Aging test device

Abstract

The invention provides an aging test device, which is applied to a test incubator, the test incubator is provided with a first temperature zone, the aging test device comprises a test board arranged in the first temperature zone, the test board is provided with a second temperature zone and a third temperature zone, and the second temperature zone and the third temperature zone are distributed at an interval; the test sample module is used for placing and electrically connecting a test sample; the first temperature control module is used for adjusting the temperature of the second temperature zone; the second temperature control module is used for adjusting the temperature of the third temperature area. When the aging test is carried out, the test control module and the test sample are interconnected through the test board, and compared with a connection mode of a low-loss high-speed cable, on one hand, the test cost is reduced, on the other hand, the high-speed signal path length and the signal loss are reduced, and the test accuracy is improved.

Description

Technical Field

[0001] The present application relates to the technical field of aging testing, and in particular to an aging testing device. Background Art

[0002] As electronic equipment in the industrial control industry and the automotive industry develops towards digital integration, the reliability requirements for electronic products such as semiconductor memory are becoming increasingly higher. After the electronic products are manufactured, they need to undergo reliability tests in the corresponding environment, such as aging tests. A test chamber (also known as a high and low temperature environment test chamber, aging test chamber, etc.) is a device used to provide a temperature environment for aging tests.

[0003] When performing aging tests on products, the test machine needs to be electrically connected to the product and the product needs to be placed in the temperature chamber of the test incubator. The incubator controls the ambient temperature of the temperature chamber to be at room temperature, low temperature (e.g. -70°C) or high temperature (e.g. 150°C) according to the set temperature parameters. At the same time, the test machine outputs a test signal to the product to make the product work in the temperature chamber, such as burning, and after the product has worked continuously for a set time, the failure degree of the product is tested to select products with early failure. At the same time, the products can be measured and classified by setting test parameters.

[0004] In the related art, the test machine is usually placed outside the temperature chamber, and the test machine needs to be connected to the products in the temperature chamber through low-loss high-speed cables. However, the cost of low-loss high-speed cables is high, resulting in high testing costs. Summary of the invention

[0005] In view of the above, it is necessary to provide an aging test device that can reduce the test cost.

[0006] An embodiment of the present application provides an aging test device, which is applied to a test incubator, the test incubator having a first temperature zone, and the aging test device includes: a test board, which is arranged in the first temperature zone, the test board is provided with a second temperature zone and a third temperature zone, and the second temperature zone and the third temperature zone are distributed at intervals; a test sample module, which is electrically connected to the test board and corresponding to the second temperature zone, the test sample module is used to place and electrically connect the test sample; the test sample module is provided with a first temperature control module, and the first temperature control module is used to adjust the temperature of the second temperature zone; a test control module, which is electrically connected to the test board and corresponding to the third temperature zone; the test control module is provided with a second temperature control module, and the second temperature control module is used to adjust the temperature of the third temperature zone.

[0007] The test sample module and the test control module are arranged on the test board, and the temperature of the second temperature zone where the test sample module is located is adjusted by the first temperature control module, and the temperature of the third temperature zone where the test control module is located is adjusted by the second temperature control module. When performing the aging test, the test control module outputs a control signal to the test sample, the test temperature box adjusts the overall temperature in the first temperature zone, and the first temperature control module can adjust the temperature of the second temperature zone so that the peripheral temperature of the test sample reaches the temperature value required by the test conditions. In addition, the test control module and the test sample are interconnected through the test board. Compared with the connection method of low-loss high-speed cables, on the one hand, the test cost is reduced, and on the other hand, the signal loss is reduced, thereby improving the accuracy of the test.

[0008] During the aging test, the second temperature control module can adjust the temperature of the third temperature zone so that the peripheral temperature of the test control module does not reach the temperature value required by the test conditions. Even if the temperature of the test control module is closer to normal temperature than the temperature of the test sample module, the impact of high and low temperature environments on the test control module is reduced, thereby improving the accuracy of the test and reducing the cost of the test control module.

[0009] On the other hand, when the test sample needs to change temperature (for example, from low temperature to high temperature, from high temperature to low temperature, etc.), the second temperature zone and the third temperature zone both perform temperature adjustment in the local space. Compared with the first temperature zone, the second temperature zone and the third temperature zone can reach the target temperature value more quickly, thereby quickly completing the temperature change for testing and improving test efficiency.

[0010] In one of the embodiments, the test temperature chamber is used to adjust the first temperature zone to a first high temperature test temperature when performing a high temperature test; the first temperature control module is used to adjust the second temperature zone to a second high temperature test temperature when performing a high temperature test; the second temperature control module is used to adjust the third temperature zone to a third high temperature test temperature when performing a high temperature test; the second high temperature test temperature is greater than the third high temperature test temperature, and the first high temperature test temperature is less than or equal to the third high temperature test temperature.

[0011] In one of the embodiments, the test temperature chamber is used to adjust the first temperature zone to a first low-temperature test temperature when performing a low-temperature test; the first temperature control module is used to adjust the second temperature zone to a second low-temperature test temperature when performing a low-temperature test; the second temperature control module is used to adjust the third temperature zone to a third low-temperature test temperature when performing a low-temperature test; the second low-temperature test temperature is lower than the third low-temperature test temperature, and the first low-temperature test temperature is lower than the third low-temperature test temperature.

[0012] In one embodiment, the first temperature control module includes a first heating element and a first temperature sensor, the first heating element is used to adjust the temperature of the second temperature zone by heating; the first temperature sensor is used to detect the temperature of the second temperature zone.

[0013] In one embodiment, the first temperature control module further includes a first heat conducting member, and the first heat conducting member is disposed between the first heating member, the first temperature sensor and the second temperature zone.

[0014] In one embodiment, the test sample module includes a test seat, the test seat is provided with a sample placement area, and the sample placement area is used to place and electrically connect the test sample; the first temperature control module is arranged corresponding to the sample placement area so that the sample placement area forms a second temperature zone.

[0015] In one embodiment, the second temperature control module includes a second heating element and a second temperature sensor, the second heating element is used to adjust the temperature of the third temperature zone by heating; the second temperature sensor is used to detect the temperature of the third temperature zone.

[0016] In one embodiment, the second temperature control module further includes a second heat conducting member, and the second heat conducting member is disposed between the second heating member, the second temperature sensor and the third temperature zone.

[0017] In one embodiment, the test board is provided with a first device area, the first device area is used for arranging devices that are not resistant to a wide temperature range, and the first device area forms a third temperature zone.

[0018] In one embodiment, it further includes a communication module and a power module, both of which are arranged outside the test incubator; the communication module and the power module are both electrically connected to the test board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of the aging test device of the first embodiment of the present application when performing an aging test.

[0020] Figure 2 It is a schematic diagram of the structure of the aging test device of the first embodiment of the present application when placed in a test temperature box.

[0021] Figure 3 It is a temperature curve diagram of the first temperature zone, the second temperature zone and the third temperature zone of the first embodiment of the present application in a continuous test scenario, wherein the test scenarios include normal temperature test, normal temperature to low temperature, low temperature test, low temperature to high temperature and high temperature test.

[0022] Figure 4 It is a structural schematic diagram of the aging test device of the first embodiment of the present application.

[0023] Figure 5 It is a schematic diagram of the structure of the aging test device of the first embodiment of the present application when performing an automotive UFS aging test.

[0024] Figure 6 It is a structural schematic diagram of an aging test device according to the second embodiment of the present application.

[0025] Main component symbols

[0026] Test oven 100

[0027] First temperature zone 101

[0028] Aging test device 200

[0029] Second temperature zone 201

[0030] The third temperature zone 202

[0031] Test board 10

[0032] Test sample module 20

[0033] Test socket 21

[0034] Stakeout area 22

[0035] The third mold 23

[0036] Test control module 30

[0037] The first temperature control module 40

[0038] The first heating element 41

[0039] First temperature sensor 42

[0040] Heating control panel 43

[0041] The first heat conducting member 44

[0042] First mold 45

[0043] Second mold 46

[0044] First heat sink 47

[0045] The second temperature control module 50

[0046] The second heating element 51

[0047] Second temperature sensor 52

[0048] Second heat conducting member 53

[0049] Fourth mold 54

[0050] Second heat sink 55

[0051] Communication module 60

[0052] Power module 70

[0053] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0054] In the description of the embodiments of the present application, words such as "exemplary", "or", "for example" and the like are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary", "or", "for example" and the like is intended to present related concepts in a concrete manner.

[0055] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the present application. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0056] It should also be noted that the terms "first" and "second" in the specification, claims and drawings of this application are used to distinguish similar objects, rather than to describe a specific order or sequence. The method disclosed in the embodiments of this application or the method shown in the flowchart includes one or more steps for implementing the method. Without departing from the scope of the claims, the execution order of multiple steps can be interchanged with each other, and some steps can also be deleted.

[0057] After the electronic products are manufactured, they need to be tested for reliability in the corresponding environment. Taking semiconductor memory as an example, in order to evaluate the reliability of semiconductor memory, it is usually necessary to perform aging test on the semiconductor memory in the corresponding environment (such as normal temperature, low temperature and high temperature, etc.). The aging test can select the semiconductor memory with early failure, and the semiconductor memory can also be measured and classified by setting the test parameters.

[0058] A test chamber (also known as a high and low temperature environment test chamber, aging test chamber, etc.) is a device used to provide a wide temperature environment for aging testing. When performing an aging test, the product can be placed in a temperature chamber, and the ambient temperature of the temperature chamber can be set at room temperature, low temperature (e.g. -70°C) or high temperature (e.g. 150°C). After a preset time period, the aging test is completed and the product is taken out of the temperature chamber.

[0059] Taking high temperature testing as an example, the existing semiconductor memory reliability demonstration test (RDT, Reliability Demonstration Testsga) has the following implementation methods:

[0060] The first is to separate the product from the test machine. When conducting high temperature testing, the product is only placed in the temperature chamber and powered on. After a preset time period, the product is taken out, and then the test machine is connected to the product at room temperature to test and classify the product. In this way, since the product is not connected to the test machine when placed in the temperature chamber, the product cannot be burned when in a high temperature environment, making it difficult to meet higher test requirements.

[0061] The second method is to place the test machine in a temperature chamber. When conducting high temperature testing, the product and the test machine are placed in a temperature chamber together, and the product is powered. The test machine controls the product to work in the temperature chamber, and after a preset time period, the test machine and the product are taken out. This method requires the test machine to have a high adaptability to harsh temperature environments, otherwise the test machine will be affected, resulting in performance changes and affecting the test yield of the product. However, the cost of a test machine that can adapt to harsh environments is high, and there is a contradiction between test yield and test cost.

[0062] The third method is to place the test machine outside the temperature chamber. Before the high temperature test, the test machine is placed outside the temperature chamber, the product is placed inside the temperature chamber, and the product and the test machine are interconnected through a metal axis or a metal wire. During the high temperature test, the product is powered, and the test machine is connected to the product through a cable to control the product to work in the temperature chamber. After a preset time period, the product is taken out. This method requires the use of low-loss high-speed cables to connect the test machine and the product, resulting in higher testing costs. At the same time, the high-speed signal path for the interconnection between the test machine and the product is long, resulting in a higher insertion loss, which affects the accuracy of the test.

[0063] To this end, an embodiment of the present application provides an aging test device that can solve the technical problems of lower testing cost and higher accuracy.

[0064] See also Figure 1 The aging test device 200 can be applied to the test incubator 100, that is, the aging test device 200 can cooperate with the test incubator 100 to perform aging tests on the test samples. The test incubator 100 includes but is not limited to a normal temperature test incubator, a high temperature test incubator, a low temperature test incubator, and a high and low temperature test incubator. In the embodiment of the present application, a high and low temperature test incubator is used as an example. The test incubator 100 has a temperature chamber, and a first temperature zone 101 is formed in the temperature chamber. The test incubator 100 can adjust the ambient temperature of the first temperature zone 101 through preset equipment parameters.

[0065] When performing an aging test on a test sample, the aging test device 200 is connected to the test sample, and the aging test device 200 and the test sample are placed together in the first temperature zone 101 of the test oven 100. The test sample includes but is not limited to automotive electronic products, semiconductor products, integrated circuit products, etc.

[0066] See also Figure 1 and Figure 2 The aging test device 200 includes a test board 10, a test sample module 20 and a test control module 30. The test sample module 20 and the test control module 30 are both arranged on the test board 10. The test sample module 20 is provided with a first temperature control module 40, and the test control module 30 is provided with a second temperature control module 50.

[0067] The test board 10 has a second temperature zone 201 and a third temperature zone 202 . The second temperature zone 201 and the third temperature zone 202 are respectively located at different positions on the test board 10 , and there is a gap between the second temperature zone 201 and the third temperature zone 202 .

[0068] The test sample module 20 is arranged corresponding to the second temperature zone 201, that is, the test sample module 20 is mainly affected by the temperature of the first temperature zone 101 or the second temperature zone 201, and the test sample module 20 is electrically connected to the test board 10. The test sample module 20 is used to place the test sample, and when the test sample is placed on the test sample module 20, the test sample module 20 is electrically connected to the test sample, so that the test sample is electrically connected to the test board 10.

[0069] The test control module 30 is set corresponding to the third temperature zone 202, that is, the test control module 30 is mainly affected by the temperature of the first temperature zone 101 or the third temperature zone 202, and the test control module 30 is electrically connected to the test board 10. When the test sample is placed on the test specimen module 20, the test control module 30 is electrically connected to the test sample through the test board 10, thereby realizing signal transmission with the test sample to control the operation of the test sample.

[0070] The first temperature control module 40 is disposed corresponding to the second temperature zone 201 , and is used to adjust the temperature of the second temperature zone 201 to a preset range, so as to adjust the temperature difference between the second temperature zone 201 and the first temperature zone 101 .

[0071] The second temperature control module 50 is disposed corresponding to the third temperature zone 202 , and is used to adjust the temperature of the second temperature zone 201 to a preset range, so as to adjust the temperature difference between the third temperature zone 202 and the first temperature zone 101 .

[0072] It can be understood that the test incubator 100 usually regulates the temperature of the first temperature zone 101 by negative feedback regulation, and the test incubator 100 is equipped with a temperature sensor, a heating device, and a cooling device. The test incubator 100 detects the real-time temperature of the first temperature zone 101 through the temperature sensor, and the difference between the real-time temperature and the preset first target temperature, and can change the temperature of the first temperature zone 101 through the heating device or the cooling device, so that the temperature difference between the real-time temperature of the first temperature zone 101 and the first target temperature is maintained within a reasonable range.

[0073] When the test incubator 100 adjusts the temperature of the first temperature zone 101, it adjusts the overall temperature of the entire space of the first temperature zone 101. The spaces of the second temperature zone 201 and the third temperature zone 202 are both smaller than the space of the first temperature zone 101, that is, although the second temperature zone 201 and the third temperature zone 202 are in the first temperature zone 101, the second temperature zone 201 and the third temperature zone 202 are respectively local areas in the first temperature zone 101, and the temperature of the second temperature zone 201 is affected by the first temperature zone 101, while the first temperature control module 40 can adjust the temperature of the first temperature zone 101, so that there is a temperature difference between the second temperature zone 201 and the first temperature zone 101. Similarly, while the temperature of the third temperature zone 202 is affected by the first temperature zone 101, the second temperature control module 50 can adjust the temperature of the third temperature zone 202, so that there is a temperature difference between the third temperature zone 202 and the first temperature zone 101.

[0074] The aging test device 200 provided in the embodiment of the present application is configured by arranging the test sample module 20 and the test control module 30 on the test board 10, and using the first temperature control module 40 to adjust the temperature of the second temperature zone 201 where the test sample module 20 is located, and using the second temperature control module 50 to adjust the temperature of the third temperature zone 202 where the test control module 30 is located. When performing the aging test, the test control module 30 outputs a control signal to the test sample, the test oven 100 adjusts the overall temperature in the first temperature zone 101, and the first temperature control module 40 can adjust the temperature of the second temperature zone 201 so that the surrounding temperature of the test sample reaches the temperature value required by the test conditions, and the test control module 30 and the test sample are interconnected through the test board 10. Compared with the connection method of low-loss high-speed cables, on the one hand, the test cost is reduced, and on the other hand, the high-speed signal path length and signal loss are reduced, thereby improving the accuracy of the test.

[0075] During the aging test, the second temperature control module 50 can adjust the temperature of the third temperature zone 202 so that the peripheral temperature of the test control module 30 does not reach the temperature value required by the test conditions. Even if the temperature of the test control module 30 is closer to normal temperature than the temperature of the test sample module 20, the impact of high and low temperature environments on the test control module 30 is reduced, thereby improving the accuracy of the test and reducing the cost of the test control module 30.

[0076] On the other hand, when the temperature chamber needs to be changed in temperature (for example, from normal temperature to low temperature, from low temperature to high temperature, etc.), the second temperature zone 201 and the third temperature zone 202 both perform temperature adjustment in the local space. Compared with the first temperature zone 101, the second temperature zone 201 and the third temperature zone 202 can reach the target temperature value more quickly, thereby quickly completing the temperature change for testing and improving test efficiency.

[0077] See also Figure 2 and Figure 3 In one embodiment of the present application, the test oven 100 is used to adjust the first temperature zone 101 to a first high temperature test temperature when performing a high temperature (eg, 108° C.) test.

[0078] The first temperature control module 40 is used to adjust the second temperature zone 201 to a second high temperature test temperature when performing a high temperature test. The second high temperature test temperature is the ambient temperature value required for the high temperature test, and the second high temperature test temperature can be set according to the requirements of the actual test. The second high temperature test temperature is greater than the first high temperature test temperature.

[0079] The second temperature control module 50 is used to adjust the third temperature zone 202 to a third high temperature test temperature when performing a high temperature test, wherein the third high temperature test temperature is greater than or equal to the first high temperature test temperature and is less than the second high temperature test temperature.

[0080] It can be understood that when performing a high temperature test, the first temperature control module 40 adjusts the second temperature zone 201 to the second high temperature test temperature so that the peripheral temperature of the test sample meets the corresponding test requirements. The test incubator 100 adjusts the first temperature zone 101 to the first high temperature test temperature so that the temperature of the first temperature zone 101 is lower than the temperature of the second temperature zone 201, so that the first temperature zone 101 achieves a cooling and heat dissipation effect, and reduces the impact of the high temperature of the second temperature zone 201 on other areas. At the same time, the second temperature control module 50 adjusts the third temperature zone 202 to the third high temperature test temperature so that the peripheral temperature of the test control module 30 is lower than the peripheral temperature of the test sample, reducing the impact of the high temperature environment on the test control module 30.

[0081] On the other hand, the temperature of the first temperature zone 101 is lower than that of the second temperature zone 201, and the first temperature zone 101 can be cooled and dissipated, so the third temperature zone 202 can be regulated by the temperature of the first temperature zone 101, that is, the temperature change of the third temperature zone 202 during cooling can be adjusted by the test temperature box 100, and the second temperature control module 50 does not need to be adjusted at this time. In this way, the second temperature control module 50 does not need to be equipped with a refrigeration device or a heat dissipation device, thereby reducing the cost and space occupation of the second temperature control module 50.

[0082] In one implementation manner of this embodiment, the third high temperature test temperature is greater than the first high temperature test temperature.

[0083] When conducting a high temperature test, the overall temperature of the first temperature zone 101 is closer to normal temperature, the temperature of the second temperature zone 201 reaches the highest temperature, and the temperature of the third temperature zone 202 is between normal temperature and the highest temperature, thereby reducing the temperature difference between the second temperature zone 201 and the third temperature zone 202, reducing the impact of the lower temperature of the third temperature zone 202 on the second temperature zone 201, and allowing the second temperature zone 201 to achieve a better heating effect.

[0084] In another implementation of this embodiment, the third high temperature test temperature is equal to the first high temperature test temperature.

[0085] When conducting high temperature testing, the overall temperature of the first temperature zone 101 and the temperature of the third temperature zone 202 are closer to normal temperature, and the temperature of the second temperature zone 201 reaches the highest temperature, thereby increasing the heat dissipation effect of the first temperature zone 101 and the third temperature zone 202, reducing the impact of the ambient temperature on the test control module 30 during high temperature testing, and achieving better testing results.

[0086] In another implementation of this embodiment, when the second high temperature test temperature is less than the preset temperature setting value, the third high temperature test temperature is greater than the first high temperature test temperature. When the second high temperature test temperature is greater than or equal to the preset temperature setting value, the third high temperature test temperature is equal to the first high temperature test temperature.

[0087] It can be understood that when the second high temperature test temperature is less than the preset temperature setting value, the aging test has a lower numerical requirement for the first high temperature test temperature, and the temperature difference between the second temperature zone 201 and the third temperature zone 202 can be appropriately reduced. When the second high temperature test temperature is greater than or equal to the preset temperature setting value, the aging test has a higher numerical requirement for the first high temperature test temperature, and the temperature difference between the second temperature zone 201 and the third temperature zone 202 needs to be increased.

[0088] In one embodiment of the present application, the test incubator 100 is used to adjust the first temperature zone 101 to a first low temperature test temperature when performing a low temperature (eg, -45° C.) test.

[0089] The first temperature control module 40 is used to adjust the second temperature zone 201 to a second low temperature test temperature when performing a low temperature test. The second low temperature test temperature is the ambient temperature value required for the low temperature test, and the second low temperature test temperature can be set according to the requirements of the actual test. The second low temperature test temperature is greater than or equal to the first low temperature test temperature.

[0090] The second temperature control module 50 is used to adjust the third temperature zone 202 to a third low temperature test temperature when performing a low temperature test, wherein the third low temperature test temperature is greater than the second low temperature test temperature.

[0091] It can be understood that when performing a low-temperature test, the first temperature control module 40 adjusts the second temperature zone 201 to the second low-temperature test temperature so that the peripheral temperature of the test sample reaches the corresponding test requirements. The test incubator 100 adjusts the first temperature zone 101 to the first low-temperature test temperature so that the temperature of the first temperature zone 101 is less than or equal to the temperature of the second temperature zone 201, even if the temperature between the first temperature zone 101 and the second temperature zone 201 is close. At the same time, the second temperature control module 50 adjusts the third temperature zone 202 to the third low-temperature test temperature so that the peripheral temperature of the test control module 30 is greater than the peripheral temperature of the test sample, thereby reducing the influence of the ambient temperature on the test control module 30 during the low-temperature test.

[0092] On the other hand, the first temperature zone 101 itself can cool down and dissipate heat, so the second temperature zone 201 can follow the temperature control of the first temperature zone 101, that is, the temperature change of the first temperature zone 101 during cooling can be adjusted by the test temperature box 100, and the first temperature control module 40 does not need to be adjusted at this time. In this way, the first temperature control module 40 does not need to be equipped with a refrigeration device or a heat dissipation device, thereby reducing the cost and space occupation of the first temperature control module 40.

[0093] It can be understood that the embodiment of the present application sets the temperature relationship among the first temperature zone 101, the second temperature zone 201 and the third temperature zone 202 so that the first temperature zone 101 itself can provide cooling and heat dissipation functions, thereby adjusting the temperature of the third temperature zone 202 in high temperature tests and adjusting the temperature of the first temperature zone 101 in low temperature tests, so that the first temperature control module 40 and the second temperature control module 50 do not need to be equipped with heat dissipation devices or refrigeration devices, thereby reducing the cost of the aging test device 200 and the space occupied by parts.

[0094] See also Figure 2 and Figure 4 In one embodiment of the present application, the first temperature control module 40 includes a first heating element 41 and a first temperature sensor 42. The first heating element 41 and the first temperature sensor 42 are both set corresponding to the second temperature zone 201. The first heating element 41 includes but is not limited to a ceramic heating plate. The first heating element 41 can adjust the temperature of the second temperature zone 201 by heating. The first temperature sensor 42 is used to detect the temperature of the second temperature zone 201.

[0095] It can be understood that the first heating element 41 and the first temperature sensor 42 form a negative feedback regulation system. When performing temperature adjustment, the first heating element 41 can heat the second temperature zone 201, and the first temperature sensor 42 can detect the real-time temperature of the second temperature zone 201. Through the difference between the real-time temperature of the second temperature zone 201 and the preset second target temperature, the power of the first heating element 41 can be changed to maintain the temperature difference between the real-time temperature of the second temperature zone 201 and the second target temperature within a reasonable range. In this case, it can be regarded that the second temperature zone 201 has reached the second target temperature.

[0096] In one embodiment, the first temperature control module 40 further includes a heating control board 43, and the first heating element 41 and the first temperature sensor 42 are both electrically connected to the heating control board 43. The heating control board 43 is provided with a first temperature control module, which includes but is not limited to a control chip, and the first temperature control module can control the working mode of the first heating element 41 through programming. For example, the first temperature control module uses a PWM (pulse width modulation) pin to control the heating power of the first heating element 41, and adjusts the PWM output according to the test result of the first temperature sensor 42.

[0097] In one embodiment, the first temperature control module 40 further includes a first heat conducting member 44, which is disposed between the first heating member 41, the first temperature sensor 42 and the second temperature zone 201, and is used to accelerate heat conduction between the first heating member 41, the first temperature sensor 42 and the second temperature zone 201. The first heat conducting member 44 includes but is not limited to heat-conducting silica gel.

[0098] In one embodiment, the first temperature control module 40 further includes a first mold 45 and a second mold 46, which are combined to form a shell structure of the first temperature control module 40. The material of the first mold 45 includes but is not limited to plastic material, and the material of the second mold 46 includes but is not limited to brass material.

[0099] Specifically, the first mold 45 is provided with a first cavity, and the first cavity passes through the first mold 45 to form a cavity opening on one side facing the test board 10. The first heating element 41, the first temperature sensor 42, the heating control board 43, the first heat conducting element 44 and the second mold 46 are all arranged in the first cavity.

[0100] The heating control plate 43 is fixed to the side of the first cavity away from the test board 10, and the first heating element 41 and the first temperature sensor 42 are arranged on the side of the heating control plate 43 close to the test board 10. The first heat conducting element 44 is arranged on the side of the first heating element 41 close to the second temperature zone 201, and a plurality of first temperature sensors 42 are arranged, and the plurality of first temperature sensors 42 are distributed around the first heating element 41 and the first heat conducting element 44. The second mold 46 blocks the cavity opening of the first cavity, and the second mold 46 is between the first heat conducting element 44 and the second temperature zone 201.

[0101] It can be understood that the thermally conductive silicone of the first heat conducting member 44 and the brass material of the second mold 46 are used to increase the thermal conductivity between the first temperature control module 40 and the second temperature zone 201 , thereby improving the temperature adjustment speed and the temperature adjustment accuracy.

[0102] In one embodiment of the present application, the test sample module 20 includes a test seat 21, and the test seat 21 is installed on the test board 10. The test seat 21 is provided with a sample placement area 22, and the sample placement area 22 is used to place the test sample. When the test sample is placed in the sample placement area 22, the metal probe of the test seat 21 can contact and electrically connect to the test sample, so that the test sample is electrically connected to the test board 10.

[0103] It can be understood that the selection and structure of the test seat 21 can be set according to the model or structure of the test sample, and this application does not limit this.

[0104] Specifically, the first temperature control module 40 is disposed corresponding to the lofting area 22 , that is, the first heat conductor 44 is disposed corresponding to the lofting area 22 , so that the heat of the first heating element 41 can be conducted to the lofting area 22 , so that the lofting area 22 forms the second temperature zone 201 .

[0105] In one embodiment, the test sample module 20 further includes a third mold 23, the material of the third mold 23 includes but is not limited to brass. The third mold 23 is detachably connected to the first temperature control module 40, that is, the third mold 23 is detachably connected to the first mold 45 or the second mold 46. The third mold 23 is sleeved and fixed on the test seat 21, and the third mold 23 is provided with a connecting port, which passes through the third mold 23 and is connected to the sample area 22, so that the test sample can be placed in the sample area 22.

[0106] When performing the aging test, the test sample is placed in the communication port and the sample placement area 22, so that the test sample is in the second temperature zone 201, and the third mold 23 is in contact with the second mold 46. The heat of the first heating element 41 is transferred to the second temperature zone 201 through the first heat conducting element 44 and the second mold 46, and at the same time, the heat is also transferred to the second temperature zone 201 through the second mold 46 and the third mold 23, so as to improve the temperature adjustment speed and improve the temperature adjustment accuracy.

[0107] In one embodiment of the present application, the test control module 30 includes a test core module, which is arranged and electrically connected to the test board 10. The test core module can be electrically connected to the test sample through the test board 10, so as to control the test sample to work, such as burning work.

[0108] It can be understood that the test core module is a device that is not resistant to a wide temperature range. A device that is not resistant to a wide temperature range refers to an electronic device whose performance will be seriously affected in harsh environments (such as the temperature of the second temperature zone 201 during high temperature testing and the temperature of the second temperature zone 201 during low temperature testing).

[0109] Correspondingly, a wide temperature resistant device refers to an electronic device that can operate in harsh environments (such as the temperature of the second temperature zone 201 during high temperature testing and the temperature of the second temperature zone 201 during low temperature testing), such as test samples, some resistors, some capacitors, etc.

[0110] Specifically, the test board 10 is provided with a first device area and a second device area, which are respectively located on both sides of the test board 10, wherein the first device area is provided for devices that are not resistant to wide temperature, such as test core modules, etc., and the second device area is provided for devices that are resistant to wide temperature, such as individual resistors and capacitors, etc. It can be understood that the space of the first device area and the space occupied by the devices that are not resistant to wide temperature themselves form the third temperature zone 202.

[0111] The second temperature control module 50 includes a second heating element 51 and a second temperature sensor 52. The second heating element 51 and the second temperature sensor 52 are both arranged corresponding to the third temperature zone 202. The second heating element 51 includes but is not limited to a ceramic heating plate. The second heating element 51 can adjust the temperature of the third temperature zone 202 by heating. The second temperature sensor 52 is used to detect the temperature of the third temperature zone 202.

[0112] It can be understood that the second heating element 51 and the second temperature sensor 52 form a negative feedback regulation system. When performing temperature adjustment, the second heating element 51 can heat the third temperature zone 202, and the second temperature sensor 52 can detect the real-time temperature of the third temperature zone 202. Through the difference between the real-time temperature of the third temperature zone 202 and the preset third target temperature, the power of the second heating element 51 can be changed to maintain the temperature difference between the real-time temperature of the third temperature zone 202 and the third target temperature within a reasonable range. In this case, it can be regarded that the third temperature zone 202 has reached the third target temperature.

[0113] In one embodiment, the second temperature control module 50 further includes a second temperature control module, and the second heating element 51 and the second temperature sensor 52 are both electrically connected to the second temperature control module. The second temperature control module includes but is not limited to a control chip, and the second temperature control module can control the working mode of the second heating element 51 by programming. For example, the second temperature control module uses a PWM (pulse width modulation) pin to control the heating power of the second heating element 51, and adjusts the PWM output according to the test result of the second temperature sensor 52.

[0114] In this embodiment, the second temperature control module is disposed in the first device area of ​​the test board 10 , and the second temperature control module and the test core module together serve as the non-wide temperature resistant device of the test board 10 .

[0115] In one embodiment, the second temperature control module 50 further includes a second heat conducting member 53, which is disposed between the second heating member 51, the second temperature sensor 52 and the third temperature zone 202, and is used to accelerate heat conduction between the second heating member 51, the second temperature sensor 52 and the third temperature zone 202. The second heat conducting member 53 includes but is not limited to heat-conducting silica gel.

[0116] In one embodiment, the second temperature control module 50 further includes a fourth mold 54, and the fourth mold 54 is a shell structure of the second temperature control module 50. The material of the fourth mold 54 includes but is not limited to plastic material.

[0117] Specifically, the fourth mold 54 is fixed to the test board 10, and the fourth mold 54 is provided with a second cavity, the second cavity penetrates the fourth mold 54 toward the test board 10 to form a cavity opening, and the third temperature zone 202 overlaps with the cavity opening of the second cavity. The second heating element 51, the second temperature sensor 52, the second heat conducting element 53, the second temperature control module and the test core module are all arranged in the second cavity.

[0118] The second heating element 51 is fixed to a side of the second cavity away from the test board 10 , the second heat conductive element 53 is arranged on a side of the second heating element 51 close to the test board 10 , the third temperature zone 202 is located on a side of the second heat conductive element 53 close to the test board 10 , and the second temperature sensor 52 is arranged on one side of the third temperature zone 202 .

[0119] It can be understood that when the third temperature zone 202 needs to be heated, such as for low temperature testing, the second heating element 51 can transfer heat to the third temperature zone 202 through the second heat conducting element 53 , thereby adjusting the temperature of the third temperature zone 202 .

[0120] In one embodiment of the present application, the aging test device 200 is further configured with a temperature calibration module, including but not limited to a thermocouple calibrator. Before the aging test, the temperature adjustment of the first temperature control module 40 and the second temperature control module 50 can be calibrated.

[0121] The temperature calibration method can be: testing in different test case environments to obtain the corresponding relationship between the temperature of the specified temperature zone and the corresponding temperature sensor reading. In the temperature calibration, a K-type thermocouple is used to perform multi-point measurements on the specified temperature zone. For example, when the temperature of the second temperature zone 201 is calibrated, multi-point measurements can be performed between the second mold 46 and the second temperature zone 201; when the temperature of the third temperature zone 202 is calibrated, multi-point measurements can be performed between the second heat conductor 53 and the third temperature zone 202.

[0122] It can be understood that by calibrating the temperature adjustment of the first temperature control module 40 and the second temperature control module 50 through the temperature calibration module, the test error caused by the spatial distance between the second temperature zone 201, the third temperature zone 202 and the corresponding temperature sensors can be reduced, thereby improving the accuracy of temperature adjustment.

[0123] See also Figure 4 and Figure 5 In one embodiment of the present application, the aging test device 200 also includes a communication module 60 and a power module 70, and the communication module 60 and the power module 70 are both arranged on the outside of the test incubator 100. The communication module 60 and the power module 70 are electrically connected to the test board 10 through cables, respectively. Among them, the communication module 60 connects the test control module 30 and the test sample through the test board 10, and can obtain the real-time parameters of the test control module 30 and the test sample, and upload them to the server for the staff to analyze and manage the test data of the test sample. The power module 70 is used to supply power to the communication module 60, the test control module 30 and the test sample, as well as various other electronic devices on the test board 10.

[0124] In one application scenario, taking the aging test of automotive UFS as an example, the automotive product test temperature requirement is -45 to 108°C. The test board 10 can use a BIB (Burn In Board) test board, the test socket 21 of the test sample module 20 can use a UFS test socket 21, and the test core module of the test control module 30 can use a 3350 chip.

[0125] The area where the automotive-grade UFS is placed in the test sample module 20 forms a second temperature zone 201 . The maximum temperature of the second temperature zone 201 can be controlled at about 108° C., and the minimum temperature of the second temperature zone 201 can be controlled at about -45° C.

[0126] The area where the 3350 chip is arranged on the test board 10 forms a third temperature zone 202 . The maximum temperature of the third temperature zone 202 can be controlled at about 50° C., and the minimum temperature of the second temperature zone 201 can be controlled at about 0° C.

[0127] The test sample module 20 , the test control module 30 and the test sample form a DUT (Device under test), and a test board 10 can be equipped with n DUTs, where n is 40. The test board 10 can be loaded into a designated test oven 100 .

[0128] The test oven 100 includes a normal temperature cabinet and a LS407 high and low temperature oven, wherein 8 test boards 10 are loaded in the normal temperature cabinet, and 12 test boards 10 can be loaded in the LS407 high and low temperature oven. The normal temperature cabinet is set at 25°C corresponding to the first temperature zone 101, and the LS407 high and low temperature oven is set at -55 or 25°C corresponding to the first temperature zone 101.

[0129] The communication module 60 and the power module 70 are arranged outside the test incubator 100, the power module 70 is connected to the communication module 60 via a cable, and the communication module 60 is connected to the test board 10 via a gold finger connector. In addition, the test board 10 is connected to the communication module 60 via a CAN bus, the communication module 60 communicates with the switch via the TCP / IP protocol, and the switch communicates with the MPS (Master Production Schedule) server via the TCP / IP protocol.

[0130] See also Figure 6 In another embodiment of the present application, the first temperature control module 40 further includes a first heat sink 47, and the first heat sink 47 is arranged corresponding to the second temperature zone 201, and the first heat sink 47 is used to adjust the temperature of the second temperature zone 201 by heat dissipation.

[0131] It can be understood that the first heat sink 47 can reduce the temperature of the second temperature zone 201 and accelerate the cooling rate of the second temperature zone 201 .

[0132] In another embodiment of the present application, the second temperature control module 50 further includes a second heat sink 55 , which is disposed corresponding to the third temperature zone 202 , and is used to adjust the temperature of the third temperature zone 202 by heat dissipation.

[0133] It can be understood that the second heat sink 55 can reduce the temperature of the third temperature zone 202 and accelerate the cooling rate of the third temperature zone 202 .

[0134] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the preferred embodiments, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. An aging test device, characterized in that: Applied to a test incubator, the test incubator has a first temperature zone, and the aging test device comprises: A test board is arranged in the first temperature zone, the test board is provided with a second temperature zone and a third temperature zone, and the second temperature zone and the third temperature zone are spaced apart; A test sample module, electrically connected to the test board and arranged corresponding to the second temperature zone, the test sample module is used to place and electrically connect the test sample; the test sample module is provided with a first temperature control module, the first temperature control module is used to adjust the temperature of the second temperature zone; A test control module is electrically connected to the test board and is arranged corresponding to the third temperature zone; the test control module is provided with a second temperature control module, and the second temperature control module is used to adjust the temperature of the third temperature zone.

2. The aging test device according to claim 1, characterized in that: The test temperature box is used to adjust the first temperature zone to a first high temperature test temperature when performing a high temperature test; The first temperature control module is used to adjust the second temperature zone to a second high temperature test temperature when performing a high temperature test; The second temperature control module is used to adjust the third temperature zone to a third high temperature test temperature when performing a high temperature test; The second high temperature test temperature is greater than the third high temperature test temperature, and the first high temperature test temperature is less than or equal to the third high temperature test temperature.

3. The aging test device according to claim 1, characterized in that: The test incubator is used to adjust the first temperature zone to a first low temperature test temperature when performing a low temperature test; The first temperature control module is used to adjust the second temperature zone to a second low temperature test temperature when performing a low temperature test; The second temperature control module is used to adjust the third temperature zone to a third low temperature test temperature when performing a low temperature test; The second low temperature test temperature is lower than the third low temperature test temperature, and the first low temperature test temperature is lower than the third low temperature test temperature.

4. The aging test device according to claim 1, characterized in that: The first temperature control module includes a first heating element and a first temperature sensor. The first heating element is used to adjust the temperature of the second temperature zone by heating; the first temperature sensor is used to detect the temperature of the second temperature zone.

5. The aging test device according to claim 4, characterized in that: The first temperature control module further includes a first heat conducting member, which is disposed between the first heating member, the first temperature sensor and the second temperature zone.

6. The aging test device according to claim 1, characterized in that: The test sample module includes a test seat, which is provided with a sample placement area for placing and electrically connecting the test sample; the first temperature control module is arranged corresponding to the sample placement area so that the sample placement area forms the second temperature zone.

7. The aging test device according to claim 1, characterized in that: The second temperature control module includes a second heating element and a second temperature sensor. The second heating element is used to adjust the temperature of the third temperature zone by heating; and the second temperature sensor is used to detect the temperature of the third temperature zone.

8. The aging test device according to claim 7, characterized in that: The second temperature control module further includes a second heat conducting member, and the second heat conducting member is disposed between the second heating member, the second temperature sensor and the third temperature zone.

9. The aging test device according to claim 1, characterized in that: The test board is provided with a first device area, the first device area is for arranging devices that are not resistant to a wide temperature range, and the first device area forms the third temperature zone.

10. The aging test device according to claim 1, characterized in that: It also includes a communication module and a power supply module, and the communication module and the power supply module are both arranged outside the test incubator; the communication module and the power supply module are both electrically connected to the test board.

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