Electronic paper screen and production method thereof

Abstract

The invention discloses an electronic paper screen and a production method thereof. The electronic paper screen comprises an electronic paper film and a thin film transistor substrate which are sequentially arranged from the top end to the bottom end. The electronic paper film is rectangular; a VCOM electrode is arranged on the thin film transistor substrate, and a VCOM ITO electrode is arranged on the electronic paper film; the VCOM electrode and the VCOM ITO electrode are communicated through elargol arranged between the thin film transistor substrate and the electronic paper film; the silver colloid is strip-shaped; the elargol is arranged on the edge of one end of the electronic paper film where a conduction region between the VCOM electrode and the VCOM ITO electrode is located; the electronic paper film is used for displaying images; the thin film transistor substrate is used for driving and controlling pixels. The conductive area of silver colloid can be effectively increased, the driving capacity of VCOM ITO on an electronic paper film is improved, ear holes can be removed, the appearances of the electronic paper film and a PS protection film are rectangular, and the narrow frame and the high screen-to-body ratio of an electronic paper screen are achieved.

Description

Technical Field

[0001] The present invention relates to the field of electronic technology, and in particular to an electronic paper screen and a production method thereof. Background Art

[0002] This section is intended to provide a background or context to the embodiments of the invention recited in the claims. No admission is made that the description herein is prior art by inclusion in this section.

[0003] An electronic paper screen is a display screen made using electrophoretic display technology. The control circuit on the thin-film transistor (TFT) substrate applies a driving voltage to each pixel to achieve the effect of displaying an image. As a reflective display screen, the electronic paper screen can maintain the image for a long time after it is updated without continuous refreshing, so the power consumption is very low. Due to its low power consumption, wide viewing angle, high contrast, eye protection and many other features, electronic paper screens are increasingly widely used in many fields such as electronic price tags, e-books, billboards, etc.

[0004] In order to drive the VCOM ITO electrode on the electronic paper film FPL, the existing electronic paper screen needs to reserve ear holes on the FPL, set silver glue at the position of the ear holes, and then connect the VCOM electrode on the TFT substrate with the VCOM ITO electrode on the FPL by applying silver glue. The existence of the ear holes causes the FPL and PS protective film to be deformed, and at the same time increases the size of the FPL, PS protective film, and TFT, which not only widens the border of the electronic paper screen and reduces the screen-to-body ratio, but also reduces the number of FPL, PS protective film, and TFT cuts of the electronic paper screen and increases the material cost. Summary of the invention

[0005] The embodiment of the present invention provides an electronic paper screen, which is used to achieve a narrow frame and a high screen-to-body ratio of the electronic paper screen.

[0006] The electronic paper screen comprises: an electronic paper film and a thin film transistor substrate arranged in sequence from the top to the bottom; the electronic paper film is in a rectangular shape;

[0007] A VCOM electrode is provided on the thin film transistor substrate, and a VCOM ITO electrode is provided on the electronic paper film;

[0008] The VCOM electrode and the VCOM ITO electrode are connected through a silver glue arranged between the thin film transistor substrate and the electronic paper film; the silver glue is in the shape of a strip; the silver glue is arranged at the edge of one end of the electronic paper film where the conduction area between the VCOM electrode and the VCOM ITO electrode is located;

[0009] Electronic paper films are used to display images;

[0010] The thin film transistor substrate is used to control pixel driving.

[0011] An embodiment of the present invention provides a method for producing an electronic paper screen, which is used to achieve a narrow frame and a high screen-to-body ratio of the electronic paper screen. The method includes:

[0012] attaching the electronic paper film to the thin film transistor substrate;

[0013] Apply silver glue to the edge of one end of the electronic paper film where the conduction area between the VCOM electrode and the VCOM ITO electrode is located; the VCOM electrode is on the thin film transistor substrate, and the VCOM ITO electrode is on the electronic paper film;

[0014] Pre-curing the silver glue;

[0015] Soldering the integrated circuit IC to the thin film transistor substrate;

[0016] Soldering the flexible circuit board FPC to the thin film transistor substrate;

[0017] Attach the PS protective film to the electronic paper film;

[0018] Apply edge sealing glue to the edge of the PS protective film;

[0019] Use a vacuum temperature-controlled furnace to cure and degas the silver glue and edge-sealing glue;

[0020] The bonding area of ​​the thin film transistor substrate is coated with silicone.

[0021] In an embodiment of the present invention, an electronic paper screen includes an electronic paper film and a thin film transistor substrate which are sequentially arranged from the top to the bottom; the electronic paper film is in a rectangular shape; a VCOM electrode is arranged on the thin film transistor substrate, and a VCOM ITO electrode is arranged on the electronic paper film; the VCOM electrode and the VCOM ITO electrode are connected through a silver paste arranged between the thin film transistor substrate and the electronic paper film; the silver paste is in a strip shape; the silver paste is arranged at the edge of one end of the electronic paper film where a conduction area between the VCOM electrode and the VCOM ITO electrode is located; the electronic paper film is used to display images; the thin film transistor substrate is used to control pixel driving. Compared with the prior art, by arranging the silver paste at the edge of one end of the electronic paper film where a conduction area between the VCOM electrode and the VCOM ITO electrode is located, not only can the conduction area of ​​the silver paste be effectively increased and the driving ability of the VCOM ITO on the electronic paper film be improved, but also the ear hole can be removed, and the outer shape of the electronic paper film and the PS protective film can be rectangularized, thereby greatly reducing the peripheral size of the electronic paper film, the protective film, and the thin film transistor, thereby achieving a narrow frame, a high screen-to-body ratio, and a low cost of the electronic paper screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0023] Figure 1 A planar structural diagram of an electronic paper screen provided by an embodiment of the present invention;

[0024] Figure 2 A longitudinal cross-sectional view of the position AA' provided for an embodiment of the present invention;

[0025] Figure 3 A longitudinal cross-sectional view of the position AA' provided for an embodiment of the present invention;

[0026] Figure 4 A longitudinal cross-sectional view of the position AA' provided for an embodiment of the present invention;

[0027] Figure 5 A planar structural diagram of an electronic paper screen and an electronic paper film provided in an embodiment of the present invention;

[0028] Figure 6 A planar structural diagram of an electronic paper screen and an electronic paper film provided in an embodiment of the present invention;

[0029] Figure 7 A planar structural diagram of an electronic paper screen and an electronic paper film provided in an embodiment of the present invention;

[0030] Figure 8 A flow chart of a method for producing an electronic paper screen provided by an embodiment of the present invention;

[0031] Fig. 9 A flow chart of a method for producing an electronic paper screen provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0032] To make the purpose, technical solution and advantages of the embodiments of the present invention more clear, the embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings. Here, the exemplary embodiments of the present invention and their descriptions are used to explain the present invention, but are not intended to limit the present invention.

[0033] The acquisition, storage, use, and processing of data in the technical solution of this application comply with the relevant provisions of national laws and regulations.

[0034] The term "and / or" herein only describes an association relationship, indicating that three relationships may exist. For example, A and / or B may represent the following three situations: A exists alone, A and B exist at the same time, and B exists alone. In addition, the term "at least one" herein represents any combination of at least two of any one or more of a plurality of. For example, including at least one of A, B, and C may represent including any one or more elements selected from the set consisting of A, B, and C.

[0035] In the description of this specification, the terms "include", "including", "have", "contain", etc. are all open terms, which mean including but not limited to. The descriptions with reference to the terms "one embodiment", "a specific embodiment", "some embodiments", "for example", etc. mean that the specific features, structures or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. The order of steps involved in each embodiment is used to schematically illustrate the implementation of the present application, and the order of steps is not limited and can be appropriately adjusted as needed.

[0036] An electronic paper screen provided by an embodiment of the present invention comprises an electronic paper film and a thin film transistor substrate arranged in sequence from the top to the bottom; the shape of the electronic paper film is rectangular;

[0037] It should be noted that the thin film transistor substrate includes a thin film transistor array and a glass substrate.

[0038] A VCOM electrode is provided on the thin film transistor substrate, and a VCOM ITO electrode is provided on the electronic paper film;

[0039] The VCOM electrode and the VCOM ITO electrode are connected through a silver glue arranged between the thin film transistor substrate and the electronic paper film; the silver glue is in the shape of a strip; the silver glue is arranged at the edge of one end of the electronic paper film where the conduction area between the VCOM electrode and the VCOM ITO electrode is located;

[0040] Electronic paper films are used to display images;

[0041] The thin film transistor substrate is used to control pixel driving.

[0042] An electronic paper screen provided by an embodiment of the present invention further includes: a PS protective film and an edge-sealing adhesive arranged on the periphery of the PS protective film; the PS protective film covers the electronic paper film; the shape of the PS protective film is rectangular;

[0043] PS protective film is used to protect the electronic paper film and isolate water vapor;

[0044] Edge sealing glue is used to fill the gap between the PS protective film and the thin film transistor substrate to isolate water vapor.

[0045] An electronic paper screen provided by an embodiment of the present invention further includes: an integrated circuit IC and a flexible circuit board FPC; in a possible implementation manner, the IC and the FPC are separately arranged on a thin film transistor substrate.

[0046] In an embodiment of the present invention, the FPC is used to realize the electrical connection between the IC and the external circuit, that is, the PCB control circuit outside the electronic paper screen. The FPC serves as a connector to transmit the power signal, control command, image data, etc. of the external circuit to the IC. The IC processes the control command and image data and converts them into the control timing of the TFT substrate to realize image display.

[0047] Figure 1 This is a planar structural diagram of the electronic paper screen provided in an embodiment of the present invention. It can be seen from the figure that the PS protective film is in a rectangular shape, the edge of the PS protective film is located outside the edge of the electronic paper film FPL and the edge of the silver glue Ag glue, and the PS protective film completely wraps the FPL and the silver glue.

[0048] The FPL is rectangular in shape. The FPL completely covers the transition area Border area and the effective display area AA area of ​​the thin film transistor TFT substrate, and a strip electrode area is provided at the lower edge of the FPL. The silver glue is arranged at the edge of one end of the electronic paper film where the conduction area between the VCOM electrode and the VCOM ITO electrode is located. The silver glue covers the entire FPL electrode area, and the area of ​​the electrode area is the effective conduction area of ​​the silver glue. The length of the first side and the second side of the silver glue is equal to the length of one side of the electronic paper film where it is located. The silver glue is arranged at the edge of one side of the electronic paper film adjacent to the integrated circuit IC and the flexible circuit board FPC.

[0049] The Border area is in the shape of a closed ring, the inner edge and the outer edge of the ring are in the shape of a rectangle, the Border area surrounds the AA area; the AA area is in the shape of a rectangle.

[0050] The above scheme, by setting silver glue at the edge of one end of the electronic paper film where the conduction area between the VCOM electrode and the VCOM ITO electrode is located, can not only effectively increase the conduction area of ​​the silver glue and improve the driving ability of the VCOM ITO on the electronic paper film, but also remove the ear holes and rectangularize the appearance of the electronic paper film and the PS protective film, thereby greatly reducing the peripheral dimensions of the electronic paper film, the protective film, and the thin film transistor, thereby achieving a narrow frame, a high screen-to-body ratio, and a low cost for the electronic paper screen.

[0051] Figure 2 The embodiment of the present invention provides Figure 1The longitudinal cross-section at the A-A' position in the figure. It can be seen from the figure that the distance of the edge of the PS protective film beyond the edge of the Ag glue is a; the edge of the PS protective film is provided within the range beyond the edge of the FPL, and the edge of the PS protective film and the TFT substrate are bonded together by the edge of the edge of the edge to prevent water vapor from entering the FPL; the Ag glue is located at the edge of the FPL, the distance from the outer edge of the Ag glue to the edge of the FPL is b, and the distance from the inner edge of the Ag glue to the edge of the FPL is c.

[0052] The position of the Ag glue corresponds to areas 1-1 and 1-2 on the TFT array, area 1-1 is located outside the edge of the FPL, and area 1-2 is located inside the edge of the FPL. The first side of the silver glue and the first part of the upper surface adjacent to the first side are connected to the edge sealing glue, and the second side of the silver glue and the second part of the upper surface adjacent to the second side are connected to the electronic paper film.

[0053] In a possible implementation manner, an area of ​​the first portion of the upper surface is half of an area of ​​the upper surface, and an area of ​​the second portion of the upper surface is half of an area of ​​the upper surface.

[0054] The area of ​​the first part of the upper surface may also be one third of the area of ​​the upper surface, and the area of ​​the second part of the upper surface may be two thirds of the area of ​​the upper surface, which is not specifically limited in the embodiment of the present invention.

[0055] The TFT substrate is provided with VCOM electrodes at the positions of area 1-1 and area 1-2. The VCOM electrodes are connected to the VCOM ITO on the FPL through Ag glue to provide driving voltage for the VCOM ITO on the FPL. The bottom surface of the silver glue is connected to the VCOM electrode on the thin film transistor substrate. The area of ​​the VCOM electrode on the TFT array is the same as the area of ​​the Ag glue.

[0056] In a possible implementation, the conductive area of ​​the silver paste is greater than 2π square millimeters.

[0057] Region 3 of the TFT array corresponds to the Border area of ​​the electronic paper screen, and the width of the Border area is e. Region 2 is set between region 1 and region 3 of the TFT array, and the width of region 2 is d. Region 2 is used to isolate the Ag glue point and the Border area to prevent the Ag glue from accidentally overlapping the ITO electrode in the Border area, and to prevent the FPL from entering the Border area due to edge damage caused by laser cutting at the Ag glue point.

[0058] Area 4 of the TFT array corresponds to the AA area, which is the effective display area of ​​the electronic paper screen. Area 2 and area 3 are arranged between area 1 and area 4. The spacing distance between area 1 and area 4 is d+e. Area 2 and area 3 are used to isolate the Ag glue and the AA area to prevent the FPL from entering the AA area during use due to edge damage caused by laser cutting at the Ag glue.

[0059] Considering the material characteristics, process capabilities and the maximum process fluctuation, the electronic paper screen can still display normally. The size range requirements for a, b, c, d, and e are as follows: 1. 0.5mm≤a≤1mm; 2. 0mm <b≤1mm;3、0<c≤1mm;4、0.3mm≤d≤1mm;5、0mm≤e≤1mm。

[0060] As shown in Table 1, the conduction area of ​​the Ag paste in the prior art and the embodiment of the present invention is compared. Assume that the effective conduction area of ​​a single strip edge Ag paste in the embodiment of the present invention is L×W, where L is the lateral length of the AA area and W is the width of the electrode area on the electronic paper film FPL.

[0061] Table 1

[0062]

[0063] By comparing the conduction area of ​​Ag glue, it can be seen that: when the W value is constant, due to the large L value, the area of ​​S3 is much larger than S1 and S2, so the strip edge Ag glue has a larger conduction area and better conduction capability; when the conduction area is constant (S3=S1 or S3=S2), due to the large L value, the W value will be very small, so the strip Ag glue can achieve a smaller FPL size.

[0064] In a possible implementation, the area of ​​the VCOM electrode on the TFT array is larger than the area of ​​the Ag glue, such as Figure 3 As shown, the area of ​​the VCOM electrode on the TFT array includes and is larger than area 1-1 and area 1-2.

[0065] In another possible implementation, the area of ​​the VCOM electrode on the TFT array is different from the area of ​​the Ag glue. Figure 4 As shown, the area of ​​the VCOM electrode on the TFT array includes and is larger than area 1-1, and does not overlap with area 1-2. Half of the bottom surface of the silver paste is connected to the VCOM electrode on the thin film transistor substrate.

[0066] In the embodiment of the present invention, the number of Ag pastes can be multiple, and the Ag paste is arranged at any position on the edge of one end of the electronic paper film where the conduction area between the VCOM electrode and the VCOM ITO electrode is located. Figure 5 As shown, the left side is a planar structure diagram of the electronic paper screen, and the right side is a planar structure diagram of the FPL in the electronic paper screen.

[0067] In a possible implementation manner, two electrode regions are respectively disposed at left and right ends of the lower edge of the FPL, and two strip-shaped Ag glues are disposed at the edges of the FPL corresponding to the electrode regions.

[0068] like Figure 6As shown, the left side is a planar structure diagram of the electronic paper screen, and the right side is a planar structure diagram of the FPL in the electronic paper screen.

[0069] In a possible implementation manner, two electrode regions are respectively disposed at the lower edges of the FPL, and two strip-shaped Ag glues are disposed at the edges of the FPL corresponding to the electrode regions.

[0070] like Figure 7 As shown, the left side is a planar structure diagram of the electronic paper screen, and the right side is a planar structure diagram of the FPL in the electronic paper screen.

[0071] In a possible implementation, the electrode area is arranged at the upper edge of the FPL, and the strip Ag glue is arranged at the FPL edge corresponding to the electrode area. The silver glue is arranged at the edge of the electronic paper film side away from the integrated circuit IC and the flexible circuit board FPC.

[0072] like Figure 8 As shown, the present invention also provides a method for producing an electronic paper screen, comprising:

[0073] S801, attaching the electronic paper film to the thin film transistor substrate.

[0074] S802, coating silver paste on the edge of one end of the electronic paper film where the conduction area between the VCOM electrode and the VCOM ITO electrode is located.

[0075] The VCOM electrode is on the thin film transistor substrate, and the VCOM ITO electrode is on the electronic paper film.

[0076] S803, pre-curing the silver glue.

[0077] In the embodiment of the present invention, UV curing type Ag glue or heat curing type Ag glue is used, and pre-curing is performed using UV light irradiation equipment or infrared light heat curing equipment.

[0078] S804, soldering the integrated circuit IC to the thin film transistor substrate.

[0079] S805, welding the flexible circuit board FPC to the thin film transistor substrate.

[0080] S806, attaching the PS protective film to the electronic paper film.

[0081] In the embodiment of the present invention, after the PS protective film is attached to the electronic paper film, the steps are as follows: Fig. 9 As shown, the details are as follows:

[0082] S901, apply edge sealing glue on the edge of the PS protective film.

[0083] S902, use a vacuum temperature controlled furnace to cure and degas the silver glue and edge sealing glue.

[0084] S903, coating the bonding area of ​​the thin film transistor substrate with silica gel.

[0085] In a possible implementation, in the Ag glue coating process, a glue dispensing needle with an inner diameter of 0.1 mm to 0.5 mm is selected.

[0086] In order to better coat the Ag glue on the edge of the FPL, in a possible implementation, the angle between the needle and the TFT substrate is between 30 degrees and 60 degrees.

[0087] In a possible implementation manner, Ag glue coating is performed by scribing glue coating.

[0088] In the above scheme, the FPL is first attached to the TFT substrate, and then the Ag glue is coated, and the Ag glue needs to be pre-cured after the coating is completed. A narrower strip of Ag glue is achieved. By setting the silver glue at the edge of one end of the electronic paper film where the conduction area between the VCOM electrode and the VCOM ITO electrode is located, it can not only effectively increase the conduction area of ​​the silver glue and improve the driving ability of the VCOM ITO on the electronic paper film, but also remove the ear holes and rectangularize the appearance of the electronic paper film and the PS protective film, thereby greatly reducing the peripheral dimensions of the electronic paper film, protective film, and thin film transistor, thereby achieving a narrow frame, high screen-to-body ratio, and low cost for the electronic paper screen.

[0089] The specific embodiments described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An electronic paper screen, characterized in that: It includes an electronic paper film and a thin film transistor substrate arranged in sequence from the top to the bottom; the shape of the electronic paper film is rectangular; A VCOM electrode is provided on the thin film transistor substrate, and a VCOM ITO electrode is provided on the electronic paper film; The VCOM electrode and the VCOMITO electrode are connected through a silver glue arranged between the thin film transistor substrate and the electronic paper film; the silver glue is in the shape of a strip; the silver glue is arranged at the edge of one end of the electronic paper film where the conduction area between the VCOM electrode and the VCOMITO electrode is located; Electronic paper films are used to display images; The thin film transistor substrate is used to control pixel driving.

2. The electronic paper screen according to claim 1, characterized in that: Also includes: A PS protective film and an edge-sealing adhesive provided on the outer periphery of the PS protective film; the PS protective film covers the electronic paper film; the PS protective film is in a rectangular shape; PS protective film is used to protect the electronic paper film and isolate water vapor; Edge sealing glue is used to fill the gap between the PS protective film and the thin film transistor substrate to isolate water vapor.

3. The electronic paper screen as claimed in claim 2, characterized in that: The first side surface of the silver glue and a first portion of the upper surface adjacent to the first side surface are connected to the edge sealing glue, and the second side surface of the silver glue and a second portion of the upper surface adjacent to the second side surface are connected to the electronic paper film.

4. The electronic paper screen according to claim 1, characterized in that: The conductive area of ​​silver paste is greater than 2π square millimeters.

5. The electronic paper screen according to claim 1, characterized in that: The bottom surface of the silver paste is connected to the VCOM electrode on the thin film transistor substrate.

6. The electronic paper screen as claimed in claim 3, characterized in that: The lengths of the first side surface and the second side surface of the silver glue are equal to the length of one side of the electronic paper film where the silver glue is located.

7. The electronic paper screen according to claim 1, characterized in that: Also includes: Integrated circuit IC and flexible circuit board FPC; IC and FPC are separately arranged on the thin film transistor substrate.

8. The electronic paper screen according to claim 7, characterized in that: The FPC is used to transmit control commands and image data to the IC; the IC is used to process the control commands and image data and convert them into control timing of the thin film transistor substrate to display the image.

9. The electronic paper screen according to claim 7, characterized in that: The silver glue is arranged on the edge of one side of the electronic paper film adjacent to the integrated circuit IC and the flexible circuit board FPC.

10. A method for producing an electronic paper screen, characterized in that: include: attaching the electronic paper film to the thin film transistor substrate; Apply silver glue to the edge of one end of the electronic paper film where the conduction area between the VCOM electrode and the VCOM ITO electrode is located; The VCOM electrode is on the thin film transistor substrate, and the VCOM ITO electrode is on the electronic paper film; Pre-curing the silver glue; Soldering the integrated circuit IC to the thin film transistor substrate; Soldering the flexible circuit board FPC to the thin film transistor substrate; Attach the PS protective film to the electronic paper film; Apply edge sealing glue on the edge of the PS protective film; Use a vacuum temperature-controlled furnace to cure and degas the silver glue and edge-sealing glue; The bonding area of ​​the thin film transistor substrate is coated with silicone.

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