Circuit board performance detection method and system

Abstract

The invention provides a circuit board performance detection method and system, and relates to the technical field of circuit board detection, and the method comprises the steps: collecting related parameters, outputting an abnormal index and a circuit board performance grade, detecting the correlation between an environment temperature and a circuit board element temperature, and detecting the image gray scale of a circuit board. In combination with generation of a correlation index for reflecting whether the performance of the circuit board is abnormal or not, a sample experiment is carried out to determine a component temperature correlation coefficient, radiation intensity is collected during actual detection, correlation analysis is carried out on the radiation intensity, and a component measurement temperature for reflecting the temperature obtained by actual measurement of an electronic component on the circuit board is generated. The method comprises the steps of collecting a component image, generating a component temperature anomaly index, collecting a circuit board image, generating a shape deviation index for reflecting the shape deviation degree of the circuit board, further generating a circuit board performance anomaly index for reflecting the performance anomaly degree of the circuit board, and outputting the performance grade of the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board detection, and in particular to a circuit board performance detection method and system. Background Art

[0002] Circuit board inspection is an important step to ensure the performance and reliability of electronic equipment, and is usually used to identify design defects, manufacturing defects and potential failures. Circuit board inspection usually includes appearance inspection and electrical performance testing. Appearance inspection is used to check whether the solder joints are flat and smooth, whether there are cold or leaky solder joints, ensure that all components are installed correctly without misalignment or reverse, and check whether there are stains, dust or other contaminants on the board surface; electrical performance testing includes ensuring that there are no unnecessary connections or disconnected circuits, verifying whether the specifications of the resistors and capacitors meet the design requirements, and verifying whether the circuit board performs normally under specific functions.

[0003] When testing a circuit board, the temperature of the components on the circuit board will deviate due to the influence of the external ambient temperature, resulting in an inability to accurately judge whether the circuit board temperature is abnormal during thermal imaging testing, which increases the difficulty of testing. At the same time, the shape of the circuit board will also affect the performance of the circuit board. If the shape deviation is too large, it will lead to performance loss of the circuit board.

[0004] The above information disclosed in this Background section is only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not constitute the prior art that is already known to one of ordinary skill in the art. Summary of the invention

[0005] The object of the present invention is to provide a circuit board performance detection method and system to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A circuit board performance detection method, characterized in that the specific steps include:

[0008] S1. Perform sample experiments using a circuit board with normal functions at different ambient temperatures and collect the component temperatures of the circuit board under test;

[0009] S2. Perform correlation analysis on the ambient temperature to generate an average ambient temperature, which is used to reflect the mean value of the ambient temperature of the sample experiment;

[0010] S3. Perform correlation analysis on component temperature to generate component average temperature, which is used to reflect the mean value of sample experiments of components on a circuit board with normal functions;

[0011] S4. Perform correlation analysis on the average component temperature and the average ambient temperature to generate a component temperature correlation coefficient, which is used to reflect the degree of correlation between the component temperature and the ambient temperature on a circuit board with normal functions;

[0012] S5. Use a thermal imager to test the performance of the circuit board and collect the radiation intensity of each component of the circuit board;

[0013] S6. Perform correlation analysis on the radiation intensity to generate component measurement temperature, where the component measurement temperature is used to reflect the actual measured temperature of the electronic components on the circuit board;

[0014] S7, collecting a circuit board image through a camera, processing the circuit board image, generating a grayscale deviation, the grayscale deviation is used to reflect the degree of deviation between the grayscale of a pixel point of the circuit board image and the mean grayscale, and generating a circuit board shape deviation index DWP;

[0015] S8, performing correlation analysis on the component measurement temperature, the component temperature and the component temperature correlation coefficient, and generating the component temperature abnormality index YYP;

[0016] S9. Perform correlation analysis on the component temperature anomaly index YYP and the circuit board shape deviation index DWP to generate a circuit board performance anomaly index DXY. The circuit board performance anomaly index DXY is used to reflect the degree of performance anomaly of the circuit board. Set an anomaly threshold, compare the circuit board performance anomaly index DXY with the anomaly threshold, and output the circuit board performance level.

[0017] Furthermore, N sample experiments are conducted at an ambient temperature of 0-40 degrees, and the sample experiments are numbered according to 1, 2, 3, ..., j, ..., N, where j is a positive integer, and the ambient temperature E is j is the external temperature during the jth sample experiment, and the component temperature is the temperature of the i-th component on the circuit board of the j-th sample experiment. The total number of components is M, and the component temperature is measured by a temperature sensor.

[0018] Furthermore, for the ambient temperature E j Perform correlation analysis to generate average ambient temperature The formula used is:

[0019]

[0020] Average ambient temperature Used to reflect the average value of the sample experimental environment temperature;

[0021] Component temperature Perform correlation analysis to generate component average temperature The formula used is:

[0022]

[0023] Average component temperature Used to reflect the mean of the sample experiment for the i-th element.

[0024] Furthermore, the average ambient temperature and component temperature Perform correlation analysis to generate the component temperature correlation coefficient r i , the formula based on is:

[0025]

[0026] Component temperature correlation coefficient r i Used to reflect the correlation between the temperature of the i-th element and the ambient temperature.

[0027] Furthermore, in S5, the radiation intensity I i is the radiation intensity value emitted by the i-th component on the circuit board. i Perform correlation analysis to generate the component measurement temperature A i , the formula based on is:

[0028]

[0029] Among them, the element measures the temperature A i It is used to reflect the actual measured temperature of electronic components on the circuit board, ε is the emissivity of the circuit board material, and σ is the Stefan-Boltzmann constant;

[0030] Furthermore, the circuit board image is captured by a camera. The pixel points of the circuit board image are 320 columns x 240 rows. The red, green, and blue components of the pixel point in the i-th row and j-th column of the circuit board image are represented by R(i,j), G(i,j), and B(i,j), respectively. Correlation analysis is performed on them to generate the grayscale I(i,j). The formula based on this is:

[0031] I(i,j)=0.299*R(i,j)+0.587*G(i,j)+0.114*B(i,j)

[0032] Grayscale I(i,j) is used to reflect the grayscale of the pixel at the i-th row and j-th column in the circuit board image;

[0033] Perform correlation analysis on grayscale I(i,j) to generate grayscale mean The formula is:

[0034]

[0035] Grayscale mean Perform correlation analysis to generate grayscale deviation S based on the formula:

[0036]

[0037] The grayscale deviation S is used to reflect the degree of deviation between the grayscale of the pixel point of the circuit board image and the mean grayscale.

[0038] Furthermore, for the grayscale deviation S and grayscale mean Correlation analysis is performed to generate the circuit board shape deviation index DWP, based on the formula:

[0039]

[0040] The circuit board shape deviation index DWP is used to reflect the shape deviation degree of the circuit board, where I is the grayscale mean of the image pixel points of a normal circuit board;

[0041] Measure the temperature of the component A i , Component temperature Correlation coefficient r with component temperature i Correlation analysis is performed to generate the component temperature anomaly index YYP, based on the following formula:

[0042]

[0043] The component temperature anomaly index YYP is used to reflect the degree of component temperature anomaly on the circuit board, and E is the actual ambient temperature.

[0044] Furthermore, the component temperature anomaly index YYP and the circuit board shape deviation index DWP are subjected to correlation analysis to generate the circuit board performance anomaly index DXY, based on the following formula:

[0045]

[0046] Among them, the circuit board performance abnormality index DXY is used to reflect the degree of performance abnormality of the circuit board, α is the circuit board component temperature weight factor, β is the circuit board shape weight factor, α>β;

[0047] The abnormal threshold θ is 16.4. When DXY>θ, the output circuit board performance level is level 2, and the circuit board performance is abnormal. At this time, the staff needs to conduct further inspection of the circuit board; when DXY>θ, the output circuit board performance level is level 1, and the output circuit board performance is normal.

[0048] The present invention also provides a circuit board performance detection system, which is used to execute a circuit board performance detection method, including:

[0049] The sample experiment module is used to conduct sample experiments using a circuit board with normal functions and collect the component temperature of the circuit board under test;

[0050] An environmental analysis module is used to perform correlation analysis on the ambient temperature to generate an average ambient temperature;

[0051] Component temperature analysis module, used to perform correlation analysis on component temperature and generate component average temperature;

[0052] Temperature analysis module, used to perform correlation analysis on the average temperature of components and the average ambient temperature, and generate the component temperature correlation coefficient;

[0053] The actual detection module is used to detect the performance of the circuit board through a thermal imager and collect the radiation intensity of each component of the circuit board;

[0054] The actual temperature analysis module is used to perform correlation analysis on the radiation intensity to generate the component measurement temperature, and to perform correlation analysis on the component measurement temperature, the component temperature and the component temperature correlation coefficient to generate the component temperature anomaly index;

[0055] An image acquisition module is used to acquire a circuit board image through a camera, process the circuit board image, generate a grayscale deviation, and generate a circuit board shape deviation index;

[0056] The comprehensive analysis module is used to perform correlation analysis on component measurement temperature, component temperature and component temperature correlation coefficient, generate component temperature anomaly index and output circuit board performance level.

[0057] Compared with the prior art, the present invention has the following beneficial effects:

[0058] The present invention detects the correlation between the ambient temperature and the temperature of the circuit board components, and detects the image grayscale of the circuit board, and generates a correlation index reflecting whether the performance of the circuit board is abnormal or not. The component temperature correlation coefficient is determined by performing a sample experiment, and the radiation intensity is collected during actual detection, and a correlation analysis is performed on the radiation intensity to generate a component measurement temperature reflecting the temperature actually measured by the electronic components on the circuit board, and generate a component temperature anomaly index. The circuit board image is also collected, and an appearance deviation index reflecting the degree of deviation of the circuit board appearance is generated. The circuit board performance anomaly index reflecting the degree of performance anomaly of the circuit board is further generated, and the circuit board performance grade is output. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] Figure 1 It is a schematic diagram of the overall method flow of the present invention. DETAILED DESCRIPTION

[0060] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments.

[0061] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the present invention should be understood by people with ordinary skills in the field to which the present invention belongs. The words "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0062] Example:

[0063] See also Figure 1 , the present invention provides a technical solution:

[0064] A circuit board performance detection method. When detecting a circuit board, due to the influence of the external environment, the temperature of components on the circuit board will deviate, resulting in the inability to accurately judge whether the circuit board temperature is abnormal during thermal imaging detection. At the same time, the shape of the circuit board will also affect the performance of the circuit board. If the shape deviation is too large, the performance of the circuit board will be lost. The present invention detects the correlation between the ambient temperature and the temperature of the circuit board components, detects the image grayscale of the circuit board, and generates a related index reflecting whether the circuit board performance is abnormal. When performing a sample experiment, the present invention needs to continuously power on the circuit board. The specific steps include:

[0065] Step 1: Perform sample experiments using a circuit board with normal functions at different ambient temperatures, and collect the component temperatures of the circuit board under test;

[0066] At an ambient temperature of 0-40 degrees, N sample experiments are conducted and the sample experiments are numbered 1, 2, 3, ..., j, ..., N, where j is a positive integer and the ambient temperature E is j is the external temperature during the jth sample experiment, and the component temperature is the temperature of the i-th component on the circuit board of the j-th sample experiment. The total number of components is M, and the component temperature is measured by a temperature sensor.

[0067] Step 2: Perform correlation analysis on the ambient temperature to generate an average ambient temperature, which is used to reflect the mean value of the ambient temperature of the sample experiment;

[0068] Step 3: Perform correlation analysis on the component temperature to generate the component average temperature, which is used to reflect the mean value of the sample experiment of the components on the circuit board with normal functions;

[0069] Ambient temperature E j Perform correlation analysis to generate average ambient temperature The formula used is:

[0070]

[0071] Average ambient temperature Used to reflect the mean value of the sample experimental environment temperature;

[0072] Component temperature Perform correlation analysis to generate component average temperature The formula used is:

[0073]

[0074] Average component temperature Used to reflect the mean of the sample experiment for the i-th element.

[0075] Step 4: Perform a correlation analysis on the average component temperature and the average ambient temperature to generate a component temperature correlation coefficient, which is used to reflect the degree of correlation between the component temperature and the ambient temperature on a circuit board with normal functions;

[0076] Average ambient temperature and component temperature Perform correlation analysis to generate the component temperature correlation coefficient r i , the formula based on is:

[0077]

[0078] Component temperature correlation coefficient r i Used to reflect the correlation between the temperature of the i-th element and the ambient temperature.

[0079] Step 5: Use a thermal imager to test the performance of the circuit board and collect the radiation intensity of each component of the circuit board;

[0080] Step 6: Perform correlation analysis on the radiation intensity to generate component measurement temperature, which is used to reflect the actual measured temperature of the electronic components on the circuit board;

[0081] Radiation intensity I iis the radiation intensity value emitted by the i-th component on the circuit board. i Perform correlation analysis to generate the component measurement temperature A i , the formula based on is:

[0082]

[0083] Among them, the element measures the temperature A i It is used to reflect the actual measured temperature of electronic components on the circuit board, ε is the emissivity of the circuit board material, and σ is the Stefan-Boltzmann constant;

[0084] Step 7: Capture the circuit board image through the camera, process the circuit board image, generate grayscale deviation, the grayscale deviation is used to reflect the deviation degree between the grayscale of the pixel point of the circuit board image and the mean grayscale, and generate the circuit board shape deviation index DWP;

[0085] The circuit board image is captured by the camera. The pixel points of the circuit board image are 320 columns x 240 rows. The red, green, and blue components of the pixel point in the i-th row and j-th column of the circuit board image are represented by R(i,j), G(i,j), and B(i,j), respectively. Correlation analysis is performed on them to generate the grayscale I(i,j). The formula is as follows:

[0086] I(i,j)=0.299*R(i,j)+0.587*G(i,j)+0.114*B(i,j)

[0087] Grayscale I(i,j) is used to reflect the grayscale of the pixel at the i-th row and j-th column in the circuit board image;

[0088] Perform correlation analysis on grayscale I(i,j) to generate grayscale mean The formula is:

[0089]

[0090] Grayscale mean Perform correlation analysis to generate grayscale deviation S based on the formula:

[0091]

[0092] The grayscale deviation S is used to reflect the degree of deviation between the grayscale of the pixel point of the circuit board image and the mean grayscale.

[0093] Grayscale deviation S, grayscale mean Correlation analysis is performed to generate the circuit board shape deviation index DWP, based on the formula:

[0094]

[0095] The circuit board shape deviation index DWP is used to reflect the shape deviation degree of the circuit board. The larger the circuit board shape deviation index DWP is, the higher the shape deviation degree of the circuit board is, where I is the grayscale mean of the image pixel points of a normal circuit board;

[0096] Step 8, performing correlation analysis on the component measurement temperature, the component temperature and the component temperature correlation coefficient, and generating the component temperature abnormality index YYP;

[0097] Measure the temperature of the component A i , Component temperature Correlation coefficient r with component temperature i Correlation analysis is performed to generate the component temperature anomaly index YYP, based on the following formula:

[0098]

[0099] The component temperature anomaly index YYP is used to reflect the degree of component temperature anomaly on the circuit board. The larger the component temperature anomaly index YYP is, the higher the degree of abnormality of the circuit board component is. E is the actual ambient temperature.

[0100] Step 9: Perform correlation analysis on the component temperature anomaly index YYP and the circuit board shape deviation index DWP to generate the circuit board performance anomaly index DXY. The circuit board performance anomaly index DXY is used to reflect the degree of performance anomaly of the circuit board. Set an anomaly threshold, compare the circuit board performance anomaly index DXY with the anomaly threshold, and output the circuit board performance level.

[0101] The component temperature anomaly index YYP and the circuit board shape deviation index DWP are correlated and the circuit board performance anomaly index DXY is generated based on the following formula:

[0102]

[0103] Among them, the circuit board performance abnormality index DXY is used to reflect the degree of performance abnormality of the circuit board, α is the circuit board component temperature weight factor, β is the circuit board shape weight factor, α>β;

[0104] The abnormality threshold θ is 16.4. When DXY>θ, the output circuit board performance level is level 2, and the circuit board performance is abnormal. At this time, the staff needs to conduct further inspection of the circuit board; when DXY>θ, the output circuit board performance level is level 1, and the output circuit board performance is normal. The larger the value of the circuit board performance abnormality index DXY, the higher the degree of circuit board performance abnormality.

[0105] The present invention also provides a circuit board performance detection system, which is used to execute a circuit board performance detection method, including:

[0106] The sample experiment module is used to conduct sample experiments using a circuit board with normal functions and collect the component temperature of the circuit board under test;

[0107] An environmental analysis module is used to perform correlation analysis on the ambient temperature to generate an average ambient temperature;

[0108] Component temperature analysis module, used to perform correlation analysis on component temperature and generate component average temperature;

[0109] Temperature analysis module, used to perform correlation analysis on the average temperature of components and the average ambient temperature, and generate the component temperature correlation coefficient;

[0110] The actual detection module is used to detect the performance of the circuit board through a thermal imager and collect the radiation intensity of each component of the circuit board;

[0111] The actual temperature analysis module is used to perform correlation analysis on the radiation intensity to generate the component measurement temperature, and to perform correlation analysis on the component measurement temperature, the component temperature and the component temperature correlation coefficient to generate the component temperature anomaly index;

[0112] An image acquisition module is used to acquire a circuit board image through a camera, process the circuit board image, generate a grayscale deviation, and generate a circuit board shape deviation index;

[0113] The comprehensive analysis module is used to perform correlation analysis on component measurement temperature, component temperature and component temperature correlation coefficient, generate component temperature anomaly index and output circuit board performance level.

[0114] The above formulas are all dimensionless and numerical calculations. The formula is a formula for the most recent real situation obtained by collecting a large amount of data and performing software simulation. The preset parameters in the formula are set by technicians in this field according to actual conditions.

[0115] The above embodiments may be implemented in whole or in part by software, hardware, firmware or any other combination thereof. When implemented by software, the above embodiments may be implemented in whole or in part in the form of a computer program product. Those skilled in the art may appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein may be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed by hardware or software methods depends on the specific application and design constraints of the technical solution.

[0116] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, and may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0117] The above description is only a specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application.

Claims

1. A circuit board performance detection method, characterized in that: The specific steps include: S1. Perform sample experiments using a circuit board with normal functions at different ambient temperatures and collect the component temperatures of the circuit board under test; S2. Perform correlation analysis on the ambient temperature to generate an average ambient temperature, which is used to reflect the mean value of the ambient temperature of the sample experiment; S3. Perform correlation analysis on component temperature to generate component average temperature, which is used to reflect the mean value of sample experiments of components on a circuit board with normal functions; S4. Perform correlation analysis on the average component temperature and the average ambient temperature to generate a component temperature correlation coefficient, which is used to reflect the degree of correlation between the component temperature and the ambient temperature on a circuit board with normal functions; S5. Use a thermal imager to test the performance of the circuit board and collect the radiation intensity of each component of the circuit board; S6. Perform correlation analysis on the radiation intensity to generate component measurement temperature, where the component measurement temperature is used to reflect the actual measured temperature of the electronic components on the circuit board; S7, collecting a circuit board image through a camera, processing the circuit board image, generating a grayscale deviation, the grayscale deviation is used to reflect the degree of deviation between the grayscale of a pixel point of the circuit board image and the mean grayscale, and generating a circuit board shape deviation index DWP; S8, performing correlation analysis on the component measurement temperature, the component temperature and the component temperature correlation coefficient, and generating the component temperature abnormality index YYP; S9. Perform correlation analysis on the component temperature anomaly index YYP and the circuit board shape deviation index DWP to generate a circuit board performance anomaly index DXY. The circuit board performance anomaly index DXY is used to reflect the degree of performance anomaly of the circuit board. Set an anomaly threshold, compare the circuit board performance anomaly index DXY with the anomaly threshold, and output the circuit board performance level.

2. A circuit board performance detection method according to claim 1, characterized in that: At an ambient temperature of 0-40 degrees, N sample experiments are conducted and the sample experiments are numbered 1, 2, 3, ..., j, ..., N, where j is a positive integer and the ambient temperature E is j is the external temperature during the jth sample experiment, and the component temperature is the temperature of the i-th component on the circuit board of the j-th sample experiment. The total number of components is M, and the component temperature is measured by a temperature sensor.

3. A circuit board performance detection method according to claim 2, characterized in that: Ambient temperature E j Perform correlation analysis to generate average ambient temperature The formula used is: Average ambient temperature Used to reflect the mean value of the sample experimental environment temperature; Component temperature Perform correlation analysis to generate component average temperature The formula used is: Average component temperature Used to reflect the mean of the sample experiment for the i-th element.

4. A circuit board performance detection method according to claim 3, characterized in that: Average ambient temperature and component temperature Perform correlation analysis to generate the component temperature correlation coefficient r i , the formula based on is: Component temperature correlation coefficient r i Used to reflect the correlation between the temperature of the i-th element and the ambient temperature.

5. A circuit board performance detection method according to claim 4, characterized in that: In S5, the radiation intensity I i is the radiation intensity value emitted by the i-th component on the circuit board. i Perform correlation analysis to generate the component measurement temperature A i , the formula based on is: Among them, the element measures the temperature A i It is used to reflect the actual measured temperature of electronic components on the circuit board. ε is the emissivity of the circuit board material, and σ is the Stefan-Boltzmann constant.

6. A circuit board performance detection method according to claim 5, characterized in that: The circuit board image is captured by the camera. The pixel points of the circuit board image are 320 columns x 240 rows. The red, green, and blue components of the pixel point in the i-th row and j-th column of the circuit board image are represented by R(i, j), G(i, j), and B(i, j), respectively. Correlation analysis is performed on them to generate grayscale I(i, j). The formula based on this is: I(i,j)=0.299*R(i,j)+0.587*G(i,j)+0.114*B(i,j) Grayscale I(i, j) is used to reflect the grayscale of the pixel at the i-th row and j-th column in the circuit board image; Perform correlation analysis on grayscale I(i, j) to generate grayscale mean The formula is: Grayscale mean Perform correlation analysis to generate grayscale deviation S based on the formula: The grayscale deviation S is used to reflect the degree of deviation between the grayscale of the pixel point of the circuit board image and the mean grayscale.

7. A circuit board performance detection method according to claim 6, characterized in that: Grayscale deviation S, grayscale mean Correlation analysis is performed to generate the circuit board shape deviation index DWP, based on the formula: The circuit board shape deviation index DWP is used to reflect the shape deviation degree of the circuit board, where I is the grayscale mean of the image pixel points of a normal circuit board; Measure the temperature of the component A i , Component temperature Correlation coefficient r with component temperature i Correlation analysis is performed to generate the component temperature anomaly index YYP, based on the following formula: The component temperature anomaly index YYP is used to reflect the degree of component temperature anomaly on the circuit board, and E is the actual ambient temperature.

8. A circuit board performance detection method according to claim 7, characterized in that: The component temperature anomaly index YYP and the circuit board shape deviation index DWP are correlated and the circuit board performance anomaly index DXY is generated based on the following formula: Among them, the circuit board performance abnormality index DXY is used to reflect the degree of performance abnormality of the circuit board, α is the circuit board component temperature weight factor, β is the circuit board shape weight factor, α>β; The abnormal threshold θ is 16.

4. When DXY>θ, the output circuit board performance level is level 2, and the circuit board performance is abnormal. At this time, the staff needs to conduct further inspection of the circuit board; when DXY>θ, the output circuit board performance level is level 1, and the output circuit board performance is normal.

9. A circuit board performance detection system, used to execute the circuit board performance detection method according to claim 1, characterized in that: include: The sample experiment module is used to conduct sample experiments using a circuit board with normal functions and collect the component temperature of the circuit board under test; An environmental analysis module is used to perform correlation analysis on the ambient temperature to generate an average ambient temperature; Component temperature analysis module, used to perform correlation analysis on component temperature and generate component average temperature; Temperature analysis module, used to perform correlation analysis on the average temperature of components and the average ambient temperature, and generate the component temperature correlation coefficient; The actual detection module is used to detect the performance of the circuit board through a thermal imager and collect the radiation intensity of each component of the circuit board; The actual temperature analysis module is used to perform correlation analysis on the radiation intensity to generate the component measurement temperature, and to perform correlation analysis on the component measurement temperature, the component temperature and the component temperature correlation coefficient to generate the component temperature anomaly index; An image acquisition module is used to acquire a circuit board image through a camera, process the circuit board image, generate a grayscale deviation, and generate a circuit board shape deviation index; The comprehensive analysis module is used to perform correlation analysis on component measurement temperature, component temperature and component temperature correlation coefficient, generate component temperature anomaly index and output circuit board performance level.

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