Damping bonding equipment with variable resistance

Abstract

The invention introduces a damping bonding device with variable resistance, which is provided with a floating linear motor and a bonding device fixedly connected to a rotor of the linear motor, a stator track is parallel to a rotor track, and an induction driving shaft fixedly connected to the rotor is inserted into a straight magnetic field of a stator; the stator is subjected to the counter-acting force of the mover, and the stator and the mover move right and left in the opposite direction. The left end or the right end or any end of the stator is connected with a connecting rod, the other end of the connecting rod is connected to a piston of the air cylinder piston structure, and the piston can oscillate left and right in the corresponding air cylinder. According to the invention, the relative movement speed of the stator and the rotor can be kept basically stable through the change of different elastic forces to the track in the bonding process, and the numerical value of the air pressure in the piston cylinder can be accurately calculated.

Description

Technical Field

[0001] The invention relates to a semiconductor bonding device and a stable operation auxiliary technology thereof. Background Art

[0002] Semiconductor chip bonding equipment causes the base plate and the entire equipment to shake due to the inertial force of the bonding head, thereby reducing the accuracy of the equipment. Especially for high-speed bonding equipment mounted on a linear motor, the accuracy reduction is more obvious. Therefore, corresponding measures need to be taken to reduce this impact.

[0003] The invention of the applicant with application number 2023116984777 introduces a linear motor micro-electromechanical system without recoil force, which is an ideal linear motor bonding platform. In the normal working process, due to the chip picking and chip bonding actions of the connected bonding device, the stator or mover of the linear motor produces unstable vibration, or due to the accumulation of dirt or wear on the stator track and the mover track, the resistance of the reciprocating motion changes and cannot run stably. Summary of the invention

[0004] Purpose of the invention: To overcome the problem of reduced bonding accuracy due to equipment vibration or track wear in existing linear electrode bonding machines, and to provide a variable resistance shock-absorbing bonding device that can reduce vibration and automatically adjust the vibration reduction effect according to acceleration parameters.

[0005] Technical solution: The variable resistance damping bonding device of the present invention has a floating linear motor and a bonding device, wherein the stator of the linear motor floats and moves on the stator track, and the mover of the linear motor floats and moves on the mover track. The stator track and the mover track are parallel to each other, and the induction drive shaft fixedly connected to the mover (the mover can sense the change of the stator magnetic field and generate reciprocating motion) is inserted in the flat magnetic field of the stator and drives the mover in the alternating magnetic field induction of the stator; the stator is subjected to the reaction force of the mover and moves right and left in the opposite direction to the mover.

[0006] The bonding device is fixedly connected to the mover of the linear motor and can move with the mover to pick up and place chips and bond chips.

[0007] When the mover and the bonding device connected thereto move on the mover track, they are subjected to the friction force 1 of the mover track; when the stator moves on the stator track, it is subjected to the friction force 2 of the stator track.

[0008] The mass of the stator is substantially constant, its movement is not affected by the bonding device, and the magnitude of the friction force 2 is substantially stable.

[0009] The mass of the mover and the bonding equipment on it is also basically constant. However, when the bonding equipment bonds the chip to the carrier or lead frame, the bonding impact force will change the elastic force of the mover on the mover track, making the friction force 1 unable to remain stable, making the acceleration of the induction drive shaft connected to the mover interspersed with the magnetic field unstable.

[0010] In the present invention, the left and right ends of the stator are respectively connected to one end of a connecting rod, or one end is connected to a connecting rod and the other end is not connected. The other end of the connecting rod is connected to the piston of each cylinder piston structure, and the piston can oscillate left and right in each cylinder.

[0011] The stator is also provided with sensors that can measure the acceleration of the sensing drive shaft moving therein.

[0012] A controller is provided between the sensor and the left and right cylinder piston structures. The controller can sense and receive the acceleration signal of the sensor and control the pressure of the gas in the cylinders of the left and right cylinder piston structures (controlling the amount of gas in and out of each cylinder or the instantaneous gas pressure through the automatic control valves of each gas pipeline).

[0013] When the bonding device is performing a bonding operation (releasing the chip), the pressure of the mover (and the bonding device) on the mover track decreases, the friction force 1 decreases, the acceleration of the mover moving (to the left or right) increases, and the acceleration of the induction drive shaft moving to the left or right increases; at this time, the controller controls the air pressure in the left cylinder piston to decrease or increase, and the air pressure in the right cylinder piston to increase or decrease, so that the acceleration of the stator floating to the left (or right) increases, so as to adapt to the increased movement acceleration of the induction drive shaft, so that the speed of the mover and the stator moving toward each other remains stable.

[0014] When the bonding device is picking up the chip, the pressure of the mover (and the bonding device) on the mover track increases, the friction force 1 increases, the acceleration of the mover moving (to the left or right) decreases, and the acceleration of the induction drive shaft moving to the left or right is small. At this time, the controller controls the air pressure in the right cylinder to increase or decrease, and the air pressure in the left cylinder to decrease or increase, so that the acceleration of the stator floating to the right (or left) is reduced to adapt to the reduction of the acceleration of the mover movement, so that the relative movement speed between the mover and the stator (target speed, a function of dynamic changes) remains stable.

[0015] In the present invention, since the mass of the chip is small relative to the mass of the bonding device, the mass of the bonding device with and without the chip is almost the same, and the difference in friction force 1 between the two states is generally not considered.

[0016] Technical effects: In the reactionless mechanism that eliminates inertial force, the friction force of the more important reactionless part is kept constant, so that the chip bonding accuracy of the bonding equipment can be stabilized.

[0017] By using the bonding head to pick up the chip and place the chip for bonding, the different changes in the elastic force on the track, and the relative mass ratio of the bonding equipment to the mover and stator, the high and low values ​​of the air pressure in the left and right piston cylinders can be accurately calculated.

[0018] The controller can digitally convert the acceleration information and digitally and accurately control the cylinder air pressure and piston movement amplitude of the cylinder piston.

[0019] The principles and structural features of the present invention can be applied to chip bonding equipment in various types of semiconductor manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of a planar structure of the present invention; Figure 2 It is another schematic diagram of the planar structure of the present invention; Figure 3 It is the local structure and circuit diagram of the present invention.

[0021] In the figure, 1-stator; 2-mover; 3-induction drive shaft; 4-statator track; 5-mover track; 6-slider A (friction force A); 7-slider B (friction force B); 8-magnet; 9-sensor; 10-cylinder piston structure; 11-bonding device; 12-fixed platform; 13-controller. Specific embodiments

[0022] Embodiment 1: like Figure 1 The variable resistance shock-absorbing bonding device shown has a floating linear motor and a bonding device 11 fixedly connected to the mover 2 of the linear motor. The stator 1 is subjected to the reaction force of the mover 2 and moves right and left in the opposite direction to the mover 2. The induction drive shaft 3 fixedly connected to the mover 2 is inserted in the straight magnetic field of the stator 1 and drives the mover 2 in the alternating magnetic field induction of the stator 1.

[0023] The left and right sides of the stator 1 are each connected to one end of a connecting rod, and the other end of the connecting rod is connected to the piston of the respective cylinder-piston structure 10, and the piston oscillates in the respective cylinder.

[0024] The stator 1 is also provided with a sensor 9 which can measure the acceleration of the driving shaft 3 moving therein.

[0025] A controller 13 is provided between the sensor 9 and the cylinder piston structure 10 . The controller 13 can sense and receive the acceleration signal of the sensor 9 . The controller 13 can control the pressure of the gas in the cylinder of the cylinder piston structure 10 .

[0026] Embodiment 2: The variable resistance shock-absorbing bonding device comprises a floating linear motor and a bonding device 11 fixedly connected to the mover 2 of the linear motor. The induction drive shaft 3 fixedly connected to the mover 2 is inserted in the straight magnetic field of the stator 1 and drives the mover 2 in the alternating magnetic field induction of the stator 1.

[0027] The left side of the stator 1 is connected to one end of a connecting rod; the other end of the connecting rod is connected to the piston of the respective cylinder-piston structure 10, and the piston oscillates in the respective cylinder.

[0028] The stator 1 is also provided with a sensor 9 capable of measuring the acceleration of the inductive drive shaft 3 moving therein; a controller 13 is provided between the sensor 9 and the cylinder piston structure 10, and the controller 13 can sense and receive the acceleration signal of the sensor 9, and the controller 13 can control the pressure of the gas in the cylinder of the cylinder piston structure 10.

Claims

1. A variable resistance damping bonding device, comprising a floating linear motor and a bonding device (11) fixedly connected to a mover (2) of the linear motor, wherein the stator (1) is subjected to a reaction force from the mover (2) and can move rightward or leftward in opposite directions to the mover (2); characterized in that: An induction drive shaft (3) fixedly connected to the mover (2) penetrates the straight magnetic field of the stator (1) and drives the mover (2) to move left and right in the alternating magnetic field induction of the stator (1); The left and right sides of the stator (1) are each connected to one end of a connecting rod, or any one side is connected to one end of a connecting rod; the other end of the connecting rod is connected to the piston of each cylinder piston structure (10), and the piston can oscillate in the respective cylinder.

2. The variable resistance damping bonding device according to claim 1, characterized in that: The stator (1) is also provided with a sensor (9) capable of measuring the acceleration of the inductive drive shaft (3) moving therein; A controller (13) is provided between the sensor (9) and the cylinder piston structure (10). The controller (13) is capable of sensing and receiving the acceleration signal measured by the sensor (9). The controller (13) is capable of controlling the pressure of the gas in the cylinder of the cylinder piston structure (10).

3. The variable resistance damping bonding device according to claim 2, characterized in that: When the bonding device (11) is performing a bonding operation, the pressure of the mover (2) on the mover track (5) decreases, the acceleration of the mover (2) increases, and the acceleration of the induction drive shaft (3) increases; at this time, the controller (13) controls the air pressure in the cylinder piston to decrease or increase; or controls the air pressure in the left cylinder piston to decrease or increase, and the air pressure in the right cylinder piston to increase or decrease; so that the floating acceleration of the stator (1) is also increased, and the speed of the mover (2) and the stator (1) moving toward each other remains stable.

4. The variable resistance damping bonding device according to claim 2, characterized in that: When the bonding device (11) is performing a chip picking operation, the pressure of the mover (2) on the mover track (5) increases, the acceleration of the mover (2) decreases, and the acceleration of the induction drive shaft (3) decreases; at this time, the controller (13) controls the air pressure in the cylinder piston to increase or decrease; or controls the air pressure in the left cylinder piston to increase or decrease, and the air pressure in the right cylinder piston to decrease or increase; so that the floating acceleration of the stator (1) is also reduced, and the speed of the mover (2) and the stator (1) moving toward each other remains stable.

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