Heat dissipation module and electronic equipment

Abstract

The invention belongs to the field of display equipment, and discloses a heat dissipation module and electronic equipment, the heat dissipation module comprises a support, a first heat conduction pipe, a heat conduction main body, a first radiator and a second radiator; the support is connected above the electrical apparatus element, one end of the first heat conduction pipe is connected with the support, and the other end of the first heat conduction pipe is connected with the heat conduction main body; the first radiator and the second radiator are connected to the two sides of the heat conduction body respectively. And the heat conduction main body is made of a heat conduction material. By means of the mode, heat generated on the electric appliance elements is stably and rapidly conducted to the surrounding environment, and the equipment cooling efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of display devices, and in particular to a heat dissipation module and an electronic device. Background Art

[0002] Currently, electronic devices with display functions often generate a large amount of heat during operation due to their high power consumption. If the heat cannot be discharged in time, the temperature of the electronic device will rise rapidly and cause the device to crash.

[0003] At present, most electronic devices mainly use active heat dissipation in the form of a fan plus an aluminum extruded heat sink. However, the fan has an unstable lifespan and produces a lot of noise. If the fan suddenly stops working, the temperature of the electronic device will rise rapidly and cause the machine to crash. In addition, users usually use the electronic equipment in an environment with harsh electricity consumption, and the power consumption of the electronic equipment is relatively large, reaching 60 to 80 watts, which does not allow the addition of fans to assist in heat dissipation.

[0004] How to stably and quickly transfer the heat generated by electrical components to the surrounding environment and improve the cooling efficiency of the equipment has become an urgent problem to be solved in this field. Summary of the invention

[0005] The present application discloses a heat dissipation module and an electronic device, the purpose of which is to stably and quickly conduct the heat generated by electrical components to the surrounding environment, thereby improving the cooling efficiency of the equipment.

[0006] The present application discloses a heat dissipation module, which includes: a bracket, a first heat-conducting pipe, a heat-conducting body, a first radiator and a second radiator; the bracket is connected above the electrical component, one end of the first heat-conducting pipe is connected to the bracket, and the other end is connected to the heat-conducting body; the first radiator and the second radiator are respectively connected to two sides of the heat-conducting body; the heat-conducting body is made of heat-conducting material.

[0007] Optionally, the heat-conducting body is of an elongated shape, and a plurality of second heat-conducting tubes are arranged at intervals in the extension direction of the heat-conducting body, and each of the second heat-conducting tubes passes through the heat-conducting body and is connected to the heat-conducting body; and both ends of each of the second heat-conducting tubes are exposed outside the heat-conducting body and are respectively connected to the first radiator and the second radiator.

[0008] Optionally, the first radiator and the second radiator each include a plurality of cooling fins, the plurality of cooling fins are arranged at intervals and are perpendicular to the second heat pipe; each of the second heat pipes passes through the cooling fins of the first radiator and the second radiator, and is connected to the cooling fins.

[0009] Optionally, the heat dissipation module also includes a third heat pipe, a third radiator and a fourth radiator, the third radiator and the fourth radiator are respectively arranged on both sides of the bracket, and the third radiator corresponds to the position of the first radiator; the fourth radiator corresponds to the position of the second radiator, and the third heat pipe is simultaneously connected to the bracket, the third radiator and the fourth radiator; the third radiator and the fourth radiator each include a plurality of fins arranged at intervals; the plurality of fins are perpendicular to the third heat pipe, and the third heat pipe passes through the fins of the third radiator and the fourth radiator, and is connected to the fins.

[0010] Optionally, there is a gap between the first heat sink and the third heat sink; there is a gap between the second heat sink and the fourth heat sink; a first heat conductive sheet is connected between the first heat sink and the third heat sink, and a second heat conductive sheet is connected between the second heat sink and the fourth heat sink.

[0011] Optionally, the heat dissipation module also includes a heat spreader, which is arranged below the first heat sink, the second heat sink and the heat-conducting body, and is connected to the first heat sink, the second heat sink and the heat-conducting body; the area of ​​the heat spreader is greater than or equal to the total area of ​​the first heat sink, the second heat sink and the heat-conducting body.

[0012] Optionally, a first support member is arranged between the third radiator and the heat spreader, and a second support member is arranged between the fourth radiator and the heat spreader, and two ends of the first support member are respectively connected to the third radiator and the heat spreader, and the third radiator is lifted to a preset height relative to the heat spreader; two ends of the second support member are respectively connected to the fourth radiator and the heat spreader, and the fourth radiator is lifted to a preset height relative to the heat spreader.

[0013] Optionally, the gap between the third heat sink, the first heat sink and the heat spreader, and the gap between the fourth heat sink, the second heat sink and the heat spreader together form a first heat dissipation channel; the thickness of the heat-conducting body is smaller than the thickness of the first heat sink and the second heat sink, and the gap between the heat-conducting body and the first heat sink and the second heat sink forms a second heat dissipation channel; the first heat dissipation channel is connected to the second heat dissipation channel.

[0014] The present application also discloses an electronic device, including a housing and electrical components, wherein the electrical components are arranged in the housing. The electronic device also includes the above-mentioned heat dissipation module, which is installed in the housing, and the bracket of the heat dissipation module is connected to the electrical components.

[0015] Optionally, the electronic device also includes a cover body, which covers the heat dissipation module and is connected to the shell. The cover body is away from the side of the heat dissipation module and is provided with multiple ridges corresponding to the positions of the first radiator and the second radiator of the heat dissipation module; and the sides of the multiple ridges are provided with heat dissipation holes.

[0016] The present application is designed for a heat dissipation module. By connecting the bracket of the heat dissipation module with the electrical components in the electronic device, the heat emitted by the electrical components is directly transferred to the bracket, and then the heat of the bracket is transferred to the heat-conducting body through the first heat-conducting pipe connected to the bracket. In this way, the heat generated by the electrical components as a heat source can be quickly conducted to a position far away from the heat source, avoiding excessive concentration of heat at the heat source, which causes the electrical components to be burned due to excessive temperature; and after the heat is transferred to the heat-conducting body, the heat-conducting body is used as the hub of heat conduction to transfer the heat to the first radiator and the second radiator respectively, thereby expanding the area of ​​heat transfer, and using the first radiator and the second radiator to transfer the heat to the environment through the air, so that the entire heat is transmitted from the heat source to the radiator in the process of "point to surface", and the heat is transferred from different directions while increasing the heat dissipation area; that is, the heat dissipation module in the present application can achieve heat dissipation by utilizing the structure and material properties of the module itself combined with air flow, without the need to add other heat dissipation equipment, so that the heat generated by the electrical components can be stably and quickly conducted to the surrounding environment, thereby improving the cooling efficiency of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0018] Figure 1 A schematic diagram of a first embodiment of the heat dissipation module of the present application;

[0019] Figure 2 A schematic diagram of a second embodiment of the heat dissipation module of the present application;

[0020] Figure 3 A schematic diagram of a third embodiment of the heat dissipation module of the present application;

[0021] Figure 4 A schematic diagram of a fourth embodiment of the heat dissipation module of the present application;

[0022] Figure 5A schematic diagram of a fifth embodiment of the heat dissipation module of the present application;

[0023] Figure 6 A schematic diagram of a sixth embodiment of the heat dissipation module of the present application;

[0024] Figure 7 A partial schematic diagram of a seventh embodiment of the heat dissipation module of the present application;

[0025] Figure 8 A schematic diagram of a first embodiment of an electronic device of the present application;

[0026] Fig. 9 This is a schematic diagram of a cover body in a second embodiment of the electronic device of the present application.

[0027] Among them, 10, electronic equipment; 100, heat dissipation module; 110, bracket; 120, first heat pipe; 130, heat conduction body; 131, second heat pipe; 140, first radiator; 141, second radiator; 150, heat dissipation fins; 151, third heat pipe; 152, third radiator; 153, fourth radiator; 160, fins; 161, first heat conductive sheet; 162, second heat conductive sheet; 170, heat spreader; 171, first support member; 172, second support member; 180, first heat dissipation channel; 181, second heat dissipation channel; 200, electrical component; 300, shell; 400, cover; 410, heat dissipation hole; 420, ridge. DETAILED DESCRIPTION

[0028] The present application is described in detail below with reference to the accompanying drawings and optional embodiments. It should be noted that, under the premise of no conflict, the embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0029] Figure 1 Schematic diagram of the first embodiment of the heat dissipation module of the present application, such as Figure 1 As shown, the present application discloses a heat dissipation module 100, which includes: a bracket 110, a first heat-conducting pipe 120, a heat-conducting body 130, a first radiator 140 and a second radiator 141; the bracket 110 is connected above the electrical component 200, one end of the first heat-conducting pipe 120 is connected to the bracket 110, and the other end is connected to the heat-conducting body 130; the first radiator 140 and the second radiator 141 are respectively connected to both sides of the heat-conducting body 130; the heat-conducting body 130 is made of heat-conducting material.

[0030] The present application is designed for a heat dissipation module 100. By connecting a bracket 110 of the heat dissipation module 100 with an electrical component 200 in an electronic device 10, the heat emitted by the electrical component 200 is directly transferred to the bracket 110. Then, the heat of the bracket 110 is transferred to a heat-conducting body 130 through a first heat-conducting pipe 120 connected to the bracket 110. In this way, the heat generated by the electrical component 200 as a heat source can be quickly transferred to a position far away from the heat source, thereby preventing the heat from being too concentrated at the heat source, causing the electrical component 200 to be burned due to excessive temperature. Moreover, after the heat is transferred to the heat-conducting body 130, the heat-conducting body 130 is used as the hub of heat conduction. The heat is transferred to the first radiator 140 and the second radiator 141 respectively, so that the area of ​​heat transfer is expanded, and the first radiator 140 and the second radiator 141 are used to transfer the heat to the environment through the air, so that the entire heat is transmitted from the heat source to the radiator in a "point-to-surface" manner. While transferring heat from different directions, the heat dissipation area is also increased; that is, the heat dissipation module 100 in the present application can achieve heat dissipation by utilizing the structure and material properties of the module itself combined with air flow, without the need for additional heat dissipation equipment. In this way, the heat generated by the electrical component 200 can be stably and quickly conducted to the surrounding environment, thereby improving the cooling efficiency of the equipment.

[0031] Figure 2 Schematic diagram of the second embodiment of the heat dissipation module of the present application, such as Figure 2 As shown, the heat-conducting body 130 is long and strip-shaped, and a plurality of second heat-conducting tubes 131 are arranged at intervals in the extending direction of the heat-conducting body 130. Each second heat-conducting tube 131 passes through the heat-conducting body 130 and is connected to the heat-conducting body 130; and both ends of each second heat-conducting tube 131 are exposed outside the heat-conducting body 130 and are respectively connected to the first heat sink 140 and the second heat sink 141.

[0032] This embodiment and Figure 1 What is different from the illustrated embodiment is that, in this embodiment, a plurality of second heat-conducting pipes 131 are arranged at intervals on the heat-conducting body 130, and the plurality of second heat-conducting pipes 131 are respectively connected to the first radiator 140 and the second radiator 141, so that the heat on the heat-conducting body 130 can be quickly transferred to the first radiator 140 and the second radiator 141 through the second heat-conducting pipes 131, and the heat is introduced into the external environment through the first radiator 140 and the second radiator 141, effectively avoiding the accumulation of heat at the position of the heat-conducting body 130, causing the local temperature of the heat-conducting body 130 to be too high and uneven heat dissipation to occur.

[0033] In addition, in order to ensure that the heat on the heat-conducting body 130 can be evenly transferred to the first radiator 140 and the second radiator 141, multiple second heat-conducting pipes 131 can be evenly spaced on the heat-conducting body 130. While the second heat-conducting pipes 131 quickly transfer heat, they can also evenly transfer heat to various positions of the first radiator 140 and the second radiator 141, so that the heat received by the first radiator 140 and the second radiator 141 is uniform, further improving the heat dissipation uniformity of the heat dissipation module 100.

[0034] Figure 3 Schematic diagram of the third embodiment of the heat dissipation module of the present application, as shown Figure 3 As shown, Figure 3 The illustrated embodiment is based on Figure 2 The improvement is that the first radiator 140 and the second radiator 141 each include a plurality of heat dissipation fins 150, the plurality of heat dissipation fins 150 are arranged at intervals and are perpendicular to the second heat pipe 131; each second heat pipe 131 passes through the heat dissipation fins 150 of the first radiator 140 and the second radiator 141, and is connected to the heat dissipation fins 150.

[0035] The first radiator 140 and the second radiator 141 in the present application both adopt a heat dissipation fin 150 structural design, and use multiple heat dissipation fins 150 to transfer heat to the external environment, and the second heat pipe 131 vertically penetrates the heat dissipation fins 150 of the first radiator 140 and the second radiator 141, which effectively shortens the heat conduction path and allows the heat emitted by the electrical component 200 to be directly conducted to the heat dissipation fins 150 in the first radiator 140 and the second radiator 141 through the second heat pipe 131 on the heat conduction body 130 when the heat is transferred to the heat conduction body 130, which is conducive to forming efficient heat dissipation.

[0036] Figure 4 Schematic diagram of a fourth embodiment of the heat dissipation module of the present application, as shown Figure 4 As shown, Figure 4 The illustrated embodiment is based on Figure 3 The heat dissipation module 100 further includes a third heat pipe 151, a third heat sink 152 and a fourth heat sink 153. The third heat sink 152 and the fourth heat sink 153 are respectively arranged on both sides of the bracket 110, and the third heat sink 152 corresponds to the position of the first heat sink 140; the fourth heat sink 153 corresponds to the position of the second heat sink 141, and the third heat pipe 151 is simultaneously connected to the bracket 110, the third heat sink 152 and the fourth heat sink 153; the third heat sink 152 and the fourth heat sink 153 both include a plurality of fins 160 arranged at intervals; the plurality of fins 160 are perpendicular to the third heat pipe 151, and the third heat pipe 151 passes through the fins 160 of the third heat sink 152 and the fourth heat sink 153, and is connected to the fins 160.

[0037] The present embodiment is different from the previous embodiment in that, in the present embodiment, a third radiator 152 and a fourth radiator 153 are further provided on both sides of the electrical component 200. Since the third radiator 152 and the fourth radiator 153 are located closer to the electrical component 200, the heat emitted by the electrical component 200 will first reach the third radiator 152 and the fourth radiator 153, and the heat received by the third radiator 152 and the fourth radiator 153 is relatively large; therefore, the third radiator 152 and the fourth radiator 153 are connected to the electrical component 200 by the third heat pipe 151. 3 is connected to the bracket 110; when the electrical component 200 generates heat, the heat is transferred to the third radiator 152 and the fourth radiator 153 respectively through the third heat pipe 151, and the third radiator 152 and the fourth radiator 153 are used to quickly dissipate the heat generated by the electrical component 200 to the external environment, so as to avoid the heat generated by the electrical component 200 accumulating in the vicinity thereof, causing the temperature around the electrical component 200 to be high, affecting the heat dissipation effect of the third radiator 152 and the fourth radiator 153, and thus improving the overall heat dissipation effect of the heat dissipation module 100.

[0038] Among them, the third radiator 152 and the fourth radiator 153 both adopt a fin 160 structural design, and the heat is quickly transferred to the external environment through the fins 160, and the third heat pipe 151 vertically penetrates the fins 160 of the third radiator 152 and the fourth radiator 153, which effectively shortens the path of heat conduction from the electrical component 200 to the third radiator 152 and the fourth radiator 153, and also allows the heat emitted by the electrical component 200 to be directly conducted to the fins 160 in the third radiator 152 and the fourth radiator 153 that mainly have a heat dissipation function, further improving the heat dissipation efficiency of the third radiator 152 and the fourth radiator 153.

[0039] Figure 5 Schematic diagram of the fifth embodiment of the heat dissipation module of the present application, as shown Figure 5 As shown, Figure 5 The illustrated embodiment is based on Figure 4 The improvement is that there is a gap between the first radiator 140 and the third radiator 152; there is a gap between the second radiator 141 and the fourth radiator 153; a first heat conducting sheet 161 is connected between the first radiator 140 and the third radiator 152, and a second heat conducting sheet 162 is connected between the second radiator 141 and the fourth radiator 153.

[0040] In this embodiment, the first heat conducting sheet 161 and the second heat conducting sheet 162 are used to connect the first heat sink 140 and the third heat sink 152, and the second heat sink 141 and the fourth heat sink 153, respectively. Since the third heat sink 152 and the fourth heat sink 153 are closer to the electrical component 200 than the first heat sink 140 and the second heat sink 141, the third heat sink 152 and the fourth heat sink 153 will first receive the heat transferred from the electrical component 200. In a short period of time, the third heat sink 152 and the fourth heat sink 153 may be subjected to a large amount of heat, and this When the heat is dissipated, part of the heat is dissipated by the third radiator 152 and the fourth radiator 153, and the heat is brought to the external environment through the air, and the other part of the heat is conducted to the first radiator 140 and the second radiator 141 through the first heat conductive sheet 161 and the second heat conductive sheet 162 respectively; the first radiator 140 and the second radiator 141 share the heat dissipation pressure of the third radiator 152 and the fourth radiator 153, so that each heat dissipation area of ​​the entire heat dissipation module 100 can normally exert the heat dissipation performance, and further improve the overall heat dissipation efficiency of the heat dissipation module 100.

[0041] Figure 6 Schematic diagram of the sixth embodiment of the heat dissipation module of the present application, as shown Figure 6 As shown, Figure 6 The illustrated embodiment is based on Figure 5 The improvement of the heat dissipation module 100 also includes a heat spreader 170, which is arranged below the first heat sink 140, the second heat sink 141 and the heat-conducting body 130, and is connected to the first heat sink 140, the second heat sink 141 and the heat-conducting body 130; the area of ​​the heat spreader 170 is greater than or equal to the total area of ​​the first heat sink 140, the second heat sink 141 and the heat-conducting body 130.

[0042] The present embodiment is different from the previous embodiment in that, in the present embodiment, a heat spreader 170 is further provided below the first heat sink 140, the second heat sink 141 and the heat-conducting body 130, and the heat spreader 170 covers the first heat sink 140, the second heat sink 141 and the bottom surface of the heat-conducting body 130. The heat spreader 170 may be made of graphene material or silicon material, and is connected to the first heat sink 140, the second heat sink 141 and the heat-conducting body 130 through the heat spreader 170, so that the heat of the first heat sink 140, the second heat sink 141 and the heat-conducting body 130 can be evenly dissipated through the heat spreader 170, thereby further accelerating the rate of heat transfer, which is beneficial to improving the heat dissipation efficiency of the heat dissipation module 100.

[0043] In addition, the thickness of the heat spreader 170 can be adjusted according to actual heat dissipation requirements. If the heat dissipation pressure of the device is large, a thicker heat spreader 170 can be set. If the heat dissipation performance of the device is stable, the thickness of the heat spreader 170 can be reduced according to the size of the device itself to make the device lighter and thinner.

[0044] Figure 7 FIG. 1 is a partial schematic diagram of a seventh embodiment of the heat dissipation module of the present application. Figure 7 As shown, Figure 7 The illustrated embodiment is based on Figure 6 In the improvement, a first support member 171 is arranged between the third heat sink 152 and the heat spreader 170, and a second support member 172 is arranged between the fourth heat sink 153 and the heat spreader 170. The two ends of the first support member 171 are respectively connected to the third heat sink 152 and the heat spreader 170, and the third heat sink 152 is lifted to a preset height relative to the heat spreader 170; the two ends of the second support member 172 are respectively connected to the fourth heat sink 153 and the heat spreader 170, and the fourth heat sink 153 is lifted to a preset height relative to the heat spreader 170.

[0045] This embodiment and Figure 6 What is different from the illustrated embodiment is that, in this embodiment, a first support member 171 and a second support member 172 are additionally provided between the third heat sink 152 and the heat spreader 170, and between the fourth heat sink 153 and the heat spreader 170. The third heat sink 152 and the fourth heat sink 153 are respectively lifted to a preset height relative to the heat spreader 170 by the first support member 171 and the second support member 172, so that sufficient space is formed at the bottom of the third heat sink 152 and the fourth heat sink 153 to allow air to circulate; and since the third heat sink 152 and the fourth heat sink 153 are closer to the electrical component 200 than the first heat sink 140 and the second heat sink 141, when the air circulation at the bottom of the third heat sink 152 and the fourth heat sink 153 is accelerated, the air can be better utilized to take away the heat near the electrical component 200 through the air, thereby avoiding the accumulation of heat near the electrical component 200, causing the electrical component 200 to be continuously high in temperature, and preventing the electrical component 200 from operating abnormally or burning.

[0046] Furthermore, the gaps between the third heat sink 152, the first heat sink 140 and the heat spreader 170, and the gaps between the fourth heat sink 153, the second heat sink 141 and the heat spreader 170 together form a first heat dissipation channel 180; the thickness of the heat-conducting body 130 is smaller than the thickness of the first heat sink 140 and the second heat sink 141, respectively, and the gaps between the heat-conducting body 130 and the first heat sink 140 and the second heat sink 141 form a second heat dissipation channel 181; the first heat dissipation channel 180 is connected to the second heat dissipation channel 181.

[0047] The first heat dissipation channel 180 is formed by utilizing the gaps between the third heat sink 152, the first heat sink 140 and the heat spreader 170, and between the fourth heat sink 153, the second heat sink 141 and the heat spreader 170. The thickness difference between the heat-conducting body 130 and the first heat sink 140 and the second heat sink 141 is utilized to make the gap formed by the thickness difference between the heat-conducting body 130 and the first heat sink 140 and the second heat sink 141 serve as the second heat dissipation channel 181. When the first heat dissipation channel 180 and the second heat dissipation channel 181 are connected, the air in the entire heat dissipation module 100 can circulate over a large area through the first heat dissipation channel 180 and the second heat dissipation channel 181, thereby accelerating the circulation rate of the air in the heat dissipation module 100, and when the air passes through the first heat dissipation channel 180 and the second heat dissipation channel 181, the heat at various positions of the heat dissipation module 100 can be taken away to the external environment.

[0048] Figure 8 This is a schematic diagram of a first embodiment of the electronic device of the present application. Figure 8 As shown, the present application also discloses an electronic device 10, including a housing 300 and an electrical component 200, wherein the electrical component 200 is disposed in the housing 300, and the electronic device 10 also includes the above-mentioned heat dissipation module 100, wherein the heat dissipation module 100 is installed in the housing 300, and a bracket 110 of the heat dissipation module 100 is connected to the electrical component 200. The housing 300 is used to protect the electrical component 200 and the heat dissipation module 100 from being easily damaged by external forces, and can effectively prevent a large amount of external water vapor or dust from adhering to the electrical component 200 or the heat dissipation module 100, resulting in a decrease in the performance of the heat dissipation module 100 or damage to the electrical component 200.

[0049] It should be noted that the electronic device 10 in the present application is mainly an electronic device 10 with a display function, and a display panel is arranged inside the electronic device 10, such as a computer, a television, etc. The present application does not make any specific restrictions on the type of the electronic device 10.

[0050] Since the electrical components 200 in the electronic device 10 often generate a lot of heat during operation, and a low heat dissipation rate may cause the electrical components 200 to burn out due to continuous high temperature, in order to solve the above problem, the present application designs a heat dissipation module 100 in the electronic device 10:

[0051] By connecting the bracket 110 of the heat dissipation module 100 with the electrical component 200 in the electronic device 10, the heat emitted by the electrical component 200 is directly transferred to the bracket 110, and then the heat of the bracket 110 is transferred to the heat-conducting body 130 through the first heat-conducting pipe 120 connected to the bracket 110. In this way, the heat generated by the electrical component 200 as a heat source can be quickly conducted to a position far away from the heat source, avoiding excessive concentration of heat at the heat source, resulting in the electrical component 200 being overheated and burned; and after the heat is transferred to the heat-conducting body 130, the heat-conducting body 130 is used as the heat conduction hub to transfer the heat to the first heat dissipation module 100, the heat is transferred to the heat-conducting body 13 ... The heat sink 140 and the second heat sink 141 expand the area of ​​heat transfer, and use the first heat sink 140 and the second heat sink 141 to transfer heat to the environment through the air, so that the entire heat is transmitted from the heat source to the heat sink in a "point to surface" manner. While transferring heat from different directions, the heat dissipation area is increased; that is, the heat dissipation module 100 in the present application can achieve heat dissipation by utilizing the structure and material properties of the module itself combined with air flow, without the need to add other heat dissipation equipment. In this way, the heat generated by the electrical component 200 can be stably and quickly conducted to the surrounding environment, thereby improving the cooling efficiency of the electronic device 10.

[0052] Fig. 9 FIG. 1 is a partial schematic diagram of a cover body in a second embodiment of the electronic device of the present application. Fig. 9 As shown, Fig. 9 The illustrated embodiment is based on Figure 8 The electronic device 10 further comprises a cover 400, which covers the heat dissipation module 100 and is connected to the housing 300. The cover 400 is away from the side of the heat dissipation module 100 and is provided with a plurality of ridges 420 corresponding to the positions of the first radiator 140 and the second radiator 141 of the heat dissipation module 100; and heat dissipation holes 410 are provided on the sides of the plurality of ridges 420.

[0053] The present embodiment is different from the previous embodiment in that, in order to ensure that the heat dissipation effect of the heat dissipation module 100 is not affected after the cover 400 is covered on the housing 300, the present embodiment makes improvements to the cover 400 of the electronic device 10. The specific improvements are as follows:

[0054] In this embodiment, a plurality of heat dissipation holes 410 are arranged at positions of the cover body 400 corresponding to the first heat sink 140 and the second heat sink 141 of the heat dissipation module 100, so that when the first heat sink 140 and the second heat sink 141 transfer heat through air, the heat can be directly discharged to the external environment through the heat dissipation holes 410 on the cover body 400. In addition, a plurality of ribs 420 are arranged on the cover body 400 to partially raise the surface of the cover body 400 away from the heat dissipation module 100, and slits are formed between the plurality of ribs 420 arranged at intervals. The air circulation speed in the slits is faster than the air circulation speed at other positions. Therefore, when the air circulates through the slits between the plurality of ribs 420, the heat from the heat dissipation holes 410 will be quickly taken away, thereby effectively improving the heat dissipation rate and avoiding heat accumulation at the heat dissipation holes 410. The temperature at the position of the heat dissipation holes 410 can be effectively lowered to prevent the heat dissipation holes 410 exposed to the outside of the device from being too high and causing burns.

[0055] It should be noted that the inventive concept of the present application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effects will be enhanced.

[0056] The above content is a further detailed description of the present application in combination with specific optional implementation methods, and it cannot be determined that the specific implementation of the present application is limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be deemed to fall within the scope of protection of the present application.

Claims

1. A heat dissipation module, characterized in that: The heat dissipation module comprises: a bracket, a first heat-conducting pipe, a heat-conducting body, a first radiator and a second radiator; the bracket is connected above the electrical component, one end of the first heat-conducting pipe is connected to the bracket, and the other end is connected to the heat-conducting body; The first heat sink and the second heat sink are respectively connected to two sides of the heat-conducting body; the heat-conducting body is made of heat-conducting material.

2. The heat dissipation module according to claim 1, characterized in that: The heat-conducting body is long and strip-shaped, and a plurality of second heat-conducting tubes are arranged at intervals in the extension direction of the heat-conducting body, each of the second heat-conducting tubes passes through the heat-conducting body and is connected to the heat-conducting body; and both ends of each of the second heat-conducting tubes are exposed outside the heat-conducting body and are respectively connected to the first radiator and the second radiator.

3. The heat dissipation module according to claim 2, characterized in that: The first heat sink and the second heat sink each include a plurality of heat sink fins, the plurality of heat sink fins are arranged at intervals and are perpendicular to the second heat pipe; Each of the second heat-conducting pipes passes through the heat-dissipating fins of the first heat sink and the second heat sink, and is connected to the heat-dissipating fins.

4. The heat dissipation module according to claim 1, characterized in that: The heat dissipation module further includes a third heat pipe, a third heat sink and a fourth heat sink, wherein the third heat sink and the fourth heat sink are respectively arranged on both sides of the bracket, and the third heat sink corresponds to the position of the first heat sink; the fourth heat sink corresponds to the position of the second heat sink, and the third heat pipe is simultaneously connected to the bracket, the third heat sink and the fourth heat sink; The third radiator and the fourth radiator each include a plurality of fins arranged at intervals; the plurality of fins are perpendicular to the third heat pipe, and the third heat pipe penetrates the fins of the third radiator and the fourth radiator and is connected to the fins.

5. The heat dissipation module according to claim 4, characterized in that: There is a gap between the first radiator and the third radiator; there is a gap between the second radiator and the fourth radiator; a first heat conducting sheet is connected between the first radiator and the third radiator, and a second heat conducting sheet is connected between the second radiator and the fourth radiator.

6. The heat dissipation module according to claim 5, characterized in that: The heat dissipation module also includes a heat spreader, which is arranged below the first heat sink, the second heat sink and the heat-conducting body, and is connected to the first heat sink, the second heat sink and the heat-conducting body; the area of ​​the heat spreader is greater than or equal to the total area of ​​the first heat sink, the second heat sink and the heat-conducting body.

7. The heat dissipation module according to claim 6, characterized in that: A first support member is arranged between the third radiator and the heat spreader, and a second support member is arranged between the fourth radiator and the heat spreader. Two ends of the first support member are respectively connected to the third radiator and the heat spreader, and the third radiator is lifted to a preset height relative to the heat spreader; two ends of the second support member are respectively connected to the fourth radiator and the heat spreader, and the fourth radiator is lifted to a preset height relative to the heat spreader.

8. The heat dissipation module according to claim 7, characterized in that: The gap between the third heat sink, the first heat sink and the vapor chamber, and the gap between the fourth heat sink, the second heat sink and the vapor chamber jointly form a first heat dissipation channel; The thickness of the heat-conducting body is smaller than the thickness of the first heat sink and the second heat sink, and the gap between the heat-conducting body and the first heat sink and the second heat sink forms a second heat dissipation channel; The first heat dissipation channel is communicated with the second heat dissipation channel.

9. An electronic device, comprising a housing and an electrical component, wherein the electrical component is arranged in the housing, characterized in that: The electronic device further comprises a heat dissipation module as claimed in any one of claims 1 to 8, wherein the heat dissipation module is installed in the housing, and a bracket of the heat dissipation module is connected to the electrical component.

10. The electronic device according to claim 9, characterized in that: The electronic device also includes a cover body, which covers the heat dissipation module and is connected to the shell. The cover body is away from the heat dissipation module and is provided with a plurality of ridges at positions corresponding to the first heat sink and the second heat sink of the heat dissipation module; and the sides of the plurality of ridges are provided with heat dissipation holes.

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