Driving substrate circuit detection device and method

Abstract

The invention relates to a driving substrate circuit detection device and method, the device comprises a hollow plate body, the hollow plate body comprises a first side and a second side which are opposite to each other, the first side and the second side define a hollow area, and the first side is provided with a conductive layer; the display detection layer is located in the hollow area, and the display detection layer comprises suspension liquid and charged particles which are doped in the suspension liquid and have the same electrical property; when approaching the first side, the charged particles appear on the surface of the suspension liquid from the first side; when approaching the second side, the charged particles do not appear on the bottom surface, opposite to the surface, of the suspension and from the first side. The detection is simple and rapid, the efficiency is high, the detection accuracy is also high, the resource waste is also reduced, the detection device can be repeatedly used, and the detection cost is saved.

Description

Technical Field

[0001] The present application relates to the field of LED display, and in particular to a driving substrate circuit detection device and method. Background Art

[0002] In the process of manufacturing the display panel, it is necessary to bond the LED chip on the driving substrate. The driving substrate is provided with a driving circuit for driving the LED chip to emit light. The driving circuit includes a plurality of electrodes bonded to the LED chip. At present, the circuit on the driving substrate is tested by driving the LED chip to emit light after the LED chip is bonded on the driving substrate. The circuit of the driving substrate is determined to be abnormal based on the light emission of the LED chip. The detection efficiency is low and the cost is high. Moreover, the detection is easily affected by the bonding process and the quality of the LED chip, and the accuracy of the detection result is low.

[0003] Therefore, how to improve the accuracy of driving substrate circuit detection is an issue that needs to be addressed urgently. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the related art, the purpose of the present application is to provide a driving substrate circuit detection device and method, aiming to solve the problem of low accuracy in driving substrate circuit detection.

[0005] A driving substrate circuit detection device, comprising:

[0006] A hollow plate body, the hollow plate body comprising a first side and a second side opposite to each other, the first side and the second side together enclose a hollow area, and a conductive layer is disposed on the first side;

[0007] A display detection layer, the display detection layer is located in the hollow area, and the display detection layer includes a suspension, and charged particles with the same electrical properties doped in the suspension;

[0008] When the charged particles are close to the first side, they appear on the surface of the suspension from the first side. When the charged particles are close to the second side, they appear on the bottom surface of the suspension opposite to the surface and not from the first side.

[0009] In the above-mentioned driving substrate circuit detection device, the charged particles in the display detection layer can move under the action of the electric field. During detection, the detection device is placed on the driving substrate, and the driving substrate is close to the first side of the hollow plate body. A first voltage is applied to the conductive layer, and a second voltage is applied to the electrode on the driving substrate. The second voltage is greater than the first voltage, and the electrical properties of the first voltage and the second voltage are the same, and an electric field can be generated between the first voltage and the second voltage. When the circuit is normal, that is, when all electrodes are normally energized, the charged particles in each electric field corresponding to the electrode will all appear on the surface of the suspension from the first side, or the charged particles in each electric field corresponding to the electrode will not appear on the bottom surface of the suspension from the first side. At this time, it can be observed from the first side that the pattern formed by the appeared charged particles is regularly arranged. When the circuit is abnormal and there is an electrode that is abnormally powered, the electric field between the electrode that is abnormally powered and the conductive layer will change, so that the charged particles between the electrode that is abnormally powered and the conductive layer move in the opposite direction compared to the charged particles in the electric field of other normal electrodes. The part that should be displayed does not have charged particles, or the part that should not be displayed has charged particles. At this time, it can be observed from the first side that the pattern formed by the displayed charged particles is irregularly arranged, and the circuit can be determined to be abnormal. The detection device is placed on the driving substrate, and then the voltage is applied to perform the detection. The detection is simple, fast and efficient. The driving substrate can be detected before bonding the LED chip. The detection result will not be affected by the bonding process and the quality of the LED chip. The detection accuracy is high, and the abnormal driving substrate can be effectively eliminated, avoiding the situation of bonding the LED chip on the abnormal driving substrate, and reducing resource waste. In addition, the detection device can be reused many times, saving the detection cost.

[0010] Based on the same inventive concept, the present application also provides a driving substrate circuit detection method, comprising:

[0011] Placing the driving substrate circuit detection device as described above on a driving substrate to be detected, wherein the driving substrate is close to the second side of the hollow plate body;

[0012] Applying a first voltage to the conductive layer and applying a second voltage to each electrode on the driving substrate, the charged particles move under the action of the electric field generated by the first voltage and the second voltage, the first voltage and the second voltage have the same electrical property, and the second voltage is greater than the first voltage;

[0013] A detection result is determined based on the display of charged particles moving to the surface of the suspension to emerge from the first side.

[0014] The above-mentioned driving substrate circuit detection method can determine the detection result according to the display result of the charged particles that move to the surface of the suspension and appear from the first side. When the circuit is abnormal and there is an electrode that is abnormally energized, the electric field between the electrode that is abnormally energized and the conductive layer will change, so that the charged particles between the electrode that is abnormally energized and the conductive layer move in the opposite direction compared to the charged particles in the electric field of other normal electrodes, and the part that should appear does not have charged particles appear, or the part that should not appear appears charged particles. At this time, it can be observed from the first side that the pattern formed by the charged particles that appear is irregularly arranged, and the circuit can be determined to be abnormal. The detection device is placed on the driving substrate, and then the voltage is applied to perform the detection. The detection is simple, fast and efficient. In addition, the driving substrate can be detected before bonding the LED chip. The detection result will not be affected by the bonding process and the quality of the LED chip. The detection accuracy is high, and the abnormal driving substrate can be effectively eliminated, avoiding the situation of bonding the LED chip on the abnormal driving substrate, and reducing resource waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the structure of a driving substrate circuit detection device provided in an embodiment of the present application;

[0016] Figure 2 Another structural schematic diagram of the driving substrate circuit detection device provided in an embodiment of the present application;

[0017] Figure 3 A schematic diagram of another structure of the driving substrate circuit detection device provided in an embodiment of the present application;

[0018] Figure 4 A schematic diagram of another structure of the driving substrate circuit detection device provided in an embodiment of the present application;

[0019] Figure 5 A flow chart of a driving substrate circuit detection method provided by another embodiment of the present application;

[0020] Figure 6 A schematic diagram of a distribution of charged particles under the action of an electric field when the driving substrate is normal during detection provided by another embodiment of the present application;

[0021] Figure 7 A schematic diagram showing that the driving substrate is normal during detection and charged particles are uniformly distributed from the first side provided by another embodiment of the present application;

[0022] Figure 8 A schematic diagram of a distribution of charged particles under the action of an electric field when a driving substrate is abnormal during detection provided by another embodiment of the present application;

[0023] Fig. 9A schematic diagram showing that the driving substrate is abnormal during detection and charged particles are unevenly distributed from the first side provided by another embodiment of the present application;

[0024] Fig.10 A schematic diagram of another distribution of charged particles under the action of an electric field when the driving substrate is normal during detection provided by another embodiment of the present application;

[0025] Fig.11 Another schematic diagram of another embodiment of the present application showing that the driving substrate is normal during detection and charged particles are uniformly distributed from the first side;

[0026] Fig.12 A schematic diagram of another distribution of charged particles under the action of an electric field when a driving substrate is abnormal during detection provided by another embodiment of the present application;

[0027] Fig.13 Another schematic diagram of another embodiment of the present application showing that the driving substrate is abnormal during detection and charged particles are unevenly distributed from the first side;

[0028] Description of reference numerals:

[0029] 1-hollow plate; 101-first substrate; 102-second substrate; 103-packaging edge; 2-conductive layer; 3-display detection layer; 301-suspension; 302-charged particles; 303-packaging body; 304-surface; 305-bottom surface; 4-driving substrate; 401-electrode. DETAILED DESCRIPTION

[0030] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0032] When testing the circuit on the driving substrate, after bonding the LED chip on the driving substrate, the LED chip is driven to emit light, and the circuit of the driving substrate is determined to be abnormal based on the light emission of the LED chip. The detection efficiency is low, the cost is high, and the detection is easily affected by the bonding process and the quality of the LED chip, and the accuracy of the detection result is low. The LED chips in this embodiment include but are not limited to Mini LED (Mini Light Emitting Diode, sub-millimeter light-emitting diode), Micro LED (Micro Light Emitting Diode, micrometer-level light-emitting diode) and nanometer-level light-emitting diode.

[0033] Based on this, the present application hopes to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in the subsequent embodiments.

[0034] This embodiment provides a driving substrate circuit detection device, such as Figure 1-Figure 4 As shown, it includes a hollow plate body 1 and a display detection layer 3. The hollow plate body 1 includes a first side and a second side opposite to each other, and the first side and the second side are enclosed to form a hollow area. The first side and the second side in this example can be opposite surfaces of left and right, top and bottom, and front and back. A conductive layer 2 is set on the first side of the hollow plate body 1 of this embodiment, and the conductive layer 2 can be made of a transparent material or a light-transmitting material, which can be but not limited to indium tin oxide.

[0035] In some embodiments, Figure 2 , Figure 3 , the hollow board body 1 includes a transparent first substrate 101 located on the first side, and a second substrate 102 located on the second side. The first substrate 101 and the second substrate 102 are packaged together to enclose a hollow area. The first substrate 101 and the second substrate 102 can be made of insulating materials, such as glass, polyimide (PI), etc. In this embodiment, the first substrate 101 and the second substrate 102 can be packaged together by a packaging edge 103. The packaging edge 103 is arranged around the edges of the two substrates. The packaging edge 103, the first substrate 101, and the second substrate 102 are together to form the hollow area of ​​the hollow board body 1. The packaging edge 103 can be set between the first substrate 101 and the second substrate 102 by pasting, or a packaging glue can be directly set around the edge between the first substrate 101 and the second substrate 102. The packaging glue is the packaging edge 103. The packaging edge 103 can also be but not limited to inorganic materials, such as glass. In some application scenarios, such as Figure 4 The hollow plate body 1 may not be provided with the first substrate 101, that is, the conductive layer 2 is directly provided on the first side of the hollow plate body 1, and the conductive layer 2 and the second substrate 102 may also be surrounded to form a hollow area.

[0036] The display detection layer 3 in this embodiment is located in the hollow area of ​​the hollow plate body 1, and the display detection layer 3 includes a suspension 301, and charged particles 302 with the same electrical properties doped in the suspension 301. When the charged particles 302 are close to the first side, they appear on the surface 304 of the suspension 301 from the first side, and when the charged particles 302 are close to the second side, they appear on the bottom surface 305 of the suspension 301 opposite to the surface 304 and not from the first side.

[0037] It can be understood that the surface 304 and the bottom surface 305 of the suspension 301 only represent the relative positional relationship and are not specifically limited in terms of orientation. The surface 304 of the suspension 301 is close to the first side of the hollow plate body 1, and the bottom surface 305 of the suspension 301 is close to the second side of the hollow plate body 1. The charged particles 302 appear on the surface 304 of the suspension 301 from the first side, that is, when observed from the direction of the first side of the hollow plate body 1, the charged particles 302 are visible on the surface 304 of the suspension 301. Specifically, "appear" means that the charged particles 302 can be observed, and there is a visual difference between the charged particles 302 and the suspension 301, for example, the charged particles 302 can be in a luminous state, and the suspension 301 is in a non-luminous state; or the charged particles 302 are white, and the suspension 301 is black; the charged particles 302 are black, and the suspension 301 is non-transparent white, and so on. Similarly, the charged particles 302 on the bottom surface 305 of the suspension 301 are not visible from the first side, that is, when observed from the first side of the hollow plate 1 , the charged particles 302 on the bottom surface 305 of the suspension 301 are blocked by the suspension 301 and are not visible.

[0038] In some embodiments, the charged particles 302 include fluorescent particles, and the suspension 301 includes a light-shielding liquid. The fluorescent particles can emit light, and when the charged particles 302 on the surface 304 of the suspension 301 can be observed from the first side because they can emit light. However, the charged particles 302 on the bottom surface 305 of the suspension 301 cannot be observed from the first side because the suspension 301 is light-shielded. Therefore, it can be clearly identified from the first side whether the charged particles 302 are close to the first side or close to the second side, so as to confirm the detection result. The light-shielding liquid in this embodiment can be, but is not limited to, black ink.

[0039] In other embodiments, the charged particles 302 are black and the suspension 301 is opaque white. When the charged particles 302 on the surface 304 of the suspension 301 are observed from the first side, the black charged particles 302 on the surface 304 of the white suspension 301 can be clearly observed. However, the charged particles 302 on the bottom surface 305 of the suspension 301 cannot be observed from the first side because the suspension 301 is opaque, or the black charged particles 302 on the bottom surface 305 of the white suspension 301 are gray when observed from the first side. In this way, it can be clearly identified whether the charged particles 302 are close to the first side or the second side, so as to confirm the detection results.

[0040] like Figure 6 , the conductive layer 2 in this embodiment is transparent and the entire layer is arranged on the side of the first substrate 101 away from the second substrate 102. The entire layer of the conductive layer 2 means that the conductive layer 2 is a panel structure without hollowing out, which can completely cover the display detection layer 3. The fully covered entire layer structure is simpler to manufacture, and the scope of application of the detection device is also wider. At this time, the side of the conductive layer 2 away from the second substrate 102 is the first side, and the side of the second substrate 102 away from the first substrate 101 is the second side. In some application scenarios, the conductive layer 2 can also be a hollow structure, that is, the area between adjacent electrodes 401 on the corresponding driving substrate 4 can be set to be hollow, and an electric field can still be formed between the area between the hollows on the conductive layer 2 and the electrodes 401 on the driving substrate 4 for detection. In this embodiment, the transparent conductive layer 2 can be arranged on the first substrate 101 by, but not limited to, evaporation.

[0041] In this embodiment, if Figure 3 , the display detection layer 3 can be a whole layer structure, and the suspension 301 is directly encapsulated by the hollow plate 1. Figure 1 , Figure 2 , the display detection layer 3 may include a plurality of independent isolation chambers, and the suspension 301 and the charged particles 302 are arranged in the isolation chambers. The plurality of independent isolation chambers can limit the lateral movement of the charged particles 302, so that the density of the charged particles 302 in the lateral direction of the display detection layer 3 is more uniform, which is conducive to improving the stability of the device detection. The lateral direction is parallel to the conductive layer 2. In some embodiments, Figure 6 , Fig.10 , one isolation chamber may correspond to one electrode 401 of the driving substrate 4. Specifically, the isolation chamber may correspond to the electrodes 401 of the driving substrate 4 one by one, or one electrode 401 may correspond to multiple isolation chambers, and the unit formed by each isolation chamber is minimized, so that the density of the charged particles 302 in the display detection layer 3 will be more uniform, which is more conducive to the detection of the circuit.

[0042] The shape of the isolation chamber in the present embodiment can be a spherical shape, and can be specifically formed by a spherical encapsulation body 303. It is understandable that ellipsoidal, oval, balloon, rugby, etc., which are similar to spherical shapes, can be regarded as equivalent replacements for the spherical shape in the present embodiment. When making the detection device, after the spherical encapsulation body 303 is placed in the hollow area of ​​the hollow plate body 1, the encapsulation body 303 can roll freely, automatically fill the hollow area, and does not overlap, and the manufacture of the device is simpler and faster. When the isolation chamber is formed by the spherical encapsulation body 303, the surface 304 of the suspension 301 represents the curved surface of the suspension 301 close to the first side, and the bottom surface 305 of the suspension 301 represents the curved surface of the suspension 301 close to the second side.

[0043] In the above-mentioned driving substrate circuit detection device, the charged particles 302 in the display detection layer 3 can move under the action of the electric field. Figure 6-Figure 13 , the detection device is placed on the driving substrate 4, and the driving substrate 4 is close to the first side of the hollow plate body 1. A first voltage is applied to the conductive layer 2, and a second voltage is applied to the electrode 401 on the driving substrate 4. The second voltage is greater than the first voltage, and the first voltage and the second voltage have the same electrical properties. An electric field is generated between the first voltage and the second voltage. When the circuit is normal, that is, when each electrode 401 is normally energized, Fig.10 , the charged particles 302 in the electric fields corresponding to the electrodes 401 will all appear on the surface 304 of the suspension 301 from the first side, or as Figure 6 , the charged particles 302 in each electric field corresponding to the electrode 401 will not appear from the first side at the bottom surface 305 of the suspension 301. Figure 7 , Fig.11 , it can be observed from the first side that the pattern formed by the charged particles 302 is regularly arranged. When the circuit is abnormal and there is an abnormally powered electrode 401, the electric field between the abnormally powered electrode 401 and the conductive layer 2 will change, so that the charged particles 302 located between the abnormally powered electrode 401 and the conductive layer 2 move in the opposite direction compared to the charged particles 302 in the electric field of other normal electrodes 401, resulting in Fig.12 , Fig.13 The situation where the charged particle 302 does not appear in the part that should appear, or Figure 8 , Fig. 9The charged particles 302 are shown in the part that should not be shown. At this time, it can be observed from the first side that the pattern formed by the shown charged particles 302 is irregularly arranged, and the circuit can be determined to be abnormal. The detection device is placed on the driving substrate 4, and then the voltage is applied to perform the detection. The detection is simple, fast and efficient. The driving substrate 4 can be detected before bonding the LED chip. The detection result will not be affected by the bonding process and the quality of the LED chip. The detection accuracy is high, and the abnormal driving substrate 4 can be effectively eliminated, avoiding the situation of bonding the LED chip on the abnormal driving substrate 4, and reducing resource waste. In addition, the detection device can be reused many times, saving the detection cost.

[0044] This embodiment provides a driving substrate circuit detection method, such as Figure 5 As shown, the following steps are included:

[0045] S101: placing a driving substrate circuit detection device on a driving substrate to be detected, where the driving substrate is close to the second side of the hollow plate body.

[0046] The driving substrate circuit detection device in this embodiment is the driving substrate circuit detection device in the previous embodiment. Figure 1-Figure 4 In this embodiment, the specific configuration of the conductive layer 2, the hollow plate 1, and the display detection layer 3 is the same as that of the previous embodiment, and will not be described in detail here. Figure 6 , Fig.10 , it can be that the side of the driving substrate 4 where the electrode 401 is set is close to the second side of the hollow plate body 1. The display detection layer 3 in this embodiment includes multiple independent isolation chambers, and the suspension 301 and the charged particles 302 are arranged in the isolation chambers, and one isolation chamber corresponds to one electrode 401. Specifically, the isolation chambers and the electrodes 401 of the driving substrate 4 may correspond one to one, or one electrode 401 may correspond to multiple isolation chambers, and the units formed by each isolation chamber are minimized, and the density of the charged particles 302 in the display detection layer 3 will be more uniform, which is more conducive to the detection of the circuit.

[0047] S102: applying a first voltage to the conductive layer, and applying a second voltage to each electrode on the driving substrate, so that the charged particles move under the action of the electric field generated by the first voltage and the second voltage.

[0048] In this embodiment, the electrical properties of the first voltage and the second voltage are the same, and the second voltage is greater than the first voltage. In this embodiment, the first voltage can be set to 1V-4V, and the second voltage can be set to 5V and above; or the first voltage can be 5V-10V, and the second voltage is 10V and above, but for safety reasons, the voltage values ​​of the first voltage and the second voltage are not easy to be too high. In some embodiments, the electrical properties of the first voltage and the second voltage can be opposite to the electrical properties of the charged particles 302; in other embodiments, the electrical properties of the first voltage and the second voltage can also be the same as the electrical properties of the charged particles 302.

[0049] In this embodiment, before applying the second voltage to the electrode 401 of the driving substrate 4 , it may be confirmed whether the detection device can work normally, thereby improving the accuracy of the detection.

[0050] In some embodiments, the electrical properties of the first voltage and the second voltage may be opposite to the electrical properties of the charged particles. Then, after applying the first voltage to the conductive layer and before applying the second voltage to each electrode on the driving substrate, the method may further include:

[0051] Confirm whether the charged particles move to the surface of the suspension to appear entirely from the first side; if so, the driving substrate circuit detection device can work normally, otherwise the driving substrate circuit detection device cannot work normally and needs to be repaired or replaced.

[0052] In some other embodiments, the electrical properties of the first voltage and the second voltage may be the same as the electrical properties of the charged particles. Then, after applying the first voltage to the conductive layer and before applying the second voltage to each electrode on the driving substrate, the following may also be included:

[0053] Confirm whether the charged particles move to the bottom surface of the suspension so as to be completely invisible from the first side. If the charged particles are completely invisible, the driving substrate circuit detection device can work normally, otherwise the driving substrate circuit detection device cannot work normally and needs to be repaired or replaced.

[0054] S103: Determine a detection result according to the display result of the charged particles moving to the surface of the suspension to appear from the first side.

[0055] In this embodiment, the charged particles 302 may be fluorescent particles, and the suspension 301 may be a light-shielding liquid; the detection result is determined according to the display result of the charged particles 302 moving to the surface 304 of the suspension 301 to appear from the first side, including:

[0056] It is determined whether the luminous pattern formed by the charged particles 302 that move to the surface 304 of the suspension 301 and emit light from the first side is regularly arranged. If the luminous pattern is regularly arranged, the circuit of the driving substrate 4 is qualified, otherwise it is unqualified.

[0057] In some embodiments, the first voltage and the second voltage can both be positive voltages, and the charged particles 302 are negatively charged particles. In this case, the first voltage is applied to the conductive layer 2, and the second voltage is applied to the electrode 401. When the circuit is normal, a first electric field is formed between each electrode 401 and the conductive layer 2, such as Figure 6 As shown, the negatively charged particles in the first electric field will move to the second side and eventually be located at the bottom surface 305 of the suspension 301; the portion of the driving substrate 4 between the electrodes 401 has no second voltage, and a second electric field is formed between the portion and the conductive layer 2, and the negatively charged particles in the second electric field will move to the first side and eventually be located at the surface 304 of the suspension 301. When the circuit is normal, as Figure 7 , observed from the first side, it can be seen that the portion B corresponding to the electrode 401 has no charged particles 302, while the portion A corresponding to the electrode 401 has charged particles 302. At this time, the pattern formed by the charged particles 302 moving to the surface 304 of the suspension 301 and appearing from the first side is regularly arranged. When the circuit is abnormal, such as Figure 8 , there is an abnormally energized electrode 401, and the abnormally energized electrode 401 has no second voltage, that is, the electric field formed between the abnormally energized electrode 401 and the conductive layer 2 is the second electric field, and the negatively charged particles in this electric field are located on the surface 304 of the suspension 301, such as Fig. 9 That is, the abnormal part C should not have any charged particles 302, but the charged particles 302 are visible. At this time, the pattern formed by the charged particles 302 that move to the surface 304 of the suspension 301 and appear from the first side is irregularly arranged, and it can be determined that the circuit of the driving substrate 4 is unqualified; at the same time, based on the area where the pattern formed by the charged particles 302 is irregularly arranged, the abnormal position of the driving substrate 4 circuit can also be quickly located, and the problematic circuit position on the driving substrate 4 can be repaired or replaced in time.

[0058] In some other embodiments, the first voltage and the second voltage can both be positive voltages, and the charged particles 302 are positively charged particles. In this case, the first voltage is applied to the conductive layer 2, and the second voltage is applied to the electrode 401. When the circuit is normal, a first electric field is formed between each electrode 401 and the conductive layer 2, such as Fig.10 , the positively charged particles in the first electric field will move to the first side and eventually be located at the surface 304 of the suspension 301; the portion of the driving substrate 4 between the electrodes 401 has no second voltage, and a second electric field is formed between the portion and the conductive layer 2, and the positively charged particles in the second electric field will move to the second side and eventually be located at the bottom 305 of the suspension 301. When the circuit is normal, as Fig.11, observed from the first side, it can be seen that the portion B corresponding to the electrode 401 has charged particles 302, while the portion A corresponding to the gap between the electrodes 401 has no charged particles 302. At this time, the pattern formed by the charged particles 302 moving to the surface 304 of the suspension 301 and appearing from the first side is regularly arranged. When the circuit is abnormal, such as Fig.12 , there is an abnormally energized electrode 401, and the abnormally energized electrode 401 has no second voltage, that is, the electric field formed between the abnormally energized electrode 401 and the conductive layer 2 is the second electric field, and the positively charged particles in this electric field are located at the bottom surface 305 of the suspension 301, that is, Fig.13 The abnormal part shown in the figure should have charged particles 302 visible, but there are no charged particles 302. At this time, the pattern formed by the charged particles 302 that move to the surface 304 of the suspension 301 and appear from the first side is irregularly arranged, and it can be determined that the circuit of the driving substrate 4 is unqualified. At the same time, based on the area where the pattern formed by the charged particles 302 is irregularly arranged, the abnormal position of the driving substrate 4 circuit can also be quickly located, and the problematic circuit position on the driving substrate 4 can be repaired or replaced in time.

[0059] In some other embodiments, the first voltage and the second voltage can both be negative voltages, and the charged particles 302 are positively charged particles. In this case, the first voltage is applied to the conductive layer 2, and the second voltage is applied to the electrode 401. When the circuit is normal, Figure 6 , a third electric field is formed between each electrode 401 and the conductive layer 2, and the positively charged particles in the third electric field will move to the second side and eventually be located at the bottom surface 305 of the suspension 301; there is no second voltage on the portion of the driving substrate 4 between the electrodes 401, and a fourth electric field is formed between the portion and the conductive layer 2, and the positively charged particles in the fourth electric field will move to the first side and eventually be located at the surface 304 of the suspension 301. When the circuit is normal, such as Figure 7 , observed from the first side, it can be seen that no charged particles 302 appear in the portion B corresponding to the electrode 401, while charged particles 302 appear in the portion A corresponding to the gap between the electrodes 401. At this time, the pattern formed by the charged particles 302 that move to the surface 304 of the suspension 301 and appear from the first side is regularly arranged. When the circuit is abnormal, such as Figure 8 , there is an abnormally powered electrode 401, and the abnormally powered electrode 401 does not have the second voltage, that is, the electric field formed between the abnormally powered electrode 401 and the conductive layer 2 is the fourth electric field, and the positively charged particles in this electric field are located on the surface 304 of the suspension 301, such as Fig. 9That is, the abnormal part C should not have any charged particles 302, but the charged particles 302 are visible. At this time, the pattern formed by the charged particles 302 that move to the surface 304 of the suspension 301 and appear from the first side is irregularly arranged, and it can be determined that the circuit of the driving substrate 4 is unqualified; at the same time, based on the area where the pattern formed by the charged particles 302 is irregularly arranged, the abnormal position of the driving substrate 4 circuit can also be quickly located, and the problematic circuit position on the driving substrate 4 can be repaired or replaced in time.

[0060] In some other embodiments, both the first voltage and the second voltage can be negative voltages, and the charged particles 302 are negatively charged particles. In this case, the first voltage is applied to the conductive layer 2, and the second voltage is applied to the electrode 401. When the circuit is normal, Fig.10 , a third electric field is formed between each electrode 401 and the conductive layer 2, and the negatively charged particles in the third electric field will move to the first side and eventually be located on the surface 304 of the suspension 301; there is no second voltage on the portion of the driving substrate 4 between the electrodes 401, and a fourth electric field is formed between the portion and the conductive layer 2, and the negatively charged particles in the fourth electric field will move to the second side and eventually be located on the bottom surface 305 of the suspension 301. When the circuit is normal, such as Fig.11 , observed from the first side, it can be seen that the portion B corresponding to the electrode 401 has charged particles 302, while the portion A corresponding to the gap between the electrodes 401 has no charged particles 302. At this time, the pattern formed by the charged particles 302 moving to the surface 304 of the suspension 301 and appearing from the first side is regularly arranged. When the circuit is abnormal, such as Fig.12 , there is an abnormally energized electrode 401, and the abnormally energized electrode 401 does not have the second voltage, that is, the electric field formed between the abnormally energized electrode 401 and the conductive layer 2 is the fourth electric field, and the negatively charged particles in this electric field are located at the bottom surface 305 of the suspension 301, such as Fig.13 That is, the abnormal part should have charged particles 302, but no charged particles 302 are shown. At this time, the pattern formed by the charged particles 302 that move to the surface 304 of the suspension 301 and appear from the first side is irregularly arranged, and it can be determined that the circuit of the driving substrate 4 is unqualified. At the same time, based on the area where the pattern formed by the charged particles 302 is irregularly arranged, the abnormal position of the circuit of the driving substrate 4 can also be quickly located, and the problematic circuit position on the driving substrate 4 can be repaired or replaced in time.

[0061] The above-mentioned driving substrate circuit detection method can determine the detection result according to the display result of the charged particles 302 that move to the surface 304 of the suspension 301 and appear from the first side. When the circuit is abnormal and there is an abnormally energized electrode 401, the electric field between the abnormally energized electrode 401 and the conductive layer 2 will change, so that the charged particles 302 located between the abnormally energized electrode 401 and the conductive layer 2 move in the opposite direction compared to the charged particles 302 in the electric field of other normal electrodes 401, so that the part that should appear does not have the charged particles 302 appear, or the part that should not appear appears. At this time, it can be observed from the first side that the pattern formed by the displayed charged particles 302 is irregularly arranged, and the circuit can be determined to be abnormal. The detection device is placed on the driving substrate 4, and then the voltage is applied to perform the detection. The detection is simple, fast and efficient. Moreover, the driving substrate 4 can be inspected before bonding the LED chip. The inspection result will not be affected by the bonding process and the quality of the LED chip. The inspection has high accuracy and can effectively eliminate abnormal driving substrates 4, thus avoiding the situation of bonding LED chips on abnormal driving substrates 4 and reducing resource waste.

[0062] It should be understood that the application of the present application is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A driving substrate circuit detection device, characterized in that: include: A hollow plate body, the hollow plate body comprising a first side and a second side opposite to each other, the first side and the second side together enclose a hollow area, and a conductive layer is disposed on the first side; A display detection layer, the display detection layer is located in the hollow area, and the display detection layer includes a suspension, and charged particles with the same electrical properties doped in the suspension; When the charged particles are close to the first side, they appear on the surface of the suspension from the first side; when the charged particles are close to the second side, they appear on the bottom surface of the suspension opposite to the surface and not from the first side.

2. The drive substrate circuit detection device according to claim 1, characterized in that: The hollow plate body includes a transparent first substrate located on the first side, and a second substrate located on the second side. The first substrate and the second substrate are packaged together to enclose and form the hollow area.

3. The drive substrate circuit detection device according to claim 2, characterized in that: The conductive layer is transparent and the entire layer is disposed on a side of the first substrate away from the second substrate.

4. The drive substrate circuit detection device according to any one of claims 1 to 3, characterized in that: The display detection layer includes a plurality of independent isolation chambers, and the suspension and the charged particles are arranged in the isolation chambers.

5. The drive substrate circuit detection device according to claim 4, characterized in that: The isolation chamber is in the shape of a sphere.

6. The drive substrate circuit detection device according to any one of claims 1 to 3, characterized in that: The charged particles include fluorescent particles, and the suspension includes light-shielding liquid.

7. A driving substrate circuit detection method, characterized in that: include: Placing the driving substrate circuit detection device according to any one of claims 1 to 6 on a driving substrate to be detected, wherein the driving substrate is close to the second side of the hollow plate body; Applying a first voltage to the conductive layer and applying a second voltage to each electrode on the driving substrate, the charged particles move under the action of the electric field generated by the first voltage and the second voltage, the first voltage and the second voltage have the same electrical property, and the second voltage is greater than the first voltage; A detection result is determined based on the display of charged particles moving to the surface of the suspension to emerge from the first side.

8. The driving substrate circuit detection method according to claim 7, characterized in that: The electrical properties of the first voltage and the second voltage are opposite to the electrical properties of the charged particles. After applying the first voltage to the conductive layer and before applying the second voltage to each electrode on the driving substrate, the method includes: It is confirmed whether the charged particles move to the surface of the suspension to be fully visible from the first side. If so, the driving substrate circuit detection device is normal; otherwise, the driving substrate circuit detection device is abnormal.

9. The driving substrate circuit detection method according to claim 7, characterized in that: The electrical properties of the first voltage and the second voltage are the same as the electrical properties of the charged particles. After applying the first voltage to the conductive layer and before applying the second voltage to each electrode on the driving substrate, the method includes: It is confirmed whether the charged particles move to the bottom surface of the suspension so as to be completely invisible from the first side. If so, the driving substrate circuit detection device is normal; otherwise, the driving substrate circuit detection device is abnormal.

10. The driving substrate circuit detection method according to any one of claims 7 to 9, characterized in that: The charged particles are fluorescent particles, and the suspension is a light-shielding liquid; and determining the detection result according to the display result of the charged particles moving to the surface of the suspension to appear from the first side comprises: It is determined whether the luminous pattern formed by the charged particles that move to the surface of the suspension and emit light from the first side is regularly arranged. If the luminous pattern is regularly arranged, the circuit of the driving substrate is qualified, otherwise it is unqualified.

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