Method, system, device and equipment for controlling semiconductor manufacturing equipment

Abstract

The invention discloses a method, system, device and equipment for controlling semiconductor manufacturing equipment, and the method comprises the steps: controlling visual detection equipment to carry out the defect detection of a to-be-processed product at a material processing position under the condition that the material processing position of the semiconductor manufacturing equipment is loaded with the to-be-processed product; inspection result information, corresponding to the material processing position, sent by the visual inspection equipment is obtained, and defect abnormal information included in the inspection result information is sent by the visual inspection equipment under the condition that the ground color identical to the material processing position is detected; and when it is determined that the inspection result information comprises defect abnormal information, operation is stopped, and alarm processing is carried out. Therefore, the defect of the to-be-processed product can be automatically detected, the maintenance cost and the labor cost of the equipment are reduced, and the productivity of the equipment is also improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a method, system, device and equipment for controlling semiconductor manufacturing equipment. Background Art

[0002] With the development of science and technology, semiconductor products have received more and more attention, and the automation level of semiconductor manufacturing equipment has also become higher and higher, including: cleaning equipment, double-sided grinding and polishing equipment (Double Side Polishing, DSP), etching equipment, deposition equipment, etc. Among them, many semiconductor manufacturing equipment require manufacturing auxiliary equipment, such as robot arms, to place the products to be processed in the corresponding material processing position before the corresponding processing is carried out. For example, the robot arm can absorb the wafer and put it into the corresponding material processing position of the DSP.

[0003] At present, regardless of whether the product to be processed loaded at the material processing position is complete, semiconductor manufacturing equipment must perform corresponding processing. However, the product to be processed itself may have defects, or the product to be processed may also have defects during the loading and feeding process. Once the product to be processed has defects, the semiconductor manufacturing equipment still performs processing, which may cause damage to the setting components of the semiconductor manufacturing equipment, while also increasing the equipment's maintenance cost and labor cost, affecting the equipment's production capacity. Summary of the invention

[0004] In order to solve the above problems existing in the prior art, the present invention provides a method, system, device and equipment for controlling semiconductor manufacturing equipment. The technical problem to be solved by the present invention is achieved through the following technical solutions: A first aspect of an embodiment of the present invention provides a method for controlling semiconductor manufacturing equipment, comprising: When it is determined that the product to be processed has been loaded at the material processing position of the semiconductor manufacturing equipment, the visual inspection equipment is controlled to perform defect inspection of the product to be processed at the material processing position; Obtaining inspection result information corresponding to the material processing position sent by the visual inspection device, wherein the defect abnormality information included in the inspection result information is sent by the visual inspection device when the same background color as the material processing position is detected; When it is determined that the inspection result information includes defective and abnormal information, the operation is stopped and an alarm is processed.

[0005] A second aspect of an embodiment of the present invention provides a system for controlling semiconductor manufacturing equipment, comprising: semiconductor equipment, control equipment, and visual inspection equipment, wherein: The control device is configured to control the visual inspection device to perform defect detection on the material processing position when it is determined that the product to be processed has been loaded on the material processing position of the semiconductor manufacturing equipment; obtain the inspection result information corresponding to the material processing position sent by the visual inspection device; and stop the operation and perform alarm processing when it is determined that the inspection result information includes defect abnormality information; The visual inspection device is configured to perform defect detection on the material processing position, and send inspection result information including defect abnormality information when the same background color as the material processing position is detected.

[0006] A third aspect of an embodiment of the present invention provides a device for controlling semiconductor manufacturing equipment, comprising: The first control module is configured to control the visual inspection device to perform defect detection of the product to be processed at the material processing position when it is determined that the product to be processed has been loaded at the material processing position of the semiconductor manufacturing equipment; The detection acquisition module is configured to acquire the inspection result information corresponding to the material processing position sent by the visual inspection device, wherein the defect abnormality information included in the inspection result information is sent by the visual inspection device when the same background color as the material processing position is detected; The second control module is configured to stop running and perform alarm processing when it is determined that the inspection result information includes defective abnormal information.

[0007] A fourth aspect of an embodiment of the present invention provides a device for controlling semiconductor manufacturing equipment, the device comprising a processor and a memory storing program instructions, the processor being configured to execute the above-mentioned method for controlling semiconductor manufacturing equipment when executing the program instructions.

[0008] A fourth aspect of an embodiment of the present invention provides a device for controlling semiconductor manufacturing equipment, comprising: a device body; and the above-mentioned device for controlling semiconductor manufacturing equipment, which is installed on the device body.

[0009] Beneficial effects of the present invention: In the semiconductor manufacturing process, after the material processing position of the semiconductor manufacturing equipment has been loaded with the product to be processed, the visual inspection equipment can be controlled to perform defect detection on the material processing position for the product to be processed, and when it is determined that the product to be processed has defects, a shutdown alarm is performed. In this way, automatic detection of defects in the product to be processed can be achieved, reducing the probability of damage to the set components of the semiconductor manufacturing equipment due to continuous processing. At the same time, it also reduces the maintenance cost and labor cost of the equipment and improves the production capacity of the equipment.

[0010] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description, claims, and drawings.

[0011] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 A schematic diagram of a system structure for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention; Figure 2 A schematic flow chart of a method for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention; Figure 3 A schematic diagram of a DSP feeding structure provided by an embodiment of the present invention; Figure 4 A schematic flow chart of a method for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention; Figure 5 A schematic diagram of the structure of a semiconductor manufacturing control device provided by an embodiment of the present invention; Figure 6 A schematic diagram of the structure of a semiconductor manufacturing control device provided by an embodiment of the present invention; Figure 7 A schematic diagram of a control device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0013] The present invention is further described in detail below with reference to specific embodiments, but the embodiments of the present invention are not limited thereto.

[0014] With the development of science and technology, the automation level of semiconductor product manufacturing equipment, such as cleaning equipment, double-sided grinding and polishing equipment (DSP), etching equipment, deposition equipment, etc., is getting higher and higher. Among them, cleaning equipment, DSP, etching equipment, etc. need to put the products to be processed into the corresponding material processing positions in the semiconductor manufacturing equipment, that is, loading. Generally, automatic loading can be performed through manufacturing auxiliary equipment, such as robot arms. In an embodiment of the present invention, in the semiconductor manufacturing process, after the material processing position of the semiconductor manufacturing equipment has been loaded with the products to be processed, the visual inspection equipment can be controlled to perform defect detection of the products to be processed at the material processing position, and when it is determined that the products to be processed have defects, the shutdown alarm processing is performed. In this way, the probability of damage to the setting components of the semiconductor manufacturing equipment due to continuous processing is reduced, and at the same time, the maintenance cost and labor cost of the equipment are reduced, and the production capacity of the equipment is also improved.

[0015] like Figure 1 As shown, a first aspect of an embodiment of the present invention provides a system for controlling semiconductor manufacturing equipment, including: semiconductor manufacturing equipment 100, a control device 200, and a visual inspection device 300.

[0016] The semiconductor manufacturing equipment 100 may be a DSP, an etching device, a deposition device, etc. The control device 200 may be a device at the front end of the DSP (Equipment Front End Module, EFEM), or other devices with control capabilities, such as a desktop computer, a handheld tablet computer, etc. The visual inspection device 300 may include one, two or more cameras, so that the corresponding image information of the inspected area can be obtained, and the corresponding image analysis can be performed to obtain the corresponding inspection results.

[0017] The semiconductor manufacturing equipment 100 and the control equipment 200 may be connected by wire or wirelessly to perform data communication, and the semiconductor manufacturing equipment 100 and the visual inspection equipment 300 may also be connected by wire or wirelessly to perform data communication.

[0018] Therefore, in the embodiment of the present invention, the control device 200 is configured to, when it is determined that the material processing position of the semiconductor manufacturing equipment 100 has been loaded with the product to be processed, control the visual inspection device 300 to perform defect detection on the material processing position of the product to be processed; obtain the inspection result information corresponding to the material processing position sent by the visual inspection device 300; when it is determined that the inspection result information includes defect abnormality information, stop the operation and perform alarm processing; the visual inspection device 300 is configured to perform defect detection on the material processing position, and when the background color identical to that of the material processing position is detected, send the inspection result information including defect abnormality information.

[0019] Since the semiconductor manufacturing equipment 100 can process semiconductor products, for example, the DSP can perform double-sided grinding and polishing on a wafer, in some embodiments, Figure 1 As shown, the system for controlling semiconductor manufacturing equipment may also include: manufacturing auxiliary equipment 400, which is configured to absorb the product to be processed from the loading buffer and place it in the material processing position corresponding to the semiconductor manufacturing equipment. That is, the manufacturing auxiliary equipment 400 can be used to place the product to be processed in the material processing position corresponding to the semiconductor manufacturing equipment, or to take out the processed product from the material processing position of the semiconductor manufacturing equipment, and then load or unload the material. The manufacturing auxiliary equipment 400 may include: a robot arm or a robot, etc. Of course, it can also be other equipment for assisting semiconductor production. The control device 200 can also be connected to the manufacturing auxiliary equipment 400 by wire or wireless, so as to perform data communication.

[0020] In a system for controlling semiconductor manufacturing equipment, the control device 200 can control two or more of the semiconductor manufacturing equipment 100, the visual inspection equipment 300 and the manufacturing support equipment 400 to automatically implement defect detection of products to be processed in the semiconductor manufacturing equipment.

[0021] Combination Figure 1 The system for controlling semiconductor manufacturing equipment shown in the figure, the embodiment of the present invention provides a method for controlling semiconductor manufacturing equipment, such as Figure 2 As shown, the process of semiconductor manufacturing equipment control includes: Step 201: When it is determined that the material processing position of the semiconductor manufacturing equipment has been loaded with the product to be processed, control the visual inspection equipment to perform defect inspection on the product to be processed at the material processing position.

[0022] There may be many types of semiconductor manufacturing equipment, such as cleaning equipment, grinding and polishing equipment, etching equipment, deposition equipment, etc. These equipments have corresponding processing areas, which can be used to place the products to be processed, and then carry out the corresponding processing.

[0023] Among them, some semiconductor manufacturing equipment may have only one processing area, and there is only one material processing position in the processing area, or some semiconductor manufacturing equipment may have only one processing area, but there are one, two or more material processing positions in the processing area, or some semiconductor manufacturing equipment may have one, two or more processing areas, and there is one, two or more material processing positions in each processing area.

[0024] For example: semiconductor manufacturing equipment is DSP, such as Figure 3As shown, DSP has five processing areas, namely Carrier1, Carrier2, Carrier3, Carrier4 and Carrier5. These five processing areas can form a processing truncated table, i.e., the lower grinding plate. The angle between each two adjacent processing areas can be 72°, and each processing area has three material processing positions, namely, Hole1, Hole2 and Hole3. Each material processing position can hold a wafer, and the wafers in each material processing position can be defined as Wafer 1, Wafer 2 and Wafer 3, respectively. Thus, there are 15 material processing positions in DSP.

[0025] The products to be processed can be placed manually into the material processing position, or, in some embodiments, can be automatically loaded through manufacturing auxiliary equipment. In this way, determining that the material processing position of the semiconductor manufacturing equipment has been loaded with the products to be processed includes: controlling the manufacturing auxiliary equipment to absorb the products to be processed from the loading buffer and place them in the material processing position corresponding to the semiconductor manufacturing equipment; upon receiving the material discharge completion signal sent by the manufacturing auxiliary equipment, determining that the material processing position of the semiconductor manufacturing equipment has been loaded with the products to be processed.

[0026] During the loading process of the semiconductor manufacturing equipment, the control device can send a loading instruction to the manufacturing auxiliary equipment, so that the manufacturing auxiliary equipment can absorb the products to be processed from the loading buffer according to the received loading instruction and place them at the corresponding material processing position of the semiconductor manufacturing equipment.

[0027] Since semiconductor manufacturing equipment may have two or more material processing positions, in some embodiments, controlling a manufacturing auxiliary device to absorb products to be processed from a loading buffer and place them at a material processing position corresponding to the semiconductor manufacturing equipment includes: upon determining that the manufacturing auxiliary device corresponds to a first processing area of ​​the semiconductor manufacturing equipment, sending a first material discharge instruction to the manufacturing auxiliary device so that the manufacturing auxiliary device absorbs one or more products to be processed from the loading buffer and places them at the first processing area of ​​the semiconductor manufacturing equipment, wherein the first processing area has one or more material processing positions; upon receiving a first area discharge completion signal sent by the manufacturing auxiliary device, controlling the semiconductor manufacturing equipment to rotate the processing area so that the second processing area corresponds to the manufacturing auxiliary device.

[0028] The control device can control the manufacturing auxiliary equipment and the semiconductor manufacturing equipment so that the manufacturing auxiliary equipment corresponds to the first processing area of ​​the semiconductor manufacturing equipment. Then, the control device sends a first material discharge instruction to the auxiliary equipment, so that the manufacturing auxiliary equipment absorbs the product to be processed from the loading buffer and places it in the material processing position of the first processing area. Among them, if the first processing area has two or more material processing positions, then the manufacturing auxiliary equipment can also absorb two or more products to be processed at the same time and place them in the corresponding material processing positions in the first processing area, that is, the manufacturing auxiliary equipment can feed one processing area at one time. Of course, the present invention may not be limited to this. The manufacturing auxiliary equipment can also feed one processing area twice or more times.

[0029] After the manufacturing auxiliary equipment completes loading the first processing area, it can send a signal to the control device that the first area is discharged. In this way, the control device can control the semiconductor manufacturing equipment so that the second processing area of ​​the semiconductor manufacturing equipment corresponds to the manufacturing auxiliary equipment. Then, the control device continues to control the manufacturing auxiliary equipment, so that the manufacturing auxiliary equipment can also load the second processing area once, twice or multiple times. According to the above process, each material processing position in each processing area of ​​the semiconductor manufacturing equipment is placed with a corresponding product to be processed. Alternatively, according to the application scenario requirements, some material processing positions in some processing areas of the semiconductor manufacturing equipment are placed with corresponding products to be processed.

[0030] like Figure 3As shown, DSP has five processing areas, namely Carrier1, Carrier2, Carrier3, Carrier4 and Carrier5, and each processing area has three material processing positions, namely Hole1, Hole2 and Hole3. The manufacturing auxiliary equipment may include a robot 1, corresponding to each processing area. Robot 1 has three suction cups, namely Sucker1, Sucker2 and Sucker3, which suck wafer 1, wafer 2 and wafer 3 respectively. In this way, after starting the operation, Carrier1 in DSP corresponds to robot 1, so that DSP EFEM can send the first material discharge instruction to robot 1, and robot 1 can then absorb three wafers from the loading buffer Loadbuffer and put them into Hole1, Hole2 and Hole3 of Carrier1. After the placement is completed, robot 1 sends a first area discharge completion signal to DSP EFEM, so that DSP EFEM controls DSP to rotate the processing area, and the lower grinding disc can be rotated 72° clockwise. In this way, Carrier 2 corresponds to Robot 1, that is, Robot 2 can load Carrier 2. This cycle is repeated until a total of 15 wafers are placed in 5 carriers. The 15 wafers are grabbed by Robot 1 from Loadbuffer 1, Loadbuffer 2 and Loadbuffer 3. Loadbuffer 1, Loadbuffer 2 and Loadbuffer 3 each have 5 wafers.

[0031] According to the scene requirements, after the material processing position of the semiconductor manufacturing equipment has been loaded with the product to be processed, the manufacturing auxiliary equipment can send a discharge completion signal to the control device, or after manual loading is completed, the discharge completion signal can also be sent to the control device through the human-computer interaction interface or terminal. Therefore, after receiving the discharge completion signal, the control device can determine that the material processing position of the semiconductor manufacturing equipment has been loaded with the product to be processed. At this time, the control device can control the visual inspection device to perform defect detection of the product to be processed at the material processing position.

[0032] The visual inspection equipment is equipped with a camera that can collect image information within the action area and perform image analysis on the collected image information to obtain corresponding inspection results.

[0033] Some manufacturing auxiliary equipment has only one processing area, and the processing area has only one or two material processing positions. In this way, the visual inspection equipment can be configured with only one camera, and the effective area of ​​the camera can cover each material processing position, that is, the control device can control the camera on the visual inspection equipment to collect image information of each material processing position loaded with the product to be processed, and perform image analysis based on the collected image information to obtain corresponding inspection results.

[0034] Some manufacturing auxiliary equipment has only one processing area, but the processing area has only two or more material processing positions, or some manufacturing auxiliary equipment has one or more processing areas, and each processing area has one or more material processing positions. At this time, the action area of ​​one camera of the visual inspection equipment cannot cover each material processing position. Therefore, the visual inspection equipment may be configured with two or more cameras, and these two or more cameras can be used to detect defects of the product to be processed at the material processing position. In some embodiments, controlling the visual inspection equipment to detect defects of the product to be processed at the material processing position includes: when there are two or more material processing positions in the current processing area, controlling the first camera in the visual inspection equipment to capture first image information of one or more material processing positions in the current processing area; when it is determined that the first camera has completed shooting, controlling the semiconductor manufacturing equipment to rotate the processing area so that other material processing positions in the current processing area correspond to the shooting area of ​​the second camera in the visual inspection equipment, and controlling the second camera in the visual inspection equipment to capture second image information of other material processing positions.

[0035] DSP has five processing areas, and each processing area has three material processing positions. In this way, DSPEFEM can send a detection instruction to the visual inspection device, thereby triggering the first camera in the visual inspection device. In this way, the first camera can shoot the two holes in the current processing area, that is, the current carrier, to obtain the first image information. Then, when it is determined that the first camera has completed shooting, DSP EFEM controls DSP to rotate the lower grinding disk clockwise for 72°, and then triggers the second camera in the visual inspection device. In this way, the second camera can shoot another hole in the current carrier to obtain the second image information. Therefore, the visual inspection device can complete the defect detection of the product to be processed in a group of material processing positions.

[0036] Step 202: Obtain inspection result information corresponding to the material processing position sent by the visual inspection device, wherein the defect abnormality information included in the inspection result information is sent by the visual inspection device when a background color identical to the material processing position is detected.

[0037] Generally, the background color of the material processing position of semiconductor manufacturing equipment is inconsistent with the color of the product to be processed. In this way, after the product to be processed is loaded into the material processing position, the camera of the visual inspection equipment can only see the color of the product to be processed after acquiring the image, but cannot see the chassis color of the material processing position, i.e., the background color. If the acquired image information includes the background color of the material processing position, then it can be indicated that the product to be processed placed at the material processing position has defects, and the defects of the product to be processed can be detected through color analysis.

[0038] As in the above example, the chassis PAD color of the material processing position of the DSP, that is, the background color is white, and the product to be processed, that is, the wafer, is black. If black wafers are loaded on all 15 holes of the DSP, then when the visual inspection device performs defect detection, if there is white information in the image information obtained by the camera, it means that the wafer corresponding to the white information is defective, that is, the visual inspection device can send the inspection result including the defect abnormality information to the control device. If there is no white information in the image information obtained by the camera, then the inspection result sent by the visual inspection device to the control device does not include the defect abnormality information.

[0039] In some embodiments, the visual inspection device sends inspection result information corresponding to each material processing position, including: when the same background color as the material processing position is detected in the image information detected by the defect, the visual inspection device determines the current material processing position corresponding to the background color; through the current communication address corresponding to the current material processing position, the visual inspection device sends the defect abnormality information.

[0040] The control device can communicate with the visual inspection device, and in some embodiments, in an image information taken by each camera in the visual inspection device, different material processing positions correspond to different communication addresses. Therefore, after the visual inspection device determines the current material processing position corresponding to the background color in the image information, the visual inspection device can send defect abnormality information through the current communication address corresponding to the current material processing position.

[0041] For example: if there is white information in the current image information detected by the DSP, the current hole corresponding to the white information is determined, and the corresponding inspection result is determined to be "1". If there is no white information in the current image information detected, the inspection result corresponding to each hole in the image information is "0". The three holes in the Carrier of any processing area of ​​the DSP have a separate communication address, which are defined as communication address 1, communication address 2 and communication address 3 respectively, and are used for the DSP EFEM to receive the inspection results sent by the visual inspection equipment. Among them, if a defect is detected in wafer 1 placed on hole 1, the visual inspection equipment sends "1" to the DSP EFEM through its communication address 1; if no defect is detected in wafer 1 placed on hole 1, the visual inspection equipment sends "0" to the DSP EFEM through its communication address 1; the inspection of wafer 2 and wafer 3 is the same, so I will not repeat them one by one.

[0042] Step 203: When it is determined that the inspection result information includes defective abnormal information, the operation is stopped and an alarm is processed.

[0043] The inspection result information obtained by the control device includes defect abnormality information, which can determine that the product to be processed has defects. At this time, the control device shuts down, and can also control the semiconductor manufacturing equipment to shut down, and can perform corresponding alarm processing. The defect alarm of the product to be processed can be prompted by one or more of the following methods, such as the indicator light turns red, the buzzer sounds, and the touch screen text prompts.

[0044] As mentioned above, if DSP EFEM receives inspection result information including "1", it can be determined that the wafer is defective and DSP cannot process the wafer. At this time, DSP EFEM can send a stop operation instruction to DSP, and can issue a defect alarm through a buzzer sound and a touch screen text prompt.

[0045] It can be seen that in the embodiment of the present invention, during the semiconductor manufacturing process, after the material processing position of the semiconductor manufacturing equipment has been loaded with the product to be processed, the visual inspection equipment can be controlled to perform defect detection of the product to be processed at the material processing position, and when it is determined that the product to be processed has a defect, a shutdown alarm is performed. In this way, automatic detection of defects in the product to be processed can be achieved, reducing the probability of damage to the setting components of the semiconductor manufacturing equipment due to continuous processing. At the same time, the maintenance cost and labor cost of the equipment are reduced, and the production capacity of the equipment is improved.

[0046] The following is an example of a specific process for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention.

[0047] like Figure 3 As shown, the semiconductor manufacturing equipment control may be DSP, and there are five processing areas on the lower grinding disc, namely Carrier1, Carrier2, Carrier3, Carrier4 and Carrier5. The angle between each two adjacent processing areas can be 72°, and each processing area has three material processing positions, namely Hole1, Hole2 and Hole3. The manufacturing auxiliary equipment includes robot 1, corresponding to each processing area, and there are three suction cups on robot 1, namely Sucker1, Sucker2 and Sucker3, which suck wafer 1, wafer 2 and wafer 3 respectively. The control device may be DSP EFEM. There are two cameras on the visual inspection equipment.

[0048] like Figure 4 As shown, the process of semiconductor manufacturing equipment control may include: Step 401: DSP EFEM, DSP, and robot 1 are started and run respectively.

[0049] Step 402: DSP EFEM determines a carrier at a position corresponding to robot 1 in DSP as the current carrier.

[0050] Step 403: DSP EFEM sends the current material placement instruction to robot 1, so that robot 1 absorbs three wafers from the loading buffer Loadbuffer and places them into Hole 1, Hole 2 and Hole 3 of the current carrier.

[0051] Step 404: DSP EFEM determines whether it has received the material discharge completion signal sent by robot 1. If so, execute step 405; otherwise, return to step 404.

[0052] Step 405: The DSP EFEM controls the DSP to rotate the lower grinding disc 72° clockwise.

[0053] Step 406: DSP EFEM determines whether all carriers have been loaded. If yes, execute step 407; otherwise, return to step 402.

[0054] Step 407: DSP EFEM controls the robot 1 to leave the set area, and controls the visual inspection device to start and run to the corresponding area.

[0055] Step 408: The DSP EFEM determines a carrier at a position in the DSP corresponding to the first camera in the visual inspection device as the current carrier.

[0056] Step 409: the DSP EFEM controls the first camera in the visual inspection device to capture first image information, wherein the first image information includes: two holes on the current carrier.

[0057] Step 410: DSP EFEM receives the inspection result information returned by the visual inspection equipment through the communication address corresponding to each Hole.

[0058] Among them, if white is detected on the first image information, the visual inspection device determines the current hole corresponding to white, and then sends "1" to the DSP EFEM through the current communication address corresponding to the current hole. If white is not detected on the first image information, the visual inspection device sends "0" to the DSP EFEM through the communication addresses corresponding to the two holes respectively. The inspection result information includes: "00", "01", "10", or "11".

[0059] Step 411: Determine whether the inspection result information includes "1". If yes, execute step 412; otherwise, execute step 413.

[0060] Step 412: The DSP EFEM controls the DSP to stop running, and issues a wafer defect alarm by turning on the indicator light in red, the buzzer sounding, and the touch screen providing a text prompt.

[0061] Step 413: the DSP EFEM controls the DSP to rotate the lower grinding disc 72° clockwise, and controls the second camera to capture second image information, wherein the second image information includes: image information of another hole on the current carrier.

[0062] Step 414: DSP EFEM receives the inspection result information returned by the visual inspection equipment through the communication address corresponding to each Hole.

[0063] Among them, if white is detected on the second image information, the visual inspection device will send "1" to the DSP EFEM through the current communication address corresponding to the hole. If white is not detected on the second image information, the visual inspection device will send "0" to the DSP EFEM through the communication address corresponding to the hole. The inspection result information includes: "0" or "1".

[0064] Step 415: DSP EFEM determines whether the inspection result information includes "1". If yes, execute step 412; otherwise, execute step 416.

[0065] Step 416: DSP EFEM determines whether all carriers have been defect-checked. If so, this process ends. Otherwise, it returns to step 408.

[0066] It can be seen that in this embodiment, during the wafer manufacturing process, after the wafer is placed in the hole of the DSP, the visual inspection equipment can be controlled to perform wafer defect detection, and when it is determined that the wafer has a defect, the DSP is controlled to shut down and perform alarm processing. In this way, automatic detection of wafer defects can be achieved, reducing the probability of damage to the lower grinding disk in the DSP due to continuous processing. At the same time, it also reduces the maintenance cost and labor cost of the equipment and improves the production capacity of the equipment.

[0067] According to the above-mentioned process of semiconductor manufacturing control, a device for controlling semiconductor manufacturing equipment can be constructed. Figure 5 A device for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention can be applied to a control device for a semiconductor manufacturing equipment control system, such as Figure 5 As shown, the device 500 includes: a first control module 510 , a detection and acquisition module 520 and a second control module 530 .

[0068] The first control module 510 is configured to control the visual inspection device to perform defect detection on the material processing position when it is determined that the material processing position of the semiconductor manufacturing equipment has been loaded with the product to be processed.

[0069] The detection acquisition module 520 is configured to obtain the inspection result information corresponding to each material processing position sent by the visual inspection equipment, wherein the defect abnormality information included in the inspection result information is sent by the visual inspection equipment when the same background color as the material processing position is detected.

[0070] The second control module 530 is configured to stop running and perform alarm processing when it is determined that the inspection result information includes defective abnormal information.

[0071] In some embodiments, the apparatus further comprises: The loading control module is configured to control the manufacturing auxiliary equipment to absorb the products to be processed from the loading buffer and place them at the corresponding material processing position of the semiconductor manufacturing equipment.

[0072] The state determination module is configured to determine that the material processing position of the semiconductor manufacturing equipment has been loaded with the product to be processed when receiving the material discharge completion signal sent by the manufacturing auxiliary equipment.

[0073] In some embodiments, the loading control module is specifically configured to send a first material discharge instruction to the manufacturing auxiliary equipment when it is determined that the manufacturing auxiliary equipment corresponds to the first processing area of ​​the semiconductor manufacturing equipment, so that the manufacturing auxiliary equipment absorbs one or more products to be processed from the loading buffer and places them in the first processing area of ​​the semiconductor manufacturing equipment, wherein the first processing area has one or more material processing positions; and when receiving the first area material discharge completion signal sent by the manufacturing auxiliary equipment, control the semiconductor manufacturing equipment to rotate the processing area so that the second processing area corresponds to the manufacturing auxiliary equipment.

[0074] In some embodiments, the first control module 510 includes: A first control unit is configured to control a first camera in the visual inspection device to capture first image information of one or more material processing positions in the current processing area when there are two or more material processing positions in the current processing area; The second control unit is configured to control the semiconductor manufacturing equipment to rotate the processing area when it is determined that the first camera has completed shooting, so that other material processing positions in the current processing area correspond to the shooting area of ​​the second camera in the visual inspection equipment, and control the second camera in the visual inspection equipment to capture second image information of other material processing positions.

[0075] It can be seen that in the embodiment of the present invention, during the semiconductor manufacturing process, after the material processing position of the semiconductor manufacturing equipment has been loaded with the product to be processed, the device for controlling the semiconductor manufacturing equipment can control the visual inspection equipment to perform defect detection on the material processing position of the product to be processed, and when it is determined that the product to be processed has a defect, a shutdown alarm is performed. In this way, automatic detection of defects in the product to be processed can be achieved, reducing the probability of damage to the setting components of the semiconductor manufacturing equipment due to continuous processing. At the same time, the maintenance cost and labor cost of the equipment are reduced, and the production capacity of the equipment is also improved.

[0076] Combination Figure 6 , an embodiment of the present invention provides a device 600 for controlling semiconductor manufacturing equipment, comprising: The processor 1000 and the memory 1001 may also include a communication interface 1002 and a bus 1003. The processor 1000, the communication interface 1002, and the memory 1001 may communicate with each other through the bus 1003. The communication interface 1002 may be used for information transmission. The processor 1000 may call the logic instructions in the memory 1001 to execute the method for controlling semiconductor manufacturing equipment of the above embodiment.

[0077] In addition, the logic instructions in the above-mentioned memory 1001 can be implemented in the form of software functional units and can be stored in a computer-readable storage medium when sold or used as an independent product.

[0078] The memory 1001 is a computer-readable storage medium that can be used to store software programs and computer executable programs, such as program instructions / modules corresponding to the method in the embodiment of the present invention. The processor 1000 executes functional applications and data processing by running the program instructions / modules stored in the memory 1001, that is, implements the method for controlling semiconductor manufacturing equipment in the above method embodiment.

[0079] The memory 1001 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and an application required for at least one function; the data storage area may store data created according to the use of the terminal device, etc. In addition, the memory 1001 may include a high-speed random access memory and may also include a non-volatile memory.

[0080] An embodiment of the present invention provides an apparatus for controlling semiconductor manufacturing equipment, comprising: a processor and a memory storing program instructions, wherein the processor is configured to execute a method for controlling semiconductor manufacturing equipment when executing the program instructions.

[0081] An embodiment of the present invention provides a storage medium storing program instructions, which, when run, execute the above-mentioned method for controlling semiconductor manufacturing equipment.

[0082] The embodiment of the present invention provides a system for controlling semiconductor manufacturing equipment, comprising: semiconductor manufacturing equipment, control equipment and visual inspection equipment, in combination with Figure 7 , the control device includes: an equipment body 700; and the above-mentioned device 500 (600) for controlling semiconductor manufacturing equipment. The device 500 (600) for controlling semiconductor manufacturing equipment is installed in the equipment body. The installation relationship described here is not limited to placement inside the product, but also includes installation connections with other components of the product, including but not limited to physical connections, electrical connections or signal transmission connections. It can be understood by those skilled in the art that the device 500 (600) for controlling semiconductor manufacturing equipment can be adapted to a feasible equipment body, thereby realizing other feasible embodiments.

[0083] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0084] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0085] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0086] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A method for controlling semiconductor manufacturing equipment, characterized in that: include: When it is determined that the product to be processed has been loaded at the material processing position of the semiconductor manufacturing equipment, the visual inspection equipment is controlled to perform defect inspection of the product to be processed at the material processing position; Obtaining inspection result information corresponding to the material processing position sent by the visual inspection device, wherein the defect abnormality information included in the inspection result information is sent by the visual inspection device when the same background color as the material processing position is detected; When it is determined that the inspection result information includes defective and abnormal information, the operation is stopped and an alarm is processed.

2. The method according to claim 1, characterized in that Determining that a material processing position of a semiconductor manufacturing device has been loaded with a product to be processed includes: Control the manufacturing auxiliary equipment to absorb the products to be processed from the loading buffer and place them at the corresponding material processing position of the semiconductor manufacturing equipment; When a material discharge completion signal sent by the manufacturing auxiliary equipment is received, it is determined that the material processing position of the semiconductor manufacturing equipment has been loaded with the product to be processed.

3. The method according to claim 2, characterized in that The controlling of the manufacturing auxiliary equipment to absorb the product to be processed from the loading buffer and place it at the material processing position corresponding to the semiconductor manufacturing equipment includes: When it is determined that the manufacturing auxiliary equipment corresponds to the first processing area of ​​the semiconductor manufacturing equipment, a first material placement instruction is sent to the manufacturing auxiliary equipment, so that the manufacturing auxiliary equipment absorbs one or more products to be processed from the loading buffer and places them in the first processing area of ​​the semiconductor manufacturing equipment, wherein the first processing area has one or more material processing positions; When receiving a first area material discharge completion signal sent by the manufacturing auxiliary equipment, the semiconductor manufacturing equipment is controlled to rotate the processing area so that the second processing area corresponds to the manufacturing auxiliary equipment.

4. The method according to claim 1, characterized in that The controlling of the visual inspection device to perform defect detection of the product to be processed at the material processing position comprises: When there are two or more material processing positions in the current processing area, control the first camera in the visual inspection device to capture first image information of one or more material processing positions in the current processing area; When it is determined that the first camera has completed shooting, the semiconductor manufacturing equipment is controlled to rotate the processing area so that other material processing positions in the current processing area correspond to the shooting area of ​​the second camera in the visual inspection equipment, and the second camera in the visual inspection equipment is controlled to capture second image information of other material processing positions.

5. The method according to claim 1, characterized in that The visual inspection device sends inspection result information corresponding to the material processing position including: In the case where the same background color as the material processing position is detected in the defect detected image information, the visual inspection device determines the current material processing position corresponding to the background color; The visual inspection device sends defect anomaly information through the current communication address corresponding to the current material processing position.

6. A system for controlling semiconductor manufacturing equipment, characterized in that: include: Semiconductor equipment, control equipment, visual inspection equipment, among which, The control device is configured to, when it is determined that the material processing position of the semiconductor manufacturing equipment has been loaded with the product to be processed, control the visual inspection device to perform defect detection on the material processing position of the product to be processed; obtain the inspection result information corresponding to the material processing position sent by the visual inspection device; when it is determined that the inspection result information includes defect abnormality information, stop the operation and perform alarm processing; The visual inspection device is configured to perform defect detection on the material processing position, and send inspection result information including defect abnormality information when the same background color as the material processing position is detected.

7. The system according to claim 6, characterized in that Also includes: The manufacturing auxiliary equipment is configured to absorb the products to be processed from the loading buffer and place them at the corresponding material processing position of the semiconductor manufacturing equipment.

8. A device for controlling semiconductor manufacturing equipment, characterized in that: include: A first control module is configured to control the visual inspection device to perform defect detection on the material processing position when it is determined that the material processing position of the semiconductor manufacturing equipment has been loaded with the product to be processed; The detection acquisition module is configured to acquire the inspection result information corresponding to each material processing position sent by the visual inspection device, wherein the defect abnormality information included in the inspection result information is sent by the visual inspection device when the same background color as the material processing position is detected; The second control module is configured to stop running and perform alarm processing when it is determined that the inspection result information includes defective abnormal information.

9. A device for controlling semiconductor manufacturing equipment, the device comprising a processor and a memory storing program instructions, characterized in that: The processor is configured to perform the method for controlling semiconductor manufacturing equipment according to any one of claims 1 to 5 when executing the program instructions.

10. A device for controlling semiconductor manufacturing equipment, wherein: Equipment includes: Equipment body; The device for controlling semiconductor manufacturing equipment according to claim 8 or 9 is installed in the equipment body.

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