Wafer loading and unloading system for epitaxial reactor and epitaxial reactor

Abstract

A system (1) for loading and unloading wafers (2) into a reaction chamber (3) of an epitaxial reactor (4), the system (1) comprising a handling robot (5); a linear actuator (6) extending along a translation axis (7), where the transfer robot (5) is configured to transfer the wafer (2) to the linear actuator (6), and where the linear actuator (6) is configured to receive the wafer (2) from the transfer robot (5) and to move the wafer (2) along the translation axis (7) in order to place the wafer (2) within the reaction chamber (3).

Description

Technical Field

[0001] The present invention relates to a wafer loading and unloading system for an epitaxial reactor, and an epitaxial reactor comprising such a loading and unloading system. Background Art

[0002] Known epitaxial reactors comprise a reaction chamber into which a wafer is introduced, usually placed on a support, for an epitaxial deposition process of semiconductor material.

[0003] In known solutions, the wafers and their supports are loaded and unloaded from the reaction chamber by means of a multi-articulated wafer handling robot which is located in a wafer handling chamber facing and connected to the reaction chamber.

[0004] In known solutions, the robotic handling system comprises an articulated arm at the end of which is articulated an end handling device or “end effector.” This end effector is suitable for grasping a wafer and a wafer support and inserting it into a reaction chamber.

[0005] There is a need to reduce the footprint of an epitaxial reactor, particularly the footprint of a wafer loading and unloading system within a reaction chamber of an epitaxial reactor.

[0006] However, in known solutions, due to the intense heat inside the reaction chamber, the robot joint and therefore the articulated robot arm must be kept outside the reaction chamber and only the end effector can extend into the volume of the reaction chamber to deposit the wafer and its support.

[0007] Due to the constraints of the production process and the required throughput requirements, both the reaction chamber and the end effector must have a certain minimum length. Therefore, in order to reduce the footprint of the epitaxial reactor, the possibility of reducing the length of the reaction chamber or the end effector is limited.

[0008] Indeed, since the end effector must be long enough to transfer the wafers in and out of the reaction chamber, the handling chamber must be large enough to ensure the rotation of the handling robot during wafer loading and unloading operations, especially the rotation of the end effector and the robot articulated arm connected to the end effector.

[0009] A conceivable technical solution for reducing the footprint of known loading and unloading systems is to position multiple reaction chambers in a radial arrangement relative to a single handling robot. However, this technical solution will also result in a large footprint and will not achieve the desired footprint reduction. Summary of the invention

[0010] An object of the present invention is to provide a wafer loading and unloading system for an epitaxial reactor, and an epitaxial reactor comprising the loading and unloading system, so as to solve at least some of the problems mentioned in the prior art.

[0011] A primary object of the present invention is to provide a wafer loading and unloading system for an epitaxial reactor, and an epitaxial reactor comprising the same, which have a reduced overall size in order to maximize wafer production density.

[0012] This and other objects are achieved by a wafer loading and unloading system for an epitaxial reactor and an epitaxial reactor comprising such a loading and unloading system according to the independent claims.

[0013] The dependent claims relate to preferred and advantageous embodiments of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to better understand the present invention and appreciate its advantages, several illustrative and non-limiting embodiments thereof will be described below with reference to the accompanying drawings, in which:

[0015] - Figure 1 is a schematic top view of an epitaxial reactor according to the prior art;

[0016] - Figure 2 is a schematic top view of an epitaxial reactor according to one embodiment of the present invention;

[0017] - Figure 3 is a schematic top view of a wafer loading and unloading system of an epitaxial reactor in an initial operating configuration according to one embodiment of the present invention;

[0018] - Figure 4 yes Figure 3 A schematic top view of the loading and unloading system shown in another operating configuration;

[0019] - Figure 5 yes Figure 3 A schematic top view of the loading and unloading system shown in another operating configuration;

[0020] - Figure 6 yes Figure 3 A schematic top view of the loading and unloading system shown in another operating configuration;

[0021] - Figure 7 is a perspective cross-sectional view of a wafer loading and unloading system of an epitaxial reactor according to one embodiment of the present invention;

[0022] - Figure 8 yes Figure 7 A perspective view of the components of the loading and unloading system shown in an initial operating configuration;

[0023] - Fig. 9 yes Figure 7 A perspective view of components of the loading and unloading system shown in a second operational configuration;

[0024] - Fig.10 yes Figure 7 a perspective view of components of the loading and unloading system shown in a third operational configuration;

[0025] - Fig.11 is a side view of a loading and unloading system in an initial operating configuration according to one embodiment;

[0026] - Fig.12 is a side view of a loading and unloading system in a second operational configuration according to one embodiment. DETAILED DESCRIPTION

[0027] With reference to the drawings, a loading and unloading system is indicated generally by reference numeral 1 .

[0028] The loading and unloading system 1 is configured to load and unload the wafer 2 into the reaction chamber 3 of the epitaxial reactor 4 .

[0029] According to one embodiment, the wafer 2 is placed on a respective wafer support, and the system 1 is configured to move the wafer support on which the wafer 2 is placed.

[0030] According to another embodiment, the wafer 2 is not placed on a wafer support. According to this embodiment, the system 1 is configured to move the wafer 2 directly.

[0031] The system 1 includes a transfer robot 5 .

[0032] In one aspect of the invention, the system 1 comprises a linear actuator 6. The linear actuator 6 extends along a translation axis 7.

[0033] The transfer robot 5 is configured to transfer the wafer 2 to the linear actuator 6 .

[0034] Furthermore, the linear actuator 6 is configured to receive the wafer 2 from the transfer robot 5 .

[0035] The linear actuator 6 is also configured to advance the wafer 2 along the translation axis 7 in order to place the wafer 2 within the reaction chamber 3 .

[0036] Advantageously, the loading and unloading system 1 thus configured has a smaller footprint than the prior art. In particular, the system 1 thus configured enables the use of a handling robot 5 having an articulated arm of reduced length. Furthermore, the system 1 thus configured enables the use of end effector components of reduced length compared to the prior art. Another advantage is that the space below the linear actuator 6 is not occupied and can therefore be used to position additional components, thereby further reducing the overall footprint of the system 1.

[0037] According to one embodiment, the handling robot 5 and the linear actuator 6 are configured to move a wafer support on which the wafer 2 is placed.

[0038] According to another embodiment, the handling robot 5 and the linear actuator 6 are configured to directly move the wafer 2 .

[0039] According to one embodiment, the linear actuator 6 comprises a transmission device 8 .

[0040] The transfer device 8 is configured to receive and support the wafer 2 transferred from the transfer robot 5 .

[0041] Furthermore, the transport device 8 is configured to transport the wafer 2 along the translation axis 7. In this way, the transport device 8 can load the wafer 2 into the reaction chamber 3.

[0042] According to one embodiment, the transport device 8 is configured to move a wafer support on which the wafer 2 is placed.

[0043] According to another embodiment, the transport device 8 is configured to move the wafer 2 directly.

[0044] According to one embodiment, the linear actuator 6 comprises a track 9 .

[0045] The rail 9 extends in a direction parallel to the translation axis 7 .

[0046] The conveyor 8 is connected to the track 9 .

[0047] The track 9 is configured to guide the movement of the transport device 8 along the translation axis 7 .

[0048] The track 9 extends from a stroke start limit 10 and an opposite stroke end limit 11. The stroke end limit 11 faces the reaction chamber 3, while the stroke start limit 10 faces the reaction chamber 3.

[0049] According to one embodiment, the linear actuator 6 comprises a drive system 12 .

[0050] The drive system 12 is configured to drive the movement of the conveyor 8 along the track 9 in the direction of the translation axis 7 .

[0051] According to one embodiment, the drive system 12 is an electromechanical drive system.

[0052] According to one embodiment, the conveying means 8 is a fork 13 .

[0053] The fork 13 comprises at least two prongs 14 , preferably only two prongs 14 .

[0054] Furthermore, the fork 13 comprises a handle 15 connected to the at least two prongs 14 .

[0055] The fork 13 faces the reaction chamber 3 .

[0056] In particular, the tip 14 is positioned substantially parallel to the translation axis 7 .

[0057] The handle 15 also extends parallel to the translation axis 7 ; in particular, it extends along the translation axis 7 .

[0058] Furthermore, the handle 15 is positioned opposite the reaction chamber 3 with respect to the tip 14 .

[0059] According to this configuration, the fork 13 is configured to support the wafer 2 received from the handling robot 5, transfer the wafer 2 to the reaction chamber 3 along the translation axis 7, and deposit the wafer 2 into the reaction chamber 3. The wafer 2 is supported by the prongs 14 of the fork 13.

[0060] Furthermore, after processing of the wafer 2 , the fork 13 is configured to pick up the wafer 2 from the reaction chamber 3 via the prongs 14 , and to move and position the wafer 2 relative to the transfer robot 5 so as to allow the processed wafer 2 to be transferred to the transfer robot 5 .

[0061] According to one embodiment, the fork 13 is configured to move, support, store and pick up a wafer support on which the wafer 2 is placed.

[0062] According to another embodiment, the fork 13 is configured to directly move, support, store and pick up the wafer 2 .

[0063] According to one embodiment, the conveyor 8 can be moved from the stroke start position 24 ( Figure 8 ) or static position to the end position of the stroke 25 ( Fig.10 ) or the storage and removal position of the wafer 2 from the reaction chamber 3.

[0064] In addition, the conveyor 8 can be moved to a transfer position 26 (between the stroke start position 24 and the stroke end position 25). Fig. 9 ).

[0065] Specifically, the conveyor device 8 is configured to receive the wafer 2 from the handling robot 5 when the conveyor device 8 is placed in the transfer position 26 .

[0066] Preferably, the transfer device 8 is also configured to transfer the wafer 2 to the handling robot 5 after processing when the transfer device 8 is placed in the transfer position 26 .

[0067] According to one embodiment, the handling robot 5 is positioned laterally with respect to the linear actuator 6 with respect to the transfer position 26 .

[0068] “Laterally” means laterally relative to the translation axis 7 in a horizontal plane, thus not aligned along the translation axis 7 .

[0069] According to an embodiment in which the transfer device 8 is a fork 13 , the start-of-travel position 24 corresponds to the fork position 13 , in which the end of the handle 15 opposite the prong 14 is located substantially at the start-of-travel limit 10 of the track 9 .

[0070] Furthermore, the end position 25 corresponds to the fork position 13, wherein the end of the handle 15 opposite the prong 14 is located substantially at the end limit 11 of the travel of the rail 9. In the end position 25, the prong 14 extends beyond the rail 9. Furthermore, the handle 15 protrudes from the rail 9. In this way, the prong 14 and a part of the handle 15 can be introduced into the reaction chamber 3 in order to deposit the wafer 2 therein.

[0071] Advantageously, this configuration enables the use of a fork 13 of reduced length compared to the “end effectors” of the prior art. In fact, this configuration of the system 1 does not require the provision of additional space to allow the translation-rotation movement of the fork to insert the wafer into the reaction chamber. On the contrary, the fork 13 thus configured does not perform a rotation, but moves in the direction of the translation axis 7 to deposit and remove the wafer 2 from the reaction chamber 3. This movement therefore requires a smaller footprint than that of the prior art and also requires a fork 13 of reduced size relative to the prior art.

[0072] According to one embodiment, the system 1 includes a lifting system 16 .

[0073] A lifting system 16 is connected to the linear actuator 6 .

[0074] The lifting system 16 is configured to propel the linear actuator 6 in a direction transverse to the translation axis 7 .

[0075] In particular, the lifting system 16 is configured to vertically advance the linear actuator 6 ; ie to move the linear actuator 6 ; ie the fork 13 , in a direction substantially transverse to a plane defined by the conveyor 8 .

[0076] In particular, the lifting system 16 is configured to vertically propel the linear actuator 6 relative to the handling robot 5 ( Figure 11-12 ).

[0077] Advantageously, the lifting system 16 thus configured allows the linear actuator 6, and in particular the transfer device 8, to be vertically raised and lowered relative to the handling robot 5. In this manner, by raising the linear actuator 6, the transfer device 8 is able to receive or pick up the wafer 2 from the handling robot 5 by grasping the wafer 2 with a fork and then inserting the wafer 2 into the reaction chamber 3. Specifically, the transfer device 8 is able to receive or pick up the wafer support on which the wafer 2 is placed by the handling robot 5 by grasping the wafer support with a fork and then inserting the wafer support on which the wafer 2 is placed into the reaction chamber 3. Similarly, by lowering the linear actuator 6, the transfer device 8 is able to transfer the wafer 2 to the handling robot 5 after processing of the wafer 2. Furthermore, by lowering the linear actuator 6, the transfer device 8 is able to deposit the wafer 2 or the wafer support on which the wafer 2 is placed in the reaction chamber 3. Conversely, the transfer device 8 is able to pick up the wafer 2 from the reaction chamber 3 by raising the linear actuator 6 so as to directly grasp the wafer 2 or the wafer support on which the wafer 2 is placed with a fork.

[0078] According to one embodiment, the lift system 16 is configured to vertically move the linear actuator 6 when the conveyor 8 is in the transfer position 26 .

[0079] According to one embodiment, the lift system 16 is configured to vertically move the linear actuator 6 when the conveyor 8 is in the end-of-stroke position 25 .

[0080] According to one embodiment, the lifting system 16 is configured to vertically and jointly move the conveyor 8 , in particular the forks 13 and the rails 9 .

[0081] According to one embodiment, the lifting system 16 is a hydraulic type system. Alternatively, the lifting system 16 is a pneumatic type system. Alternatively, the lifting system 16 is an electromechanical type system.

[0082] According to one embodiment, the lifting system 16 is located below the track 9 .

[0083] According to one embodiment, the system 1 is configured such that when the conveyor 8 moves between the transfer position 26 and the end-of-stroke position 25, or vice versa, the wafer 2 is being conveyed, the conveyor 8 is in the raised configuration. In addition, when the conveyor 8 moves between the transfer position 26 and the end-of-stroke position 25, or vice versa, the wafer 2 is not being conveyed, the conveyor 8 is in the lowered configuration.

[0084] The “raised configuration” and the “lowered configuration” are defined as the maximum and minimum height dimensions that the transfer device 8 can achieve relative to the handling robot 5 by the lifting system 16 .

[0085] According to one embodiment, the system 1 comprises two linear actuators 6 .

[0086] The two linear actuators 6 are positioned opposite to each other relative to the handling robot 5 .

[0087] Furthermore, the linear actuators 6 are positioned parallel to each other.

[0088] In particular, both linear actuators 6 define a respective translation axis 7. The respective translation axes 7 defined by the two linear actuators 6 are parallel but do not overlap.

[0089] In particular, each linear actuator 6 may be positioned facing the respective reaction chamber 3. Thus, the translation axis 7 defined by the respective linear actuator 6 points towards the respective reaction chamber 3.

[0090] Advantageously, this configuration further reduces the overall footprint of the system 1. In fact, two respective linear actuators 6 and therefore two respective reaction chambers 3 can be fed by a single handling robot 5. More advantageously, the parallel arrangement of two linear actuators 6 with the handling robot 5 in between minimizes the overall footprint of the system 1.

[0091] According to one embodiment, the two linear actuators 6 are positioned mirror-image relative to a symmetry plane 27 which is perpendicular and parallel to the translation axis 7 and passes through the handling robot 5 .

[0092] Each linear actuator 6 may include all the features discussed above, which will not be repeated here to avoid repetition.

[0093] According to one embodiment, the system 1 comprises four linear actuators 6 defining two pairs of linear actuators 6. Each linear actuator 6 is positioned along a direction parallel to the translation axis 7.

[0094] Specifically, the two pairs of linear actuators 6 are respectively positioned relative to the handling robot 5. Therefore, the system 1 includes two linear actuators 6 adjacent to each other and parallel to each other, located on one side of the handling robot 5. In addition, the system 1 includes two additional linear actuators 6 adjacent to each other and parallel to each other, located on one side of the handling robot 5, opposite to the side where the other two linear actuators 6 are located.

[0095] Advantageously, this configuration allows four different linear actuators 6 and therefore four different reaction chambers 3 to be fed by a single handling robot 5 between two pairs of linear actuators 6 .

[0096] According to one embodiment, the handling robot 5 is configured to pick up the wafer 2 from the one or more linear actuators 6 , in particular after an epitaxial deposition process on the wafer 2 .

[0097] The following description will refer to the linear actuator 6 , but it should be understood that it also applies to embodiments in which the system 1 comprises two linear actuators 6 that are parallel and opposed relative to the handling robot 5 .

[0098] According to one embodiment, the handling robot 5 is positioned laterally with respect to the linear actuator 6 .

[0099] In particular, the handling robot 5 is configured to transfer the wafer 2 , either directly or supported by a wafer support, to the linear actuator 6 by moving the wafer 2 in a direction substantially transverse to the translation axis 7 .

[0100] Similarly, the handling robot 5 is configured to pick up the wafer 2 from the linear actuator 6 in a direction substantially transverse to the translation axis 7 , either directly or by picking up a wafer support on which the wafer 2 is placed.

[0101] Advantageously, this configuration minimizes the footprint of the handling robot 5 and the linear actuator 6 , as well as the movement of loading or unloading the wafer 2 from the linear actuator 6 by the handling robot 5 .

[0102] According to one embodiment, the handling robot 5 comprises an articulated arm 17 .

[0103] The articulated arm 17 extends between a fulcrum end 18 and an opposite clamping end 19 .

[0104] The articulated arm 17 may include a plurality of joints and articulated sections between the fulcrum end 18 and the clamping end 19 .

[0105] According to one embodiment, the handling robot 5 includes an end effector 20 .

[0106] The end effector 20 is connected to the articulated arm 17 at the gripping end 19 .

[0107] The end effector 20 is configured to move the wafer 2. Furthermore, the end effector 20 is configured to deposit or pick up the wafer 2 from the linear actuator 6, in particular from the conveyor 8.

[0108] According to one embodiment, the end effector 20 is configured to move a wafer support on which the wafer 2 is placed.

[0109] According to another embodiment, the end effector 20 is configured to directly move the wafer 2 .

[0110] According to one embodiment, the end effector 20 is movable in a transport plane parallel to the translation axis 7 , being fixed relative to a frame 21 of the epitaxial reactor 4 .

[0111] In another aspect of the invention, an epitaxial reactor 4 comprises at least one reaction chamber 3 and a loading and unloading system 1 as previously described.

[0112] The reaction chamber 3 is positioned along a translation axis 7 defined by a linear actuator 6 .

[0113] In particular, the reaction chamber 3 is positioned facing the linear actuator 6 ; ie is open in the direction of the translation axis 7 .

[0114] Thus, the linear actuator 6 is configured to move the wafer 2 along the translation axis 7 in the direction of the reaction chamber 3 .

[0115] According to one embodiment, the epitaxial reactor 4 comprises two reaction chambers 3 .

[0116] Furthermore, the system 1 includes two linear actuators 6 and a transfer robot 5 interposed between the two linear actuators 6 .

[0117] Specifically, the handling robot 5 is configured to operate with the two linear actuators 6 , with the handling robot 5 being located between the two linear actuators 6 ; that is, to selectively transfer the wafer 2 to the two linear actuators 6 , and to pick up the wafer 2 from the two linear actuators 6 .

[0118] The linear actuators 6 are positioned parallel to each other.

[0119] Furthermore, the reaction chamber 3 faces a corresponding linear actuator 6 .

[0120] According to one embodiment, the two reaction chambers 3 and the two linear actuators 6 are positioned relative to each other with respect to a plane parallel to the translation axis 7 defined by the linear actuators 6 and passing through the handling robot 5 .

[0121] According to one embodiment, the two reaction chambers 3 and the two linear actuators 6 are positioned mirror-image relative to a symmetry plane 27 which is parallel to the translation axis 7 defined by the linear actuators 6 and passes through the handling robot 5 .

[0122] According to one embodiment, the handling robot 5 is configured to alternately transfer a wafer 2 to one of the two linear actuators 6 and transfer a subsequent wafer 2 to the other of the two linear actuators 6 .

[0123] Advantageously, this makes it possible to reduce the total throughput time of the wafers being processed, thereby increasing the efficiency of the epitaxial reactor 4 .

[0124] According to one embodiment, the epitaxial reactor 4 comprises a loading station 22 ("load lock").

[0125] The loading station 22 is configured to store a plurality of wafers 2 to be used in an epitaxial deposition process in the reaction chamber 3 .

[0126] Preferably, in the loading station 22, a wafer pre-processing operation 2 may be performed to prepare the wafer 2 for the next epitaxial deposition process.

[0127] Specifically, the transfer robot 5 is configured to pick up the wafer 2 to be used in the reaction chamber 3 from the loading station 22 , and then to be transferred to the linear actuator 6 .

[0128] According to one embodiment, the epitaxial reactor 4 comprises a cooling station 23 .

[0129] The cooling station 23 is configured to store a plurality of wafers 2 from the reaction chamber 3 , whereby an epitaxial deposition process is performed thereon, which wafers 2 are to be removed from the linear actuator 6 by the handling robot 5 .

[0130] In particular, the cooling station 23 is adapted to store wafers 2 to be cooled after the epitaxial deposition process.

[0131] The cooling station 23 is different from the loading station 22 .

[0132] According to one embodiment, the loading station 22 and / or the cooling station 23 are positioned between the linear actuator 6 and the reaction chamber 3 of the epitaxial reactor 4 .

[0133] According to one embodiment, the transfer robot 5 is positioned between the loading station 22 and the cooling station 23 .

[0134] According to one embodiment, the handling robot 5, the loading station 22 and / or the cooling station 23 are positioned substantially aligned along an axis parallel to the translation axis 7 of the respective linear actuator 6, between the translation axis 7 of the respective linear actuator 6. Preferably, the loading station 22, the handling robot 5 and the cooling station 23 are positioned substantially aligned along the symmetry plane 27.

[0135] Advantageously, the epitaxial reactor 4 so configured has a smaller footprint than the prior art.

[0136] According to one embodiment, the loading station 22, the cooling station 23 and the transfer position 26 of the respective linear actuator 6 are arranged in a diamond configuration, preferably symmetrical with respect to a symmetry plane 27 parallel to the translation axis 7, defined by the linear actuator 6 and passing through the handling robot 5, and even more preferably centered on the fulcrum end 18 ( Figure 3-6 ).

[0137] Of course, a person skilled in the art will be able to modify or adapt the present invention without departing from the scope of the claims set forth below.

[0138] Reference numerals list

[0139] 1. Loading and unloading system

[0140] 2. Chip

[0141] 3. Reaction chamber

[0142] 4. Epitaxial reactor

[0143] 5. Transport Robot

[0144] 6. Linear Actuator

[0145] 7. Translation axis

[0146] 8.Transmission device

[0147] 9. Track

[0148] 10. Travel start limit

[0149] 11. End of trip limit

[0150] 12. Drive system

[0151] 13. Fork

[0152] 14. Pointed Toe

[0153] 15. Handle

[0154] 16. Improvement system

[0155] 17. Articulated Arm

[0156] 18. Fulcrum end

[0157] 19. Clamping end

[0158] 20. End effector

[0159] 21. Framework

[0160] 22. Loading station

[0161] 23. Cooling station

[0162] 24. Trip start location

[0163] 25. End of trip location

[0164] 26. Transfer Location

[0165] 27. Symmetry plane

Claims

1. A system (1) for loading and unloading wafers (2) in a reaction chamber (3) of an epitaxial reactor (4), the system (1) comprising: - handling robot (5); - a linear actuator (6) extending along a translation axis (7), wherein the handling robot (5) is configured to transfer the wafer (2) to the linear actuator (6), and Therein, the linear actuator (6) is configured to receive the wafer (2) from the handling robot (5) and move the wafer (2) along the translation axis (7) so as to position the wafer (2) in the reaction chamber (3).

2. The system (1) according to claim 1, wherein: The linear actuator (6) comprises a transfer device (8) configured to receive and support a wafer (2) transferred from the handling robot (5), wherein the transfer device (8) is configured to transfer the wafer (2) along the translation axis (7) so as to load the wafer (2) into the reaction chamber (3), and wherein the linear actuator (6) comprises a track (9) extending in a direction parallel to the translation axis (7), wherein the conveyor (8) is connected to the track (9), and Therein, the track (9) is configured to guide the movement of the conveyor (8) along the translation axis (7).

3. The system (1) according to claim 2, wherein: The delivery device (8) is a fork (13) comprising at least two prongs (14), preferably only two prongs (14), and a handle (15) connected to the at least two prongs (14), wherein the fork (13) faces the reaction chamber (3), wherein the tip (14) and the handle (15) are positioned substantially parallel to the translation axis (7), and The handle (15) is positioned relative to the tip (14) and the reaction chamber (3).

4. The system (1) according to claim 2, wherein: The conveying device (8) can be moved from a stroke start position (24) to a stroke end position (25) at the reaction chamber (3) and at a transfer position (26) between the stroke start position (24) and the stroke end position (25), wherein the conveying device (8) is configured to receive the wafer (2) from the handling robot (5) when the conveying device (8) is located at the transfer position (26), wherein the transfer device (8) is configured to transfer the wafer (2) to the handling robot (5) after processing when the transfer device (8) is located at the transfer position (26), and Therein, the handling robot (5) is positioned laterally relative to the linear actuator (6) at the transfer position (26).

5. System (1) according to claims 3 and 4, wherein: The start-of-travel position (24) corresponds to a fork position (13), wherein the end of the handle (15) opposite the prong (14) is substantially located at the start-of-travel limit (10) of the track (9), wherein the end-of-travel position (25) corresponds to a fork position (13), wherein the end of the handle (15) opposite the prong (14) is substantially located at the end-of-travel limit (11) of the track (9), and wherein, in the end-of-travel position (25), the prong (14) extends beyond the track (9) and the handle (15) protrudes from the track (9).

6. System (1) according to any one of the preceding claims, comprising a lifting system (16) connected to the linear actuator (6), in, The lifting system (16) is configured to move the linear actuator (6) in a direction transverse to the translation axis (7), Among them, preferably, the lifting system (16) is a hydraulic or pneumatic or electromechanical type system.

7. The system (1) according to any of the preceding claims, comprising two linear actuators (6) positioned opposite the handling robot (5), wherein the linear actuators (6) are positioned parallel to each other and wherein each linear actuator (6) can be positioned facing a respective reaction chamber (3), and in, Preferably, the two linear actuators (6) are positioned in mirror image with respect to a symmetry plane (27) which is perpendicular and parallel to the translation axis (7) and passes through the handling robot (5).

8. The system (1) according to claim 7, comprising four linear actuators (6) defining two pairs of linear actuators (6), wherein the two pairs of linear actuators (6) are respectively positioned relative to the handling robot (5), wherein: The linear actuators (6) in each pair of linear actuators (6) are adjacent to each other and parallel.

9. System (1) according to any one of the preceding claims, wherein: The handling robot (5) is positioned laterally relative to one or more linear actuators (6), wherein the handling robot (5) is configured to transfer the wafer (2) to the linear actuator (6), or pick up the wafer (2) from the linear actuator (6), and move the wafer (2) in a direction substantially transverse to the translation axis (7).

10. The system (1) according to any one of the preceding claims, wherein: The handling robot (5) comprises an articulated arm (17) extending between a fulcrum end (18) and an opposite gripping end (19), and comprises an end effector (20) connected to the articulated arm (17) at the gripping end (19), wherein the end effector (20) is configured to move the wafer (2) and to deposit or pick up the wafer (2) from the linear actuator (6), in particular from a conveyor (8), and The end effector (20) is movable on a transport plane parallel to the translation axis (7) and is fixed to a frame (21) of the epitaxial reactor (4).

11. An epitaxial reactor (4) comprising at least one reaction chamber (3) and a loading and unloading system (1) according to any one of the preceding claims, in, The reaction chamber (3) is positioned along a translation axis (7) defined by the linear actuator (6), facing the linear actuator (6), and Therein, the linear actuator (6) is configured to move the wafer (2) along a translation axis (7) in the direction of the reaction chamber (3).

12. The epitaxial reactor (4) according to claim 11, comprising two reaction chambers (3), in, The system (1) comprises two linear actuators (6) and a handling robot (5) interposed between the two linear actuators (6), wherein the linear actuators (6) are positioned parallel to each other, and wherein the reaction chamber (3) faces the corresponding linear actuator (6), and wherein, optionally, the two reaction chambers (3) and the two linear actuators (6) are mirror-positioned relative to a symmetry plane (27), which is parallel to the translation axis (7) defined by the linear actuators (6) and passes through the handling robot (5).

13. The epitaxial reactor (4) according to claim 12, comprising a loading station (22) configured to store a plurality of wafers (2) to be used for an epitaxial deposition process in the reaction chamber (3), wherein The handling robot (5) is configured to pick up a wafer (2) from a loading station (22) to be used in a reaction chamber (3) and to be transferred to a linear actuator (6), wherein the epitaxial reactor (4) comprises a cooling station (23) configured to store a plurality of wafers (2) from the reaction chamber (3), and wherein the cooling station (23) is different from the loading station (22), wherein the loading station (22) and the cooling station (23) are positioned between the linear actuator (6) and the reaction chamber (3) of the epitaxial reactor (4), And, optionally, wherein the handling robot (5) is positioned between the loading station (22) and the cooling station (23), And, optionally, the handling robot (5), the loading station (22) and the cooling station (23) are positioned to be substantially aligned along axes parallel to the translation axes (7) of the corresponding linear actuators (6), between the translation axes (7) of the corresponding linear actuators (6).

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