Temperature measuring device, temperature adjusting device, electronic component processing device, and electronic component testing device

Abstract

The invention provides a temperature measuring device capable of improving the sensing responsiveness of a temperature sensor. The temperature measuring device (8) measures the temperature of the DUT (300). The temperature measuring device (8) is provided with a first heat transfer member (73) thermally connected to the DUT (300), and a temperature sensor (812) in contact with the first heat transfer member (73), and the first heat transfer member (73) is a sheet-like member extending in the horizontal direction.

Description

Technical Field

[0001] The present invention relates to a temperature measuring device, a temperature regulating device, an electronic component processing device and an electronic component testing device. Background Art

[0002] In order to control the temperature of IC devices, a push rod having a thermostat composed of a heater and a cooler is known (for example, see Patent Document 1). In addition, a temperature sensor is provided on the push rod, and the operation of the heater and the cooler is controlled based on the measurement result of the temperature sensor, so that the IC device is maintained at a given temperature. Prior Art Literature Patent Literature

[0003] Patent Document 1: International Publication No. 2009 / 057203 Summary of the invention Problems to be solved by the invention

[0004] In the above prior art push rod, if the heater and the cooler are far away from the IC device, the temperature adjustment performance is reduced. On the other hand, if the thermostat is as close to the IC device as possible, the temperature sensor cannot be arranged between the thermostat and the IC device, and there is a problem that the sensing responsiveness of the temperature sensor is reduced.

[0005] An object of the present invention is to provide a temperature measuring device, a temperature adjusting device, an electronic component processing device, and an electronic component testing device capable of improving the sensing responsiveness of a temperature sensor. Means for solving problems

[0006] [1] A first aspect of the present invention is a temperature measuring device that measures the temperature of a DUT or a DUT accommodated in a carrier, the temperature measuring device comprising: a first heat transfer member that is thermally connected to the DUT or the carrier; and a temperature sensor that is in contact with the first heat transfer member, wherein the first heat transfer member is a sheet-like member extending along a first direction.

[0007] [2] A second aspect of the present invention may be that, in the temperature measuring device of aspect 1, the temperature measuring device includes a first biasing member for biasing the temperature sensor toward the first heat transfer member, and the first biasing member biases the temperature sensor in a direction substantially orthogonal to the first direction.

[0008] [3] A third aspect of the present invention may be that, in the temperature measuring device of aspect 1 or 2, the first heat transfer member is a sheet-shaped member that diffuses heat transferred from the DUT or the carrier preferentially in the first direction.

[0009] [4] A fourth aspect of the present invention may be the temperature measuring device according to any one of aspects 1 to 3, wherein the first heat transfer member is a graphite sheet.

[0010] [5] A fifth aspect of the present invention may be the temperature measuring device according to any one of aspects 1 to 4, wherein the temperature sensor is disposed on the opposite side of the first heat transfer member from the DUT or the carrier.

[0011] [6] Aspect 6 of the present invention may be that, in the temperature measuring device according to any one of aspects 1 to 5, the first direction is a direction substantially parallel to the extending direction of the main surface of the DUT or the carrier.

[0012] [7] A seventh aspect of the present invention may be the temperature measuring device according to any one of aspects 1 to 6, wherein the temperature measuring device includes a heat insulating member covering the temperature sensor.

[0013] [8] According to an eighth aspect of the present invention, in the temperature measuring device according to the seventh aspect, the heat insulating member may be formed of a porous material.

[0014] [9] Mode 9 of the present invention may be that, in a temperature measuring device of Mode 7 or 8, the heat insulating member is made of an elastic material, the temperature measuring device comprises a pressing member for pressing the heat insulating member toward the first heat transfer member, the heat insulating member is sandwiched between the pressing member and the first heat transfer member, and the heat insulating member applies force to the temperature sensor toward the first heat transfer member.

[0015]

[10] A tenth aspect of the present invention is a temperature adjustment device for adjusting the temperature of a DUT or a DUT accommodated in a carrier, the temperature adjustment device comprising the temperature measuring device according to any one of aspects 1 to 9.

[0016]

[11] Mode 11 of the present invention may be that, in the temperature adjustment device of mode 10, the temperature adjustment device includes a heater unit as a heating source, the heater unit includes a planar heater, and the first heat transfer member arranged on a main surface of the planar heater.

[0017]

[12] Aspect 12 of the present invention may be the temperature adjustment device according to aspect 11, wherein the first heat transfer member includes an exposed portion exposed from the planar heater, and the temperature sensor is in contact with the exposed portion.

[0018]

[13] A thirteenth aspect of the present invention may be that, in the temperature adjustment device of the eleventh or twelfth aspect, the first heat transfer member is arranged at a position closer to the DUT or the carrier than the planar heater.

[0019]

[14] A fourteenth aspect of the present invention may be that, in the temperature adjustment device according to any one of aspects 11 to 13, the temperature sensor is arranged separately from the planar heater.

[0020]

[15] Aspect 15 of the present invention may be the temperature adjustment device according to any one of aspects 11 to 14, wherein the heater unit includes a second heat transfer member disposed on the other main surface of the planar heater.

[0021]

[16] A sixteenth aspect of the present invention may be that, in the temperature adjustment device of the fifteenth aspect, the second heat transfer member is a sheet-shaped member that diffuses the heat transferred from the DUT or the carrier preferentially in the first direction.

[0022]

[17] A seventeenth aspect of the present invention may be that, in the temperature adjustment device according to any one of aspects 15 and 16, the second heat transfer member is a graphite sheet.

[0023]

[18] Mode 18 of the present invention may be that, in the temperature adjustment device according to any one of modes 15 to 17, the first heat transfer member includes an exposed portion exposed from the planar heater and the second heat transfer member, and the temperature sensor is in contact with the exposed portion.

[0024]

[19] Mode 19 of the present invention may be that, in the temperature adjustment device of any one of modes 11 to 18, the planar heater comprises: a first resin layer; a second resin layer stacked on the first resin layer; and a metal wiring interposed between the first resin layer and the second resin layer.

[0025]

[20] Aspect 20 of the present invention may be that, in the temperature adjustment device according to any one of aspects 11 to 19, the planar heater is a polyimide heater.

[0026]

[21] Aspect 21 of the present invention may be the temperature adjustment device according to any one of aspects 11 to 20, wherein the heater unit is a sheet-like laminate having a thickness of 400 μm or less.

[0027]

[22] Mode 22 of the present invention may also be that in any one of modes 11 to 21, the temperature adjustment device further includes a cooler unit as a cooling source and in contact with the heater unit, the cooler unit includes a flow path for passing the refrigerant, the cooler unit includes: a nozzle member having an injection port for injecting the refrigerant; and a cold plate, which is opposite to the injection port and is configured in a manner separated from the injection port and is blown with refrigerant from the nozzle member, the flow path includes an air gap formed between the nozzle member and the cold plate, and the refrigerant injected from the injection port passes through the air gap after reaching the cold plate.

[0028]

[23] Mode 23 of the present invention may also be that in the temperature adjustment device of mode 22, the heater unit has a second heat transfer member, the second heat transfer member is arranged on the other main surface of the planar heater and contacts the cold plate, the planar heater has: a planar heating portion, which has a resistive heating element and contacts the second heat transfer member from the side opposite to the cold plate; and a lead-out portion, which has a lead-out wiring connected to the resistive heating element and extends from the heating portion, the flow path has a passage, the passage is connected to the air gap, and allows the refrigerant to pass along the lead-out portion.

[0029]

[24] Mode 24 of the present invention may also be that in the temperature adjustment device of mode 22 or 23, the heater unit has a second heat transfer member, the second heat transfer member is arranged on the other main surface of the planar heater, the cold plate is in contact with the second heat transfer member, the first heat transfer member has an exposed portion exposed from the planar heater, the second heat transfer member, and the cold plate, and the temperature sensor is in contact with the exposed portion.

[0030]

[25] Mode 25 of the present invention may also be that in any one of modes 22 to 24 of the temperature adjustment device, the cold plate has a first opposing surface opposite to the nozzle member, the nozzle member has a second opposing surface opposite to the cold plate, the air gap is formed between the first opposing surface and the second opposing surface, and the first opposing surface and the second opposing surface are both planes.

[0031]

[26] A 26th aspect of the present invention may be that, in the temperature adjustment device of any one of aspects 22 to 25, the thickness of the air gap is 1 mm or less.

[0032]

[27] Mode 27 of the present invention is an electronic component processing device that processes a DUT or a carrier that accommodates the DUT, wherein the electronic component processing device includes a pressing device, which electrically connects the DUT to the socket by pressing the DUT or the carrier toward the socket, and the pressing device includes a temperature adjustment device of any one of modes 7 to 26, and a contact plate that contacts the DUT or the carrier, the contact plate is between the first heat transfer component of the temperature adjustment device and the DUT, or between the first heat transfer component and the carrier, and the temperature sensor contacts a second main surface of the first heat transfer component on the opposite side of the first main surface that contacts the contact plate.

[0033]

[28] A method 28 of the present invention is an electronic component testing device for testing a DUT, wherein the electronic component testing device comprises the electronic component processing device of the method 27 and a tester having a socket. Effects of the Invention

[0034] According to the present invention, even if a structure is adopted in which the temperature adjustment device is placed close to the DUT, the temperature sensor can sense the temperature of the DUT or the carrier via the first heat transfer member, so that the sensing speed can be increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is a block diagram showing an example of the configuration of an electronic component testing apparatus in the embodiment of the present invention. Figure 2 This is a cross-sectional view showing the state of the pusher before the DUT is sucked and held in the embodiment of the present invention. Figure 3 This is a cross-sectional view showing the state of the pusher after the DUT is sucked and held in the embodiment of the present invention. Figure 4 is an enlarged cross-sectional view of a contact plate and a temperature adjustment device in an embodiment of the present invention, Figure 2 An enlarged view of section IV. Figure 5 It is an enlarged cross-sectional view of the planar heater. Figure 6 This is a development view of an example of a heater unit according to an embodiment of the present invention as viewed from below. Figure 7 This is a perspective view of an example of a nozzle member in an embodiment of the present invention as viewed from below. DETAILED DESCRIPTION

[0036] Hereinafter, embodiments of the present invention will be described based on the drawings. Figure 1 It is a block diagram showing an example of the configuration of the electronic component testing apparatus 100 in the present embodiment. Figure 2 It is a cross-sectional view showing the state of the push rod 6 before the DUT 300 is sucked and held in the present embodiment. Figure 3 It is a cross-sectional view showing the state of the push rod 6 after the DUT 300 is sucked and held in the present embodiment.

[0037] like Figure 1 As shown, the electronic component test device 100 in this embodiment is a device for testing the electrical characteristics of the DUT 300. As specific examples of the DUT 300 to be tested, a SoC (System on a chip), a logic device, or a memory device can be exemplified. Figure 2As shown, the DUT 300 in the present embodiment includes a substrate 301 , an IC chip 302 , a temperature detection circuit 303 , a mold resin 304 , and a plurality of terminals 305 .

[0038] In the DUT 300, an IC chip 302 and a temperature detection circuit 303 are mounted on the upper surface of a substrate 301, and the IC chip 302 and the temperature detection circuit 303 are covered with a molded resin 304. In addition, terminals 305 electrically connected to the IC chip 302 and the temperature detection circuit 303 are provided on the lower surface of the substrate 301, and these terminals 305 are electrically connected to the socket 2 described later by contact. It should be noted that in this embodiment, the temperature detection circuit 303 is described as an electronic component separate from the IC chip 302, but it is not limited to this, and the temperature detection circuit 303 may also be included in the IC chip 302.

[0039] like Figure 1 As shown, the electronic device test apparatus 100 includes a tester 1 for testing a DUT 300 , a socket 2 for electrically connecting the DUT 300 and the tester 1 , and a handler 3 for conveying the DUT 300 and pressing it against the socket 2 .

[0040] The tester 1 includes a main frame 11 and a test head 12. The main frame 11 is connected to the test head 12 via a cable 13. The main frame 11 sends a test signal to the DUT 300 via the test head 12 to test the DUT 300, and evaluates the DUT 300 based on the test result. The test head 12 is connected to the main frame 11 via the cable 13, and sends the test signal sent from the main frame 11 to the DUT 300 when the DUT 300 is tested.

[0041] like Figure 3 As shown, the test head 12 is electrically connected to the DUT 300 via the socket 2. The socket 2 includes a socket body 21 and a contact 22. The socket body 21 is fixed to the upper surface of the test head 12. The contact 22 is arranged on the socket body 21. Although not specifically shown in the figure, the contact 22 is electrically connected to a carrier board or the like arranged on the upper surface of the test head 12, and is also electrically connected to the DUT 300 by contacting the terminal 305 of the DUT 300. In the present embodiment, a spring pin is used as the contact 22, but a contact other than a spring pin may also be used as the contact 22. For example, a cantilever-type probe, an anisotropic conductive rubber sheet, or a film-type contact having bumps formed on an insulating film may also be used.

[0042] like Figure 1As shown, the DUT 300 is pushed against the socket 2 by the handler 3. The handler 3 includes a constant temperature chamber 4, a contact arm 5, a push rod 6, and a refrigerant supply unit 9. It should be noted that the handler 3 is equivalent to an example of an "electronic component handling device" in the embodiment of the present invention, and the contact arm 5 and the push rod 6 are equivalent to an example of a "pressing device" in the embodiment of the present invention.

[0043] The thermostatic bath 4 can adjust the temperature of the internal atmosphere to a desired temperature, and can apply a high or low temperature to the DUT 300. The thermostatic bath 4 is not particularly limited, and for example, the temperature can be adjusted within a range of -55°C to +155°C. The thermostatic bath 4 accommodates the contact arm 5 and the push rod 6. Furthermore, the thermostatic bath 4 accommodates the socket 2 via an opening formed at the bottom of the thermostatic bath 4. It should be noted that the processor 3 may not have the thermostatic bath 4.

[0044] The contact arm 5 is supported by a guide rail (not shown) provided on the processor 3. The contact arm 5 is provided with an actuator (not shown) for horizontal movement, and can move forward, backward, left and right along the rail. In addition, the contact arm 5 is provided with an actuator (not shown) for vertical driving, and can move in the vertical direction.

[0045] A push rod 6 is disposed at the lower end of the contact arm 5. Figure 2 As shown, the push rod 6 includes a push rod body 61 , a contact plate 62 , a holding portion 65 , a vertical guide 69 , a temperature adjustment device 7 , and a temperature measurement device 8 .

[0046] like Figure 2 As shown, the push rod body 61 in this embodiment has a plurality of (two in this example) first suction holes 611 and a first refrigerant supply hole 612. The first suction hole 611 is a through hole opened on the lower surface of the push rod body 61, and the opening is connected to the second suction hole 67 (described later) of the holding portion 65. The first suction hole 611 is connected to a vacuum pump (not shown), and the interior of the first suction hole 611 becomes a negative pressure through the vacuum pump.

[0047] The first refrigerant supply hole 612 is also a through hole opened on the lower surface of the push rod body 61, and is connected to the through hole 781 (described later) of the nozzle member 78 (described later). Refrigerant is supplied to the first refrigerant supply hole 612 from the refrigerant supply source 200 provided outside the processor 3. It should be noted that Figures 2 to 4 The dashed arrows in φ indicate the flow of the refrigerant. In addition, the first suction hole 611 and the first refrigerant supply hole 612 may also be provided in a portion other than the push rod body 61 .

[0048] like Figure 2 As shown in FIG. 6 , the contact plate 62 is a plate having a convex shape bent in a manner protruding downward. Figure 3As shown, the contact plate 62 is a member that directly contacts the DUT 300 when the push rod 6 holds the DUT 300. In addition, the contact plate 62 contacts the temperature adjustment device 7 and is fixed to the holding portion 65 in a state where the temperature adjustment device 7 is pressed toward the push rod body 61. In this way, the temperature adjustment device 7 can heat or cool the DUT 300 at a high speed via the contact plate 62 by pressing the temperature adjustment device 7 with the contact plate 62.

[0049] As a material constituting the contact plate 62, a metal having an insulating film formed on the surface can be used. Specifically, for example, aluminum having an anodized film on the surface can be used. In order to transfer heat from the temperature adjustment device 7 to the DUT 300, the contact plate 62 is preferably made of a metal material having high thermal conductivity. In addition, by using a metal having an insulating film formed on the surface, the electromagnetic noise generated by the push rod 6 can be shielded from the DUT 300, and the push rod 6 can be electrically insulated from the DUT 300. It should be noted that in order to prevent electrostatic discharge (ESD), although not specifically shown in the figure, the contact plate 62 can also be electrically connected to the ground.

[0050] The contact plate 62 has a contact portion 621 and a fixing portion 622. The contact portion 621 extends in a direction substantially parallel to the DUT 300. The contact portion 621 has a contact surface 621a that contacts the DUT 300. The contact surface 621a in this embodiment is the lower surface of the contact portion 621. Figure 3 As shown in FIG. 6 , when the push rod 6 holds the DUT 300, it contacts and presses the DUT 300. In addition, the temperature adjustment device 7 applies heat to the DUT 300 via the contact surface 621a. Figure 4 As shown, the thickness T1 of the contact portion 621 is not particularly limited, and can be set to 500 μm to 550 μm (500 μm ≤ T1 ≤ 550 μm).

[0051] like Figure 2 As shown, the fixing portion 622 is provided outside the contact portion 621. The fixing portion 622 in this embodiment is formed integrally with the contact portion 621. The fixing portion 622 can be formed, for example, by bending the outer periphery of the plate-shaped contact plate 62 toward the push rod body 61. It should be noted that the fixing portion 622 may also be a member different from the contact portion 621.

[0052] The fixing portion 622 is fixed to the holding portion 65 by a screw 63. The screw 63 fastens the fixing portion 622 to the holding portion 65. In the fixing portion 622 connected to the contact portion 621 in a stepped shape, the contact plate 62 is fixed to the holding portion 65 by the screw 63, so that the contact plate 62 presses the heater unit 71 (described later) of the temperature adjustment device 7 toward the push rod body 61.

[0053] As in the present embodiment, by fixing the contact plate 62 with the screw 63, the contact plate 62 can be pressed against the temperature adjustment device 7 by using the substantially constant axial force of the screw 63. In addition, the axial force of the screw 63 can be easily adjusted by the size of the screw 63, the tightening torque, etc. In this way, the contact plate 62 can be pressed against the temperature adjustment device 7 with a substantially constant pressing force, so that the stability of the temperature adjustment of the DUT 300 by the temperature adjustment device 7 can be improved.

[0054] In addition, the fixing portion 622 in this embodiment is arranged at a position closer to the push rod body 61 than the contact portion 621. Figure 3 As shown, when the push rod 6 holds the DUT 300 , the screw 63 provided in the fixing portion 622 can be prevented from interfering with the DUT 300 .

[0055] like Figure 2 and Figure 3 As shown, a holding portion 65 is provided on the outer side of the contact plate 62. The holding portion 65 in this embodiment is fixed to the lower surface of the push rod body. Although not particularly shown, the holding portion 65 can be fixed to the push rod body 61 by fasteners such as screws.

[0056] The holding portion 65 in this embodiment has a second suction hole 67 and an adsorption pad 68. The second suction hole 67 passes through the holding portion 65. The upper end of the second suction hole 67 is connected to the first suction hole 611 of the push rod body 61. The second suction hole 67 is connected to a vacuum pump (not shown) via the first suction hole 611, so that the interior of the second suction hole 67 becomes negative pressure.

[0057] An adsorption pad 68 is provided at the lower end of the second suction hole 67. Figure 3 As shown, the suction pad 68 contacts the DUT 300 to form a space surrounded by the suction pad 68 and the DUT 300. Since the space is connected to the second suction hole 67, the DUT 300 can be held by suction at the lower end surface of the holding portion 65.

[0058] like Figure 2 as well as Figure 3 As shown, the temperature adjustment device 7 is arranged inside the holding portion 65 . The temperature adjustment device 7 adjusts the temperature of the DUT 300 via the contact plate 62 .

[0059] Figure 4 It is an enlarged cross-sectional view of the contact plate 62 and the temperature adjustment device 7 according to the present embodiment. Figure 5 It is an enlarged cross-sectional view of the planar heater. Figure 6 It is a developed plan view showing an example of the structure of the heater unit according to the embodiment of the present invention.

[0060] like Figure 4As shown, the temperature adjustment device 7 includes a heater unit 71 as a heating source and a cooler unit 75 as a cooling source. The heater unit 71 is arranged on the contact portion 621 of the contact plate 62. The heater unit 71 is a sheet-like laminated body formed by laminating a planar heater 72, a first heat transfer member 73, and a second heat transfer member 74. The thickness T2 of the heater unit 71 is not particularly limited, and is 400 μm or less (T2 ≤ 400 μm).

[0061] The planar heater 72 has a planar shape (sheet shape). Since the planar heater 72 is thin, the heat capacity of the planar heater 72 is smaller than that of a ceramic heater, etc. Therefore, the temperature increase rate of the temperature adjustment device 7 can be increased, so that the responsiveness can be improved.

[0062] Figure 4 as well as Figure 5 The thickness T3 of the planar heater 72 shown is not particularly limited, and can be set to 100 μm to 150 μm (100 μm ≤ T3 ≤ 150 μm). In addition, as the planar heater 72, for example, a resin film heater such as a polyimide heater or a polyester heater can be used. In particular, as the planar heater 72, a polyimide heater is preferably used. The polyimide heater has excellent heat resistance among heaters using resin. In addition, the polyimide heater is cheaper than a ceramic heater, etc., so cost reduction can be achieved.

[0063] like Figure 5 as well as Figure 6 As shown in FIG. 1 , the planar heater 72 includes a resin layer 721, a metal wiring 724, and a terminal 725. The resin layer 721 is a planar layer. Figure 5 As shown, the resin layer 721 includes a first resin layer 722 and a second resin layer 723 stacked on the first resin layer 722. The first resin layer 722 and the second resin layer 723 are not particularly limited, and are resin films that are bonded to each other by an adhesive or the like that is not shown. It should be noted that the first and second resin layers 722 and 723 may also be bonded without an adhesive. The first and second resin layers 722 and 723 are composed of, for example, a resin material such as polyimide or polyester. In particular, from the viewpoint of heat resistance, polyimide is preferably used as the resin material.

[0064] A metal wiring 724 is interposed between the first resin layer 722 and the second resin layer 723. The metal wiring 724 is made of a metal such as stainless steel. In the planar heater 72, current is supplied to the metal wiring 724 to generate resistance heat.

[0065] like Figure 6As shown in FIG. 1 , the planar heater 72 includes a heating portion 72a and a pair of lead portions 72b. The heating portion 72a is a planar portion that serves as a heat source and heats the contact plate 62. The heating portion 72a contacts the second heat transfer member 74 from the side (lower side) opposite to the cold plate 76 (described later). In the heating portion 72a, the metal wiring 724 is meandering to form a resistance heating element 724a, thereby increasing the density of the metal wiring 724 in the heating portion 72a and increasing the resistance heating amount.

[0066] like Figure 4 as well as Figure 6 As shown, the lead-out portion 72b has a band shape and extends from the heating portion 72a. The lead-out portion 72b supplies power from a power source outside the planar heater 72 to the resistive heating element 724a. The details will be described later. The lead-out wiring 724b is electrically connected to the control unit 93 (described later), and the amount of power received by the lead-out wiring 724b is adjusted by the control unit 93. It should be noted that the lead-out wiring 724b in the present embodiment has the same width as the resistive heating element 724a, but is not limited to this. In order to reduce the resistivity of the lead-out wiring 724b, the lead-out wiring 724b may also have a width thicker than the width of the resistive heating element 724a.

[0067] like Figure 4 As shown, the lead portion 72b in this embodiment extends in a direction different from the extending direction of the first and second main surfaces 721a and 721b of the heat generating portion 72a. The planar heater 72 is bent at the boundary between the heat generating portion 72a and the lead portion 72b. In this embodiment, a pair of lead portions 72b are arranged in a manner of sandwiching a cold plate 76 (described later).

[0068] like Figure 6 As shown, in the lead-out portion 72b, the metal wiring 724 constitutes a lead-out wiring 724b connected to the resistance heating element 724a. In addition, in the lead-out portion 72b, the lead-out wiring 724b is connected to a terminal 725. The terminal 725 is a portion electrically connected to the control unit 93 (described later).

[0069] like Figure 4 as well as Figure 5 As shown, the first heat transfer member 73 is disposed on the first main surface (lower surface) 721 a of the planar heater 72 . Therefore, the first heat transfer member 73 is disposed closer to the DUT 300 than the planar heater 72 , and is thermally connected to the DUT 300 via the contact plate 62 .

[0070] The second heat transfer member 74 is also disposed on the second main surface (upper surface) 721 b of the planar heater 72 . Therefore, the second heat transfer member 74 is disposed at a position farther from the DUT 300 than the planar heater 72 and is in contact with the cooler unit 75 .

[0071] The first and second heat transfer members 73 and 74 are thermally conductive materials that dissipate heat generated by the planar heater 72 from the planar heater 72 . Figure 4 The thicknesses T4 and T5 of the first and second heat transfer members 73 and 74 shown are not particularly limited, and can be set to 50 μm to 100 μm (50 μm ≤ T4, T5 ≤ 100 μm).

[0072] The first heat transfer member 73 is larger than the heat generating portion 72a of the planar heater 72 and larger than the second heat transfer member 74. Therefore, the first heat transfer member 73 includes a contact portion 73a in contact with the planar heater 72 and an exposed portion 73b exposed from the planar heater 72 and the second heat transfer member 74. On the other hand, the entire second heat transfer member 74 is in contact with the planar heater 72.

[0073] In a planar heater, the metal wiring generates heat, and thus the temperature rises locally near the metal wiring, and thus the temperature of the resin layer locally becomes too high near the metal wiring, which sometimes causes the resin layer to burn out. On the other hand, in the heater unit 71 of this embodiment, by using the first and second heat transfer members 73 and 74 to diffuse heat to portions other than the vicinity of the metal wiring 724, it is possible to suppress the local temperature rise near the metal wiring 724, and suppress the occurrence of burning out of the resin layer 721.

[0074] As the first and second heat transfer members 73 and 74, for example, TIM (Thermal Interface Material) can be used. As TIM, for example, metal foil made of aluminum or copper, graphite sheet, silicone rubber sheet in which a thermally conductive filler is dispersed, sheet containing carbon nanotubes (CNT), gel in which a thermally conductive filler is dispersed, etc. can be used.

[0075] The first and second heat transfer members 73 and 74 preferably diffuse the heat from the planar heater 72 preferentially in a first direction (in this example, a horizontal direction) parallel to the first and second main surfaces 721a and 721b of the planar heater 72. It should be noted that the heat transfer member that diffuses the heat preferentially in the first direction refers to a heat transfer member whose thermal conductivity in the first direction is greater than the thermal conductivity in a direction perpendicular to the first direction when pressed with a given pressure. As such a material, the above-mentioned graphite sheet, a sheet made by bundling CNTs extending in the first direction, etc. can be used.

[0076] like Figure 5As shown, in the planar heater 72, the metal wiring 724 generates heat, so the heat is easily concentrated on the first portion 73a1 located near the metal wiring 724 of the contact portion 73a of the first heat transfer member 73. On the other hand, it is relatively difficult for the heat to be concentrated on the second portion 73a2 of the first heat transfer member 73 away from the metal wiring 724. Therefore, as in this embodiment, by using the first heat transfer member 73 that diffuses the heat preferentially in the first direction, the heat can be preferentially transferred from the first portion 73a1 to the second portion 73a2, so that the first portion 73a1 can be prevented from being excessively heated. Therefore, it is possible to effectively prevent the portion near the metal wiring 724 of the planar heater 72 from becoming locally hot. In addition, for the second heat transfer member 74, it is possible to effectively prevent the portion near the metal wiring 724 of the planar heater 72 from becoming locally hot for the same reason.

[0077] In addition, if Figure 4 As shown, in this embodiment, the first and second heat transfer members 73 and 74 are directed toward the push rod body 61 (see Figure 2 as well as Figure 3 ) is pressed, thereby the first and second heat transfer members 73 and 74 are in close contact with the planar heater 72. Therefore, the heat transfer from the planar heater 72 to the first and second heat transfer members 73 and 74 can be accelerated.

[0078] Furthermore, as described above, the pressing force of the contact plate 62 is set according to the size of the screw 63 , so that the state in which the first and second heat transfer members 73 , 74 and the planar heater 72 are in close contact can be stabilized.

[0079] like Figures 2 to 4 As shown, a cooler unit 75 is disposed on the heater unit 71. The cooler unit 75 cools the heater unit 71 during heating to adjust the temperature of the heater unit 71 to a desired temperature. In addition, the cooler unit 75 can also cool the DUT 300 via the heater unit 71 and the contact plate 62.

[0080] The cooler unit 75 includes a cold plate 76, a nozzle member 78, and a flow path 79. The cold plate 76 is a plate-shaped plate. The cold plate 76 is arranged on the heater unit 71 and is a member that contacts and cools the heater unit 71. As a material constituting the cold plate 76, a metal having an insulating coating formed on the surface can be used, similarly to the contact plate 62 described above.

[0081] Figure 4The thickness T6 of the cold plate 76 shown is, for example, 300 μm to 400 μm (300 μm ≤ T6 ≤ 400 μm). In addition, the total thickness T7 of the cold plate 76, the thickness T2 of the heater unit 71, and the thickness T1 of the contact plate is 2 mm or less (T6 + T2 + T1 ≤ 1 mm). By shortening the distance between the cold plate 76 and the DUT 300 in this way, the responsiveness of the temperature adjustment can be improved.

[0082] In addition, the cold plate 76 has a first facing surface 76a facing the nozzle member 78. The first facing surface 76a is a flat surface.

[0083] A nozzle member 78 is disposed on the cold plate 76. Figure 2 as well as Figure 3 As shown, the nozzle member 78 is a member for bringing the refrigerant supplied from the first refrigerant supply hole 612 of the push rod body 61 into contact with the first facing surface 76 a of the cold plate 76 .

[0084] like Figure 4 As shown, the nozzle member 78 has a through hole 781, an injection port 782, and a protrusion 785. The through hole 781 is connected to the first refrigerant supply hole 612 of the push rod body 61. The through hole 781 constitutes a part of the flow path 79. The injection port 782 is formed substantially at the center of the lower end surface (second opposing surface 78a) of the through hole 781. The injection port 782 is separated from the cold plate 76 and injects the refrigerant supplied from the second refrigerant supply hole 772a of the refrigerant guide 77 toward the cold plate 76.

[0085] In addition, the nozzle member 78 has a second opposing surface 78a that is opposed to the first opposing surface 76a of the cold plate 76 and is separated from the first opposing surface 76a. Therefore, an air gap 791 is formed between the first opposing surface 76a and the second opposing surface 78a. The air gap 791 also constitutes a part of the flow path 79, and the refrigerant injected from the injection port 782 flows through the air gap 791 after reaching the first opposing surface 76a of the cold plate 76. By allowing the refrigerant to flow through the air gap 791 on the cold plate 76, the refrigerant can be accelerated on the first opposing surface 76a, so that the cooling rate can be increased. Therefore, the responsiveness in temperature adjustment can be improved.

[0086] Figure 7 78a is a three-dimensional view showing the nozzle member 78 of the present embodiment as viewed from below. The second opposing surface 78a is a plane. The second opposing surface 78a includes a plurality of (four in this example) grooves 783 and steps 784. The plurality of grooves 783 extend from the injection port 782 to the radially outer side of the nozzle member 78. By providing such grooves 783, the refrigerant injected from the injection port 782 can be guided by the grooves 783 and circulate radially outward.

[0087] In addition, the width of the groove 783 increases as it approaches the center of the second facing surface 78 a , so that the refrigerant can flow at a high speed also at the front end of the groove 783 .

[0088] The plurality of grooves 783 are arranged at substantially equal intervals along the circumferential direction of the injection port 782, with the injection port 782 as the center. In the air gap 791, the refrigerant can flow uniformly toward the radially outer side.

[0089] A step 784 is formed on the outer side of the groove 783. The step 784 has an annular shape. The second facing surface 78a is divided by the step 784, including an outer facing surface 78b located on the outer side of the step 784 and an inner facing surface 78c located on the inner side of the step 784. The thickness of the air gap 791 increases at the outer facing surface 78b and decreases at the inner facing surface 78c. By providing such a step 784, the refrigerant can be accelerated at the outer peripheral portion of the second facing surface 78a.

[0090] In addition, the thickness T8 of the air gap 791 can be appropriately set according to the pressure of the supplied refrigerant, for example, it can be set to 1 mm or less (T8 ≤ 1 mm). If the thickness T8 of the air gap 791 is 1 mm or less, the refrigerant flowing in the air gap 791 can be accelerated, so the cooling rate can be increased. Therefore, the responsiveness in temperature adjustment can be improved.

[0091] like Figure 4 as well as Figure 7 As shown in FIG. 1 , a plurality of protrusions 785 are arranged on the second facing surface 78a. The protrusions 785 are spacers between the first facing surface 76a and the second facing surface 78a, and separate the first and second facing surfaces 76a and 78a. The front ends of the protrusions 785 contact the first facing surface 76a of the cold plate 76, defining the above-mentioned air gap 791.

[0092] like Figure 4 As shown, a passage 792 is formed between the nozzle member 78 and the lead-out portion 72b. The passage 792 is connected to the air gap 791 and constitutes a part of the flow path 79. The passage 792 allows the refrigerant that has passed through the air gap 791 to pass along the lead-out portion 72b. Thus, the lead-out portion 72b can be cooled, so even if heat is generated in the lead-out portion 72b, burning of the lead-out portion 72b can be suppressed.

[0093] In the present embodiment, the refrigerant passing through the passage 792 is released to the outside of the push rod 6. However, the refrigerant may be recovered to the refrigerant supply source 200 instead of being released to the outside of the push rod 6.

[0094] Figures 2 to 4 The temperature measuring device 8 shown in the figure measures the temperature of the DUT 300. Figure 4As shown, the temperature measuring device 8 in this embodiment is provided on the exposed portion 73b of the first heat transfer member 73 and is in contact with the exposed portion 73b. In addition, the temperature measuring device 8 in this embodiment is arranged separately from the planar heater 72. The temperature measuring device 8 only needs to be in contact with the exposed portion 73b, and the relative position of the temperature measuring device 8 with respect to the exposed portion 73b can be appropriately changed according to the arrangement of the exposed portion 73b.

[0095] The temperature measuring device 8 includes a sensor substrate 81, a porous material 82, and a pressing member 83. The sensor substrate 81 is a circuit substrate including a resin base material 811 and a temperature sensor 812. It should be noted that, although not particularly shown, the sensor substrate 81 may also include wiring, electronic components other than the temperature sensor 812, etc. In addition, the porous material 82 is equivalent to an example of the "first biasing member", "elastic material", and "heat insulating member" in the embodiment of the present invention.

[0096] The resin base material 811 is a plate-shaped resin member. The material constituting the resin base material 811 is not particularly limited, and polyimide and the like can be exemplified.

[0097] The temperature sensor 812 is mounted on the resin substrate 811. The temperature sensor 812 measures the temperature of the exposed portion 73b. Although not particularly limited, a platinum temperature measuring resistor is used as the temperature sensor 812 of this embodiment. In addition, although not particularly limited, as the temperature sensor 812, a metal temperature measuring resistor other than platinum, a thermocouple, a thermistor temperature measuring body, and the like can also be used.

[0098] The temperature sensor 812 is disposed on the side opposite to the DUT 300 with respect to the first heat transfer member 73, and is in direct contact with the exposed portion 73b. The temperature sensor 812 and the planar heater 72 are arranged in the first direction so as to be separated from each other.

[0099] As described above, the first heat transfer member 73 can quickly diffuse the heat generated from the planar heater 72 toward the first direction. Therefore, the heat propagation delay to the temperature sensor 812 can be reduced, and the temperature of the DUT 300 can be measured at high speed.

[0100] The porous material 82 is provided on the sensor substrate 81 so as to cover the temperature sensor 812. The porous material 82 in this embodiment is a sponge, and is made of a resin material having a plurality of pores formed therein. Therefore, the porous material 82 has both heat insulating properties and elasticity.

[0101] By covering the temperature sensor 812 with the porous material 82 having heat insulation properties, the temperature sensor 812 can be less susceptible to the influence of wind generated by the flow of the refrigerant, etc. Therefore, the temperature measurement accuracy of the temperature sensor 812 can be improved.

[0102] In addition, the porous material 82 in this embodiment is pressed toward the exposed portion 73b of the first heat transfer member 73 by the pressing member 83. Therefore, the porous material 82 is sandwiched between the pressing member 83 and the first heat transfer member 73 in a compressed state, and the temperature sensor 812 is urged toward the first heat transfer member 73 by elastic force. That is, the porous material 82 urges the temperature sensor 812 in a direction substantially orthogonal to the first direction.

[0103] The porous material 82 urges the temperature sensor 812 toward the first heat transfer member 73 , so that the temperature sensor 812 can be brought into close contact with the first heat transfer member 73 . Therefore, heat can be efficiently transferred from the first heat transfer member 73 to the temperature sensor 812 , and sensing can be accelerated.

[0104] In order to heat-insulate and press the temperature sensor 812, a member having heat-insulating properties and elasticity other than the porous material 82 may be used. Alternatively, a member having heat-insulating properties and a member having elasticity may be used in combination.

[0105] The pressing member 83 presses the porous material 82 toward the first heat transfer member 73. The pressing member 83 is a rigid member, and is fixed to the lower surface of the plunger body 61.

[0106] In this embodiment, the distance D1 from the pressing surface 831 of the pressing member 83 to the temperature sensor 812 is set to be smaller than the height H1 (not shown) of the porous material 82 when the porous material 82 is not expanded or contracted (D1

[0107] like Figure 2 as well as Figure 3 As shown in FIG. 1 , the vertical guide 69 is disposed outside the holding portion 65. The vertical guide 69 is fixed to the lower surface of the push rod body 61 and extends downward from the lower surface of the push rod body 61. It should be noted that, although not particularly limited, the vertical guide 69 can be fixed to the push rod body 61 using fasteners such as bolts. Figure 3 As shown, the vertical guide 69 abuts against the DUT 300 when the push rod 6 adsorbs and holds the DUT 300, thereby enabling the DUT 300 to be positioned relative to the push rod 6 in the vertical direction and the horizontal direction. ​

[0108] like Figure 1 As shown, the refrigerant supply unit 9 supplies refrigerant to the push rod 6. The refrigerant supply unit 9 includes a connection unit 91, a valve 92, and a control unit 93. The connection unit 91 is connected to a refrigerant supply source 200 provided outside the electronic component test device 100. The refrigerant supplied by the refrigerant supply source 200 is compressed dry air, liquid nitrogen, etc. In the case where the refrigerant supply source 200 supplies compressed dry air, the refrigerant supply source 200 may also include, for example, a compressor that takes in and compresses external air and a dryer that dries the compressed air. Alternatively, the refrigerant supply source 200 may also be an existing factory piping that can supply compressed dry air. In the case where the refrigerant supply source 200 supplies liquid nitrogen, the refrigerant supply source 200 may be, for example, a pressure vessel that stores liquid nitrogen at high pressure, or a factory piping for supplying liquid nitrogen.

[0109] A valve 92 is provided downstream of the connection portion 91. The valve 92 adjusts the flow rate of the refrigerant supplied from the refrigerant supply source 200. Figure 2 As shown, the refrigerant having passed through the valve 92 is supplied to the first refrigerant supply hole 612 of the push rod body 61 .

[0110] like Figure 1 As shown in FIG. 1 , the control unit 93 controls the opening and closing of the valve 92. Figure 6 As shown, the control unit 93 controls the output of the planar heater 72. The control unit 93 in this embodiment is input to the temperature detection circuit 303 (see Figure 2 ) and is input to the temperature sensor 812 of the temperature measuring device 8 (refer to Figure 4 ) detection value. The control unit 93 performs PID control based on the input detection value so that the temperature of the DUT 300 becomes a desired value. It should be noted that the control method of the control unit 93 is not limited to PID control, and other control methods can also be used.

[0111] According to the electronic component test apparatus 100 described above, even if the temperature adjustment device 7 is arranged close to the DUT 300 , the temperature sensor 812 can sense the temperature of the DUT 300 via the first heat transfer member 73 , so that the sensing speed can be increased.

[0112] In the electronic component test apparatus 100 of the present embodiment, the heater unit 71 of the temperature adjustment device 7 includes a planar heater 72. Since the planar heater 72 is thin, the heat capacity of the planar heater 72 is smaller than that of the ceramic heater. Therefore, the temperature rise rate of the heater unit 71 can be increased, so that the responsiveness can be improved.

[0113] In the electronic component test apparatus 100 of the present embodiment, the first and second heat transfer members 73 and 74 are provided on the first and second main surfaces 721a and 721b of the planar heater 72. Therefore, even when the planar heater 72 is heated rapidly, the first and second heat transfer members 73 and 74 can suppress the planar heater 72 from locally becoming high temperature, and the heat can be released from the planar heater 72. Therefore, damage to the planar heater 72 can be prevented.

[0114] Furthermore, in the electronic component testing apparatus 100 of the present embodiment, since a ceramic heater which tends to be heavy is not used, the weight of the push rod 6 can also be reduced.

[0115] It should be noted that the above-described embodiments are described to facilitate understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above-described embodiments is intended to include all design changes or equivalents that fall within the technical scope of the present invention.

[0116] For example, in the above-mentioned embodiment, the push rod 6 holds the DUT 300 by suction, but the present invention is not limited thereto. The push rod 6 may also hold the carrier 400 (see FIG. 4 ) containing the DUT by suction. Figure 1 ). Such a carrier 400 is not particularly limited, and for example, carriers described in Japanese Patent Application Laid-Open Nos. 2019-197012 and 2013-79860 can be used.

[0117] In addition, the push rod 6 may also press a plurality of DUTs 300 mounted on a test tray carrying a plurality of DUTs 300. In this case, the processor 3 includes a plurality of push rods 6, and the plurality of push rods 6 respectively press a plurality of DUTs 300 mounted on the test tray. In this case, all the push rods 6 may also have the structure as in the present embodiment described above.

[0118] In addition, the fixing portion 622 of the contact plate 62 is fixed to the holding portion 65, but the present invention is not limited thereto. For example, the fixing portion 622 may be fixed to the push rod body 61, or may be fixed to another member fixed to the push rod body 61 without moving relative to the push rod body 61. Explanation of symbols

[0119] 100…Electronic component test equipment 1…Tester 11…Main frame 12…Test Head 13…Cable 2…Socket 21…Socket body 22…Contact 3…Processor 4…Thermostatic bath 5…Contact arm 6…Putter 61…Putter body 611…First suction hole 612…First refrigerant supply hole 62…Contact plate 621…Contact Department 621a…Contact surface 622…Fixed part 63…Screw 65…Maintenance 67…Second suction hole 68…Absorbent pad 69…Vertical guide 7…Temperature adjustment device 71…Heater unit 72…Surface heater 72a…heating part 72b…lead-out section 721…resin layer 721a, 721b... first and second main surfaces 722, 723 ... first and second resin layers 724…Metal wiring 724a…Resistor heating element 724b…lead-out wiring 725…terminal 73 ... first heat transfer member 73a…Contact part 73a1, 73a2…Part I and Part II 73b…exposed part 74 ... second heat transfer member 75...Chiller unit 76…Cold plate 76a ... first opposing surface 78…Nozzle assembly 78a…Second opposing surface 78b…Outer facing surface 78c…Inner facing surface 781…Through hole 782…Injection port 783...Slot 784… steps 785…protrusion 79…Flow path 791…Air Gap 792…passage 8…Temperature measuring device 81…Sensor substrate 811…Resin base material 812…Temperature sensor 82…Porous materials 83…Pressing member 9…Refrigerant supply unit 91…Connection 92…Valve 93…Control Department 200…Refrigerant supply source 300…DUT 301…Substrate 302…IC chip 303…Temperature detection circuit 304…Molding resin 305…terminal 400…vector.

Claims

1. A temperature measuring device for measuring the temperature of a DUT or a DUT accommodated in a carrier, the temperature measuring device comprising: a first heat transfer member thermally connected to the DUT or the carrier; and a temperature sensor in contact with the first heat transfer member, The first heat transfer member is a sheet-shaped member extending along a first direction.

2. The temperature measuring device according to claim 1, wherein: The temperature measuring device includes a first biasing member for biasing the temperature sensor toward the first heat transfer member. The first urging member urges the temperature sensor in a direction substantially orthogonal to the first direction.

3. The temperature measuring device according to claim 1, wherein: The first heat transfer member is a sheet-shaped member that diffuses heat transferred from the DUT or the carrier preferentially in the first direction.

4. The temperature measuring device according to claim 1, wherein: The temperature sensor is disposed on a side of the first heat transfer member opposite to the DUT or the carrier.

5. The temperature measuring device according to any one of claims 1 to 4, wherein: The temperature measuring device includes a heat insulating member covering the temperature sensor.

6. The temperature measuring device according to claim 5, wherein: The heat insulating member is made of a porous material.

7. The temperature measuring device according to claim 5, wherein: The heat insulating member is made of elastic material. The temperature measuring device includes a pressing member for pressing the heat insulating member toward the first heat transfer member. The heat insulating member is sandwiched between the pressing member and the first heat transfer member. The heat insulating member urges the temperature sensor toward the first heat transfer member.

8. A temperature adjustment device for adjusting the temperature of a DUT or a DUT accommodated in a carrier, The temperature adjustment device comprises the temperature measuring device according to any one of claims 1 to 7, The temperature adjustment device includes a heater unit as a heating source, The heater unit comprises: A planar heater; and The first heat transfer member is disposed on one main surface of the planar heater.

9. The temperature adjustment device according to claim 8, wherein: The first heat transfer member includes an exposed portion exposed from the planar heater. The temperature sensor is in contact with the exposed portion.

10. The temperature adjustment device according to claim 8, wherein: The first heat transfer member is disposed at a position closer to the DUT or the carrier than the planar heater.

11. The temperature adjustment device according to claim 8, wherein: The heater unit includes a second heat transfer member disposed on the other main surface of the planar heater.

12. The temperature adjustment device according to claim 8, wherein: The planar heater comprises: a first resin layer; a second resin layer stacked on the first resin layer; and A metal wiring is interposed between the first resin layer and the second resin layer.

13. The temperature adjustment device according to claim 8, wherein: The temperature adjustment device further includes a cooler unit as a cooling source and in contact with the heater unit. The cooler unit includes a flow path through which a refrigerant passes. The cooler unit comprises: a nozzle member having an injection port for injecting a refrigerant; and a cold plate which is opposed to the injection port, is arranged to be separated from the injection port, and to which the refrigerant is blown from the nozzle member, The flow path includes an air gap formed between the nozzle member and the cold plate, The refrigerant injected from the injection port passes through the air gap after reaching the cold plate.

14. The temperature adjustment device according to claim 13, wherein: The heater unit includes a second heat transfer member disposed on the other main surface of the planar heater and in contact with the cold plate. The planar heater comprises: a planar heat generating portion having a resistance heating element and contacting the second heat transfer member from a side opposite to the cold plate; and a lead portion having a lead wiring connected to the resistance heating element and extending from the heating portion, The flow path includes a passage connected to the air gap and allowing the refrigerant to pass along the lead-out portion.

15. An electronic component processing device for processing a DUT or a carrier containing the DUT, The electronic component handling device includes a pressing device that electrically connects the DUT to the socket by pressing the DUT or the carrier toward the socket. The pressing device comprises: A temperature adjustment device, which is the temperature adjustment device according to any one of claims 8 to 14; and a contact plate, which contacts the DUT or the carrier, The contact plate is interposed between the first heat transfer member of the temperature adjustment device and the DUT, or between the first heat transfer member and the carrier. The temperature sensor is in contact with a second main surface of the first heat transfer member on the opposite side of the first main surface in contact with the contact plate.

16. An electronic component test device for testing a DUT, the electronic component test device comprising: The electronic component processing device according to claim 15; and A tester having the socket.

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