Motor controller and vehicle

Abstract

The invention relates to a motor controller and a vehicle, the motor controller comprises a power module and a radiator, the power module comprises a substrate and a power terminal, the power terminal is arranged on one side of the substrate in the thickness direction, the orthographic projection of the power terminal in the direction towards the substrate covers one part of the substrate, and the orthographic projection of the power terminal in the direction towards the substrate covers one part of the substrate. The end faces, close to the substrate, of the power terminals are electrically connected with the substrate, and the end faces, away from the substrate, of the power terminals are used for being electrically connected with matching parts. The radiator is arranged on one side, far away from the power terminal, of the substrate in the thickness direction of the substrate, and the radiator is connected with the substrate. According to the motor controller disclosed by the invention, the radiator is arranged on one side, far away from the power terminal, of the substrate, so that heat dissipation of the power module can be realized, and the reliability of the motor controller is improved. The parasitic inductance of the power module can be reduced by providing the power terminals on one side of the substrate in the thickness direction.

Description

Technical Field

[0001] The present disclosure relates to the technical field of motor controllers, and in particular to a motor controller and a vehicle. Background Art

[0002] The core component of the motor controller is the power module. As the power switch of the motor controller, the power module's main function is to work with the control drive circuit to convert the external input DC into three-phase AC output. During the current conversion process of the power module, a large amount of heat is generated, and a heat sink is required to dissipate the heat of the motor controller to prevent the temperature inside the motor controller from being too high, which will affect the reliability of the motor controller. At the same time, a power copper busbar is welded on the end of the power module, which is connected to the capacitor by the power copper busbar, resulting in a large parasitic inductance of the power module. Summary of the invention

[0003] The present disclosure provides a motor controller to improve the reliability of the motor controller and reduce the parasitic inductance of a power module.

[0004] The motor controller disclosed in the present invention includes a power module and a heat sink. The power module includes a substrate and a power terminal. The power terminal is arranged on one side of the substrate in the thickness direction. The power terminal's orthographic projection in the direction toward the substrate covers a portion of the substrate. The end face of the power terminal close to the substrate is electrically connected to the substrate, and the end face of the power terminal away from the substrate is used to be electrically connected to a matching component. The heat sink is arranged on a side of the substrate away from the power terminal in the thickness direction of the substrate, and the heat sink is connected to the substrate.

[0005] Optionally, the motor controller further includes a plastic package, the substrate is packaged in the plastic package, and at least a portion of the power terminal is packaged in the plastic package.

[0006] Optionally, the plastic packaging body includes a first plastic packaging part and a second plastic packaging part, the second plastic packaging part protrudes from the first plastic packaging part in a direction away from the substrate, the substrate and a part of the power terminal are encapsulated in the first plastic packaging part, and another part of the power terminal is encapsulated in the second plastic packaging part.

[0007] Optionally, it is characterized in that the power terminal includes a first side surface and a second side surface arranged adjacent to each other, and the first side surface intersects with the second side surface.

[0008] Optionally, the orthographic projection of the power terminal in a direction toward the substrate is a rectangle, and a ratio of a long side to a short side of the rectangle is 1.5 to 6.5.

[0009] Optionally, the power terminal includes a first side surface and a second side surface that are adjacently arranged, and the first side surface intersects with the second side surface.

[0010] Optionally, a protrusion and / or a groove is provided on a side surface of the power terminal.

[0011] Optionally, the power terminal is a conductive block, and a thickness direction of the conductive block is consistent with a thickness direction of the substrate.

[0012] Optionally, the thickness of the conductive block is 2 mm to 5 mm.

[0013] Optionally, there are multiple power terminals, and the multiple power terminals are arranged at intervals around the edge of the substrate.

[0014] Optionally, the power terminal includes an input terminal and an output terminal, and the input terminal and the output terminal are arranged on opposite sides of the substrate along a first direction, and the first direction is perpendicular to the thickness direction of the substrate; the matching component includes a first matching component and a second matching component, and the motor controller also includes an input row and an output row, one end of the input row is electrically connected to the input terminal, and the other end of the input row is electrically connected to the first matching component, one end of the output row is electrically connected to the output terminal, and the other end of the output row is electrically connected to the second matching component.

[0015] Optionally, the motor controller also includes a signal terminal, and the signal terminal and the power terminal are arranged on the same side of the thickness direction of the substrate; the end of the signal terminal close to the substrate is electrically connected to the substrate, and the end of the power terminal away from the substrate is used to be electrically connected to the chip.

[0016] Optionally, the motor controller also includes a connecting board, which is arranged between the substrate and the signal terminal, at least a portion of the connecting board is encapsulated in the plastic package, the connecting board includes a conductive layer and an insulating layer, the insulating layer is arranged between the substrate and the conductive layer, the conductive layer is electrically connected to the substrate, and the signal terminal is electrically connected to the conductive layer.

[0017] Optionally, the connecting plate further comprises a metal layer, the metal layer is arranged on a side of the insulating layer close to the substrate, and the metal layer is welded to the substrate.

[0018] Optionally, the connecting plate is a ceramic copper-clad plate, the insulating layer is a ceramic layer, and the conductive layer and the metal layer are both copper foil layers.

[0019] Optionally, the connecting plate is entirely encapsulated in the plastic package, the plastic package wraps a portion of the surface of the conductive layer away from the substrate, and the plastic package is provided with an escape portion for escaping the signal terminal.

[0020] Optionally, the avoidance portion is a avoidance hole, the signal terminal is arranged in the avoidance hole, and there is a gap between the signal terminal and a hole wall of the avoidance hole.

[0021] Optionally, a covering portion is provided on a surface of the conductive layer away from the insulating layer, the plastic package body wraps the covering portion, and the covering portion includes a groove and / or a protrusion.

[0022] Optionally, the radiator includes a flow channel plate and a heat sink, the flow channel plate is provided with a flow channel groove for the flow of coolant; the heat sink is arranged between the substrate and the flow channel plate, the heat sink is connected to the flow channel plate, the heat sink is provided with cooling fins on the side facing the flow channel plate, and the cooling fins are arranged in the flow channel groove.

[0023] Optionally, the flow channel plate is provided with a liquid inlet and a liquid outlet, the liquid inlet is for cooling liquid to enter the flow channel groove, and the liquid outlet is for cooling liquid to flow out of the flow channel groove, the liquid inlet and the liquid outlet are arranged on opposite sides of the flow channel groove in a second direction, and the second direction is perpendicular to the thickness direction of the substrate; the number of the heat dissipation fins is multiple, and the multiple heat dissipation fins form multiple fin groups, and the multiple fin groups are arranged in sequence along the length direction of the flow channel groove, and the spacing between two adjacent heat dissipation fins in the fin group close to the liquid inlet is greater than the spacing between two adjacent heat dissipation fins in the fin group close to the liquid outlet.

[0024] Optionally, the heat sink includes a plate body and an annular enclosure, wherein the annular enclosure is arranged around the plate body and forms a mounting groove with the plate body, the heat sink fins are arranged in the mounting groove, and the annular enclosure is connected to the flow channel plate.

[0025] Optionally, a boss is provided on a side of the plate body facing the substrate, and the boss is used to be connected to the substrate.

[0026] Optionally, an annular protrusion is provided on the boss, and a receiving groove is formed between the annular protrusion and the boss, and the receiving groove is used to receive solder connecting the boss and the power module.

[0027] Optionally, a positioning protrusion is provided on the boss in the accommodating groove, and the positioning protrusion is used to abut against the power module.

[0028] The present disclosure also provides a vehicle.

[0029] The vehicle disclosed herein includes the motor controller described in any one of the above items.

[0030] The motor controller disclosed in the present invention can achieve heat dissipation of the power module by arranging a heat sink on the side of the substrate away from the power terminal and connecting the heat sink to the substrate, thereby preventing the temperature inside the motor controller from being too high and improving the reliability of the motor controller. By arranging the power terminal on one side of the thickness direction of the substrate and the orthographic projection of the power terminal in the direction toward the substrate covering a part of the substrate, the power terminal can adopt a block or sheet structure, thereby reducing the parasitic inductance of the power module. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a stereoscopic diagram of a motor controller according to an embodiment of the present disclosure.

[0032] Figure 2 It is an exploded view of one perspective of the motor controller of an embodiment of the present disclosure.

[0033] Figure 3 It is an exploded diagram of the motor controller of the embodiment of the present disclosure from another perspective.

[0034] Figure 4 is a stereoscopic diagram of a power module of a motor controller according to an embodiment of the present disclosure.

[0035] Figure 5 It is a partial cross-sectional view of a power module of a motor controller according to an embodiment of the present disclosure.

[0036] Figure 6 The main view of the connection between the power module of the motor controller of the embodiment of the present disclosure and the input row and the output row Figure 1 .

[0037] Figure 7 The main view of the connection between the power module of the motor controller of the embodiment of the present disclosure and the input row and the output row Figure 2 .

[0038] Figure 8 yes Figure 7 AA view.

[0039] Fig. 9 yes Figure 7 BB direction view.

[0040] Fig.10 is an exploded diagram of a power module, an input row, and an output row of a motor controller according to an embodiment of the present disclosure.

[0041] Fig.11 4 is a cross-sectional view of a signal terminal of a power module of a motor controller according to an embodiment of the present disclosure.

[0042] Fig.12 It is a schematic diagram of the structure of the connection between the signal terminal and the connection row of the power module of the motor controller of the embodiment of the present disclosure.

[0043] Fig.13 It is a stereoscopic diagram of a flow channel plate of a motor controller according to an embodiment of the present disclosure.

[0044] Fig.14 4 is a cross-sectional view of a flow channel plate and a heat sink of a motor controller according to an embodiment of the present disclosure.

[0045] Fig.15 It is a three-dimensional diagram of the heat dissipation plate of the motor controller according to an embodiment of the present disclosure.

[0046] Fig.16 is a bottom view of the heat sink of the motor controller according to an embodiment of the present disclosure.

[0047] Fig.17 yes Fig.16 CC view.

[0048] Fig.18 yes Fig.17 A partial enlarged view of point E in the middle.

[0049] Reference numerals:

[0050] 100. Motor controller;

[0051] 10. Power module; 101. First power module; 102. Second power module; 103. Third power module;

[0052] 1. substrate; 11. first copper cladding layer; 12. ceramic layer; 13. second copper cladding layer;

[0053] 2. power terminal; 21. input terminal; 211. first pole terminal; 2111. first terminal; 2112. second terminal; 212. second pole terminal; 22. output terminal; 2001. first end surface; 2002. second end surface;

[0054] 3. Plastic sealing body; 31. First plastic sealing part; 32. Second plastic sealing part; 321. Protruding part; 3211. Avoiding part;

[0055] 4. signal terminal; 41. base; 42. terminal body;

[0056] 5. connecting plate; 51. conductive layer; 511. covering portion; 52. insulating layer; 53. metal layer;

[0057] 6. Wire;

[0058] 7. Chip;

[0059] 81, first solder layer; 82, second solder layer; 83, third solder layer;

[0060] 201, input row; 202, first pole input row; 2021, first main body; 2022, first extension; 2023, second extension; 203, second pole input row; 2031, second main body; 2032, third extension; 204, output row;

[0061] 30. Radiator;

[0062] 301, flow channel plate; 3011, flow channel groove; 3012, liquid inlet; 3013, liquid outlet; 3014, positioning column;

[0063] 302, heat sink; 3021, first fin group; 3022, second fin group; 3023, third fin group; 3024, heat sink fin; 3025, plate body; 3026, annular enclosure; 3056, mounting groove; 3027, boss; 3028, annular protrusion; 3029, receiving groove; 3030, positioning protrusion; 3031, positioning hole; 3032, connecting ear; 3033, connecting hole; 3034, sealing groove;

[0064] 303. Seals. DETAILED DESCRIPTION

[0065] Embodiments of the present disclosure are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present disclosure, but should not be understood as limiting the present disclosure.

[0066] like Figures 1 to 5 As shown, the motor controller 100 of the embodiment of the present disclosure includes a power module 10 and a heat sink 30. The power module 10 includes a substrate 1 and a power terminal 2. The power terminal 2 is arranged on one side of the substrate 1 in the thickness direction, and the orthographic projection of the power terminal 2 in the direction toward the substrate 1 covers a part of the substrate 1. The end surface of the power terminal 2 close to the substrate 1 is electrically connected to the substrate 1, and the end surface of the power terminal 2 away from the substrate 1 is used to be electrically connected to the matching component. The heat sink 30 is arranged on the side of the substrate 1 away from the power terminal 2 in the thickness direction of the substrate 1, and the heat sink 30 is connected to the substrate 1.

[0067] The motor controller 100 of the embodiment of the present disclosure can achieve heat dissipation of the power module 10 by arranging a heat sink 30 on a side of the substrate 1 away from the power terminal 2, and connecting the heat sink 30 to the substrate 1, thereby preventing the temperature inside the motor controller 100 from being too high, and improving the reliability of the motor controller 100. By arranging the power terminal 2 on one side in the thickness direction of the substrate 1, and the orthographic projection of the power terminal 2 in the direction toward the substrate 1 covers a part of the substrate 1, the power terminal 2 can adopt a block or sheet structure, thereby reducing the parasitic inductance of the power module 10.

[0068] In order to make the technical solution of the present disclosure easier to understand, the technical solution of the present disclosure is further described below by taking the case where the thickness direction of the substrate 1 is consistent with the up-down direction as an example.

[0069] For example, Figure 4 and Figure 5 As shown, the power terminal 2 is arranged on the upper side of the substrate 1, and the downward projection of the power terminal 2 covers a part of the substrate 1. The lower end surface of the power terminal 2 is electrically connected to the substrate 1, and the upper end surface of the power terminal 2 is used to be electrically connected to the mating component.

[0070] Optionally, the substrate 1 is a ceramic copper clad laminate.

[0071] For example, Figure 5 As shown, the substrate 1 includes a first copper clad layer 11, a ceramic layer 12 and a second copper clad layer 13. The first copper clad layer 11 is arranged on the upper side of the ceramic layer 12, and the second copper clad layer 13 is arranged on the lower side of the ceramic layer 12. The power terminal 2 is arranged on the upper side of the first copper clad layer 11, and the lower end surface of the power terminal 2 is electrically connected to the first copper clad layer 11.

[0072] Optionally, the power terminal 2 is welded to the substrate 1 .

[0073] For example, Figure 5 As shown, the power terminal 2 has a first end face 2001 and a second end face 2002 arranged opposite to each other along the thickness direction of the substrate 1, wherein the first end face 2001 is the lower end face of the power terminal 2, and the second end face 2002 is the upper end face of the power terminal 2. The first end face 2001 is welded to the substrate 1, and the second end face 2002 is used for welding with a matching component. The power terminal 2 and the substrate 1 can be welded through a first solder layer 81. The first solder layer 81 can be a system soldering tin solder, or a silver paste or copper paste used for sintering.

[0074] The welding of the power terminal 2 and the substrate 1 is beneficial to improving the connection reliability between the power terminal 2 and the substrate 1 , and is beneficial to improving the reliability of the power module 10 .

[0075] In the related art, when the power terminal adopts a power copper busbar, the entire power terminal is a cantilever structure. Regardless of whether the power terminal and the mating component are connected by welding or screws, the power terminal will be deformed to varying degrees due to the existence of assembly tolerances, etc., resulting in stress concentration problems at the junction of the power terminal and the plastic package, and ultimately causing the plastic package to crack easily at the junction with the power terminal, causing the power module to easily suffer from insulation failure problems.

[0076] In some embodiments, Figure 4 and Figure 5As shown, the power module 10 further includes a plastic package 3 , the substrate 1 is packaged in the plastic package 3 , and at least a portion of the power terminal 2 is packaged in the plastic package 3 .

[0077] Among them, at least a part of the power terminal 2 is encapsulated in the plastic package 3, which can be understood as: a part of the power terminal 2 is encapsulated in the plastic package 3, and the other part of the power terminal 2 is located outside the plastic package 3; or, the power terminal 2 is encapsulated in the plastic package 3 as a whole.

[0078] By covering a portion of the substrate 1 with the orthographic projection of the power terminal 2 in the direction toward the substrate 1, at least a portion of the power terminal 2 is encapsulated in the plastic package 3, so that the stress concentration problem at the junction of the power terminal 2 and the plastic package can be avoided, and the risk of insulation failure of the power module 10 can be reduced. In addition, the plastic package 3 can also be used to indirectly realize the mechanical connection between the power terminal 2 and the substrate 1, thereby improving the connection reliability between the power terminal 2 and the substrate 1, and further improving the reliability of the power module 10.

[0079] Alternatively, if Figure 5 As shown, the plastic encapsulation body 3 includes a first plastic encapsulation portion 31 and a second plastic encapsulation portion 32, and the second plastic encapsulation portion 32 is arranged to protrude from the first plastic encapsulation portion 31 in a direction away from the substrate 1. The substrate 1 and a portion of the power terminal 2 are encapsulated in the first plastic encapsulation portion 31, and another portion of the power terminal 2 is encapsulated in the second plastic encapsulation portion 32.

[0080] For example, Figure 5 As shown, the second plastic encapsulation part 32 is arranged to protrude upward from the first plastic encapsulation part 31. The lower part of the substrate 1 and the power terminal 2 is encapsulated in the first plastic encapsulation part 31, and the upper part of the power terminal 2 is encapsulated in the second plastic encapsulation part 32.

[0081] It is understandable that the end surface of the power terminal 2 away from the substrate 1 will protrude from the substrate 1, so there is a difference between the height of the plastic encapsulation body 3 required for the substrate 1 and the height of the plastic encapsulation body 3 required for the power terminal 2. By setting the plastic encapsulation body 3 to include a first plastic encapsulation part 31 and a second plastic encapsulation part 32, the first plastic encapsulation part 31 is used to encapsulate a part of the substrate 1 and the power terminal 2, and the second plastic encapsulation part 32 is used to encapsulate another part of the power terminal 2, while achieving a good plastic encapsulation effect for the substrate 1 and the power terminal 2, the overall volume of the plastic encapsulation body 3 can be avoided to be large, thereby helping to reduce the cost of the power module 10.

[0082] Alternatively, if Figure 5 As shown, the end surface of the power terminal 2 away from the first plastic sealing portion 31 is flush with the end surface of the second plastic sealing portion 32 away from the first plastic sealing portion 31 .

[0083] For example, the upper end surface of the power terminal 2 is flush with the upper end surface of the second plastic sealing part 32 .

[0084] By setting the end surface of the power terminal 2 away from the first plastic sealing part 31 and the end surface of the second plastic sealing part 32 away from the first plastic sealing part 31 to be flush, the plastic sealing effect of the power terminal 2 can be improved while the second plastic sealing part 32 can be prevented from affecting the electrical connection between the power terminal 2 and the matching component, thereby improving the reliability of the power module 10.

[0085] In the related art, the power terminal and the mating component are mostly connected by welding, for example, the power terminal and the mating component are welded by laser. The power terminal is usually a power copper busbar. When the power terminal and the mating component are welded, it is easy to burn through the power terminal, further burn the power module, cause the insulation failure of the power module, and result in poor connection reliability between the power module and the mating component.

[0086] In some embodiments, the power terminal 2 is a conductive block, and the thickness direction of the conductive block is consistent with the thickness direction of the substrate 1 .

[0087] By setting the power terminal 2 as a conductive block, the thickness of the conductive block is relatively large, so that when the power terminal 2 is electrically connected to the matching component, the power terminal 2 can be prevented from being burned through, thereby preventing the power module 10 from being burned, and improving the connection reliability between the power module 10 and the matching component.

[0088] Optionally, the thickness of the conductive block is 2 mm to 5 mm.

[0089] For example, Figure 5 As shown, the thickness of the conductive block is H, and H is 3 mm.

[0090] It can be understood that the greater the thickness of the conductive block, the less likely it is to burn through the power terminal 2 when the power terminal 2 is electrically connected to the mating component, and the better the connection reliability between the power module 10 and the mating component. However, the thickness of the power module 10 will also be greater and the cost will be higher. The smaller the thickness of the conductive block, the smaller the thickness of the power module 10 and the lower the cost. However, the easier it is to burn through the power terminal 2 when the power terminal 2 is electrically connected to the mating component, and the worse the connection reliability between the power module 10 and the mating component.

[0091] By setting the thickness of the conductive block to 2 mm to 5 mm, the connection reliability between the power module 10 and the mating component can be improved while the thickness of the power module 10 can be reduced and the cost of the power module 10 can be reduced.

[0092] Optionally, the power terminal 2 includes a first side surface and a second side surface that are adjacently arranged, and the first side surface intersects the second side surface.

[0093] By setting the first side surface and the second side surface of the power terminal 2 to intersect, the bonding force between the power terminal 2 and the plastic package 3 can be increased, the connection reliability between the power terminal 2 and the plastic package 3 can be improved, and the reliability of the power module 10 can be further improved.

[0094] Optionally, the orthographic projection of the power terminal 2 in the direction toward the substrate 1 is a polygon.

[0095] For example, the orthographic projection of the power terminal 2 in the direction toward the substrate 1 is a triangle, a quadrilateral, a pentagon, a hexagon, or the like.

[0096] By setting the orthographic projection in the direction toward the substrate 1 to be a polygon, the bonding force between the power terminal 2 and the plastic package 3 can be further increased, and the reliability of the power module 10 can be further improved.

[0097] Of course, in other embodiments, the outer side surface of the power terminal 2 may also be a cylindrical surface. In this case, the orthographic projection of the power terminal 2 in the direction toward the substrate 1 is a circle.

[0098] Optionally, the orthographic projection of the power terminal 2 in the direction toward the substrate 1 is a rectangle, and the ratio of the long side to the short side of the rectangle is 1.5 to 6.5.

[0099] For example, the orthographic projection of the first side surface in the direction toward the substrate 1 is the short side, the orthographic projection of the second side surface in the direction toward the substrate 1 is the long side, and the ratio of the long side to the short side is 4.

[0100] By setting the orthographic projection of the power terminal 2 in the direction toward the substrate 1 to be a rectangle, the processing and manufacturing of the power terminal 2 is facilitated. By setting the ratio of the long side to the short side of the rectangle to 1.5 to 6.5, the connection reliability between the power terminal 2 and the matching component can be ensured when the width of the power terminal 2 is narrow.

[0101] Optionally, the power terminal 2 is in a prism shape.

[0102] For example, the power terminal 2 is in the shape of a prism such as a quadrangular prism, a triangular prism, or a hexagonal prism.

[0103] By setting the power terminal 2 to be in a prism shape, the processing and manufacturing of the power terminal 2 is facilitated, which is beneficial to reducing the cost of the power module 10 .

[0104] Optionally, a protrusion and / or a groove is provided on a side surface of the power terminal 2 .

[0105] By setting a protrusion and / or a groove on the side of the power terminal 2, the contact area between the power terminal 2 and the plastic package 3 can be increased, the bonding force between the power terminal 2 and the plastic package 3 can be increased, the connection reliability between the power terminal 2 and the plastic package 3 can be improved, and the reliability of the power module 10 can be improved.

[0106] In the related technology, the power terminal uses a power copper busbar. The overall structure of the power copper busbar is complex and can only be made of pure copper, which leads to a large difference in the expansion coefficient between the power terminal and the plastic package. During the operation of the power module, the power terminal and the plastic package will experience repeated high and low temperature changes, which can easily cause cracking problems at the connection between the power terminal and the plastic package, thereby causing insulation failure of the power module.

[0107] Optionally, the power terminal 2 is made of alloy.

[0108] Optionally, there are multiple power terminals 2 , and the multiple power terminals 2 are arranged at intervals around the edge of the substrate 1 .

[0109] For example, the number of the power terminals 2 is four, and the four power terminals 2 are arranged at intervals around the edge of the substrate 1 .

[0110] By arranging the power terminals 2 around the edge of the substrate 1 , it is convenient to connect the power terminals 2 with the mating components, thereby facilitating the connection of the power module 10 with the mating components.

[0111] The motor controller 100 of the disclosed embodiment has a simple structure of the power terminal 2, which is easy to form and has good processability, so that there are more choices for the material of the power terminal 2. For example, a copper-molybdenum alloy material or other material with a coefficient of expansion close to the plastic package 3 can be used to reduce the risk of cracking at the connection between the power terminal 2 and the plastic package 3, and reduce the risk of insulation failure of the power module 10.

[0112] Alternatively, if Figures 6 to 10 As shown, the power terminal 2 includes an input terminal 21 and an output terminal 22, and the input terminal 21 and the output terminal 22 are arranged on opposite sides of the substrate 1 along a first direction, and the first direction is perpendicular to the thickness direction of the substrate 1. The matching component includes a first matching component and a second matching component, and the motor controller 100 also includes an input row 201 and an output row 204, one end of the input row 201 is electrically connected to the end face of the input terminal 21 away from the substrate 1, and the other end of the input row 201 is electrically connected to the first matching component, one end of the output row 204 is electrically connected to the end face of the output terminal 22 away from the substrate 1, and the other end of the output row 204 is electrically connected to the second matching component.

[0113] For example, the input terminal 21 is arranged on the front side of the substrate 1, and the output terminal 22 is arranged on the rear side of the substrate 1. The first matching component is a capacitor, and the second matching component is a three-phase input phase line of the motor.

[0114] By arranging the input terminal 21 and the output terminal 22 on opposite sides of the first direction, not only the electrical insulation performance between the input terminal 21 and the output terminal 22 can be ensured, but also the input terminal 21 and the output terminal 22 can be conveniently electrically connected to different matching components.

[0115] Alternatively, if Figures 6 to 10 As shown, the number of input terminals 21 and input row 201 are both multiple, the input terminal 21 includes a first pole terminal 211 and a second pole terminal 212, the input row 201 includes a first pole input row 202 and a second pole input row 203, the first pole input row 202 is electrically connected to the first pole terminal 211, and the second pole input row 203 is electrically connected to the second pole terminal 212. A part of the orthographic projection of the first pole input row 202 in the thickness direction toward the substrate 1 covers a part of the orthographic projection of the second pole input row 203 in the thickness direction toward the substrate 1.

[0116] Among them, one of the first pole terminal 211 and the second pole terminal 212 is a positive pole terminal, the other of the first pole terminal 211 and the second pole terminal 212 is a negative pole terminal, one of the first pole input row 202 and the second pole input row 203 is a positive pole input row 201, and the other of the first pole input row 202 and the second pole input row 203 is a negative pole input row 201.

[0117] For example, the first pole terminal 211 is a positive pole terminal, the second pole terminal 212 is a negative pole terminal, the first pole input row 202 is a positive pole input row, and the second pole input row 203 is a negative pole input row. Fig.10 As shown, the current directions of the first pole input row 202 and the second pole input row 203 are opposite.

[0118] By covering a part of the orthographic projection of the first pole input row 202 in the thickness direction toward the substrate 1 with a part of the orthographic projection of the second pole input row 203 in the thickness direction toward the substrate 1, since the current directions of the first pole input row 202 and the second pole input row 203 are opposite (the current direction of the first pole input row 202 is as shown in FIG. Fig.10 As shown by the arrow D1 in FIG. 1 , the current direction of the second pole input row 203 is as follows: Fig.10 As shown by the arrow D2 in FIG. 1 ), the stray inductance between the first pole input row 202 and the second pole input row 203 can be significantly reduced, and the equivalent series inductance (ESL) of the motor controller 100 can be reduced, so that the motor controller 100 can operate at a higher voltage.

[0119] Alternatively, if Figure 7 and Figure 8As shown, the first pole input row 202 includes a first main body 2021, a first extension 2022 and a second extension 2023, and the first extension 2022 and the second extension 2023 are arranged on the same side of the first main body 2021 in the first direction and are both electrically connected to the first main body 2021. There are multiple first pole terminals 211, and the first pole terminal 211 includes a first terminal 2111 and a second terminal 2112. The first extension 2022 and the second extension 2023 are arranged at intervals along the second direction, and the first terminal 2111 and the second terminal 2112 are arranged at intervals along the second direction. Among them, the first extension 2022 is electrically connected to the first terminal 2111, and the second extension 2023 is electrically connected to the second terminal 2112. The first direction is perpendicular to the second direction, and the first direction and the second direction are both perpendicular to the thickness direction of the substrate 1.

[0120] By configuring the first pole input row 202 to include a first main body portion 2021, a first extension portion 2022 and a second extension portion 2023, configuring the first pole terminal 2111 to include a first terminal 2111 and a second terminal 2112, the first extension portion 2022 is electrically connected to the first terminal 2111, and the second extension portion 2023 is electrically connected to the second terminal 2112, the connection area between the first pole input row 202 and the power module 10 can be increased, thereby improving the current transmission capacity between the power module 10 and the mating component.

[0121] In order to make the technical solution of the present disclosure easier to understand, the following takes the first direction being consistent with the front-to-back direction and the second direction being consistent with the left-to-right direction as an example to further describe the technical solution of the present disclosure.

[0122] For example, the first extension portion 2022 and the second extension portion 2023 are disposed at the rear side of the first main body portion 2021 , the first extension portion 2022 is disposed on the left side of the second extension portion 2023 , and the first terminal 2111 is disposed on the left side of the second terminal 2112 .

[0123] Alternatively, if Fig. 9 and Fig.10 As shown, the second pole input row 203 includes a second main body portion 2031 and a third extension portion 2032, wherein the third extension portion 2032 is disposed on one side of the second main body portion 2031 in the first direction and is electrically connected to the second main body portion 2031. The third extension portion 2032 is electrically connected to the second pole terminal 212. At least a portion of the orthographic projection of the first main body portion 2021 in the thickness direction of the substrate 1 covers at least a portion of the orthographic projection of the second main body portion 2031 in the thickness direction of the substrate 1.

[0124] Among them, at least a part of the orthographic projection of the first main body portion 2021 in the thickness direction toward the substrate 1 covers at least a part of the orthographic projection of the second main body portion 2031 in the thickness direction toward the substrate 1, which can be understood as: a part of the orthographic projection of the first main body portion 2021 in the thickness direction toward the substrate 1 covers a part of the orthographic projection of the second main body portion 2031 in the thickness direction toward the substrate 1, and another part of the orthographic projection of the first main body portion 2021 in the thickness direction toward the substrate 1 covers another part of the orthographic projection of the second main body portion 2031 in the thickness direction toward the substrate 1; or, the orthographic projection of the first main body portion 2021 in the thickness direction toward the substrate 1 covers the orthographic projection of the second main body portion 2031 in the thickness direction toward the substrate 1.

[0125] For example, Fig. 9 and Fig.10 As shown, the second extension portion 2023 is disposed at the rear side of the second main body portion 2031. The downward orthographic projection of the first main body portion 2021 covers the downward orthographic projection of the second main body portion 2031.

[0126] By having at least a portion of the orthographic projection of the first main body 2021 in the thickness direction toward the substrate 1 cover at least a portion of the orthographic projection of the second main body 2031 in the thickness direction toward the substrate 1, the stacking portion between the first pole input row 202 and the second pole input row 203 can be increased, the stray inductance between the first pole input row 202 and the second pole input row 203 can be effectively reduced, and the equivalent inductance of the motor controller 100 can be reduced, thereby enabling the motor controller 100 to operate at a higher voltage.

[0127] Alternatively, if Figures 8 to 10 As shown, the second main body 2031 is arranged on a side of the first main body 2021 away from the substrate 1 in the thickness direction of the substrate 1. The first extension portion 2022 and the second extension portion 2023 are bent in a direction toward the substrate 1. The second terminal 212 is arranged between the first terminal 2111 and the second terminal 2112 in the second direction. The third extension portion 2032 is arranged between the first extension portion 2022 and the second extension portion 2023 in the second direction.

[0128] For example, the second main body 2031 is disposed on the upper side of the first main body 2021. The first extension 2022 and the second extension 2023 are bent downward. The third extension 2032 is disposed between the first extension 2022 and the second extension 2023 in the left-right direction.

[0129] By designing the first extension portion 2022, the second extension portion 2023 and the third extension portion 2032 as described above, the first extension portion 2022, the second extension portion 2023 and the third extension portion 2032 can be arranged more compactly, and the first terminal 2111, the second terminal 2112 and the second terminal 212 can be arranged more compactly, thereby further reducing the volume of the motor controller 100.

[0130] Optionally, at least one of a surface of the first extending portion 2022 facing the substrate 1 and a surface of the second extending portion 2023 facing the substrate 1 is flush with a surface of the third extending portion 2032 facing the substrate 1 .

[0131] For example, the lower surface of the first extension portion 2022 , the lower surface of the second extension portion 2023 , and the lower surface of the third extension portion 2032 are flush.

[0132] By making at least one of the surface of the first extension portion 2022 facing the substrate 1 and the surface of the second extension portion 2023 facing the substrate 1 flush with the surface of the third extension portion 2032 facing the substrate 1 , the volume of the motor controller 100 can be further reduced.

[0133] Optionally, the connection area between the second terminal 212 and the third extension portion 2032 is larger than the connection area between the first terminal 2111 and the first extension portion 2022. The connection area between the second terminal 212 and the third extension portion 2032 is larger than the connection area between the second terminal 2112 and the second extension portion 2023.

[0134] For example, the connection area between the second terminal 212 and the third extension portion 2032 is S1, the connection area between the first terminal 2111 and the first extension portion 2022 is S2, and the connection area between the second terminal 2112 and the second extension portion 2023 is S3. The sum of S2 and S3 is equal to S1, or the sum of S2 and S3 is greater than S1, or the sum of S2 and S3 is less than S1.

[0135] It can be understood that the current between the first pole input row 202 and the second pole input row 203 is equal, and the current transmission capacity of the first pole input row 202 and the second pole input row 203 is equivalent. By performing the above-mentioned design on the connection area between the second pole terminal 212 and the third extension portion 2032, the connection area between the first terminal 2111 and the first extension portion 2022, and the connection area between the second pole terminal 212 and the third extension portion 2032, the current transmission capacity of the first pole input row 202 and the second pole input row 203 is equivalent.

[0136] Optionally, the input terminal 21 and the output terminal 22 are arranged on opposite sides of the substrate 1 in the first direction. The input row 201 and the output row 204 are arranged on opposite sides of the substrate 1 in the first direction.

[0137] For example, Figures 6 to 10 As shown, the input terminal 21 is arranged in front of the output terminal 22, and the input row 201 is arranged in front of the output row 204. The output row 204 is used to be directly or indirectly connected to the three-phase input phase line of the motor.

[0138] By arranging the input terminal 21 and the output terminal 22 on opposite sides of the substrate 1 in the first direction, the input row 201 and the output row 204 are arranged on opposite sides of the substrate 1 in the first direction, so that the distance between the input row 201 and the output row 204 is relatively far, the insulation performance between the input row 201 and the output row 204 is improved, and the safety of the motor controller 100 is improved.

[0139] Alternatively, if Figure 4 , Figures 8 to 12 As shown, the power module 10 further includes a signal terminal 4, which is arranged on the same side of the thickness direction of the substrate 1 as the power terminal 2. The end of the signal terminal 4 close to the substrate 1 is electrically connected to the substrate 1, and the end of the power terminal 2 away from the substrate 1 is used to be electrically connected to the chip.

[0140] The end of the signal terminal 4 away from the substrate 1 is used to connect with a semiconductor chip (eg, an IGBT chip), so that a control signal is input to the semiconductor chip through the signal terminal 4 .

[0141] For example, Figure 4 As shown, the signal terminals 4 and the power terminals 2 are both arranged on the upper side of the substrate 1 .

[0142] By arranging the signal terminal 4 and the power terminal 2 on the same side of the substrate 1 in the thickness direction, the wiring operation between the power module 10 and the mating component and between the power module 10 and the chip is facilitated, thereby improving the installation efficiency of the power module 10 .

[0143] Optionally, the signal terminal 4 is a signal pin.

[0144] For example, the signal terminal 4 is a spring signal pin.

[0145] In the related art, the power module sets the signal terminal on one side of the substrate in the thickness direction, and the signal terminal is directly welded to the substrate or welded through a copper block. At this time, the substrate needs to be cut to form an island, which not only leads to a higher equivalent series inductance (ESL) of the power module, but also reduces the current carrying capacity of the power module.

[0146] In some embodiments, Fig.11 and Fig.12As shown, the power module 10 includes a connection board 5, which is stacked and connected to the substrate 1, and at least a portion of the connection board 5 is encapsulated in the second plastic sealing part 32. The connection board 5 includes a conductive layer 51 and an insulating layer 52, the insulating layer 52 is arranged between the substrate 1 and the conductive layer 51, and the conductive layer 51 is electrically connected to the substrate 1. The signal terminal 3 is arranged on a side of the conductive layer 51 away from the insulating layer 52 and is electrically connected to the conductive layer 51.

[0147] The motor controller 100 of the disclosed embodiment connects the connection plate 5 to the substrate 1, and connects the signal terminal 4 to the connection plate 5, so as to achieve a fixed connection between the signal terminal 4 and the substrate 1. By setting the connection plate 5 to include a conductive layer 51 and an insulating layer 52, the conductive layer 51 is electrically connected to the substrate 1, and the signal terminal 4 is electrically connected to the conductive layer 51, so as to achieve an electrical connection between the signal terminal 4 and the substrate 1. By arranging the insulating layer 52 between the substrate 1 and the conductive layer 51, insulation between the conductive layer 51 and the substrate 1 can be achieved, so that there is no need to cut the substrate 1 to form an island, which not only reduces the equivalent inductance of the power module 10, but also improves the current carrying capacity of the power module 10. In addition, by arranging the signal terminal 4 on one side in the thickness direction of the substrate 1, the upper and lower bridges of the power module 10 can be more consistent and the structure can be more compact.

[0148] For example, Fig.11 As shown, the connection plate 5 is arranged on the upper side of the substrate 1, the conductive layer 51 is arranged on the upper side of the insulating layer 52, and the signal terminal 4 is arranged on the upper side of the conductive layer 51. The lower end of the signal terminal 4 is electrically connected to the conductive layer 51, and the lower end of the signal terminal 4 is insulated from the substrate 1 by the insulating layer 52.

[0149] Optionally, the substrate 1 is a ceramic copper clad laminate.

[0150] For example, Fig.11 As shown, the substrate 1 includes a first copper clad layer 11, a ceramic layer 12 and a second copper clad layer 13. The first copper clad layer 11 is arranged on the upper side of the ceramic layer 12, and the second copper clad layer 13 is arranged on the lower side of the ceramic layer 12. The connecting plate 5 is arranged on the upper side of the first copper clad layer 11, and the lower end of the connecting plate 5 is connected to the first copper clad layer 11.

[0151] like Fig.11 As shown, the signal terminal 4 includes a base 41 and a terminal body 42 , and the base 41 is electrically connected to the conductive layer 51 .

[0152] The signal terminal 4 is electrically connected to the conductive layer 51 through the base 41 , which can increase the connection area between the signal terminal 4 and the conductive layer 51 and improve the connection reliability between the signal terminal 4 and the conductive layer 51 .

[0153] Optionally, the signal terminal 4 is welded to the conductive layer 51 .

[0154] For example, the signal terminal 4 and the conductive layer 51 are laser welded.

[0155] By welding the signal terminal 4 and the conductive layer 51 , the connection reliability between the signal terminal 4 and the conductive layer 51 is improved, and the reliability of the power module 10 is improved.

[0156] In some embodiments, Fig.11 As shown, the connecting plate 5 further includes a metal layer 53 , and the metal layer 53 is welded to the substrate 1 .

[0157] For example, Fig.11 As shown, the power module 10 further includes a second solder layer 82, which is disposed between the metal layer 53 and the substrate 1 in the thickness direction of the substrate 1. The metal layer 53 is soldered to the substrate 1 through the second solder layer 82. The second solder layer 82 may be a system soldering tin solder, or may be a silver paste or a copper paste used for sintering.

[0158] By welding the metal layer 53 to the substrate 1 , the connection between the connecting plate 5 and the substrate 1 is achieved, which can improve the connection reliability between the connecting plate 5 and the substrate 1 , and is beneficial to improving the reliability of the power module 10 .

[0159] Optionally, the connection board 5 is a ceramic copper-clad board (Direct Bonding Copper, DBC), the insulating layer 52 is a ceramic layer, and the conductive layer 51 and the metal layer 53 are both copper foil layers.

[0160] By using the connection plate 5 as a ceramic copper-clad plate, not only the insulation performance of the insulating layer 52 can be ensured, but also the current carrying capacity of the conductive layer 51 can be ensured, thereby improving the reliability of the power module 10 .

[0161] Optionally, the connecting plate 5 is entirely encapsulated in the plastic package 3 .

[0162] By encapsulating the entire connecting plate 5 in the plastic package 3 , the connection reliability between the connecting plate 5 and the plastic package 3 can be improved, and the reliability of the power module 10 can be further improved.

[0163] Alternatively, if Fig.11 As shown, the plastic package body 3 is provided with an avoidance portion 3211 for avoiding the signal terminal 4 , and the plastic package body 3 wraps a portion of the surface of the conductive layer 51 away from the substrate 1 .

[0164] For example, Fig.11 As shown, the second plastic sealing part 32 includes a protruding part 321, which protrudes upward from the upper side of the connecting plate 5, and the lower end of the protruding part 321 wraps the upper surface of the connecting plate 5. The protruding part 321 is provided with an escape part 3211 for escaping the signal terminal 4.

[0165] By wrapping the plastic package 3 with a portion of the conductive layer 51 away from the surface of the substrate 1, the bonding force between the plastic package 3 and the connecting plate 5 can be increased, the connection reliability between the plastic package 3 and the connecting plate 5 can be improved, and the reliability of the power module 10 can be improved. In addition, the avoidance portion 3211 is provided on the plastic package 3 to avoid direct contact between the signal terminal 4 and the plastic package 3, thereby avoiding cracking of the signal terminal 4 and the plastic package 3 due to different expansion coefficients, resulting in insulation failure of the power module 10, and improving the reliability of the power module 10.

[0166] Optionally, the avoidance portion 3211 is an avoidance hole, the signal terminal 4 is disposed in the avoidance hole, and there is a gap between the signal terminal 4 and a hole wall of the avoidance hole.

[0167] By setting the avoidance portion 3211 as an avoidance hole, the connection reliability between the plastic package body 3 and the connection plate 5 can be increased, thereby improving the reliability of the power module 10.

[0168] Optionally, a covering portion 511 is provided on a surface of the conductive layer 51 away from the insulating layer 52 , and the plastic package body 3 wraps the covering portion 511 , and the covering portion 511 includes a groove and / or a protrusion.

[0169] For example, a groove is formed by etching on the conductive layer 51. The groove and the protrusion can increase the adhesion between the plastic package body 3 and the conductive layer 51.

[0170] By providing a covering portion 511 on the conductive layer 51, the bonding force between the plastic package body 3 and the connecting plate 5 can be increased, the connection reliability between the plastic package body 3 and the connecting plate 5 can be improved, the plastic package body 3 and the connecting plate 5 can be prevented from being delaminated, water vapor can be prevented from entering the power module 10, and the insulation performance of the power module 10 can be improved.

[0171] Optionally, the orthographic projection of the insulating layer 52 in the direction toward the substrate 1 is larger than the orthographic projection of the conductive layer 51 in the direction toward the substrate 1. Alternatively, the orthographic projection of the insulating layer 52 in the direction toward the substrate 1 is smaller than the orthographic projection of the conductive layer 51 in the direction toward the substrate 1.

[0172] For example, Fig.11 As shown, the area of ​​the insulating layer 52 is larger than the area of ​​the conductive layer 51, so that the side of the insulating layer 52 protrudes from the conductive layer 51, thereby increasing the bonding force between the plastic package 3 and the connecting plate 5. Of course, the area of ​​the insulating layer 52 can also be smaller than the area of ​​the conductive layer 51, so that the side of the conductive layer 51 protrudes from the insulating layer 52, thereby increasing the bonding force between the plastic package 3 and the connecting plate 5.

[0173] Thus, the connection reliability between the plastic package body 3 and the connecting plate 5 can be improved, the plastic package body 3 and the connecting plate 5 can be prevented from being delaminated, water vapor can be prevented from entering the power module 10 , and the insulation performance of the power module 10 can be improved.

[0174] Alternatively, if Fig.12As shown, the conductive layer 51 is electrically connected to the substrate 1 via a wire 6 .

[0175] One end of the wire 6 is electrically connected to the conductive layer 51 , and the other end of the wire 6 is electrically connected to the substrate 1 .

[0176] The conductive layer 51 is electrically connected to the substrate 1 via the wire 6 , which facilitates the electrical connection between the conductive layer 51 and the substrate 1 and facilitates the processing and manufacturing of the power module 10 .

[0177] like Fig.11 As shown, the power module 10 further includes a chip 7 . The chip 7 and the signal terminal 4 are arranged on the same side in the thickness direction of the substrate 1 . The chip 7 is electrically connected to the substrate 1 .

[0178] In some embodiments, Figures 1 to 3 As shown, the radiator 30 includes a flow channel plate 301 and a heat sink 302. The flow channel plate 301 is provided with a flow channel groove 3011 for the flow of coolant, and the heat sink 302 is arranged between the substrate 1 and the flow channel plate 301. The heat sink 302 is connected to the flow channel plate 301, and a heat sink fin 3024 is provided on the side of the heat sink 302 facing the flow channel plate 301, and the heat sink fin 3024 is arranged in the flow channel groove 3011.

[0179] The motor controller 100 of the embodiment of the present disclosure is configured such that the heat sink 30 includes a flow channel plate 301 and a heat sink 302, and a flow channel groove 3011 for the flow of coolant is provided on the flow channel plate 301, and heat sink fins 3024 are provided on the heat sink 302, and the heat sink fins 3024 are provided in the flow channel groove 3011, so that the heat generated by the power module 10 can be transferred to the heat sink 302, and the heat of the heat sink 302 is transferred to the external environment through the coolant, thereby improving the heat dissipation effect of the motor controller 100.

[0180] Alternatively, if Figure 2 , Fig.13 and Fig.14 As shown, the flow channel plate 301 is provided with a liquid inlet 3012 and a liquid outlet 3013, the liquid inlet 3012 is for the coolant to enter the flow channel groove 3011, and the liquid outlet 3013 is for the coolant to flow out of the flow channel groove 3011, and the liquid inlet 3012 and the liquid outlet 3013 are arranged on opposite sides of the flow channel groove 3011 in the second direction, and the second direction is perpendicular to the thickness direction of the substrate 1. For example, the second direction is consistent with the left-right direction.

[0181] For example, Fig.13 and Fig.14 As shown, the liquid inlet 3012 is arranged on the left side of the liquid outlet 3013 , and the coolant enters the flow channel 3011 from the liquid inlet 3012 , then flows from left to right, and finally flows out from the liquid outlet 3013 to the outside.

[0182] It can be understood that, as the coolant absorbs more and more heat along the flow direction of the coolant, the temperature of the coolant becomes higher and higher, and the heat dissipation effect of the corresponding power module 10 becomes worse.

[0183] like Figure 3 and Fig.16 As shown, there are multiple heat dissipation fins 3024, and the multiple heat dissipation fins 3024 form multiple fin groups, and the multiple fin groups are arranged in sequence along the length direction of the flow channel groove 3011. The distance between two adjacent heat dissipation fins 3024 in the fin group close to the liquid inlet 3012 is greater than the distance between two adjacent heat dissipation fins 3024 in the fin group close to the liquid outlet 3013.

[0184] For example, Fig.16 As shown, the heat dissipation fins 3024 form three fin groups, which are respectively the first fin group 3021, the second fin group 3022 and the third fin group 3023. The first fin group 3021 is arranged on the left side of the second fin group 3022, and the second fin group 3022 is arranged on the left side of the third fin group 3023. The distance between two adjacent heat dissipation fins 3024 in the first fin group 3021 is L1, the distance between two adjacent heat dissipation fins 3024 in the second fin group 3022 is L2, and the distance between two adjacent heat dissipation fins 3024 in the third fin group 3023 is L3, L1 is greater than L2, and L2 is greater than L3.

[0185] By setting the distance between two adjacent cooling fins 3024 in the fin group near the liquid inlet 3012 to be larger than the distance between two adjacent cooling fins 3024 in the fin group near the liquid outlet 3013, the cooling area of ​​the radiator 30 near the liquid outlet 3013 is made larger than the cooling area of ​​the radiator 30 near the liquid inlet 3012, thereby improving the cooling effect of the radiator 30 near the liquid inlet 3012, thereby improving the heat dissipation uniformity of the motor controller 100.

[0186] Alternatively, if Fig.16 and Fig.17 As shown, the heat sink 302 includes a plate body 3025 and an annular plate 3026, the annular plate 3026 is arranged around the plate body 3025, and forms a mounting groove 3056 with the plate body 3025. The heat sink fins 3024 are arranged in the mounting groove 3056, and the annular plate 3026 is connected to the flow channel plate 301.

[0187] By setting the heat sink 302 to the above structure, the annular enclosure 3026 can strengthen the plate body 3025, improve the anti-deformation ability of the heat sink 302, and effectively improve the overall rigidity of the heat sink 302.

[0188] like Figure 2 and Figure 3As shown, the motor controller 100 includes a seal 303, which is disposed between the flow channel plate 301 and the heat sink 302. The seal 303 is used to improve the sealing between the flow channel plate 301 and the heat sink 302 and reduce the risk of leakage of the coolant.

[0189] like Figure 2 and Fig.13 As shown, the annular enclosure plate 3026 is provided with a sealing groove 3034 , and the sealing member 303 is arranged in the sealing groove 3034 .

[0190] Alternatively, if Figure 2 , Fig.15 , Fig.17 and Fig.18 As shown, a boss 3027 is provided on one side of the plate body 3025 facing the substrate 1 , and the boss 3027 is used to connect with the substrate 1 .

[0191] The boss 3027 may be provided to increase the thickness of the plate body 3025 , which is beneficial to increase the rigidity of the plate body 3025 and improve the overall rigidity of the heat dissipation plate 302 .

[0192] Alternatively, if Figure 2 As shown, an annular protrusion 3028 is provided on the boss 3027 , and a receiving groove 3029 is formed between the annular protrusion 3028 and the boss 3027 . The receiving groove 3029 is used to receive solder connecting the boss 3027 and the power module 10 .

[0193] For example, the power module 10 is soldered to the boss 3027 via the third solder layer 83 .

[0194] By setting an annular protrusion 3028 on the boss 3027, a receiving groove 3029 is formed between the annular protrusion 3028 and the boss 3027. The receiving groove 3029 is used to accommodate solder, which can prevent the solder from overflowing, which is beneficial to improving the welding effect of the power module 10 and the heat sink 302 and improving the connection reliability of the power module 10 and the heat sink 302.

[0195] Alternatively, if Figure 2 and Fig.15 As shown, a positioning protrusion 3030 is provided on the boss 3027 in the receiving groove 3029 , and the positioning protrusion 3030 is used to abut against the power module 10 .

[0196] By providing the positioning protrusion 3030 and utilizing the positioning protrusion 3030 to abut against the power module 10, it is possible to prevent the power module 10 from directly contacting the boss 3027. That is, the provision of the positioning protrusion 3030 can ensure that there is a certain interval between the power module 10 and the boss 3027, and the solder in the interval will not overflow. Thus, the minimum thickness of the solder can be ensured, and overflow of the solder in the receiving groove 3029 can be prevented.

[0197] Alternatively, if Fig.15 As shown, the number of the positioning protrusions 3030 can be multiple, and the multiple positioning protrusions 3030 are arranged in multiple rows and columns.

[0198] The number of bosses 3027 may be determined according to the number of power modules 10. Figure 2 and Figure 3 As shown, the number of power modules 10 is three, and the three power modules 10 are respectively a first power module 101, a second power module 102 and a third power module 103. The number of bosses 3027 can also be three, and the bosses 24 correspond to and are welded with the power modules 10 one by one. In addition, the fin groups correspond to the power modules 10 one by one, for example, the first power module 101 corresponds to the first fin group 3021, the second power module 102 corresponds to the second fin group 3022, and the third power module 103 corresponds to the third fin group 3023.

[0199] Alternatively, if Fig.13 , Fig.15 and Fig.16 As shown, one of the annular enclosure plate 3026 and the flow channel plate 301 is provided with a positioning column 3014, and the other is provided with a positioning hole 3031, and the positioning column 3014 is positioned and matched with the positioning hole 3031.

[0200] For example, the annular enclosure plate 3026 is provided with a positioning hole 3031 , and the flow channel plate 301 is provided with a positioning column 3014 , and the positioning column 3014 is positioned and matched with the positioning hole 3031 .

[0201] By positioning the positioning column 3014 and the positioning hole 3031 , the positioning reliability of the flow channel plate 301 and the heat dissipation plate 302 can be improved, thereby improving the reliability of the heat sink 30 .

[0202] Alternatively, if Fig.15 and Fig.16 As shown, the annular enclosure 3026 is provided with a connecting ear 3032 , and the connecting ear 3032 is provided with a connecting hole 3033 . The connecting hole 3033 is used to connect with other components of the motor controller 100 to fix the radiator 30 .

[0203] The motor controller 100 of the disclosed embodiment can make the upper and lower bridges more consistent and the structure more compact by setting the signal terminal 4 on one side in the thickness direction of the substrate 1; the parasitic inductance of the power module 10 can be reduced by setting the power terminal 2 as a conductive block; the above-mentioned design of the heat sink 30 has no water accumulation efficiency, and the heat dissipation performance of the motor controller 100 is good.

[0204] The vehicle of the embodiment of the present disclosure includes the motor controller 100 described in any of the above embodiments, wherein the vehicle may be an electric vehicle.

[0205] Although the embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are illustrative and cannot be construed as limitations on the present disclosure. Changes, modifications, substitutions and variations of the above embodiments by those of ordinary skill in the art are all within the scope of protection of the present disclosure.

Claims

1. A motor controller, characterized in that: include: A power module, the power module comprising a substrate and a power terminal, the power terminal being arranged on one side of the substrate in a thickness direction, the orthographic projection of the power terminal in a direction toward the substrate covering a portion of the substrate, the end surface of the power terminal close to the substrate being electrically connected to the substrate, and the end surface of the power terminal away from the substrate being used for being electrically connected to a mating component; A heat sink is arranged on a side of the substrate away from the power terminal in a thickness direction of the substrate, and the heat sink is connected to the substrate.

2. The motor controller according to claim 1, characterized in that: It also includes a plastic package, the substrate is packaged in the plastic package, and at least a portion of the power terminal is packaged in the plastic package.

3. The motor controller according to claim 2, characterized in that: The plastic packaging body includes a first plastic packaging part and a second plastic packaging part, wherein the second plastic packaging part protrudes from the first plastic packaging part in a direction away from the substrate, the substrate and a part of the power terminal are encapsulated in the first plastic packaging part, and another part of the power terminal is encapsulated in the second plastic packaging part.

4. The motor controller according to claim 2, characterized in that: The power terminal includes a first side surface and a second side surface that are adjacently arranged, and the first side surface intersects the second side surface.

5. The motor controller according to claim 4, characterized in that: The orthographic projection of the power terminal in the direction toward the substrate is a rectangle, and the ratio of the long side to the short side of the rectangle is 1.5 to 6.

5.

6. The motor controller according to claim 2, characterized in that: The side surface of the power terminal is provided with a protrusion and / or a groove.

7. The motor controller according to claim 1, characterized in that: The power terminal is a conductive block, and a thickness direction of the conductive block is consistent with a thickness direction of the substrate.

8. The motor controller according to claim 7, characterized in that: The thickness of the conductive block is 2 mm to 5 mm.

9. The motor controller according to claim 1, characterized in that: There are multiple power terminals, and the multiple power terminals are arranged at intervals around the edge of the substrate.

10. The motor controller according to claim 1, characterized in that: The power terminal comprises an input terminal and an output terminal, wherein the input terminal and the output terminal are arranged on opposite sides of the substrate along a first direction, and the first direction is perpendicular to a thickness direction of the substrate; The matching components include a first matching component and a second matching component, and the motor controller also includes an input row and an output row, one end of the input row is electrically connected to the input terminal, and the other end of the input row is electrically connected to the first matching component, one end of the output row is electrically connected to the output terminal, and the other end of the output row is electrically connected to the second matching component.

11. The motor controller according to claim 2, characterized in that: Also comprising a signal terminal, wherein the signal terminal and the power terminal are arranged on the same side of the substrate in the thickness direction; An end of the signal terminal close to the substrate is electrically connected to the substrate, and an end of the power terminal away from the substrate is used to be electrically connected to the chip.

12. The motor controller according to claim 11, characterized in that: It also includes a connecting plate, which is arranged between the substrate and the signal terminal, at least a portion of the connecting plate is encapsulated in the plastic package, the connecting plate includes a conductive layer and an insulating layer, the insulating layer is arranged between the substrate and the conductive layer, the conductive layer is electrically connected to the substrate, and the signal terminal is electrically connected to the conductive layer.

13. The motor controller according to claim 12, characterized in that: The connection plate further comprises a metal layer, which is arranged on a side of the insulating layer close to the substrate, and the metal layer is welded to the substrate.

14. The motor controller according to claim 13, characterized in that: The connecting plate is a ceramic copper-clad plate, the insulating layer is a ceramic layer, and the conductive layer and the metal layer are both copper foil layers.

15. The motor controller according to claim 14, characterized in that: The connecting plate is entirely encapsulated in the plastic package, the plastic package wraps a portion of the conductive layer away from the surface of the substrate, and the plastic package is provided with an escape portion for escaping the signal terminal.

16. The motor controller according to claim 15, characterized in that: The avoidance portion is an avoidance hole, the signal terminal is arranged in the avoidance hole, and there is a gap between the signal terminal and the hole wall of the avoidance hole.

17. The motor controller according to claim 15, characterized in that: A covering portion is provided on a surface of the conductive layer away from the insulating layer. The plastic package body wraps the covering portion. The covering portion includes a groove and / or a protrusion.

18. The motor controller according to claim 1, characterized in that: The radiator comprises: A flow channel plate, wherein the flow channel plate is provided with a flow channel groove for the flow of the coolant; A heat sink is arranged between the substrate and the flow channel plate, the heat sink is connected to the flow channel plate, a heat sink is provided on a side of the heat sink facing the flow channel plate, and the heat sink is arranged in the flow channel groove.

19. The motor controller according to claim 18, characterized in that: The flow channel plate is provided with a liquid inlet and a liquid outlet, the liquid inlet is for cooling liquid to enter the flow channel groove, the liquid outlet is for cooling liquid to flow out of the flow channel groove, the liquid inlet and the liquid outlet are arranged on opposite sides of the flow channel groove in a second direction, and the second direction is perpendicular to the thickness direction of the substrate; There are multiple heat dissipation fins, and the multiple heat dissipation fins form multiple fin groups. The multiple fin groups are arranged in sequence along the length direction of the flow channel. The distance between two adjacent heat dissipation fins in the fin group near the liquid inlet is greater than the distance between two adjacent heat dissipation fins in the fin group near the liquid outlet.

20. The motor controller according to claim 18, characterized in that: The heat sink includes a plate body and an annular enclosure. The annular enclosure is arranged around the plate body and forms a mounting groove with the plate body. The heat sink fins are arranged in the mounting groove. The annular enclosure is connected to the flow channel plate.

21. The motor controller according to claim 20, characterized in that: A boss is provided on one side of the plate body facing the base plate, and the boss is used to be connected to the base plate.

22. The motor controller according to claim 21, characterized in that: An annular protrusion is arranged on the boss, and a receiving groove is formed between the annular protrusion and the boss, and the receiving groove is used to receive solder connecting the boss and the power module.

23. The motor controller according to claim 22, characterized in that: The boss is provided with a positioning protrusion in the receiving groove, and the positioning protrusion is used to abut against the power module.

24. A vehicle, characterized in that: A motor controller comprising any one of claims 1-23.

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