Test heat sheet with high heat flux

Abstract

The invention discloses a high-heat-flux test heat sheet, which is characterized by comprising a slide glass, a binding post and a plurality of heat loads are mounted on the slide glass, and a plurality of leads are connected between the binding post and the heat loads. According to the high-heat-flux test hot fin, a stable and reliable point-shaped heat source can be provided for a cold plate heat dissipation performance test, a diamond resistor design is adopted for a heat load, and various heat fluxes required by a conventional test can be provided.

Description

Technical Field

[0001] The invention relates to the field of heat dissipation performance testing, and in particular to a high heat flux density test heat sheet. Background Art

[0002] Traditional cold plate heat dissipation performance tests mainly focus on the total heat power index under the premise of uniform heating, that is, the cold plate heat dissipation performance is tested with a flat heat source that generates heat evenly. Previous tests used total heat power as the main index, and generally used the temperature rise between the cooling medium and the cold plate as the evaluation index. The heat flux distribution on the test plate surface is uniform and the heat flux density is low, usually 2-5W / cm 2 At the same time, since the cold plate plane is completely covered by the heat source, the uniformity of the cold plate heat flux cannot be considered. This type of test method can no longer fully test the performance of the cold plate with a point heat source and high heat flux density.

[0003] Taking the cold plate of the phased array radar load-bearing structure as an example, the cold plate provides a mounting base for high-power T / R components while dissipating heat. The high-power components installed on the base plate exhibit point-like heat source characteristics, and the heat source point emits hundreds of watts of heat power per square centimeter when working. The existing heat source for cold plate heat dissipation performance tests can no longer meet the test requirements, so it is necessary to develop a heat source that can exhibit point-like heat generation and provide a stable high heat flux density. Summary of the invention

[0004] The object of the present invention is to provide a test heat sheet with high heat flux density, aiming to solve the above problems.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A high heat flux density test heat sheet comprises a carrier sheet, on which a connection post and a plurality of heat loads are mounted, and a plurality of wires are connected between the connection post and the heat loads.

[0007] Preferably, the heat load comprises a diamond sheet, and the two ends of the diamond sheet are respectively provided with a first electrode and a second electrode, the first electrode is made of gold, and the first electrode extends and is attached to the bottom surface of the diamond sheet to form a gold-plated heat dissipation surface. The heat load of the technical solution is made of diamond material, and diamond as a resistor has a single-piece heat flux density of 2.5kW / cm2. With the use of gold electrodes and gold-plated heat dissipation surfaces, a strong Au-C bond is formed at the diamond / gold interface, which can well take into account the requirements of thermal conductivity and electrical conductivity.

[0008] Preferably, the whole or part of the surface of the carrier is plated with nickel and gold in sequence by electroplating or chemical plating process to form a nickel-gold composite layer, and the gold-plated heat dissipation surface of the heat load is installed on the nickel-gold composite layer of the carrier by welding. In this technical solution, the heat load has a high heat flux density, so the selected welding medium material not only has connection strength and high thermal conductivity, but also has to withstand the internal stress caused by different thermal expansion dimensions between the heat load and the carrier, so the nickel-gold composite layer is used. The nickel-gold composite layer of the carrier and the gold-plated heat dissipation surface of the heat load are fixed by welding.

[0009] Preferably, the terminal is vertically mounted on the carrier at a position away from the heat load, so as to reduce the influence of high temperature generated when the heat load is working on the wire.

[0010] Preferably, an insulating part is provided at the top of the terminal post, and the material of the insulating part is polyetheretherketone. For the purpose of heat dissipation, the terminal post is vertically placed using a copper column. The electrode at the top of the copper column is made of polyetheretherketone material, which can withstand high temperatures of 300°C and provide insulation support for the positive and negative electrode wires.

[0011] Preferably, the carrier is made of diamond / aluminum composite material or copper. The carrier uses diamond / aluminum composite material with a thermal conductivity of not less than 600W / m·K. Its structure is a double-sided aluminum sandwich diamond structure, and the thickness of the single-sided aluminum sheet is 0.2mm-0.4mm. A strong Al-C bond can also be formed at the diamond / aluminum interface, which can well take into account the thermal conductivity requirements and the internal stress changes caused by thermal expansion and contraction. The copper material has a thermal conductivity of 300W / m·K, and the heat flux density of the heat sheet does not exceed 1kW / cm 2 When the substrate is made of nickel, the carrier can be made of copper with lower cost. In addition, copper has relatively poor corrosion resistance. If it is directly plated with gold, the bonding force between the metal layer and the copper layer will be insufficient. Aluminum is a metal substrate that is difficult to plate. Since aluminum has a strong affinity with oxygen, an oxide film is easily formed on the surface of the aluminum substrate. The bonding strength of this natural oxide film and its surface covering layer is very poor. The use of nickel plating can enhance the adhesion, corrosion resistance, thermal conductivity and other properties of the coating to a certain extent, thereby improving the overall product quality. Therefore, after nickel plating on the copper and aluminum surfaces, the adhesion of the gold plating layer can be effectively increased, and the overall wear resistance and conductivity can be improved.

[0012] The beneficial effects of the present invention are:

[0013] 1. Provides a high heat flux density test heat sheet, the heat load adopts diamond resistor design, and can provide various heat flux densities required for conventional tests during the cold plate heat dissipation performance test.

[0014] 2. The carrier is made of diamond / aluminum composite material with very high thermal conductivity and a wide range of experiments; the carrier is made of copper material with low cost and high thermal conductivity, which can meet the needs of conventional experiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a front view of a test heat sheet with high heat flux density of the present invention;

[0016] Figure 2 It is a schematic diagram of the structure of the heat load of the present invention;

[0017] Figure 3 It is a top view of the test heat plate of the present invention with high heat flux density.

[0018] In the figure: 1-carrier, 2-terminal, 3-insulation, 4-wire, 5-heat load, DETAILED DESCRIPTION

[0019] The technical solution of the present invention is further described in detail below in conjunction with specific implementation methods.

[0020] In the description of the present invention, it should be noted that the directions or positional relationships indicated by terms such as “upper”, “lower”, “left”, “right”, “inside” and “outside” are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0021] A high heat flux density test heat plate comprises a carrier 1, a terminal 2 and a plurality of heat loads 5 are mounted on the carrier 1, and a plurality of wires 4 are connected between the terminal 2 and the heat load 5. The surface of the carrier 1 is plated with nickel and gold in sequence by electroplating or chemical plating process in whole or in part to form a nickel-gold composite layer 6. The heat load 5 comprises a diamond sheet 502, and a first electrode 501 and a second electrode 503 are respectively arranged at both ends of the diamond sheet 502, the first electrode 501 is made of gold, and the first electrode 501 extends and is attached to the bottom surface of the diamond sheet 502 to form a gold-plated heat dissipation surface. The gold-plated heat dissipation surface of the heat load 5 is mounted on the nickel-gold composite layer 6 of the carrier 1 by welding. The terminal 2 is vertically mounted on the carrier 1 at a position away from the heat load 5. An insulating portion 3 is provided at the top of the terminal 2, and the material of the insulating portion 3 is polyetheretherketone. For the purpose of self-heat dissipation, the terminal 2 adopts a copper column to be placed vertically. The electrode at the top of the copper column is made of polyetheretherketone material, which can withstand a high temperature of 300° C. and provide insulation support for the positive and negative electrode wires 4. The carrier 1 is made of a diamond / aluminum composite material or copper.

[0022] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A high heat flux test piece, characterized in that: The invention comprises a carrier, on which a terminal and a plurality of heat loads are mounted, and a plurality of wires are connected between the terminal and the heat loads.

2. The high heat flux test thermal sheet according to claim 1, characterized in that: The heat load comprises a diamond sheet, and a first electrode and a second electrode are respectively arranged at two ends of the diamond sheet, the first electrode is made of gold, and the first electrode extends and is attached to the bottom surface of the diamond sheet to form a gold-plated heat dissipation surface.

3. The high heat flux test thermal sheet according to claim 1, characterized in that: The whole or part of the surface of the carrier is plated with nickel and gold in sequence by electroplating or chemical plating to form a nickel-gold composite layer, and the heat load is installed on the nickel-gold composite layer by welding.

4. The high heat flux test thermal sheet according to claim 1, characterized in that: The terminal is vertically mounted on the carrier at a position away from the heat load.

5. The high heat flux test thermal sheet according to claim 1, characterized in that: An insulating portion is provided at the top of the terminal post, and the insulating portion is made of polyetheretherketone.

6. The high heat flux test piece according to claim 1, characterized in that: The carrier is made of diamond / aluminum composite material or copper.

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