Electrical data analysis method and device, wafer-level test equipment and storage medium

Abstract

The invention relates to an electrical data analysis method and device, wafer-level test equipment and a storage medium. The method comprises the following steps: acquiring electrical test data of a test target; the data attributes of the electrical test data comprise the structure-related attributes and the test-related attributes of the test target; judging whether the electrical property test data of the test target is invalid or not based on the structure related attributes of the electrical property test data and a first judgment standard so as to determine electrical property failure data; classifying the electrical failure data according to a structure related attribute, a test related attribute and a second judgment standard of the electrical test data so as to determine a failure mode corresponding to the electrical failure data; and determining a test problem root cause corresponding to the failure mode of the electrical failure data based on a preset failure mode and test problem classification relationship. Through the method, the test efficiency can be improved.

Description

Technical Field

[0001] The present application relates to the field of electrical testing technology, and in particular to an electrical data analysis method, device, wafer-level testing equipment and storage medium. Background Art

[0002] In the field of semiconductor electrical testing, there are abnormal test data in semiconductor testing. In addition to the abnormal data points generated by the test target itself, various factors such as the stability of the test machine, the wear of the test probe card, and the limited application range of the test algorithm can also cause test errors, thereby obtaining problematic data points. If these problematic test data points are statistically processed together with valid data points, it may affect the conclusions drawn from the electrical data analysis, or even get the opposite conclusion, thereby affecting the direction of process adjustment and even causing economic losses.

[0003] In the related art, electrical test data information only includes the structure and characteristic-related attributes of the test target itself. Even if a test problem occurs, it is impossible to identify the validity of the test data, let alone determine which part of the test has a problem, which is not conducive to the subsequent improvement of similar problems. Summary of the invention

[0004] Based on this, it is necessary to provide a method, device, equipment and storage medium capable of electrical data analysis in order to address the above technical issues.

[0005] In a first aspect, the present application provides an electrical data analysis method, the method comprising: Acquire electrical test data of a test target; the data attributes of the electrical test data include structure-related attributes and test-related attributes; Based on the structure-related attributes of the electrical test data and the first judgment criterion, judging whether the electrical test data of the test target is invalid, so as to determine electrical failure data; Classify the electrical failure data according to the structure-related attributes, the test-related attributes and the second judgment criterion of the electrical test data to determine the failure mode corresponding to the electrical failure data; Based on a preset relationship between failure modes and test problem classification, a root cause of the test problem corresponding to the failure mode of the electrical failure data is determined.

[0006] In some of these embodiments, the test-related attributes include one or more of a test structure type, a needle insertion order, a probe card, a test algorithm, and a SMU.

[0007] In some embodiments, judging whether the electrical test data of the test target is invalid based on the structure-related attribute of the electrical test data and the first judgment criterion to determine the electrical failure data includes: Determine a plurality of test items corresponding to the electrical test data of the test target; Obtaining standard data ranges of several structure-related attribute values ​​corresponding to each of the test items; The electrical test data are compared and analyzed with the corresponding standard data ranges of several structure-related property values ​​according to the test items, and the electrical failure data are determined according to the analysis results.

[0008] In some embodiments, the electrical failure data is classified according to the structure-related attribute, the test-related attribute and the second judgment criterion of the electrical test data to determine the failure mode corresponding to the electrical failure data, including: Determining the test data failure rate under each test parameter in the test-related attribute of the electrical failure data based on the structure-related attribute and the test-related attribute of the electrical test data of the test target; The test data failure rates corresponding to the test parameters of the electrical failure data are compared with preset failure standards, and the failure modes corresponding to the electrical failure data are determined according to the comparison results.

[0009] In some embodiments, determining the test data failure rate under each test parameter in the test-related attribute of the electrical failure data based on the structure-related attribute and the test-related attribute of the electrical test data of the test target includes: determining a plurality of test parameters corresponding to the test-related attributes of the electrical failure data; For each test parameter, respectively indexing the number of test items of electrical valid data and electrical failure data in the electrical test data of the test target; Calculating the test data failure rate under the test parameters according to the number of the test items of the electrical valid data and the electrical failure data; Repeat the above steps to obtain the test data failure rate under each test parameter in the test-related attribute of the electrical failure data.

[0010] In some embodiments, comparing the test data failure rates corresponding to the test parameters of the electrical failure data with preset failure standards, and determining the failure mode corresponding to the electrical failure data according to the comparison results includes: When the test data failure rate corresponding to the same parameter type under the same test parameters is greater than or equal to a first preset threshold, the electrical failure data is determined to be a first type of test failure mode, and the first type of test failure mode is a failure mode corresponding to the parameter type; When the test data failure rate corresponding to all parameter types of the same test parameter is greater than or equal to the second preset threshold and less than the first preset threshold, the second type of test failure mode of the electrical failure data is determined, and the second type of test failure mode is the failure mode corresponding to the test parameter.

[0011] In some embodiments, after classifying the electrical failure data according to the structure-related attributes, the test-related attributes, and the second judgment criterion of the electrical test data to determine the failure mode corresponding to the electrical failure data, the method further includes: Marking the electrical failure data under different failure modes; The electrical failure data after marking is filtered to perform electrical analysis on the test target based on the filtered electrical test data.

[0012] In a second aspect, the present application further provides an electrical data analysis device, the device comprising: An electrical data acquisition module, used to acquire electrical test data of a test target; the data attributes of the electrical test data include structure-related attributes and test-related attributes; a failure data acquisition module, configured to determine whether the electrical test data of the test target is failed based on the structure-related attributes of the electrical test data and a first judgment criterion, so as to determine electrical failure data; A failure mode determination module, configured to classify the electrical failure data according to the structure-related attributes, the test-related attributes and the second judgment criterion of the electrical test data, so as to determine the failure mode corresponding to the electrical failure data; The test root cause determination module is used to determine the test problem root cause corresponding to the failure mode of the electrical failure data based on a preset failure mode and test problem classification relationship.

[0013] In a third aspect, the present application further provides a wafer-level testing device, wherein the wafer-level testing device comprises a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the above method when executing the computer program.

[0014] In a fourth aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the method described above are implemented.

[0015] The above-mentioned electrical data analysis method, device, wafer-level testing equipment and storage medium determine whether the electrical test data of the test target is invalid based on the structure-related properties of the electrical test data and the first judgment standard to determine the electrical failure data. The judgment and filtering of test abnormality data can be realized based on the structure-related properties of the electrical test data, so that when a test error occurs in the test analysis stage, the validity of the data can be identified.

[0016] By classifying the electrical failure data according to the structure-related attributes, test-related attributes and second judgment criteria of the test target, the failure mode corresponding to the electrical failure data is determined; based on the preset failure mode and test problem classification relationship, the root cause of the test problem corresponding to the failure mode of the electrical failure data is determined. In this way, on the basis of determining the electrical failure data, the failure mode and the corresponding root cause of the test problem are further determined in combination with the test-related attributes of the test target, and it is specifically determined which test link has a problem, and it is clear whether the root cause of the test problem is the test target itself or the test-related software and hardware, so as to improve related problems, avoid the recurrence of similar problems, and improve test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic flow chart of an electrical data analysis method in one embodiment; Figure 2 A schematic diagram of data attribute columns of electrical test data in one embodiment; Figure 3 A schematic diagram of the relationship between failure modes and test problem classifications preset in an embodiment; Figure 4 A schematic diagram of a process for determining a failure mode corresponding to the electrical failure data in an embodiment; Figure 5 is a structural block diagram of an electrical data analysis device in one embodiment; Figure 6 FIG. 4 is a diagram showing the internal structure of a wafer-level testing device in one embodiment. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0019] like Figure 1As shown, the present application provides an electrical data analysis method. This embodiment uses the method applied to a terminal as an example. It can be understood that the method can also be applied to a server, and can also be applied to a system including a terminal and a server, and is implemented through the interaction between the terminal and the server. In this embodiment, the method includes the following steps: Step S12, obtaining electrical test data of the test target.

[0020] In this embodiment, the terminal can be a wafer-level testing device (WAT, Wafer Acceptance Testing). After wafer manufacturing is completed and before chip packaging, WAT testing (wafer acceptance testing) can be used to extract data information characterizing process and device performance to guide process development and production control of chip products.

[0021] The test target can be a transistor, basic circuit unit, interface module, or related test structure for evaluating and verifying semiconductor manufacturing process, material / device performance on a bare die before packaging. The probe card on the wafer test equipment contacts the test target on the wafer to achieve electrical connection and obtain electrical test data.

[0022] The data attributes of the electrical test data include the structure-related attributes and test-related attributes of the test target. Among them, the structure-related attributes are attribute parameters related to the structure and characteristics of the test target, which are used to characterize the physical characteristics of the test target, such as gate length and width, contact hole and through hole size, metal layer line width, line length, etc., and the electrical characteristics of the test target, such as resistance, leakage current, threshold voltage, etc.

[0023] In this embodiment, the test-related attributes are the test-related software and hardware information involved in the test target. The test-related software and hardware information not only affects the validity of the test data, but also affects the cause of the test problem of the electrical failure data. Among them, hardware information analysis can help identify the physical wear or failure of the test structure, probe card or test equipment element / component, while software information analysis can ensure the correctness of the test program and the accuracy of data processing, thereby improving the accuracy and reliability of the test results. By extracting the test-related attributes in the electrical test data, it is convenient to analyze and optimize the test later, and improve resource utilization and test efficiency.

[0024] In some embodiments, the test-related attribute may be a test structure type. In this embodiment, the test mechanism type may be different types of test structures, such as a process monitoring structure for monitoring and evaluating each step of a semiconductor manufacturing process, and a device characteristic test structure for evaluating and measuring the electrical characteristics of a semiconductor device; it may also be different structural deformations under the same type of test structure. The test structure types in different test items are different according to the test requirements, and this application is not limited here. In other embodiments, a probe card makes physical contact with a pad or contact point on a wafer to perform related tests, and the test-related attribute may also be a probe card (such as a needle card pin), or it may be the needle sequence of the probe on the probe card during multiple needle insertions, i.e., the needle insertion order (TouchDown). In other embodiments, the test-related hardware information also includes test equipment related accessories such as the SMU (Source Measure Unit) ID, PGU (Pulse Generation Unit), and FMU (Frequency Measurement Unit) for testing.

[0025] In this embodiment, the test-related software information is used to execute and manage the test process of the test target to adapt to different test requirements, and may be a test algorithm (Test Algorithm, referred to as Algo).

[0026] During actual testing, test-related attributes may be extracted based on the software and hardware information actually used by the test target, and this application does not limit this.

[0027] Step S14, judging whether the electrical test data of the test target is invalid based on the structure-related attribute of the electrical test data and the first judgment criterion, so as to determine electrical failure data.

[0028] like Figure 2 As shown, in this embodiment, the first judgment standard is the test standard for electrical failure data. For each test item in the test target electrical test output data, a corresponding test standard is preset. The test standard can be a data range containing an upper / lower limit. The upper / lower limit represents the boundary of the data failure standard, which is used to determine whether the data is within the normal range. Exceeding the upper / lower limit is considered as failure. By comparing and analyzing the structural related attributes of the electrical test data with the test standard, the matching of the electrical test data with the test standard can be determined, thereby filtering out electrical failure data.

[0029] Exemplarily, for the test items in the electrical test output data: testing the threshold voltage of a transistor, when the actual test value of the electrical test data is 0.3V, and the test standard of the test item is an upper limit of 0.28V and a lower limit of 0.2V, at this time 0.3V exceeds the preset upper limit of 0.28V, it can be determined that the electrical test data does not match the test standard, and the electrical test data is judged to be electrical failure data.

[0030] Step S16, classifying the electrical failure data according to the structure-related attributes, the test-related attributes and the second judgment criterion of the electrical test data to determine the failure mode corresponding to the electrical failure data.

[0031] In this embodiment, the second judgment standard is a classification standard for electrical failure data. After the electrical failure data is determined, it is necessary to further classify the data in combination with the structure-related attributes and test-related attributes of the electrical test data to determine the failure mode.

[0032] According to the root cause of the electrical failure data, corresponding judgment criteria and corresponding failure modes are preset for different types of electrical failure data. The judgment criteria can be based on the structural related attributes and test related attributes of the electrical test data, combined with experience, or obtained by data mining, statistical calculation and analysis, and this application does not limit this. By comparing and analyzing the electrical failure data under the second judgment criterion, the matching of the electrical failure data and the failure mode can be determined, thereby screening out different failure modes of the electrical failure data.

[0033] Step S18, determining the root cause of the test problem corresponding to the failure mode of the electrical failure data based on the preset relationship between the failure mode and the test problem classification.

[0034] Specifically, Figure 3 As shown, for multiple different failure modes, corresponding test questions can be set under different failure modes to obtain the classification relationship between failure modes and test questions. When analyzing electrical data, according to the failure mode corresponding to the electrical failure data, the corresponding test question is indexed in the classification relationship between failure mode and test question. It can be understood that in this embodiment, a test question can correspond to one or more failure modes. In this way, it is convenient to carry out data analysis, and take corresponding engineering measures for specific test problems to avoid recurrence. For example, when the failure mode of the electrical failure data is a specific TouchDown sequence, the position of the specific TouchDown of the probe station needs to be checked and adjusted.

[0035] It should be noted that since the failure mode corresponding to the electrical failure data is determined by the structure-related attributes and the test-related attributes, the test problems corresponding to the failure mode include problems with the test target itself or problems caused by the test software and hardware. For example, the test problem can be an open circuit, excessive etching, leakage current, etc. caused by process deviation, or it can be the test structure type, probe card, SMU, etc.

[0036] The above-mentioned electrical data analysis method, device, wafer-level testing equipment and storage medium determine whether the electrical test data of the test target is invalid based on the structure-related properties of the electrical test data and the first judgment standard to determine the electrical failure data. The judgment and filtering of test abnormality data can be realized based on the structure-related properties of the electrical test data, so that when a test error occurs in the test analysis stage, the validity of the data can be identified.

[0037] By classifying the electrical failure data according to the structure-related attributes, test-related attributes and second judgment criteria of the test target, the failure mode corresponding to the electrical failure data is determined; based on the preset failure mode and test problem classification relationship, the root cause of the test problem corresponding to the failure mode of the electrical failure data is determined. In this way, on the basis of determining the electrical failure data, the failure mode and the corresponding root cause of the test problem are further determined in combination with the test-related attributes of the test target, and it is specifically determined which test link has a problem, and it is clear whether the root cause of the test problem is the test target itself or the test-related software and hardware, so as to improve related problems and avoid the recurrence of similar problems.

[0038] In some embodiments, step S14 includes: Step 141 , determining a plurality of test items corresponding to the electrical test data of the test target.

[0039] Step 142: Obtain standard data ranges of several structure-related attribute values ​​corresponding to each of the test items.

[0040] Step 143 , comparing and analyzing the electrical test data with corresponding standard data ranges of several structure-related attribute values ​​according to the test items, and determining electrical failure data according to the analysis results.

[0041] In this embodiment, the electrical test data includes a set of electrical test output data corresponding to multiple test items of the test target. The multiple test items corresponding to the electrical test data include DC tests such as resistance, leakage current, threshold voltage, etc.; AC tests such as capacitance measurement, transconductance measurement; and power consumption test, etc. Correspondingly, in the electrical test data, different test items involve several different structure-related attributes. For example, for leakage current testing, structure-related attributes include metal line width / spacing, number of through holes, etc. For threshold voltage testing, structure-related attributes include leakage current, threshold voltage, standard deviation, gate voltage, etc.

[0042] Under different test items, different structure-related property values ​​have different standard data ranges. The electrical test data is compared and analyzed with the corresponding standard data ranges of several structure-related property values ​​according to the test items. When the measured value of the electrical test data is outside the standard data range, the data is determined to be electrical failure data, otherwise, the data is not electrical failure data.

[0043] Through the above steps, the electrical data analysis method of the present application filters the electrical failure data in the electrical test data, so as to facilitate the rapid location of possible failure causes and test anomalies in the subsequent electrical data analysis, narrow the scope of investigation of the root cause analysis of the test problem, and improve the efficiency and accuracy of the subsequent test root cause analysis.

[0044] like Figure 4 As shown, in some embodiments, the step S16 includes the following steps S161-S162.

[0045] Step S161 : determining the test data failure rate under each test parameter in the test related attribute of the electrical failure data based on the structure related attribute and the test related attribute of the electrical test data of the test target.

[0046] In this embodiment, the test-related attributes of the electrical failure data include multiple test parameters, each of which corresponds to test-related software and hardware information involved in the test targets under different test items. As described above, the test parameters can be one or more of the test structure type, probe card, needle insertion sequence, SMU, PGU, FMU, and test algorithm, but are not limited thereto and can be adaptively set according to actual test conditions.

[0047] like Figure 2As shown, under different test items, the various test parameters in the test-related attributes corresponding to the electrical failure data may be the same, partially the same, or different from each other. Exemplarily, for the test structure type test parameters: Class A / Class B / Class C / Class D / Class E represent different test structure (TestKey) types. For test items 1-4, the test structure type (marked as category) corresponding to the electrical test data is Class A. For test items 5-8, the test structure type corresponding to the electrical test data is Class B. For the needle sequence test parameter, 1 / 2 / 3 / 4 represent different needle sequences, which are used to mark which needle has a test problem. For test items 1-6, the needle sequence corresponding to the electrical test data is 1. For test items 7-14, the needle sequence corresponding to the electrical test data is 2. For other test parameters, they will not be repeated here.

[0048] Specifically, in some embodiments, step S161 includes the following steps S1611-S1614.

[0049] Step S1611 , determining a plurality of test parameters corresponding to the test-related attributes of the electrical failure data.

[0050] Step S1612 : for each test parameter, respectively index the number of test items of electrical valid data and electrical failure data in the electrical test data of the test target.

[0051] Step S1613, calculating the test data failure rate under the test parameters according to the number of the test items of the electrical valid data and the electrical failure data.

[0052] Step S1614, repeat the above steps to obtain the test data failure rate under each test parameter in the test-related attribute of the electrical failure data.

[0053] In this embodiment, by determining a plurality of test parameters corresponding to the test-related attributes of the electrical failure data, all relevant test parameters that cause the electrical test data to fail can be screened out, and the analysis scope can be further defined.

[0054] For the same test parameter, the test parameters involved in different test items are not the same, which may lead to different measurement results. In order to improve the accuracy of the test data failure rate calculation results and ensure that the data failure cause matches the test parameter, in this embodiment, the test results obtained by each test item containing the test parameter are counted separately, that is, the number of test items for electrical valid data and electrical failure data. According to the number of test items for the electrical valid data and the electrical failure data, the test data failure rate under the test parameter is calculated, and the specific calculation method is as follows: δ i =N F / (N P +N F ) Among them, δ i represents the test data failure rate of the i-th test parameter, N F Indicates the number of test items for electrical failure data, N P Indicates the number of test items with valid electrical data.

[0055] When the test data failure rate corresponding to a test parameter is calculated, the above steps are executed repeatedly to obtain the test data failure rate under each test parameter in the test-related attribute of the electrical failure data.

[0056] It should be noted that, in order to reduce the influence of random error factors, when calculating the test data failure rate under each test parameter, the number of test items needs to be greater than the first preset number and the test target samples need to be greater than the second preset number. Exemplarily, in this embodiment, the number of test target samples is greater than 5 and the number of test items is greater than 50.

[0057] Through the above steps, the test parameters corresponding to the electrical failure data are indexed into the test results of the relevant test items in all the electrical test data and statistically calculated to obtain the corresponding test data failure rate, which can accurately reflect the test conditions of each test parameter, provide direct data support for subsequent analysis, and facilitate the accurate calculation of subsequent failure modes.

[0058] Step S162 , comparing the test data failure rates corresponding to the test parameters of the electrical failure data with preset failure standards, and determining the failure mode corresponding to the electrical failure data according to the comparison results.

[0059] In this embodiment, different failure criteria are pre-set for all test parameters to determine whether the calculated test data failure rate meets the classification criteria. After the data failure rate is obtained, it is necessary to further compare and analyze according to the preset failure criteria, and determine the failure mode corresponding to the electrical failure data according to the comparison results. Specifically, the step S162 may include the following steps S1621-S1622.

[0060] Step S1621, when the test data failure rate corresponding to the same parameter type under the same test parameters is greater than or equal to a first preset threshold, the electrical failure data is determined to be a first type of test failure mode, and the first type of test failure mode is a failure mode corresponding to the parameter type.

[0061] In order to further classify the electrical failure data more accurately and obtain more accurate root cause analysis results of the test problems, each test parameter includes one or more parameter types. Correspondingly, for each test parameter, the number of test items of electrical valid data and electrical failure data is indexed in the electrical test data of the test target for each parameter type, thereby calculating the test data failure rate under each parameter type. The specific calculation method can refer to the test data failure rate calculation method under each test parameter in the above step S161, and this application will not elaborate on it here.

[0062] In this embodiment, when the calculated test data failure rate under the parameter type is greater than or equal to the first preset threshold, it indicates that the electrical failure data obtained under the test of the parameter type meets the failure mode classification standard, and the electrical failure data is determined to be the first type of test failure mode. The first type of test failure mode is the failure mode corresponding to the parameter type, indicating that the failure category of the electrical failure data matches the corresponding parameter type under the test parameter, thereby specifying the root cause of the test problem to the parameter type of the test error. For example, Figure 3 As shown, the test parameter is Algo. When the calculated test parameter is the test data failure rate under the parameter type under Algo (ie, specific Algo) is greater than or equal to the first preset threshold value of 90%, it is determined that the electrical failure data is a failure mode corresponding to the specific Algo.

[0063] Step S1622, when the test data failure rate corresponding to all parameter types of the same test parameter is greater than or equal to the second preset threshold and less than the first preset threshold, determine the second type of test failure mode of the electrical failure data, and the second type of test failure mode is the failure mode corresponding to the test parameter.

[0064] In this embodiment, when the calculated test data failure rate under all parameter types of the same test parameter is greater than or equal to the second preset threshold and less than the first preset threshold, it indicates that the electrical failure data obtained under all parameter types does not meet the failure mode classification standard, but the electrical failure data under the test parameter can meet the failure mode classification standard. At this time, the electrical failure data is determined to be a second-category test failure mode. The second-category test failure mode is the failure mode corresponding to the test parameter, indicating that the failure category of the electrical failure data matches the test parameter. At this time, the root cause of the test can be further analyzed and classified according to the matching result. For example, Figure 3As shown, the test parameter is the test structure type, and the parameter type is different test structures. When the calculated test data failure rate under all test structures under the test structure type is less than the first preset threshold value of 90% and greater than the second preset threshold value of 20%, the electrical failure data is determined to be the failure mode corresponding to the test structure type. At this time, further judgment shows that since most of the test structure data are erroneous and the specific error problem is unclear, the root cause of the test problem is the probe station problem, which may be unstable needle pressure, needle slippage or false puncture, resulting in Open.

[0065] The first preset threshold and the second preset threshold can be adjusted accordingly according to different test items or different stages of the same test item, and the present application does not limit this.

[0066] Through the above steps, by further dividing each test parameter into one or more parameter types, through the setting of the first type of test failure mode and the second type of test failure mode, the electrical failure data is classified to different degrees according to the failure rate calculation results of the electrical failure data, so that more accurate failure mode classification results can be obtained according to the actual situation of the test problems corresponding to the electrical failure data.

[0067] In one embodiment, after step S16, the method further includes: Step S171, marking the electrical failure data under different failure modes; Step S172 , filtering the marked electrical failure data to perform electrical analysis on the test target based on the filtered electrical test data.

[0068] It can be understood that since the electrical failure data of the test target includes multiple test items, the structure-related attributes and test-related attributes of the data under different test items are different, and the reasons for data failure may be different. Figure 2 As shown, after the electrical failure data is determined, it is possible to mark whether the electrical test data is failed. Exemplarily, when the electrical test data is determined to be electrical failure data, it is marked as 1, otherwise it is marked as 0. Further, after the failure mode corresponding to the electrical failure data is determined, the corresponding filter mark is added to the electrical failure data under different test items, such as when the electrical failure data is the first type of test failure mode TouchDown2, it is marked as flag2. In this way, data analysis can be carried out conveniently.

[0069] In this embodiment, by marking the electrical failure data, the root cause analysis of the test problem can be performed based on the electrical failure data, and then the test software and hardware can be improved to avoid the recurrence of similar test problems. By marking the electrical failure data, invalid data points caused by test problems can also be accurately filtered out to avoid interference with valid data points, thereby obtaining reliable data analysis conclusions.

[0070] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0071] Based on the same inventive concept, the embodiment of the present application also provides an electrical data analysis device for implementing the electrical data analysis method involved above. The implementation solution provided by the device to solve the problem is similar to the implementation solution recorded in the above method, so the specific limitations in one or more electrical data analysis device embodiments provided below can refer to the limitations on the electrical data analysis method above, and will not be repeated here.

[0072] In one embodiment, Figure 5 As shown, an electrical data analysis device 500 is provided, comprising: an electrical data acquisition module 501, a failure data acquisition module 502, a failure mode determination module 503 and a test root cause determination module 504, wherein: The electrical data acquisition module 501 is used to acquire electrical test data of a test target; the data attributes of the electrical test data include structure-related attributes and test-related attributes of the test target; A failure data acquisition module 502 is used to determine whether the electrical test data of the test target is failed based on the structure-related attributes of the electrical test data and a first judgment criterion, so as to determine electrical failure data; A failure mode determination module 503, configured to classify the electrical failure data according to the structure-related attributes, the test-related attributes and the second judgment criterion of the electrical test data, so as to determine the failure mode corresponding to the electrical failure data; The test root cause determination module 504 is used to determine the test problem root cause corresponding to the failure mode of the electrical failure data based on a preset relationship between the failure mode and the test problem classification.

[0073] In one embodiment, the test-related attributes include one or more of a test structure type, a needle insertion order, a probe card, a test algorithm, and a SMU.

[0074] In one embodiment, the failure data acquisition module 502 includes: a test item determination module, a data range acquisition module and a data determination module.

[0075] A test item determination module, used to determine a plurality of test items corresponding to the electrical test data of the test target; A data range acquisition module, used to acquire the standard data range of several structure-related attribute values ​​corresponding to each of the test items; The data determination module is used to compare and analyze the electrical test data with the corresponding standard data ranges of several structure-related attribute values ​​according to the test items, and determine the electrical failure data according to the analysis results.

[0076] In one embodiment, the failure mode determination module 503 includes: a failure rate determination module and a mode determination module.

[0077] A failure rate determination module, configured to determine the test data failure rate under each test parameter in the test-related attribute of the electrical failure data based on the structure-related attribute and the test-related attribute of the electrical test data of the test target; The mode determination module is used to compare the test data failure rates corresponding to the test parameters of the electrical failure data with preset failure standards, and determine the failure mode corresponding to the electrical failure data according to the comparison results.

[0078] In one embodiment, the failure rate determination module includes: a test parameter determination unit, a test item number index unit, a failure rate calculation unit and a loop unit.

[0079] A test parameter determination unit, configured to determine a plurality of test parameters corresponding to the test-related attributes of the electrical failure data; A test item number indexing unit, used to index the number of test items of electrical valid data and electrical failure data in the electrical test data of the test target for each test parameter; A failure rate calculation unit, configured to calculate the test data failure rate under the test parameters according to the number of the test items of the electrical valid data and the electrical failure data; The cycle unit is used to repeat the above steps to obtain the test data failure rate under each test parameter in the test related attribute of the electrical failure data.

[0080] In one embodiment, the mode determination module includes: a first type test failure mode determination unit and a second type test failure mode determination unit.

[0081] A first type test failure mode determination unit, configured to determine that the electrical failure data is a first type test failure mode when the failure rate of the test data corresponding to the same parameter type under the same test parameters is greater than or equal to a first preset threshold, and the first type test failure mode is a failure mode corresponding to the parameter type; The second type test failure mode determination unit is used to determine the second type test failure mode of the electrical failure data when the test data failure rate corresponding to all parameter types of the same test parameter is greater than or equal to the second preset threshold and less than the first preset threshold, and the second type test failure mode is the failure mode corresponding to the test parameter.

[0082] In one embodiment, the electrical data analysis device further includes: a marking module and an electrical analysis module.

[0083] A marking module, used for marking the electrical failure data under different failure modes; The electrical analysis module is used to filter the electrical failure data after marking, so as to perform electrical analysis on the test target based on the filtered electrical test data.

[0084] Each module in the electrical data analysis device 500 can be implemented in whole or in part by software, hardware, or a combination thereof. Each module can be embedded in or independent of a processor in a wafer-level test device in the form of hardware, or can be stored in a memory in a wafer-level test device in the form of software, so that the processor can call and execute operations corresponding to each module.

[0085] In one embodiment, a wafer-level test device is provided. The wafer-level test device may be a terminal, and its internal structure diagram may be as follows: Figure 6 As shown. The wafer-level test equipment includes a processor, a memory, a communication interface, a display screen and an input device connected through a system bus. Among them, the processor of the wafer-level test equipment is used to provide computing and control capabilities. The memory of the wafer-level test equipment includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The communication interface of the wafer-level test equipment is used to communicate with an external terminal in a wired or wireless manner. When the computer program is executed by the processor, an electrical data analysis method is implemented.

[0086] Those skilled in the art will understand that Figure 6The structure shown in the figure is merely a block diagram of a partial structure related to the scheme of the present application, and does not constitute a limitation on the wafer-level testing equipment to which the scheme of the present application is applied. The specific wafer-level testing equipment may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0087] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the above electrical data analysis method is implemented.

[0088] It should be noted that the data involved in this application (including but not limited to data used for analysis, data stored, data displayed, etc.) are all data authorized by the user or fully authorized by all parties.

[0089] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but are not limited to this.

[0090] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A method for analyzing electrical data, characterized in that: The method comprises: Acquire electrical test data of a test target; the data attributes of the electrical test data include structure-related attributes and test-related attributes of the test target; Based on the structure-related attributes of the electrical test data and the first judgment criterion, judging whether the electrical test data of the test target is invalid, so as to determine electrical failure data; Classify the electrical failure data according to the structure-related attributes, the test-related attributes and the second judgment criterion of the electrical test data to determine the failure mode corresponding to the electrical failure data; Based on a preset relationship between failure modes and test problem classification, a root cause of the test problem corresponding to the failure mode of the electrical failure data is determined.

2. The method according to claim 1, characterized in that The test-related attributes include one or more of a test structure type, a needle insertion sequence, a probe card, a test algorithm, and a SMU.

3. The method according to claim 1, characterized in that The determining whether the electrical test data of the test target is invalid based on the structure-related attribute of the electrical test data and the first determination criterion to determine the electrical failure data includes: Determine a plurality of test items corresponding to the electrical test data of the test target; Obtaining standard data ranges of several structure-related attribute values ​​corresponding to each of the test items; The electrical test data are compared and analyzed with the corresponding standard data ranges of several structure-related property values ​​according to the test items, and the electrical failure data are determined according to the analysis results.

4. The method according to claim 1, characterized in that: The classifying the electrical failure data according to the structure-related attributes, the test-related attributes and the second judgment criterion of the electrical test data to determine the failure mode corresponding to the electrical failure data includes: Determining the test data failure rate under each test parameter in the test-related attribute of the electrical failure data based on the structure-related attribute and the test-related attribute of the electrical test data of the test target; The test data failure rates corresponding to the test parameters of the electrical failure data are compared with preset failure standards, and the failure modes corresponding to the electrical failure data are determined according to the comparison results.

5. The method according to claim 4, characterized in that The determining of the test data failure rate under each test parameter in the test related attribute of the electrical failure data based on the structure related attribute and the test related attribute of the electrical test data of the test target comprises: determining a plurality of test parameters corresponding to the test-related attributes of the electrical failure data; For each test parameter, respectively indexing the number of test items of electrical valid data and electrical failure data in the electrical test data of the test target; Calculating the test data failure rate under the test parameters according to the number of the test items of the electrical valid data and the electrical failure data; Repeat the above steps to obtain the test data failure rate under each test parameter in the test-related attribute of the electrical failure data.

6. The method according to claim 4, characterized in that The test data failure rates corresponding to the test parameters of the electrical failure data are compared with the preset failure standards respectively, and the failure modes corresponding to the electrical failure data are determined according to the comparison results, including: When the test data failure rate corresponding to the same parameter type under the same test parameters is greater than or equal to a first preset threshold, the electrical failure data is determined to be a first type of test failure mode, and the first type of test failure mode is a test failure mode corresponding to the parameter type; When the test data failure rate corresponding to all parameter types of the same test parameter is greater than or equal to the second preset threshold and less than the first preset threshold, the electrical failure data is determined to be a second type of test failure mode, and the second type of test failure mode is the failure mode corresponding to the test parameter.

7. The method according to claim 1, characterized in that After classifying the electrical failure data according to the structure-related attributes, the test-related attributes and the second judgment criterion of the electrical test data to determine the failure mode corresponding to the electrical failure data, the method further includes: Marking the electrical failure data under different failure modes; The electrical failure data after marking is filtered to perform electrical analysis on the test target based on the filtered electrical test data.

8. An electrical data analysis device, characterized in that: The device comprises: An electrical data acquisition module, used to acquire electrical test data of a test target; the data attributes of the electrical test data include structure-related attributes and test-related attributes of the test target; a failure data acquisition module, configured to determine whether the electrical test data of the test target is failed based on the structure-related attributes of the electrical test data and a first judgment criterion, so as to determine electrical failure data; A failure mode determination module, configured to classify the electrical failure data according to the structure-related attributes, the test-related attributes and the second judgment criterion of the electrical test data, so as to determine the failure mode corresponding to the electrical failure data; The test root cause determination module is used to determine the test problem root cause corresponding to the failure mode of the electrical failure data based on a preset failure mode and test problem classification relationship.

9. A wafer-level testing device, comprising a memory and a processor, wherein the memory stores a computer program, characterized in that: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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