Support, camera module and electronic device

Abstract

The thickness of the support ranges from 0.5 mm to 1 mm, the support comprises a bearing plate and a plurality of supporting plates, the supporting plates are arranged on one side of the bearing plate in a surrounding mode to form a supporting space, the bearing plate is provided with a first open hole and a plurality of second open holes in a penetrating mode, the first open hole and the second open holes are arranged in a staggered mode, and the first open hole and the second open holes are arranged in a staggered mode. And the first open hole and the plurality of second open holes are communicated with the supporting space. The support provided by the invention is beneficial to reducing the thickness of the camera module. In addition, the invention also provides a camera module and an electronic device.

Description

Technical Field

[0001] The present invention relates to the field of photography, and in particular to a bracket, a camera module and an electronic device. Background Art

[0002] Generally, a camera module includes a circuit board, a bracket and a lens assembly. The bracket is arranged between the lens assembly and the circuit board. The back focal length (Back Focal Length) of the existing lens assembly is short, and the bracket is designed to be thicker to ensure that the structural strength meets the requirements, resulting in a mismatch between the lens assembly and the bracket, and is also not conducive to the miniaturization of the camera module. Summary of the invention

[0003] In view of this, it is necessary to provide a bracket to solve the above technical problems.

[0004] In addition, it is also necessary to provide a camera module having the bracket.

[0005] In addition, it is also necessary to provide an electronic device having the camera module.

[0006] A bracket, wherein the thickness of the bracket is 0.5 to 1 mm. The bracket comprises a bearing plate and a plurality of supporting plates, wherein the plurality of supporting plates are arranged around one side of the bearing plate to form a supporting space, wherein a first opening and a plurality of second openings are arranged through the bearing plate, wherein the first opening and each of the second openings are arranged staggered, and the first opening and the plurality of second openings are connected to the supporting space.

[0007] In a possible implementation manner, the carrying plate is recessed toward the supporting space to form a receiving groove, the first opening passes through the bottom of the receiving groove, and the second opening is arranged at the periphery of the receiving groove.

[0008] In a possible implementation manner, one end of the plurality of support plates away from the carrying plate is bent toward the supporting space to form a bent portion, or one end of the plurality of support plates away from the carrying plate is bent away from the supporting space to form the bent portion.

[0009] In a possible implementation, the side of the plurality of support plates facing the support space and the side of the carrier plate facing the support space are both provided with an anti-reflective layer, and the inner periphery of the receiving groove and the inner wall of the first opening are both provided with the anti-reflective layer.

[0010] In a possible implementation manner, the carrying plate and the plurality of support plates are made of metal.

[0011] In a possible implementation manner, the bracket is an integrally formed structure.

[0012] A camera module comprises a circuit board assembly, a lens assembly and the bracket as described above, wherein the bracket is arranged between the circuit board assembly and the lens assembly, the circuit board assembly comprises a circuit board and a photosensitive element and a plurality of electronic components arranged on one side of the circuit board, the photosensitive element is arranged corresponding to the first opening, a plurality of the electronic components are arranged corresponding to the second opening and at least some of the electronic components pass through the second opening.

[0013] In a possible implementation manner, the camera module further includes a filter, and the filter is disposed on the supporting plate, and the filter covers the first opening.

[0014] In a possible implementation manner, the circuit board includes a plurality of grounding pads, and the support plate is electrically connected to the grounding pads.

[0015] An electronic device comprises the camera module as described above.

[0016] The bracket provided in the present application is provided with a second opening, which can be used to accommodate the electronic component or allow the electronic component to pass through, so that even a bracket with a smaller thickness will not interfere with the electronic component, which is beneficial to reduce the overall thickness of the bracket and further help reduce the thickness of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of an electronic device provided in accordance with the first embodiment of the present application.

[0018] Figure 2 for Figure 1 A schematic diagram of a camera module of an electronic device is shown.

[0019] Figure 3 for Figure 2 Exploded view of the camera module shown.

[0020] Figure 4 for Figure 3 Schematic diagram of the bracket of the camera module shown.

[0021] Figure 5 for Figure 4 Another angle schematic diagram of the bracket shown.

[0022] Figure 6 for Figure 2 The camera module shown is a cross-sectional view along VI-VI.

[0023] Figure 7 A cross-sectional view of a camera module provided in the second embodiment of the present application.

[0024] Figure 8This is a cross-sectional view of a camera module provided in the third embodiment of the present application.

[0025] Fig. 9 This is a cross-sectional view of a camera module provided in the fourth embodiment of the present application.

[0026] Main component symbols

[0027] Electronic device 300

[0028] Shell 301

[0029] Camera module 100, 100', 100", 100''

[0030] Circuit board assembly 10

[0031] Circuit board 11

[0032] Mounting hole 111

[0033] Photosensitive chip 12

[0034] Electronic components 13

[0035] Bracket 20

[0036] Loading plate 21

[0037] The first opening 211

[0038] The second opening 212

[0039] Storage tank 213

[0040] Second anti-reflective layer 214

[0041] Support plate 22

[0042] The first bending portion 221

[0043] The second bending portion 222

[0044] Support space 23

[0045] The first anti-reflective layer 231

[0046] Lens assembly 30

[0047] Lens tube 31

[0048] Lens 32

[0049] Filter 40

[0050] First adhesive layer 401

[0051] Second adhesive layer 41

[0052] Light axis A

[0053] Thickness D

[0054] Gap S

[0055] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0056] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0057] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a central component at the same time. The terms "vertical", "horizontal" and similar expressions used herein are for illustrative purposes only.

[0058] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0059] See also Figure 1 The first embodiment of the present application provides an electronic device 300, which includes a digital camera, a mobile phone, a security device, a robot, a vehicle system, an optical measurement device, a medical device, or other electronic devices with a camera function. The present application embodiment is described by taking a mobile phone as an example.

[0060] The electronic device 300 includes a housing 301 and a camera module 100. The camera module 100 may be exposed from the housing 301. The camera module 100 may be a front camera, a rear camera, or a rotatable camera.

[0061] See also Figure 2 and Figure 3The camera module 100 includes a circuit board assembly 10, a bracket 20 and a lens assembly 30. The bracket 20 is disposed between the circuit board assembly 10 and the lens assembly 30 to play a role of connection and support.

[0062] See also Figure 3 and Figure 6 The circuit board assembly 10 includes a circuit board 11, a photosensitive chip 12 and a plurality of electronic components 13. The photosensitive chip 12 and the plurality of electronic components 13 are both disposed on the circuit board 11. The bracket 20 is disposed on the circuit board 11 and the bracket 20 covers the photosensitive chip 12 and the plurality of electronic components 13. The lens assembly 30 includes a lens barrel 31 and a lens 32. The lens 32 is disposed in the lens barrel 31, and the central axis of the lens barrel 31 coincides with the optical axis A of the lens 32. The lens barrel 31 is disposed on a side of the bracket 20 away from the circuit board 11.

[0063] The circuit board assembly 10 further includes a reinforcing plate 14. The circuit board 11 is provided with a mounting hole 111. The reinforcing plate 14 is disposed on a side of the circuit board 11 away from the electronic component 13, and the reinforcing plate 14 covers the mounting hole 111. The photosensitive chip 12 is disposed in the mounting hole 111, and the photosensitive chip 12 is electrically connected to the circuit board 11.

[0064] During operation, the multiple lenses 32 focus the light reflected by the object to form an image, and the photosensitive chip 12 collects the light signal of the image and converts it into a digital signal. Finally, the digital signal is transmitted to other components of the electronic device 300 (for example, a control mainboard, etc.) through the circuit board 11.

[0065] See also Figure 4 and Figure 5 In this embodiment, the bracket 20 is roughly in the shape of a square frame, and the bracket 20 includes a carrier plate 21 and four support plates 22. The four support plates 22 are arranged around the periphery of the carrier plate 21 to form a support space 23. The photosensitive chip 12 and the plurality of electronic components 13 are all accommodated in the support space 23.

[0066] The carrier plate 21 is provided with a first opening 211 and a plurality of second openings 212. The first opening 211 and the second opening 212 are staggered, and both the first opening 211 and the second opening 212 are connected to the support space 23. One side of the first opening 211 corresponds to the photosensitive chip 12, and the other side corresponds to the lens assembly 30, so that light can pass through the first opening 211 and emit to the photosensitive chip 12. The second opening 212 corresponds to the electronic component 13 one by one, and the end of the electronic component 13 away from the circuit board 11 can be accommodated in the second opening 212, or the end of the electronic component 13 away from the circuit board 11 can be passed through the second opening 212. Among them, the electronic component 13 includes active components and passive components. The active component includes a driver chip, etc., and the passive component includes a resistor, a capacitor, an inductor, etc.

[0067] The bracket 20 provided in the present application is provided with a second opening 212, and the second opening 212 can be used to accommodate the electronic component 13 or allow the electronic component 13 to pass through, so that even if the bracket 20 has a smaller thickness, it will not interfere with the electronic component 13, which is beneficial to reduce the overall thickness of the bracket 20, and further help reduce the thickness of the camera module 100.

[0068] See also Figure 6 In this embodiment, there is a gap S between the edge of the electronic component 13 and the inner peripheral wall of the second opening 212, and the gap S is filled with a colloid 24. The colloid 24 can further enhance the stability of the electronic component 13 and improve the connection strength between the bracket 20 and the circuit board 11.

[0069] In this embodiment, the bracket 20 is an integrally formed structure, the bearing plate 21 and the four support plates 22 are all made of metal, and the thickness D of the bracket 20 is 0.5 to 1 mm. The first opening 211 and the second opening 212 are both formed by mechanical punching. Specifically, the material of the bracket 20 can be a hard alloy such as aluminum alloy, steel, copper alloy, etc. In this way, (a) compared with plastic materials or metal-plastic composite materials, the all-metal bracket 20 has higher strength and rigidity. Under the same size, it can provide better structural support capabilities. (b) The all-metal bracket 20 has better high and low temperature performance and can work normally in a wider temperature range. This is conducive to the stability of the product in different environments. (c) The overall quality of the all-metal bracket 20 is more uniform, which is conducive to the stable distribution of structural stress, improving service life and reliability. (d) By controlling the thickness, the best strength-to-size ratio can be grasped, and the length and width of the bracket can be reduced while meeting the structural requirements, thereby achieving product miniaturization. (V) The metal material has a high thermal conductivity, which is conducive to the effective heat dissipation of high heat load components (e.g., the photosensitive chip 12 and the plurality of electronic components 13), which is conducive to improving the working stability and reliability of the product. (VI) The feed cost of the all-metal bracket 20 is low, which is conducive to reducing the overall manufacturing cost of the camera module 100.

[0070] In this embodiment, the central area of ​​the carrier plate 21 is recessed toward the support space 23 to form a receiving groove 213. The first opening 211 passes through the bottom of the receiving groove 213. A plurality of second openings 212 are arranged around the receiving groove 213. The camera module 100 also includes a filter 40, which is disposed at the bottom of the receiving groove 213, and the filter 40 covers the first opening 211. In this way, light can be filtered by the filter 40, pass through the first opening 211 and be emitted to the photosensitive chip 12. The filter 40 is fixed to the bottom of the receiving groove 213 by a first adhesive layer 401, thereby ensuring the stable operation of the filter 40 in a shaking or tilted state, and the filter 40 can well remove the light components of the photosensitive chip 12 that are not sensitive to color, and can improve the color space of the image.

[0071] See also Figure 4 and Figure 5In this embodiment, the first anti-reflective layer 231 is provided on one side of the plurality of support plates 22 facing the support space 23 and the side of the carrier plate 21 facing the support space 23. The second anti-reflective layer 214 is provided on the inner periphery of the receiving groove 213 and the inner wall of the first opening 211. The first anti-reflective layer 231 and the second anti-reflective layer 214 both include a black oxide layer with a plurality of microporous structures. When light is incident on the first anti-reflective layer 231 and the second anti-reflective layer 214, the plurality of microporous structures play a role similar to a "black body" and absorb the light, thereby reducing the reflection of the light on the bracket 20, which is beneficial to reducing stray light and improving the imaging quality of the camera module 100. Specifically, the first anti-reflective layer 231 and the second anti-reflective layer 214 are both formed by anodizing.

[0072] See also Figure 6 In this embodiment, the lens barrel 31 is connected to the carrier plate 21 via a second adhesive layer 41. The support plate 22 is connected to the circuit board 11 via a welding layer 42. The circuit board 11 is also provided with a plurality of grounding pads 112, which can be connected to a grounding circuit, so that the bracket 20 can be used as an electromagnetic shielding shell to achieve electromagnetic shielding of the photosensitive chip 12 and the plurality of electronic components 13.

[0073] See also Figure 7 The second embodiment of the present application provides a camera module 100', which is different from the first embodiment in that the support plate 22 and the circuit board 11 are connected by a thermal conductive adhesive 43. The thermal conductive adhesive 43 can not only firmly connect the support plate 22 and the circuit board 11, but also conduct the heat of the circuit board 11 to the bracket 20, so that the heat can be quickly dissipated through the bracket 20.

[0074] See also Figure 8 The third embodiment of the present application provides a camera module 100", which is different from the first embodiment in that one end of the support plate 22 away from the carrier plate 21 is bent toward the support space 23 to form a first bending portion 221. The first bending portion 221 is connected to the circuit board 11 through the second adhesive layer 41. In this way, not only can the bonding area be increased and the bonding strength between the bracket 20 and the circuit board 11 be improved, but also the thickness D of the bracket 20 can be further reduced.

[0075] See also Fig. 9The fourth embodiment of the present application provides a camera module 100'', which is different from the first embodiment in that one end of the plurality of support plates 22 away from the carrier plate 21 is bent away from the support space 23 to form a second bent portion 222. The second bent portion 222 is connected to the circuit board 11 through the second adhesive layer 41. In this way, not only can the bonding area be increased and the bonding strength between the bracket 20 and the circuit board 11 be improved, but also the thickness D of the bracket 20 can be further reduced.

[0076] It is understandable that a person skilled in the art can make other corresponding changes and modifications based on the technical concept of the present invention, and all these changes and modifications should fall within the protection scope of the claims of the present invention.

Claims

1. A bracket, characterized in that: The thickness of the bracket is 0.5 to 1 mm. The bracket includes a supporting plate and multiple supporting plates. The multiple supporting plates are arranged around the edge of the supporting plate to form a supporting space. The supporting plate is penetrated by a first opening and multiple second openings. The first opening is staggered with each of the second openings, and the first opening and multiple second openings are connected to the supporting space.

2. The bracket according to claim 1, characterized in that The carrying plate is recessed toward the supporting space to form a receiving groove, the first opening passes through the bottom of the receiving groove, and the second opening is arranged at the periphery of the receiving groove.

3. The bracket according to claim 1, characterized in that: The plurality of support plates include a bending portion, the bending portion is provided at one end of the support plate away from the carrying plate, and the bending portion is bent toward the support space or away from the support space.

4. The bracket according to claim 2, characterized in that: The side of the plurality of support plates facing the support space and the side of the bearing plate facing the support space are both provided with an anti-reflection layer, and the inner periphery of the receiving groove and the inner wall of the first opening are both provided with the anti-reflection layer.

5. The bracket according to claim 1, characterized in that: The bearing plate and the plurality of supporting plates are made of metal.

6. The bracket according to claim 1, characterized in that: The bracket is an integrally formed structure.

7. A camera module, characterized in that: It includes a circuit board assembly, a lens assembly and a bracket as described in any one of claims 1 to 6, wherein the bracket is arranged between the circuit board assembly and the lens assembly, the circuit board assembly includes a circuit board and a photosensitive element and a plurality of electronic components arranged on one side of the circuit board, the photosensitive element is arranged corresponding to the first opening, the plurality of electronic components are arranged corresponding to the second opening and at least some of the electronic components are inserted through the second opening.

8. The camera module according to claim 7, wherein: It also includes a filter, which is arranged on the supporting plate and covers the first opening.

9. The camera module according to claim 7, wherein: The circuit board includes a plurality of grounding pads, and the supporting plate is electrically connected to the grounding pads.

10. An electronic device, characterized in that: Comprising a camera module as described in any one of claims 7 to 9.

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