Control device, control system, and storage medium storing control program

Abstract

A control device, a control system, and a storage medium storing a control program can perform data management in consideration of the state of each wafer and the change over time of each device. The control device (100) controls the operation of a plurality of semiconductor wafer production devices (A) for each target wafer, and is provided with a storage unit (10), a command data generation unit (20), a reception data generation unit (30), and a communication unit (50). The command data generation unit associates a transmission destination address with an operation process and generates command data (OD) indicating an operation condition of one semiconductor wafer production apparatus before or during operation, and the reception data generation unit acquires log data (LD) from the semiconductor wafer production apparatus at predetermined time intervals via the communication unit. Corresponding the log data with the second step of the log item in sequence, and generating reception data (D4) indicating at least one of the operating state of one semiconductor wafer production apparatus and the state of the wafer during operation.

Description

Technical Field

[0001] The present invention relates to a control device for controlling the operation of a plurality of semiconductor wafer production devices, a control system, and a storage medium storing a control program. Background Art

[0002] In a semiconductor production line equipped with a variety of semiconductor production devices, a data management method is known, which manages device drive data for driving each drive unit of each semiconductor production device (for example, a chip bonding device, a wire bonding device, a dispenser, etc.). In the data management method of Patent Document 1 (Japanese Patent Publication No. 5-94448), a method of dividing the device drive data into multiple files is proposed. The specific data management method is briefly described as follows.

[0003] First, the device drive data is divided into four data files, namely, the device name file of each semiconductor manufacturing device, the unit name file of each drive unit, the action item name file of each drive unit, and the setting data file, and stored in the data storage unit of the management computer independently of the data management program. Then, the device number, unit number, and action item number are read from the corresponding files, and the data of the part that matches each number is specified from the setting data file to send data to each semiconductor manufacturing device and change the data. In this way, the processing speed is improved and the data editing is easy.

[0004] Patent Document 1: Japanese Patent Application Laid-Open No. 5-94448

[0005] The data management method disclosed in Patent Document 1 can also be applied to a semiconductor production line equipped with various or multiple devices for wafer manufacturing processes (including grinding, measurement, cleaning, etc.) (sometimes referred to as "semiconductor wafer production devices" in the present invention). However, in the device driving data disclosed in Patent Document 1, data management is not performed for each wafer, so there is a problem that each device cannot be operated in consideration of the status of each wafer.

[0006] Furthermore, the data management method disclosed in Patent Document 1 does not take into account the temporal changes such as the degradation of each component of the semiconductor wafer production apparatus, and thus another problem arises that data management cannot be performed based on the temporal changes. Summary of the invention

[0007] The present invention is completed in view of the above situation, and its purpose is to provide the following control device, control system and storage medium storing control program: control the operation of multiple semiconductor chip production devices and enable data management that takes into account the status of each chip and the time-dependent changes of each device.

[0008] The present invention solves the above-mentioned problems by the solution means described below as one embodiment.

[0009] A control device that controls the operation of multiple semiconductor wafer production devices according to each wafer as an object, wherein the control device has a storage unit, a command data generation unit, a received data generation unit and a communication unit, wherein a first structure file, a setting value file and a second structure file are stored in the storage unit, wherein the first structure file stores a first identifier of the semiconductor wafer production device, a second identifier of the wafer, an action item of the semiconductor wafer production device, a first step number of the action item and a sending destination address corresponding to the action item and the first step, and the setting value file stores an operation process that shows the operation conditions of each semiconductor wafer production device in correspondence with the first identifier and the second identifier, the action item and the first step, or the setting value file stores an operation process that shows the operation conditions of each semiconductor wafer production device in correspondence with the second identifier, the action item and the first step. The second structure file stores the first identifier, the second identifier, the log item of the semiconductor chip production device, the second step number of the log item, the specified time interval and the receiving source address corresponding to the log item. The instruction data generating unit is configured to establish a correspondence between the sending destination address and the working process to generate instruction data showing the working conditions of one of the semiconductor chip production devices before or during work, and output the instruction data from the communication unit to one of the semiconductor chip production devices. The receiving data generating unit is configured to obtain log data from one of the semiconductor chip production devices via the communication unit at the specified time interval, establish a correspondence between the log data and the second step in sequence to generate receiving data showing at least one of the working state of one of the semiconductor chip production devices and the state of the chip during work, and store the receiving data in the storage unit.

[0010] Furthermore, preferably, the first structured file and the second structured file are encrypted by a predetermined encryption process.

[0011] Furthermore, it is preferable that a predetermined protection process is performed on the first structured file and the second structured file, and the predetermined protection process prohibits at least one of deletion and rewriting.

[0012] Furthermore, a control system that controls the operation of a plurality of semiconductor wafer production devices according to each wafer as an object is provided, wherein the control system comprises a control device and a storage unit, the control device comprising a command data generating unit, a receiving data generating unit and a communication unit, the storage unit storing a first structure file, a setting value file and a second structure file, the first structure file storing a first identifier of the semiconductor wafer production device, a second identifier of the wafer, an action item of the semiconductor wafer production device, a first step number of the action item and a sending destination address corresponding to the action item and the first step, the setting value file storing a work process that shows the working conditions of each semiconductor wafer production device in correspondence with the first identifier and the second identifier, the action item and the first step, or the setting value file storing a second identifier that shows the working conditions of each semiconductor wafer production device in correspondence with the second identifier, the action item and the first step. The working process of the working conditions of the semiconductor chip production device, the second structure file stores the first identifier, the second identifier, the log item of the semiconductor chip production device, the second step number of the log item, the specified time interval and the receiving source address corresponding to the log item, the instruction data generating unit is configured to establish a correspondence between the sending destination address and the working process to generate instruction data showing the working conditions of one of the semiconductor chip production devices before or during work, and output the instruction data from the communication unit to one of the semiconductor chip production devices, the receiving data generating unit is configured to obtain log data from one of the semiconductor chip production devices via the communication unit at the specified time interval, establish a correspondence between the log data and the second step in sequence to generate receiving data showing at least one of the working status of one of the semiconductor chip production devices and the status of the chip during work, and store the receiving data in the storage unit.

[0013] Furthermore, preferably, the first structured file and the second structured file are encrypted by a predetermined encryption process.

[0014] Furthermore, it is preferable that a predetermined protection process is performed on the first structured file and the second structured file, and the predetermined protection process prohibits at least one of deletion and rewriting.

[0015] Furthermore, a storage medium storing a control program, which can be read by a computer and controls the operation of a plurality of semiconductor chip production devices according to each target chip, is provided, wherein the control program causes the computer to respectively perform the following processing: instruction data generation processing, establishing a correspondence between a sending destination address and a working process to generate instruction data showing the working conditions of one of the semiconductor chip production devices before or during operation, wherein the sending destination address is associated with a first identifier of the semiconductor chip production device, a second identifier of the chip, an action item of the semiconductor chip production device, and a first step of the action item, and the working process is associated with the first identifier and the second identifier, the action item, and the first step A corresponding working condition is established for each of the semiconductor wafer production devices, or a corresponding working condition is established between the working process and the second identifier, the action item and the first step; a command data output process is performed to output the command data from the communication unit to one of the semiconductor wafer production devices; a received data generation process is performed to obtain log data from one of the semiconductor wafer production devices via the communication unit at a prescribed time interval, and the log data is sequentially corresponded to the second step of the log item to generate received data showing at least one of the working status of one of the semiconductor wafer production devices and the status of the wafer; and a received data storage process is performed to store the received data in the storage unit.

[0016] Furthermore, preferably, the storage unit stores a first structure file storing the first identifier, the second identifier, the action item, the first step number of the action item, and the sending destination address, and a second structure file storing the first identifier, the second identifier, the log item, the second step number of the log item, the prescribed time interval, and a receiving source address corresponding to the log item, and the first structure file and the second structure file are encrypted by prescribed encryption processing.

[0017] Furthermore, preferably, the storage unit stores a first structure file storing the first identifier, the second identifier, the action item, the first step number of the action item, and the sending destination address, and a second structure file storing the first identifier, the second identifier, the log item, the second step number of the log item, the prescribed time interval, and a receiving source address corresponding to the log item, and prescribed protection processing is performed on the first structure file and the second structure file, and the prescribed protection processing prohibits at least one of deletion and rewriting.

[0018] According to the above structure, it is possible to generate command data that takes into account the status of each wafer for multiple semiconductor wafer production devices and send the command data. In addition, according to the above structure, it is possible to obtain log data of each wafer and each device from multiple semiconductor wafer production devices, and generate reception data based on the log data. Furthermore, by performing both the generation of command data and the generation of reception data, it is possible to realize a semiconductor production line that can perform data management that takes into account the status of each wafer and the time-varying changes of each device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a block diagram of a control device according to a first embodiment of the present invention.

[0020] Figure 2 It is an explanatory diagram showing the data structure of the first structured file in each embodiment of the present invention.

[0021] Figure 3 It is an explanatory diagram showing the data structure of the setting value file in each embodiment of the present invention.

[0022] Figure 4 It is an explanatory diagram showing the data structure of the second structured file in each embodiment of the present invention.

[0023] Figure 5 It is an explanatory diagram showing the data structure of reception data in each embodiment of the present invention.

[0024] Figure 6 This is a block diagram of a control system according to a second embodiment of the present invention.

[0025] Figure 7 This is a block diagram of a control device according to a third embodiment of the present invention.

[0026] Figure 8 This is a block diagram of a control device according to a fifth embodiment of the present invention.

[0027] Fig. 9 This is a block diagram of a control device according to a seventh embodiment of the present invention. DETAILED DESCRIPTION

[0028] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Figure 1 This is a block diagram of the control device 100 according to the first embodiment of the present invention. Figure 2 It is an explanatory diagram showing the data structure of the first structured file D1 according to each embodiment of the present invention. Figure 3 It is an explanatory diagram showing the data structure of the setting value file D2 according to each embodiment of the present invention. Figure 4 It is an explanatory diagram showing the data structure of the second structured file D3 according to each embodiment of the present invention. Figure 5It is an explanatory diagram showing the data structure of the reception data D4 according to each embodiment of the present invention. Figure 6 This is a block diagram of a control system S according to a second embodiment of the present invention. In all the drawings for explaining each embodiment, components having the same function are denoted by the same reference numerals, and duplicate descriptions may be omitted.

[0029] (Semiconductor wafer production equipment)

[0030] First, the semiconductor wafer production device A of the present invention includes various devices of the front process in each process roughly divided into the front process of manufacturing wafers and the back process of manufacturing chips. Specifically, it includes a cutting device for cutting out wafers from an ingot, a grinding device (single-sided grinding device, double-sided grinding device, edge grinding device, etc.) for grinding the surface and end face of the wafer, a sputtering device for forming a film on the surface of the wafer, etc. In addition, it also includes a cleaning device for the wafer, various measuring devices, various inspection devices, etc. In addition, with respect to each semiconductor wafer production device A of each embodiment, as an example, a well-known single-sided grinding device A is assumed, which has a fixed plate with a grinding pad attached to the upper surface and a grinding head capable of holding the wafer. Therefore, the first structure file D1, the setting value file D2, the second structure file D3, the received data D4, the instruction data OD, and the log data LD described later also include various parameters about the single-sided grinding device A.

[0031] Furthermore, each semiconductor wafer production device (single-side polishing device) A of the first embodiment is configured to include a communication unit 70 (70a to 70c) and a control unit 80 (80a to 80c), and to operate each unit of the device according to the input of the command data OD. Each semiconductor wafer production device (single-side polishing device) A of the second embodiment is configured to include a communication unit 170 (170a to 170c) and a control unit 180 (180a to 180c), and to operate each unit of the device according to the input of the command data OD.

[0032] Furthermore, the control device 100, the control system S, and the control program PGM of each embodiment are described with reference to a case where three semiconductor wafer production apparatuses (single-side polishing apparatuses) A1 to A3 are provided, but the number of semiconductor wafer production apparatuses A is not limited thereto. In addition, a case where a plurality of types of semiconductor wafer production apparatuses A described above are provided may also be provided.

[0033] (First embodiment)

[0034] (Control device)

[0035] Next, the overall structure of the control device 100 of the first embodiment is described. As an example, the control device 100 is implemented by an information processing device such as a personal computer or a workstation. That is, the control device 100 is configured to include a CPU, a memory such as a RAM, a ROM, and a communication unit, and operates according to a preset control program PGM and a setting signal input from the editing unit 60.

[0036] And, if Figure 1 As shown, the control device 100 of this embodiment includes a storage unit 10, a command data generation unit 20, a received data generation unit 30, a temporary storage unit 40, one or more communication units 50, and an editing unit 60. The control device 100 includes three communication units 50a to 50c to control the three single-side polishing devices A1 to A3.

[0037] Next, as an example, the storage unit 10 of this embodiment corresponds to a ROM as a nonvolatile memory. The storage unit 10 stores a first structure file D1, a setting value file D2, a second structure file D3, and a control program PGM for causing the command data generation unit 20 and the received data generation unit 30 to perform operations as the control device 100. In addition, the received data D4 described later is also stored in the storage unit 10.

[0038] Furthermore, the command data generating unit 20 of the present embodiment corresponds to a CPU, and is configured to call the control program PGM from the storage unit 10 and sequentially execute each process of generating the command data OD and outputting the command data OD.

[0039] The reception data generating unit 30 of the present embodiment corresponds to a CPU and is configured to call the control program PGM from the storage unit 10 and sequentially execute processes of generating the reception data D4 and storing the reception data D4 in the storage unit 10 .

[0040] The temporary storage unit 40 of the present embodiment corresponds to a RAM as a volatile memory as an example. The temporary storage unit 40 is configured to temporarily store the command data OD generated by the command data generating unit 20 and the log data LD received by each communication unit 50 (50a to 50c) described later.

[0041] Furthermore, the communication unit 50 (50a~50c) of this embodiment has the following function: to perform prescribed communication (sending or receiving data) with each communication unit 70 (70a~70c) of the semiconductor wafer production device A (A1~A3) through a wired LAN or a wireless LAN.

[0042] Furthermore, the control device 100 may be configured to include a single common communication unit 50 .

[0043] The editing unit 60 of the present embodiment is configured to include a display unit 60a and an operation unit 60b. The display unit 60a is a display for displaying the files D1 to D3 stored in the storage unit 10. In addition, as an example, the operation unit 60b may be a touch panel in addition to a mouse and a keyboard. The operator can edit the setting value file D2 using the editing unit 60.

[0044] Next, the first structured file D1 and the setting value file D2 of this embodiment will be described in detail.

[0045] (1st structure file)

[0046] The first structure file D1 of the present embodiment is a data structure that stores a first identifier for identifying the semiconductor wafer production device A, a second identifier for identifying each wafer, an action item of the semiconductor wafer production device A, a first step number Q1 of the action item, and a destination address that establishes a correspondence between the action item and the first step. More specifically, Figure 2 As shown, the first structured file D1 has a data structure including summary data D11, wafer data D12 as a lower layer of the summary data D11, destination address data D13 as a lower layer of the wafer data D12, and definition data D14 as a lower layer of the wafer data D12.

[0047] The summary data D11 is a data structure having the device name (first identifier), the wafer list (second identifier), the IP address, and the port number as elements. More specifically, the summary data D11 is a data structure storing a first identifier and second identifiers corresponding to the first identifier. In other words, the storage unit 10 stores the first structure files D1 corresponding to the number of semiconductor wafer production devices A. In addition, the IP address and the port number specify the destination of the transmission to the semiconductor wafer production device A.

[0048] Furthermore, the chip data D12 is divided into each of the N chips, and is a data structure with M action items, a pattern reserve number P, and a first step number Q1 as elements. In addition, the action item is an item showing the action of each part of the semiconductor chip production device A. In the case of the single-sided grinding device A, as an example, it includes grinding time, platen speed, head speed, head pressure, etc. In addition, the pattern reserve corresponds to various operations of a semiconductor chip production device A. In the case of the single-sided grinding device A, as an example, the pattern reserve number P is three: rough grinding, medium grinding, and fine grinding. Moreover, the first step number Q1 is a number that specifies how many stages the action of the semiconductor chip production device A is performed. In addition, in the case where the action item includes time (grinding time in this embodiment), each step is configured to work only for that time (grinding time).

[0049] Furthermore, when a plurality of wafers (for example, 5 wafers) are processed as one batch (including processing, inspection, and cleaning), the wafer data D12 may be configured to be divided for each of the N batches instead of for each of the N wafers. For example, the semiconductor wafer production device A is a polishing device (single-side polishing device or double-side polishing device) A that can polish a plurality of wafers at the same time.

[0050] Furthermore, the destination address data D13 is divided for each of the N chips, and has a data structure with P pattern reserves, Q1 first steps, and the destination address of each of the M action items as elements. More specifically, the destination address is stored in each row and column of Q1 rows×M columns, and the destination address data D13 has a data structure having P Q1 rows×M columns of data.

[0051] The definition data D14 is divided for each of the N wafers and has a data structure having the type, maximum value, and minimum value of the value of each of the M operation items as elements. As an example, the definition data D14 is referred to when the editing unit 60 edits the setting value file D2.

[0052] As described above, the first structured file D1 has a hierarchical data structure, but can be divided into each data D11 to D14.

[0053] (settings file)

[0054] Next, the setting value file D2 of this embodiment is a data structure with a work process as an element, and the work process is established to correspond to the first identifier, the second identifier, the action item, and each first step to show the working condition of each semiconductor wafer production device. More specifically, Figure 3 As shown, the setting value file D2 has the following data structure: each file name is classified by the second identifier, and a work process is stored in each row and column of Q1 rows×M columns in correspondence with the second identifier, and has P Q1 rows×M columns of data (as an example, a CSV file). By setting the setting value file D2 as the above structure, the setting value file D2 can be shared between the same type of devices A.

[0055] In addition, when the setting value file D2 is a CSV file, as an example, the first identifier and the second identifier are included in the file name, or the second identifier is included in the file name, but it can also be a data structure with the first identifier and the second identifier at the upper level, or a data structure with the second identifier at the upper level, as in the first structure file D1.

[0056] Since each file D1 and D2 has a file for each semiconductor wafer production device A and each wafer, it is possible to generate and output the command data OD for each wafer for a plurality of semiconductor wafer production devices A using one control device (computer) 100. Furthermore, by making the first structure file D1 and the setting value file D2 independent files, for example, the editing unit 60 can easily edit the work recipe.

[0057] (Command data generation unit)

[0058] Next, the specific processing of the command data generating unit 20 will be described in detail.

[0059] The command data generating unit 20 is configured to generate command data OD indicating the working condition of a semiconductor wafer production device A before or during operation by establishing a correspondence between the destination address and the working recipe stored in the setting value file D2 based on the first structure file D1 (command data generating process). That is, the command data generating unit 20 generates command data OD according to the type of wafer set in advance, the type of semiconductor wafer production device A set in advance, and the type of mode reserve set in advance and corresponding to the working mode of the semiconductor wafer production device A. More specifically, it is assumed that the surface of a wafer is polished in one mode by using a single-side polishing device A1. The command data generating unit 20 reads the destination address data D13 and the setting value file D2 corresponding to the single-side polishing device A1, the wafer and the mode from the storage unit 10. Then, the command data OD is generated by establishing a correspondence between each element of the destination address data D13 and each element of the setting value file D2 corresponding to the row and column of each element (i.e., the same row and column) and stored in the temporary storage unit 40. Next, the command data generating unit 20 outputs the command data OD from the temporary storage unit 40 to the communication unit 70a via the communication unit 50a (command data output processing). Since each operation recipe of the command data OD is associated with a transmission destination address, the operation recipe can be output to each control unit 80 (80a) of the single-side polishing device A1 to perform a predetermined surface polishing (operation of the semiconductor wafer production device A).

[0060] (Second structure file)

[0061] Next, the second structured document D3 of this embodiment will be described in detail.

[0062] The second structured file D3 of this embodiment is a data structure having as its elements the first identifier, the second identifier, the log item of the semiconductor wafer production device, the second step number Q2 of the log item, the specified time interval T, and the receiving source address corresponding to the log item. More specifically, Figure 4As shown, the data structure includes summary data D31, wafer data D32 as a lower layer of the summary data D31, and reception source address data D33 as a lower layer of the wafer data D32.

[0063] The summary data D31 has the same data structure as the summary data D11. That is, the summary data D31 stores a first identifier of a semiconductor wafer production apparatus A, and the storage unit 10 stores second structured files D3 corresponding to the number of semiconductor wafer production apparatuses A.

[0064] The wafer data D32 is divided into L log items for each of the N wafers, and is a data structure having L log items, a pattern reserve number P, a second step number Q2, and a predetermined time interval T as elements. In addition, the log item is an item showing various measurements during operation or after operation of the semiconductor wafer production device A (including the state of stopping the semiconductor wafer production device A and the state after stopping), and at least one of the items of various measurements of the wafer during operation or after operation (including the state of stopping the semiconductor wafer production device A and the state after stopping) (i.e., the item of the log data LD), and in the case of the single-side polishing device A, as an example, includes the wafer shape (as an example, the thickness of the wafer), the device temperature, the driving torque, the head pressure, etc. In addition, the second step number Q2 is a number that specifies how many stages the measurement of the semiconductor wafer production device A is performed. In addition, the received data generation unit 30 obtains the log data LD communicated in real time during the operation of the semiconductor wafer production device A at the time interval T. That is, the second step is divided at the predetermined time interval T.

[0065] Furthermore, the receiving source address data D33 is divided for each of the N chips and is a data structure having P pattern reserves and the receiving source address of each log item of the L log items as elements. Unlike the first structure file D1, the second structure file D3 is a data structure having P receiving source address data D33 storing L receiving source addresses.

[0066] As described above, the second structured file D3 has a hierarchical data structure, but can be divided into each data D31 to D33.

[0067] (Received data generation unit)

[0068] Next, the specific processing of the reception data generating unit 30 will be described in detail.

[0069] The receiving data generating unit 30 obtains log data LD from a semiconductor wafer production device A via each communication unit 50 (50a~50c) at a prescribed time interval T, and sequentially establishes a correspondence between the log data LD and the second step to generate receiving data D4 (receiving data generating process), wherein the receiving data D4 indicates at least one of the working state of a semiconductor wafer production device A during operation of the semiconductor wafer production device A and the state of a wafer during operation of the semiconductor wafer production device A. Then, it is configured to store the receiving data D4 in the storage unit 10 (receiving data storing process). More specifically, it is assumed that a single-sided polishing device A1 is used to perform surface polishing of a wafer in a mode. The receiving data generating unit 30 reads the second structure file D3 from the storage unit 10. Furthermore, the log data LD stored in the temporary storage unit 40 is read at a prescribed time interval T. Next, based on the receiving source address data D33, the log data LD divided according to the time interval T is sequentially established to correspond to the second step to generate Figure 5 The received data D4 is Q2 rows×(L+1) columns as shown. In addition, each row is in the time series order (that is, the second step order) when the log data LD is read. Next, the generated received data D4 is stored in the storage unit 10.

[0070] In addition, each row of the received data D4 only needs to be the order (second step order) of reading the log data LD at the prescribed time interval T, so there is no need to have the second step in the first column, and the received data D4 is Q2 rows × L columns. In addition, each row of the received data D4 only needs to be the order (second step order) of reading the log data LD at the prescribed time interval T, so there is no need to pre-set the value of the second step number Q2, but the second step number Q2 is set according to the number of log data LD. In addition, the second step number Q2 and the time interval T may be set separately for each log item.

[0071] Furthermore, it is possible to configure such that, while the semiconductor wafer production apparatus A is operating, the command data OD is generated based on the setting value file D2 changed by the editing unit 60, and the operating conditions of the same semiconductor wafer production apparatus A in operation are updated. That is, the respective processes of the command data generating unit 20 and the received data generating unit 30 can be combined to change the operating conditions of the semiconductor wafer production apparatus A in operation in real time.

[0072] According to the above configuration, the log data LD can be acquired from a plurality of semiconductor wafer production apparatuses A, and the received data D4 can be generated for each wafer based on the log data LD and stored.

[0073] Furthermore, according to the above configuration, it is possible to realize a semiconductor production line capable of data management that takes into account the state of the wafer and the time-dependent changes of each device A. As an example, when the thickness of the wafer in the received data D4 is greater than a predetermined value, it is sufficient to increase the platen speed, head speed, and head pressure of the setting value file D2 corresponding to the semiconductor wafer production device (single-side polishing device) A that will be operated next.

[0074] (Second embodiment)

[0075] The above describes the structure of the control device 100 and each data. Next, the control system S of the second embodiment is described. The control system S of the second embodiment is configured to include a control device 200 and a storage unit 210, and the control device 200 includes a command data generation unit 120, a received data generation unit 130, and a communication unit 150 (150a to 150c). That is, the structure of the storage unit 10 of the first embodiment is different from that of the storage unit 210 of the second embodiment. The difference from the first embodiment is described below.

[0076] As an example, Figure 6 As shown, the storage unit 210 of the present embodiment is provided in the server 300 independent of the control device 200. The communication unit 190 of the control device 200 and the communication unit 290 of the server 300 have a function of performing predetermined communication (transmission or reception of data) via the network NW.

[0077] As an example, the server 300 of this embodiment is implemented by an information processing device such as a personal computer or a workstation, etc. That is, the server 300 is configured to include a CPU, a memory such as a RAM and a ROM, and a communication unit, and operates according to a preset program or external input.

[0078] The network NW is a network of any structure that connects the control device 200 and the server 300 , and may be any of a wireless network, a dedicated line network, and a public line network.

[0079] In the control system S of the second embodiment, the storage unit 210 is provided in the server 300, and each communication unit 190, 290 performs predetermined communication via the network NW, and the rest is the same as the first embodiment except for these structures. That is, the command data generation unit 20 is renamed as the command data generation unit 120, the received data generation unit 30 is renamed as the received data generation unit 130, the temporary storage unit 40 is renamed as the temporary storage unit 140, the communication unit 50 is renamed as the communication unit 150, the editing unit 60 (display unit 60a, operation unit 60b) is renamed as the editing unit 160 (display unit 160a, operation unit 160b), the communication unit 70 (70a~70c) is renamed as the communication unit 170 (170a~170c), and the control unit 80 (80a~80c) is renamed as the control unit 180 (180a~180c).

[0080] (Third embodiment)

[0081] Next, the control device 100 of the third embodiment will be described. In the control device 100 of the third embodiment, the first structured file D1 and the second structured file D3 are configured to be encrypted by a predetermined encryption process. The differences from the first embodiment will be described below.

[0082] The first structure file D1 and the second structure file D3 of the present embodiment are encrypted by a known encryption method. Specifically, the character strings of data D11, D12, D13, D14, D31, D32, and D33 of each level are composed of ciphertext. As an example, the first structure file D1 and the second structure file D3 can be constructed to be encrypted by a public key encryption method based on an encryption algorithm such as DES (Data Encryption Standard), RC4 (Rivest Cipher 4) or AES (Advanced Encryption Standard). And, as another example, the first configuration file D1 and the second structure file D3 can also be constructed to be encrypted by a public key encryption method based on an encryption algorithm such as RSA. As another example, the first configuration file D1 and the second structure file D3 can also be constructed to be encrypted by a hybrid encryption method.

[0083] According to the above configuration, it is possible to prevent the inconvenience caused by inadvertently changing the files D1 and D3, and to prevent the information of the files D1 and D3 from being leaked.

[0084] Since the first structured file D1 and the second structured file D3 are encrypted, they can be read as follows: Figure 7 As shown in FIG. 1 , the control device 100 according to the third embodiment is configured to include an input unit 90 , an encryption unit 92 , and a decryption unit 94 .

[0085] The encryption unit 92 of this embodiment corresponds to the CPU, and is configured to call the control program PGM from the storage unit 10, and encrypt the first structured file D1 and the second structured file D3 input to the input unit 90 by the above-mentioned known encryption method. More specifically, in the case of the public key encryption method, the control program PGM is configured to include an encryption key (common to a decoding key) for encrypting and decrypting the first structured file D1 and the second structured file D3 in the program code.

[0086] In addition, the encryption key and the decryption key are not limited to being included in the program code of the control program PGM, and may be data independent of the program code.

[0087] Furthermore, the encryption key and the decryption key may be shared by the first structured file D1 and the second structured file D3, or may be set separately.

[0088] In addition, as an example, the input unit 90 of the present embodiment is a USB port 90 . The first structured file D1 and the second structured file D3 are input to the storage unit 10 via the USB port 90 from a USB flash memory or an external terminal.

[0089] In addition, the input unit 90 is not limited to the USB port 90. As another example, the first structured file D1 and the second structured file D3 may be input to the storage unit 10 via a communication unit (not shown) instead of the USB port 90. The communication unit has a function of performing predetermined communication (data transmission or reception) between the control device 100 and an external terminal or the like via a wired LAN or a wireless LAN.

[0090] According to the above configuration, the first structured file D1 and the second structured file D3 input to the control device 100 are encrypted and stored in the storage unit 10 , so that the confidentiality of the files D1 and D3 can be improved.

[0091] Furthermore, the control device 100 may be configured not to include the encryption unit 92. In this case, the first structured file D1 and the second structured file D3 input to the input unit 90 may be encrypted in advance using the above-mentioned known encryption method.

[0092] The decoding unit 94 of this embodiment is equivalent to a CPU, and is configured to call the control program PGM from the storage unit 10, decode the first structure file when the instruction data generation unit 20 generates instruction data OD, and decode the second structure file D3 when the reception data generation unit 30 generates reception data D4.

[0093] According to the above configuration, each structured file D1, D3 is decoded only when the command data OD and the received data D4 are generated, so that the confidentiality of the file D1, D3 can be improved.

[0094] Furthermore, the control device 100 may be configured not to include the decoding unit 94 .

[0095] Furthermore, the encryption unit 92, the decryption unit 94, or both the encryption unit 92 and the decryption unit 94 may be provided in an external server (not shown). Furthermore, the decryption unit 94 may be provided in the semiconductor wafer production apparatus A.

[0096] (Fourth embodiment)

[0097] Next, the control system S of the fourth embodiment is described. In the control system S of the fourth embodiment, the first structured file D1 and the second structured file D3 are configured to be encrypted by a predetermined encryption process similarly to the third embodiment. Therefore, the control device 200 of the fourth embodiment may include a decoding unit, and the server 300 may include an input unit and an encryption unit (neither of which is shown in the figure). In addition, the input unit, the encryption unit, and the decoding unit are the same as those of the third embodiment.

[0098] According to the above configuration, it is possible to prevent the inconvenience caused by inadvertently changing the files D1 and D3, and to prevent the information of the files D1 and D3 from being leaked.

[0099] (Fifth embodiment)

[0100] Next, the control device 100 of the fifth embodiment is described. In the control device 100 of the fifth embodiment, the first structure file D1 and the second structure file D3 are configured so that when data is output to the outside of the control device 100 (especially an external terminal, a user device such as a USB memory) and when data is output to the semiconductor wafer production device A, the data is encrypted by a prescribed encryption process. The structure other than the above is the same as that of the first embodiment. Therefore, it can be as follows Figure 8 As shown in FIG. 1 , the control device 100 of the present embodiment is configured to include an input / output unit 91 and an encryption / decryption unit 96 .

[0101] The encryption / decryption unit 96 corresponds to a CPU and has the functions of both the encryption unit 92 and the decryption unit 94 .

[0102] The above configuration can prevent problems caused by inadvertent changes to the first structured file D1 and the second structured file D3 outside the control device 100. In addition, information leakage of the files D1 and D3, the setting value file D2, and the received data D4 can be prevented.

[0103] Furthermore, the semiconductor wafer production apparatus A (A1 to A3) of the present embodiment may be configured to include encryption / decryption units 98 (98a to 98c), respectively.

[0104] According to the above structure, it is possible to prevent adverse situations and information leakage caused by inadvertent changes to the first structure file D1 and the second structure file D3 outside the control system including the semiconductor wafer production device A, and it is possible to prevent information leakage of the setting value file D2 and the received data D4.

[0105] Furthermore, the control device 100 may be configured to limit the semiconductor wafer production device A as the destination of data transmission and reception so that data cannot be transmitted and received with the semiconductor wafer production device A that does not include the encryption / decryption unit 98 .

[0106] According to the above configuration, information leakage can be prevented.

[0107] Next, the control system S of the sixth embodiment is described. In the control system S of this embodiment, as in the fifth embodiment, the first structure file D1 and the second structure file D3 are configured to be encrypted by a prescribed encryption process when outputting data to the outside of the control system (particularly, external terminals, USB memory and other user devices), when inputting and outputting data between the control device 200 and the server 300, and when outputting data to the semiconductor wafer production device A. The structure other than the above is the same as that of the second embodiment. Therefore, the control device 200 and the server 300 of the sixth embodiment can also be configured to have an input / output unit 91 and an encryption / decoding unit 96 (both not shown).

[0108] The above configuration can prevent problems caused by inadvertent changes to the first structured file D1 and the second structured file D3 outside the control system S. Furthermore, information leakage of the files D1 and D3, the setting value file D2, and the received data D4 can be prevented.

[0109] Furthermore, similarly to the fifth embodiment, the semiconductor wafer production apparatuses A (A1 to A3) may be configured to include encryption / decryption units 98 (98a to 98c) (not shown).

[0110] Next, the control device 100 of the seventh embodiment is described. In the control device 100 of this embodiment, the first structured file D1 and the second structured file D3 are configured to be subjected to a predetermined protection process, and the predetermined protection process prohibits at least one of deletion and rewriting. The differences from the first embodiment are described below.

[0111] As an example, the protection processing unit 402 corresponding to the CPU in the external terminal 400 performs protection processing on the first structured file D1 and the second structured file D3. Alternatively, a configuration may be adopted in which the protection is released using a predetermined key.

[0112] In addition, the protection processing unit 402 may be configured to be provided in the control device 100 .

[0113] The first structured file D1 and the second structured file D3 that have been protected are configured to be input to the storage unit 10 of the control device 100 via a communication unit (not shown).

[0114] According to the above configuration, only authorized users can perform deletion and editing, and it is possible to prevent problems caused by changing the first structured file D1 and the second structured file D3.

[0115] Next, the control system S of the eighth embodiment will be described. In the control device 200 and the server 300 of this embodiment, the first structured file D1 and the second structured file D3 are configured to be subjected to a predetermined protection process, and the predetermined protection process prohibits at least one of deletion and rewriting. The differences from the second embodiment will be described below.

[0116] As an example, the first structured file D1 and the second structured file D3 are protected by a protection processing unit 402 corresponding to a CPU in an external terminal 400 connected to the server 300 (neither of them is shown). Alternatively, the protection may be released using a predetermined key.

[0117] In addition, the protection processing unit 402 may be configured to be provided in the control device 200 or the server 300 .

[0118] The protected first structured file D1 and the second structured file D3 are configured to be input to the storage unit 210 of the server 300 via a communication unit (not shown).

[0119] According to the above configuration, only authorized users can perform deletion and editing, and it is possible to prevent problems caused by changing the first structured file D1 and the second structured file D3.

[0120] As described above, according to the control device 100, the control system S, and the control program PGM of each embodiment, a semiconductor production line capable of data management that takes into account the state of each wafer and the time-dependent changes of each device can be realized. In particular, it can also be applied to a semiconductor production line that combines various semiconductor production devices in addition to the above-mentioned front process and the back process.

[0121] In addition, the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the scope of the present invention.

[0122] As an example, the first structure file D1 may also adopt a data structure having wafer data D12 corresponding to a plurality of semiconductor wafer production devices A. More specifically, the following data structure may be adopted: in a lower level of the summary data D11, in addition to wafer data on a single-side polishing device, wafer data on a measuring device and an inspection device are also provided. Similarly, the second structure file D3 may also adopt a data structure having wafer data D32 corresponding to a plurality of semiconductor wafer production devices A. More specifically, the following data structure may be adopted: in a lower level of the summary data D31, in addition to wafer data on a single-side polishing device, wafer data on a measuring device and an inspection device are also provided.

[0123] As another example, a data updating unit (not shown) may be used instead of the editing unit 60 or 160 of each embodiment. The data updating unit is configured to compare a predetermined value of the received data D4 with a preset threshold value and update the preset appropriate value to the setting value file D2.

[0124] Furthermore, as another example of the data updating unit, based on the predetermined value of the received data D4 and the correlation data, the data updating unit is configured to update the predetermined value obtained from the correlation data to the value of the setting value file D2.

Claims

1. A control device for controlling the operation of a plurality of semiconductor wafer production devices for each target wafer, characterized in that: The control device includes a storage unit, a command data generating unit, a received data generating unit, and a communication unit. The storage unit stores a first configuration file, a setting value file, and a second configuration file. The first structure file stores a first identifier of the semiconductor wafer production device, a second identifier of the wafer, an action item of the semiconductor wafer production device, a first step number of the action item, and a destination address corresponding to the action item and the first step. The setting value file stores a work process that establishes a correspondence between the first identifier and the second identifier, the action item, and the first step to show the working conditions of each of the semiconductor chip production devices, or the setting value file stores a work process that establishes a correspondence between the second identifier, the action item, and the first step to show the working conditions of each of the semiconductor chip production devices, The second structure file stores the first identifier, the second identifier, the log item of the semiconductor wafer production device, the second step number of the log item, the specified time interval, and the receiving source address associated with the log item. The command data generating unit is configured to generate command data indicating the working condition of one of the semiconductor wafer production devices before or during operation by establishing a correspondence between the sending destination address and the working process, and output the command data from the communication unit to one of the semiconductor wafer production devices. The receiving data generating unit is configured to obtain log data from one of the semiconductor chip production devices via the communication unit at the prescribed time intervals, sequentially correspond the log data to the second step to generate receiving data showing at least one of the working status of one of the semiconductor chip production devices in operation and the status of the chip, and store the receiving data in the storage unit.

2. The control device according to claim 1, characterized in that: The first structured file and the second structured file are encrypted by a predetermined encryption process.

3. The control device according to claim 1, characterized in that: A predetermined protection process is performed on the first structured file and the second structured file, and the predetermined protection process prohibits at least one of deletion and rewriting.

4. A control system for controlling the operation of a plurality of semiconductor wafer production devices for each target wafer, characterized in that: The control system comprises a control device and a storage unit, wherein the control device comprises a command data generating unit, a received data generating unit and a communication unit. The storage unit stores a first configuration file, a setting value file, and a second configuration file. The first structure file stores a first identifier of the semiconductor wafer production device, a second identifier of the wafer, an action item of the semiconductor wafer production device, a first step number of the action item, and a destination address corresponding to the action item and the first step. The setting value file stores a work process that establishes a correspondence between the first identifier and the second identifier, the action item, and the first step to show the working conditions of each of the semiconductor chip production devices, or the setting value file stores a work process that establishes a correspondence between the second identifier, the action item, and the first step to show the working conditions of each of the semiconductor chip production devices, The second structure file stores the first identifier, the second identifier, the log item of the semiconductor wafer production device, the second step number of the log item, the specified time interval, and the receiving source address associated with the log item. The command data generating unit is configured to generate command data indicating the working condition of one of the semiconductor wafer production devices before or during operation by establishing a correspondence between the sending destination address and the working process, and output the command data from the communication unit to one of the semiconductor wafer production devices. The receiving data generating unit is configured to obtain log data from one of the semiconductor chip production devices via the communication unit at the prescribed time intervals, sequentially correspond the log data to the second step to generate receiving data showing at least one of the working status of one of the semiconductor chip production devices in operation and the status of the chip, and store the receiving data in the storage unit.

5. The control system according to claim 4, characterized in that: The first structured file and the second structured file are encrypted by a predetermined encryption process.

6. The control system according to claim 4, characterized in that: A predetermined protection process is performed on the first structured file and the second structured file, and the predetermined protection process prohibits at least one of deletion and rewriting.

7. A storage medium storing a control program, the control program being readable by a computer and controlling the operation of a plurality of semiconductor wafer production devices for each target wafer, characterized in that: The control program causes the computer to execute the following processing respectively: A command data generation process, wherein a sending destination address is associated with a work process to generate command data showing a working condition of one of the semiconductor wafer production devices before or during operation, wherein the sending destination address is associated with a first identifier of the semiconductor wafer production device, a second identifier of the wafer, an action item of the semiconductor wafer production device, and a first step of the action item, and the work process is associated with the first identifier and the second identifier, the action item, and the first step to show the working condition of each of the semiconductor wafer production devices, or the work process is associated with the second identifier, the action item, and the first step to show the working condition of each of the semiconductor wafer production devices; command data output processing, outputting the command data from the communication unit to one of the semiconductor wafer production devices; receiving data generating processing, acquiring log data from one of the semiconductor wafer production devices via the communication unit at a predetermined time interval, sequentially establishing correspondence between the log data and the second step of the log item to generate receiving data showing at least one of the operating state of one of the semiconductor wafer production devices in operation and the state of the wafer; and The received data storage process stores the received data in the storage unit.

8. The storage medium storing the control program according to claim 7, characterized in that: The storage unit stores a first structure file storing the first identifier, the second identifier, the action item, the first step number of the action item, and the sending destination address, and a second structure file storing the first identifier, the second identifier, the log item, the second step number of the log item, the prescribed time interval, and a receiving source address corresponding to the log item. The first structured file and the second structured file are encrypted by a predetermined encryption process.

9. The storage medium storing the control program according to claim 7, characterized in that: The storage unit stores a first structure file storing the first identifier, the second identifier, the action item, the first step number of the action item, and the sending destination address, and a second structure file storing the first identifier, the second identifier, the log item, the second step number of the log item, the prescribed time interval, and a receiving source address corresponding to the log item. A predetermined protection process is performed on the first structured file and the second structured file, and the predetermined protection process prohibits at least one of deletion and rewriting.

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