A temperature sensor assembly production process

Abstract

The present invention discloses a temperature sensor assembly production process, which includes the following steps: First, strip the outer skin at one end of the wire to expose the internal wire core; Further, group every two wires and place them on the positioning jig at intervals, and position several groups of wires simultaneously through the positioning jig; Further, transfer the positioning jig to the tin dipping station to perform tin dipping treatment on the exposed end of the wire to harden the end of the wire; Further, transfer the positioning jig to the shaping station, and the shaping machine punches and forms the end of each group of wires, so that the end of the wire is bent to form a clamping part; Further, transfer the positioning jig to the sensor insertion station, and the chip insertion machine inserts the sensor into the clamping part of each group of wires, and clamps the sensor through the clamping part of the wire; Further, transfer the positioning jig to the soldering station, and the soldering machine solders the wire and the sensor together; Finally, take out the welded wire and sensor assembly from the positioning jig.

Description

Technical Field:

[0001] The present invention relates to the technical field of sensor production, and particularly refers to an assembly production process for temperature sensors. Background Art:

[0002] A temperature sensor is a device that can sense the temperature of the environment or an object and convert it into a measurable signal. It is widely used in multiple fields such as industry, medical treatment, household appliances, automobiles, aerospace, etc., for monitoring, controlling, and optimizing various temperature-related systems and equipment. Temperature sensors are classified into various types according to their working principles, application scenarios, and measurement ranges, including thermocouples, thermistors, semiconductor temperature sensors, infrared temperature sensors, etc.

[0003] In the assembly production process of temperature sensors, connecting the temperature sensor to the wire is a very crucial step in the entire assembly process. The quality of the wire connection step directly affects the signal transmission stability and accuracy of the sensor. To ensure that the temperature sensor can work accurately in different environments, the wire connection step must be strictly controlled to ensure reliable and durable connections. The most traditional and reliable way is usually to manually weld the wire together, but due to the decreasing size of the sensor, manually welding the sensor to the wire not only fails to meet the production capacity requirements but also makes it difficult to guarantee the yield rate. For example: A high-temperature and moisture-proof NTC thermistor disclosed in the Chinese patent application authorization announcement number CN204010867U. In the solution disclosed in this patent, two leads 2 are welded on the NTC thermistor chip 1 to transmit signals to an external circuit or device.

[0004] In view of this, the inventor of the present invention proposes the following technical solutions. Summary of the Invention:

[0005] The purpose of the present invention is to overcome the deficiencies of the prior art and provide an assembly production process for temperature sensors.

[0006] To solve the above technical problems, the present invention adopts the following technical solutions: An assembly production process for temperature sensors, including the following steps:

[0007] First, strip the outer skin at one end of the wire to expose the internal wire core.

[0008] Further, group every two wires and place them on the positioning jig at intervals, and position several groups of wires simultaneously through the positioning jig.

[0009] Further, transfer the positioning jig to the tin dipping station and dip the exposed end of the wire in tin to harden the end of the wire.

[0010] Further, transfer the positioning fixture to the shaping station, and the end of each group of wires is stamped and formed by a shaping machine, so that the end of the wire is bent to form a clamping part;

[0011] Further, transfer the positioning fixture to the sensor insertion station, and insert the sensor into the clamping part of each group of wires by a chip insertion machine, and clamp the sensor through the clamping parts of two wires;

[0012] Further, transfer the positioning fixture to the soldering station, and solder the wire and the sensor together by a soldering machine;

[0013] Finally, take out the welded wire and sensor assembly from the positioning fixture.

[0014] Furthermore, in the above technical solution, every two of the wires are arranged in a group on the positioning fixture, and the bare ends of the wires extend out of the positioning fixture. The exposed ends of the wires are symmetrically extruded by the extrusion forming module in the shaping machine, so that the ends of the wires form clamping parts that are symmetrically "V"-shaped.

[0015] Furthermore, in the above technical solution, a number of positioning grooves for positioning two wires are provided on the positioning fixture. After the wires are placed in the positioning grooves, the wires are fixed on the positioning fixture by tape or a pressing plate.

[0016] Furthermore, in the above technical solution, in the shaping station, the positioning fixture is positioned and installed on the horizontal transfer module. The horizontal transfer module pushes the positioning fixture towards the extrusion forming module, so that the exposed part of the wire is inserted into the extrusion forming module. After the wire and the positioning fixture are tightly pressed and fixed by the upper pressing and positioning module, the wire is extruded and bent by the extrusion forming module to form a clamping part.

[0017] Furthermore, in the above technical solution, the horizontal transfer module includes a first support base, a first moving platform and a second moving platform that are stacked on the first support base and can independently move closer to and away from the extrusion forming module. Among them, the pressing and positioning module is installed on the first moving platform and spans above the second moving platform, and the positioning fixture is positioned and installed on the second moving platform and can move below the pressing and positioning module accordingly.

[0018] Furthermore, in the above technical solution, the pressing and positioning module includes a portal bracket installed on the first moving platform and spanning above the second moving platform, a fifth guide rail and a sixth guide rail vertically arranged on the portal bracket, a lower pressing plate slidably installed on the fifth guide rail and the sixth guide rail and used for clamping the positioning fixture, and a fourth air cylinder installed on the portal bracket and used for driving the lower pressing plate to lift. Among them, the lower pressing plate is "concave"-shaped, and the fourth air cylinder is located in the groove.

[0019] Furthermore, in the above technical solution, the extrusion molding module includes a second support base disposed beside the horizontal transfer module, a molding die disposed on the second support base and capable of pressing and forming multiple groups of wires, and a driving device for driving the molding die to extrude and form the wires. Among them, the molding die includes a die vertical seat disposed on the second support base, a fixed template installed on the die vertical seat and used to extend into the middle of each group of wires, and a left sliding template and a right sliding template slidably disposed on the die vertical seat and respectively extruding and forming the wires on both sides of the fixed template. Moreover, left convex plate portions, middle concave plate portions, and right convex plate portions that are arranged in sequence, staggered, and coplanarly are respectively disposed on the left sliding template, the fixed template, and the right sliding template and are used to extrude multiple groups of wires.

[0020] Furthermore, in the above technical solution, the driving device includes a driving block disposed on one side of the molding die and capable of relatively approaching and separating, a first connecting rod and a second connecting rod that are "V"-shaped and cross-hinged at one end of the driving block and are respectively hinged to the ends of the left sliding template and the right sliding template, a limit guiding seat disposed on the second support base and used to limit the driving block to maintain linear motion, and a fifth air cylinder installed on the second support base and used to drive the limit guiding seat to move.

[0021] Furthermore, in the above technical solution, in the inserting sensor station, the chip inserting machine includes a inserting mechanism for installing and positioning the jig and moving up and down, a positioning device disposed beside the inserting mechanism and used to pre-position the wires on the positioning jig, and a feeding and positioning mechanism disposed below the inserting mechanism and used to arrange and position the sensors. Among them, when the positioning jig is placed on the inserting mechanism, the clamping portions of the wires on the positioning jig face downward. First, the positioning device approaches the inserting mechanism and inserts between the clamping portions of each group of wires to ensure that the intervals of the clamping portions meet the requirements. Then, the inserting mechanism moves the positioning jig above the feeding and positioning mechanism. After the feeding and positioning mechanism arranges the sensors directly below the wires, the inserting mechanism drives the positioning jig to descend so that the sensors are clamped by the clamping portions of each group of wires, and then the inserting mechanism returns to its original position.

[0022] Furthermore, in the above technical solution, the feeding and positioning mechanism includes a feeding module for arranging and sending out the sensors and a support and positioning device for arranging and positioning the sensors at intervals directly below the wires. The support and positioning device carries the sensors through a cantilever support plate, enabling the wires to pass downward from both sides of the cantilever support plate and clamping the sensors between the clamping portions of each group of wires. After the wires clamp the sensors, the cantilever support plate disengages from carrying the sensors to facilitate the wires to stably clamp the sensors; of course, the support and positioning device can also use a magnetic attraction method to suspend the sensors below the wires.

[0023] After adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art: In the present invention, the wires are placed on the positioning fixture in groups of two, and then multiple groups of wires are simultaneously subjected to the tin dipping process through the positioning fixture, so that the exposed parts of the wires are coated with solder. Utilizing the characteristics of metallic tin, not only can the exposed parts of the wires be made more rigid for extrusion molding, but also the soldering strength can be improved after the exposed parts are coated with solder. Subsequently, the wires coated with solder are extruded and molded by a shaping machine, so that the exposed parts of the wires are bent in a "V" shape. An elastic clip is formed by the clamping part structures of each group of wires being symmetrically distributed, which not only facilitates the quick insertion of the sensor between the two wires for clamping, but also the two symmetrical "V" shaped clamping parts can stably clamp the sensor. Finally, the sensor is inserted into the ends of the two wires by a chip inserting machine and then transferred to the soldering station for soldering, thereby replacing manual assembly and soldering, and greatly improving the assembly efficiency and product quality. Brief Description of the Drawings:

[0024] Figure 1 is the process flow schematic diagram of the present invention Figure 1 ;

[0025] Figure 2 is the process flow schematic diagram of the present invention Figure 2 ;

[0026] Figure 3 is the structural diagram of the shaping machine in the present invention;

[0027] Figure 4 is the structural diagram of the horizontal transfer module and the pressing and positioning module in the present invention;

[0028] Figure 5 is the structural diagram of the second moving platform in the present invention;

[0029] Figure 6 is the structural diagram of the fixture in the present invention;

[0030] Figure 7 is the structural diagram of the extrusion molding module in the present invention;

[0031] Figure 8 is the structural diagram of the molding die in the present invention;

[0032] Figure 9 is the partial enlarged view at X in 8;

[0033] Figure 10 is the exploded view of the molding die in the present invention; Detailed Embodiments:

[0034] The present invention will be further described below in conjunction with specific embodiments and the drawings.

[0035] See Figures 1 to 10As shown, it is a production process for assembling a temperature sensor, which includes the following steps:

[0036] First, strip the outer skin at one end of wire 1 to expose the internal conducting wire core.

[0037] Further, group every two wires 1 and place them on the positioning jig 2 at intervals. The positioning jig 2 is used to position several groups of wires 1 simultaneously.

[0038] Further, transfer the positioning jig 2 to the tin dipping station, dip the exposed end of wire 1 in tin to harden the end of wire 1.

[0039] Further, transfer the positioning jig 2 to the shaping station, and the end of each group of wires 1 is stamped and shaped by the shaping machine 3, so that the end of wire 1 is bent to form a clamping part 11.

[0040] Further, transfer the positioning jig 2 to the sensor insertion station, and the sensor 4 is inserted into the clamping part of each group of wires 1 by the chip insertion machine, and the sensor 4 is clamped by the clamping parts of two wires 1.

[0041] Further, transfer the positioning jig 2 to the soldering station, and the wire 1 and the sensor 4 are soldered together by the soldering machine.

[0042] Finally, take out the welded wire 1 and sensor 4 assembly from the positioning jig 2.

[0043] In the present invention, by placing the wires 1 in groups of two on the positioning jig 2, and then synchronously performing the tin dipping process on multiple groups of wires 1 through the positioning jig 2, the exposed parts of the wires 1 are coated with solder. Utilizing the properties of metallic tin, not only can the exposed parts of the wires 2 be made more rigid for extrusion forming, but also the soldering strength can be improved after the exposed parts are coated with solder. Subsequently, the shaped machine 3 is used to extrude and form the tinned wires 1, so that the exposed parts of the wires 1 are bent in a "V" shape. The elastic clips are formed by the symmetrically distributed clamping parts 11 of each group of wires 1. This not only facilitates the quick insertion of the sensor 4 between the two wires 1 for clamping, but also the two symmetric "V" - shaped clamping parts 11 can stably clamp the sensor 4. Finally, the sensor 4 is inserted into the ends of the two wires 1 by the chip insertion machine and then transferred to the soldering station for soldering, thus replacing manual assembly and soldering, and greatly improving the assembly efficiency and product quality.

[0044] Every two of the wires 1 are arranged in a group on the positioning jig 2, and the bare ends of the wires 1 extend out of the positioning jig 2. The extrusion forming module 32 in the shaping machine 3 symmetrically extrudes the bare ends of the wires 1, so that the ends of the wires 1 form clamping parts 11 that are symmetrically "V"-shaped. By using a mold to press and form a "V"-shaped bending part at the end of the wire 1, the sensor 4 is clamped symmetrically by two "V"-shaped clamping parts 11. The "V"-shaped clamping parts 11 not only form a strong clamping force with the shortest distance in the middle, but also the inclined surfaces on both sides form a guiding structure at the opening, which is convenient for the insertion of the sensor.

[0045] A number of positioning grooves 21 for positioning two wires 1 are provided on the positioning jig 2. After the wires 1 are placed in the positioning grooves 21, the wires 1 are fixed to the positioning jig 2 by adhesive tapes 22 or pressing plates. Among them, the two ends of the positioning jig 2 are provided with a first mounting hole 23 and a second mounting hole 24 for fixing. In an embodiment, the adhesive tape 22 is used to paste on the positioning jig 2 to fix the wires 1. Since in the tin dipping process, only the bare parts of the wires 1 are immersed in the molten tin liquid for a while, the resistance received by the wires 1 is very small. Therefore, the adhesive strength of the adhesive tape 22 is sufficient to fix the wires 1. And in the subsequent shaping station and the sensor insertion station, devices for pressing and fixing the positioning jig 2 and the wires 1 are provided. Therefore, by using the adhesive tape 22 to fix the wires 1, the fixing effect of the wires 1 can be achieved, the cost can be greatly reduced, and the fixing method is simple and efficient, which is beneficial to high-efficiency production.

[0046] In the shaping station, the positioning jig 2 is positioned and installed on the horizontal transfer module 31. The horizontal transfer module 31 is used to push the positioning jig 2 towards the extrusion forming module 32, so that the bare parts of the wires 1 are inserted into the extrusion forming module 32. After the upper pressing and positioning module 33 presses and fixes the wires 1 and the positioning jig 2, the extrusion forming module 32 is used to extrude and bend the wires 1 to form the clamping parts 11.

[0047] The horizontal transfer module 31 includes a first support base 311, a first moving platform 312 and a second moving platform 313 which are stacked on the first support base 311 and can independently approach and move away from the extrusion molding module 32. Among them, the pressing and positioning module 33 is installed on the first moving platform 312 and spans above the second moving platform 313. The positioning fixture 2 is fixedly installed on the second moving platform 313 and can move therewith to the lower part of the pressing and positioning module 33. Among them, the first moving platform 312 includes a first guide rail 312A and a second guide rail 312B which are installed in parallel on the first support base 311 and perpendicular to the extrusion molding module 32, a first moving plate 312C slidably installed on the first guide rail 312A and the second guide rail 312B, and a first air cylinder 312D installed on the first support base 311 and used to push the first moving plate 312C to approach and move away from the extrusion molding module 32; the second moving platform 313 includes a third guide rail 313A and a fourth guide rail 313B which are installed in parallel on the first moving platform 312, a second moving plate 313C slidably installed on the third guide rail 313A and the fourth guide rail 313B, a second air cylinder 313D installed on the first moving platform 312 and used to push the second moving plate 313C to approach and move away from the extrusion molding module 32, a fixture 313E provided at one end of the second moving plate 313C and used to fix the positioning fixture 2 and the wire 1, a wire groove plate 313H provided at the other end of the second moving plate 313C, and a first buffer positioning device 313F and a second buffer positioning device 313G which are symmetrically arranged at both ends of the first guide rail 312A and the second guide rail 313B and used to limit and position the movement of the second moving plate 313C.

[0048] The fixture 313E includes a fixed clamp base 313E1 fixedly installed at the front end of the second moving plate 313C, a movable clamp base 313E2 slidably arranged below the fixed clamp base 313E1 and capable of cooperating to clamp the wire 1, a slider bearing 313E3 arranged between the fixed clamp base 313E1 and the movable clamp base 313E2, a plurality of sucker devices 313E4 arranged on the fixed clamp base 313E1 and used to adsorb and fix the positioning fixture 2, a sliding module 313E5 installed at the bottom of the second moving plate 313C and used to drive the movable clamp base 313E2 to move relative to the fixed clamp base 313E1 to clamp and loosen the wire 1, and a third air cylinder 313E6 installed at the bottom of the second moving plate 313C and used to drive the sliding module 313E5 to drive the movable clamp base 313E2 to reciprocate. The fixed clamp base 313E1 and the movable clamp base 313E2 are respectively provided with a number of alternately distributed first clamping blocks 313E1A and second clamping blocks 313E2A for cooperating to clamp the wire 1, and the two ends of the fixed clamp base 313E1 are provided with a first positioning pin 313E1B and a second positioning pin 313E1C which are matched with the first mounting hole 23 and the second mounting hole 24 on the positioning fixture 2.

[0049] The pressing and positioning module 33 includes a gantry bracket 331 mounted on the first moving platform 312 and spanning above the second moving platform 313, a fifth guide rail 332 and a sixth guide rail 333 vertically arranged on the gantry bracket 331, a lower pressing plate 334 slidably mounted on the fifth guide rail 332 and the sixth guide rail 333 and used for clamping and positioning the fixture 2, and a fourth cylinder 335 mounted on the gantry bracket 331 and used for driving the lower pressing plate 334 to lift and lower. Among them, the lower pressing plate 334 is in a "concave" shape, and the fourth cylinder 335 is located in the groove.

[0050] The extrusion molding module 32 includes a second support base 321 arranged beside the horizontal transfer module 31, a molding die 322 arranged on the second support base 321 and capable of pressing and forming multiple groups of wires 1, and a driving device 323 used for driving the molding die 322 to extrude and form the wires 1. Among them, the molding die 322 includes a die vertical seat 324 arranged on the second support base 321, a fixed template 325 mounted on the die vertical seat 324 and used for extending into the middle of each group of wires 1, a left sliding template 326 and a right sliding template 327 slidably arranged on the die vertical seat 324 and used for extruding and forming the wires 1 on both sides of the fixed template 325 respectively. And left convex plate parts 326A, middle concave plate parts 325A and right convex plate parts 327A which are arranged in a staggered and coplanar manner in sequence are respectively arranged on the left sliding template 326, the fixed template 325 and the right sliding template 327 and used for extruding multiple groups of wires 1. Among them, the middle concave plate part 325A is in a sharp cone shape, and both sides of the middle part are recessed inwards in an arc shape, and left arc-shaped grooves and right arc-shaped grooves which are respectively matched with the left convex plate part 326A and the right convex plate part 327A are formed at the middle part; the front end of the left convex plate part 326A is directly opposite to the middle part of the middle concave plate part 325A, and a left arc-shaped protrusion 326A1 for stamping the wire 1 corresponding to the left arc-shaped groove is formed at the end part, and transition arc surfaces are formed on both sides of the left arc-shaped protrusion 326A1. The right convex plate part 327A has the same structure as the left convex plate part 326A, and has a right arc-shaped protrusion 327A1 for stamping the wire 1 corresponding to the right arc-shaped groove.

[0051] A seventh guide rail 328 and an eighth guide rail 329 perpendicular to the first moving platform 312 are arranged below the second support base 321, and a seventh cylinder 320 used for driving the second support base 321 to slide is arranged in parallel beside the seventh guide rail 328 and the eighth guide rail 329.

[0052] The driving device 323 includes a driving block 323A disposed on one side of the forming die 322 and capable of approaching and separating relatively, a first connecting rod 323B and a second connecting rod 323C that are “V”-shaped and cross-hinged at one end of the driving block 323A and are respectively hinged to the ends of the left sliding template 326 and the right sliding template 327, a limiting and guiding seat 323D disposed on the second support base 321 and used to limit the driving block 323A to move in a straight line, and a fifth cylinder 323E installed on the second support base 321 and used to drive the limiting and guiding seat 323D to move. Among them, the fixed template 325, the left sliding template 326, and the right sliding template 327 are arranged in sequence from top to bottom. The other ends of the first connecting rod 323B and the second connecting rod 323C are hinged to the end of the driving block 323A through a pin shaft 323F, and the first connecting rod 323B is located below the second connecting rod 323C; a travel space 327B for accommodating the left embossing part 326A and the middle concave part 325A and allowing two wires 1 to be inserted is provided between every two right embossing parts 327A on the right sliding template 327, and the bare end parts of the two wires 1 are respectively inserted between the left embossing part 326A and the middle concave part 325A and between the right embossing part 327A and the middle concave part 325A.

[0053] In the sensor insertion station, the chip inserter includes a plugging mechanism for installing and positioning the fixture 2 and moving up and down, a positioning device disposed beside the plugging mechanism and used to pre-position the wire 1 on the positioning fixture 2, and a feeding and positioning mechanism disposed below the plugging mechanism and used to arrange and position the positioning sensors 4. Among them, after the positioning fixture 2 is placed on the plugging mechanism, the clamping part 11 of the wire 1 on the positioning fixture 2 faces downward. First, it approaches the plugging mechanism through the positioning device and is inserted between the clamping parts 11 of each group of wires 1 to ensure that the interval of the clamping parts 11 meets the requirements. Then, the plugging mechanism moves the positioning fixture 2 above the feeding and positioning mechanism. After the feeding and positioning mechanism arranges the sensors 4 directly below the wires 1, the plugging mechanism drives the positioning fixture 2 to descend, so that the sensors 4 are clamped by the clamping parts 11 of each group of wires 1, and then the plugging mechanism returns to its original position.

[0054] The feeding and positioning mechanism includes a feeding module for arranging and sending out the sensors 4 and a supporting and positioning device for arranging and positioning the sensors 4 at intervals below the wires 1. The supporting and positioning device carries the sensors 4 through a cantilever support plate, so that the wires 1 can pass downward from both sides of the cantilever support plate, and the sensors 4 are clamped between the clamping parts 11 of each group of wires 1. After the wires 1 clamp the sensors 4, the cantilever support plate disengages from carrying the sensors 4 to facilitate the wires 1 to stably clamp the sensors 4; of course, the supporting and positioning device can also use a magnetic attraction method to suspend the sensors 4 below the wires 1.

[0055] In summary, in the present invention, the wire 1 is cut into several segments according to a specified length, and one end of each segment of the wire 1 is peeled to expose the conductive core inside the wire 1; further, the wires 1 are aligned in pairs and placed on the positioning fixture 2, and the exposed parts of the wires 1 extend out of the positioning fixture 2 to one side. Of course, the peeling step of the wire 1 can also be completed after the wire 1 is placed on the positioning fixture 2; further, the positioning fixture 2 loaded with the wires 1 is transferred to the tin dipping station, and by inserting the exposed parts of the wires 1 into the tin liquid, the exposed parts of the wires 1 are glued with tin and hardened, so that the wires 1 have sufficient rigidity to maintain their shape unchanged during subsequent pressing; further, the positioning fixture 2 loaded with the wires 1 is transferred to the shaping machine 3 and placed on the horizontal transfer module 31. The first positioning pin 313E1B and the second positioning pin 313E1C are inserted into the first mounting hole 23 and the second mounting hole 24 for positioning, and the positioning fixture 2 is adsorbed and fixed by the suction cup device 313E4. At the same time, the movable clamp seat 313E2 and the fixed clamp seat 313E1 cooperate to clamp and fix the wire 1 to ensure that there is no movement offset when pressing the wire 1; further, the horizontal transfer module 31 moves the exposed part of the wire 1 and inserts it into the extrusion forming module 32, and the pressing and positioning module 33 descends to press the positioning fixture 2 to ensure the fixed position between the wire 1, the positioning fixture 2 and the horizontal transfer module 31. Then, the exposed part of the wire 1 is extruded by the extrusion forming module 32, so that the exposed part of the wire 1 is bent to form a "V"-shaped clamping part 11; further, the extrusion forming module 32, the pressing and positioning module 33, and the horizontal transfer module 31 are reset in sequence, and the positioning fixture 2 is transferred to the chip inserting machine. At this time, the positioning fixture 2 is suspended on the inserting mechanism and is in a vertical state, and the clamping part 11 of the wire 1 is at the lower end; further, first, the pre-positioning block is inserted between the clamping parts 11 of the wire 1 through the positioning device to ensure that the clamping space of the clamping parts 11 of each group of wires 1 is consistent. Then, the positioning fixture 2 is moved to above the feeding and positioning mechanism by the inserting mechanism. The feeding and positioning mechanism sends out the sensors 4 arranged at intervals to below the inserting mechanism, and ensures that both sides of each sensor 4 are suspended for the clamping part 11 of the wire 1 to insert, so as to ensure that the sensor 4 can move relatively and insert between the clamping parts 11 of two wires 1. After the inserting mechanism and the feeding and positioning mechanism repeatedly operate to complete the assembly of all the wires 1 and the sensors 4 on the positioning fixture 2, the inserting mechanism resets and takes out the positioning fixture 2 and transfers it to the welding station; further, the contact parts of the wire 1 and the sensor 4 are welded by the welding machine to complete the stable fixation of the wire 1 and the sensor 4.

[0056] Of course, the above are only specific embodiments of the present invention, and are not intended to limit the scope of implementation of the present invention. Any equivalent changes or modifications made according to the structure, features and principles described in the scope of the patent application of the present invention shall be included in the scope of the patent application of the present invention.

Claims

1. A temperature sensor assembly production process, characterized in that: The following steps are involved: First, the outer sheath of one end of the wire (1) is peeled off to expose the inner conductive wire core; Further, the wires (1) are placed in groups of two at intervals on a positioning jig (2), and a plurality of groups of wires (1) are positioned simultaneously by the positioning jig (2); Further, the positioning jig (2) is transferred to a tinning station, and the exposed end of the wire (1) is tinned to harden the end of the wire (1); Further, the positioning jig (2) is transferred to a shaping station, and the shaping machine (3) performs stamping and shaping on the end of each group of wires (1), so that the end of the wires (1) is bent to form a clamping portion (11); In the shaping station, the positioning jig (2) is positioned and installed on the horizontal cutting module (31), and the positioning jig (2) is pushed toward the extrusion molding module (32) by the horizontal cutting module (31), so that the exposed part of the wire (1) is inserted into the extrusion molding module (32), and after the wire (1) and the positioning jig (2) are pressed and fixed by the upper pressing positioning module (33), the wire (1) is pressed and bent by the extrusion molding module (32) to form a clamping portion (11); Further, the positioning jig (2) is transferred to the sensor insertion station, and the sensor (4) is inserted into the holding portion of each group of wires (1) by the chip insertion machine, and the sensor (4) is clamped by the clamping portions (11) of the two wires (1); In the sensor insertion station, the chip insertion machine comprises a plug-in mechanism for installing a positioning fixture (2) and moving up and down, a positioning device arranged beside the plug-in mechanism and used for pre-positioning the wire (1) on the positioning fixture (2), and a feeding positioning mechanism arranged below the plug-in mechanism and used for arranging the positioning sensor (4); Further, the positioning jig (2) is transferred to a soldering station, and the wire (1) and the sensor (4) are soldered together by a soldering machine; Finally, the welded wire (1) and sensor (4) assembly is removed from the positioning fixture (2).

2. A temperature sensor assembly production process according to claim 1, characterized in that: The wires (1) are arranged in groups of two on a positioning jig (2), and an exposed end of the wire (1) is extended out of the positioning jig (2). An extrusion molding module (32) in a molding machine (3) symmetrically extrude the exposed end of the wire (1), so that the end of the wire (1) forms a symmetrical "V"-shaped clamping portion (11).

3. The temperature sensor assembly production process according to claim 1, characterized in that: The positioning jig (2) is provided with a plurality of positioning grooves (21) for positioning the two wires (1), and after the wires (1) are placed in the positioning grooves (21), the wires (1) are fixed to the positioning jig (2) by means of adhesive tape (22) or a pressure plate.

4. The temperature sensor assembly production process according to claim 1, characterized in that: The horizontally movable cutting module (31) comprises a first supporting base (311) and a first moving platform (312) and a second moving platform (313) which are stacked on the first supporting base (311) and can independently move towards and away from the extrusion molding module (32), wherein the clamping and positioning module (33) is installed on the first moving platform (312) and straddles the second moving platform (313), and the positioning fixture (2) is positioned and installed on the second moving platform (313) and can move therewith to the bottom of the clamping and positioning module (33).

5. The temperature sensor assembly production process according to claim 1, characterized in that: The clamping and positioning module (33) comprises a gantry bracket (331) mounted on the first moving platform (312) and spanning above the second moving platform (313), a fifth guide rail (332) and a sixth guide rail (333) vertically arranged on the gantry bracket (331), a lower pressing plate (334) slidably mounted on the fifth guide rail (332) and the sixth guide rail (333) and used for clamping the positioning fixture (2), and a fourth cylinder (335) mounted on the gantry bracket (331) and used for driving the lower pressing plate (334) to rise and fall, wherein the lower pressing plate (334) is in a "concave" shape, and the fourth cylinder (335) is located in the concave groove.

6. The temperature sensor assembly production process according to claim 1, characterized in that: The extrusion molding module (32) comprises a second support base (321) arranged beside the horizontal cutting module (31), a molding die (322) arranged on the second support base (321) and capable of extruding and molding a plurality of groups of wires (1), and a driving device (323) for driving the molding die (322) to extrude and mold the wires (1), wherein the molding die (322) comprises a mold stand (324) arranged on the second support base (321), a mold stand (324) installed on the mold stand (324) and used to A fixed template (325) extending into the middle of each group of wires (1) and a left sliding template (326) and a right sliding template (327) slidably arranged on a mold stand (324) and respectively extruding the wires (1) on both sides of the fixed template (325), and the left sliding template (326) and the fixed template (325) and the right sliding template (327) are respectively provided with a left relief portion (326A) and a middle concave portion (325A) and a right relief portion (327A) arranged in a staggered coplanar manner and used for extruding multiple groups of wires (1).

7. A temperature sensor assembly production process according to claim 6, characterized in that: The driving device (323) comprises a driving block (323A) arranged on one side of the molding die (322) and used to move relatively closer or further away, a first connecting rod (323B) and a second connecting rod (323C) which are cross-hinged and installed in a V-shaped manner at one end of the driving block (323A) and are respectively hinged to the ends of the left sliding template (326) and the right sliding template (327), a limiting guide seat (323D) arranged on the second supporting base (321) and used to limit the driving block (323A) to maintain linear motion, and a fifth cylinder (323E) installed on the second supporting base (321) and used to drive the limiting guide seat (323D) to move.

8. A temperature sensor assembly production process according to any one of claims 1 to 7, characterized in that: When the positioning jig (2) is placed on the plug-in mechanism, the clamping portion (11) of the wire (1) on the positioning jig (2) faces downward, and the positioning jig (2) is first moved toward the plug-in mechanism through the positioning device and inserted between the clamping portions (11) of each group of wires (1), ensuring that the spacing of the clamping portions (11) meets the requirements, and then the positioning jig (2) is moved to the top of the feeding positioning mechanism through the plug-in mechanism. After the feeding positioning mechanism arranges the sensor (4) directly below the wire (1), the plug-in mechanism drives the positioning jig (2) to descend, so that the sensor (4) is clamped and clamped by the clamping portion (11) of each group of wires (1), and then the plug-in mechanism returns to its original position.

9. A temperature sensor assembly production process according to claim 8, characterized in that: The feeding and positioning mechanism comprises a feeding module for arranging and feeding the sensors (4) and a supporting and positioning device for arranging and positioning the sensors (4) at intervals below the wires (1). The supporting and positioning device supports the sensors (4) via a cantilever support plate, so that the wires (1) can pass downward from both sides of the cantilever support plate, and the sensors (4) are clamped between the clamping parts (11) of each group of wires (1). After the wires (1) clamp the sensors (4), the cantilever support plate is separated from the support for the sensors (4), so that the wires (1) can stably clamp the sensors (4). Of course, the supporting and positioning device can also suspend the sensors (4) below the wires (1) by magnetic attraction.

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