Display substrate and manufacturing method thereof, and display device

Abstract

The present invention provides a display substrate and a manufacturing method thereof, and a display device, which belong to the field of display technology. The display substrate includes: a substrate; a first routing line located on the substrate; a first organic layer located on a side of the first routing line away from the substrate, the first organic layer including a first sub-opening; a first inorganic layer located on a side of the first organic layer away from the substrate, the first inorganic layer including a second sub-opening, the second sub-opening and the first sub-opening forming an opening; a second routing line located on the side walls of the first sub-opening and the second sub-opening, the second routing line being connected to the first routing line; wherein the first orthographic projection of the side wall of the first sub-opening on the substrate is located within the area defined by the second orthographic projection of the side wall of the second sub-opening on the substrate, and the outer boundary of the first orthographic projection does not exceed the inner boundary of the second orthographic projection. The present invention can reduce the bottom frame of the display device.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display substrate and a manufacturing method thereof, and a display device. Background Art

[0002] OLED (Organic Light-Emitting Diode) display devices have been listed as the next generation display technology with great development prospects due to their advantages such as thinness, lightness, wide viewing angle, active light emission, continuously adjustable light color, low cost, fast response speed, low energy consumption, low driving voltage, wide operating temperature range, simple production process, high light emission efficiency and flexible display.

[0003] In recent years, the development of full-screen has been very rapid, which has put forward new requirements for the screen shape. For full-screen display, the impact of the screen border is very important. At present, the bottom border of conventional display devices is larger than other borders. In order to reduce the bottom border, the fanout trace of the bottom border can be placed in the flexible substrate to achieve an ultra-narrow bottom border design. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a display substrate and a manufacturing method thereof, and a display device, which can reduce the bottom frame of the display device.

[0005] To solve the above technical problems, the embodiments of the present invention provide the following technical solutions:

[0006] In one aspect, a display substrate is provided, comprising:

[0007] substrate;

[0008] a first trace located on the substrate;

[0009] a first organic layer located at a side of the first wiring away from the substrate, the first organic layer comprising a first sub-opening;

[0010] A first inorganic layer located on a side of the first organic layer away from the substrate, the first inorganic layer comprising a second sub-opening, the second sub-opening and the first sub-opening forming an opening;

[0011] A second routing line located on the side walls of the first sub-opening and the second sub-opening, the second routing line being connected to the first routing line;

[0012] The first orthographic projection of the side wall of the first sub-opening on the substrate is located within the area defined by the second orthographic projection of the side wall of the second sub-opening on the substrate, and the outer boundary of the first orthographic projection does not exceed the inner boundary of the second orthographic projection.

[0013] In some embodiments, an outer boundary of the first orthographic projection coincides with an inner boundary of the second orthographic projection.

[0014] In some embodiments, the display substrate includes a display area, a binding area, and a bending area.

[0015] The opening is located in a bending area between the display area and the binding area; or

[0016] The opening is located in the display area.

[0017] In some embodiments, the minimum aperture of the second sub-opening is 10-15 um larger than the minimum aperture of the first sub-opening.

[0018] In some embodiments, a sidewall of the first sub-opening is a curved surface, and the curved surface is bent toward a central axis of the first sub-opening.

[0019] In some embodiments, the angle between the curved surface and the substrate gradually decreases in a direction away from the substrate.

[0020] In some embodiments, the display substrate includes a first flexible substrate, a first barrier layer, a second flexible substrate, and a second barrier layer which are arranged in sequence.

[0021] The substrate is the first flexible substrate;

[0022] The first organic layer is the second flexible substrate;

[0023] The first inorganic layer is the second barrier layer;

[0024] The first barrier layer is located between the first trace and the first flexible substrate.

[0025] An embodiment of the present invention further provides a display device, comprising the display substrate as described above.

[0026] An embodiment of the present invention further provides a method for manufacturing a display substrate, comprising:

[0027] forming a first organic layer on a side of the first wiring away from the substrate;

[0028] forming a first inorganic layer on a side of the first organic layer away from the substrate, and patterning the first inorganic layer to form a second sub-opening exposing the first organic layer;

[0029] Coating an organic photosensitive material on the first inorganic layer formed with the second sub-opening, exposing and developing the organic photosensitive material to form a transition via hole penetrating the organic photosensitive material, wherein the organic photosensitive material covers a side wall of the second sub-opening, an orthographic projection of the transition via hole on the substrate is located within an orthographic projection of the second sub-opening on the substrate, and the transition via hole exposes the first organic layer;

[0030] Using the organic photosensitive material and the first inorganic layer as masks, the first organic layer is etched to form a first sub-opening penetrating the first organic layer, wherein the first sub-opening exposes the first wiring, and the second sub-opening and the first sub-opening form an opening;

[0031] removing the remaining organic photosensitive material;

[0032] forming a second routing line located on the sidewalls of the first sub-opening and the second sub-opening, wherein the second routing line is connected to the first routing line;

[0033] The first orthographic projection of the side wall of the first sub-opening on the substrate is located within the area defined by the second orthographic projection of the side wall of the second sub-opening on the substrate, and the outer boundary of the first orthographic projection does not exceed the inner boundary of the second orthographic projection.

[0034] In some embodiments, the thickness of the organic photosensitive material is 3-5 um.

[0035] The embodiments of the present invention have the following beneficial effects:

[0036] In the above scheme, the first orthographic projection of the side wall of the first sub-opening on the substrate is located within the second orthographic projection of the side wall of the second sub-opening on the substrate, and the outer boundary of the first orthographic projection does not exceed the inner boundary of the second orthographic projection. In this way, no undercut structure will appear at the junction of the first sub-opening and the second sub-opening, which can avoid the disconnection of the second wiring in the via hole, ensure the electrical connection between the second wiring and the first wiring, and facilitate the realization of a narrow frame of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 and Figure 2 is a schematic diagram of a conventional display substrate;

[0038] Figure 3-Figure 12 FIG. 2 is a schematic diagram showing a substrate according to an embodiment of the present invention.

[0039] Reference numerals

[0040] 01 The first flexible substrate

[0041] 02 First barrier layer

[0042] 03 Signal connection line

[0043] 04 Second flexible substrate

[0044] 05 Signal line

[0045] 06 Second barrier layer

[0046] 07 Buffer layer

[0047] 08 Active layer

[0048] 09 First gate insulation layer

[0049] 10 First gate metal layer

[0050] 11. Second gate insulating layer

[0051] 12. Second gate metal layer

[0052] 13 Interlayer insulation layer

[0053] 14 Flat layer

[0054] 15 Anode

[0055] 16 Passivation layer

[0056] 17 First source and drain metal layer

[0057] 18 Second source and drain metal layer DETAILED DESCRIPTION

[0058] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention more clear, a detailed description will be given below with reference to the accompanying drawings and specific embodiments.

[0059] like Figure 1 As shown, in order to reduce the bottom frame, the trace 03 of the bottom frame can be placed between the first flexible substrate 01 and the second flexible substrate 04, and the trace 03 is connected to the signal line 05 made of the source and drain metal layer through a via hole to achieve an ultra-narrow bottom frame design. Figure 2 As shown, the via hole penetrates the second flexible substrate 04, the second barrier layer 06, the buffer layer 07, the first gate insulating layer 09, the second gate insulating layer 11 and the interlayer insulating layer 13, wherein the second flexible substrate 04 is made of organic material, and the second barrier layer 06, the buffer layer 07, the first gate insulating layer 09, the second gate insulating layer 11 and the interlayer insulating layer 13 are made of inorganic material. When etching to form the via hole, since the lateral etching rate of the organic material is greater than the lateral etching rate of the inorganic material, the following will occur Figure 2 The undercut structure in the middle dotted box makes it easy for signal line 05 to be disconnected at the undercut structure, resulting in poor connection with routing line 03.

[0060] In order to solve the above problems, embodiments of the present invention provide a display substrate and a manufacturing method thereof, and a display device, which can reduce the bottom frame of the display device.

[0061] An embodiment of the present invention provides a display substrate, such as Figure 3 As shown, including:

[0062] substrate;

[0063] A first trace A1 located on the substrate;

[0064] A first organic layer A2 located at a side of the first wiring A1 away from the substrate, the first organic layer including a first sub-opening A5;

[0065] A first inorganic layer A3 located at a side of the first organic layer A2 away from the substrate, the first inorganic layer comprising a second sub-opening A6, the second sub-opening and the first sub-opening forming an opening;

[0066] A second wiring A4 located on the side walls of the first sub-opening A5 and the second sub-opening A6, wherein the second wiring A4 is connected to the first wiring A1;

[0067] like Figure 4 As shown, a first orthographic projection A7 of the side wall of the first sub-opening A5 on the substrate is located within a region defined by a second orthographic projection A8 of the side wall of the second sub-opening A6 on the substrate, and an outer boundary of the first orthographic projection A7 does not exceed an inner boundary of the second orthographic projection A8.

[0068] In the present embodiment, a first orthographic projection of the side wall of the first sub-opening on the substrate is located within a second orthographic projection of the side wall of the second sub-opening on the substrate, and an outer boundary of the first orthographic projection does not exceed an inner boundary of the second orthographic projection, so that no undercut structure will appear at the junction of the first sub-opening and the second sub-opening. By changing the via structure, the present embodiment can avoid disconnection of the portion of the second wiring in the via, thereby ensuring electrical connection between the second wiring and the first wiring, and facilitating realization of a narrow bezel of the display device.

[0069] In some embodiments, Figure 4 As shown, the outer boundary of the first orthographic projection A7 coincides with the inner boundary of the second orthographic projection A8, so that a smooth transition can be achieved at the junction of the first sub-opening and the second sub-opening, thereby optimizing the electrical connection between the second routing line and the first routing line.

[0070] In some embodiments, the display substrate includes a display area, a binding area and a bending area, the opening is located in the display area, the opening is located in the bending area between the display area and the binding area; or, the opening is located in the display area.

[0071] In some embodiments, the first wiring is a signal connection line, the second wiring is a signal line, the substrate is a first flexible substrate, the first organic layer is a second flexible substrate, and the first inorganic layer is a second barrier layer. Fig.10 As shown, the display substrate includes a flexible substrate substrate, which is composed of a first flexible substrate 01, a first barrier layer 02, and a second flexible substrate 04. A second barrier layer 06, a buffer layer 07, an active layer 08, a first gate insulating layer 09, a first gate metal layer 10, a second gate insulating layer 11, a second gate metal layer 12, an interlayer insulating layer 13, a source-drain metal layer, a flat layer 14, and an anode 15 are sequentially arranged on the flexible substrate substrate. In order to reduce the frame, a signal connection line 03 is arranged on the first barrier layer 02 and between the second flexible substrate 04. The signal connection line 03 is connected to a signal line 05 formed by the source-drain metal layer through an opening that penetrates the second flexible substrate 04 and the second barrier layer 06. Of course, according to the film layer stacking and patterning conditions, the opening can also penetrate the buffer layer 07, the first gate insulating layer 09, the second gate insulating layer 11, and the interlayer insulating layer 13.

[0072] The second barrier layer 06 is the first inorganic layer adjacent to the second flexible substrate 04, and the junction between the second sub-opening and the first sub-opening of the second barrier layer 06 does not have an undercut structure, thereby ensuring the electrical connection between the signal line 05 and the signal connection line 03. Fig.10 As shown, the buffer layer 07, the first gate insulating layer 09, the second gate insulating layer 11 and the interlayer insulating layer 13 constitute the remaining film layer of the inorganic insulating layer, and the remaining film layer includes a third sub-opening. Since the remaining film layer and the second barrier layer 06 are generally made of inorganic insulating materials, there will be no undercut structure at the junction of the third sub-opening and the second sub-opening, and the signal line 05 will not be disconnected at the junction of the third sub-opening and the second sub-opening.

[0073] like Fig.10 As shown, the signal line 05 at the opening is disconnected, and two parts of the signal line 05 are respectively connected to the signal connection line 03 , and the two disconnected parts of the signal line 05 are connected through the signal connection line 03 .

[0074] In this embodiment, the minimum aperture of the second sub-opening is greater than or equal to the maximum aperture of the first sub-opening, the minimum aperture of the second sub-opening may be equal to the maximum aperture of the first sub-opening, and the minimum aperture of the second sub-opening is 10-15um larger than the minimum aperture of the first sub-opening. Figure 7 As shown, the minimum aperture of the second sub-opening (the part within the dotted frame) is D1. Fig. 9As shown, the maximum aperture of the first sub-opening (the part in the dotted box) is D2, and D2 can be 90-100um, such as 95um; D1 can be 100-110um, such as 105um. Among them, the second sub-opening and the first sub-opening can be circular holes, the minimum aperture is the diameter of the inner boundary of the sub-opening side wall, and the maximum aperture is the diameter of the outer boundary of the sub-opening side wall. Alternatively, the second sub-opening and the first sub-opening can be square holes, the minimum aperture is the minimum side length of the inner boundary of the sub-opening side wall, and the maximum aperture is the minimum side length of the outer boundary of the sub-opening side wall.

[0075] In order to ensure the continuity of the signal line 05 on the side wall of the first sub-opening, as Fig. 9 As shown, the side wall of the first sub-opening is a curved surface, and the curved surface is bent toward the central axis of the first sub-opening, so that the side wall of the first sub-opening can form a smooth arc.

[0076] In some embodiments, the angle between the curved surface and the substrate gradually decreases in a direction away from the substrate. In an area close to the second flexible substrate 04, the angle between the tangent of the curved surface and the second flexible substrate 04 may be 60-70°, and in an area away from the second flexible substrate 04, the angle between the tangent of the curved surface and the second flexible substrate 04 may be 30-40°.

[0077] In some embodiments, the opening is located in the bending area between the display area and the binding area, the first wiring is a signal connection line (i.e., a fan-out wiring), the second wiring is a signal line, the substrate is a first flexible substrate, the first organic layer is a second flexible substrate, the first inorganic layer is a second barrier layer, and the first wiring and the first flexible substrate are separated by a first barrier layer. Fig.12 As shown, the display substrate includes a flexible substrate substrate, which is composed of a first flexible substrate 01, a first barrier layer 02, and a second flexible substrate 04. A second barrier layer 06, an active layer 08, a first gate insulating layer 09, a first gate metal layer 10, a second gate insulating layer 11, a second gate metal layer 12, an interlayer insulating layer 13, a first source-drain metal layer 17, a passivation layer 16, a flat layer 14, and a second source-drain metal layer 18 are sequentially arranged on the flexible substrate substrate. In the bending area, a signal connection line 03 is arranged on the first barrier layer 02 and between the second flexible substrate 04. The signal connection line 03 is connected to a signal line 05 formed by the first gate metal layer 10 through an opening K1 that penetrates the second flexible substrate 04 and the second barrier layer 06. Of course, according to the film layer stacking and patterning conditions, the opening can also penetrate the first gate insulating layer 09.

[0078] The second barrier layer 06 is the first inorganic layer adjacent to the second flexible substrate 04 , and no undercut structure appears at the junction of the second sub-opening of the second barrier layer 06 and the first sub-opening of the second flexible substrate 04 , thereby ensuring electrical connection between the signal line 05 and the signal connection line 03 .

[0079] like Fig.12 As shown, the signal line 05 is disconnected in the bending area, and the two parts of the signal line 05 are connected to the signal connection line 03 through the vias G1 and G2 respectively, and the two disconnected parts of the signal line 05 are connected through the signal connection line 03.

[0080] In this embodiment, the minimum aperture of the second sub-opening is greater than or equal to the maximum aperture of the first sub-opening, the minimum aperture of the second sub-opening may be equal to the maximum aperture of the first sub-opening, and the minimum aperture of the second sub-opening is 10-15um larger than the minimum aperture of the first sub-opening. The second sub-opening and the first sub-opening may be circular holes, the minimum aperture is the diameter of the inner boundary of the sub-opening side wall, and the maximum aperture is the diameter of the outer boundary of the sub-opening side wall. Alternatively, the second sub-opening and the first sub-opening may be square holes, the minimum aperture is the minimum side length of the inner boundary of the sub-opening side wall, and the maximum aperture is the minimum side length of the outer boundary of the sub-opening side wall.

[0081] An embodiment of the present invention further provides a display device, comprising the display substrate as described above. The display device of this embodiment may be an OLED display device or a QLED (quantum dot light emitting diode) display device.

[0082] The display device includes but is not limited to: a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply. Those skilled in the art will appreciate that the structure of the above-mentioned display device does not constitute a limitation on the display device, and the display device may include more or less of the above-mentioned components, or a combination of certain components, or different component arrangements. In an embodiment of the present invention, the display device includes but is not limited to a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, and the like.

[0083] The display device may be any product or component with a display function, such as a television, a monitor, a digital photo frame, a mobile phone, a tablet computer, etc., wherein the display device further includes a flexible circuit board, a printed circuit board and a backplane.

[0084] An embodiment of the present invention further provides a method for manufacturing a display substrate, comprising:

[0085] providing a substrate;

[0086] forming a first trace on the substrate;

[0087] forming a first organic layer on a side of the first wiring away from the substrate;

[0088] forming a first inorganic layer on a side of the first organic layer away from the substrate, and patterning the first inorganic layer to form the second sub-opening exposing the first organic layer;

[0089] Coating an organic photosensitive material on the first inorganic layer formed with the second sub-opening, exposing and developing the organic photosensitive material to form a transition via hole penetrating the organic photosensitive material, wherein the organic photosensitive material covers a side wall of the second sub-opening, an orthographic projection of the transition via hole on the substrate is located within an orthographic projection of the second sub-opening on the substrate, and the transition via hole exposes the first organic layer;

[0090] Using the organic photosensitive material and the first inorganic layer as masks, etching the first organic layer to form a first sub-opening penetrating the first organic layer, wherein the first sub-opening exposes the first wiring, and the second sub-opening and the first sub-opening form an opening;

[0091] removing the remaining organic photosensitive material;

[0092] forming a second routing line located on the sidewalls of the first sub-opening and the second sub-opening, wherein the second routing line is connected to the first routing line;

[0093] like Figure 4 As shown, a first orthographic projection A7 of the side wall of the first sub-opening A5 on the substrate is located within a region defined by a second orthographic projection A8 of the side wall of the second sub-opening A6 on the substrate, and an outer boundary of the first orthographic projection A7 does not exceed an inner boundary of the second orthographic projection A8.

[0094] In this embodiment, the first orthographic projection of the side wall of the first sub-opening on the substrate is located within the second orthographic projection of the side wall of the second sub-opening on the substrate, and the outer boundary of the first orthographic projection does not exceed the inner boundary of the second orthographic projection. In this way, no undercut structure will appear at the junction of the first sub-opening and the second sub-opening, which can avoid the disconnection of the second wiring in the via hole, ensure the electrical connection between the second wiring and the first wiring, and facilitate the realization of a narrow frame of the display device.

[0095] In some embodiments, such as Figure 4 As shown, the outer boundary of the first orthographic projection A7 coincides with the inner boundary of the second orthographic projection A8, so that a smooth transition can be achieved at the junction of the first sub-opening and the second sub-opening, thereby optimizing the electrical connection between the second routing line and the first routing line.

[0096] In some embodiments, the display substrate includes a display area, a binding area and a bending area, the opening is located in the display area, the opening is located in the bending area between the display area and the binding area; or, the opening is located in the display area.

[0097] In some embodiments, the first wiring is a signal connection line, the second wiring is a signal line, the substrate is a first flexible substrate, the first organic layer is a second flexible substrate, and the first inorganic layer is a second barrier layer. Fig.10 As shown, the display substrate includes a flexible substrate substrate, which is composed of a first flexible substrate 01, a first barrier layer 02, and a second flexible substrate 04. A second barrier layer 06, a buffer layer 07, an active layer 08, a first gate insulating layer 09, a first gate metal layer 10, a second gate insulating layer 11, a second gate metal layer 12, an interlayer insulating layer 13, a source-drain metal layer, a flat layer 14, and an anode 15 are sequentially arranged on the flexible substrate substrate. In order to reduce the frame, a signal connection line 03 is arranged on the first barrier layer 02 and between the second flexible substrate 04. The signal connection line 03 is connected to a signal line 05 formed by the source-drain metal layer through an opening that penetrates the second flexible substrate 04 and the second barrier layer 06. Of course, according to the film layer stacking and patterning conditions, the opening can also penetrate the buffer layer 07, the first gate insulating layer 09, the second gate insulating layer 11, and the interlayer insulating layer 13.

[0098] like Figure 5-Figure 10 As shown, the manufacturing method of this embodiment includes the following steps:

[0099] Step 1: Figure 5 As shown, a first flexible substrate 01 is provided, and a first barrier layer 02 is formed on the first flexible substrate 01;

[0100] The first flexible substrate 01 may be made of a polyimide film, and the first barrier layer 02 may be made of an inorganic insulating material, such as silicon nitride or silicon oxide. Of course, the first flexible substrate 01 may also be replaced by a hard substrate.

[0101] Step 2: Figure 6 As shown, a signal connection line 03 is formed on the first barrier layer 02;

[0102] Specifically, a conductive structure can be deposited on the first barrier layer 02, and the conductive structure can be patterned to form a signal connection line 03. The conductive structure can adopt a Mo or Ti / Al / Ti stacked structure. The signal connection line 03 can be located in the area where the GOA driving circuit is located, which can save the area occupied by the frame.

[0103] Step 3: Figure 7 As shown, a second flexible substrate 04 and a second barrier layer 06 are formed, and a second sub-opening penetrating the second barrier layer 06 is formed;

[0104] The second flexible substrate 04 may be made of a polyimide film, and the second barrier layer 06 may be made of an inorganic insulating material, such as silicon nitride or silicon oxide.

[0105] The second barrier layer 06 is etched, such as dry etching, to form a second sub-opening (shown in the dotted frame) penetrating the second barrier layer 06 . The minimum aperture D1 of the second sub-opening may be 100 um. The second sub-opening exposes the second flexible substrate 04 .

[0106] Step 4: Figure 8 As shown, an organic photosensitive material is formed on the second barrier layer 06, and the organic photosensitive material is exposed and developed to form a transition via hole that penetrates the organic photosensitive material;

[0107] The orthographic projection of the transition via on the first flexible substrate 01 is located within the orthographic projection of the second sub-opening on the first flexible substrate 01, and the transition via exposes the second flexible substrate 04. It is worth noting that the organic photosensitive material needs to cover the side wall of the second sub-opening, and the thickness of the organic photosensitive material covering the side wall of the second sub-opening needs to be determined according to the lateral etching rate. In this embodiment, the thickness of the organic photosensitive material can be 3-5um.

[0108] Step 5: Fig. 9 As shown, the second flexible substrate 04 is etched using the organic photosensitive material and the second barrier layer 06 as masks to form a first sub-opening penetrating the second flexible substrate 04, wherein the first sub-opening exposes the signal connection line 03;

[0109] The second flexible substrate 04 is made of organic material, and the problem of lateral etching cannot be avoided. In this embodiment, the second flexible substrate 04 is etched using the organic photosensitive material and the second barrier layer 06 as a mask, and the organic photosensitive material covers the second barrier layer 06. The lateral etching rate of the organic photosensitive material is similar to that of the second flexible substrate 04. While the second flexible substrate 04 is longitudinally etched, the organic photosensitive material and the second flexible substrate 04 are laterally etched at a slower rate, and the etching rate is controlled so that when the longitudinal etching of the second flexible substrate 04 exposes the signal connection line 03, the organic photosensitive material on the side wall of the second sub-opening is completely etched or part of the organic photosensitive material remains, and then the remaining organic photosensitive material is removed.

[0110] like Fig.10 As shown, since the lateral etching rate is lower than the longitudinal etching rate in the direction from far away from the second flexible substrate 04 to close to the second flexible substrate 04, the side wall of the first sub-opening of the second flexible substrate 04 can form a smooth arc. The minimum aperture of the first sub-opening can be 90-100um, such as 95um, and the first sub-opening exposes the signal connection line 03.

[0111] Step 6: Fig.10 As shown, a remaining film layer of the inorganic insulating layer is formed; the remaining film layer is patterned to form a third sub-opening penetrating the remaining film layer, wherein the third sub-opening, the second sub-opening and the first sub-opening constitute the opening exposing the signal connection line 03;

[0112] The buffer layer 07, the first gate insulating layer 09, the second gate insulating layer 11 and the interlayer insulating layer 13 constitute the remaining film layer of the inorganic insulating layer, and the remaining film layer includes the third sub-opening. Since the remaining film layer and the second barrier layer 06 are generally made of inorganic insulating materials, there will be no undercut structure at the junction of the third sub-opening and the second sub-opening, and the signal line 05 will not be disconnected at the junction of the third sub-opening and the second sub-opening.

[0113] Step 7: Fig.10 As shown, a source-drain metal layer is deposited, and the source-drain metal layer is patterned to form a signal line 05;

[0114] There will be no undercut structure at the junction of the second sub-opening and the first sub-opening. Therefore, the signal line 05 will not be disconnected at the junction of the first sub-opening and the second sub-opening and can be electrically connected to the signal connection line 03.

[0115] like Fig.10 As shown, the signal line 05 at the opening is disconnected, and two parts of the signal line 05 are respectively connected to the signal connection line 03 , and the two disconnected parts of the signal line 05 are connected through the signal connection line 03 .

[0116] Step 8: Fig.10 and Fig.11 As shown, a planarization layer 14 and an anode 15 are formed.

[0117] like Fig.10 As shown, the planar layer 14 can be patterned to form a planar layer 14 via hole exposing the signal line 05; Fig.11 As shown, the flat layer 14 may not be patterned so that the flat layer 14 fills the depression above the signal line 05. In this way, the flat layer 14 can also protect the signal line 05 at the opening, and when the display substrate is bent, the signal line can be located in the neutral layer through the flat layer 14 and is not easily broken.

[0118] The display substrate of the present embodiment can be formed through the above steps 1-8, and other structures of the display substrate, such as spacers, pixel defining layers, etc., can be formed thereafter, which will not be described in detail here.

[0119] In the various method embodiments of the present invention, the serial numbers of the steps cannot be used to limit the sequence of the steps. For ordinary technicians in this field, without paying creative work, changes to the sequence of the steps are also within the protection scope of the present invention.

[0120] It should be noted that each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the embodiments, since they are basically similar to the product embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the product embodiments.

[0121] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0122] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0123] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0124] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display substrate, characterized in that: include: substrate; a first trace located on the substrate; a first organic layer located on a side of the first trace away from the substrate, the first organic layer comprising a first sub-opening, a sidewall of the first sub-opening being a curved surface, the curved surface being bent toward a central axis of the first sub-opening, an angle between a tangent of the curved surface and the substrate being 60-70° in a region close to the substrate, and an angle between a tangent of the curved surface and the substrate being 30-40° in a region away from the substrate; A first inorganic layer located on a side of the first organic layer away from the substrate, the first inorganic layer comprising a second sub-opening, the second sub-opening and the first sub-opening forming an opening; a second wiring located on side walls of the first sub-opening and the second sub-opening, the second wiring being connected to the first wiring, and the second wiring being in direct contact with the first organic layer; The first orthographic projection of the side wall of the first sub-opening on the substrate is located within the area defined by the second orthographic projection of the side wall of the second sub-opening on the substrate, and the outer boundary of the first orthographic projection does not exceed the inner boundary of the second orthographic projection.

2. The display substrate according to claim 1, characterized in that: An outer boundary of the first orthographic projection coincides with an inner boundary of the second orthographic projection.

3. The display substrate according to claim 1, characterized in that: The display substrate includes a display area, a binding area and a bending area. The opening is located in a bending area between the display area and the binding area; or The opening is located in the display area.

4. The display substrate according to claim 1, characterized in that: The minimum aperture of the second sub-opening is 10-15 um larger than the minimum aperture of the first sub-opening.

5. The display substrate according to claim 1, characterized in that: Along the direction away from the substrate, the angle between the curved surface and the substrate gradually decreases.

6. The display substrate according to claim 1, characterized in that: The display substrate includes a first flexible substrate, a first barrier layer, a second flexible substrate, and a second barrier layer which are arranged in sequence. The substrate is the first flexible substrate; The first organic layer is the second flexible substrate; The first inorganic layer is the second barrier layer; The first barrier layer is located between the first trace and the first flexible substrate.

7. A display device, characterized in that: The invention comprises a display substrate as claimed in any one of claims 1 to 6.

8. A method for manufacturing a display substrate, characterized in that: include: providing a substrate; forming a first trace on the substrate; forming a first organic layer on a side of the first wiring away from the substrate; forming a first inorganic layer on a side of the first organic layer away from the substrate, and patterning the first inorganic layer to form a second sub-opening exposing the first organic layer; Coating an organic photosensitive material on the first inorganic layer formed with the second sub-opening, exposing and developing the organic photosensitive material to form a transition via hole penetrating the organic photosensitive material, wherein the organic photosensitive material covers a side wall of the second sub-opening, an orthographic projection of the transition via hole on the substrate is located within an orthographic projection of the second sub-opening on the substrate, and the transition via hole exposes the first organic layer; The first organic layer is etched using the organic photosensitive material and the first inorganic layer as masks to form a first sub-opening penetrating the first organic layer, wherein the first sub-opening exposes the first wiring, the second sub-opening and the first sub-opening form an opening, the sidewall of the first sub-opening is a curved surface, the curved surface is bent toward the central axis of the first sub-opening, in an area close to the substrate, the angle between the tangent of the curved surface and the substrate is 60-70°, and in an area far from the substrate, the angle between the tangent of the curved surface and the substrate is 30-40°; removing the remaining organic photosensitive material; forming a second wiring located on the sidewalls of the first sub-opening and the second sub-opening, wherein the second wiring is connected to the first wiring, and the second wiring is in direct contact with the first organic layer; The first orthographic projection of the side wall of the first sub-opening on the substrate is located within the area defined by the second orthographic projection of the side wall of the second sub-opening on the substrate, and the outer boundary of the first orthographic projection does not exceed the inner boundary of the second orthographic projection.

9. The method for manufacturing a display substrate according to claim 8, characterized in that: The thickness of the organic photosensitive material is 3-5um 。

Images