wire for electrical signal transmission, which, on the one hand, plays a conductive role, and on the other hand, can provide a certain downward pressure during operation, so that the probe is fully in contact with the pad of the module to be tested. Moreover, the tip of the probe head is preferably designed to be U-shaped to avoid excessive contact resistance and damage to the module to be tested. This probe card, relative to directly using a wire to connect the probe, increases stability and prevents signal interference. The lower part is connected to a probe needle sleeve, in which a probe is installed, and the electrical signal can be directly output to the probe through the PCB, and the number of installed probes can be modified according to the number of pins of the module to be tested.

[0054] Based on the photoelectric sensor module detection device of the variable resistor matrix shown in the above embodiment of the present invention, the photoelectric sensor module can be tested without welding the sensor. Figure 7 As shown in the figure, the test process is as follows: according to the test requirements, the FPGA is controlled to output the corresponding digital signal, which is first converted into an analog electrical signal by a digital-to-analog converter. Then, the analog signal passes through the amplification circuit to improve its driving ability so that it can drive the variable resistance matrix. The other end of the variable resistance matrix is ​​connected to the probe card, and the probe card is in full contact with the pad position of the module to be tested. At this time, the electrical signal is connected to the module to be tested through the probe. Finally, by changing any resistance value in the variable resistance matrix, the electrical signal on any probe card can be modified to meet the working state of the module to be tested under different working conditions.

[0055] In addition, the variable resistors in the variable resistor matrix use varistors, photoresistors, thermistors or electrically controlled resistors to facilitate flexible adjustment of resistance. If the variable resistor is a photoresistor, the resistance value can be changed by changing the light intensity, thereby outputting different currents. If the variable resistor is a varistor, different currents can be output by changing the pressure intensity. In this way, the current change of any pin of the sensor can be simulated to test whether the module to be tested is working properly.

[0056] Therefore, in another embodiment of the present invention, using Figure 1 The photoelectric sensor module detection device shown can implement a photoelectric sensor module detection method based on a variable resistor matrix, and the method flow is as follows:

[0057] According to the detection requirements of the photoelectric sensor module, the programmable logic device is controlled to output a digital signal, which is first converted into an analog signal by a digital-to-analog converter, and then amplified by an amplifier circuit to a level sufficient to drive the variable resistor matrix;

[0058] According to the detection requirements of the photoelectric sensor module, determine the current required to be input to each pin in the peripheral module of the photoelectric sensor to be detected, and then adjust the resistance value of each variable resistor in the variable resistor matrix so that the test probes on the probe card correspond one by one to output the current required by all pins in the peripheral module;

[0059] Without soldering the photoelectric sensor, the test probe on the probe card is connected to the pin of the peripheral module of the photoelectric sensor to be tested. Each pin that requires input current is independently connected to a test probe whose output current meets the requirements of the pin, so as to detect the peripheral module.

[0060] Therefore, the present invention does not need to use sensors or weld any components during the entire testing process, thereby saving testing costs and improving testing efficiency.

[0061] In addition, in another embodiment of the present invention, multiple peripheral modules can also be detected synchronously. To meet this requirement, the variable resistor matrix and probe card in the above device need to have multiple sets of paired sets, and different sets of variable resistor matrix and probe card are connected in parallel to the output end of the amplifier circuit; each set of paired variable resistor matrix and probe card is used to independently detect a peripheral module of a photoelectric sensor.

[0062] Based on the detection device and method of the present invention, when the peripheral module needs to be replaced, the resistance value of each variable resistor in the variable resistor matrix is ​​readjusted so that the test probes on the probe card output the current required by all pins in the new peripheral module one by one.

[0063] In addition, the present invention uses a programmable logic device FPGA as a main control chip, which has a high degree of freedom and can output any digital signal as needed, and has good compatibility with digital-to-analog conversion chips. Therefore, the present invention also performs multiple detection tasks in sequence or synchronously by setting the output logic of the signal in the time domain in the programmable logic device FPGA.

[0064] In summary, in the detection device of the present invention, a variable resistor matrix is ​​connected to a probe card, and the electrical signal on the probe card is controlled by changing the resistance of the variable resistor matrix, so as to simulate the output of the sensor and test the working status of the module to be tested under different working conditions.

[0065] The above-described embodiments are only some preferred implementations of the present invention, but are not intended to limit the present invention. A person skilled in the relevant technical field may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, any technical solution obtained by equivalent replacement or equivalent transformation falls within the protection scope of the present invention.

Claims

1. A photoelectric sensor module detection device based on a variable resistor matrix, characterized in that: Includes programmable logic devices, digital-to-analog converters, amplifier circuits, variable resistor matrices, and probe cards; The programmable logic device is used to generate the digital signal required for detection by the photoelectric sensor module according to the built-in logic, and send it to the digital-to-analog converter through the output port; The digital-to-analog converter is used to convert the received digital signal into an analog signal and send it to the amplification circuit; The amplifier circuit is used to amplify the received analog signal and send it to the variable resistor matrix; The variable resistor matrix is ​​used to form an array of multiple variable resistors whose resistance values ​​are independently controlled and adjusted, and all variable resistors are connected in parallel between the output end of the amplifier circuit and the probe card; The probe card has test probes connected one-to-one with the variable resistors in the variable resistor matrix. After each variable resistor receives the amplified analog signal output by the amplifier circuit, it converts it into current and inputs it into the corresponding test probe; the different test probes in the probe card are used to input the electrical signals required for detection to different pins in the photoelectric sensor module to be detected, thereby simulating the output of the photoelectric sensor.

2. The photoelectric sensor module detection device based on the variable resistor matrix according to claim 1, characterized in that: The test probe in the probe card is assembled from a needle sleeve and a probe body. The needle sleeve is fixedly welded on the probe card base, and the probe body has an elastic component so that the tip of the probe body can be elastically pressed onto the peripheral module of the photoelectric sensor to be tested.

3. The photoelectric sensor module detection device based on the variable resistor matrix according to claim 1, characterized in that: The tip of the probe body is an arc-shaped tip.

4. The photoelectric sensor module detection device based on the variable resistor matrix according to claim 1, characterized in that: The number of the test probes in the probe card is not less than the number of the pins that require input current in the photoelectric sensor module to be tested.

5. The photoelectric sensor module detection device based on the variable resistor matrix according to claim 1, characterized in that: The variable resistors in the variable resistor matrix are varistors, photoresistors, thermistors or electrically controlled resistors.

6. The photoelectric sensor module detection device based on a variable resistor matrix as claimed in claim 1, characterized in that: The variable resistor matrix and the probe card have multiple paired groups, and different groups of variable resistor matrix and probe cards are connected in parallel to the output end of the amplifier circuit; each group of paired variable resistor matrix and probe card is used to independently detect a peripheral module of a photoelectric sensor.

7. The photoelectric sensor module detection device based on a variable resistor matrix as claimed in claim 1, characterized in that: The amplifier circuit is composed of an NPN-type transistor and a peripheral circuit, wherein the peripheral circuit includes a first resistor, a second resistor and a third resistor; the output end of the digital-to-analog converter is connected to the collector of the transistor through the first resistor, the external power supply is connected to the emitter of the transistor through the second resistor, and the external power supply is also connected to the base of the transistor through the third resistor, and the emitter of the transistor is grounded; each variable resistor in the variable resistor matrix is ​​connected to the collector of the transistor.

8. A photoelectric sensor module detection method based on a variable resistor matrix, characterized in that: The photoelectric sensor module detection method is implemented using the photoelectric sensor module detection device based on the variable resistor matrix as described in any one of claims 1 to 7, and the method flow is as follows: According to the detection requirements of the photoelectric sensor module, the programmable logic device is controlled to output a digital signal, the digital signal is first converted into an analog signal by a digital-to-analog converter, and then the analog signal is amplified by the amplifier circuit to be sufficient to drive the variable resistor matrix; According to the detection requirements of the photoelectric sensor module, determine the current required to be input to each pin in the peripheral module of the photoelectric sensor to be detected, and then adjust the resistance value of each variable resistor in the variable resistor matrix so that the test probes on the probe card output the current required by all the pins in the peripheral module one by one; Without soldering the photoelectric sensor, the test probe on the probe card is connected to the pin of the peripheral module of the photoelectric sensor to be tested, and each pin requiring input current is independently connected to a test probe whose output current meets the requirements of the pin, so as to detect the peripheral module.

9. The photoelectric sensor module detection method based on a variable resistor matrix as claimed in claim 1, characterized in that: When the peripheral module needs to be replaced, the resistance value of each variable resistor in the variable resistor matrix is ​​readjusted so that the test probes on the probe card output the current required by all pins in the new peripheral module one by one.

10. The photoelectric sensor module detection method based on a variable resistor matrix according to claim 1, characterized in that: In the programmable logic device, multiple detection tasks are executed sequentially or synchronously by setting the output logic of the signal in the time domain.

Images