Pulse laser system and pulse laser drilling method

Abstract

The invention discloses a pulse laser system and a pulse laser drilling method. The pulse laser system comprises a transmitting module used for providing a pulse laser beam, the pulse width of the pulse laser beam ranges from 50 fs to 500 fs, the repetition frequency of the pulse laser beam ranges from 0.5 GHz to 10 GHz, and the pulse energy of the pulse laser beam ranges from 100 muJ to 1000 muJ; the light beam adjusting module is used for converting the pulse laser beam into a first modulated laser beam; the optical module is used for converting the first modulated laser beam into a second modulated laser beam; the scanning module is used for selectively projecting a second modulated laser beam in a projection direction; and the focusing module is used for converting the second modulated laser beam into a flat-topped laser beam projected to the workpiece to be drilled. Therefore, the machining efficiency of the composite material can be improved, and meanwhile the damage rate of the composite material is reduced.

Description

Technical Field

[0001] The invention relates to a laser system and a laser drilling method, and in particular to a pulse laser system and a pulse laser drilling method combining pulse laser and flat-top light laser technology. Background Art

[0002] With the advancement of technology, the substrates used in the electronics industry have evolved from single-layer substrates to composite substrates that use a combination of multiple materials. In addition, the substrate hole processing method has also evolved from the existing drilling method to the laser processing method.

[0003] However, when the existing laser processing technology processes composite material substrates (e.g., drilling holes), the processed composite material is prone to delamination at the drilling site; and the heat-affected zone of the processed composite material is large, so it is easy to produce fragments and cracks. In addition, the beam characteristics of the laser beam generated by the existing laser processing technology are pointed and peak-shaped. Therefore, when processing composite materials, it is impossible to accurately and effectively drill holes to the expected depth, or it is easy to drill beyond the expected depth (i.e., the laser beam drills beyond the expected depth).

[0004] Therefore, how to overcome the above-mentioned defects through improvement of structural design has become one of the important issues to be solved in the technical field. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a pulse laser system and a pulse laser drilling method in view of the deficiencies in the prior art.

[0006] In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a pulse laser system, including a transmitting module, a beam adjustment module, an optical module, a scanning module and a focusing module. The transmitting module is used to provide at least one pulse laser beam, wherein the pulse width of the at least one pulse laser beam is between 50 and 500 fs, the repetition frequency of the at least one pulse laser beam is between 0.5 and 10 GHz, and the pulse energy of the at least one pulse laser beam is between 100 and 1000 μJ. The beam adjustment module corresponds to the transmitting module, and the beam adjustment module is configured to receive the at least one pulse laser beam and to convert the at least one pulse laser beam into a first modulated laser beam. The optical module corresponds to the beam adjustment module, and the optical module is configured to receive the first modulated laser beam and to convert the first modulated laser beam into a second modulated laser beam. The scanning module corresponds to the optical module, and the scanning module is configured to receive the second modulated laser beam and to selectively project the second modulated laser beam in at least one projection direction. The focusing module corresponds to the scanning module, and is configured to receive the second modulated laser beam and convert the second modulated laser beam into a flat-top laser beam projected onto a workpiece to be drilled.

[0007] In one feasible or preferred embodiment, the transmitting module includes a pulse laser generating unit, a laser modulation unit and a laser amplifying unit. The pulse laser generating unit is used to generate a laser having multiple pulse signals. The laser modulation unit is adjacent to the pulse laser generating unit, and the laser modulation unit is configured to increase the repetition frequency of the laser, and to generate a pulse train laser having multiple pulse trains based on the increased laser. The laser amplifying unit is adjacent to the laser modulation unit, and the laser amplifying unit is configured to increase the pulse energy of the pulse train laser to generate the pulse laser beam, wherein the multiple pulse trains include the multiple pulse signals, and the frequencies of the multiple pulse signals are between 1 and 2000 KHz.

[0008] In one feasible or preferred embodiment, the pulse laser system further includes an analysis module and a spectroscopic module. The analysis module is connected to the emission module. The spectroscopic module corresponds to the analysis module, and the spectroscopic module is configured to receive the first modulated laser beam, the second modulated laser beam or the flat-top laser beam. Wherein, when the spectroscopic module receives the first modulated laser beam, the spectroscopic module projects a portion of the first modulated laser beam to the optical module, and projects another portion of the first modulated laser beam to the analysis module, so that the analysis module generates a first beam energy analysis signal, and the analysis module transmits the first beam energy analysis signal to the emission module. Wherein, when the spectroscopic module receives the second modulated laser beam, the spectroscopic module projects a portion of the second modulated laser beam to the scanning module, and projects another portion of the second modulated laser beam to the analysis module, so that the analysis module generates a second beam energy analysis signal, and the analysis module transmits the second beam energy analysis signal to the emission module. When the light splitting module receives the flat-top laser beam, the light splitting module projects a portion of the flat-top laser beam to the workpiece to be drilled, and projects another portion of the flat-top laser beam to the analysis module, so that the analysis module generates a third beam energy analysis signal, and the analysis module transmits the third beam energy analysis signal to the transmitting module. The first beam energy analysis signal, the second beam energy analysis signal, and the third beam energy analysis signal include at least one of a spot shape, a spot position, and a beam energy.

[0009] In one feasible or preferred embodiment, the pulse laser system further comprises a carrier module, corresponding to the focusing module, and the carrier module is configured to carry the workpiece to be drilled. The emission module, the beam adjustment module, the optical module, the scanning module and the focusing module are arranged in the same optical path. The focusing module focuses the second modulated laser beam into the flat-top laser beam with a predetermined high diameter-to-depth ratio, and projects the flat-top laser beam to the workpiece to be drilled.

[0010] In one feasible or preferred embodiment, the flat-top laser beam is projected to at least one drilling hole of the workpiece to be drilled at an offset speed, the carrier module is offset at the offset speed, the at least one drilling hole includes at least one drilling hole, the at least one drilling hole is a cylindrical hole, the at least one drilling hole has a fixed hole diameter, the inner wall of the at least one drilling hole is a smooth wall, the depth of the at least one drilling hole is determined according to the number of pulse trains and the energy density, the hole diameter is between 20 and 40 μm, the depth of the at least one drilling hole is between 70 and 295 μm, and the inner wall smoothness of the at least one drilling hole is between 100 and 5000 nm. Wherein, the offset speed of the flat-top laser beam is determined according to the repetition frequency, and the average power of the pulsed laser beam is determined according to the pulse energy and the repetition frequency.

[0011] In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a pulse laser drilling method, which includes the following steps:

[0012] At least one pulsed laser beam is provided through an emission module, wherein a pulse width of the at least one pulsed laser beam is between 50 and 500 fs, a repetition frequency of the at least one pulsed laser beam is between 0.5 and 10 GHz, and a pulse energy of the at least one pulsed laser beam is between 100 and 1000 μJ; the at least one pulsed laser beam is received by a beam adjustment module and converted into a first modulated laser beam; the first modulated laser beam is received by an optical module and converted into a second modulated laser beam; the second modulated laser beam is received by a scanning module and selectively projects the second modulated laser beam in at least one projection direction; and the second modulated laser beam is received by a focusing module and converted into a flat-top laser beam projected onto a workpiece to be drilled.

[0013] In one feasible or preferred embodiment, the step of providing the at least one pulsed laser beam further includes the following steps:

[0014] A laser having a plurality of pulse signals is generated by a pulse laser generating unit; a laser modulation unit is used to increase the repetition frequency of the laser, and a pulse train laser having a plurality of pulse trains is generated based on the increased laser; and a laser amplification unit is used to increase the pulse energy of the pulse train laser to generate at least one pulse laser beam, wherein the plurality of pulse trains include the plurality of pulse signals, and the frequencies of the plurality of pulse signals are between 1 and 2000 KHz.

[0015] In one feasible or preferred embodiment, after the step of generating the first modulated laser beam, the following steps are also included:

[0016] The first modulated laser beam is received by a beam splitter module, and a portion of the first modulated laser beam is projected to the optical module, and another portion of the first modulated laser beam is projected to the analysis module; and the analysis module is used to receive the other portion of the at least one pulsed laser beam, and a first beam energy analysis signal is generated accordingly, and the first beam energy analysis signal is transmitted to the transmitting module;

[0017] Alternatively, after the step of generating the second modulated laser beam, the method further comprises the following steps:

[0018] The second modulated laser beam is received by a beam splitter module, and a portion of the second modulated laser beam is projected to the scanning module, and another portion of the second modulated laser beam is projected to the analysis module; and the analysis module is used to receive the other portion of the at least one pulsed laser beam, and a second beam energy analysis signal is generated accordingly, and the second beam energy analysis signal is transmitted to the transmitting module;

[0019] Alternatively, after the step of generating the flat-top laser beam, the method further comprises the following steps:

[0020] The flat-top laser beam is received by the light splitting module, and a part of the flat-top laser beam is projected to the workpiece to be drilled, and another part of the flat-top laser beam is projected to the analysis module; and the analysis module is used to receive the other part of the flat-top laser beam, and a third beam energy analysis signal is generated accordingly, and the third beam energy analysis signal is transmitted to the transmitting module;

[0021] The first beam energy analysis signal, the second beam energy analysis signal and the third beam energy analysis signal include at least one of a light spot shape, a light spot position and a beam energy.

[0022] In one feasible or preferred embodiment, before the step of providing at least one pulsed laser beam, the following steps are also included:

[0023] Carrying the workpiece to be drilled by a carrier module;

[0024] The transmitting module, the beam adjusting module, the optical module, the scanning module and the focusing module are arranged in the same optical path. The focusing module focuses the second modulated laser beam into the flat-top laser beam with a predetermined high diameter-to-depth ratio, and projects the flat-top laser beam onto the workpiece to be drilled.

[0025] In one feasible or preferred embodiment, the flat-top laser beam is projected to at least one drilling hole of the workpiece to be drilled at an offset speed, the carrier module is offset at the offset speed, the at least one drilling hole includes at least one drilling hole, the at least one drilling hole is a cylindrical hole, the at least one drilling hole has a fixed hole diameter, the inner wall of the at least one drilling hole is a smooth wall, the depth of the at least one drilling hole is determined according to the number of pulse trains and the energy density, the hole diameter is between 20 and 40 μm, the depth of the at least one drilling hole is between 70 and 295 μm, and the inner wall smoothness of the at least one drilling hole is between 100 and 5000 nm. Wherein, the offset speed of the flat-top laser beam is determined according to the repetition frequency, and the average power of the pulsed laser beam is determined according to the pulse energy and the repetition frequency.

[0026] One of the beneficial effects of the present invention is that the pulse laser system provided by the present invention can be used to provide at least one pulse laser beam through a "transmitting module, wherein the pulse width of the at least one pulse laser beam is between 50 and 500 fs, the repetition frequency of the at least one pulse laser beam is between 0.5 and 10 GHz, and the pulse energy of the at least one pulse laser beam is between 100 and 1000 μJ. The beam adjustment module corresponds to the transmitting module, and the beam adjustment module is configured to receive the at least one pulse laser beam and convert the at least one pulse laser beam into a first modulated laser beam. The optical module corresponds to the A beam adjustment module, the optical module is configured to receive the first modulated laser beam and to convert the first modulated laser beam into a second modulated laser beam. A scanning module corresponds to the optical module, the scanning module is configured to receive the second modulated laser beam and to selectively project the second modulated laser beam in at least one projection direction. A focusing module corresponds to the scanning module, the focusing module is configured to receive the second modulated laser beam and to convert the second modulated laser beam into a flat-top laser beam projected onto a workpiece to be drilled. The technical solution is used to improve the processing efficiency of composite materials while reducing the damage rate of composite materials.

[0027] Another beneficial effect of the present invention is that the pulse laser drilling method provided by the present invention can improve the processing efficiency of composite materials and reduce the damage rate of composite materials by the technical solution of "providing at least one pulse laser beam through a transmitting module, wherein the pulse width of the at least one pulse laser beam is between 50 and 500 fs, the repetition frequency of the at least one pulse laser beam is between 0.5 and 10 GHz, and the pulse energy of the at least one pulse laser beam is between 100 and 1000 μJ; receiving the at least one pulse laser beam by a beam adjustment module and converting the at least one pulse laser beam into a first modulated laser beam; receiving the first modulated laser beam by an optical module and converting the first modulated laser beam into a second modulated laser beam; receiving the second modulated laser beam by a scanning module and selectively projecting the second modulated laser beam in at least one projection direction; and receiving the second modulated laser beam by a focusing module and converting the second modulated laser beam into a flat-top laser beam projected onto a workpiece to be drilled".

[0028] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 FIG. 4 is a flow chart of a pulse laser drilling method according to a first embodiment of the present invention.

[0030] Figure 2 FIG. 4 is a schematic diagram of the system architecture of a pulse laser system according to a first embodiment of the present invention.

[0031] Figure 3 FIG. 1 is a schematic diagram of the architecture of a transmitting module of a pulse laser system according to a first embodiment of the present invention.

[0032] Figure 4 FIG. 1 is a schematic diagram of a plurality of pulse trains of a pulse laser beam of a transmitting module of a pulse laser system according to a first embodiment of the present invention.

[0033] Figure 5 FIG. 4 is a schematic diagram of processing a pulsed laser beam of a pulsed laser system according to the first embodiment of the present invention.

[0034] Figure 6 FIG. 4 is a flow chart of a pulse laser drilling method according to a second embodiment of the present invention.

[0035] Figure 7 FIG. 4 is a schematic diagram of a first system architecture of a pulsed laser system according to a second embodiment of the present invention.

[0036] Figure 8FIG. 4 is a schematic diagram of a second system architecture of a pulsed laser system according to a second embodiment of the present invention.

[0037] Fig. 9 FIG. 4 is a processing schematic diagram of a pulse laser system according to a third embodiment of the present invention.

[0038] Description of Reference Numerals

[0039] Z: pulse laser system; 1: emission module; 10: pulse laser generating unit; 11: laser modulation unit; 12: laser amplifying unit; 2: beam adjustment module; 3: optical module; 4: scanning module; 40: first beam scanning unit; 41: second beam scanning unit; 5: focusing module; 6: analysis module; 7: spectroscopic module; 8: carrier module; 9: blowing and suction module; 90: control element; 91: gas supply element; 92: gas recovery element; 93: collection element; 94: blowing element; 95: suction element; B: workpiece to be drilled; B1: drilling location; B10: drilling hole; B10a: inner wall; B11: surface; L: pulse laser beam; L01: laser; L02: pulse train laser; L1: first modulated laser beam; L2: second modulated laser beam; LT: flat-top laser beam; P1~Pn: pulse train; S1-Sn: pulse signal. DETAILED DESCRIPTION

[0040] The following is an explanation of the implementation methods of the "pulse laser system and pulse laser drilling method" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0041] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0042] First embodiment

[0043] See also Figures 1 to 5, which are respectively a flow chart of the pulse laser drilling method of the first embodiment of the present invention, a system architecture chart of the pulse laser system, an architecture chart of the transmitting module of the pulse laser system, a chart of multiple pulse trains of the pulse laser beam of the transmitting module of the pulse laser system, and a processing chart of the pulse laser beam of the pulse laser system. As shown in the above figures, the first embodiment of the present invention provides a pulse laser drilling method, which can be applied to the pulse laser system Z of the present invention; wherein the pulse laser system Z may include a transmitting module 1, a beam adjustment module 2, an optical module 3, a scanning module 4 and a focusing module 5. The pulse laser drilling method of the present invention may include at least the following steps:

[0044] First, at least one pulsed laser beam L may be provided by the transmitting module 1 (step S102). Figure 1 and Figure 2 As shown, the transmitting module 1 may be a laser device for providing at least one pulsed laser beam L. The pulse width of the pulsed laser beam L may be between 50 and 500 fs, the repetition frequency of the pulsed laser beam L may be between 0.5 and 10 GHz (for example, any positive integer between 0.5 and 10 GHz), and the pulse energy of the pulsed laser beam L may be between 100 and 1000 μJ (for example, any positive integer between 10 and 30 mJ), but is not limited thereto.

[0045] Furthermore, in the step S102 of providing at least one pulsed laser beam L, the following steps are also included:

[0046] A laser L01 having a plurality of pulse signals may be generated by the pulse laser generating unit 10 (step S1020 ).

[0047] Next, the laser modulation unit 11 may be used to increase the repetition frequency of the laser light L01, and a pulse train laser light L02 having a plurality of pulse trains may be generated according to the increased laser light L01 (step S1021); and

[0048] Next, the pulse energy of the pulse train laser L02 may be increased by the laser amplification unit 12 to generate at least one pulse laser beam L (step S1022 ).

[0049] For example, with Figures 1 to 4As shown, the transmitting module 1 may include a pulse laser generating unit 10, a laser modulation unit 11 and a laser amplifying unit 12. The pulse laser generating unit 10 may be configured to generate a laser L01 having a plurality of pulse signals S1 to Sn; wherein the pulse laser generating unit 10 may be a pulse laser generator. The laser modulation unit 11 may be adjacent to the pulse laser generating unit 10, and the laser modulation unit 11 is configured to increase the repetition frequency of the laser L01, and to generate a pulse train laser L02 having a plurality of bursts according to the increased laser L01; wherein the laser modulation unit 11 may be an acousto-optic modulator (AOM) or other similar devices, and the repetition frequency of the pulse train laser L02 may be between 0.5 and 10 GHz (for example, any positive integer between 0.5 and 10 GHz), but is not limited thereto. The laser amplifying unit 12 may be adjacent to the laser modulation unit 11, and the laser amplifying unit 12 is configured to increase the pulse energy of the pulse train laser L02 to generate a pulse laser beam L. The plurality of pulse trains include a plurality of pulse signals S1 -Sn, and the frequencies of the plurality of pulse signals S1 -Sn may be between 1 and 2000 KHz.

[0050] Furthermore, with Figures 1 to 4 As shown, the multiple pulse trains P1-Pn include multiple pulse signals S1-Sn; that is, multiple pulse signals S1 form pulse train P1, multiple pulse signals S2 form pulse train P2, ..., multiple pulse signals Sn form pulse train Pn, so that multiple pulse trains B1-Bn respectively form multiple pulse signals S1-Sn. Wherein, the pulse width of the multiple pulse signals S1-Sn is between 50 and 500 fs (for example, any positive integer between 50 and 500 fs), the number of the multiple pulse signals S1-Sn is between 50 and 1000 (for example, any positive integer between 50 and 1000), and the frequency of the multiple pulse signals S1-Sn is between 1 and 2000 KHz (for example, any positive integer between 1 and 2000 KHz), but not limited thereto.

[0051] Therefore, the pulsed laser beam L can be adjusted through the transmitting module 1, and the pulse width of the pulsed laser beam L (i.e., the pulse width of the multiple pulse signals S1~Sn) can be between 50~500fs, the repetition frequency of the pulsed laser beam L (i.e., the repetition frequency of the pulse train laser L02) can be between 0.5~10GHz, and the average power of the pulsed laser beam L can be determined according to the pulse energy and the repetition frequency, but is not limited thereto. It is worth noting that the pulse width of the pulsed laser beam L, the pulse energy of the pulsed laser beam L, the frequency of the multiple pulse signals S1~Sn, the repetition frequency of the pulsed laser beam L, and the number of the multiple pulse signals S1~Sn can be appropriately adjusted according to actual needs. For example, if the pulse energy of the pulsed laser beam L used in drilling or welding composite materials is higher, the repetition frequency of the pulsed laser beam L can be adjusted to a lower frequency. In addition, it is worth noting that if the pulse width of the pulse laser beam L, the pulse energy of the pulse laser beam L, the frequency of the multiple pulse signals S1-Sn, the repetition frequency of the pulse laser beam L, and the number of the multiple pulse signals S1-Sn used in drilling or welding the composite material are lower than the above-mentioned predetermined range, the laser beam is difficult to drill or weld the composite material; and if the pulse width of the pulse laser beam L, the pulse energy of the pulse laser beam L, the frequency of the multiple pulse signals S1-Sn, the repetition frequency of the pulse laser beam L, and the number of the multiple pulse signals S1-Sn used in drilling or welding the composite material exceed the above-mentioned predetermined range, cracks are easily generated at the drilling of the composite material; for example, if the pulse width of the pulse laser beam L used in drilling or welding the composite material is 600fs, cracks are easily generated at the drilling of the composite material. However, the above-mentioned example is only one feasible embodiment and is not intended to limit the present invention.

[0052] Next, the beam adjustment module 2 may be used to receive at least one pulsed laser beam L and convert the at least one pulsed laser beam L into a first modulated laser beam L1 (step S104). Figure 1 and Figure 2 As shown, the beam adjustment module 2 may correspond to the transmitting module 1, and the beam adjustment module 2 is configured to receive at least one pulsed laser beam L, and to convert at least one pulsed laser beam L into a first modulated laser beam L1. The beam adjustment module 2 may be a laser beam expansion device, and the beam adjustment module 2 may expand the laser spot of the pulsed laser beam L to generate the first modulated laser beam L1.

[0053] Next, the first modulated laser beam L1 may be received by the optical module 3 and converted into a second modulated laser beam L2 (step S106). Figure 1 and Figure 2As shown, the optical module 3 may correspond to the beam adjustment module 2, and the optical module 3 is configured to receive the first modulated laser beam L1, and to convert the first modulated laser beam L1 into the second modulated laser beam L2. The optical module 3 may be a diffractive optical element (DOE) or a top-hat beam shaper (Top-Hat beam shaper DOE), and the optical module 3 may be a lens or a long tube lens group. The optical module 3 may convert the laser spot of the first modulated laser beam L1 into a spot of a specific pattern (such as a circle, square or other geometric shape), and may convert the first modulated laser beam L1 into a top-hat light, thereby forming the second modulated laser beam L2.

[0054] Next, the scanning module 4 may be used to receive the second modulated laser beam L2 and selectively project the second modulated laser beam L2 in at least one projection direction (step S108). Figure 1 and Figure 2 As shown, the scanning module 4 may correspond to the optical module 3, and the scanning module 4 is configured to receive the second modulated laser beam L2, and to selectively project the second modulated laser beam L2 in at least one projection direction. The scanning module 4 may be a laser scanning galvanometer or other types of galvanometer modules. Further, the scanning module 4 may include a first beam scanning unit 40 and a second beam scanning unit 41. The first beam scanning unit 40 may correspond to the optical module 3 and the second beam scanning unit 41, and is located between the optical module 3 and the second beam scanning unit 41, and the second beam scanning unit 41 may correspond to the first beam scanning unit 40 and the scanning module 4, and is located between the first beam scanning unit 40 and the scanning module 4, but is not limited thereto. The first beam scanning unit 40 may be a galvanometer that can adjust the displacement of the second modulated laser beam L2 in a first axial direction (e.g., the direction of the X-axis or the Y-axis); for example, the first beam scanning unit 40 may reflect the second modulated laser beam L2 according to a plurality of rotation angles in the X-axis direction (e.g., 0°, 30°, 60°, etc.), that is, the first beam scanning unit 40 generates at least one rotation angle in the X-axis direction through rotational motion, and reflects the second modulated laser beam L2 with mirrors at different angles. In contrast, the second beam scanning unit 41 may be a galvanometer that can adjust the displacement of the second modulated laser beam L2 in a second axial direction (e.g., the direction of the X-axis or the Y-axis); that is, the second beam scanning unit 41 may also generate a plurality of rotation angles in the Y-axis direction through rotational motion, and reflect the second modulated laser beam L2 with mirrors at different angles. The first axial direction is different from the second axial direction, and the first axial direction and the second axial direction are preferably perpendicular to each other.

[0055] Next, the second modulated laser beam L2 can be received by the focusing module 5 and converted into a flat-top laser beam LT projected onto the workpiece B to be drilled (step S110). Figure 1 and Figure 2 As shown, the focusing module 5 corresponds to the scanning module 4, and the focusing module 5 is configured to receive the second modulated laser beam L2, and to convert the second modulated laser beam L2 into a flat-top laser beam LT, and project the flat-top laser beam LT to the workpiece to be drilled B. The focusing module 5 may be a flat-field focusing lens (F-Theta Lens), and the focusing module 5 may focus the second modulated laser beam L2 into a flat-top laser beam LT with a predetermined high diameter-to-depth ratio, and then project the flat-top laser beam LT to the workpiece to be drilled B. The transmitting module 1, the beam adjustment module 2, the optical module 3, the scanning module 4, and the focusing module 5 may be arranged in the same optical path.

[0056] Therefore, with Figure 2 , Figure 4 and Figure 5 As shown, when the focusing module 5 projects the flat-top laser beam LT onto one of the drilling holes B1 on the workpiece B to be drilled, when the flat-top laser beam LT contacts the surface B11 of the drilling hole B1, the surface B11 is melted (ablation) by the flat-top laser beam LT; then, when the flat-top laser beam LT completely melts the surface B11, the flat-top laser beam LT is incident on the inner wall B10a of the drilling hole B1 of the workpiece B to be drilled and smoothes it. Next, according to multiple laser parameters of the flat-top laser beam LT, a portion of the composite material of the workpiece B to be drilled is effectively removed, thereby generating a drilling hole B10 at the drilling hole B1. The drilled hole B10 at the drilling location B1 may be a cylindrical hole, the drilled hole B10 may have a fixed hole diameter, the inner wall B10a of the drilled hole B10 may be a smooth wall, the depth of the drilled hole B10 may be determined according to the number of pulse trains and the energy density, and the depth of the drilled hole B10 varies linearly; wherein, the hole diameter of the drilled hole B10 may be between 20 and 40 μm, the depth of the drilled hole B10 may be between 70 and 295 μm, and the inner wall smoothness (Rz) of the drilled hole B10 is between 100 and 5000 nm (ten-point average roughness Rz), but is not limited thereto.

[0057] The way in which the flat-top laser beam LT melts from the surface B11 to the inner wall B10a is called a preheating phenomenon, and the multiple laser parameters include the pulse width of the pulse laser beam L, the pulse energy of the pulse laser beam L, the number of multiple pulse signals S1 to Sn of the multiple pulse trains B1-Bn of the pulse laser beam L, the repetition frequency of the pulse laser beam L, and the frequency of the multiple pulse signals S1 to Sn. In addition, in the process of the flat-top laser beam LT melting the inner wall B10a, the flat-top laser beam LT is reflected and scattered multiple times at the inner wall B10a under grazing incidence, and the flat-top laser beam LT loses part of its energy at each reflection, causing the energy of the drilling to decrease as the drilling depth increases, and eventually the drilling depth reaches saturation. In addition, through the flat-top beam characteristics of the flat-top laser beam LT, when drilling the workpiece B to be drilled, it is possible to accurately and effectively drill to the expected depth (i.e., remove the target area or range) without damaging the bottom layer or exceeding the expected depth.

[0058] Specifically, when the bottom influence of the flat-top laser beam LT is lower than the ablation threshold, the inner wall B10a is stopped from being melted. The bottom influence may be the energy density of the laser beam melting the composite material. The energy density refers to the amount of joules per square unit (J / cm 2 ), the melting threshold can be adjusted according to the pulse width of the pulse laser beam L, the pulse energy of the pulse laser beam L, the number of multiple pulse signals S1~Sn of the multiple pulse trains B1-Bn of the pulse laser beam L, the repetition frequency of the pulse laser beam L and the frequency of the multiple pulse signals S1~Sn, but is not limited to this.

[0059] Furthermore, the drilled hole B1 of the workpiece B to be drilled after processing does not have delamination, and maintains a small heat affected zone (HAZ), so the workpiece B to be drilled after processing and its surface B11 are not damaged, and the electrical performance is measured to be normal. In addition, since the HAZ of the workpiece B to be drilled after processing is small, any debris and cracks can be avoided at the drilled hole B1 of the workpiece B to be drilled after processing.

[0060] Therefore, the pulse laser system Z and the pulse laser drilling method of the present invention can be optimized for selective removal of composite materials by utilizing the flat-top beam characteristics of the flat-top laser beam LT through the above-mentioned technical solution, effectively removing the composite materials cleanly without damaging the bottom layer. In addition, the pulse laser system Z and the pulse laser drilling method of the present invention can be used to drill or weld one or more holes B1 of the workpiece B to be drilled by using a pulse laser beam L with a pulse width of GHz pulse train (burst) between 50 and 500 fs, so as to avoid delamination at one or more holes B1 of the workpiece B to be drilled after processing, and maintain a small HAZ, thereby avoiding any debris and cracks at the holes B1 of the workpiece B to be drilled.

[0061] Furthermore, the pulse laser drilling method of the present invention may further include the following steps after step S104 of generating the first modulated laser beam L1:

[0062] Receive the first modulated laser beam L1 through the light splitting module 7, project a portion of the first modulated laser beam L1 to the optical module 3, and project another portion of the first modulated laser beam L1 to the analysis module 6 (step S1050); and

[0063] The analysis module 6 is utilized to receive another portion of the at least one pulsed laser beam L, and accordingly generates a first beam energy analysis signal, and transmits the first beam energy analysis signal to the transmitting module 1 (step S1051 ).

[0064] For example, with Figure 1 and Figure 2As shown, the pulse laser system Z of the present invention may also include an analysis module 6 and a spectroscopic module 7. The analysis module 6 is connected to the transmitting module 1. The spectroscopic module 7 corresponds to the analysis module 6, and the spectroscopic module 7 is configured to receive the first modulated laser beam L1, the second modulated laser beam L2 or the flat-top laser beam LT. The spectroscopic module 7 may be a cube spectroscope, a flat spectroscope, a polarization spectroscope, or other types of spectroscopic optical components; and the spectroscopic module 7 may be disposed between the beam adjustment module 2 and the optical module 3. Therefore, when the spectroscopic module 7 receives the first modulated laser beam L1, the spectroscopic module 7 projects a portion of the first modulated laser beam L1 to the optical module 3, and projects another portion of the first modulated laser beam L1 to the analysis module 6, so that the analysis module 6 generates a first beam energy analysis signal accordingly; wherein the first beam energy analysis signal may include at least one of the spot shape of the pulsed laser beam L, the spot position of the pulsed laser beam L, and the beam energy of the pulsed laser beam L. Furthermore, the analysis module 6 may transmit the first beam energy analysis signal to the emission module 1, and the emission module 1 may selectively adjust at least one of the spot shape, spot position and beam energy of the pulsed laser beam L according to information of the first beam energy analysis signal.

[0065] Furthermore, the pulse laser drilling method of the present invention may further include the following steps before the step S102 of providing at least one pulse laser beam L:

[0066] The workpiece B to be drilled is carried by the carrier module 8 (step S100). Figure 1 and Figure 2 As shown, the pulse laser system Z of the present invention may further include a carrier module 8, which corresponds to the focusing module 5, and the carrier module 8 is configured to carry at least one workpiece B to be drilled, and can selectively drive the workpiece B to be drilled to move. The thickness of the workpiece B to be drilled may be 50 to 1000 μm, and the workpiece B to be drilled may include at least two substrates to be drilled, and each substrate may be glass, metal, ceramic or semiconductor wafer, but is not limited thereto.

[0067] In addition, the pulse laser system Z of the present invention can also form one or more drilling holes B10 at one or more drilling locations B1 of the workpiece B to be drilled. Figure 2As shown, the projection path of the flat-top laser beam LT can be adjusted by the first beam scanning unit 40, the second beam scanning unit 41 or both of the scanning module 4, so that the flat-top laser beam LT projected to one or more drilling holes B1 of the workpiece B to be drilled is offset at an offset speed; that is, the flat-top laser beam LT is projected to one or more drilling holes B1 of the workpiece B to be drilled at an offset speed. In one feasible or preferred embodiment, the workpiece B to be drilled can also be driven to move by the carrier module 8 (for example, the carrier module 8 can move along the X-axis or Y-axis direction on a horizontal plane), so that one or more drilling holes B1 of the workpiece B to be drilled are offset at an offset speed; that is, the carrier module 8 is offset in parallel at an offset speed, and drives one or more drilling holes B1 of the workpiece B to be drilled to be offset at an offset speed. The offset speed of the flat-top laser beam LT can be determined according to the repetition frequency of the pulsed laser beam L, but is not limited thereto.

[0068] According to the above content, the first embodiment of the present invention further proposes a pulse laser system Z, which may include a transmitting module 1, a beam adjustment module 2, an optical module 3, a scanning module 4 and a focusing module 5. The transmitting module 1 is used to provide at least one pulse laser beam L, wherein the pulse width of at least one pulse laser beam L may be between 50 and 500 fs, the repetition frequency of at least one pulse laser beam L may be between 0.5 and 10 GHz, and the pulse energy of at least one pulse laser beam L may be between 100 and 1000 μJ. The beam adjustment module 2 corresponds to the transmitting module 1, and the beam adjustment module 2 is configured to receive at least one pulse laser beam L and to convert at least one pulse laser beam L into a first modulated laser beam L1. The optical module 3 corresponds to the beam adjustment module 2, and the optical module 3 is configured to receive the first modulated laser beam L1 and to convert the first modulated laser beam L1 into a second modulated laser beam L2. The scanning module 4 corresponds to the optical module 3, and the scanning module 4 is configured to receive the second modulated laser beam L2 and to selectively project the second modulated laser beam L2 in at least one projection direction. The focusing module 5 corresponds to the scanning module 4 , and is configured to receive the second modulated laser beam L2 , and to convert the second modulated laser beam L2 into a flat-top laser beam LT projected onto the workpiece B to be drilled.

[0069] Second embodiment

[0070] See also Figures 6 to 8 , which are respectively a flow chart of the pulsed laser drilling method according to the second embodiment of the present invention, a system architecture chart of the first pulsed laser system, and a system architecture chart of the second pulsed laser system, and please refer to Figures 1 to 5As shown in the above figures, the pulse laser system Z and the pulse laser drilling method of this embodiment are substantially similar to the pulse laser system Z and the pulse laser drilling method of the above embodiment, so the configuration or operation of the same components will not be repeated here. The difference between this embodiment and the above embodiment is that, in this embodiment, after the step S108 of generating the second modulated laser beam L2, the pulse laser drilling method of the present invention may further include the following steps:

[0071] Receive the second modulated laser beam L2 through the light splitting module 7, project a portion of the second modulated laser beam L2 to the scanning module 4, and project another portion of the second modulated laser beam L2 to the analysis module 6 (step S1090); and

[0072] The analysis module 6 is utilized to receive another portion of the at least one pulsed laser beam L, and accordingly generates a second beam energy analysis signal, and transmits the second beam energy analysis signal to the transmitting module 1 (step S1091 ).

[0073] For example, with Figure 6 and Figure 7 As shown, the difference between the pulse laser system Z and the pulse laser drilling method of the present embodiment and the pulse laser system Z and the pulse laser drilling method of the above-mentioned embodiment is that the spectroscopic module 7 of the present embodiment can be disposed between the optical module 3 and the scanning module 4. Therefore, when the spectroscopic module 7 receives the second modulated laser beam L2, the spectroscopic module 7 can project a portion of the second modulated laser beam L2 to the scanning module 4, and project another portion of the second modulated laser beam L2 to the analysis module 6, so that the analysis module 6 generates a second beam energy analysis signal accordingly; wherein the second beam energy analysis signal may include at least one of the spot shape of the pulsed laser beam L, the spot position of the pulsed laser beam L, and the beam energy of the pulsed laser beam L. Furthermore, the analysis module 6 can transmit the first beam energy analysis signal to the transmitting module 1, and the transmitting module 1 can selectively adjust at least one of the spot shape, the spot position, and the beam energy of the pulsed laser beam L according to the information of the first beam energy analysis signal.

[0074] In addition, in other feasible or preferred embodiments, the pulse laser drilling method of the present invention may also include the following steps after the step S110 of generating the flat-top laser beam LT:

[0075] The flat-top laser beam LT is received by the light splitting module 7, and a part of the flat-top laser beam LT is projected to the workpiece B to be drilled, and another part of the flat-top laser beam LT is projected to the analysis module 6 (step S1110); and

[0076] The analysis module 6 is utilized to receive another portion of the flat-top laser beam LT, and accordingly generates a third beam energy analysis signal, and transmits the third beam energy analysis signal to the transmitting module 1 (step S1111 ).

[0077] For example, with Figure 6 and Figure 8 As shown, the spectroscopic module 7 of the pulse laser system Z of the present invention can also be disposed between the focusing module 5 and the carrier module 8 (or the workpiece B to be drilled). Therefore, when the spectroscopic module 7 receives the flat-top laser beam LT, the spectroscopic module 7 can project a portion of the flat-top laser beam LT to the carrier module 8 or the workpiece B to be drilled, and project another portion of the flat-top laser beam LT to the analysis module 6, so that the analysis module 6 generates a third beam energy analysis signal accordingly; wherein the third beam energy analysis signal can include at least one of the spot shape of the pulsed laser beam L, the spot position of the pulsed laser beam L, and the beam energy of the pulsed laser beam L.

[0078] It is worth mentioning that the pulse laser system Z of the present invention can be provided with one or more groups of laser analysis devices (ie, analysis module 6 and spectrometer module 7) according to the above embodiments.

[0079] Third embodiment

[0080] See also Fig. 9 , which is a processing schematic diagram of a pulse laser system according to a third embodiment of the present invention, and please refer to Figures 1 to 8 As shown in the above figures, the pulse laser system Z and the pulse laser drilling method of this embodiment are substantially similar to the pulse laser system Z and the pulse laser drilling method of the above embodiments, so the arrangement or operation of the same components will not be repeated here. The difference between this embodiment and the above embodiments is that, in this embodiment, the pulse laser drilling method of the present invention may further include the following steps:

[0081] The air blowing and suction module 9 performs air blowing and suction actions toward the workpiece B to be drilled.

[0082] For example, with Fig. 9As shown, the pulse laser system Z of the present invention may also include an air blowing and suction module 9, which can be used to blow air toward the workpiece B to be drilled and to suck air toward the workpiece B to be drilled. Further, the air blowing and suction module 9 may include a control unit 90, at least one air supply unit 91, at least one gas recovery unit 92, at least one collection unit 93, at least one air blowing unit 94, and at least one air suction unit 95. The control unit 90 may be electrically connected to the air supply unit 91 and the gas recovery unit 92, and the control unit 90 may be a processor, or a module or component with a control function. The air supply unit 91 may be a gas supply device, the gas recovery unit 92 may be an air suction pump or other types of air suction devices, the collection unit 93 may be a dust collection device or a filter component, and the air blowing unit 94 and the air suction unit 95 may be any type of gas transmission device; wherein, the air supply unit 91 and the gas recovery unit 92 may be electrically connected to the control unit 90. The air supply unit 91 is connected to the air blowing unit 94, and the number of the air supply units 91 may be greater than or equal to the number of the air blowing units 94. The collecting unit 93 is connected to the gas recovery unit 92 and the suction unit 95; wherein the number of the collecting units 93 is greater than or equal to the number of the gas recovery units 92 and the number of the suction units 95, or the number of the gas recovery units 92 is greater than or equal to the number of the collecting units 93 and the number of the suction units 95. The blowing unit 94 and the suction unit 95 may correspond to the workpiece B to be drilled, and the lengths of the blowing unit 94 and the suction unit 95 are greater than the longest length and the longest diameter of the workpiece B to be drilled; wherein the blowing unit 94 can be detachably connected to the suction unit 95, or the blowing unit 94 and the suction unit 95 are separated from each other and arranged opposite to each other. In addition, the blowing and suction module 9 can be moved by being driven by an independent driving module (not shown in the figure).

[0083] Therefore, with Fig. 9 As shown, when the focusing module 5 projects the flat-top laser beam LT onto the workpiece B to be drilled for drilling, the air supply unit 91 can perform a blowing action through the blowing unit 94 toward the position where the flat-top laser beam LT is projected onto the workpiece B to be drilled, so as to blow up the material chips or foreign matter generated when the flat-top laser beam LT is drilled; at the same time, the gas recovery unit 92 can perform a suction action toward the position where the flat-top laser beam LT is projected onto the workpiece B to be drilled, so as to recover the material chips or foreign matter. Moreover, after the material chips or foreign matter enter the suction unit 95, before reaching the gas recovery unit 92, they will be filtered and collected by the collection unit 93.

[0084] However, the examples given in the above embodiments are only feasible embodiments and are not intended to limit the present invention.

[0085] Advantageous Effects of Embodiments

[0086] One of the beneficial effects of the present invention is that the pulse laser system Z provided by the present invention can be used to provide at least one pulse laser beam L through the "transmitting module 1, wherein the pulse width of the at least one pulse laser beam L is between 50 and 500 fs, the repetition frequency of the at least one pulse laser beam L is between 0.5 and 10 GHz, and the pulse energy of the at least one pulse laser beam L is between 100 and 1000 μJ. The beam adjustment module 2 corresponds to the transmitting module 1, and the beam adjustment module 2 is configured to receive the at least one pulse laser beam L and to convert the at least one pulse laser beam L into a first modulated laser beam L1. The optical module 3 corresponds to the beam The adjustment module 2 and the optical module 3 are configured to receive the first modulated laser beam L1 and to convert the first modulated laser beam L1 into a second modulated laser beam L2. The scanning module 4 corresponds to the optical module 3, and the scanning module 4 is configured to receive the second modulated laser beam L2 and to selectively project the second modulated laser beam L2 in at least one projection direction. The focusing module 5 corresponds to the scanning module 4, and the focusing module 5 is configured to receive the second modulated laser beam L2 and to convert the second modulated laser beam L2 into a flat-top laser beam LT projected onto the workpiece B to be drilled. The technical solution is to improve the processing efficiency of composite materials while reducing the damage rate of composite materials.

[0087] Another beneficial effect of the present invention is that the pulse laser drilling method provided by the present invention can improve the processing efficiency of composite materials and reduce the damage rate of composite materials by the technical solution of "providing at least one pulse laser beam L through the transmitting module 1, wherein the pulse width of at least one pulse laser beam L is between 50 and 500 fs, the repetition frequency of at least one pulse laser beam L is between 0.5 and 10 GHz, and the pulse energy of at least one pulse laser beam L is between 100 and 1000 μJ; receiving at least one pulse laser beam L through the beam adjustment module 2, and converting at least one pulse laser beam L into a first modulated laser beam L1; receiving the first modulated laser beam L1 through an optical module 3, and converting the first modulated laser beam L1 into a second modulated laser beam L2; receiving the second modulated laser beam L2 through the scanning module 4, and selectively projecting the second modulated laser beam L2 in at least one projection direction; and receiving the second modulated laser beam L2 through the focusing module 5, and converting the second modulated laser beam L2 into a flat-top laser beam LT projected onto the workpiece B to be drilled".

[0088] Furthermore, the pulse laser system Z and the pulse laser drilling method of the present invention can utilize the flat-top beam characteristics of the flat-top laser beam LT through the above-mentioned technical solution to optimize the selective removal of composite materials, effectively remove them cleanly without damaging the bottom layer. In addition, the pulse laser system Z and the pulse laser drilling method of the present invention can use a pulse laser beam L with a GHz pulse train (burst) with a pulse width between 50 and 500 fs to drill or weld one or more holes B1 of the workpiece B to be drilled, so as to avoid delamination at one or more holes B1 of the workpiece B to be drilled after processing, maintain a small HAZ, and thus avoid any debris and cracks at the hole B1 of the workpiece B to be drilled.

[0089] Furthermore, the pulse laser system Z and the pulse laser drilling method of the present invention can also be provided with an analysis module 6 and a spectroscopic module 7, so that the transmitting module 1 can selectively adjust at least one of the spot shape, spot position and beam energy of the pulse laser beam L according to the information of the beam energy analysis signal. Furthermore, the pulse laser system Z and the pulse laser drilling method of the present invention can also be provided with an air blowing and suction module 9 to blow up and recycle the chips or foreign matter generated when the flat-top laser beam LT is drilled, so as to prevent the chips or foreign matter from affecting the processing quality or product quality of the workpiece B to be drilled.

[0090] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the claims of the present invention.

Claims

1. A pulsed laser system, characterized in that: include: An emission module, the emission module is used to provide at least one pulsed laser beam, wherein the pulse width of the at least one pulsed laser beam is between 50 and 500 fs, the repetition frequency of the at least one pulsed laser beam is between 0.5 and 10 GHz, and the pulse energy of the at least one pulsed laser beam is between 100 and 1000 μJ; a beam adjustment module, the beam adjustment module corresponding to the transmitting module, the beam adjustment module being configured to receive the at least one pulsed laser beam and to convert the at least one pulsed laser beam into a first modulated laser beam; an optical module, the optical module corresponding to the beam adjustment module, the optical module being configured to receive the first modulated laser beam and to convert the first modulated laser beam into a second modulated laser beam; a scanning module, the scanning module corresponding to the optical module, the scanning module being configured to receive the second modulated laser beam and selectively project the second modulated laser beam in at least one projection direction; and A focusing module, the focusing module corresponds to the scanning module, and the focusing module is configured to receive the second modulated laser beam and to convert the second modulated laser beam into a flat-top laser beam projected onto a workpiece to be drilled.

2. The pulse laser system according to claim 1, characterized in that: The transmitting module comprises: A pulse laser generating unit, wherein the pulse laser generating unit is used to generate a laser having a plurality of pulse signals; a laser modulation unit, the laser modulation unit being adjacent to the pulse laser generating unit, the laser modulation unit being configured to increase the repetition frequency of the laser and to generate a pulse train laser having a plurality of pulse trains according to the increased repetition frequency of the laser; and A laser amplification unit, the laser amplification unit is adjacent to the laser modulation unit, and the laser amplification unit is configured to increase the pulse energy of the pulse train laser to generate the pulse laser beam, wherein the multiple pulse trains include the multiple pulse signals, and the frequencies of the multiple pulse signals are between 1 and 2000 KHz.

3. The pulse laser system according to claim 1, characterized in that: Also includes: An analysis module, the analysis module is connected to the transmission module; as well as A spectroscopic module, the spectroscopic module corresponds to the analyzing module, and the spectroscopic module is configured to receive the first modulated laser beam, the second modulated laser beam or the flat-top laser beam; When the light splitting module receives the first modulated laser beam, the light splitting module projects a portion of the first modulated laser beam to the optical module, and projects another portion of the first modulated laser beam to the analysis module, so that the analysis module generates a first beam energy analysis signal, and the analysis module transmits the first beam energy analysis signal to the transmitting module; When the light splitting module receives the second modulated laser beam, the light splitting module projects a portion of the second modulated laser beam to the scanning module, and projects another portion of the second modulated laser beam to the analysis module, so that the analysis module generates a second beam energy analysis signal, and the analysis module transmits the second beam energy analysis signal to the transmitting module; When the light splitting module receives the flat-top laser beam, the light splitting module projects a portion of the flat-top laser beam to the workpiece to be drilled, and projects another portion of the flat-top laser beam to the analysis module, so that the analysis module generates a third beam energy analysis signal, and the analysis module transmits the third beam energy analysis signal to the transmission module; The first beam energy analysis signal, the second beam energy analysis signal and the third beam energy analysis signal include at least one of a light spot shape, a light spot position and a beam energy.

4. The pulse laser system according to claim 1, characterized in that: It also includes a carrier module, the carrier module corresponds to the focusing module, and the carrier module is configured to carry the workpiece to be drilled; Wherein, the transmitting module, the beam adjusting module, the optical module, the scanning module and the focusing module are arranged in the same optical path; The focusing module focuses the second modulated laser beam into the flat-top laser beam with a predetermined high diameter-to-depth ratio, and projects the flat-top laser beam onto the workpiece to be drilled.

5. The pulse laser system according to claim 4, characterized in that: The flat-top laser beam is projected to at least one drilling hole of the workpiece to be drilled at an offset speed, the carrier module is offset at the offset speed, the at least one drilling hole includes at least one drilling hole, the at least one drilling hole is a cylindrical hole, the at least one drilling hole has a fixed hole diameter, the inner wall of the at least one drilling hole is a smooth wall, the depth of the at least one drilling hole is determined according to the number of pulse trains and the energy density, the hole diameter is between 20 and 40 μm, the depth of the at least one drilling hole is between 70 and 295 μm, and the inner wall smoothness of the at least one drilling hole is between 100 and 5000 nm; wherein, the offset speed of the flat-top laser beam is determined according to the repetition frequency, and the average power of the pulsed laser beam is determined according to the pulse energy and the repetition frequency.

6. A pulse laser drilling method, characterized in that: The following steps are involved: Providing at least one pulsed laser beam through a transmitting module, wherein a pulse width of the at least one pulsed laser beam is between 50 and 500 fs, a repetition frequency of the at least one pulsed laser beam is between 0.5 and 10 GHz, and a pulse energy of the at least one pulsed laser beam is between 100 and 1000 μJ; receiving the at least one pulsed laser beam using a beam adjustment module and converting the at least one pulsed laser beam into a first modulated laser beam; receiving the first modulated laser beam through an optical module, and converting the first modulated laser beam into a second modulated laser beam; Using a scanning module to receive the second modulated laser beam, and selectively projecting the second modulated laser beam in at least one projection direction; and The second modulated laser beam is received by a focusing module, and the second modulated laser beam is converted into a flat-top laser beam projected onto a workpiece to be drilled.

7. The pulse laser drilling method according to claim 6, characterized in that: In the step of providing the at least one pulsed laser beam, the following steps are also included: generating a laser having a plurality of pulse signals by a pulse laser generating unit; Using a laser modulation unit to increase the repetition frequency of the laser, and generating a pulse train laser having a plurality of pulse trains based on the increased laser; and The pulse energy of the pulse train laser is increased by a laser amplification unit to generate the at least one pulse laser beam, wherein the multiple pulse trains include the multiple pulse signals, and the frequencies of the multiple pulse signals are between 1 and 2000 KHz.

8. The pulse laser drilling method according to claim 6, characterized in that: After the step of generating the first modulated laser beam, the following steps are also included: receiving the first modulated laser beam through a beam splitter module, projecting a portion of the first modulated laser beam to the optical module, and projecting another portion of the first modulated laser beam to an analysis module; and Utilizing the analysis module to receive the other portion of the at least one pulsed laser beam, and generating a first beam energy analysis signal accordingly, and transmitting the first beam energy analysis signal to the transmitting module; Wherein, after the step of generating the second modulated laser beam, the method further includes the following steps: receiving the second modulated laser beam through a beam splitter module, projecting a portion of the second modulated laser beam to the scanning module, and projecting another portion of the second modulated laser beam to the analysis module; and Utilizing the analysis module to receive the other portion of the at least one pulsed laser beam, and generating a second beam energy analysis signal accordingly, and transmitting the second beam energy analysis signal to the transmitting module; After the step of generating the flat-top laser beam, the method further includes the following steps: Receiving the flat-top laser beam through the light splitting module, projecting a portion of the flat-top laser beam to the workpiece to be drilled, and projecting another portion of the flat-top laser beam to the analysis module; and Using the analysis module to receive the other part of the flat-top laser beam, and generating a third beam energy analysis signal accordingly, and transmitting the third beam energy analysis signal to the transmitting module; The first beam energy analysis signal, the second beam energy analysis signal and the third beam energy analysis signal include at least one of a light spot shape, a light spot position and a beam energy.

9. The pulse laser drilling method according to claim 6, characterized in that: Before the step of providing at least one pulsed laser beam, the following steps are also included: carrying the workpiece to be drilled by a carrier module; Wherein, the transmitting module, the beam adjusting module, the optical module, the scanning module and the focusing module are arranged in the same optical path; The focusing module focuses the second modulated laser beam into the flat-top laser beam with a predetermined high diameter-to-depth ratio, and projects the flat-top laser beam onto the workpiece to be drilled.

10. The pulse laser drilling method according to claim 9, characterized in that: The flat-top laser beam is projected to at least one drilling hole of the workpiece to be drilled at an offset speed, the carrier module is offset at the offset speed, the at least one drilling hole includes at least one drilling hole, the at least one drilling hole is a cylindrical hole, the at least one drilling hole has a fixed hole diameter, the inner wall of the at least one drilling hole is a smooth wall, the depth of the at least one drilling hole is determined according to the number of pulse trains and the energy density, the hole diameter is between 20 and 40 μm, the depth of the at least one drilling hole is between 70 and 295 μm, and the inner wall smoothness of the at least one drilling hole is between 100 and 5000 nm; wherein, the offset speed of the flat-top laser beam is determined according to the repetition frequency, and the average power of the pulsed laser beam is determined according to the pulse energy and the repetition frequency.

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