Manifold micro-channel evaporator and gravity type separated heat pipe system thereof

Abstract

The invention provides a manifold micro-channel evaporator and a gravity type separated heat pipe system thereof. The manifold micro-channel evaporator comprises a manifold micro-channel evaporator body serving as an evaporation end, a flow guide piece type radiator serving as a condensation end, a steam ascending pipe, a condensate backflow pipe and a working medium, wherein the steam ascending pipe and the condensate backflow pipe are connected with the evaporation end and the condensation end, and the gravity type separated heat pipe system is filled with the working medium. The manifold micro-channel evaporator comprises a third layer, a second layer, a first layer and a fourth layer, the second layer comprises a plurality of inlet through holes and outlet through holes which vertically penetrate through the second layer, and the inlet through holes and the outlet through holes communicate with an inlet manifold and an outlet manifold correspondingly; a micro-channel is arranged at the upper part of the third layer; a shell is arranged at the upper part of the flow deflector; and a refrigerant outlet hole is formed in the shell. According to the design of the manifold micro-channels, the flowing path of fluid in the micro-channels is shortened, the overall pressure drop of the system is reduced, the advantages of impact jet flow are also achieved, and heat exchange is further enhanced by intensifying disturbance of the fluid.

Description

Technical Field

[0001] The invention relates to the field of heat exchange, and in particular to a gravity-type separation heat pipe system using a manifold microchannel evaporator. Background Art

[0002] A heat exchanger is a device that exchanges heat between hot and cold fluids, also known as a heat exchanger. Heat exchangers are widely used in many fields. In fields such as electronics, petrochemicals, communications, aerospace, etc., due to their special working scenes, there are special requirements for the size and weight of the heat exchanger, and their heat exchange capacity is required to be stronger. In 1981, some scholars proposed the use of microchannels for heat dissipation, which can not only reduce the volume of the heat exchanger but also greatly improve its heat exchange capacity by utilizing the higher specific surface area of ​​the microchannel. However, although its heat exchange capacity is strong, its overall pressure loss is also high due to the small hydraulic diameter of the microchannel.

[0003] Heat pipe technology uses heat transfer theory and the rapid heat transfer properties of phase change media to quickly transfer heat from the heating source to the outside of the heat source through heat pipes. Its thermal conductivity exceeds that of any known metal. Therefore, since its inception, heat pipe technology has become a hot topic for many scholars at home and abroad in recent decades.

[0004] The split heat pipe is an innovative form of heat pipe technology. It is an efficient heat energy transmission system. By setting up independent evaporation sections and condensation sections between the heat source and the heat dissipation source, the split heat pipe uses the phase change process of the internal working fluid to achieve heat transfer without any external power assistance. Its structural features are: the evaporation section and the condensation section are separated, and vacuum insulation technology is used inside. It has the advantages of high transmission efficiency, fast thermal response speed, flexible structure, easy expansion and maintenance, etc. It is widely used in data centers, solar thermal collection, industrial waste heat recovery and other fields.

[0005] The split heat pipe is mainly composed of an evaporation section, a condensation section, connecting pipes, a working fluid and a vacuum insulation layer. Its working principle is: the heat source transfers heat to the evaporation section, causing the working fluid to absorb heat and evaporate. The steam flows to the condensation section through the connecting pipe, releases heat in the condensation section and condenses into liquid. Relying on gravity or the action of a micro pump, the condensate returns to the evaporation section to absorb heat and evaporate again, forming a closed cycle. In this process, the vacuum insulation layer ensures efficient insulation inside the heat pipe and reduces heat loss. The design of the evaporation section and the condensation section is the key to the performance of the split heat pipe, and their design directly affects the heat transfer efficiency and overall working stability of the heat pipe.

[0006] With the continuous development of technology, the design heat flux density required by many machines and equipment has also increased. Therefore, in order to maintain the normal operation of the machine equipment, a large amount of heat dissipation of the equipment is required. However, the traditional air cooling technology has limited heat dissipation capacity and high energy consumption, and can no longer meet the current heat dissipation needs. Therefore, it is imperative to develop a new type of refrigeration method with high efficiency and low energy consumption.

[0007] To solve this problem, the main measure currently adopted by heat dissipation equipment is liquid cooling technology. Liquid cooling technology can be divided into indirect cooling and direct cooling. Evaporator cooling is one of the main forms of indirect cooling. Uniform and small microchannels are etched in the evaporator to make the working fluid flow in a directional manner in the microchannel. The structure of the microchannel can increase the convective heat transfer area and improve the convective heat transfer intensity, thereby effectively enhancing the heat exchange. Patent CN 111678364 A discloses a microchannel heat exchanger with high heat dissipation efficiency. By setting grooves on the side walls of the guide vanes, the heat exchange space formed by the grooves is used to create secondary heat exchange channels, thereby effectively increasing the heat exchange efficiency. However, in this patent, due to the presence of viscosity, the working fluid in the microchannel will produce huge friction losses along the flow direction, and the flow loss is very large.

[0008] Separate heat pipe cooling is one of the forms of indirect cooling. Its basic principle is to use a fan or other means to bring the heat of the electronic equipment to the evaporation end of the separate heat pipe, and achieve heat transfer between the evaporation end and the condensation end through the phase change heat transfer of the refrigerant in the separate heat pipe, thereby reducing the temperature of the target. Patent CN 113056167 A discloses a liquid-cooled server heat dissipation device based on a separate heat pipe heat exchanger, which can significantly simplify the internal structure of the system, reduce energy consumption, and improve heat dissipation efficiency. In this patent, although immersion cooling can significantly reduce the temperature of electronic equipment, for electronic equipment with very high local hot spots, the heat dissipation capacity of simple immersion cooling is limited, and overheating of heating components will still occur. In addition, simple immersion cooling has a complex structure and occupies a large area. Summary of the invention

[0009] The purpose of the present invention is to provide a manifold microchannel evaporator and a gravity-type separated heat pipe system using the manifold microchannel evaporator. The design of the manifold microchannel shortens the flow distance of the fluid in the microchannel, reduces the overall pressure drop of the system, and also has the advantages of the impact jet, further enhancing the heat exchange by intensifying the disturbance of the fluid. The evaporator can also improve the problem that immersion cooling cannot solve local hot spots and easily causes overheating of heating components, and can also solve the problem of complex structure and large floor space.

[0010] In order to achieve the above object, the technical solution of the present invention is as follows: A manifold microchannel evaporator comprises a fourth layer, a first layer, a second layer and a third layer which are stacked in sequence from top to bottom, the fourth layer comprises a refrigerant inlet header, a refrigerant inlet manifold, a refrigerant outlet header, a refrigerant outlet manifold and a guide plate, the refrigerant inlet manifold and the refrigerant outlet manifold pass through the fourth layer from top to bottom, the guide plate is arranged at the outlet of the refrigerant outlet manifold at the upper part of the fourth layer, the refrigerant inlet manifold is arranged at the lower part of the fourth layer and communicated with the inlet header, the refrigerant outlet manifold is arranged at the lower part of the fourth layer and communicated with the outlet header; the second layer comprises a plurality of inlet through holes and outlet through holes which pass through the second layer from top to bottom, the inlet through holes and the outlet through holes are communicated with the inlet manifold and the outlet manifold respectively; a microchannel is arranged at the upper part of the third layer; the inlet manifold, the outlet manifold, the inlet through holes and the outlet through holes are all strip structures, the guide plate is arranged perpendicular to or inclined to the strip structure of the refrigerant outlet manifold; a shell is arranged at the upper part of the guide plate, and a refrigerant outlet hole is arranged on the shell.

[0011] As an improvement, the refrigerant outlet manifold is a plurality of parallel refrigerant outlet manifolds, each of which is independently provided with a guide plate and a shell. A refrigerant outlet hole is provided on each shell, each refrigerant outlet hole is connected to an outlet pipe, and a plurality of outlet pipes are connected to the main pipe.

[0012] As an improvement, the guide vane is inclined at an angle of 50-70° relative to the upper surface of the first layer.

[0013] As an improvement, the guide vanes of the refrigerant outlet manifold are arranged with different inclination directions, wherein the guide vanes on both sides of the refrigerant outlet hole position are inclined in opposite directions and are both inclined toward the refrigerant outlet hole position.

[0014] As an improvement, the inclination angle of the guide vane gradually decreases along the position of the refrigerant outlet hole toward the two ends of the refrigerant outlet manifold.

[0015] As an improvement, the refrigerant outlet hole is located at a middle position of the refrigerant outlet manifold, that is, a middle position of the shell in the direction of the refrigerant outlet manifold.

[0016] The working method of the manifold microchannel evaporator is that the refrigerant enters the evaporator from the refrigerant inlet header and then enters the refrigerant inlet manifold. After being divided into multiple streams at the manifold, the refrigerant impacts the third layer downward and flows to both sides along the microchannel direction. The refrigerant then leaves the third layer from the refrigerant outlet manifold. After leaving the third layer, the refrigerant will also pass through the refrigerant outlet guide plate, where the refrigerant is fully broken up and drained to the refrigerant outlet header to optimize the fluid flow in the fourth layer.

[0017] A gravity-type separated heat pipe system includes a guide fin radiator, a manifold microchannel evaporator, a steam riser and a condensate downcomer. A certain volume of refrigerant is filled in the system. The guide fin radiator is responsible for cooling the gaseous working medium entering the system. The manifold microchannel evaporator uses the liquid working medium to absorb the heat generated by the cooling target. The steam riser and the condensate return pipe connect the guide fin radiator and the manifold microchannel evaporator to form a circulation loop. The lower part of the third layer is thermally connected to the main heating component, and the guide fin radiator is connected to the fan. Compared with the prior art, the present invention has the following advantages: 1. The purpose of the present invention is to provide a manifold microchannel evaporator and a gravity-type separated heat pipe system using the manifold microchannel evaporator. The design of the manifold microchannel shortens the flow distance of the fluid in the microchannel, reduces the overall pressure drop of the system, and also has the advantages of impact jets, further enhancing heat exchange by intensifying the disturbance of the fluid. Combining the evaporator with immersion cooling can also improve the problem that immersion cooling cannot solve local hot spots and easily causes overheating of heating components.

[0018] 2. The present invention also fully considers the characteristics of high refrigerant flow velocity and high temperature at the refrigerant outlet manifold, which may cause strong impact on the fourth layer, and arranges low-density guide vanes at the refrigerant outlet. These guide vanes can effectively disperse the fluid, slow down the strong impact of the refrigerant on the fourth layer, reduce the impact of the fluid on the shell, and further reduce noise. Guide the refrigerant to flow to the outlet, increase the heat exchange area, and further enhance the heat exchange effect.

[0019] 3. The present invention can make the outlet fluid flow obliquely toward the refrigerant outlet hole, which can further ensure that the fluid can flow out in the middle and reduce the flow resistance. At the same time, the two fluids in opposite directions can offset each other's flow intensity, thereby ensuring enhanced heat transfer while reducing the fluid flow speed and reducing the strong impact on the fourth layer. The impact of the fluid on the shell is further reduced, and the noise is further reduced.

[0020] 4. The present invention adopts the form of a separate heat pipe to construct a heat dissipation system that is in direct contact with the server chip, and realizes indirect liquid cooling phase change heat dissipation for the chip with the largest power consumption and the most critical impact on performance in the server, effectively controlling the chip temperature. At the same time, the separate heat pipe has the characteristics of flexibility and simplicity, long-distance arrangement, simple modification, compact structure, and can be hard-connected or soft-connected according to the specific needs of the server, with strong adaptability. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the layered structure of the manifold microchannel evaporator of the present invention.

[0022] Figure 2 It is a schematic diagram of the first layer structure of the present invention.

[0023] Figure 3 It is a schematic diagram of the refrigerant flow of the present invention.

[0024] Figure 4 This is a schematic diagram of the housing and the outlet inclined guide vane of the present invention. Figure 5 This is a schematic diagram of the outlet guide vane of the present invention tilting toward the middle Figure 6 It is a schematic diagram of the overall structure of the separated heat pipe system of the present invention. DETAILED DESCRIPTION

[0025] The specific implementation modes of the present invention are described in detail below with reference to the accompanying drawings.

[0026] In this article, unless otherwise specified, “ / ” represents division, and “×” and “*” represent multiplication.

[0027] Figure 1-3 The manifold microchannel evaporator of the present invention is shown. Figure 1 As shown, the manifold microchannel evaporator includes a fourth layer 4 (outlet layer), a first layer 1 (inlet layer), a second layer 2 (manifold layer) and a third layer 3 (microchannel layer) which are stacked in sequence from top to bottom. The first layer 1 includes a refrigerant inlet header 11, a refrigerant inlet manifold 12, a refrigerant outlet manifold 13 and a guide plate 14. The refrigerant inlet header 11 and the refrigerant outlet manifold 13 pass through the first layer 1 from top to bottom. The guide plate 14 is arranged at the outlet of the refrigerant outlet manifold at the upper part of the first layer. The refrigerant inlet manifold 12 is a refrigerant outlet manifold 13. 2 is arranged at the lower part of the first layer 1 and is connected to the inlet header 11, and the refrigerant outlet manifold 13 penetrates the first layer 1 from top to bottom; the second layer 2 includes a plurality of inlet through holes and outlet through holes penetrating the second layer 2 from top to bottom, and the inlet through holes and the outlet through holes are respectively connected to the inlet manifold 12 and the outlet manifold 13; the third layer 3 is provided with a microchannel at the upper part; the inlet manifold 12, the outlet manifold 13, the inlet through holes and the outlet through holes are all strip structures, and the guide plate 14 is arranged perpendicular to or inclined to the strip structure of the refrigerant outlet manifold. The shell 5 is arranged on the upper part of the guide plate 14, and the refrigerant outlet hole 51 is arranged on the shell.

[0028] The object of the present invention is to provide a manifold microchannel evaporator, wherein the design of the manifold microchannel shortens the flow distance of the fluid in the microchannel, reduces the overall pressure drop of the system, and also has the advantages of impact jets, further enhancing heat exchange by intensifying the disturbance of the fluid.

[0029] The present invention also fully considers the characteristics of the refrigerant outlet manifold, which has a high flow velocity and high temperature, and may cause a strong impact on the fourth layer and cause a large flow resistance, and arranges low-density guide vanes at the refrigerant outlet. These guide vanes can effectively disperse the fluid, slow down the strong impact of the refrigerant on the fourth layer, and guide it to flow to the refrigerant outlet manifold. They also play a role similar to fins, increase the heat exchange area, and further enhance the heat exchange effect. At the same time, they also reduce the pressure drop of the refrigerant. In addition, the guide vanes are arranged to effectively disperse the fluid, slow down the strong impact of the refrigerant on the fourth layer, reduce the impact of the fluid on the shell, and further reduce noise.

[0030] The evaporator of the present invention can also improve the problem that immersion cooling cannot solve local hot spots and easily causes overheating of heating components by arranging guide plates on the shell and the outlet, and can also solve the problem of complex structure and large floor space.

[0031] As an improvement, the refrigerant outlet manifold 13 is a plurality of parallel refrigerant outlet manifolds, each of which is provided with a guide plate and a shell. A refrigerant outlet hole is provided on each shell, each refrigerant outlet hole is connected to an outlet pipe, and the plurality of outlet pipes are connected to the main pipe. Figure 6 The above structure can further effectively disperse the fluid, mitigate the strong impact of the refrigerant on the fourth layer, reduce the impact of the fluid on the shell, and further reduce noise.

[0032] Figure 3 The guide vane 14 is shown to be arranged vertically relative to the upper surface of the fourth layer 1. However, as an improvement, the guide vane may be an inclined structure. Figure 4 The guide plate 14 is tilted at a certain angle relative to the upper surface of the fourth layer 1. The tilted setting can delay the flow time of the fluid and enhance the heat transfer. At the same time, it can also reduce the flow speed of the fluid and reduce the strong impact on the fourth layer. The impact of the fluid on the shell is further reduced, and the noise is further reduced.

[0033] The guide plate 14 is inclined at an angle of preferably 50-70° relative to the upper surface of the first layer 1. The above angle is obtained through a lot of research. On the one hand, it can reduce the flow speed of the fluid and reduce the strong impact on the fourth layer. On the other hand, it can also avoid too much flow resistance. The impact of the fluid on the shell is further reduced, and the noise is further reduced.

[0034] As an improvement, Figure 5The guide vanes 14 of the same refrigerant outlet manifold 13 are arranged in different inclination directions, wherein the guide vanes 14 on both sides of the refrigerant outlet hole 51 are arranged in opposite inclination directions and are both inclined toward the refrigerant outlet hole 51. By such an arrangement, the outlet fluid can all flow obliquely toward the refrigerant outlet hole 51, which can further ensure that the fluid can flow out in the middle and reduce the flow resistance. At the same time, the two fluids in opposite directions can offset each other's flow intensity, thereby reducing the fluid flow speed while ensuring enhanced heat transfer, and reducing the possible strong impact on the fourth layer. The impact of the fluid on the shell is further reduced, and the noise is further reduced.

[0035] As an improvement, the inclination angle of the guide vane gradually decreases from the position of the refrigerant outlet hole 51 to the two ends of the refrigerant outlet manifold. By such an arrangement, the fluid flowing along the inclined guide vane cannot flow to a farther position, and basically gathers at the position of the refrigerant outlet hole 51, which can reduce the strong impact on the fourth layer and reduce the refrigerant flow resistance. The impact of the fluid on the shell is further reduced, and the noise is further reduced.

[0036] As an improvement, the inclination angle of the guide vane gradually decreases from the position of the refrigerant outlet hole 51 to the two ends of the refrigerant outlet manifold. By setting it in this way, it can be further ensured that the fluid flowing along the inclined guide vane cannot flow to a farther position, and basically gathers at the position of the refrigerant outlet hole 51, which can reduce the strong impact on the fourth layer and reduce the refrigerant flow resistance. It can further reduce the impact of the fluid on the shell and further reduce the noise.

[0037] As an improvement, the refrigerant outlet hole 51 is located in the middle of the refrigerant outlet manifold 13, that is, the middle of the shell 5 in the direction of the refrigerant outlet manifold 13. This can make the fluids on both sides evenly distributed, achieve balanced heat exchange, and balance the fluids on both sides to further reduce noise.

[0038] As an improvement, the refrigerant inlet manifold 12 is designed as a conical structure along the flow direction of the fluid. The refrigerant inlet manifold 12 is designed as a conical structure, through which the refrigerant can be effectively guided to be evenly distributed from the inlet header 11 to multiple inlet pipelines, which can not only reduce the velocity difference of the fluid flow and reduce the pressure drop, but also enable the fluid to be evenly distributed before entering the microchannel to avoid the occurrence of local hot spots.

[0039] As an improvement, the inlet manifold 12 and the outlet manifold 13 are respectively provided in plurality, and the inlet manifold 12 and the outlet manifold 13 are arranged at intervals. By arranging the inlet manifold 12 and the outlet manifold 13 at intervals, it is possible to ensure uniform fluid distribution and avoid the occurrence of local hot spots.

[0040] As an improvement, multiple outlet manifolds 13 are provided, the middle outlet manifold 13 is closer to the inlet than the outlet manifolds 13 on both sides, and the width of the middle outlet manifold 13 is greater than the outlet manifolds 13 on both sides. The flow distance of the refrigerant in the microchannel can be shortened, so that the temperature rise of the refrigerant is reduced, thereby achieving more efficient cooling of the central area of ​​the heat dissipation component.

[0041] Figure 3 The working method of the manifold microchannel evaporator is demonstrated. The refrigerant enters the evaporator from the refrigerant inlet header 11, and then enters the refrigerant inlet manifold 12. After being divided into multiple streams at the manifold, the refrigerant impacts the third layer 3 downward and flows to both sides along the microchannel direction. The refrigerant is heated and vaporized and then leaves the third layer 3 from the refrigerant outlet manifold 13. After leaving the third layer, the refrigerant will also pass through the refrigerant outlet guide plate 14, where the refrigerant is fully dispersed and drained to the refrigerant outlet header to optimize the flow of the fourth layer fluid.

[0042] Figure 6 Demonstrated adoption Figure 1-3 The gravity-type separation heat pipe system of the manifold microchannel evaporator includes a manifold microchannel evaporator as an evaporation end, a finned radiator as a condensation end, a steam riser and a condensate return pipe connecting the evaporation end and the condensation end, and a working medium filled in the gravity-type separation heat pipe system. Liquid refrigerant enters the manifold microchannel evaporator from the refrigerant inlet manifold, evaporates in the evaporator after being heated, and flows out from the refrigerant outlet manifold, taking away the heat absorbed by the evaporator. The gaseous refrigerant enters the evaporation end and cools into a liquid state and then flows back to the evaporator, completing the circulation of the refrigerant and the transfer of heat. The lower part of the third layer 3 is thermally connected to the main heating component to achieve cooling of the main heating component, and the finned radiator is connected to heat dissipation components such as fans to dissipate heat.

[0043] The purpose of the present invention is to provide a manifold microchannel evaporator and a gravity-type separated heat pipe system using the manifold microchannel evaporator. The design of the manifold microchannel shortens the flow distance of the fluid in the microchannel, reduces the overall pressure drop of the system, and also has the advantages of the impact jet, further enhancing the heat exchange by increasing the disturbance of the fluid. The evaporator can also improve the problem that immersion cooling cannot solve local hot spots and easily causes overheating of heating components.

[0044] Although the present invention has been disclosed as above with preferred embodiments, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, so the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A manifold microchannel evaporator, comprising a fourth layer, a first layer, a second layer and a third layer stacked in sequence from top to bottom, the fourth layer comprising a refrigerant inlet header, a refrigerant inlet manifold, a refrigerant outlet header, a refrigerant outlet manifold and a guide plate, the refrigerant inlet manifold and the refrigerant outlet manifold pass through the fourth layer from top to bottom, the guide plate is arranged at the outlet of the refrigerant outlet manifold at the upper part of the fourth layer, the refrigerant inlet manifold is arranged at the lower part of the fourth layer and communicated with the inlet header, the refrigerant outlet manifold is arranged at the lower part of the fourth layer and communicated with the outlet header; the second layer comprises a plurality of inlet through holes and outlet through holes passing through the second layer from top to bottom, the inlet through holes and the outlet through holes are communicated with the inlet manifold and the outlet manifold respectively; a microchannel is arranged at the upper part of the third layer; the inlet manifold, the outlet manifold, the inlet through holes and the outlet through holes are all strip structures, the guide plate is arranged perpendicular to or inclined to the strip structure of the refrigerant outlet manifold; a shell is arranged at the upper part of the guide plate, and a refrigerant outlet hole is arranged on the shell.

2. The manifold microchannel evaporator according to claim 1, characterized in that: The refrigerant outlet manifolds are multiple and parallel, each of which is independently provided with a guide plate and a shell. A refrigerant outlet hole is provided on each shell, each refrigerant outlet hole is connected to an outlet pipe, and multiple outlet pipes are connected to the main pipe.

3. The manifold microchannel evaporator according to claim 1, characterized in that: The guide vane is inclined at an angle of 50-70° relative to the upper surface of the first layer.

4. The manifold microchannel evaporator according to claim 1, characterized in that: The guide vanes of the refrigerant outlet manifold are arranged with different inclination directions, wherein the guide vanes on both sides of the refrigerant outlet hole position are inclined in opposite directions and are both inclined toward the refrigerant outlet hole position.

5. The manifold microchannel evaporator according to claim 1, characterized in that: Along the refrigerant outlet hole position toward the two ends of the refrigerant outlet manifold, the inclination angle of the guide plate gradually decreases.

6. The manifold microchannel evaporator according to claim 1, characterized in that: The refrigerant outlet hole is located at the middle of the refrigerant outlet manifold, that is, the middle of the shell in the direction of the refrigerant outlet manifold.

7. The working method of the manifold microchannel evaporator as described in any one of claims 1-6, the refrigerant enters the evaporator from the refrigerant inlet header and then enters the refrigerant inlet manifold. After being divided into multiple streams at the manifold, the refrigerant impacts the third layer downward and flows to both sides along the microchannel direction. The refrigerant then leaves the third layer from the refrigerant outlet manifold. After leaving the third layer, the refrigerant will also pass through the refrigerant outlet guide plate, where the refrigerant is fully broken up and drained to the refrigerant outlet header to optimize the fluid flow of the fourth layer.

8. A gravity-type separated heat pipe system, comprising a guide fin radiator, a manifold microchannel evaporator, a steam riser and a condensate downcomer, wherein a certain volume of refrigerant is filled in the system; the guide fin radiator is responsible for cooling the gaseous working medium entering therein, the manifold microchannel evaporator utilizes the liquid working medium to absorb the heat generated by the cooling target, the steam riser and the condensate return pipe connect the guide fin radiator and the manifold microchannel evaporator to form a circulation loop; the manifold microchannel evaporator is the evaporator as described in any one of claims 1-7; the lower portion of the third layer is thermally connected to the main heat-generating component, and the guide fin radiator is connected to a fan.

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