Electric field assisted optical tweezers chip and clamping tool thereof

Abstract

The invention relates to an electric field assisted optical tweezer chip and a clamping tool thereof.The optical tweezer chip comprises an upper glass plate and a lower glass plate which are stacked and plated with conducting layers, and the clamping tool fixes the parallel plate optical tweezer chip composed of the upper glass and the lower glass through a base, a PCB chip board and an upper cover plate; an external electric field is connected with the PCB interface board and the PCB chip board through the signal generator to be transmitted to the optical tweezer chip, and when an alternating electric field is applied to the optical tweezer chip, the stability of the electric field and the precision of particle operation in the optical tweezer operation process can be improved; according to the clamp, the repeatability of the optical tweezer chip in micro-nano operation is improved, the damage to the chip and a sample caused by misoperation is reduced, and the operation view field range and the operation convenience are optimized.

Description

Technical Field

[0001] The invention belongs to the technical field of chips, and in particular relates to an electric field-assisted optical tweezers chip and a clamping tool thereof. Background Art

[0002] Optical tweezers, also known as optical trapping, is a method of manipulating microscopic particles using the radiation pressure of a focused laser beam. The concept of optical tweezers was first proposed by physicist Arthur Ashkin in the 1970s, and in 1986, it was successfully demonstrated for the first time to capture and manipulate micron-sized spheres. Ashkin's work laid the foundation for subsequent biophysical research and the development of micro-nanotechnology. The working principle of optical tweezers is based on the momentum transfer of light. When light passes through a transparent medium (such as glass or water), if there is a difference in refractive index in the medium, the light will exert a force on the medium, which is the scattering force or gradient force of light. Under the focus of a high numerical aperture, the intensity of the laser beam increases rapidly near the focus, forming a high-intensity light field. The force exerted on the particle in the light field is mainly determined by the gradient force of light, which can capture and fix the particle near the focus.

[0003] In existing optical tweezers operations, known devices for containing samples include simple devices such as a combination of a slide and a cover glass, and complex devices such as specially designed microfluidic devices.

[0004] The chip designed with a combination of a slide and a cover glass has poor operational stability when used on an inverted microscope. In addition, there is no sufficient gap between the slide and the cover glass, which may cause damage to particles with larger diameters, and the operating field is limited. This type of chip has problems such as low operating accuracy, poor stability, and low operational repeatability.

[0005] Microfluidic devices are complex in design and high in cost. In addition, due to their special design, they have poor universality and can only be applied to specific or certain types of particles.

[0006] Therefore, there is an urgent need to develop an electric field-assisted optical tweezers chip and a clamping tool thereof. The optical tweezers chip can be suitable for particles ranging in size from hundreds of nanometers to tens of micrometers, and the clamping tool can improve the operating accuracy of the optical tweezers chip at the micro-nano scale, reduce possible damage to the chip and operating samples, and optimize the complexity of the operation; and the clamping tool can be suitable for chips with most particles in the diameter range from hundreds of nanometers to tens of micrometers to be operated by the optical tweezers, without the need for targeted repeated design. Summary of the invention

[0007] In response to at least one of the problems in the above-mentioned prior art, the purpose of the present invention is to provide an electric field-assisted optical tweezers chip and a clamping tool thereof, wherein the clamping tool is used to clamp a parallel plate optical tweezers chip composed of two upper and lower pieces of glass. When an alternating electric field is applied to the optical tweezers chip, the electric field stability and the accuracy of particle operation during the optical tweezers operation can be improved; the repeatability of the optical tweezers chip in micro-nano operations is improved through the clamp, the damage to the chip and sample caused by improper operation is reduced, and the operation field of view and operation convenience are optimized.

[0008] To achieve the above object, the present invention adopts the following technical solutions: An electric field-assisted optical tweezers chip comprises: an upper glass plate and a lower glass plate which are stacked and both coated with a conductive layer, wherein the two conductive layers face inwards; the adjacent sides of the upper glass plate and the lower glass plate are staggered, the upper glass plate and the lower glass plate are sealed and connected by a curing glue with gap beads added thereto, a gap is formed between the upper glass plate and the lower glass plate, the area surrounded by the curing glue is a use area, and two injection holes are provided on the upper glass plate in the use area, wherein one of the injection holes is used for injection of samples, and the other injection hole is used for exhaust.

[0009] An electric field-assisted optical tweezer chip clamping tool, used for clamping the optical tweezer chip, comprising: A base, on which a PCB chip board mounting groove and a PCB interface board position opening are respectively provided, wherein a bottom observation window located below the optical tweezers chip is opened in the PCB chip board mounting groove; A PCB chip board is arranged in the PCB chip board installation groove, the PCB chip board is provided with contacts, and the PCB chip board is used to install the optical tweezers chip; A PCB interface board, on which pins and an SMA interface are provided, wherein the SMA interface is used to connect a signal generator; An upper cover plate is hinged to the base; the PCB interface board is installed on the upper cover plate, and when the upper cover plate is buckled on the base, the PCB interface board is buckled on the PCB interface board position opening, and the upper cover plate presses the PCB chip board; Wherein, the pin is in contact with the contact, and the PCB interface board is electrically connected to the optical tweezers chip through the PCB chip board.

[0010] Preferably, the upper cover plate is provided with a top observation window located above the optical tweezers chip.

[0011] Preferably, at least two positioning beads are arranged on the bottom surface of the PCB chip board installation groove, and the PCB chip board is provided with a positioning hole corresponding to each of the positioning beads.

[0012] Preferably, a square hole is opened in the center of the PCB chip board, and a plurality of spring pieces are arranged around the square hole on the lower surface of the PCB chip board, and the optical tweezers chip is clamped on the PCB chip board through the spring pieces.

[0013] Preferably, a rotating connection piece is provided between the base and the upper cover plate, the rotating connection piece is threadedly connected to the base, the rotating connection piece and the upper cover plate are provided with coaxial shaft holes, and a rotating shaft is provided in the shaft hole.

[0014] Preferably, a through hole for the SMA interface to pass through is opened on the upper cover plate; the through hole is a stepped hole with a square hole at the bottom and a round hole at the top, and the inner diameter of the round hole is larger than the diagonal length of the square hole.

[0015] Preferably, a handle is provided on one side of the top observation window, and the upper cover plate is opened by pulling the handle.

[0016] Preferably, the PCB interface board is installed with an interface board lower cover, the upper cover plate is screwed to the PCB interface board and the interface board lower cover, and the PCB interface board is located between the upper cover plate and the interface board lower cover.

[0017] Preferably, a telescopic positioning bead is provided on the side wall of the PCB chip board mounting groove, and a ball socket matching the telescopic positioning bead is opened on the side wall of the upper cover plate. When the upper cover plate is buckled on the base, the ball head of the telescopic positioning bead is automatically pushed into the ball socket.

[0018] The present invention adopts the above technical solution, which has the following advantages: 1. The optical tweezers chip provided by the present invention has two ITO glass plates placed in parallel up and down after power is turned on, which can generate an internal electric field with higher stability. The optical tweezers chip facilitates the subsequent optical tweezers operation through the assistance of the electric field, and the PCB chip board transmits electrical signals and clamps the optical tweezers chip. The way of transmitting electrical signals is more stable than the cable connection method in the prior art; the design of different sizes of the upper and lower plates of the chip makes the operating range of the optical tweezers larger.

[0019] 2. The optical tweezers chip clamping tool provided by the present invention clamps the optical tweezers chip on the PCB chip board through spring pieces, fixes the PCB chip board through positioning beads, and tightens the upper cover plate to ensure that the chip is stably placed. When the stage position is moved, the optical tweezers operation will not be affected by the shaking of the chip.

[0020] 3. The optical tweezer chip clamping tool provided by the present invention uses a PCB interface board and a PCB circuit board to connect the chip to transmit electrical signals. Compared with a direct wire connection method, the PCB circuit board method avoids the situation where the wires are not connected properly or have poor contact, and the heat generated by high impedance causes damage to the chip and the sample; improves the electric field stability and the accuracy of particle operation during the optical tweezer operation; improves the repeatability of the optical tweezer chip in micro-nano operation, and reduces the damage to the chip and the sample caused by improper operation. 4. The optical tweezers chip clamping tool provided by the present invention has an observation window, which expands the observation field of view compared to the original method of staggered stacking of two ITO glass sheets, and optimizes the operating field of view and operating convenience. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the buckled state of the upper cover plate of the clamping tool provided in the second embodiment of the present invention.

[0022] Figure 2 It is a schematic diagram of the state in which the upper cover plate of the clamping tool provided in the second embodiment of the present invention is opened.

[0023] Figure 3 It is a schematic diagram of the exploded structure of the clamping tool provided in the second embodiment of the present invention.

[0024] Figure 4 It is a schematic diagram of the structure of the optical tweezers chip provided in the first embodiment of the present invention.

[0025] Figure 5 It is a structural schematic diagram of the optical tweezers chip provided in the first embodiment of the present invention being assembled on a PCB chip board.

[0026] Figure 6 It is a structural schematic diagram of a base provided in Embodiment 2 of the present invention.

[0027] Figure 7 It is a structural schematic diagram of the clamping tool showing the ball and socket viewing angle provided by the second embodiment of the present invention.

[0028] Figure 8 It is a structural schematic diagram of the lower surface of the upper cover plate provided in the second embodiment of the present invention.

[0029] Fig. 9 It is a bottom schematic diagram of the clamping tool without the lower cover of the interface plate provided in the second embodiment of the present invention.

[0030] Fig.10 It is a bottom schematic diagram of the clamping tool provided in the second embodiment of the present invention equipped with the lower cover of the interface plate.

[0031] Markings in the accompanying drawings: 100 is an optical tweezer chip, 1001 is an upper glass plate, 1002 is a lower glass plate, 1003 is a curing glue, 1004 is a sample injection hole, 1 is a base, 101 is a PCB chip board mounting slot, 102 is a PCB interface board position port, 103 is a bottom observation window, 104 is a positioning bead, 105 is a telescopic positioning bead, 2 is a PCB chip board, 201 is a contact, 202 is a square hole, 203 is a spring, 3 is a PCB interface board, 301 is a pin, 302 is an SMA interface, 4 is an upper cover, 401 is a top observation window, 402 is a handle, 403 is a ball socket, 5 is a rotating connector, and 6 is a lower cover of the interface board. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0033] In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "front", "back", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the system or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0034] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "assembly", "setting", and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] The present invention provides an electric field-assisted optical tweezer chip and a clamping tool thereof. The clamping tool fixes a parallel plate optical tweezer chip consisting of two upper and lower glass sheets through a base, a PCB chip board and an upper cover plate. An external electric field is transmitted to the optical tweezer chip through a signal generator connected to a PCB interface board and a PCB chip board. When an alternating electric field is applied to the optical tweezer chip, the electric field stability and the precision of particle operation during the optical tweezer operation can be improved. The clamp improves the repeatability of the optical tweezer chip in micro-nano operation, reduces chip and sample damage caused by improper operation, and optimizes the operation field of view and operation convenience.

[0036] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0037] Example 1 Please refer to Figure 4 and Figure 5 The electric field assisted optical tweezers chip 100 provided in this embodiment comprises an upper glass plate 1001 and a lower glass plate 1002 which are stacked and both coated with a conductive layer, and both conductive layers face inwards; the adjacent sides of the upper glass plate 1001 and the lower glass plate 1002 are staggered, and the upper glass plate 1001 and the lower glass plate 1002 are sealed and connected by a curing glue 1003 with gap beads added thereto, and a gap is formed between the upper glass plate 1001 and the lower glass plate 1002, and the area surrounded by the curing glue 1003 is a use area, and two injection holes 1004 are provided on the upper glass plate 1001 in the use area, and the injection holes 1004 are through holes, one of which is used for liquid injection, and the other is used for exhaust. The use area of ​​the optical tweezers chip 100 is used to fill a solution with particles.

[0038] Specifically, the conductive layer is a light-transmitting material. For example, the upper glass plate 1001 and the lower glass plate 1002 are glass plates coated with an ITO conductive layer. After being coated with the ITO conductive layer, the upper glass plate 1001 and the lower glass plate 1002 are still transparent glass plates. ITO glass, that is, tin doped with indium oxide (Indium Tin Oxide), is a material coated with a transparent conductive film on the surface of the glass. ITO glass has high transparency and good conductivity, which is mainly due to the mixture of indium oxide and tin oxide. The oxides of indium and tin form a thin film on the surface of the glass, which provides electrical conductivity while maintaining the transparency of the glass. The production of ITO glass generally involves physical vapor deposition (PVD) or chemical vapor deposition (CVD) technology. In these processes, the ITO material is evaporated or chemically decomposed, and then redeposited on the glass substrate to form a thin film.

[0039] In this embodiment, the lower glass plate 1002 is 31x20mm, the upper glass plate 1001 is 26x27mm, and the conductive layers of the two glass plates are facing inward; the lower glass plate 1002 is 31x20mm, the upper glass plate 1001 is 26x27mm, and two injection holes 1004 with a diameter of 1mm are punched at the diagonal of the upper glass plate 1001. The upper glass plate 1001 and the lower glass plate 1002 are staggered and stacked, that is, the left and right sides of the upper glass plate 1001 extend out of the left and right sides of the lower glass plate 1002, and the upper and lower sides of the lower glass plate 1002 extend out of the upper and lower sides of the upper glass plate 1001. The use area is a rectangular area of ​​19 mm x 12 mm in the center of the optical tweezers chip 100, which is the use and observation area of ​​the optical tweezers chip 100, and the liquid containing the operation object is injected into the use area through the injection holes 1004. This design has good universality, and the optical tweezers chip 100 can accommodate particles with diameters ranging from hundreds of nanometers to tens of micrometers.

[0040] The optical tweezers chip 100 of this embodiment makes it easier to inject and extract samples: injecting and extracting samples through the sample injection hole 1004 of the chip causes less damage to the chip and the sample; the chip can be reused, and sample loss during the injection and extraction process is less.

[0041] In the electric field-assisted optical tweezers chip 100 of this embodiment, the gap between the upper glass plate 1001 and the lower glass plate 1002 is larger than the diameter of the particles filled therein, and the sufficient gap will not cause damage to the particles, while providing a larger operating field of view; after the optical tweezers chip 100 is powered on, the two ITO glass plates placed in parallel up and down can generate an internal electric field with higher stability, and the design of the PCB chip board 2 transmitting electrical signals and clamping the optical tweezers chip 100 is more stable than the cable connection method in that the electrical signals are transmitted, and the use of the PCB circuit board avoids the situation where the wires are not connected or have poor contact, and the heat generated by the high impedance causes damage to the chip and the sample. Example 2 Please refer to Figures 1 to 3 , Figures 6 to 10 The present embodiment provides an optical tweezer chip clamping tool, which is used to clamp the optical tweezer chip 100 described in Example 1. The clamping tool includes a base 1, a PCB chip board 2, a PCB interface board 3 and an upper cover plate 4; The base 1 is provided with a PCB chip board mounting groove 101 and a PCB interface board position opening 102, and the PCB chip board mounting groove 101 is provided with a bottom observation window 103 located below the optical tweezers chip; The PCB chip board 2 is arranged in the PCB chip board installation groove 101, the PCB chip board is provided with contacts 201, and the PCB chip board 2 is used to install the optical tweezers chip 100; The PCB interface board 3 is provided with a pin 301 and an SMA interface 302. The pin 301 is connected to the SMA interface 302 via the PCB interface board 3. The SMA interface 302 is used to connect to a signal generator. The upper cover plate 4 is hinged to the base 1; the PCB interface board 3 is installed on the upper cover plate 4. When the upper cover plate 4 is buckled on the base 1, the PCB interface board 3 is buckled at the PCB interface board position opening 102, and the upper cover plate 4 presses the PCB chip board 2. The top observation window 401 is located directly above the optical tweezers chip 100, and the optical tweezers chip 100 can be observed through the top observation window 401; The pin 301 contacts the contact 201 , and the PCB interface board 3 is electrically connected to the optical tweezers chip 100 through the PCB chip board 2 . Specifically, the base 1 is made of metal, and when in use, the base 1 is placed on the stage and applied to an inverted microscope. The base 1 is a rectangular plate as a whole, and the PCB chip board mounting groove 101 and the PCB interface board position port 102 are adjacent, and the PCB chip board mounting groove 101 has a stepped bottom plate; a bottom observation window 103 is provided on the bottom plate, and the bottom observation window 103 is square, with four rounded corners, and the bottom observation window 103 is located directly below the optical tweezers chip 100, and the optical tweezers chip 100 is invertedly installed on the lower surface of the PCB chip board 2, and the objective lens of the microscope is located below the optical tweezers chip 100, and the optical tweezers chip 100 is observed through the bottom observation window 103, and the bottom observation window 103 provides a larger observation field; a top observation window 401 is provided on the upper cover plate 4, and after the upper cover plate 4 is buckled on the base 1, the top observation window 401 is located above the optical tweezers chip 100, and the top of the top observation window 401 is a light source, and the optical tweezers chip 100 is illuminated through the top observation window 401.

[0042] At least two positioning beads 104 are arranged in the PCB chip board installation groove 101, and the PCB chip board 2 is provided with a positioning hole 201 corresponding to each positioning bead 104. Specifically, there are two positioning beads 104, which are respectively arranged at the diagonal positions of the PCB chip board installation groove 101, and the PCB chip board 2 is provided with four positioning holes 201, and the two opposite positioning holes 201 are diagonally distributed and correspond to the positions of the diagonally distributed positioning beads 104, which can be more convenient when the PCB chip board 2 needs to be installed in the PCB chip board installation groove 101. The PCB chip board 2 is fixed to the base 1 through the positioning beads 104, and is clamped by the upper cover plate 4 and the base 1.

[0043] In this embodiment, a square hole 202 is provided at the center of the PCB chip board 2, and conduction points are respectively provided on the PCB chip board 2 at the four sides of the square hole 202 on the lower surface of the PCB chip board 2, and the contact 201 is located on the upper surface of the PCB chip board 2, and the conduction point is electrically connected to the contact 201, and a metal spring 203 is welded on each conduction point, and the optical tweezers chip 100 is clamped on the PCB chip board 2 through the spring 203. Specifically, the springs 203 on the left and right sides of the optical tweezers chip 100 press the lower glass plate 1002 downward and are connected to the conductive layer; the springs 203 on the upper and lower sides of the optical tweezers chip 100 press the upper glass plate 1001 upward and are connected to the conductive layer, so as to realize the installation and connection of the optical tweezers chip 100 on the PCB chip board 2.

[0044] In this embodiment, a rotating connector 5 is provided between the base 1 and the upper cover plate 4. The rotating connector 5 is screwed to the base 1. The rotating connector 5 and the upper cover plate 4 are provided with coaxial shaft holes, and a rotating shaft is provided in the shaft hole.

[0045] Specifically, a rotating member installation groove is provided at a position adjacent to the PCB interface board position opening 102 on the base 1, and two threaded holes are provided in the rotating member installation groove. The rotating connector 5 is embedded in the rotating member installation groove, and two light holes are provided at positions corresponding to the two threaded holes on the rotating connector 5. The rotating connector 5 is fixed to the base 1 by bolts. The other end of the rotating connector 5 is fork-shaped, and a coaxial shaft hole is provided on the fork. One end of the upper cover plate 4 has a protruding boss, and the boss is provided with a shaft hole. The boss extends into the fork, so that the fork is coaxial with the two shaft holes on the boss, and the rotating shaft is inserted from one end to realize the rotating connection between the base 1 and the upper cover plate 4.

[0046] In this embodiment, a through hole is provided on the upper cover plate 4 for the SMA interface 302 to pass through. The through hole is a stepped hole with a square hole at the bottom and a round hole at the top. The inner diameter of the round hole is larger than the diagonal length of the square hole. The SMA interface 302 passes through the upper cover plate to facilitate connection with the signal generator.

[0047] In this embodiment, a handle 402 is provided on one side of the top observation window 401, and the upper cover plate is opened by pulling the handle 402.

[0048] Specifically, the handle 402 is a protrusion extending into the top observation window 401 , and the protrusion cannot block the optical tweezers chip 100 .

[0049] In this embodiment, the PCB interface board 3 is installed with an interface board lower cover 6, the upper cover 4 is screwed to the PCB interface board 3 and the interface board lower cover 6, and the PCB interface board 3 is located between the upper cover 4 and the interface board lower cover 6.

[0050] Specifically, the interface board lower cover 6 is provided with threaded holes at the four corners, and light holes are opened at the corresponding positions of the upper cover plate 4 and the PCB interface board 3 respectively. The upper cover plate 4, the PCB interface board 3 and the interface board lower cover 6 are connected as a whole by bolts, and the interface board lower cover 6 can better protect the PCB interface board 3.

[0051] In this embodiment, a telescopic positioning bead 105 is provided on the side wall of the PCB chip board installation slot 101. Specifically, a hole is provided on the side wall of the PCB chip board installation slot 101, and the telescopic positioning bead 105 is fixedly installed in the hole. The telescopic positioning bead 105 is a prior art product. A ball socket 403 matching the telescopic positioning bead 105 is provided on the side wall of the upper cover plate 4. When the upper cover plate 4 is buckled on the base 1, the ball head of the telescopic positioning bead 105 automatically pushes into the ball socket 403 to achieve locking of the two. When the upper cover plate 4 is opened, the ball head of the telescopic positioning bead 105 is separated from the ball socket 403, unlocking the upper cover plate 4.

[0052] When the optical tweezer chip clamping tool of this example is used, the clamping tool is placed on the stage, the optical tweezer chip 100 is injected with a sample through the sample injection hole 1004, the optical tweezer chip 100 is mounted on the PCB chip board 2 through the spring 203, the SMA interface 302 is connected to the signal generator, and when the upper cover plate 4 is buckled, the pin 301 contacts the contact 201, so that the signal generator, the PCB interface board 3, the PCB chip board 2 and the optical tweezer chip 100 are electrically connected. When the signal generator is turned on, an alternating electric field is generated between the upper glass plate 1001 and the lower glass plate 1002 of the optical tweezer chip 100. When the upper cover plate 4 is opened, the pin 301 is disconnected from the contact 201, and the electric field in the optical tweezer chip 100 disappears. The optical tweezers chip clamping tool of this embodiment clamps the optical tweezers chip 100 on the PCB chip board 2 by means of a spring 203, fixes the PCB chip board 2 by means of a positioning bead 104, and tightens by means of an upper cover plate 4, so that the chip is stably placed, and when the stage position is moved, the optical tweezers operation will not be affected by the shaking of the chip; and the chip is connected to the PCB circuit board to transmit electrical signals, and the existence of the observation window expands the observation field of view compared to the original method of staggered stacking of two ITO glass sheets, and the design of the upper and lower plates of the chip with different sizes expands the operating range of the optical tweezers; the clamp improves the electric field stability and the accuracy of particle operation during the optical tweezers operation; improves the repeatability of the optical tweezers chip in micro-nano operation, reduces the damage to the chip and sample caused by improper operation, and optimizes the operating field of view and the convenience of operation.

[0053] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electric field-assisted optical tweezers chip, characterized in that: include: An upper glass plate (1001) and a lower glass plate (1002) are stacked and both are coated with a conductive layer, and the two conductive layers are both facing inwards; the adjacent sides of the upper glass plate (1001) and the lower glass plate (1002) are staggered; the upper glass plate (1001) and the lower glass plate (1002) are sealed and connected by a curing glue (1003) with gap beads added thereto; a gap is formed between the upper glass plate (1001) and the lower glass plate (1004); the area surrounded by the curing glue (1003) is a use area; two injection holes (1004) are provided on the upper glass plate (1001) in the use area, wherein one of the injection holes (1004) is used for injection, and the other injection hole (1004) is used for exhaust.

2. An electric field-assisted optical tweezer chip clamping tool for clamping the optical tweezer chip according to claim 1, characterized in that: include: A base (1) having a PCB chip board mounting groove (101) and a PCB interface board position opening (102) respectively disposed thereon, wherein a bottom observation window (103) located below the optical tweezers chip (100) is provided in the PCB chip board mounting groove (101); A PCB chip board (2) is arranged in the PCB chip board installation groove (101), the PCB chip board (2) is provided with a contact point (201), and the PCB chip board (2) is used to install the optical tweezers chip (100); A PCB interface board (3) having pins (301) and an SMA interface (302) provided thereon, wherein the SMA interface (302) is used to connect to a signal generator; An upper cover plate (4) is hinged to the base (1); the PCB interface plate (3) is mounted on the upper cover plate (4); when the upper cover plate (4) is buckled onto the base (1), the PCB interface plate (3) is buckled into the PCB interface plate position opening (102), and the upper cover plate (4) presses the PCB chip board (2); The pin (301) is in contact with the contact point (201), and the PCB interface board (3) is electrically connected to the optical tweezers chip (100) via the PCB chip board (2).

3. The optical tweezers chip clamping tool according to claim 2, characterized in that: The upper cover plate (4) is provided with a top observation window (401) located above the optical tweezers chip (100).

4. The optical tweezers chip clamping tool according to claim 2, characterized in that: At least two positioning beads (104) are arranged on the bottom surface of the PCB chip board installation groove (101), and the PCB chip board (2) is provided with a positioning hole correspondingly connected to each positioning bead (104).

5. The optical tweezers chip clamping tool according to claim 2, characterized in that: A square hole (202) is provided at the centre of the PCB chip board (2); a plurality of spring pieces (203) are provided around the square hole on the lower surface of the PCB chip board (2); and the optical tweezers chip (100) is clamped onto the PCB chip board (2) via the spring pieces (203).

6. The optical tweezers chip clamping tool according to claim 2, characterized in that: A rotating connection member (5) is provided between the base (1) and the upper cover plate (4); the rotating connection member (5) is threadedly connected to the base (1); the rotating connection member (5) and the upper cover plate (4) are provided with coaxial shaft holes, and a rotating shaft is provided in the shaft hole.

7. The optical tweezers chip clamping tool according to claim 2, characterized in that: The upper cover plate (4) is provided with a through hole for the SMA interface to pass through; the through hole is a stepped hole, with a square hole at the bottom and a round hole at the top, and the inner diameter of the round hole is greater than the diagonal length of the square hole.

8. The optical tweezers chip clamping tool according to claim 2, characterized in that: A handle (402) is provided on one side of the top observation window (401), and the upper cover plate (4) is opened by pulling the handle (402).

9. The optical tweezers chip clamping tool according to claim 2, characterized in that: The PCB interface board (3) is installed with an interface board lower cover (6); the upper cover (4) is screwed to the PCB interface board (3) and the interface board lower cover (6); the PCB interface board (3) is located between the upper cover (4) and the interface board lower cover (6).

10. The optical tweezers chip clamping tool according to claim 2, characterized in that: A telescopic positioning bead (105) is provided on the side wall of the PCB chip board mounting groove (101), and a ball socket (403) matching the telescopic positioning bead (105) is provided on the side wall of the upper cover plate (4); when the upper cover plate (4) is buckled onto the base (1), the ball head of the telescopic positioning bead (105) is automatically pushed into the ball socket (403).

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