Wafer batch management method and device, MES system, storage medium and program

Abstract

The embodiment of the invention provides a wafer batch management method and device, an MES system, a storage medium and a program, and the method comprises the steps: obtaining a Lot merging request which comprises a plurality of Lot identifiers of Lot; based on the Lot identifier, acquiring account information of a plurality of Lants; based on the account information, judging whether the plurality of Lets meet a merging condition, wherein the merging condition comprises that pollution identifiers in the account information are consistent and identifiers of the next process step are consistent; if the plurality of Lants meet a merging condition, merging the plurality of Lants to obtain a merged Lant, including: obtaining wafer identifiers of the plurality of Lants based on account material information, generating a virtual Lant identifier, and creating a first mapping relationship between the wafer identifiers and the virtual Lant identifier; storing updated account information, wherein the updated account information comprises the first mapping relation and the account information; and carrying out process dispatching on the merged Lot based on the virtual Lot identifier. The embodiment of the invention can improve the resource utilization rate of a production line and improve the wafer production efficiency.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor technology, and specifically to a wafer batch management method, device, MES system, storage medium and program. Background Art

[0002] In the semiconductor manufacturing process, wafers are manufactured in lots (batches), that is, a lot can have one or more wafers, and wafers in the same lot can be processed together. However, the production efficiency of wafers in lots still needs to be improved, so how to provide a technical solution to improve the resource utilization of the production line and thus improve the wafer production efficiency has become a technical problem that technicians in this field need to solve urgently. Summary of the invention

[0003] In view of this, the embodiments of the present application provide a wafer batch management method, device, MES system, storage medium and program, which can improve the resource utilization of the production line and thus improve the wafer production efficiency.

[0004] To achieve the above objectives, the embodiments of the present application provide the following technical solutions.

[0005] In a first aspect, an embodiment of the present application provides a wafer batch management method, comprising the following steps:

[0006] Obtaining a lot merge request, where the lot merge request is used to request to merge multiple lots, and the lot merge request includes lot identifiers of the multiple lots;

[0007] Based on the lot identifier, obtaining account information of the plurality of lots;

[0008] Determining whether the plurality of lots meet a merging condition based on the account material information, the merging condition comprising: the contamination identifiers in the account material information are consistent, and the identifiers of the next process steps are consistent;

[0009] If the multiple lots meet the merging condition, merging the multiple lots to obtain a merged lot, including: acquiring wafer identifiers of the multiple lots based on the account information, generating a virtual lot identifier, and creating a first mapping relationship between the wafer identifier and the virtual lot identifier;

[0010] saving updated account information, wherein the updated account information includes the first mapping relationship and the account information;

[0011] The merged lot is assigned a process based on the virtual lot identifier.

[0012] In a second aspect, an embodiment of the present application provides a wafer batch management device, including:

[0013] A request transmission module, used for obtaining a lot merging request, wherein the lot merging request is used for requesting to merge multiple lots, and the lot merging request includes lot identifiers of the multiple lots;

[0014] A data processing module, configured to obtain the account material information of the plurality of lots based on the lot identification, and determine whether the plurality of lots meet a merging condition based on the account material information, wherein the merging condition includes that the contamination identification in the account material information is consistent and the identification of the next process step is consistent; if the plurality of lots meet the merging condition, the plurality of lots are merged to obtain a merged lot, including: obtaining the wafer identification of the plurality of lots based on the account material information, generating a virtual lot identification, and creating a first mapping relationship between the wafer identification and the virtual lot identification;

[0015] The data execution module is used to save updated account material information, wherein the updated account material information includes the first mapping relationship and the account material information; and to perform process dispatching for the merged lot based on the virtual lot identifier.

[0016] In a third aspect, an embodiment of the present application provides an MES system, including a computer device running MES software, the computer device including a memory and a processor; the memory stores computer execution instructions, and the processor calls the computer execution instructions stored in the memory to execute the wafer batch management method as described in the first aspect above.

[0017] In a fourth aspect, an embodiment of the present application provides a storage medium, wherein the storage medium stores computer-executable instructions, and when the computer-executable instructions are executed, the wafer batch management method as described in the first aspect above is implemented.

[0018] In a fifth aspect, an embodiment of the present application provides a computer program product, comprising computer execution instructions, which, when executed, implement the wafer batch management method as described in the first aspect above.

[0019] In the wafer batch management method provided in the embodiment of the present application, a lot merge request can request to merge multiple lots, and the lot merge request includes lot identifiers of the multiple lots; thus, based on the lot identifiers of the multiple lots, the embodiment of the present application can obtain the account information of the multiple lots, and determine whether the multiple lots meet the merge condition based on the account information of the multiple lots, and the merge condition includes that the contamination identifiers in the account information are consistent, and the next process step identifier is consistent; if the multiple lots meet the merge condition, the multiple lots can be merged to obtain a merged lot; when merging multiple lots, at the data processing level, the embodiment of the present application can obtain the multiple lots based on the account information Lot's wafer identification, and generates a virtual Lot identification of the merged Lot, and creates a first mapping relationship between the wafer identification and the virtual Lot identification; further, the embodiment of the present application can save updated account information, and the updated account information includes the first mapping relationship and the account information, that is, the updated account information can record the account information before the multiple Lots are merged, as well as the first mapping relationship between the wafer identification and the virtual Lot identification of the merged Lot, so as to trace the Lot where each wafer is located and the merged Lot in which it is located, thereby maintaining the integrity and consistency of the wafer data before and after the Lot merger; then, the embodiment of the present application can perform process dispatch for the merged Lot based on the virtual Lot identification.

[0020] It can be seen that the embodiment of the present application can merge multiple Lots to obtain a merged Lot when multiple Lots meet the merging conditions, and then use the virtual Lot identifier of the merged Lot to perform process dispatching on the merged Lot, so that the machine performs consistent process processing on the merged Lot containing the multiple Lots, avoiding the process of the machine performing process processing on multiple Lots separately, which can reduce the machine preparation and conversion time in the production line and improve the operation efficiency of the machine; at the same time, after merging multiple Lots, the virtual Lot identifier of the merged Lot is used to dispatch the merged Lot, so that the number of wafers of the Lot served by the machine can be increased, and the situation where the machine serves a scattered Lot containing a small number of wafers is reduced, thereby improving the operation efficiency of the machine. Therefore, the embodiment of the present application can make efficient use of the resources of the production line, improve the operation efficiency of the machine, and improve the wafer production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0022] Figure 1A This is an example diagram of the architecture of a wafer production system.

[0023] Figure 1B This is an example of the format of Lot's account information.

[0024] Figure 2 A flowchart of a wafer batch management method provided in an embodiment of the present application.

[0025] Figure 3A This is another example format of Lot's account information.

[0026] Figure 3B This is another example format of Lot's account information.

[0027] Figure 4 This is an example of a Lot merge.

[0028] Figure 5 The following is an example of the format of a virtual Lot ID.

[0029] Figure 6 Another flow chart of the wafer batch management method provided in an embodiment of the present application.

[0030] Figure 7 This is another example of a merge of Lot.

[0031] Fig. 8A A flowchart of splitting and merging Lots provided in an embodiment of the present application.

[0032] Figure 8B This is an example diagram of splitting and merging Lot.

[0033] Figure 8C Another example diagram of splitting and merging Lot.

[0034] Fig. 9 A flow chart for obtaining pre-measurement values ​​provided in an embodiment of the present application.

[0035] Fig.10 A block diagram of a wafer batch management device provided in an embodiment of the present application.

[0036] Fig.11 Another example architecture diagram of a wafer production system.

[0037] Fig.12 An example diagram of the process for wafer lot management. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0039] For ease of understanding, Figure 1A The following is an exemplary diagram showing the architecture of a wafer production system. Figure 1A As shown, the wafer production system may include: multiple sites, an MES (Manufacturing Execution System) system 110 , and a database 120 .

[0040] Multiple sites such as Figure 1A The stations 101 to 10n shown, where n is the number of stations, can be determined according to the specific process of the wafer; wherein one station is used to perform a specific process step of the production line, so that different stations can be responsible for different process stages of the wafer manufacturing process, for example, multiple stations can include but are not limited to photolithography stations, etching stations, cleaning stations, etc., which are responsible for different process stages;

[0041] Furthermore, a site may include machines required to perform specific process steps, such as production machines; for example, a lithography station may be equipped with lithography machines, coating machines and other production machines, an etching station may be equipped with etching machines (such as wet etching and dry etching machines) and other production machines, and a cleaning station may be equipped with cleaning machines and other production machines.

[0042] It is understandable that multiple sites responsible for different process stages of the wafer manufacturing process can form a wafer production line. Furthermore, when wafer production is based on Lots, after a Lot of wafers enters the production line, they can be processed by multiple sites to complete the production of a Lot of wafers; for example, when a Lot of wafers enters the production line, all wafers in a Lot will be processed continuously by multiple set sites, that is, all wafers in the same Lot will receive the same process at the same time to maintain the performance and quality consistency of the wafers in the same Lot.

[0043] The MES system 110 is the core information system of wafer manufacturing, which is used to manage and monitor the wafer manufacturing process, such as managing wafer production data, tracking production progress, controlling the equipment operation status of the production line, and ensuring the correct execution of the wafer process.

[0044] The database 120 stores production data collected by the MES system 110, including but not limited to lot account information, process parameters, quality control results, equipment operating status of the production line, and production output.

[0045] exist Figure 1A In the example wafer production system, the MES system 110 serves as the command center for wafer production and manufacturing, and can send work dispatch instructions to each site and collect production data from each site; the production data collected by the MES system 110 can be processed and stored in the database 120, so that the production data stored in the database 120 can be used for further production scheduling, quality management, and historical production data analysis of the MES system 110.

[0046] When wafer production is in units of Lot, different Lots can be distinguished by different Lot identifiers, that is, the Lot identifier can be a unique identifier of the Lot. For example, the Lot identifier can be a offline Lot identifier. Specifically, when each Lot enters the production line (the entry of the Lot into the production line can also be called the Lot offline), each Lot can be assigned a unique offline Lot identifier (offline Lot identifier such as offline Lot ID), that is, the offline Lot identifier of the Lot can be understood as the Lot identifier assigned when the Lot enters the production line; further, when collecting production data, the MES system 110 can collect the account information corresponding to different Lot identifiers and record it in the database.

[0047] The ledger information of the Lot can record the batch data of the Lot, so as to record and track the relevant data of the Lot during the wafer production process; taking the identification information (such as ID information) recorded in the ledger information of the Lot as an example, the ledger information of the Lot can record the offline Lot identification of the Lot, the wafer identification of each wafer in the Lot, the wafer physical identity number (such as the wafer back engraving code), the slot identification, and the process step identification related to the Lot, etc., so that the MES system can track and manage the wafer information contained in the Lot, the production progress of the Lot, etc. through the identification information recorded in the ledger information of the Lot.

[0048] As an example, Figure 1B The format of the account information of Lot is shown as an example. Figure 1B As shown, Lot's account information may include:

[0049] Offline Lot ID, used to identify the Lot;

[0050] Wafer ID, as a form of wafer identification, is used to identify wafers. Different wafers can have different Wafer IDs. The offline Lot ID and Wafer ID can form a unique record code for the wafers in the Lot, so that each wafer in the Lot can be tracked and managed.

[0051] T7 Code is a form of physical wafer identification number. It should be noted that the physical wafer identification number (such as T7 Code) is the unique identification number of the wafer in physical form, such as the wafer back-engraved code laser engraved on the back of the wafer, while the wafer identification (such as Wafer ID) is the identification information assigned by the MES system to distinguish different wafers. Therefore, the physical wafer identification number (such as T7 Code) and the wafer identification (such as Wafer ID) identify the wafer in different identification dimensions.

[0052] Slot ID, as a form of slot identification, is used to identify the slot of a wafer in a FOUP (Front Opening Unified Pod). FOUP is a wafer container for storing wafers in a production line, and is used to store, protect and transport wafers in the semiconductor manufacturing process to prevent the wafers from being contaminated or damaged during processing. FOUP can have multiple slots for storing wafers, one slot stores one wafer, that is, the slot is the specific storage position of the wafer in the FOUP, and each slot in each FOUP can have a unique slot identification (such as Slot ID) to ensure the accurate placement and extraction of the wafer in the FOUP. For the same Lot, wafers in the same Lot can be stored in the same FOUP.

[0053] Step ID, as a form of process step identification; each process step of the production line (such as lithography, etching, cleaning, etc.) will be assigned a unique process step ID to track the production progress of the wafer; the process step ID recorded in the lot's ledger information can be used to track and manage the lot's process steps, including but not limited to:

[0054] The next process step identifier indicates the process step that Lot will perform next. For example, after Lot completes the current process step, the MES system can generate the process step identifier that Lot will perform next, i.e., the next process step identifier.

[0055] The final process step identifier indicates the last process step after the lot completes all manufacturing processes;

[0056] The current process step identifier indicates the process step currently being executed by Lot.

[0057] Taking Lot as the unit, different Lots are processed separately, so that the wafers of the same Lot can be processed in the same process, and the performance and quality of the wafers of the same Lot can be consistent; however, the wafer production efficiency in Lot units still needs to be improved, specifically:

[0058] There may be lots of loose wafers with a small number of wafers on the production line. When individual process processing is performed on each lot, the individual process processing of the loose wafer lots may result in a waste of production line resources, thereby reducing wafer production efficiency and extending the production cycle.

[0059] That is to say, a loose lot refers to a lot containing a small number of wafers. When the loose lot is processed individually, each loose lot needs to go through a complete process flow. This results in the production line (such as the machines in the production line) needing to serve the loose lot containing a small number of wafers. At the same time, the resources of the production line are not utilized efficiently, resulting in reduced wafer production efficiency, delayed wafer production cycle, and increased process cost of a single wafer.

[0060] For example, if there are a large number of loose wafers Lot and they need to be put down or flushed, multiple loose wafers Lot will be processed separately, which will waste a lot of FOUP resources and measurement resources of the production line, and increase the consumption of test wafers (dummy wafers), etc., thereby causing waste of production line resources, resulting in reduced wafer production efficiency and delayed wafer production cycle. Specifically, when processing loose wafers Lot, there may be a large number of idle slots in the FOUP that accommodates the loose wafers Lot, which will waste a large number of FOUP resources of the production line; test wafers are required to calibrate, test, and process verification of production equipment (such as production machines) during semiconductor manufacturing, and when processing loose wafers Lot, test wafers are also required to ensure the production quality of the loose wafers Lot in the production equipment, which leads to increased consumption of test wafers and increased testing costs; measurement is the process of performing various measurements on wafers to ensure that the quality meets the specifications. Processing loose wafers Lot may cause the measurement equipment to be frequently switched and set up, which reduces the efficiency of the measurement equipment and wastes measurement resources.

[0061] It should be noted that decentralization refers to the act of putting the Lot into the production line for process processing, that is, the Lot enters the production line; rushing the line means giving priority to the Lot in order to quickly complete the process processing.

[0062] Based on the above-mentioned problem that wafer production efficiency needs to be improved, the embodiment of the present application provides an improved wafer batch management solution. On the basis of performing process processing in units of Lot, multiple Lots are merged to obtain a merged Lot, and then process dispatch is performed based on the merged Lot, which can improve the resource utilization of the production line and improve wafer production efficiency.

[0063] As an optional implementation, Figure 2 The optional flow chart of the wafer batch management method provided in the embodiment of the present application is shown as an example. Figure 2 The method flow may include the following steps.

[0064] In step S210, the user submits a lot merging request to the MES system. The lot merging request is used to request merging multiple lots, and the lot merging request includes lot identifiers of the multiple lots.

[0065] In an optional implementation, the embodiment of the present application supports the merging of multiple Lots triggered by the user, that is, when the user wishes to merge multiple Lots in the production line, the user can submit a Lot merge request to the MES system, and the Lot merge request can carry the Lot identifiers of multiple Lots to indicate the multiple Lots requested to be merged. For example, when the user wishes to merge multiple scattered Lots with a small number of wafers in the production line, the user can submit a Lot merge request to the MES system to request the merging of multiple scattered Lots, and carry the Lot identifiers of multiple scattered Lots in the Lot merge request. Among them, the user may be, for example, a person who needs to perform management operations during the wafer production and manufacturing process, such as a production manager, process engineer or operator.

[0066] In an optional implementation, a user may submit a lot merge request to the MES system through the OA (Office Automation System) system. For example, the OA system may set an interactive interface for the user to submit a lot merge request, so that the user may at least input the information of multiple lots to be merged (such as the lot identifiers of multiple lots) in the interactive interface. Furthermore, the user may also input other contents such as the reason for the merge in the interactive interface. Then, the OA system may generate a lot merge request based on the information input by the user in the interactive interface and submit it to the MES system. Among them, there may be an integrated interface between the OA system and the MES system to facilitate communication between the OA system and the MES system, such as through enterprise-level application integration software or a custom API (Application Programming Interface) to achieve secure access and communication between the OA system and the MES system.

[0067] In a further optional example, the lot merge request can be in the form of a work order request. For example, the above-mentioned interactive interface set by the OA system can be a work order interface, so that the user can create a work order through the work order interface to merge multiple lots. Then, the OA system can submit a corresponding work order request to the MES system based on the work order created by the user, requesting the MES system to merge multiple lots.

[0068] As an optional implementation, the embodiment of the present application further sets an execution Lot identifier (such as an execution Lot ID) of the Lot on the basis of using the offline Lot identifier (such as the offline Lot ID) to identify the Lot. For example, the execution Lot identifier of a Lot can be the same as the offline Lot identifier; by setting the execution Lot identifier, the Lot can be scheduled for production at the level of the execution Lot identifier, and multiple Lots can be merged at the level of the execution Lot identifier, and it is guaranteed that the Lot can retain the offline Lot identifier before the merger after the merger.

[0069] That is to say, in an optional implementation, the embodiment of the present application introduces an execution lot identification for a lot, and the execution lot identification is used as the lot identification when the MES system dispatches work to a site (such as a machine at a site), so that the site (such as a machine at a site) can perform process steps on the wafers under the same execution lot identification. In addition, the embodiment of the present application can merge multiple lots at the level of the execution lot identification, so that multiple lots can be dispatched using the same execution lot identification after being merged, so that multiple lots can perform consistent process processing after being merged, thereby optimizing the resource utilization of the production line. In addition, since multiple lots are merged at the level of the execution lot identification, the offline lot identification of the lot can remain unchanged, that is, the offline lot identification of each lot is not changed after the multiple lots are merged, which allows each lot to keep the account information traceable and manageable after being merged.

[0070] In an optional implementation, the embodiment of the present application can set an execution Lot ID that is the same as the offline Lot ID for the Lot when assigning the offline Lot ID to the Lot; for example, for any Lot, when the Lot enters the production line, the embodiment of the present application can assign a unique offline Lot ID to the Lot, and set an execution Lot ID that is the same as the offline Lot ID, and at the same time set a record item of the execution Lot ID in the Lot's account information to record the execution Lot ID of the Lot. For ease of understanding, Figure 3A Another example of the format of the account information of Lot is shown in FIG. Figure 1B and Figure 3AAs shown, the account information of the Lot may also include: the execution Lot ID of the Lot; in an optional implementation, the execution Lot ID of the Lot may be the same as the offline Lot ID.

[0071] In an optional implementation, based on the setting of the execution Lot identifier (such as the execution Lot ID), the Lot identifiers of the multiple Lots included in the Lot merge request can be: the execution Lot identifiers of the multiple Lots, that is, the execution Lot identifiers of the multiple Lots requested to be merged.

[0072] In step S211, the MES system obtains a lot merging request.

[0073] In an optional implementation, the MES system may obtain a Lot merging request submitted by a user, and the relevant content may refer to the above description. Further, the embodiment of the present application may further process the obtained Lot merging request when verifying that the user who submitted the Lot merging request is a legitimate user.

[0074] In an optional implementation, the MES system may also actively generate a lot merge request. For example, the MES system may monitor the number of wafers in each lot in the production line, and actively generate a lot merge request to merge multiple lots with a smaller number of wafers, and the lot merge request may include lot identifiers of the multiple lots requested to be merged to indicate the multiple lots requested to be merged.

[0075] For example, the embodiment of the present application can define a threshold value for the number of loose wafers, so as to define the loose lot by the threshold value for the number of loose wafers. For example, if the number of wafers in any lot is less than the threshold value for the number of loose wafers, then the lot can be regarded as a loose lot; thus, when the MES system monitors that there are multiple loose lots on the production line, it can automatically generate a lot merge request to merge multiple loose lots. Among them, the threshold value for the number of loose wafers can be less than the wafer number limit of the wafer container. The wafer number limit of the wafer container refers to the maximum number of wafers that the wafer container can accommodate. The wafer number limit of the wafer container is, for example, the wafer number limit of the FOUP; for example, the wafer number limit of a FOUP can be designed to be 25, that is, a FOUP can accommodate a maximum of 25 wafers. Of course, the wafer number limit of a FOUP can be determined according to actual conditions. The specific value here is only an example.

[0076] In an optional implementation, the multiple Lots requested to be merged in the embodiment of the present application can be divided into any of the following situations:

[0077] Multiple lots are all single lots, where unmerged lots are called single lots. For example, if a single lot is an independent wafer batch, then multiple unmerged single lots are requested to be merged.

[0078] Some of the multiple lots are combined lots, and some of the lots are single lots, wherein the combined lot includes at least two single lots, for example, the combined lot has been merged at least once, and at this time, the unmerged single lot is requested to be merged with the merged combined lot; the combined lot may correspond to the merged lot in the embodiment of the present application;

[0079] The multiple lots are all combined lots, that is, the multiple lots requested to be merged are all combined lots that have been merged.

[0080] That is to say, the embodiment of the present application supports flexible merging of Lots, and whether a Lot has been merged before will not affect the request for merging again; whether it is an unmerged single Lot or a combined Lot that has been merged at least once, it can be requested to be merged according to production needs.

[0081] In step S212, the MES system obtains the account information of multiple lots based on the lot identifier.

[0082] As an optional implementation, the MES system may read the account information of the multiple lots requested to be merged from the database, that is, based on the lot identifiers of the multiple lots carried in the lot merge request, read the account information of the multiple lots from the database.

[0083] In step S213, the MES system determines whether the multiple lots meet the merging conditions based on the account information. If not, the system executes step S214. If yes, the system executes step S215.

[0084] In order to ensure that the multiple lots requested to be merged can smoothly proceed to the subsequent production process steps after merging, to ensure the consistency of wafer quality, and to optimize the production efficiency and resource utilization of the production line, the embodiment of the present application can set a merging condition. Therefore, after obtaining the lot merging request, the MES system can obtain the account information of the multiple lots requested to be merged, and determine whether the multiple lots requested to be merged meet the merging conditions based on the obtained account information; if the multiple lots requested to be merged do not meet the merging conditions, the MES system can enter step S214, so that the MES system terminates the process; if the multiple lots requested to be merged meet the merging conditions, the MES system can enter step S215 and continue the subsequent process.

[0085] In an optional implementation, the purpose of merging multiple Lots in the embodiment of the present application is to enable the multiple Lots to be assigned to the process after being merged, so that the machine can perform consistent process processing on the merged Lot in the future, thereby improving the resource utilization of the production line; therefore, the next process step of each wafer in the multiple Lots requested to be merged should be consistent, so that the merged Lot can perform consistent process processing in the next process step.

[0086] Since the material information of a lot records the next process step identifier of the lot, the merging condition may include that the next process step identifiers in the material information of multiple lots are consistent. For example, after obtaining the material information of multiple lots requested to be merged, the MES system may parse the next process step identifiers in the material information of multiple lots and determine whether the next process step identifiers of multiple lots are consistent; if not, that is, if the next process step identifiers of multiple lots are inconsistent, it can be determined that the multiple lots do not meet the merging condition.

[0087] During the wafer production process, different lots may experience differences in process steps, material processing, and surface conditions. Therefore, in order to prevent cross-contamination and improve wafer production quality and yield, the embodiment of the present application may introduce a judgment of contamination consistency in the merging conditions, that is, the merging conditions may include the consistency of the contamination identification of multiple lots requested to be merged, wherein the contamination identification of the lot is used to represent the contamination-related factors of the lot, to ensure that after the multiple lots are merged, there will be no cross-contamination or process compatibility issues due to contamination differences. The contamination identification of the lot can be recorded in the account information of the lot, so that after the MES system obtains the account information of the multiple lots requested to be merged, it can parse the contamination identification in the account information of the multiple lots and determine whether the contamination identification of the multiple lots is consistent; if not, that is, if the contamination identification of the multiple lots is inconsistent, it can be confirmed that the multiple lots do not meet the merging conditions.

[0088] In an optional implementation, the contamination identification of a lot may be composed of one or more pieces of information to indicate at least one of the wafer surface state, contamination level, and compatibility of the lot with subsequent processes. As an example, the contamination identification of a lot may include but is not limited to at least one of the following:

[0089] The final process step identifier indicates the last process step after the lot completes all manufacturing processes;

[0090] Photoresist label, indicating whether the wafer surface of Lot is coated with photoresist (i.e. photoresist layer);

[0091] The final contamination level indicates the contamination status of the wafer surface of the lot. The final contamination level can be evaluated based on the particle density, chemical residues, etc. on the wafer surface of the lot.

[0092] It should be noted that if the final process step identifications of multiple lots requested to be merged are inconsistent, the multiple lots may have undergone different process conditions and may have different contamination risks. It cannot be guaranteed that the multiple lots can be safely merged without causing cross contamination. Therefore, if the final process step identifications of multiple lots are inconsistent, it is deemed that the contamination identifications of the multiple lots are inconsistent.

[0093] When wafers coated with photoresist and wafers not coated with photoresist are exposed to the same environment, chemical reactions or material migration may occur, resulting in contamination or incompatibility. Therefore, if the photoresist labels of multiple lots requested to be merged are inconsistent, it may cause process problems or cross-contamination in subsequent processes. Therefore, if the photoresist labels of multiple lots are inconsistent, it is considered that the contamination marks of multiple lots are inconsistent, so as to prevent contamination problems when wafers with different surface states are mixed and processed;

[0094] Different final contamination levels mean that the wafer surface is subjected to different processing or environmental impacts. If the final contamination levels of multiple lots requested to be merged are inconsistent, the lot with a higher final contamination level may contaminate the lot with a lower final contamination level, causing the contamination to spread. Therefore, if the final contamination levels of multiple lots are inconsistent, the contamination identifications of the multiple lots are deemed to be inconsistent.

[0095] At least one of the above-mentioned final process step identification, photoresist label, and final contamination level can constitute the contamination identification of the Lot. For example, the contamination identification can include the final process step identification, and / or the photoresist label and the final contamination level.

[0096] In an optional implementation, the final process step identification, photoresist label, and final contamination level may be recorded in the material information of the lot. For example, Figure 3B Another example format diagram of the material information of a lot is shown as an example, which can be used for reference. Therefore, after obtaining the material information of multiple lots requested to be merged, the MES system can parse the final process step identification and / or the photoresist label and the final contamination level in the material information of multiple lots to obtain the contamination identification of multiple lots, and determine whether the contamination identification of multiple lots is consistent.

[0097] Based on the merging conditions including the consistency of the contamination identification in the material information of the multiple Lots described above, and the consistency of the identification of the next process step, the embodiment of the present application can ensure that the multiple Lots have process compatibility after the merger and reduce the risk of cross-contamination, thereby ensuring the smooth and efficient production process after the merger of multiple Lots, providing a basis for improving wafer production efficiency.

[0098] In a further optional implementation, keeping the wafers in the same lot in the same wafer container helps to receive the same process environment conditions and process steps, thereby maintaining the process consistency of the wafers in the same lot. Therefore, the embodiment of the present application can place the wafers of multiple lots requested to be merged in the same wafer container, so the number of wafers of multiple lots requested to be merged should not be greater than the wafer quantity limit of the wafer container.

[0099] Based on this, the merging condition may also include that the total number of wafers in the multiple lots requested to be merged is not greater than the wafer quantity limit of the wafer container, so that when multiple lots are merged, the wafers in the multiple lots can be placed in the same wafer container. In other words, the MES system can also determine whether the total number of wafers in multiple lots is not greater than the wafer quantity limit of the wafer container to determine whether the multiple lots meet the merging condition; if not, that is, if the total number of wafers in multiple lots is greater than the wafer quantity limit of the wafer container, it can be confirmed that the multiple lots do not meet the merging condition.

[0100] As an optional implementation, the MES system can read the account information of multiple Lots requested to be merged from the database; thereby determining the number of wafers of each Lot requested to be merged based on the account information of each Lot requested to be merged. For example, for any Lot requested to be merged, analyze the number of wafer identifiers (such as Wafer ID) in the account information of the Lot to obtain the number of wafers in the Lot; then add the number of wafers of each Lot requested to be merged to obtain the total number of wafers of the multiple Lots requested to be merged, and determine whether the total number of wafers of the multiple Lots requested to be merged is not greater than the wafer number limit of the wafer container.

[0101] It should be noted that placing the merged lot in the same wafer container can also reduce the number of material handling times of the merged lot and reduce the complexity of operation. At the same time, the production line can process wafers in the same wafer container more efficiently. For example, the robotic arm and automated handling system of the production line only need to obtain and place wafers from one wafer container, reducing the mechanical movement and adjustment time of the production line.

[0102] In a further optional implementation, the merging condition may also include that any of the multiple lots requested to be merged does not have an unexecutable future action. That is, the MES system may also determine whether any of the multiple lots does not have an unexecutable future action, so as to determine whether the multiple lots meet the merging condition; if not, that is, if any of the multiple lots has an unexecutable future action, it may be determined that the multiple lots do not meet the merging condition.

[0103] In the wafer production and manufacturing process, future operations refer to actions or tasks to be performed in the future, that is, the future operations of a Lot are specific operations that the Lot needs to perform in the future production process. For example, due to factors such as quality control, customer demand, and process adjustment, the Lot needs to introduce specific operations, namely future operations, in the future production process. An unexecutable future operation refers to a future operation that cannot be performed because the production conditions are not met, such as a future operation that cannot be performed due to lack of required resources or equipment, lack of support for the production environment or parameters, or conflict with other production steps. If any of the multiple Lots requested to be merged has an unexecutable Future Action, merging the multiple Lots may result in problems with wafer production execution or risks in quality control. Therefore, the embodiment of the present application may further set in the merging conditions that any of the multiple Lots does not have an unexecutable future operation, so as to avoid problems in production execution or risks in quality control after the multiple Lots are merged.

[0104] In a further optional implementation, the merging condition may also include that the number of lots requested to be merged should be greater than one, that is, the embodiment of the present application supports merging at least two lots, and if there is only one lot requested to be merged, the lot merging cannot be effectively performed.

[0105] From the above description, it can be seen that the embodiment of the present application at least sets the merging conditions as follows: the contamination identification in the account information of the multiple lots requested to be merged is consistent, and the identification of the next process step is consistent; on this basis, the embodiment of the present application can also expand the merging conditions in at least one dimension, such as the total number of wafers in the multiple lots requested to be merged is not greater than the wafer number limit of the wafer container, there is no unexecutable future operation in any of the multiple lots requested to be merged, and the number of lots requested to be merged should be greater than one, so as to comprehensively cope with various situations that may arise in wafer production, make the merging of multiple lots more reasonable and efficient, and thereby achieve resource optimization of the production line while ensuring the consistency of wafer quality of the merged Lots.

[0106] In step S214, the MES system terminates the process.

[0107] Furthermore, the MES system may also send a reminder message to the user to remind the user that the lot merger has failed. For example, the MES system may carry the reason for the lot merger failure in the reminder message, for example, the specific merger conditions that the multiple lots requested to be merged do not meet.

[0108] In step S215, the MES system merges the multiple lots to obtain a merged lot, including: acquiring wafer identifications of the multiple lots based on the inventory information, generating a virtual lot identification, and creating a first mapping relationship between the wafer identification and the virtual lot identification.

[0109] When the MES system determines that the multiple lots requested to be merged meet the merging conditions, the multiple lots requested to be merged can be merged to obtain a merged Lot, and then the multiple lots requested to be merged can be dispatched through the merged Lot to achieve consistent process processing. In other words, after the multiple lots requested to be merged are dispatched through the merged Lot, unified production scheduling can be performed, so that the site can uniformly perform consistent process processing on the multiple lots contained in the merged Lot, thereby improving the resource utilization of the production line during the wafer production process and improving the wafer production efficiency.

[0110] As an optional implementation, when merging multiple lots to obtain a merged lot, the embodiment of the present application may involve updating the account information of multiple lots and merging the materials of multiple lots on the production line (ie, material merging).

[0111] For the update of the account information of multiple lots, the embodiment of the present application can generate a virtual lot identifier for the merged lot obtained by merging multiple lots, so as to create a mapping relationship (referred to as a first mapping relationship) between the wafer identifiers of multiple lots and the virtual lot identifier in the account information of multiple lots, so as to update the account information and obtain the updated account information. That is to say, the updated account information can include the first mapping relationship and the original account information of multiple lots, that is, the updated account information can record the account information before the merger of multiple lots, as well as the first mapping relationship between the wafer identifier and the virtual lot identifier of the merged lot, so as to trace the lot where each wafer is located and the merged lot where it is located, so as to maintain the integrity and consistency of the wafer data before and after the lot merger.

[0112] In an optional implementation, the embodiment of the present application can obtain wafer identifications of multiple lots based on the account material information of multiple lots, and after generating a virtual lot identification of the merged lot, create a first mapping relationship between the wafer identification and the virtual lot identification in the account material information of the multiple lots to obtain updated account material information, so that the updated account material information can include the first mapping relationship and the original account material information of the multiple lots (i.e., the account material information before the multiple lots are merged).

[0113] In a further optional implementation, creating a first mapping relationship between a wafer identifier and a virtual lot identifier in the account information may include: at the level of the execution lot identifier, adjusting the execution lot identifier in the account information of the multiple lots to the virtual lot identifier, thereby recording the virtual lot identifier and the wafer identifier in the account information of the multiple lots, and establishing a first mapping relationship between the wafer identifier and the virtual lot identifier. That is, for a merged lot that merges multiple lots, the account information will include both the virtual lot identifier and the wafer identifier, thereby establishing a mapping relationship between the virtual lot identifier and the wafer identifier in the updated account information.

[0114] Taking multiple lots as a single lot as an example, before the multiple lots are merged, the execution lot identifier and the offline lot identifier in the account information of the multiple lots can be the same. When the multiple lots are merged, the execution lot identifier in the account information of the multiple lots is adjusted to the virtual lot identifier of the merged lot, thereby obtaining updated account information. That is to say, the updated account information is identified using the virtual lot identifier at the execution lot identifier level and mapped with the wafer identifier recorded in the account information.

[0115] For ease of understanding, Figure 4 The example diagram of the merging of Lot is shown as an example. Figure 4 For example, if the number of lots to be merged is 3 lots, and the offline lot IDs of the 3 lots are Lot ID1, Lot ID2, and Lot ID3, and each lot contains 3 wafers, then according to the account information of the lot in the example of FIG. 3, the account information of the 3 lots before merging can be as follows: Figure 4 Specifically, if three lots are requested to be merged, the next process step identifiers of the three lots before merging should be the same, and the pollution identifiers should be consistent. In addition, the execution Lot IDs of the three lots can reuse the offline Lot IDs, and the execution Lot IDs of the three lots are Lot ID1, Lot ID2, and Lot ID3 respectively; further, the WaferID, T7 Code, and Slot ID of each wafer in the three lots can refer to Figure 4 The corresponding parts are shown and will not be expanded here.

[0116] When three lots are merged, the embodiment of the present application can generate a virtual lot ID for the merged lot formed by merging the three lots, such as Figure 4The virtual Lot ID A shown is used, and the execution Lot IDs of the three lots are adjusted to the virtual Lot ID A, so that the three lots are identified with the virtual Lot ID A at the execution Lot ID level, and mapped with the Wafer ID in the account information of the three lots, thereby updating the account information of the three lots.

[0117] That is to say, after multiple lots are merged, the generated virtual Lot ID can be used to manage and record at the level of the execution Lot ID. For example, after multiple lots are merged, the execution Lot ID of each lot displayed by the MES system can be adjusted to the generated virtual Lot ID; that is, for multiple lots requested to be merged, the MES system can use the generated virtual Lot ID to cover the execution Lot ID displayed by the multiple lots after merging the multiple lots.

[0118] In an optional implementation, a virtual lot identification (such as a virtual lot ID) may be viewed as a logical batch identifier created for the purpose of managing merged lots; that is, the offline lot identification (such as an offline lot ID) of a lot may correspond to a physical actual batch, while the virtual lot identification is a logical batch identifier generated to represent a merged lot formed by merging multiple lots, and is used to logically merge multiple lots, such as merging and adjusting the execution lot IDs in the account information of multiple lots into a virtual lot ID.

[0119] In a further optional implementation, the embodiment of the present application can generate a virtual Lot identifier (such as a virtual Lot ID) for the merged Lot based on the virtual Lot identifier generation strategy, and ensure the uniqueness of the virtual Lot identifier, such as the virtual Lot identifier is different from the Lot identifiers of the multiple Lots requested to be merged (such as the offline Lot identifier). As an optional implementation, the virtual Lot identifier generation strategy can consider dimensions such as the production geographic information of the wafer, the wafer product type, the time and sequence number of the virtual Lot identifier generation, etc. to generate a virtual Lot identifier for the merged Lot. For example, when the MES system merges multiple Lots, it can generate a virtual Lot identifier for the merged Lot based on the production geographic information of the wafer, the wafer product type information, the Lot property information of the virtual Lot identifier, the generation time information and the generation sequence number of the virtual Lot identifier to ensure the uniqueness of the virtual Lot identifier generated for the merged Lot. Among them, the Lot property information of the virtual Lot identifier can indicate that the Lot property of the virtual Lot identifier is a virtual Lot identifier, so as to distinguish the actual physical Lot identifier (such as the offline Lot identifier), that is, the Lot property information can distinguish the virtual Lot identifier from the actual physical offline Lot identifier in terms of Lot property.

[0120] As an example, Figure 5 The format of the virtual Lot ID is shown as an example. Figure 5 As shown, the virtual Lot ID can carry the following content:

[0121] The production plant number of the wafer is regarded as an optional form of the production geographical information of the wafer; for example, a production plant number can be represented by one character, so that different characters represent different production plant numbers corresponding to different production areas of the wafer, for example, characters from A to Z can correspond to different production areas of the wafer, so that the production plant number of the wafer in the virtual Lot ID can be set based on the current production area of ​​the wafer;

[0122] The wafer product type number is regarded as an optional form of wafer product type information; for example, a wafer can have different product types, such as wafer product, control wafer, other special wafer and other product types, and different wafer product types can be represented by different product type numbers, such as P for wafer product, N for control wafer, R for other special wafer, etc., so that the wafer product type number in the virtual Lot ID can be set based on the current product type of the wafer;

[0123] The lot property identifier is regarded as an optional form of lot property information; for example, different lot properties can be represented by different characters, so that the lot property identifier in the virtual lot ID can be set to correspond to the virtual lot identifier, for example, X indicates that the lot property is a virtual lot identifier, and the lot property identifier in the virtual lot ID can be set to X;

[0124] The suffix of the year when the virtual lot logo is generated is regarded as an optional form of the generation time information of the virtual lot logo; for example, the suffix of the year when the virtual lot logo is generated can be two digits, and the value of each digit is 0 to 9, for example, the suffix of the year when the virtual lot logo is generated can be the last two digits of the year when the virtual lot logo is generated;

[0125] The month of generation of the virtual lot identification is regarded as a further optional form of the generation time information of the virtual lot identification; for example, the month of generation of the virtual lot identification can be two digits, and the value of each digit is 0 to 9. For example, if the value of the month of generation of the virtual lot identification is 06, it means that the month of generation of the virtual lot identification is June;

[0126] The serial code is regarded as an optional form of the generation number of the virtual Lot identifier; for example, the serial code can represent the virtual Lot identifier number corresponding to the generation time of the virtual Lot identifier, such as the virtual Lot identifier number corresponding to the generation month of the virtual Lot identifier; in a further example, the serial code can be a two-digit number, each digit has a value from 0 to 9, for example, a serial code of 16 means that the virtual Lot identifier number corresponding to the generation month of the virtual Lot identifier is 16, that is, the 16th virtual Lot identifier generated in the generation month.

[0127] As an optional implementation, for material merging, the embodiment of the present application can place multiple lots requested to be merged in the same wafer container (e.g., the same FOUP) to merge the materials of multiple lots in the same wafer container, thereby reducing the number of production equipment (e.g., production machine) replacements and material handling times when multiple lots are merged and processed in a consistent manner, thereby improving the operating efficiency of the production line. Based on this, when merging multiple lots, the embodiment of the present application can determine whether the multiple lots are in the same wafer container; if not (i.e., multiple lots are not in the same wafer container), the MES system can create a sorting job instruction, transmit the sorting job instruction to the machine, that is, assign the machine to a sorting job, so that the machine performs the sorting operation process, thereby placing the wafers of multiple lots in the same wafer container through the machine. In other words, the MES system can generate a sorting job instruction for controlling the machine to perform a sorting operation at the data processing level, and the MES system assigns the machine to a sorting job by transmitting the sorting job instruction to the machine, so that the machine performs the sorting operation process. Among them, the sorting operation can be regarded as an automated task for moving wafers between wafer containers (such as FOUP); that is, when the container identifications of multiple lots requested to be merged are inconsistent, the machine is controlled by the sorting operation instructions to execute the sorting operation process, thereby being responsible for physically reordering and organizing the wafers of the lot, ensuring that the multiple lots requested to be merged can be moved to the same wafer container, so as to facilitate the merging of multiple lots in terms of materials and subsequent consistent process processing.

[0128] In an optional implementation, the inventory information of multiple Lots requested to be merged may also record the container identifiers and slot identifiers corresponding to the wafer identifiers of multiple Lots, so as to indicate the wafer containers and slots in which the wafers of multiple Lots are located; thus, when merging multiple Lots to obtain a merged Lot, the embodiment of the present application may also confirm whether the container identifiers in the inventory information of multiple Lots are consistent; if the container identifiers are inconsistent, the embodiment of the present application may create a mapping relationship (referred to as a second mapping relationship) between the merged container identifier and the wafer identifier, wherein the merged container identifier corresponds to the same wafer container in which the wafers of multiple Lots need to be placed; and then, a sorting operation instruction is created based on the second mapping relationship and the inventory information of multiple Lots, and the created sorting operation instruction is used to place the wafers of multiple Lots in the same wafer container, for example, the sorting operation instruction is used to control the machine to perform a sorting operation process to move the wafers of multiple Lots to the same wafer container. The second mapping relationship may be recorded in the updated account information (ie, the updated account information also includes the second mapping relationship). For example, the updated account information of multiple lots may simultaneously record the combined container identification and wafer identification.

[0129] In an optional implementation, the same wafer container where wafers of multiple lots need to be placed can be a used wafer container of one of the multiple lots; for example, the wafer container with the largest number of wafers among the wafer containers used by multiple lots, or the wafer container used by any of the multiple lots. In this case, the embodiment of the present application can reuse the used wafer container and place the wafers of multiple lots in the same wafer container without adding additional wafer containers. In other possible implementations, the embodiment of the present application can also use a new wafer container (the new wafer container is different from the wafer containers used by multiple lots) and designate the new wafer container as the same wafer container where the wafers of multiple lots need to be placed.

[0130] The container identifier corresponding to the same wafer container is a combined container identifier, that is, the combined container identifier is used to identify or associate the same wafer container where wafers of multiple lots need to be placed. In possible implementations, the combined container identifier may have any of the following conditions:

[0131] The merged container identifier is the container identifier of the used wafer container, or the associated container identifier; for example, when the same wafer container is a used wafer container, the merged container identifier can reuse the container identifier of the used wafer container or the associated container identifier. At this time, after the multiple lots are merged, the previous wafer container is still used, but the wafers of other lots are also moved into the wafer container;

[0132] The merged container identifier is a new container identifier (the new container identifier is different from the container identifiers of wafer containers used by multiple Lots); for example, when the same wafer container is a new wafer container, the container identifier of the new wafer container or the associated container identifier can be a merged container identifier; for another example, when the same wafer container is a used wafer container, the embodiment of the present application can also reconfigure a new container identifier for the used wafer container to distinguish the used wafer container before and after the Lot merge; that is, the merged container identifier can be a brand new container identifier, regardless of whether the same wafer container uses a new wafer container or continues to reuse the used wafer container.

[0133] In an optional implementation, when creating the second mapping relationship between the merged container identifier and the wafer identifier, the embodiment of the present application may completely create a second mapping relationship between the merged container identifier and the wafer identifier, that is, for wafers of multiple lots, regardless of whether the wafer container in which the wafer is located changes, the embodiment of the present application will re-establish the second mapping relationship between the merged container identifier and the wafer identifier. For example, the same wafer container in which the wafers of multiple lots need to be placed is a used wafer container. Even if the wafers in the used wafer container do not need to be moved, the embodiment of the present application can still re-establish the second mapping relationship for all wafers of multiple lots, such as re-establishing the second mapping relationship between the wafer identifier and the new container identifier of the used wafer container, and recording it in the updated account information. For another example, if the same wafer container is a new wafer container, all wafers of multiple lots need to be moved into the new wafer container. The embodiment of the present application needs to re-establish the second mapping relationship between the wafer identifier and the new container identifier of the new wafer container, and record it in the updated account information.

[0134] In an optional implementation, the embodiment of the present application may partially update the mapping relationship when creating the second mapping relationship between the merged container identifier and the wafer identifier, that is, a second mapping relationship between the wafer identifier and the merged container identifier is established for the wafer that needs to be moved, and for the wafer that does not need to be moved, since it is already in the same wafer container that needs to be placed, the existing mapping relationship between the wafer identifier and the container identifier can continue to be used; for example, if the same wafer container in which multiple lots of wafers need to be placed is a used wafer container, then the wafers in the used wafer container do not need to be moved, and the existing mapping relationship between the wafer identifier and the container identifier continues to be used; and if the wafers that are not in the used wafer container need to be moved, it is necessary to establish a second mapping relationship between the wafer identifier and the container identifier of the used wafer container, or an associated container identifier. For example, assume that the Lots requested to be merged are divided into Lot1 and Lot2, where Lot1 is in FOUP A and Lot2 is in FOUP B. Lot1 and Lot2 need to be placed in FOUP A. The wafers in Lot1 can use the existing mapping relationship between the wafer identification and the container identification. At this time, the update of the second mapping relationship can be a partial update, that is, updating the mapping relationship between the wafer identification of the wafers in Lot2 and the container identification of FOUP A, and recording it in the account information.

[0135] In a further optional implementation, if the container identifiers of multiple lots requested to be merged are inconsistent, the slot identifiers of the wafers in the multiple lots may also change. Therefore, the embodiment of the present application may further include a correspondence between the wafer identifier and the merged slot identifier in the second mapping relationship or the updated account information, wherein the merged slot identifier corresponds to the slot information of the wafer in the same wafer container.

[0136] In an optional implementation, the embodiment of the present application can pre-determine the new slot position of the wafer in the same wafer container by the MES system before the sorting operation begins, or, during the sorting operation, determine the new slot position of the wafer allocated on-site by the machine and record it by the MES system; and, regardless of whether the new slot position of the wafer is determined in advance or during the sorting operation, the embodiment of the present application can record the correspondence between the wafer identification and the merged slot identification in the second mapping relationship or the updated account information to clarify the specific position of the wafer in the same wafer container.

[0137] As an optional implementation, in order to predetermine the new slot positions of the wafers before the sorting operation begins, the embodiment of the present application can plan the slot positions of each wafer in the same wafer container in advance, and record the correspondence between the wafer identification of the wafer and the merged slot identification of the planned slots in the second mapping relationship or the updated account information; assuming that the wafers of Lot1 and Lot2 need to be merged into the same wafer container, then when or after establishing the second mapping relationship between the wafer identification and the merged container identification corresponding to the same wafer container (the relevant content can be referred to the previous description), the embodiment of the present application can plan the slot positions of the wafers of Lot1 and Lot2 in the same wafer container, and record the correspondence between the wafer identification of the wafers of Lot1 and Lot2 and the merged slot identification of the planned slots in the second mapping relationship or the updated account information.

[0138] It should be noted that the embodiments of the present application support the same wafer container being a used wafer container or a new wafer container, and do not limit whether the slot positions of the wafers in the same wafer container remain unchanged or are re-planned; for example, if the same wafer container is a used wafer container, the slot positions of the wafers originally existing in the used wafer container can remain unchanged or be re-planned, while the slot positions of the wafers not in the used wafer container need to be re-planned; for another example, if the same wafer container is a new wafer container, the slot positions of multiple lots of wafers in the new wafer container need to be re-planned.

[0139] For example, when creating the second mapping relationship between the merged container identifier and the wafer identifier, the embodiment of the present application can simultaneously create a corresponding relationship between the wafer identifier and the merged slot identifier in the second mapping relationship, so that the second mapping relationship can simultaneously indicate the same wafer container in which multiple lots of wafers need to be placed, and the slots of the wafers in the same wafer container. Furthermore, based on the second mapping relationship, the embodiment of the present application can create a sorting operation instruction, and indicate the merged container identifier and the merged slot identifier corresponding to the wafer identifier in the sorting operation instruction, so that during the sorting operation performed by the machine, multiple lots of wafers can be accurately placed in the same wafer container (corresponding to the merged container identifier), and according to the corresponding relationship between the wafer identifier and the merged slot identifier, the wafers can be accurately placed in the slots of the same wafer container.

[0140] Assume that the Lots requested to be merged are divided into Lot1 and Lot2, where Lot1 is in FOUP A, including wafers W1, W2 and W3, and the corresponding Slot IDs are Slot ID A1, Slot ID A2 and Slot ID A3, i.e., the first slot, the second slot and the third slot in FOUP A; Lot2 is in FOUP B, including wafers W4, W5 and W6, and the corresponding Slot IDs are Slot ID B1, Slot ID B2, Slot ID B3, i.e., the first slot, the second slot and the third slot in FOUP B; if Lot1 and Lot2 meet the merging conditions, then the embodiment of the present application can judge that Lot1 and Lot2 are not in the same FOUP through the container identification in the account information of Lot1 and Lot2 (the container identification of FOUP A and FOUP B). Assuming that Lot1 and Lot2 are uniformly placed in FOUP A, then the embodiment of the present application can create wafer identifications and FOUP IDs of wafers W4, W5 and W6 in the account information of Lot2. A second mapping relationship of the container identification of FOUP A (for example, adjusting the container identification of FOUP B in the account information of Lot2 to the container identification of FOUP A), and creating corresponding relationships between the wafer identifications of wafers W4, W5 and W6 and Slot ID A4 (the slot identification of the fourth slot of FOUP A), Slot ID A5 (the slot identification of the fifth slot of FOUP A), and Slot ID A6 (the slot identification of the sixth slot of FOUP A), respectively; and then based on the wafer identifications of wafers W4, W5 and W6 recorded in the account information of Lot2, the container identification of FOUP A, Slot ID A4 of wafer W4, Slot ID A5 of wafer W5, and Slot ID A6 of wafer W6, a sorting operation instruction is created; the sorting operation instruction is transmitted to the machine, and the machine can execute the sorting operation process to move wafer W4 in Lot2 to the fourth slot of FOUP A, wafer W5 to the fifth slot of FOUP A, and wafer W6 to FOUP The sixth slot of A allows the wafer in Lot2 to be placed in FOUP A.

[0141] In other optional implementations, in the case where the new slots of the wafers allocated on-site by the machine are determined and recorded by the MES system during the sorting operation, the MES system can determine the merged slot identifiers corresponding to the slots of multiple lots of wafers in the same wafer container based on the real-time results or final results of the sorting operation performed by the machine, and record the wafer identifiers of the wafers and the corresponding merged slot identifiers in the updated account information. For example, after creating the second mapping relationship between the merged container identifier and the wafer identifier, the embodiment of the present application can create a sorting operation instruction based on the second mapping relationship between the merged container identifier and the wafer identifier and the account information, and indicate the merged container identifier and the wafer identifier in the sorting operation instruction, so that during the machine's sorting operation, multiple lots of wafers can be placed in the same wafer container (corresponding to the merged container identifier); during the machine's sorting operation, the MES system can determine in real time the merged slot identifier corresponding to the slots of multiple lots of wafers in the same wafer container, or, based on the final result of the machine's sorting operation, determine the merged slot identifier corresponding to the slots of multiple lots of wafers in the same wafer container, thereby recording the wafer identifier of the wafer and the merged slot identifier corresponding to the slot of the wafer in the updated account information.

[0142] In step S216, the MES system saves updated account information, where the updated account information includes the first mapping relationship and the account information.

[0143] The MES system can save updated account information in the database.

[0144] In step S217, the MES system assigns processes to the merged lot based on the virtual lot identifier.

[0145] The MES system can use the virtual lot identifier of the merged lot to perform process dispatch on the merged lot, so that the machine can perform consistent process processing on the wafers in the merged lot. For example, the MES system can use the virtual lot identifier of the merged lot to send a process dispatch instruction to the production machine, so that the production machine can perform consistent process processing on multiple lots with the virtual lot identifier based on the virtual lot identifier in the process dispatch instruction, that is, the production machine can perform consistent process processing on wafers based on the merged lot.

[0146] It can be seen that the embodiment of the present application can merge multiple Lots to obtain a merged Lot when multiple Lots meet the merging conditions, and then use the virtual Lot identifier of the merged Lot to perform process dispatching on the merged Lot, so that the machine performs consistent process processing on the merged Lot containing the multiple Lots, avoiding the process of the machine performing process processing on multiple Lots separately, which can reduce the machine preparation and conversion time in the production line and improve the operation efficiency of the machine; at the same time, after merging multiple Lots, the virtual Lot identifier of the merged Lot is used to dispatch the merged Lot, so that the number of wafers of the Lot served by the machine can be increased, and the situation where the machine serves a scattered Lot containing a small number of wafers is reduced, thereby improving the operation efficiency of the machine. Therefore, the embodiment of the present application can make efficient use of the resources of the production line, improve the operation efficiency of the machine, and improve the wafer production efficiency.

[0147] In a further optional implementation, the lot merge request may further include a merge site identifier to indicate the site where the multiple lots are merged, wherein the merge site identifier may correspond to the lot identifiers of the multiple lots requested to be merged. Thus, after determining that the multiple lots meet the merge conditions and before merging the multiple lots to obtain the merged lot, the embodiment of the present application may further generate pause information, and the pause information is used to make the multiple lots stop at the site corresponding to the merge site identifier to merge the multiple lots. For example, after the multiple lots meet the merge conditions, the MES system may generate pause information and send it to the machine, so that the machine can control the multiple lots requested to be merged to stop at the site corresponding to the merge site identifier based on the lot identifiers of the multiple lots and the merge site identifier, until the multiple lots arrive at the site corresponding to the merge site identifier. The embodiment of the present application can merge the multiple lots, such as updating the account information, merging materials, etc.

[0148] In a further optional implementation, the embodiment of the present application can merge multiple Lots at the current site, so that the current sites of the multiple Lots should be the same. For example, the embodiment of the present application can further set the current sites of the multiple Lots to be the same in the merge condition; and then when judging whether the multiple Lots meet the merge condition, it is also necessary to judge whether the current sites of the multiple Lots are the same; for example, the embodiment of the present application can obtain the current site identifiers of the multiple Lots from the account information of the multiple Lots, and judge whether the current site identifiers of the multiple Lots are the same. Therefore, after judging that the multiple Lots meet the merge condition and before merging the multiple Lots to obtain the merged Lot, the embodiment of the present application can generate pause information, and the pause information is used to make the multiple Lots stop at the current site for merging the multiple Lots. In the case of merging the current site, the lot merge request may not carry the merge site identifier, that is, the embodiment of the present application may not specify the merge site in advance, but set the current sites of the multiple Lots to be the same in the merge condition, so that if the multiple Lots meet the merge condition, the multiple Lots are controlled to stop at the current site for merging.

[0149] Furthermore, after the merging of multiple lots is completed, the MES system can release the suspension information so that the merged lot can continue the subsequent production process. In an optional implementation, the suspension information can be system hold information, which is a kind of security or quality control information used to suspend the operation until it is released; the authority of the system hold information can be associated with the user who submitted the lot merging request or the department to which the user belongs, for example, the authority to release the system hold information can be associated with the user or the department to which the user belongs.

[0150] As an example of an optional implementation, Figure 6 Another optional flow chart of the wafer batch management method provided in the embodiment of the present application is shown as an example, and the flow chart can be executed by the MES system. Figure 6 The relevant contents of the process can be referenced in conjunction with the previous description. Figure 6 As shown, the process may include the following steps.

[0151] In step S610, a lot merge request is obtained. The lot merge request is used to request to merge multiple lots. The lot merge request includes lot identifiers of the multiple lots.

[0152] In step S611, based on the lot identifier, the account information of the plurality of lots is obtained.

[0153] In step S612, it is determined whether the pollution identifications of multiple lots are consistent. If not, step S613 is executed. If so, step S614 is executed.

[0154] In step S613, the process is terminated.

[0155] In step S614, it is determined whether the next process step identifiers of multiple Lots are consistent. If not, step S613 is executed. If so, step S615 is executed.

[0156] In step S615, it is determined based on the account information whether the current sites of the multiple Lots are the same. If not, step S613 is executed. If so, step S616 is executed.

[0157] In step S616, it is determined whether the total number of wafers in the plurality of lots is not greater than the wafer quantity limit of the wafer container, if not, step S613 is executed, and if so, step S617 is executed.

[0158] In step S617, it is determined whether any of the multiple Lots has no unexecutable future operations. If not, step S613 is executed. If so, step S618 is executed.

[0159] In step S618, it is determined whether the number of lots requested to be merged is greater than one. If not, step S613 is executed. If so, step S619 is executed.

[0160] It should be noted that in Figure 6 In the example, the merging condition combines the conditions of multiple dimensions such as the contamination identification of the multiple lots requested to be merged is consistent, the next process step identification is consistent, the current site is the same, the total number of wafers is not greater than the wafer number limit of the wafer container, there are no unexecutable future operations, and the number of lots is greater than one. Therefore, when the judgment results of step S612, step S614, step S615, step S616, step S617 and step S618 are all yes, the embodiment of the present application can confirm that the multiple lots requested to be merged meet the merging condition; when the judgment result of any of the above steps is no, the embodiment of the present application can confirm that the multiple lots requested to be merged do not meet the merging condition, thereby terminating the process.

[0161] Of course, when the merging condition is combined with the conditions of the above multiple dimensions, the judgment order of step S612, step S614, step S615, step S616, step S617 and step S618 is only an optional order. For example, the judgment order of step S612, step S614, step S615, step S616, step S617 and step S618 can be set arbitrarily, without being limited to Figure 6 The judgment order of the example is sufficient as long as the conditions of the above multiple dimensions in the merging condition are judged.

[0162] Furthermore, when the merging conditions are set to at least include the consistency of the contamination identifications of multiple lots requested to be merged and the consistency of the identification of the next process step, the embodiment of the present application may further set conditions in at least one other dimension, and is not limited to the use of the above-mentioned multiple dimensions of conditions in the merging conditions.

[0163] In step S619, pause information is generated, and the pause information is used to make multiple Lots stay at the current site.

[0164] In step S620, multiple Lots are merged to obtain a merged Lot.

[0165] The relevant contents of step S620 can refer to the above description, involving updating the account information of multiple lots, and creating a sorting operation instruction to merge the materials of multiple lots, etc. For example, for the MES system, the MSE system can obtain the wafer identifications of multiple lots based on the account information, generate a virtual lot identification of the merged lot, and create a first mapping relationship between the wafer identification and the virtual lot identification to obtain updated account information; further, if the container identifications in the account information of multiple lots are inconsistent, a second mapping relationship between the merged container identification and the wafer identification is created, and a sorting operation instruction is created based on the second mapping relationship and the account information, and the sorting operation instruction is used to place the wafers of multiple lots in the same wafer container, wherein the same wafer container corresponds to the merged container identification, and the updated account information may also include the second mapping relationship; further, the second mapping relationship or the updated account information may also include: a corresponding relationship between the wafer identification and the merged slot identification, wherein the merged slot identification corresponds to the slot information of the wafer in the same wafer container. The relevant contents of merging multiple Lots can be referred to the previous description and will not be expanded here.

[0166] Thus, when the merged lot is obtained, the embodiment of the present application can synchronously obtain updated account information, and the updated account information includes a first mapping relationship between the wafer identifier and the virtual lot identifier, and the account information before the multiple lots are merged; further, the updated account information also includes a second mapping relationship between the merged container identifier and the wafer identifier; further, the updated account information also includes a corresponding relationship between the wafer identifier and the merged slot identifier. Furthermore, the MES system can also save the updated account information.

[0167] In step S621, the pause information is released.

[0168] In step S622, the merged lot is assigned a process based on the virtual lot identifier.

[0169] In a further optional implementation, after obtaining the merged Lot, the embodiment of the present application may also support merging the merged Lot with at least one Lot to obtain a new merged Lot; the at least one Lot may all be single Lots, or some Lots may be single Lots and some Lots may be combined Lots, or all Lots may be combined Lots. In an optional implementation, for updating the account information of the database, since the merged Lot has a generated virtual Lot ID, the merged Lot may reuse the existing virtual Lot ID after merging with at least one Lot; of course, the embodiment of the present application may also support regenerating a virtual Lot ID for a new merged Lot obtained by merging the merged Lot with at least one Lot, and the embodiment of the present application is not limited to this. Taking the reuse of an existing virtual Lot ID as an example, the execution Lot ID of at least one Lot to be merged with the merged Lot can be adjusted to the virtual Lot ID of the merged Lot, so that the merged Lot and the at least one Lot can use the same virtual Lot ID at the execution Lot ID level; for example, the execution Lot ID recorded in the account information of at least one Lot to be merged with the merged Lot can be adjusted to the virtual Lot ID of the merged Lot.

[0170] For ease of understanding, Figure 7 Another example of merging Lot is shown in FIG. Figure 4 and Figure 7 As shown, assuming that Figure 4 A single lot is merged based on the merged lot shown in the figure. The offline lot ID of the single lot is lot ID4 and contains 3 wafers. The wafer ID, T7 code, slot ID, etc. of each wafer can be referred to Figure 7 When the merged Lot is merged with the Lot with Lot ID4, the embodiment of the present application can reuse the virtual Lot ID of the merged Lot, such as virtual Lot ID A, so as to adjust the execution Lot ID of the Lot with offline Lot ID Lot ID4 to virtual Lot ID A.

[0171] In a further optional implementation, after the MES system assigns the process to the merged lot based on the virtual lot identifier, the MES system can also support unmerging some or all of the lots in the merged lot, that is, some or all of the lots in the merged lot can be split. As an optional implementation, Fig. 8A An optional flowchart of splitting and merging Lots provided in an embodiment of the present application is shown by way of example. The process can be executed by the MES system. Fig. 8A , the process may include the following steps.

[0172] In step S810, a Lot splitting request is obtained. The Lot splitting request is used to request splitting and merging of Lots. The Lot splitting request includes a virtual Lot identifier and grouping information. The grouping information includes grouping conditions of multiple Lots.

[0173] The virtual lot identifier is used to indicate the merged lot. When requesting to split the merged lot, the lot split request needs to include the virtual lot identifier of the merged lot requested to be split. Since the merged lot is obtained by merging multiple lots, when requesting to split the merged lot, the lot split request can define the grouping of the multiple lots after the merged lot is split, so that the lot split request can include grouping information, and the grouping information indicates the grouping of the multiple lots.

[0174] In an optional implementation, the grouping information can be used to describe the Lot grouping method during the splitting process of the merged Lot. Specifically, the grouping information can indicate the Lots contained in each group, or the group into which the Lot should be divided, wherein a group is associated with at least one Lot among the multiple Lots merged to obtain the merged Lot, so as to ensure that each Lot can be accurately assigned to the group indicated by the grouping information during the splitting process of the merged Lot.

[0175] For example, a Lot split request may request to split a portion of the Lot in a merged Lot, in which case the portion of the Lot will be split from the merged Lot, while the other portion of the Lot will continue to remain in the merged Lot. At this time, the grouping information may define one or more groups of the portion of the Lot split from the merged Lot (the split portion of the Lot may form one or more groups, and one group is associated with at least one Lot), as well as a group of the other portion of the Lot remaining in the merged Lot.

[0176] For example, the lot splitting request may request to split all the lots in the merged lot, and then all the lots will be split from the merged lot. At this time, the grouping information may define multiple groups of all the lots split from the merged lot, and one group is associated with at least one lot.

[0177] In an optional implementation, the user can create a work order through the work order interface to split the merged Lot, and fill in the virtual Lot identifier and grouping information of the merged Lot in the work order. Then, the OA system can submit a corresponding work order request to the MES system based on the work order created by the user to request the MES system to split the merged Lot.

[0178] In an optional implementation, the MES system may also automatically generate a lot split request to proactively split the merged lot, such as proactively splitting some or all of the lots in the merged lot. For example, the MES system may automatically split the merged lot based on different requirements such as quality control requirements, production scheduling changes, and inventory management optimization. For example, if the MES system monitors wafers with quality problems in the merged lot, the lot where the wafers with quality problems are located may be split out of the merged lot to prevent the wafer quality problem from spreading to the entire merged lot. For example, the MES system may automatically split some or all of the lots in the merged lot based on the current production line status and the available resources of the production line. For example, in the case of inventory level adjustments or excess inventory, the MES system may also automatically split some or all of the lots in the merged lot to accurately manage inventory levels.

[0179] In step S811, the state information of the merged lot is obtained based on the virtual lot identifier.

[0180] In step S812, it is determined based on the status information whether the merged Lot is in a predetermined indivisible state. If so, step S813 is executed; if not, step S814 is executed.

[0181] As an optional implementation, the embodiment of the present application can predefine the indivisible state of the merged lot, so that if the merged lot is not in the predetermined indivisible state, the merged lot is deemed to be divisible, and the subsequent process can be continued to split the merged lot; if the merged lot is in the predetermined indivisible state, the process needs to be terminated. Therefore, after obtaining the lot splitting request, the MES system can obtain the state information of the merged lot from the database based on the virtual lot identifier of the merged lot, and determine whether the merged lot is in the predetermined indivisible state based on the state information.

[0182] As an optional implementation, the embodiment of the present application can define the state where the merged lot is participating in or waiting to participate in process processing and is not suitable for splitting as an unsplittable state. As an example, the unsplittable state may include but is not limited to at least one of the following:

[0183] Processing state: When the merged lot is in the processing state, the wafers in the merged lot are undergoing process processing. If the merged lot is split at this time, the production process of the wafers will be interrupted, affecting the quality of the wafers and even causing confusion in the scheduling of production equipment. Therefore, the processing state can be regarded as an inseparable state.

[0184] Suspended state, for example, when the merged Lot is in the bank state, the merged Lot is temporarily stored or placed in the waiting area to wait for the next process processing or inspection, that is, the merged Lot is in the suspended state at this time; when the merged Lot is in the suspended state, the merged Lot may have been arranged for subsequent process processing or has been included in the production plan. At this time, if the merged Lot is split, it will affect the continuity of the production plan and the overall production scheduling, resulting in confusion in the resource allocation and time arrangement of the production line. Therefore, the suspended state can be regarded as an inseparable state.

[0185] In step S813, the process is terminated.

[0186] When the merged lot is in an indivisible state, the implementation of the present application can terminate the process. Further, the embodiment of the present application can also send a reminder message, such as sending a reminder message to the user who submitted the lot splitting request, to remind the user that the merged lot is currently indivisible and the reason for the indivisibility.

[0187] In step S814, the merged lot is split based on the grouping information to obtain multiple split lots, including: generating split lot identifiers of the split lots, and creating a third mapping relationship between the split lot identifiers and wafer identifiers based on the updated account information and grouping information.

[0188] When the merged Lot is not in an indivisible state, the embodiment of the present application can split the merged Lot based on the updated account information and grouping information to obtain multiple split Lots, wherein one split Lot corresponds to a group after the split, including at least one Lot; for example, a group in the grouping information may be a single Lot, or it may be a combined Lot of at least two single Lots, so that one split Lot corresponds to a group after the split, then one of the multiple split Lots may be a single Lot (i.e., an independent wafer batch), or it may be a combined Lot containing at least two single Lots, and the combined Lot corresponds to the merged Lot that has been merged at least once.

[0189] As an optional implementation, splitting the merged lot may involve updating the account information to ensure that the information of the split lot can be correctly recorded in the account information. Specifically, when the merged lot is split based on the grouping information to obtain multiple split lots, the embodiment of the present application may generate a split lot identifier of the split lot, create a third mapping relationship between the split lot identifier and the wafer identifier based on the updated account information and the grouping information, and record it in the updated account information.

[0190] In an optional implementation, the split lot identifier of the split lot can be a lot identifier generated at the execution lot identifier level. If the split lot is a single lot, the split lot identifier can be a lot identifier corresponding to the physical actual batch. If the split lot is a combined lot, the split lot identifier can be a logical virtual lot identifier. Thus, at the execution lot identifier level, a split lot identifier is generated for the split lot, and a third mapping relationship is established with the wafer identifier of the wafer in the split lot. The execution lot identifier of the split lot can be remapped with the wafer identifier to ensure that the MES system can track and manage the specific wafers in each split lot through updated account information.

[0191] As an optional implementation, for establishing the third mapping relationship between the split lot identifier and the wafer identifier, the embodiment of the present application may have any of the following processing methods:

[0192] A new split lot identifier is created for the split lot. For example, if the split lot is a single lot, a new lot identifier (such as a new execution lot identifier) ​​is recreated for the split lot. If the split lot is a combined lot, a new virtual lot identifier is recreated for the split lot. Thus, a third mapping relationship is established between the new split lot identifier created for the split lot and the wafer identifiers of the wafers in the split lot.

[0193] The original Lot ID is used for splitting the Lot. For example, if the split Lot is a single Lot, the original Lot ID is restored for the split Lot (such as restoring the original execution Lot ID). If the split Lot is a combined Lot, and the grouping information indicates that the merged Lot has only one combined Lot after the split, the split Lot where the combined Lot is located can reuse the virtual Lot ID of the merged Lot.

[0194] For example, taking the creation of a new split lot identifier for a split lot as an example, assuming that the merged lot requested to be split is LotA, its virtual lot identifier is A, and the merged lot merges three single lots, namely Lot1, Lot2 and Lot3, wherein the lot identifier of Lot1 is 1, the lot identifier of Lot2 is 2, and the lot identifier of Lot3 is 3, that is, Lot1, Lot2 and Lot3 are merged to obtain LotA; when splitting LotA, it is assumed that there are two groups, one of which is Lot1, and the other is Lot2 and Lot3;

[0195] For the group where Lot1 is located, the group is a split lot, and the split lot is a single lot, so when generating a split lot identifier for the split lot, a new lot identifier can be created (such as creating a new execution lot identifier), or the original lot identifier can be restored (such as restoring the original execution lot identifier), for example, the split lot identifier of the split lot can be newly created as 1.1, or restored to 1; and then in the account information of the split lot, the split lot identifier is recorded and mapped with the wafer identifier, so that a third mapping relationship between the split lot identifier of the split lot and the wafer identifier can be created;

[0196] For the group where Lot2 and Lot3 are located, the group is a split Lot, and the split Lot is a combined Lot. Therefore, when a split Lot identifier is generated for the split Lot, a new virtual Lot identifier can be created. For example, the split Lot identifier of the split Lot can be newly created as B, and LotB contains Lot2 and Lot3; in other alternative implementations, since the grouping information indicates that there is only one combined Lot after LotA is split, that is, the group where Lot2 and Lot3 are located, the split Lot of the group where Lot2 and Lot3 are located can also reuse the virtual Lot identifier of LotA.

[0197] In other possible implementations, if the grouping information indicates that there are multiple combined Lots after the merged Lot is split, the embodiment of the present application may support the creation of a new virtual Lot identifier for the group where each combined Lot is located (that is, the split Lot corresponding to each combined Lot); or, the group where a combined Lot among multiple combined Lots is located can reuse the virtual Lot identifier of the merged Lot, and the groups where other combined Lots are located can create new virtual Lot identifiers.

[0198] For further understanding, take splitting a lot and creating a new split lot identifier as an example. Figure 8B The example diagram of splitting and merging Lot is shown in the example. Figure 8BAs shown, the three Lots of Lot ID1, Lot ID2 and Lot ID3 are merged to obtain a merged Lot of virtual Lot IDA. When the merged Lot is split, the merged Lot can be split into a group whose execution Lot ID is Lot ID1.1 (the offline Lot ID in the group remains Lot ID1) and a group whose execution Lot ID is virtual Lot IDDB (the group is composed of two Lots whose offline Lot IDs are Lot ID2 and Lot ID3). In other possible examples, the embodiment of the present application can also support the group whose offline Lot ID is Lot ID1 to restore the execution Lot ID to Lot ID1, so as to keep the same as the offline Lot ID. In other possible examples, the embodiment of the present application can also support the group whose offline Lot IDs are Lot ID2 and Lot ID3, and reuse the virtual Lot IDDA as the execution Lot ID.

[0199] For further understanding, let's take the example of splitting a lot and using the original lot logo. Figure 8C Another example diagram of splitting and merging Lot is shown as an example. Figure 8C As shown, assuming that all the single lots in the merged lot are split out, the execution Lot IDs of the three lots in the merged lot can be restored from the virtual Lot ID A to the offline Lot IDs of each lot. In other possible examples, the embodiment of the present application can also regenerate a new execution Lot ID for each single lot based on the offline Lot ID of each single lot, and the new execution Lot ID of each single lot is different from the offline Lot ID.

[0200] It can be seen that in an optional implementation, with respect to multiple Lots that are merged to obtain a merged Lot (the multiple Lots may include a single Lot and / or a combined Lot), in an embodiment of the present application, when the merged Lot is split to obtain multiple split Lots, at least one of the multiple split Lots may include a Lot (which may be a single Lot or a combined Lot) used to obtain the merged Lot, and the split Lot identifier of the at least one split Lot is associated with the Lot identifier of the one Lot.

[0201] In a further optional implementation, when creating a new split lot identifier for a split lot, the embodiment of the present application can use a serial code to create a new split lot identifier to avoid duplicate identifiers. Figure 8BIn the example, the offline Lot ID of the Lot is Lot ID1. A new Lot ID1.1 can be formed at the execution Lot ID level as a new split Lot ID, so as to create a new split Lot ID for the split Lot. The new execution Lot ID can be generated by adding a specific suffix to the parent Lot ID of the Lot (such as the offline Lot ID), such as Figure 8B The example is to add a suffix of 1 to the offline Lot ID of Lot ID1 to form a new execution Lot ID (ie, Lot ID1.1) as a new split Lot ID.

[0202] In an optional implementation, the value of the above-mentioned specific suffix can be determined according to the serial code of the split lot, and the serial code corresponds to the number of times the split lot identifier of the split lot is created. For example, every time the number of times the split lot identifier of the split lot is created increases, the suffix increases by 1. For example, if the number of times the split lot identifier of the split lot is created is 1, a suffix of 1 can be added to the offline lot identifier of the split lot as a newly created split lot identifier; if the number of times the split lot identifier of the split lot is created is 2, a suffix of 2 can be added to the offline lot identifier of the split lot as a newly created split lot identifier, and so on. Figure 8B In the example, the offline Lot ID of Lot ID1 is taken as an example. If the number of times the split Lot identifier is created when the Lot is used as a split Lot is 1, the newly created split Lot identifier may be Lot ID1.1. If the number of times the split Lot identifier is created when the Lot is used as a split Lot is 2, the newly created split Lot identifier may be Lot ID1.2. And so on. According to the number of times the split Lot identifier is created when the Lot is used as a split Lot, the suffix of the offline Lot ID is incremented to form a new split Lot identifier.

[0203] In a further optional implementation, splitting the merged Lot may also involve material splitting, for example, separating the split Lot from the merged Lot at the wafer container level. As an optional implementation, for at least one split Lot obtained by splitting, the embodiment of the present application may also generate a sorting operation instruction for the split Lot, which is used to place the wafers of the split Lot in a wafer container different from the merged Lot, which may be a new wafer container, or a wafer container originally used by the split Lot. For example, the MES system may create a mapping relationship (referred to as the fourth mapping relationship) between the wafer identification of the wafers in the split Lot and the split container identification, so that the embodiment of the present application may create a sorting operation instruction based on the fourth mapping relationship and the account information of the split Lot, and the sorting operation instruction is used to place the wafers of the split Lot in a wafer container different from the merged Lot, wherein the split container identification corresponds to the wafer container in which the wafers of the split Lot are placed, which may be a new wafer container, or a wafer container originally used by the split Lot. The fourth mapping relationship may be updated and recorded in the account information of the split lot so as to track the wafer container where the split lot is located.

[0204] In a further optional implementation, the fourth mapping relationship or the updated account information of the split lot may also include: the correspondence between the wafer identification of the split lot and the split slot identification; the split slot identification corresponds to the slot information of the wafer of the split lot in the wafer container. The embodiment of the present application supports pre-determining the slot of the wafer of the split lot before the sorting operation begins, or, during the sorting operation, determining the new slot of the wafer allocated on the machine site and recording it by the MES system.

[0205] In a further optional implementation, the lot splitting request may further include a splitting site identifier to indicate the site where the merged lot is split. Therefore, after determining that the merged lot is not in a predetermined unsplit state, before splitting the merged lot to obtain multiple split lots, the embodiment of the present application may further generate pause information, and the pause information is used to make the merged lot stop at the site corresponding to the splitting site identifier to split the merged lot.

[0206] In a further optional implementation, the embodiment of the present application may also support the splitting of the merged Lot at the current site; thus, after determining that the merged Lot is not in a predetermined indivisible state, the embodiment of the present application may further generate pause information before splitting the merged Lot to obtain multiple split Lots, and the pause information is used to make the merged Lot stop at the current site to split the merged Lot. In the case of splitting the merged Lot at the current site, the split site identifier may not be carried in the lot splitting request, that is, the embodiment of the present application may not specify the split site in advance, but control the merged Lot to stop at the current site for splitting at the current site where the merged Lot is currently located.

[0207] Furthermore, after the merged lot is split, the MES system can remove the pause information so that the split lot can continue the subsequent production process. In an optional implementation, the pause information can be a system hold information.

[0208] In step S815, a process is assigned to any of the multiple split lots based on the split lot identifier.

[0209] The MES system can use the split lot identification of the split lot to assign processes to the split lot, so that the machine can perform process processing on the wafers in the split lot.

[0210] The solution provided by the embodiment of the present application supports merging multiple Lots into a merged Lot, and supports merging between multiple single Lots, merging between at least one single Lot and at least one combined Lot, and merging between multiple combined Lots. Furthermore, the solution provided by the embodiment of the present application also supports splitting the merged Lot, and supports splitting of some or all Lots in the merged Lot. Therefore, the embodiment of the present application can adapt to changes in wafer production requirements through flexible batch management strategies. In other words, the Lot merging and splitting strategies provided by the embodiment of the present application can make the wafer production process highly adaptable and efficient, allowing users to flexibly respond to changes in wafer production requirements while ensuring wafer production quality, thereby finely managing inventory and optimizing the use of production line resources.

[0211] In a further optional implementation, for wafers in a merged lot and / or split lot, the embodiment of the present application can also obtain a pre-measurement value corresponding to a wafer identification, and the pre-measurement value is applied to the process processing performed by the process dispatch. For example, when the MES system performs process dispatch for the merged lot based on the virtual lot identification, the pre-measurement value corresponding to the wafer identification of the wafer in the merged lot can be used for the process processing performed by the process dispatch; for example, when the MES system performs process dispatch for any split lot in multiple split lots based on the split lot identification, the pre-measurement value corresponding to the wafer identification of the wafer in the split lot can be used for the process processing performed by the process dispatch. In an optional implementation, the MES system can obtain the pre-measurement value corresponding to the wafer identification for the wafers in the merged lot and / or split lot during the APC (Advanced / Automated Process Control) process, so as to perform the process processing corresponding to the process dispatch for the wafers in the merged lot and / or split lot. Among them, APC is a specific execution method for controlling wafers during the semiconductor manufacturing process, involving wafer processing decisions, etc.

[0212] As an optional implementation, Fig. 9 An optional flow chart for obtaining a pre-measurement value provided in an embodiment of the present application is shown as an example. Fig. 9 , the process may include the following steps.

[0213] In step S910, for any wafer identification, it is determined whether measurement data of the wafer corresponding to the wafer identification when it passed through the previous station is found. If so, step S911 is executed, and if not, step S912 is executed.

[0214] As an optional implementation, for any wafer in the merged lot and / or split lot, the embodiment of the present application can search the database for the measurement data of the wafer when it passes through the previous station based on the wafer identification, such as the measurement data of the wafer when it completes the process processing of the previous station. It should be noted that passing through the station means that the wafer has completed the process processing of the station, that is, the wafer has undergone the process processing of the station; the measurement data when passing through the station refers to the physical and chemical property measurement results of the wafer after completing the process processing of the station, such as thickness, flatness, etc.

[0215] In step S911, a pre-measurement value corresponding to the wafer identification is determined based on the measurement data of the wafer when it passes through the previous station.

[0216] If the measurement data of the wafer when it passes through the previous station is found in the database based on the wafer identification of the wafer, then the embodiment of the present application can use the measurement data of the wafer when it passes through the previous station to determine the pre-measurement value corresponding to the wafer identification of the wafer. In an optional implementation, the pre-measurement value can be the process parameter of the wafer when it leaves the next station. Leaving the station means that the wafer enters the station and will undergo process processing at the station; for example, the wafer may go through multiple stations. If the wafer is transferred from the lithography station to the etching station, it can be regarded as the wafer passing through the lithography station and leaving the etching station. When the wafer leaves the next station, the pre-measurement value corresponding to the wafer identification of the wafer can be regarded as the specific process parameters required for the wafer to enter the next station, such as the temperature, pressure, chemical dosage, process time, etc. required for the production machine at the next station. These process parameters when leaving the station are called pre-measurement values.

[0217] In step S912, the lot where the wafer was located when it passed through the previous station is determined according to the inventory information.

[0218] In step S913, it is determined whether the measurement data of other wafers in the lot when passing through the previous station are found. If so, step S914 is executed, and if not, step S915 is executed.

[0219] If the measurement data of the wafer when it passed through the previous station is not found in the database based on the wafer identification of the wafer, the embodiment of the present application can use similar measurement data of other wafers in the Lot where the wafer was located when it passed through the previous station to estimate the pre-measurement value corresponding to the wafer identification of the wafer; thus, the embodiment of the present application can determine the Lot where the wafer was located when it passed through the previous station according to the account information of the Lot where the wafer is located, and search for measurement data of other wafers in the Lot when they passed through the previous station in the database, for example, based on the wafer identifications of other wafers in the Lot where the wafer is located, search for measurement data of other wafers when they passed through the previous station in the database.

[0220] In step S914, the pre-measurement value corresponding to the wafer identification is determined based on the measurement data of other wafers when passing through the previous station.

[0221] If measurement data of other wafers are found in the database, the embodiment of the present application can use the measurement data of the other wafers found to determine the pre-measurement value corresponding to the wafer identification of the wafer.

[0222] In step S915 , a pre-measurement value corresponding to the wafer identification is determined based on the preset process parameters.

[0223] If the measurement data of the wafer when it passed through the previous station is not found, nor is the measurement data of other wafers in the lot where the wafer was located when it passed through the previous station, or the measurement data found is unavailable, the embodiment of the present application can determine the pre-measurement value corresponding to the wafer identification based on the preset process parameters, so as to perform the process treatment of the wafer in the process dispatch. The preset process parameters can be the default process parameters of the station, for example, the preset process parameters can be set based on statistical data and experience.

[0224] The wafer batch management device provided in the embodiment of the present application is introduced below. The wafer batch management device described below can be regarded as a functional module required to be set by the MES system to implement the wafer batch management method provided in the embodiment of the present application. The content described below can be referenced to the content described above.

[0225] As an optional implementation, Fig.10 An optional block diagram of a wafer batch management device provided in an embodiment of the present application is shown as an example. The wafer batch management device can be applied to an MES system. Fig.10 , the wafer batch management device may include:

[0226] A request transmission module 011 is used to obtain a lot merging request, where the lot merging request is used to request merging of multiple lots, and the lot merging request includes lot identifiers of the multiple lots;

[0227] The data processing module 012 is used to obtain the account material information of the plurality of lots based on the lot identification, and determine whether the plurality of lots meet the merging condition based on the account material information, wherein the merging condition includes that the contamination identification in the account material information is consistent and the identification of the next process step is consistent; if the plurality of lots meet the merging condition, the plurality of lots are merged to obtain a merged lot, including: obtaining the wafer identification of the plurality of lots based on the account material information, generating a virtual lot identification, and creating a first mapping relationship between the wafer identification and the virtual lot identification;

[0228] The data execution module 013 is used to save the updated account material information, wherein the updated account material information includes the first mapping relationship and the account material information; and to perform process dispatching for the merged lot based on the virtual lot identifier.

[0229] In an optional implementation, the contamination identification includes: a final process step identification, and / or a photoresist label and a final contamination level.

[0230] In an optional implementation, the inventory information further includes a container identifier and a slot identifier corresponding to the wafer identifier; the data processing module 012, which is used to merge the multiple lots to obtain a merged lot, may also include:

[0231] Confirming whether the container identification in the account information is consistent;

[0232] If the container identifiers are inconsistent, a second mapping relationship between the merged container identifier and the wafer identifier is created so that the data execution module 013 creates a sorting operation instruction based on the second mapping relationship and the account information, and the sorting operation instruction is used to place the wafers of the multiple lots in the same wafer container, and the same wafer container corresponds to the merged container identifier, and the updated account information also includes the second mapping relationship.

[0233] For example, when the container identification is inconsistent, the data processing module 012 can create a second mapping relationship between the merged container identification and the wafer identification, and provide the second mapping relationship and the account information to the data execution module 013, so that the data execution module 013 can create a sorting operation instruction based on the second mapping relationship and the account information; then the data execution module 013 can transmit the sorting operation instruction to the machine to assign the sorting operation to the machine, so that the machine executes the sorting operation process.

[0234] In an optional implementation, the second mapping relationship or the updated inventory information further includes: a correspondence between the wafer identification and the combined slot identification; the combined slot identification corresponds to the slot information of the wafer in the same wafer container.

[0235] In an optional implementation, the merging condition also includes: the total number of wafers in the multiple Lots is not greater than the wafer number limit of the wafer container; and / or there is no unexecutable future operation in any of the multiple Lots.

[0236] In an optional implementation, the Lot merge request also includes a merge site identifier corresponding to the Lot identifier; after the data processing module 012 determines that the multiple Lots meet the merge conditions, before merging the multiple Lots to obtain a merged Lot, the data execution module 013 can also be used to: generate pause information, and the pause information is used to make the multiple Lots stop at the site corresponding to the merge site identifier to perform the merge.

[0237] For example, after the data processing module 012 determines that the multiple lots meet the merging condition, the data execution module 013 can generate pause information and transmit it to the site corresponding to the merging site identifier, so that the site stays at the multiple lots to merge the multiple lots.

[0238] In an optional implementation, the merging condition also includes: the current sites of the multiple Lots are the same; after the data processing module 012 determines that the multiple Lots meet the merging condition, before merging the multiple Lots to obtain a merged Lot, the data execution module 013 can also be used to: generate pause information, and the pause information is used to make the multiple Lots stay at the current site to perform the merging.

[0239] In an optional implementation, the virtual Lot identifier is different from the Lot identifiers of the multiple Lots.

[0240] In an optional implementation, after the data execution module 013 performs process dispatching on the merged lot based on the virtual lot identifier, the request transmission module 011 is further used to: obtain a lot splitting request, the lot splitting request is used to request splitting of the merged lot, the lot splitting request includes the virtual lot identifier and grouping information, and the grouping information includes grouping conditions of the multiple lots;

[0241] The data processing module 012 is further used to: obtain the state information of the merged lot based on the virtual lot identifier, and determine whether the merged lot is in a predetermined indivisible state based on the state information; if the merged lot is not in the predetermined indivisible state, split the merged lot based on the grouping information to obtain a plurality of split lots, including: generating a split lot identifier of the split lot, and creating a third mapping relationship between the split lot identifier and the wafer identifier based on the updated account information and the grouping information;

[0242] The data execution module 013 is further used to: perform process dispatching for any split lot among the multiple split lots based on the split lot identifier.

[0243] In an optional implementation, at least one split lot among the multiple split lots includes one of the Lots, and the split lot identifier of the at least one split lot is associated with the lot identifier of one of the Lots.

[0244] In an optional implementation, the predetermined inseparable state includes a processing state or a suspension state.

[0245] In an optional implementation, the Lot splitting request also includes a splitting site identifier corresponding to the virtual Lot identifier; after the data processing module 012 determines that the merged Lot is not in a predetermined indivisible state, before splitting the merged Lot to obtain multiple split Lots, the data execution module 013 is also used to: generate pause information, and the pause information is used to make the merged Lot stop at the site corresponding to the splitting site identifier to perform the splitting.

[0246] For example, after the data processing module 012 determines that the merged Lot is not in a predetermined indivisible state, the data execution module 013 may generate pause information and transmit it to the site corresponding to the split site identifier, so that the site stays at the merged Lot to split the merged Lot.

[0247] In an optional implementation, after the data processing module 012 determines that the merged Lot is not in a predetermined indivisible state, and before splitting the merged Lot into multiple split Lots, the data execution module 013 is further used to: generate pause information, wherein the pause information is used to make the merged Lot stay at the current site for the splitting.

[0248] For example, after the data processing module 012 determines that the merged Lot is not in a predetermined indivisible state, the data execution module 013 may generate pause information and transmit it to the current site, so that the current site stays at the merged Lot to split the merged Lot.

[0249] In a further optional implementation, the wafer batch management device provided in the embodiment of the present application may also include:

[0250] The APC module (not shown) is used to obtain a pre-measurement value corresponding to the wafer identification, and the pre-measurement value is applied to the process processing performed by the process dispatch.

[0251] In an optional implementation, the APC module is used to obtain a pre-measurement value corresponding to the wafer identification, and the pre-measurement value is applied to the process processing performed by the process dispatching, including:

[0252] For any of the wafer identifications, determining whether measurement data of the wafer corresponding to the wafer identification when it passed through a previous station is found;

[0253] If the measurement data of the wafer when it passes through the previous station is found, then the pre-measurement value corresponding to the wafer identification is determined according to the measurement data of the wafer when it passes through the previous station;

[0254] If the measurement data of the wafer when it passed through the previous station is not found, the lot where the wafer was located when it passed through the previous station is determined according to the account information, and whether the measurement data of other wafers in the lot where the wafer was located when it passed through the previous station is found;

[0255] If the measurement data of the other wafers when passing through the previous station is found, determine the pre-measurement value corresponding to the wafer identification according to the measurement data of the other wafers when passing through the previous station;

[0256] If the measurement data of the other wafers when passing through the previous station is not found, the pre-measurement value corresponding to the wafer identification is determined based on the preset process parameters.

[0257] As an optional implementation example, the MES system using the wafer batch management device provided in the embodiment of the present application can interact with the OA system, database, and production line to implement the wafer batch management solution of the embodiment of the present application. Fig.11 Another example of the architecture of the wafer production system is shown, combined with Figure 1A and Fig.11 As shown, the wafer production system may include:

[0258] MES system 110, MES system 110 can be set up, for example Fig.10 The wafer lot management device shown;

[0259] Database 120;

[0260] The production line 130 may be provided with a plurality of stations, each station being provided with a machine, such as a production machine; further, the production line 130 may also be provided with a conveyor for transferring wafers between stations, for example, by transferring wafer containers between stations to transfer wafers between stations;

[0261] OA system 140.

[0262] based on Fig.11 In the wafer production system shown, a user can create a work order through the OA system 140, so that the OA system 140 can transmit a request to the MES system 110 based on the work order created by the user, such as a Lot merge request, and further, can also transmit a Lot split request to the MES system 110; thereby, the MES system can utilize the set wafer batch management device to execute the wafer batch management method provided in the embodiment of the present application, and interact with the database and the production line to realize the Lot merging process, and further, can also realize the Lot splitting process, etc.

[0263] As an example, take the implementation of the Lot merging process as an example. Fig.12 The following diagram illustrates the process example of wafer batch management. Fig.12 As shown, the process example may include the following steps:

[0264] ① The user uses the OA system to create a work order that merges multiple lots;

[0265] ② The OA system sends a lot merge request to the MES system, and the lot merge request includes the execution lot IDs of multiple lots;

[0266] ③After the request transmission module of the MES system obtains the lot merging request, it verifies that the user is a legitimate user, and then transmits the execution lot IDs of multiple lots in the lot merging request to the data processing module of the MES system;

[0267] ④ The data processing module obtains the account information of the multiple lots from the database based on the execution lot IDs of the multiple lots, so as to determine whether the multiple lots meet the merging conditions;

[0268] ⑤ If the data processing module determines that the merging conditions are not met, the process is terminated and a reminder message is transmitted to the user through the request transmission module to remind the user of the reason why the merging conditions are not met;

[0269] ⑥ If the data processing module determines that the merging conditions are met, the multiple lots are merged to obtain a merged lot, and updated account information is obtained in the process of merging the lots; the relevant content can refer to the description of the corresponding part of the previous text;

[0270] ⑦The data processing module transmits updated account information to the data execution module of the MES system;

[0271] ⑧The data execution module saves the updated account information to the database;

[0272] In a further optional example, the data execution module may also be responsible for creating, modifying, and freezing the account information of the lot in the database, including creating, modifying, and freezing the account information of merging lots and splitting lots in the database, for example, based on the production progress and feedback of the machine, modifying the value of each lot data in the account information of the lot;

[0273] ⑨ The data execution module transmits a process dispatch instruction to the production machine based on the virtual lot ID of the merged lot in the updated account information, so that the production machine performs consistent process processing on the merged lot with the virtual lot ID.

[0274] In a further optional implementation, the MES system may include a computer device running the MES software. For example, the wafer batch management device provided in the embodiment of the present application may be installed on the computer device running the MES software by means of a software device. In an optional implementation, the computer device may include at least one memory and at least one processor, the memory stores computer-executable instructions, and the processor calls the computer-executable instructions stored in the memory to execute the wafer batch management method provided in the embodiment of the present application.

[0275] In a further optional implementation, the embodiment of the present application also provides a storage medium, which can store computer execution instructions. When the computer execution instructions are executed (for example, when the computer execution instructions are executed by a processor), the wafer batch management method provided in the embodiment of the present application is implemented.

[0276] In a further optional implementation, the embodiments of the present application also provide a computer program product, such as MES software, which may include computer execution instructions. When the computer execution instructions are executed (for example, when the computer execution instructions are executed by a processor), a wafer batch management method as provided in the embodiments of the present application is implemented.

[0277] The above describes multiple implementation schemes provided by the embodiments of the present application. The various optional methods introduced in each implementation scheme can be combined and cross-referenced with each other without conflict, thereby extending a variety of possible implementation schemes, which can all be considered as implementation schemes disclosed and open in the embodiments of the present application.

[0278] Although the embodiments of the present application are disclosed above, the present application is not limited thereto. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be subject to the scope defined by the claims.

Claims

1. A wafer batch management method, characterized in that: The steps include: Obtaining a batch lot merging request, the lot merging request is used to request merging multiple lots, and the lot merging request includes lot identifiers of the multiple lots; Based on the lot identifier, obtaining account information of the plurality of lots; Determining whether the plurality of lots meet a merging condition based on the account material information, the merging condition comprising: the contamination identifiers in the account material information are consistent, and the identifiers of the next process steps are consistent; If the multiple lots meet the merging condition, merging the multiple lots to obtain a merged lot, including: acquiring wafer identifiers of the multiple lots based on the account information, generating a virtual lot identifier, and creating a first mapping relationship between the wafer identifier and the virtual lot identifier; saving updated account information, wherein the updated account information includes the first mapping relationship and the account information; The merged lot is assigned a process based on the virtual lot identifier.

2. The method according to claim 1, characterized in that The contamination identification includes: a final process step identification, and / or a photoresist label and a final contamination level.

3. The method according to claim 1, characterized in that The inventory information also includes a container identifier and a slot identifier corresponding to the wafer identifier, and the merging of the multiple lots to obtain a merged lot also includes the steps of: Confirming whether the container identification in the account information is consistent; If the container identifiers are inconsistent, a second mapping relationship between the merged container identifier and the wafer identifier is created, and a sorting operation instruction is created based on the second mapping relationship and the account information. The sorting operation instruction is used to place the wafers of the multiple lots in the same wafer container, and the same wafer container corresponds to the merged container identifier. The updated account information also includes the second mapping relationship.

4. The method according to claim 3, characterized in that The second mapping relationship or the updated account information further includes: a correspondence between the wafer identifier and the merged slot identifier; The combined slot identifier corresponds to the slot information of the wafer in the same wafer container.

5. The method according to claim 1, characterized in that The merger conditions also include: The total number of wafers in the plurality of lots is not greater than the wafer quantity limit of the wafer container; And / or, there is no unexecutable future operation for any of the plurality of Lots.

6. The method according to claim 1, characterized in that The Lot merge request also includes a merge site identifier corresponding to the Lot identifier; After determining that the multiple lots meet the merging condition, and before merging the multiple lots to obtain a merged lot, the method further includes: Pause information is generated, where the pause information is used to make the multiple Lots stay at the site corresponding to the merge site identifier to perform the merge.

7. The method according to claim 1, characterized in that The merging condition also includes: the current sites of the multiple Lots are the same; After determining that the multiple lots meet the merging condition, and before merging the multiple lots to obtain a merged lot, the method further includes: Pause information is generated, where the pause information is used to make the multiple Lots stay at the current site to perform the merging.

8. The method according to claim 1, characterized in that The virtual lot identifier is different from the lot identifiers of the plurality of lots.

9. The method according to claim 1, characterized in that: After the process of assigning the merged lot based on the virtual lot identifier is performed, the method further includes: Obtaining a Lot splitting request, the Lot splitting request is used to request splitting of the merged Lot, the Lot splitting request includes the virtual Lot identifier and grouping information, and the grouping information includes grouping conditions of the multiple Lots; Acquiring status information of the merged lot based on the virtual lot identifier, and determining whether the merged lot is in a predetermined indivisible state based on the status information; If the merged lot is not in a predetermined indivisible state, splitting the merged lot based on the grouping information to obtain a plurality of split lots, including: generating split lot identifiers of the split lots, and creating a third mapping relationship between the split lot identifiers and the wafer identifiers based on the updated account information and the grouping information; Perform process assignment for any of the multiple split lots based on the split lot identifier.

10. The method according to claim 9, characterized in that At least one of the multiple split Lots includes one of the Lots, and the split Lot identifier of the at least one split Lot is associated with the Lot identifier of one of the Lots.

11. The method according to claim 9, characterized in that The predetermined inseparable state includes a processing state or a suspension state.

12. The method according to claim 9, characterized in that The Lot splitting request also includes a splitting site identifier corresponding to the virtual Lot identifier; After determining that the merged lot is not in a predetermined indivisible state, and before splitting the merged lot to obtain a plurality of split lots, the method further includes: Generate pause information, where the pause information is used to make the merged Lot stay at the site corresponding to the split site identifier to perform the splitting.

13. The method according to claim 9, characterized in that After determining that the merged lot is not in a predetermined indivisible state, and before splitting the merged lot to obtain a plurality of split lots, the method further includes: Generate pause information, where the pause information is used to make the merged Lot stay at the current site to perform the splitting.

14. The method according to claim 1 or 9, characterized in that: The method further includes: acquiring a pre-measurement value corresponding to the wafer identification, wherein the pre-measurement value is applied to the process processing performed by the process dispatching.

15. The method according to claim 14, characterized in that The obtaining of the pre-measurement value corresponding to the wafer identification comprises: For any of the wafer identifications, determining whether measurement data of the wafer corresponding to the wafer identification when it passed through a previous station is found; If the measurement data of the wafer when it passes through the previous station is found, then the pre-measurement value corresponding to the wafer identification is determined according to the measurement data of the wafer when it passes through the previous station; If the measurement data of the wafer when it passed through the previous station is not found, the lot where the wafer was located when it passed through the previous station is determined according to the account information, and whether the measurement data of other wafers in the lot where the wafer was located when it passed through the previous station is found; If the measurement data of the other wafers when passing through the previous station is found, determine the pre-measurement value corresponding to the wafer identification according to the measurement data of the other wafers when passing through the previous station; If the measurement data of the other wafers when passing through the previous station is not found, the pre-measurement value corresponding to the wafer identification is determined based on the preset process parameters.

16. A wafer batch management device, characterized in that: include: A request transmission module, used for obtaining a batch lot merging request, wherein the lot merging request is used for requesting to merge multiple lots, and the lot merging request includes lot identifiers of the multiple lots; A data processing module, configured to obtain the account material information of the plurality of lots based on the lot identifier, and determine whether the plurality of lots meet a merging condition based on the account material information, wherein the merging condition includes that the pollution identifiers in the account material information are consistent and the identifiers of the next process step are consistent; If the multiple lots meet the merging condition, merging the multiple lots to obtain a merged lot, including: acquiring wafer identifiers of the multiple lots based on the account information, generating a virtual lot identifier, and creating a first mapping relationship between the wafer identifier and the virtual lot identifier; The data execution module is used to save updated account material information, wherein the updated account material information includes the first mapping relationship and the account material information; and to perform process dispatching for the merged lot based on the virtual lot identifier.

17. The wafer batch management device according to claim 16, characterized in that: It also includes an APC module, which is used to obtain a pre-measurement value corresponding to the wafer identification, and the pre-measurement value is applied to the process processing performed by the process dispatch.

18. A MES system, characterized in that: A computer device comprising a computer running MES software, wherein the computer device comprises a memory and a processor; the memory stores computer execution instructions, and the processor calls the computer execution instructions stored in the memory to execute the wafer batch management method as described in any one of claims 1 to 15.

19. A storage medium, characterized in that: The storage medium stores computer-executable instructions, and when the computer-executable instructions are executed, the wafer batch management method according to any one of claims 1 to 15 is implemented.

20. A computer program product, characterized in that It comprises computer-executable instructions, which, when executed, implement the wafer batch management method as described in any one of claims 1 to 15.

Images