Heating assembly
By designing wiring wires with lower impedance than heating wires in the heating assembly and connecting them through conductive parts, the thermal test error and wire burning problems caused by excessive impedance of the outlet wires in existing heaters are solved, and more accurate thermal testing is achieved and longer service life.
Patent Information
- Application Number
- CN202311177726.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-08-04
- Filing Date
- 2023-09-13
- Publication Date
- 2025-02-14
AI Technical Summary
The impedance of the outlet wire located outside the heat source area in the existing heat generator is too high, resulting in a large amount of heat generated during heat generation, affecting the thermal test analysis, increasing errors, and possibly causing the wire to burn.
A heating component is designed, including a heating plate and a wiring piece. The heating plate is equipped with a heating conductor. The wiring plate is equipped with a wiring conductor, and its impedance is lower than that of the heating conductor. The two are connected by conductive parts to achieve electrical connection.
It reduces the heat generated by the outgoing wire, reduces the error in thermal testing and analysis, and avoids the wiring wire burning due to high heat, extending the service life.
Smart Images
Figure CN119450831A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a heating component, in particular to a heating component with a low-impedance outlet conductor. Background Art
[0002] With the rapid development of technology, the computing performance of various electronic components has increased significantly, and a large amount of heat will be generated at the same time. When the heat generated by electronic components during operation is too high, it is easy to cause damage to the electronic components, thereby affecting the reliability of the electronic components.
[0003] Generally speaking, during the development of a computer system, researchers need to use a heater to simulate a heat source to perform thermal tests on the various functional parameters of the computer system to verify the reliability of the system. However, the impedance of the outgoing wires outside the heat source area in the current heater is too high, so that the outgoing wires will generate a lot of heat when the heater is heated, which in turn affects the thermal test analysis in the heat source area and increases the error of the test, and even the outgoing wires will burn due to high heat. Therefore, how to reduce the heat generated by the outgoing wires to reduce the error of the thermal test analysis, and avoid the outgoing wires from burning due to high heat to increase the service life, is one of the problems that researchers should solve. Summary of the invention
[0004] The present invention provides a heating component, which reduces the heat generated by the outgoing wire to reduce the error of thermal test analysis, and avoids the outgoing wire from being burned due to high heat to increase the service life.
[0005] A heating component disclosed in an embodiment of the present invention comprises a heating plate and a wiring plate. The heating plate comprises a first insulating layer and a heating wire. The heating wire is disposed on the first insulating layer. The wiring plate comprises an insulating substrate layer and a wiring wire. The insulating substrate layer is disposed on the first insulating layer. The wiring wire is disposed on the insulating substrate layer and is electrically connected to the heating wire. The impedance of the wiring wire is lower than the impedance of the heating wire.
[0006] In one embodiment of the present invention, the heating sheet further includes a second insulating layer, and the heating wire is sandwiched between the first insulating layer and the second insulating layer.
[0007] In one embodiment of the present invention, at least one conductive member is further included. The first insulating layer has at least one through hole. The at least one conductive member passes through the at least one through hole and electrically connects the heating wire and the connection wire.
[0008] In one embodiment of the present invention, the at least one conductive member is a conductive screw, a conductive rivet, solder, a conductive spring, a conductive spring, a conductive foam, or a matching conductive socket and conductive plug.
[0009] In one embodiment of the present invention, the connecting piece is a flexible strip.
[0010] In one embodiment of the present invention, the wiring piece further includes an insulating covering layer, the wiring conductor is sandwiched between the insulating base layer and the insulating covering layer, and the insulating base layer is disposed on the first insulating layer through the insulating covering layer.
[0011] In one embodiment of the present invention, it further comprises at least one conductive member, the first insulating layer has at least one through hole, the insulating covering layer has at least one perforation, the at least one conductive member penetrates the at least one through hole and the at least one perforation, and electrically connects the heating wire and the wiring wire.
[0012] In one embodiment of the present invention, the insulating substrate layer is a circuit board.
[0013] In one embodiment of the present invention, the heating wire includes a first wire, a second wire and a third wire that are separated from each other, and at least two of the first wire, the second wire and the third wire have different widths. The wiring wire includes a first wiring, a second wiring and a third wiring that are separated from each other, and the first wiring, the second wiring and the third wiring are electrically connected to the first wire, the second wire and the third wire respectively.
[0014] In one embodiment of the present invention, the first conductive wire, the second conductive wire and the third conductive wire are all wavy, and at least two of the first conductive wire, the second conductive wire and the third conductive wire have different numbers of wave crests.
[0015] In one embodiment of the present invention, a cable is further included, and the cable is connected to the connection wire.
[0016] In one embodiment of the present invention, a heat conducting block is further included, which is thermally coupled to the heating plate, and the connection point between the cable and the wiring conductor is located outside the extension surface of the periphery of the heat conducting block.
[0017] According to the heating assembly of the above embodiment, since the impedance of the wiring conductor is lower than the impedance of the heating conductor, when the heating sheet is heated, the wiring conductor outside the heat source area will not generate a large amount of heat to affect the thermal test analysis of the heating conductor located in the heat source area, thereby reducing the error of the thermal test data analysis. In addition, the wiring conductor will not burn due to the large amount of heat generated, thereby increasing the service life.
[0018] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 is a three-dimensional schematic diagram of a heating component according to a first embodiment of the present invention;
[0020] Figure 2 for Figure 1 An exploded schematic diagram of the heating components;
[0021] Figure 3 for Figure 1 A plan view of a heating element, a wiring piece and a cable of a heating element;
[0022] Figure 4 for Figure 1 A cross-sectional schematic diagram of a heating component;
[0023] Figure 5 for Figure 1 An enlarged cross-sectional schematic diagram of a heating component;
[0024] Figure 6 is a three-dimensional schematic diagram of a heating component according to a second embodiment of the present invention;
[0025] Figure 7 for Figure 6 An exploded schematic diagram of the heating components;
[0026] Figure 8 It is a schematic plan view of a heating sheet, a connecting sheet and a cable of a heating component according to a third embodiment of the present invention.
[0027]
Explanation of symbols
[0028] 10,10A,10B: Heating components
[0029] 11: Base
[0030] 12: Heating sheet
[0031] 121: first insulating layer
[0032] 1211:Through hole
[0033] 122: Second insulation layer
[0034] 123,123A: Heating wire
[0035] 1231~1233,123A1: Wire
[0036] 13,13A: Terminal block
[0037] 131,131A: Insulating substrate layer
[0038] 132: Insulation covering layer
[0039] 1321:Piercing
[0040] 133,133A: Wiring wire
[0041] 1331~1333,133A1: Wiring
[0042] 14: Conductive parts
[0043] 15,15A: Cable
[0044] 151~153,15A1: Sub-cable
[0045] 16,17: Heat transfer block
[0046] 18: Heat transfer line
[0047] A: Periphery DETAILED DESCRIPTION
[0048] See also Figure 1 and Figure 2 . Figure 1 It is a three-dimensional schematic diagram of a heat generating component according to a first embodiment of the present invention. Figure 2 for Figure 1 Schematic diagram of the exploded view of the heat generating components.
[0049] The heating element 10 of this embodiment is used to simulate a heat source, and includes a base 11, a heating sheet 12, a connecting piece 13, a plurality of conductive members 14, and a cable 15. The heating sheet 12 and the connecting piece 13 are disposed on the base 11. The heating sheet 12 includes a first insulating layer 121, a second insulating layer 122, and a heating wire 123. The material of the first insulating layer 121 and the second insulating layer 122 is, for example, polyimide or ceramic, and the heating wire 123 is sandwiched between the first insulating layer 121 and the second insulating layer 122.
[0050] The wiring sheet 13 is, for example, a flexible printed circuit board (FPCB), and includes an insulating substrate layer 131, an insulating cover layer, and a wiring conductor 133. The wiring conductor 133 is sandwiched between the insulating substrate layer 131 and the insulating cover layer, and the insulating substrate layer 131 is disposed on the first insulating layer 121 through the insulating cover layer. In other words, the insulating cover layer is located between the insulating substrate layer 131 and the first insulating layer 121. The impedance of the wiring conductor 133 is lower than the impedance of the heating conductor 123.
[0051] Please also read Figures 3 to 5 . Figure 3 for Figure 1 A plan view of the heating element, the wiring piece and the cable of the heating component. Figure 4 for Figure 1 A schematic cross-sectional view of a heating component. Figure 5 for Figure 1 An enlarged cross-sectional schematic diagram of a heating component.
[0052] The first insulating layer 121 has a plurality of through holes 1211, and the insulating cover layer has a plurality of through holes 1321. The conductive members 14 are, for example, solder. The conductive members 14 are disposed in the through holes 1211 and the through holes 1321, and electrically connect the heating wire 123 and the wiring wire 133. In other words, the heating wire 123 is electrically connected to the wiring wire 133 through the conductive members 14. In addition, the cable 15 is used to transmit power to the heating wire 123, and is electrically connected to the wiring wire 133.
[0053] In detail, the heating wire 123 includes a first wire 1231, a second wire 1232, and a third wire 1233 that are separated from each other. The widths of at least two of the first wire 1231, the second wire 1232, and the third wire 1233 are, for example, different. The first wire 1231, the second wire 1232, and the third wire 1233 are, for example, all wavy, and the number of crests of at least two of the first wire 1231, the second wire 1232, and the third wire 1233 is, for example, different. In this way, the first wire 1231, the second wire 1232, and the third wire 1233 can form different heat source areas according to different resistance requirements.
[0054] The connection wire 133 includes a first connection wire 1331, a second connection wire 1332 and a third connection wire 1333. The cable 15 includes a first sub-cable 151, a second sub-cable 152 and a third sub-cable 153. The first connection wire 1331 is electrically connected to the first wire 1231 and the first sub-cable 151, the second connection wire 1332 is electrically connected to the second wire 1232 and the second sub-cable 152, and the third connection wire 1333 is electrically connected to the third wire 1233 and the third sub-cable 153.
[0055] In the present embodiment, the heating component 10 may further include an upper heat-conducting block 16, a lower heat-conducting block 17 and a plurality of heat transfer wires 18. The upper heat-conducting block 16 and the lower heat-conducting block 17 are, for example, copper blocks and are thermally coupled to the heating plate 12. These heat transfer wires 18 are used to be respectively connected to the upper heat-conducting block 16 and a temperature sensor (not shown), so that the temperature sensor can sense the current temperature of the heating plate 12 through the heat-conducting blocks 16, 17 and these heat transfer wires 18. The connection between the cable 15 and the wiring conductor 133 is located outside the extension surface of the periphery A of the heat-conducting block. In other words, the connection between the cable 15 and the wiring conductor 133 is away from the heat-conducting block, so it will not interfere with the heat-conducting block. The so-called thermal coupling refers to thermal contact or connection through other heat-conducting media.
[0056] In this embodiment, since the impedance of the wiring conductor 133 is lower than the impedance of the heating conductor 123, when the heating sheet 12 generates heat, the wiring conductor 133 outside the heat source area will not generate a large amount of heat to affect the thermal test analysis of the heating conductor 123 located in the heat source area, thereby reducing the error of the analysis. In addition, the wiring conductor 133 will not be burned due to the large amount of heat generated, so the service life can be further increased.
[0057] In this embodiment, the heating sheet 12 includes a first insulating layer 121, and the connecting piece 13 includes an insulating covering layer, but the present invention is not limited thereto. In other embodiments, the first insulating layer of the heating sheet and the insulating covering layer of the connecting piece can be provided selectively.
[0058] In this embodiment, the material of the first insulating layer 121 and the second insulating layer 122 is polyimide or ceramic, but the present invention is not limited thereto. In other embodiments, the material of the first insulating layer and the second insulating layer may also be other insulating materials.
[0059] In this embodiment, the heating element 10 includes a plurality of conductive members 14, and the heating wire 123 and the connection wire 133 are electrically connected through the conductive members 14, but the present invention is not limited thereto. In other embodiments, the heating element may not include conductive members, and the heating wire and the connection wire may be directly electrically connected by spot welding or laser welding, for example.
[0060] In this embodiment, the conductive members 14 are solder, but the present invention is not limited thereto. In other embodiments, the conductive members may also be conductive screws, conductive rivets, conductive springs, conductive springs, conductive foams, or matching conductive sockets and conductive plugs.
[0061] In this embodiment, the number of the wires 1231, 1232, 1233, the wirings 1331, 1332, 1333, and the sub-cables 151, 152, 153 are three, and are electrically connected through a plurality of through holes 1211 and a plurality of perforations 1321, but the present invention is not limited thereto. In other embodiments, the number of the wires, wirings, and sub-cables may be less than two or more than four, and the number of through holes and perforations may be adjusted according to the number of the wires, wirings, and sub-cables.
[0062] In this embodiment, at least two of the first conductive line 1231 , the second conductive line 1232 , and the third conductive line 1233 have different widths, but the present invention is not limited thereto. In other embodiments, the first conductive line, the second conductive line, and the third conductive line may also have the same width.
[0063] In this embodiment, at least two of the first conductive line 1231, the second conductive line 1232 and the third conductive line 1233 have different numbers of crests, but the present invention is not limited thereto. In other embodiments, the first conductive line, the second conductive line and the third conductive line may also have the same number of crests.
[0064] In this embodiment, the heat generating component 10 includes an upper heat conducting block 16 and a lower heat conducting block 17, but the present invention is not limited thereto. In other embodiments, the heat generating component may also include only the upper heat conducting block.
[0065] See also Figure 6 and Figure 7 . Figure 6 FIG. 4 is a schematic three-dimensional diagram of a heating component according to a second embodiment of the present invention. Figure 7 for Figure 6 Schematic diagram of the exploded view of the heat generating components.
[0066] The heating component 10A of this embodiment is similar to the heating component 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In the heating component 10A of this embodiment, the insulating substrate layer 131A of the wiring piece 13A is, for example, a circuit board. In this way, the operator can simulate the size of the heating component 10A applied to the actual circuit board, thereby accelerating the development and verification time of the actual product. In addition, multiple other control circuits can be integrated through the circuit board to provide additional functions such as time or current protection.
[0067] In the aforementioned embodiment, the heating wire 123 of the heating element 10 includes a first wire 1231, a second wire 1232 and a third wire 1233, the connection wire 133 includes a first connection 1331, a second connection 1332 and a third connection 1333, and the cable 15 includes a first sub-cable 151, a second sub-cable 152 and a third sub-cable 153, but the present invention is not limited thereto. Figure 8 . Figure 8 It is a plan view of the heating sheet, wiring sheet and cable of the heating component according to the third embodiment of the present invention. The heating component 10B of this embodiment is similar to the heating component 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In the heating component 10B of this embodiment, the heating wire 123A may also include only a single wire 123A1, the wiring wire 133A may also include only a single wiring 133A1, and the cable 15A may also include only a single sub-cable 15A1. That is to say, in this embodiment, the heating component 10B may also include only a single heat source area.
[0068] According to the heating assembly of the above embodiment, since the impedance of the wiring conductor is lower than the impedance of the heating conductor, when the heating sheet is heated, the wiring conductor outside the heat source area will not generate a large amount of heat to affect the thermal test analysis of the heating conductor located in the heat source area, thereby reducing the error of the thermal test data analysis. In addition, the wiring conductor will not burn due to the large amount of heat generated, thereby increasing the service life.
[0069] Although the present invention is disclosed as above with the aforementioned embodiments, it is not intended to limit the present invention. Anyone familiar with similar techniques may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be subject to the scope defined by the attached claims.
Claims
1. A heating component, characterized in that: Include: A heating sheet, comprising: a first insulating layer; and A heating wire, disposed on the first insulating layer; and A terminal lug, comprising: An insulating substrate layer, disposed on the first insulating layer; as well as A wiring conductor, disposed on the insulating substrate layer and electrically connected to the heating conductor; The impedance of the connection wire is lower than the impedance of the heating wire.
2. The heating component according to claim 1, characterized in that: The heating sheet further comprises a second insulating layer, and the heating wire is sandwiched between the first insulating layer and the second insulating layer.
3. The heating component according to claim 1, characterized in that: It also includes at least one conductive member. The first insulating layer has at least one through hole. The at least one conductive member passes through the at least one through hole and electrically connects the heating wire and the connection wire.
4. The heating component according to claim 3, characterized in that: The at least one conductive member is a conductive screw, a conductive rivet, solder, a conductive spring, a conductive spring, a conductive foam, or a matching conductive socket and conductive plug.
5. The heating component according to claim 1, characterized in that: The terminal strip is a soft row.
6. The heating component according to claim 1, characterized in that: The wiring piece also includes an insulating covering layer. The wiring conductor is sandwiched between the insulating base layer and the insulating covering layer, and the insulating base layer is arranged on the first insulating layer through the insulating covering layer.
7. The heating component according to claim 6, characterized in that: It also includes at least one conductive member, the first insulating layer has at least one through hole, the insulating covering layer has at least one through hole, the at least one conductive member penetrates the at least one through hole and the at least one through hole, and electrically connects the heating wire and the wiring wire.
8. The heating component according to claim 1, characterized in that: The insulating substrate layer is a circuit board.
9. The heating component according to claim 1, characterized in that: The heating wire includes a first wire, a second wire and a third wire separated from each other, and at least two of the first wire, the second wire and the third wire have different widths. The wiring wire includes a first wiring, a second wiring and a third wiring separated from each other, and the first wiring, the second wiring and the third wiring are electrically connected to the first wire, the second wire and the third wire respectively.
10. The heating component according to claim 9, characterized in that: The first conductive line, the second conductive line and the third conductive line are all wavy, and the number of wave crests of at least two of the first conductive line, the second conductive line and the third conductive line is different.
11. The heating component according to claim 1, characterized in that: The invention also comprises a cable connected to the wiring wire.
12. The heating component according to claim 11, characterized in that: It also includes a heat-conducting block, which is thermally coupled to the heating plate, and the connection point between the cable and the wiring wire is located outside the extension surface of the periphery of the heat-conducting block.