Semiconductor temperature control device, garment using same and garment manufacturing method

Abstract

The invention relates to the technical field of clothing, and provides a semiconductor temperature control device, clothing using the same and a clothing manufacturing method. Comprising a shell, a semiconductor piece and a cold conduction module are arranged in a main cavity of the shell, one side of the semiconductor piece is a refrigeration face, and the other side of the semiconductor piece is a heat dissipation face; the cold conduction module is arranged opposite to the refrigeration surface of the semiconductor chip; a fresh air inlet is formed in the top of the main cavity, one side of the main cavity communicates with a fresh air outflow pipeline and a return pipeline, the fresh air outflow pipeline and the return pipeline are arranged up and down, a fresh air outlet is formed in the end of the fresh air outflow pipeline, and a return opening is formed in the end of the return pipeline; the semiconductor wafer seals the side wall, where the semiconductor wafer is mounted, of the main cavity; the heat dissipation surface of the semiconductor sheet is arranged opposite to the heat conduction module which is communicated with the hot air outflow pipeline. The semiconductor temperature control device has the advantages that the semiconductor temperature control device is arranged in the garment, exchange of airflow outside the garment and airflow inside the garment can be achieved through two circulation modes, and exchange of airflow inside the garment can also be achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of clothing, and in particular to a semiconductor temperature control device, clothing using the same, and a clothing manufacturing method. Background Art

[0002] The existing clothing has poor air permeability and the internal temperature is not easy to adjust, resulting in reduced comfort when wearing. In view of this, the present invention is proposed. Summary of the invention

[0003] The purpose of the present invention is to provide a semiconductor temperature control device and clothing and a clothing manufacturing method using the same, so as to solve the technical problems existing in the prior art.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a semiconductor temperature control device, comprising: a shell, a semiconductor chip and a cold conduction module are arranged inside the main cavity of the shell, one side of the semiconductor chip is a cooling surface, and the other side is a heat dissipation surface; the cold conduction module is arranged opposite to the cooling surface of the semiconductor chip; the top of the main cavity is a fresh air inlet, one side of the main cavity is connected to a fresh air outflow pipeline and a return pipeline, the fresh air outflow pipeline and the return pipeline are arranged up and down, the end of the fresh air outflow pipeline is a fresh air outlet, and the end of the return pipeline is a return port; the semiconductor chip closes the side wall of the main cavity where the semiconductor chip is installed; the heat dissipation surface of the semiconductor chip is arranged opposite to the heat conduction module, and the heat conduction module is connected to the hot air outflow pipeline;

[0005] In the first circulation mode, the return port is closed, the airflow enters through the fresh air inlet, passes through the refrigeration surface and then flows out through the fresh air outlet; in the second circulation mode, the fresh air inlet is closed, the airflow enters through the return port, passes through the refrigeration surface and then flows out through the fresh air outlet.

[0006] In an optional embodiment, the cooling surface of the semiconductor chip includes a first cooling area and a second cooling area, and the second cooling area is arranged around the first cooling area;

[0007] The cross-sectional area of ​​the first refrigeration region is equal to the cross-sectional area of ​​the cold conduction module, and the central axis of the cross-sectional area of ​​the first refrigeration region coincides with the central axis of the cross-sectional area of ​​the cold conduction module; the cross-sectional area of ​​the cold conduction module is set to surround the cross-sectional area of ​​the fresh air outflow pipeline and the return pipeline.

[0008] In an optional embodiment, in the first circulation mode, the first refrigeration area and the second refrigeration area are turned on simultaneously; in the second circulation mode, the first refrigeration area is turned on alone.

[0009] In an optional embodiment, a filter assembly is disposed in the main cavity, the filter assembly is disposed adjacent to the fresh air inlet, and the filter assembly is located above the semiconductor sheet.

[0010] In an optional embodiment, a silicon-based fan is provided in the fresh air outlet duct; and a heat dissipation fan is provided in the hot air outlet duct.

[0011] In an optional embodiment, a main control board for controlling the operation of the temperature control device is also provided inside the shell.

[0012] On the other hand, the present invention also provides a garment using the semiconductor temperature control device as described above, comprising: the garment having a plurality of separate closed temperature regulating areas.

[0013] In addition, the present invention also provides a method for making the clothing as described above, comprising the following steps:

[0014] S110: Acquire a comfortable temperature distribution diagram of a human body surface;

[0015] S120: Starting from at least one point with the highest temperature in the comfortable temperature distribution map and spreading outward, at least one area within the set temperature difference is obtained. If there are two or more areas that overlap, or if there are two or more areas that do not overlap but the closest distance between the boundary points of the two or more areas is less than a set threshold, the two or more areas are merged into one area. At least one temperature adjustment area is formed through the above process.

[0016] S130: Repeating the operations of S120-S130 for the remaining comfortable temperature distribution maps of the human body surface that have not formed the temperature adjustment area, until the remaining comfortable temperature distribution maps that have not formed the temperature adjustment area are less than the set area threshold; and finally forming a plurality of temperature adjustment areas;

[0017] S140: producing a corresponding plurality of closed temperature regulating areas on the garment according to the plurality of temperature regulating areas finally formed.

[0018] In an optional embodiment, it also includes:

[0019] S150: A semiconductor temperature control device is respectively arranged in each of the closed temperature adjustment areas, and an initial cooling temperature of each semiconductor temperature control device is determined according to a comfortable temperature value in a comfortable temperature distribution diagram of a human body surface covered by each temperature adjustment area.

[0020] In an optional embodiment, it also includes:

[0021] S160: When the actual sensible temperature of each of the closed temperature adjustment areas is higher than the corresponding starting cooling temperature, the semiconductor in each of the closed temperature adjustment areas starts cooling.

[0022] The beneficial effects of the present invention are:

[0023] (1) The semiconductor temperature control device is placed inside the clothing, and can realize the exchange of airflow outside the clothing with airflow inside the clothing through two circulation modes, and can also realize the exchange of airflow inside the clothing. In the first circulation mode, the first refrigeration area and the second refrigeration area are turned on at the same time, and in the second circulation mode, the first refrigeration area is turned on alone, which can reduce the power consumption of the semiconductor chip while ensuring the refrigeration effect.

[0024] (2) The temperature regulation area is determined according to the comfortable temperature distribution diagram of the human body surface, and the corresponding closed temperature regulation area on the clothing is determined according to the temperature regulation area. By setting a semiconductor temperature control device in each closed temperature regulation area, the temperature regulation of the corresponding area is completed, thereby improving the comfort of wearing the clothing. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic diagram of the principle structure of a semiconductor temperature control device provided in one embodiment of the present invention.

[0027] Figure 2 A schematic diagram of a semiconductor cooling plate provided in one embodiment of the present invention.

[0028] Figure 3 A comfortable temperature distribution diagram of a human body surface provided by an embodiment of the present invention.

[0029] Comfortable temperature distribution diagram of human body surface

[0030] Among them, the accompanying drawings are marked as follows:

[0031] 1-semiconductor wafer, 11-first refrigeration area, 12-second refrigeration area;

[0032] 2-main cavity, 3-cold conduction module, 4-return pipeline, 5-heat conduction module, 6-main control board, 7-fresh air outlet pipeline, 8-silicon-based fan, 9-hot air outlet pipeline, 10-cooling fan. DETAILED DESCRIPTION

[0033] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0034] It should be noted that when a component is referred to as being "fixed on" or "disposed on" another component, it may be directly or indirectly located on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The directions or positions indicated by the terms "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the directions or positions shown in the accompanying drawings and are only for the convenience of description and cannot be understood as limitations on the present technical solution. The terms "first" and "second" are only used for the convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, and "several" means any number including one, unless otherwise clearly and specifically defined.

[0035] Please see attached Figure 1-2 The purpose of this embodiment is to provide a semiconductor temperature control device, including: a shell, a semiconductor chip 1 and a cold conduction module 3 are arranged inside the main cavity 2 of the shell, one side of the semiconductor chip 1 is a cooling surface, and the other side is a heat dissipation surface; the cold conduction module 3 is arranged opposite to the cooling surface of the semiconductor chip 1; the top of the main cavity 2 is a fresh air inlet, one side of the main cavity 2 is connected to the fresh air outflow pipeline 7 and the return pipeline 4, the fresh air outflow pipeline 7 and the return pipeline 4 are arranged up and down, the end of the fresh air outflow pipeline 7 is the fresh air outlet, and the end of the return pipeline 4 is the return port; the semiconductor chip 1 closes the side wall of the main cavity 2 where the semiconductor chip 1 is installed; the heat dissipation surface of the semiconductor chip 1 is arranged opposite to the heat conduction module 5, and the heat conduction module 5 is connected to the hot air outflow pipeline 9; in the first circulation mode, the return port is closed, the airflow enters from the fresh air inlet, passes through the cooling surface and flows out through the fresh air outlet; in the second circulation mode, the fresh air inlet is closed, the airflow enters from the return port, passes through the cooling surface and flows out through the fresh air outlet. Through the above two circulation modes, external circulation of airflow and internal circulation in clothing can be achieved.

[0036] In this embodiment, the refrigeration surface of the semiconductor chip 1 includes a first refrigeration area 11 and a second refrigeration area 12, and the second refrigeration area 12 is arranged around the first refrigeration area 11; the cross-sectional area of ​​the first refrigeration area 11 is equal to the cross-sectional area of ​​the cold conduction module 3, and the central axis of the cross section of the first refrigeration area 11 coincides with the central axis of the cross section of the cold conduction module 3; the cross section of the cold conduction module 3 is arranged to surround the cross section of the fresh air outflow pipeline 7 and the return pipeline 4. Through the above arrangement, when the airflow circulates internally, the airflow entering through the return pipeline 4 can be fully in contact with the first refrigeration area 11. It should be pointed out that in the first circulation mode, the first refrigeration area 11 and the second refrigeration area 12 are opened at the same time; in the second circulation mode, the first refrigeration area 11 is opened alone. Through the above opening method, it can be ensured that the external airflow is fully in contact with the refrigeration surface in the first circulation mode, so that the heat exchange is sufficient, especially when the temperature of the external airflow is high; in the second circulation mode, when the opening area of ​​the refrigeration area is reduced, sufficient heat exchange can still be ensured without affecting the heat exchange efficiency.

[0037] In addition, a filter assembly is provided in the main cavity 2, and the filter assembly is provided close to the fresh air inlet, and the filter assembly is located above the semiconductor chip 1 to ensure the neatness of the airflow flowing into the clothing. A silicon-based fan 8 is provided in the fresh air outflow pipeline 7; a heat dissipation fan 10 is provided in the hot air outflow pipeline 9; and is used to adjust the airflow velocity. A main control board 6 for controlling the operation of the temperature control device is also provided inside the housing. The main control board 6 is wirelessly connected to the external controller and performs corresponding operations according to instructions.

[0038] In an optional embodiment, the embodiment of the present invention further provides a garment using the above-mentioned semiconductor temperature control device, including: the garment has a plurality of separate closed temperature regulating areas.

[0039] The method of making the garment is as follows. Figure 1-3 :

[0040] S110: Obtain the comfortable temperature distribution diagram of the human body surface; see Appendix Figure 3 In the example, the temperature values ​​represented by pink, red, orange, yellow, and green decrease in sequence.

[0041] S120: Starting from at least one point with the highest temperature in the comfortable temperature distribution map, diffusing outward to obtain at least one area within the set temperature difference, if there are two or more areas overlapping, or if there are two or more areas without overlapping but the shortest distance between the boundary points of the two or more areas is less than the set threshold, the two or more areas are merged into one area; at least one temperature adjustment area is formed through the above process.

[0042] For example, the highest temperature in the pink area is 38°, and the temperature difference is set to a° (a>0), and a region is formed from a point with a temperature of 38° to multiple points or isotherms of 38°-a°. The point with the highest temperature is located in the pink area. Figure 3 It can be seen that there can be more than two points with the highest temperature, and the areas initially diffused from the points with the highest temperature can also be more than two. After the final merging (if there is a need for merging), it can be determined that there can be one or more temperature adjustment areas.

[0043] S130: Repeat the operations of S120-S130 for the remaining comfortable temperature distribution maps of the human body surface that have not formed temperature adjustment areas, and repeat this cycle until the remaining comfortable temperature distribution maps that have not formed temperature adjustment areas are less than the set area threshold; and finally form multiple temperature adjustment areas.

[0044] S140: producing corresponding multiple closed temperature regulating areas on the garment according to the multiple temperature regulating areas finally formed. By determining the corresponding closed temperature regulating areas on the garment according to the comfortable temperature distribution diagram of the human body surface, the accuracy of garment temperature regulation can be improved, and differentiated temperature control of different areas can be achieved, thereby improving the comfort of the garment when worn.

[0045] S150: A semiconductor temperature control device is respectively arranged in each of the closed temperature adjustment areas, and an initial cooling temperature of each of the semiconductor temperature control devices is determined according to the comfortable temperature value in the comfortable temperature distribution map of the human body surface covered by each temperature adjustment area. Exemplarily, for any temperature adjustment area, the maximum value or average value of the comfortable temperature value in the comfortable temperature distribution map of the human body surface covered by the temperature adjustment area is used as the initial cooling temperature of each of the semiconductor temperature control devices.

[0046] S160: When the actual sensible temperature of each of the closed temperature adjustment areas is higher than the corresponding starting cooling temperature, the semiconductor in each of the closed temperature adjustment areas starts cooling.

[0047] The temperature regulation area is determined according to the comfortable temperature distribution diagram of the human body surface, and the corresponding closed temperature regulation area on the clothing is determined according to the determined temperature regulation area. By setting a semiconductor temperature control device in each closed temperature regulation area, the temperature regulation of the corresponding area is completed, thereby improving the comfort of wearing the clothing.

[0048] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor temperature control device, characterized in that: include: A shell, wherein a semiconductor chip (1) and a cold conduction module (3) are arranged inside a main cavity (2) of the shell, one side of the semiconductor chip (1) is a cooling surface, and the other side is a heat dissipation surface; the cold conduction module (3) is arranged opposite to the cooling surface of the semiconductor chip (1); the top of the main cavity (2) is a fresh air inlet, and one side of the main cavity (2) is connected to a fresh air outflow pipeline (7) and a return pipeline (4), the fresh air outflow pipeline (7) and the return pipeline (4) are arranged up and down, the end of the fresh air outflow pipeline (7) is a fresh air outlet, and the end of the return pipeline (4) is a return port; the semiconductor chip (1) closes the side wall of the main cavity (2) on which the semiconductor chip (1) is installed; the heat dissipation surface of the semiconductor chip (1) is arranged opposite to the heat conduction module (5), and the heat conduction module (5) is connected to the hot air outflow pipeline (9); In the first circulation mode, the return port is closed, the airflow enters through the fresh air inlet, passes through the refrigeration surface and then flows out through the fresh air outlet; in the second circulation mode, the fresh air inlet is closed, the airflow enters through the return port, passes through the refrigeration surface and then flows out through the fresh air outlet.

2. The semiconductor temperature control device according to claim 1, characterized in that: The cooling surface of the semiconductor chip (1) comprises a first cooling area (11) and a second cooling area (12), wherein the second cooling area (12) is arranged around the first cooling area (11); The cross-sectional area of ​​the first refrigeration region (11) is equal to the cross-sectional area of ​​the cold conduction module (3), and the central axis of the cross-sectional area of ​​the first refrigeration region (11) coincides with the central axis of the cross-sectional area of ​​the cold conduction module (3); the cross-sectional area of ​​the cold conduction module (3) is arranged to surround the cross-sectional area of ​​the fresh air outlet pipe (7) and the return pipe (4).

3. The semiconductor temperature control device according to claim 2, characterized in that: In the first circulation mode, the first refrigeration area (11) and the second refrigeration area (12) are opened simultaneously; in the second circulation mode, the first refrigeration area (11) is opened alone.

4. The semiconductor temperature control device according to claim 1, characterized in that: A filter assembly is arranged in the main cavity (2), the filter assembly is arranged adjacent to the fresh air inlet, and the filter assembly is located above the semiconductor chip (1).

5. The semiconductor temperature control device according to claim 1, characterized in that: A silicon-based fan (8) is provided in the fresh air outflow pipeline (7); and a heat dissipation fan (10) is provided in the hot air outflow pipeline (9).

6. The semiconductor temperature control device according to claim 1, characterized in that: A main control board (6) for controlling the operation of the temperature control device is also arranged inside the housing.

7. A garment using the semiconductor temperature control device according to any one of claims 1 to 6, characterized in that: include: The garment has a plurality of individually enclosed temperature regulating zones.

8. A method for making clothing according to claim 7, characterized in that: The following steps are involved: S110: Acquire a comfortable temperature distribution diagram of a human body surface; S120: Starting from at least one point with the highest temperature in the comfortable temperature distribution map and spreading outward, at least one area within the set temperature difference is obtained. If there are two or more areas that overlap, or if there are two or more areas that do not overlap but the closest distance between the boundary points of the two or more areas is less than a set threshold, the two or more areas are merged into one area. At least one temperature adjustment area is formed through the above process. S130: Repeating the operations of S120-S130 for the remaining comfortable temperature distribution maps of the human body surface that have not formed the temperature adjustment area, until the remaining comfortable temperature distribution maps that have not formed the temperature adjustment area are less than the set area threshold; and finally forming a plurality of temperature adjustment areas; S140: producing a corresponding plurality of closed temperature regulating areas on the garment according to the plurality of temperature regulating areas finally formed.

9. The method for making clothing according to claim 8, characterized in that: Also includes: S150: A semiconductor temperature control device is respectively arranged in each of the closed temperature adjustment areas, and an initial cooling temperature of each semiconductor temperature control device is determined according to a comfortable temperature value in a comfortable temperature distribution diagram of a human body surface covered by each temperature adjustment area.

10. The method for making clothing according to claim 9, characterized in that: Also includes: S160: When the actual sensible temperature of each of the closed temperature adjustment areas is higher than the corresponding starting cooling temperature, the semiconductor in each of the closed temperature adjustment areas starts cooling.

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