Antenna unit structure applied to base station

Abstract

The invention provides an active antenna unit structure applied to a base station. Comprising an upper casing assembly, a lower casing assembly, and a transceiver board and an antenna assembly which are packaged between the upper casing assembly and the lower casing assembly. The upper casing assembly and the lower casing assembly are provided with heat dissipation teeth located in the packaging outer environment, the transceiving board is integrated with at least one of a transceiving chip, a power supply, a filter and a power amplifier, and at least one of the transceiving chip, the power supply, the filter and the power amplifier is in contact with the lower casing assembly and / or the upper casing assembly through a heat conduction material. Heat dissipation is carried out through the heat dissipation teeth of the lower machine shell assembly and / or the upper machine shell assembly. Compared with an active antenna unit of a traditional framework, the active antenna unit structure can reduce the influence of a thermal cascade effect on heat dissipation of a whole machine, heat of components such as a transceiver chip, a power supply, a filter and a power amplifier is conducted to the external environment more efficiently, and the whole machine is lighter under the same heat dissipation capacity.

Description

Technical Field

[0001] The present application relates to the technical field of communication equipment, and in particular to an active antenna unit structure applied to a base station. Background Art

[0002] Massive MIMO is one of the key technologies in the 5G era. It is used to control the phase and amplitude of the transmitted (or received) signal of each antenna channel to generate a directional beam to enhance the signal in the direction of the beam and compensate for the wireless propagation loss to obtain the beamforming gain. The beamforming gain can be used to improve the coverage of the cell, such as wide-area coverage, deep coverage, and high-rise coverage. However, MIMO technology also makes the whole machine have higher output power and heat consumption, which brings greater challenges to heat dissipation.

[0003] At present, the common base station active antenna units are encapsulated and protected by casings. However, as operators continue to increase their requirements for miniaturization and lightweighting of base stations, the integration and heat flux density of the active antenna unit transceiver board continue to increase, and the "thermal cascade effect" caused by heat dissipation becomes more and more serious, which cannot meet the heat dissipation requirements of high-power base station products.

[0004] To this end, under the development trend of miniaturization and lightweight of base stations, how to alleviate the "thermal cascade effect" caused by single-sided heat dissipation of the casing, so as to meet the heat dissipation requirements of high-power base station products with lighter overall weight and smaller overall volume is the technical problem to be solved by this application. Summary of the invention

[0005] The purpose of this application is to provide an active antenna unit structure applied to a base station, which can reduce the adverse effects of the "thermal cascade effect" on the heat dissipation of the whole machine, and achieve efficient heat dissipation with a lighter whole machine weight and a smaller whole machine volume.

[0006] In order to achieve the above-mentioned object, an embodiment of the present application provides an active antenna unit structure applied to a base station, comprising: an upper housing component, a lower housing component, and a transceiver board encapsulated between the upper housing component and the lower housing component; wherein:

[0007] The upper housing component and the lower housing component are provided with heat dissipation teeth located in the environment outside the package, and the transceiver board integrates at least one of a transceiver chip, a power supply, a filter and a power amplifier. At least one of the transceiver chip, the power supply, the filter and the power amplifier is in contact with the lower housing component and / or the upper housing component through a thermally conductive material so as to dissipate heat through the heat dissipation teeth of the lower housing component and / or the upper housing component.

[0008] The active antenna unit structure of the present application includes an upper housing component, a lower housing component, and a transceiver board encapsulated between the upper housing component and the lower housing component. The upper housing component and the lower housing component are provided with heat dissipation teeth located in the environment outside the package; the transceiver board integrates the main heat-generating components such as transceiver chips, power supplies, filters and power amplifiers. Among them, these components are in contact with the lower housing component and / or the upper housing component through heat-conducting materials, so as to dissipate heat to the external environment of the package with the help of the heat dissipation teeth provided by the lower housing component and / or the upper housing component. Compared with the active antenna unit of the traditional architecture, the active antenna unit structure of the present application can effectively reduce the influence of the "thermal cascade effect" on the heat dissipation of the whole machine, and efficiently transfer the heat of components such as transceiver chips, power supplies, filters and power amplifiers to the external environment. Under the same heat consumption conditions, the heat dissipation requirements can be met with shorter heat dissipation teeth, so that the whole machine has a lighter weight and a smaller volume. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0010] Figure 1 It is a three-dimensional schematic diagram of the active antenna unit structure of an embodiment of the present application.

[0011] Figure 2 It is a schematic diagram of the arrangement between the upper casing component, the lower casing component and the heat dissipation teeth in the active antenna unit structure of an embodiment of the present application.

[0012] Figure 3 It is a two-dimensional schematic diagram of heat dissipation of a transceiver board in an active antenna unit structure of an embodiment of the present application.

[0013] Figure 4 It is a schematic diagram of the structural relationship between the upper housing component and the antenna component in the active antenna unit structure of an embodiment of the present application.

[0014] Figure 5 It is a schematic diagram of the structural relationship between the upper casing assembly and the piezoelectric fan of an embodiment of the present application. DETAILED DESCRIPTION

[0015] As mentioned above, currently common base station active antenna units use a single-sided housing with heat dissipation teeth to encapsulate and protect the transceiver board and dissipate heat from the components on the board. As operators continue to increase their requirements for miniaturization and lightweighting of base stations, the integration and heat flux density of transceiver boards continue to increase, and the "thermal cascade effect" generated by heat dissipation becomes more and more serious, which cannot meet the heat dissipation requirements of high-power base station products.

[0016] To this end, the present application aims to provide an active antenna unit structure applied to a base station, which can reduce the adverse effects of the "thermal cascade effect" on the heat dissipation of the whole machine, and achieve efficient heat dissipation with a lighter whole machine weight and a smaller whole machine volume. Specifically, the active antenna unit structure of the present application includes: an upper housing assembly, a lower housing assembly, and a transceiver board encapsulated between the upper housing assembly and the lower housing assembly. The upper housing assembly and the lower housing assembly are provided with heat dissipation teeth located in the environment outside the package; the transceiver board integrates the main heat-generating components such as transceiver chips, power supplies, filters and power amplifiers. Among them, these components are in contact with the lower housing assembly and / or the upper housing assembly through heat-conducting materials, so as to dissipate heat to the external environment of the package with the help of the heat dissipation teeth provided by the lower housing assembly and / or the upper housing assembly. Compared with the active antenna unit of the traditional architecture, the active antenna unit structure of the present application can effectively reduce the impact of the "thermal cascade effect" on the heat dissipation of the whole machine, and more efficiently transfer the heat of components such as transceiver chips, power supplies, filters and power amplifiers to the external environment. Under the same heat consumption conditions, shorter heat dissipation teeth can meet the heat dissipation requirements, thereby making the whole machine lighter and smaller in size.

[0017] In order to enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this specification.

[0018] Figure 1 This is a schematic diagram of an active antenna unit structure according to an embodiment of the present application, including: a lower housing assembly 10, a transceiver board 20, a radio frequency connector assembly 30, an upper housing assembly 40, an antenna assembly 50 and a radome 60.

[0019] The lower housing assembly 10 and the upper housing assembly 40 are packaged to form a housing body of the active antenna unit structure. The transceiver board 20 is packaged in the internal space of the lower housing assembly 10 and the upper housing assembly 40. The upper housing assembly 40, the transceiver board 20 and the lower housing assembly 10 are fixed by waterproof screws 42 to maintain the sealing of the housing body.

[0020] In order to meet the electromagnetic compatibility (EMC) requirements of the base station for the transceiver board 20, the lower housing assembly 10 and the upper housing assembly 40 are both made of conductive shielding materials, and the packaging contact area between the lower housing assembly 10 and / or the upper housing assembly 40 and the transceiver board 20 can be filled with conductive shielding glue.

[0021] Different from the traditional active antenna unit structure, this embodiment is provided with heat dissipation teeth 01 and heat dissipation teeth 41 at the lower housing component 10 and the upper housing component 40, respectively. The heat dissipation teeth 01 and 41 are located in the external environment of the housing package so as to conduct convection heat exchange with the outside.

[0022] As an illustrative introduction, refer to Figure 2 In the present embodiment, the lower housing component 10 and the heat dissipation teeth 01 are integrally formed by die-casting or extrusion; in the integral forming, the heat dissipation teeth 01 are distributed within the outer contour of the lower housing component 10. Similarly, the upper housing component 40 and the heat dissipation teeth 41 can also be integrally formed by die-casting or extrusion, so that the heat dissipation teeth 41 are distributed within the outer contour of the upper housing component 4.

[0023] Alternatively, refer to Figure 2 As shown in the lower part. In this embodiment, the heat dissipation tooth 01 is made by using the heat conduction technology of Phase Change Inhibited (PCI), and is fixed to the lower housing assembly 10 by any method of riveting, gluing and laser welding; wherein, in order to improve the heat dissipation effect of the heat dissipation tooth 01, the heat dissipation tooth 01 is appropriately extended from the main structure of the lower housing assembly 10 to increase the heat dissipation area. Similarly, the heat dissipation tooth 41 can also be made by using the heat conduction technology of PCI, and is fixed to the upper housing assembly 40 by any method of riveting, gluing and laser welding, and appropriately extends from the main structure of the upper housing assembly 40.

[0024] Further, refer to Figure 3 As shown. The transceiver board 20 of this embodiment integrates the transceiver chip 21, the power amplifier 22, the power supply 23 and the filter 24 by surface mount welding. Among them, the antenna assembly 50 of this embodiment is located on the side of the upper housing assembly 40 facing away from the lower housing assembly 10. The upper housing assembly 40 is provided with a through-hole structure. The RF connector 30 connects the transceiver board 20 and the antenna assembly 50 through the through-hole structure, so that the transceiver board 20 and the antenna assembly 50 form a signal interconnection.

[0025] exist Figure 3In the structure shown, the transceiver chip 21, the power amplifier 22, the power supply 23 and the filter 24 are in contact with the lower housing assembly 10 and / or the upper housing assembly 40 through thermally conductive materials (such as thermally conductive gel, thermally conductive pads, silicone grease, etc.), thereby conducting heat to the heat dissipation teeth 11 or the heat dissipation teeth 41 to dissipate heat to the environment outside the package.

[0026] As an example. In the active antenna unit structure, the heat generated by the power amplifier 22 is significantly greater than that of the transceiver chip 21, the power supply 23 and the filter 24. In view of this feature, the present embodiment can isolate the power amplifier 22 from other components for separate heat dissipation, thereby reducing the thermal cascade effect between the power amplifier 22 and other components to improve the heat dissipation density of the active antenna unit. That is, the transceiver chip 21, the power supply 23 and the filter 24 are in contact with the lower housing assembly 10 through the heat conductive material, and the heat generated by the transceiver chip 21, the power supply 23 and the filter 24 are introduced into the lower housing assembly 10 and conducted to the external environment through the heat dissipation teeth 01; while the power amplifier 22 is in contact with the upper housing assembly 40 through the heat conductive material alone, and the heat generated by it is introduced into the upper housing assembly 40 through the transceiver board 20, and conducted to the external environment through the heat dissipation teeth 41.

[0027] Further, refer to Figure 4 and Figure 5 As shown. In this embodiment, the upper housing component 40 has a plurality of heat dissipation teeth 41, and is located between the antenna component 50 and the upper housing component 40. Among them, gaps are left between the plurality of heat dissipation teeth 41 of the upper housing component 40 to form an air duct with a chimney effect. The chimney effect refers to the phenomenon that the temperature difference between the air inside and outside the structure produces an air density difference, driving the high-temperature air inside the structure to flow upward, and the cold air outside the structure is continuously sucked in from the bottom. Based on the chimney effect air duct design, the heat of the transceiver chip 21, the power amplifier 22, the power supply 23 and the filter 24 can be more efficiently conducted to the upper housing component 40.

[0028] It should be noted that a certain gap should be left between the outer walls of the through-hole structure of the upper casing component 40 in this embodiment, so as to maintain a certain air inlet and outlet volume of the upper casing component 40 to improve the effect of convective heat exchange.

[0029] In addition, in order to prevent the through hole structure from affecting the sealing of the entire housing, a sealing ring for waterproofing the through hole structure may be provided between the antenna assembly 50 and the upper housing assembly 40 in this embodiment. Figure 1 and Figure 5The antenna assembly 50 of this embodiment is a substrate structure, including an antenna substrate 51. The upper housing assembly 40 has a plurality of through-hole structures (the number is not limited), each of which extends in the direction away from the lower housing assembly 10 to form a hole column 43, and the upper housing assembly 40 is fixed against the antenna substrate 51 through the hole column 43 formed by the plurality of through-hole structures.

[0030] In this embodiment, the hole column 42 is integrally die-casted with the upper housing assembly 40, and the hole column 42 corresponds to the sealing ring one by one, that is, each sealing ring is arranged on the end surface of its corresponding hole column 42 for contacting with the antenna substrate 51. Based on the design of the hole column 42, the antenna substrate 51 is equivalent to a sealing cover of the through-hole structure, and the sealing ring can effectively prevent water vapor from the external environment from entering the internal space of the housing package.

[0031] In addition, in this embodiment, a fan may be installed on the lower housing component 10 and / or the upper housing component 40 to dissipate heat from the lower housing component 10 and / or the upper housing component 40 through the fan. Here, installing a fan on the upper housing component 40 is taken as an example. Figure 5 As shown, the fan of this embodiment adopts a piezoelectric fan 45 that does not generate a magnetic field. The piezoelectric fan 45 is fixed to the upper housing assembly 40 by screws, and the air outlet faces the upper housing assembly 40, and is powered by the transceiver board 20. It should be noted that this embodiment does not specifically limit the way in which the transceiver board 20 supplies power to the piezoelectric fan 45. As one of the feasible solutions, the power supply connector on the transceiver board 20 can be connected to the piezoelectric fan 45 via the through-hole structure of the upper housing assembly 40.

[0032] To sum up, the active antenna unit structure of this embodiment integrates the main heat-generating components on the transceiver board, which improves the integration to save space. At the same time, it also allows the components on the transceiver board to dissipate heat to the external environment through the heat dissipation teeth of the different side casings, which can reduce the thermal cascade effect between components caused by excessive integration to a certain extent.

[0033] In practical applications, since the antenna unit structure of this embodiment utilizes shorter heat dissipation teeth to achieve efficient heat dissipation, it is particularly suitable for the development trend of miniaturization of base stations. In addition, components such as power supplies, filters, and power amplifiers are integrated on a transceiver board, which simplifies the difficulty of producing and assembling the active antenna unit. If the solution is finally implemented, it will have high practicality.

[0034] The above is a description of a specific embodiment of the specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0035] The above are only embodiments of this specification and are not intended to limit this specification. For those skilled in the art, this specification may be subject to various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this specification shall be included in the scope of the claims of this specification. In addition, all other embodiments obtained by ordinary technicians in this field without creative work shall fall within the scope of protection of this document.

Claims

1. An active antenna unit structure applied to a base station, comprising: An upper housing component, a lower housing component, and a transceiver board encapsulated between the upper housing component and the lower housing component; characterized in that: The upper housing component and the lower housing component are provided with heat dissipation teeth located in the environment outside the package, and the transceiver board integrates at least one of a transceiver chip, a power supply, a filter and a power amplifier. At least one of the transceiver chip, the power supply, the filter and the power amplifier is in contact with the lower housing component and / or the upper housing component through a thermally conductive material so as to dissipate heat through the heat dissipation teeth of the lower housing component and / or the upper housing component.

2. The active antenna unit structure according to claim 1, characterized in that: Also includes: Antenna assemblies and RF connectors; The antenna assembly is arranged on a side of the upper housing assembly facing away from the lower housing assembly, the upper housing assembly is provided with a through-hole structure, and the RF connector connects the transceiver board and the antenna assembly via the through-hole structure.

3. The active antenna unit structure according to claim 2, characterized in that: The upper casing component has a plurality of heat dissipation teeth, which are arranged between the antenna component and the upper casing component. Gaps are left between the plurality of heat dissipation teeth of the upper casing component to form an air duct with a chimney effect.

4. The active antenna unit structure according to claim 2, characterized in that: Also includes: Piezoelectric fan; The piezoelectric fan is arranged on the upper casing assembly to dissipate heat from the upper casing assembly, and the power supply connector of the transceiver board is connected to the piezoelectric fan via a through-hole structure.

5. The active antenna unit structure according to any one of claims 1 to 4, characterized in that: In the case where the transceiver board integrates the transceiver chip, power supply, filter and power amplifier at the same time, the power amplifier is in contact with the upper casing assembly through the thermal conductive material so as to dissipate heat through the heat dissipation teeth of the upper casing assembly; the transceiver chip, power supply and filter are in contact with the lower casing assembly through the thermal conductive material so as to dissipate heat through the heat dissipation teeth of the lower casing assembly.

6. The active antenna unit structure according to any one of claims 1 to 4, characterized in that: The upper housing component and the lower housing component are both made of conductive shielding material, and the upper housing component and the transceiver board have a package contact area.

7. The active antenna unit structure according to any one of claims 1 to 4, characterized in that: The packaging contact area between the lower housing component and the transceiver board is filled with conductive shielding glue.

8. The active antenna unit structure according to any one of claims 1 to 4, characterized in that: The thermally conductive material includes at least one of thermally conductive gel, thermally conductive pad and silicone grease.

9. The active antenna unit structure according to any one of claims 1 to 4, characterized in that: The heat dissipation teeth of the upper casing assembly are fixed to the upper casing assembly by riveting, gluing and laser welding, and the heat dissipation teeth of the upper casing assembly extend from the main structure of the upper casing assembly; and / or, the heat dissipation teeth of the lower casing assembly are fixed to the lower casing assembly by riveting, gluing and laser welding, and the heat dissipation teeth of the lower casing assembly extend from the main structure of the lower casing assembly.

10. The active antenna unit structure according to any one of claims 1 to 4, characterized in that: The heat dissipation teeth of the upper housing assembly and the upper housing assembly are integrally formed by a die-casting process or an extrusion process; And / or, the heat dissipation teeth of the lower casing assembly and the lower casing assembly are integrally formed by a die-casting process or an extrusion process.

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