Back drilling depth determination method, circuit board thickness detection method and object parameter generation method

Abstract

The invention provides a backdrilling depth determination method. The backdrilling depth determination method comprises the following steps: acquiring theoretical thicknesses and actual thicknesses of a plurality of hole sites on a circuit board to be processed; the theoretical thickness and the actual thickness of each hole position are compared, and a first hole position and an abnormal hole position are determined; a target hole site is selected from the multiple first hole sites, the multiple first hole sites close to the target hole site are searched for the first time, the actual thicknesses of the multiple searched first hole sites are obtained, and the corrected actual thickness of the target hole site is determined; and determining the actual back drilling depth of the target hole site according to the corrected actual thickness, the theoretical thickness and the theoretical back drilling depth of the target hole site. The invention further discloses a method for detecting the thickness of the circuit board and an object parameter generation method. According to the method, each hole site on the circuit board to be machined is independently corrected, and the back drilling machining precision is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field related to methods for manufacturing circuit boards, and in particular to a method for determining back drilling depth, a method for detecting circuit board thickness, and a method for generating object parameters. Background Art

[0002] With the continuous iteration and upgrading of technology, more and more intelligent devices are applied to industrial manufacturing and processing processes, such as circuit board processing equipment. These circuit board processing equipment have multiple spindle components for processing, which greatly improves the processing efficiency.

[0003] The current circuit board drilling processing equipment obtains the actual thickness of the hole after bottom and top surface detection, and corrects the depth control value in the drill belt according to the preset theoretical thickness before depth controlled drilling. However, the thickness of the circuit board directly determines the depth control value, and it is necessary to ensure the accuracy of the thickness detection of the circuit board to be processed. First, the actual thickness may be different between different areas of some circuit board plates; the existing method can only input a theoretical thickness in the drill belt, and it is not possible to correct the depth control value of each hole well. Secondly, the means and environment of the detection device (thermal expansion and contraction, circuit board surface warping, uneven table surface) will cause the thickness measured at some holes to be different from the actual thickness, resulting in distortion of the detected circuit board thickness; and the default data is completely true and correct, and the data is not corrected, so some thickness parameters will be distorted, causing poor plate processing or even scrapping. Finally, the thickness distribution of the same batch of circuit boards cannot be consistent. The current detection method cannot guarantee that the actual depth control value calculated for each circuit board to be processed is in line with the actual situation.

[0004] Therefore, improving the thickness detection accuracy of each hole on the circuit board to be processed, ensuring the actual thickness of each hole is accurate, and realizing differentiated detection or correction of multiple holes, thereby improving the accuracy of back drilling depth, is a technical problem that technicians in this field need to solve.

[0005] Application Contents

[0006] In order to solve the problems existing in the prior art, the present disclosure provides a circuit board processing device and a circuit board processing control method.

[0007] According to a first aspect of the present disclosure, a backdrill depth determination method is provided, comprising: obtaining theoretical thicknesses and actual thicknesses of a plurality of hole positions on a circuit board to be processed; comparing the theoretical thickness and actual thickness of each hole position to determine a first hole position and an abnormal hole position; selecting a target hole position from the plurality of first hole positions, first searching for a plurality of first hole positions adjacent to the target hole position, obtaining the actual thicknesses of the searched plurality of first hole positions, and determining a corrected actual thickness of the target hole position; and determining an actual backdrill depth of the target hole position according to the corrected actual thickness, the theoretical thickness, and the theoretical backdrill depth of the target hole position.

[0008] In one embodiment of the present disclosure, obtaining the actual thicknesses of the searched multiple first hole positions and determining the corrected actual thickness of the target hole position includes: determining the corrected actual thickness of the target hole position based on the median or average of the actual thicknesses of the searched multiple first hole positions.

[0009] In one embodiment of the present disclosure, the actual thickness of the target hole is compared with the median or the average value. When the actual thickness of the target hole is within a preset threshold range of the median or the average value, the median or the average value is determined as the corrected actual thickness of the target hole.

[0010] In one embodiment of the present disclosure, when the actual thickness of the target hole position is not within a preset threshold range of the median or the average value, a plurality of first hole positions adjacent to the target hole position are searched a second time to determine a corrected actual thickness of the target hole position.

[0011] In one embodiment of the present disclosure, the number of first hole positions searched the second time is greater than the number of first hole positions searched the first time; or, the range of the second search for first hole positions is greater than the range of the first search for first hole positions.

[0012] In one embodiment of the present disclosure, the theoretical thickness and actual thickness of each hole position are compared to determine the first hole position and the abnormal hole position, including: when the difference between the theoretical thickness and the actual thickness is within a preset threshold range, it is determined as the first hole position, and when it is not within the preset threshold range, it is determined as the abnormal hole position.

[0013] In one embodiment of the present disclosure, a plurality of first hole positions adjacent to the abnormal hole position are searched for the first time, actual thicknesses of the searched plurality of first hole positions are acquired, and a corrected actual thickness of the abnormal hole position is determined.

[0014] In one embodiment of the present disclosure, the search is to query multiple first hole positions by spreading outward from the target hole position or the abnormal hole position as the center to determine the number and range of the multiple first hole positions searched.

[0015] According to a second aspect of the present disclosure, a method for detecting the thickness of a circuit board is provided, which is applied to a circuit board processing device, and includes: detecting the actual thicknesses of a plurality of hole positions on the circuit board to be processed; judging a first hole position and an abnormal hole position based on a difference between the actual thickness of each hole position and a theoretical thickness; selecting a target hole position from the plurality of first hole positions, searching for a first time a plurality of first hole positions adjacent to the target hole position, obtaining the actual thicknesses of the plurality of searched first hole positions, and determining a corrected actual thickness of the target hole position based on a median or an average of the actual thicknesses of the plurality of searched first hole positions.

[0016] In one embodiment of the present disclosure, a plurality of first hole positions adjacent to the abnormal hole position are searched for the first time, actual thicknesses of the plurality of searched first hole positions are obtained, and a corrected actual thickness of the abnormal hole position is determined based on the median or average of the actual thicknesses of the plurality of searched first hole positions.

[0017] According to a third aspect of the present disclosure, there is provided an object parameter generation method, which is applied to circuit board processing equipment, and the method comprises: obtaining basic object parameters, the basic object parameters comprising theoretical thicknesses and actual thicknesses of a plurality of hole positions on a circuit board to be processed; comparing the theoretical thickness and actual thickness of each hole position to determine a first hole position and an abnormal hole position; searching for a first hole position adjacent to each hole position, and determining a corrected actual thickness of each hole position based on a median or average of the actual thicknesses of the plurality of first hole positions searched; and generating target object parameters based on the corrected actual thickness and theoretical thickness of each hole position.

[0018] In one embodiment of the present disclosure, the corrected actual thickness of each first hole position is determined based on the median or average of the actual thicknesses of multiple first hole positions searched adjacent to each first hole position; or, the corrected actual thickness of each abnormal hole position is determined based on the median or average of the actual thicknesses of multiple first hole positions searched adjacent to each abnormal hole position.

[0019] The back-drilling depth determination method, the circuit board thickness detection method, and the object parameter generation method have the following beneficial effects: on the one hand, the thickness of each hole on the circuit board to be processed can be independently corrected, which can greatly improve the accuracy of the back-drilling depth of each hole. On the other hand, not only the thickness of the normal first hole can be corrected, but also the thickness of the abnormal hole can be corrected, which reduces the back-drilling depth abnormality caused by the abnormal thickness, reduces the scrap rate of back-drilling, and improves the product quality.

[0020] Other features and advantages of the present disclosure will become apparent from the following detailed description of exemplary embodiments of the present disclosure with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0022] Figure 1 It is a schematic diagram of a portion of the structure of a circuit board to be processed provided by an embodiment of the present disclosure;

[0023] Figure 2 It is a schematic diagram of a portion of the structure of a circuit board to be processed provided by an embodiment of the present disclosure;

[0024] Figure 3 It is a partial flow chart of a back drilling depth determination method provided by an embodiment of the present disclosure;

[0025] Figure 4 It is a partial flow chart of a method for detecting the thickness of a circuit board provided by an embodiment of the present disclosure;

[0026] Figure 5 It is a partial flow chart of a method for generating object parameters provided by an embodiment of the present disclosure;

[0027] Figures 1 to 5 The one-to-one correspondence between the component names and the reference numerals is as follows:

[0028] 10. Circuit board to be processed; 11. Sub-circuit board; 110. First hole position; 111. Abnormal hole position; 112. Target hole position. DETAILED DESCRIPTION

[0029] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of the components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present disclosure. The following description of at least one exemplary embodiment is actually merely illustrative and is by no means intended to limit the present disclosure and its application or use. Techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered part of the specification. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0030] The specific embodiments of the present disclosure are described below in conjunction with the accompanying drawings. In this article, "upper", "lower", "front", "back", "left", "right", etc. are only used to indicate the relative position relationship between the relevant parts, rather than to limit the absolute positions of these relevant parts. In this article, "first", "second", etc. are only used to distinguish each other, rather than to indicate the degree of importance and order, as well as the premise of mutual existence, etc. In this article, "equal", "same", "synchronous", "sequentially", "consistent", "symmetrical", "copy", "center of a circle", etc. are not strict mathematical and / or geometric limitations, but also include errors that can be understood by those skilled in the art and are allowed in manufacturing or use.

[0031] In the back drilling process, the back drilling depth is a key technical parameter. One of the key factors affecting the back drilling depth is the thickness of the circuit board to be processed. How to accurately detect the actual thickness of the circuit board to be processed, especially the actual thickness at each hole position of the circuit board to be processed, is the key to improving the depth control accuracy. To this end, the present disclosure provides a back drilling depth determination method for determining the back drilling depth at each hole position of the circuit board to be processed on a circuit board processing device. The present disclosure also provides a method for detecting the thickness of a circuit board, which is used to detect the actual thickness at each hole position of the circuit board to be processed on a circuit board processing device. The present disclosure also provides an object parameter determination method, which is applicable to circuit board processing equipment, and generates new target object parameters based on the original basic object parameters and the corrected actual thickness of each hole position for back drilling processing of each hole position.

[0032] The circuit board processing equipment disclosed in the present invention includes a base, a crossbeam, a spindle assembly, a workbench, etc. The workbench is arranged on the base, and a crossbeam is erected above the workbench. At least one spindle assembly is slidably connected to the crossbeam, and each spindle assembly moves along the first direction on the crossbeam. The workbench is on the base and moves along the second direction. At least one processing position is arranged on the workbench, and a circuit board to be processed is placed on each processing position. Each spindle assembly corresponds to the circuit board to be processed on each processing position, and the tool clamped at the bottom end of each spindle assembly moves along the third direction to process the corresponding circuit board to be processed. The first direction, the second direction, and the third direction are perpendicular to each other. In the contextual embodiments of the present invention, the circuit board processing equipment can be implemented as a drilling device, a molding device, a gong machine device, a drilling and gonging integrated device, etc., which is not limited here. In the upper and lower embodiments of the present invention, at least one spindle assembly is slidably connected to the crossbeam of the circuit board processing equipment, and the number of spindle assemblies here can be one, two, three, four, six, ten, twelve, etc., and the structure and function of each spindle assembly are basically the same, which is not limited here.

[0033] At least one spindle assembly is slidably connected to the crossbeam of the circuit board processing equipment, and each spindle assembly includes a camera, a detection member, a spindle, a base plate, etc. The spindle, camera, detection member, etc. are fixedly arranged on the base plate, and the spindle assembly moves along the first direction on the crossbeam through the base plate. In the spindle assembly, the camera is mainly used to detect the actual center coordinates of each hole position, and provide basic data for correcting and compensating the center position, thereby improving the processing accuracy. The detection member is an electrical signal sensing and acquisition module, which can detect the thickness at each hole position of the circuit board to be processed. Specifically, the spindle assembly clamps a metal standard rod or a tool to contact each metal layer at each hole position of the circuit board to be processed, and the detection member receives the feedback pulse signal to determine the actual thickness at each hole position of the circuit board to be processed.

[0034] In the upper and lower embodiments of the present disclosure, the circuit boards to be processed are of different types, and their materials, sizes, thicknesses, softness and hardness are different, and the physical properties of the circuit boards to be processed of different types are very different. However, these circuit boards to be processed are all fixed in the processing position on the workbench, and the high-speed moving spindle assembly clamps the tool and moves along the third direction to process the circuit boards to be processed. There are many ways to fix the circuit boards to be processed on the workbench, including but not limited to: air clamps, bakelite boards, adsorption devices, etc. These fixing methods can achieve the circuit boards to be processed Stably and reliably fixed in the processing position on the workbench, so that the high-speed moving tool does not move when processing the circuit boards to be processed.

[0035] Each processing position on the workbench carries a circuit board to be processed, such as Figure 1 As shown, each circuit board to be processed includes multiple sub-circuit boards, and the multiple sub-circuit boards have the same layout structure, which is arranged in a matrix structure on the entire circuit board to be processed. Each sub-circuit board includes multiple hole positions, which are arranged in the sub-circuit board according to a predetermined layout structure. The spindle assembly clamps the tool and processes the multiple hole positions on the sub-circuit board in sequence according to a predetermined path and order. In the upper and lower embodiments of the present disclosure, the multiple hole positions on the circuit board to be processed refer to the positions of the through holes that need to be deep-processed, and each hole position has a predetermined center coordinate; the thickness of the hole position refers to the thickness of the board of the circuit board to be processed at the center coordinate of the through hole.

[0036] There are multilayer boards and single-layer boards to be processed. The multilayer and single-layer here mainly refer to the metal conductive layer, and the multilayer board contains multiple metal conductive layers. The multilayer board can integrate multiple circuit layouts to reduce the volume of the circuit board to be processed, carry more circuit layouts, increase the scale of integrated circuits per unit area, and reduce the volume of the circuit board to be processed. In the field of ultra-precision electronic technology, multilayer boards are widely used. Multilayer circuit boards need to achieve selective electrical conduction between multilayer circuits, which requires the use of back drilling process to process through holes. Back drilling is a secondary drilling process. After the through hole is processed on the front side, it is subjected to copper plating process, and the secondary drilling process is performed on the back side to remove the excess copper layer, so as to achieve selective electrical conduction between some layers in the through hole. Some layers are connected through metal copper, and some layers are not conductive after the copper is removed.

[0037] For this reason, Figure 3 As shown, the present disclosure provides a back-drilling depth determination method, including: obtaining the theoretical thickness and actual thickness of multiple hole positions on a circuit board to be processed; comparing the theoretical thickness and actual thickness of each hole position to determine the first hole position and the abnormal hole position; selecting a target hole position from the multiple first hole positions, searching for the first time for multiple first hole positions adjacent to the target hole position, obtaining the actual thickness of the searched multiple first hole positions, and determining the corrected actual thickness of the target hole position; determining the actual back-drilling depth of the target hole position according to the corrected actual thickness, theoretical thickness and theoretical back-drilling depth of the target hole position. This back-drilling depth determination method first accurately determines the actual thickness of the target hole position, eliminates the influence of factors such as plate deformation on the plate thickness of each hole position, and improves the accuracy of the plate thickness. On the other hand, under the premise of ensuring the accuracy of the actual thickness of each hole position, the actual back-drilling depth of each hole position can be accurately and differentially determined to reduce errors and improve the back-drilling accuracy and yield rate.

[0038] In one embodiment of the present disclosure, the theoretical thickness and actual thickness of each hole position are compared to determine the first hole position and the abnormal hole position, including: when the difference between the theoretical thickness and the actual thickness is within a preset threshold range, it is determined as the first hole position, and when it is not within the preset threshold range, it is determined as an abnormal hole position. There are multiple hole positions distributed on the sub-circuit board, and the circuit board to be processed at each hole position has a predetermined plate thickness, and the thickness at different hole positions may be different. In actual application, the slight difference between the actual thickness and the theoretical thickness of each hole position directly affects the back drilling depth.

[0039] Therefore, after obtaining the theoretical thickness and actual thickness of multiple holes on the circuit board to be processed, the actual thickness and theoretical thickness of each hole should be compared first. When the difference between the theoretical thickness and the actual thickness of any hole is within the preset threshold range, the hole is determined to be the first hole, that is, a normal hole that is qualified. At the first hole, the difference between the theoretical thickness and the actual thickness meets the standard of being a sample. When the difference between the theoretical thickness and the actual thickness of any hole is not within the preset threshold range, the hole is determined to be an abnormal hole. The abnormal hole may be affected by measurement errors, plate warping or deformation, thermal expansion and contraction, etc., resulting in a large difference between the actual thickness and the theoretical thickness, which does not meet the standard of being a sample. First, multiple holes are screened and the abnormal holes are filtered out, which helps to improve the data accuracy of multiple first holes in the sample, provide accurate samples for subsequent thickness search and correction, and further improve the accuracy of the actual thickness of each hole and the accuracy of the back drilling depth.

[0040] In one embodiment of the present disclosure, the actual thickness of the multiple first hole positions searched is obtained, and the corrected actual thickness of the target hole position is determined, including: determining the corrected actual thickness of the target hole position according to the median or average of the actual thickness of the multiple first hole positions searched. Specifically, among the multiple first hole positions, any first hole position is selected as the target hole position according to a predetermined path and sequence. For the multiple first hole positions on the sub-circuit board, by selecting any first hole position as the target hole position in turn, the actual thickness of the first hole position is determined in turn, thereby determining the back drilling depth of the first hole position. Repeating multiple times, the back drilling depth of each first hole position is determined in turn on the entire circuit board to be processed.

[0041] After selecting the target hole position, the first search is performed for multiple first hole positions adjacent to the target hole position to obtain the actual thickness of these first hole positions. Figure 2 As shown, the first hole positions are arranged at intervals and distributed according to the layout structure of the circuit board, and the spacing between each two adjacent first hole positions is uncertain. When searching for multiple first hole positions adjacent to the target hole position, a predetermined search range or number is set to ensure that the multiple first hole positions searched meet the requirements of the sample collection standard. This search mainly calculates and determines the center spacing between multiple first hole positions and the target hole position first, and intercepts multiple first hole positions with the smallest spacing as samples. In some preferred embodiments of the present disclosure, 10 or 20 first hole positions adjacent to the target hole position can be selected. Then the actual thickness of these selected first hole positions is obtained. The actual thickness of multiple samples adjacent to the target hole position has a strong reference significance for the actual thickness of the target hole position, especially on ultra-large-scale circuit boards, where the spacing between each first hole position is very small, and the thickness of multiple adjacent first holes has a high degree of similarity.

[0042] After obtaining the actual thickness of multiple first holes adjacent to the target hole, the average or median of the actual thickness of the selected multiple first holes is calculated. Specifically, after selecting 20 adjacent first holes, the actual thickness values ​​of the 20 first holes are averaged or median is calculated. The average or median is used as parameter data of the actual thickness of the 20 first holes adjacent to the target hole.

[0043] In one embodiment of the present disclosure, the actual thickness of the target hole is compared with the median or average value Px. When the actual thickness P of the target hole is within the preset threshold range of the median or average value P0, the median or average value Px is determined as the corrected actual thickness of the target hole. Specifically, after determining the average value or median Px, it is compared with the actual thickness value P of the target hole. If P is within the threshold range of the Px value, the Px value is determined as the corrected actual thickness of the target hole. Finally, the actual back-drilling depth of the target hole is calculated and determined by the corrected actual thickness, theoretical thickness, and theoretical back-drilling depth of the target hole. For each first hole on the circuit board to be processed, the actual back-drilling depth is determined by determining the corrected actual thickness of the target hole.

[0044] When the actual thickness P of the target hole is not within the preset threshold range of the median or average value Px, a second search is conducted for multiple first holes adjacent to the target hole to determine the corrected actual thickness of the target hole. For the target hole, it may be a first hole in a recessed area or a raised area on the circuit board to be processed. There is a problem that the actual thickness of a single or several target holes is too large or too small, and there may be errors in a too small range. Therefore, the search range is expanded for the second time, and multiple first holes adjacent to the target hole are searched for the second time to obtain the actual thickness of the 50 first holes searched. The actual thickness values ​​of these 50 first holes are calculated to average or median. The average value or median Py is used as the parameter data of the actual thickness of the 50 first holes adjacent to the target hole. Py is compared with the actual thickness P of the target hole. If P is within the threshold range of the Py value, the Py value is determined as the corrected actual thickness of the target hole. Finally, the actual back drilling depth of the target hole is calculated and determined by the corrected actual thickness, theoretical thickness, and theoretical back drilling depth of the target hole.

[0045] In some embodiments of the present disclosure, the number of first hole positions searched for the second time is greater than the number of first hole positions searched for the first time; or, the range of the second search for the first hole positions is greater than the range of the first search for the first hole positions. The actual thickness of each hole position on the circuit board to be processed may vary greatly. When searching for multiple first hole positions adjacent to the target hole position as samples for the first time, if the median or average value Px is significantly different from the actual thickness P of the target hole position, or in other words, when P is not within the threshold range of Px, the search range is expanded, and multiple first hole positions adjacent to the target hole position are searched for the second time; the range and number of samples for the second search are greater than the range or number of samples for the first search, and a larger range of samples are sought, and a larger number of first hole positions are searched, thereby reducing interference caused by warping or deformation of the local sheet material of the circuit board to be processed, improving the accuracy of correcting the actual thickness and the accuracy of the back drilling depth, and reducing abnormal back drilling processing quality.

[0046] In some embodiments of the present disclosure, a first search is performed for multiple first hole positions adjacent to an abnormal hole position, and the actual thickness of the multiple first hole positions searched is obtained to determine the corrected actual thickness of the abnormal hole position. For abnormal hole positions, there may be measurement errors, thermal expansion and contraction, local deformation or warping of the plate, and other factors. The abnormal hole position also needs to correct the actual thickness. Similar to the first hole position, a first search is performed for multiple first hole positions adjacent to the abnormal hole position, and the corrected actual thickness of the abnormal hole position is determined based on the median or average of the actual thicknesses of the multiple first hole positions. Generally, the range and number of the search for multiple first hole positions adjacent to the abnormal hole position are greater than the range and number of the search for multiple first hole positions adjacent to the target hole position, so as to ensure the accuracy of the corrected actual thickness of the abnormal hole position, reduce the number of searches, and improve efficiency.

[0047] In some embodiments of the present disclosure, the search is to search for multiple first hole positions by spreading outward from the target hole position or the abnormal hole position as the center to determine the number and range of the multiple first hole positions searched. Figure 2 As shown, multiple first hole positions are distributed on multiple sub-circuit boards on the circuit board to be processed. After selecting a first hole position as the target hole position according to a predetermined rule and order, multiple first hole positions are diffused to the periphery with the target hole position as the center of the center circle, and the multiple first hole positions closest to the center of the circle are sorted according to the distance from the center of the circle, and the search is determined as the predetermined number of first hole positions searched. For abnormal hole positions, the search is also diffused to the periphery by the method of the center of the circle. That is to say, during the search process, the radius of the search circle is continuously expanded to ensure that the predetermined number of first hole positions can be captured. The target hole position requires 20 first hole positions as samples, and the abnormal hole position requires 40 first hole positions as samples. This search method of diffuse query from the center of the circle to the periphery can obtain multiple first hole positions closest to the target hole position or the abnormal hole position, thereby ensuring the accuracy of correcting the actual thickness.

[0048] like Figure 4 As shown, the present disclosure also provides a method for detecting the thickness of a circuit board, which is applied to a circuit board processing device, including: detecting the actual thickness of multiple holes on the circuit board to be processed; judging the first hole and the abnormal hole based on the difference between the actual thickness of each hole and the theoretical thickness; selecting a target hole from the multiple first hole, first searching multiple first holes adjacent to the target hole, obtaining the actual thickness of the searched multiple first holes, and determining the corrected actual thickness of the target hole according to the median or average of the actual thickness of the searched multiple first holes. This method for detecting the thickness of a circuit board first removes the interference of the abnormal hole to ensure the accuracy of the sample first hole, and then determines the corrected actual thickness of the target hole based on the median or average of the thickness of the multiple first holes adjacent to the target hole, which can reduce the interference of external factors and improve the accuracy of the thickness of each target hole on the circuit board to be processed.

[0049] In some embodiments of the present disclosure, a plurality of first hole positions adjacent to an abnormal hole position are searched for the first time, and the actual thicknesses of the plurality of first hole positions searched are obtained. The corrected actual thickness of the abnormal hole position is determined based on the median or average of the actual thicknesses of the plurality of first hole positions searched. On a circuit board to be processed, there are a plurality of first hole positions and abnormal hole positions. Based on the actual thicknesses of the plurality of first hole positions, the corrected actual thickness of the abnormal hole position is determined by searching the median or average of the actual thicknesses of the adjacent hole positions, thereby effectively reducing the interference of noise and improving the accuracy of the actual thickness of the abnormal hole position.

[0050] like Figure 5 As shown, the present disclosure also provides an object parameter generation method, which is applied to circuit board processing equipment, and the method includes: obtaining basic object parameters, the basic object parameters include theoretical thickness and actual thickness of multiple hole positions on the circuit board to be processed; comparing the theoretical thickness and actual thickness of each hole position, and determining the first hole position and abnormal hole position; searching for the first hole position adjacent to each hole position, and determining the corrected actual thickness of each hole position according to the median or average of the actual thicknesses of the multiple first hole positions searched. Generate target object parameters based on the corrected actual thickness and theoretical thickness of each hole position. Compare, search, and determine the corrected actual thickness based on the basic object parameters of each hole position on the circuit board to be processed, so as to produce target object parameters, and the circuit board processing equipment calls the target object parameters to complete the controlled depth back drilling processing and improve the processing accuracy.

[0051] In some embodiments of the present disclosure, the corrected actual thickness of each first hole position is determined based on the median or average of the actual thicknesses of multiple first hole positions searched adjacent to each first hole position; or the corrected actual thickness of each abnormal hole position is determined based on the median or average of the actual thicknesses of multiple first hole positions searched adjacent to each abnormal hole position. Whether it is the first hole position or the abnormal hole position, the corrected actual thickness is determined based on the median or average of the actual thicknesses of the adjacent first hole positions, thereby improving accuracy and reducing interference errors.

[0052] The method for determining backdrill depth, detecting circuit board thickness, and generating object parameters has the following beneficial effects: (1) It can realize independent thickness correction for each hole position on the circuit board to be processed, which can greatly improve the accuracy of the backdrill depth of each hole position. (2) It can not only perform thickness correction on the normal first hole position, but also perform thickness correction on abnormal hole positions, thereby reducing the backdrill depth abnormality caused by abnormal thickness, reducing the scrap rate of backdrilling, and improving product quality.

[0053] Application scenario 1

[0054] This embodiment takes a six-axis circuit board processing device as an example to explain in detail the specific application process of the back drilling depth determination method, the circuit board thickness detection method and the object parameter generation method.

[0055] In this embodiment, the circuit board processing equipment includes a workbench, a spindle assembly, a crossbeam and a base. The workbench is arranged on the base, and a crossbeam is mounted above the workbench. Six identical spindle assemblies are slidably connected to the crossbeam, and each spindle assembly moves along the first direction on the crossbeam. The workbench is on the base and moves along the second direction. Six processing positions are arranged on the workbench, and a circuit board to be processed is placed in each processing position. The spindle assembly moves along the third direction to process the circuit board to be processed carried on the corresponding processing position. In the upper and lower embodiments of the present disclosure, the first direction, the second direction, and the third direction are perpendicular to each other.

[0056] In this embodiment, the circuit board processing equipment includes a control system, and the control system has multiple built-in original object parameters for processing circuit boards, and the circuit boards to be processed correspond to the object parameters one by one. Figure 1 As shown, in the original object parameters, the circuit board 10 to be processed includes 20 sub-circuit boards 11, and each sub-circuit board 11 includes a plurality of hole positions, such as Figure 2 As shown, the sub-circuit board 11 includes a plurality of first holes 110 and abnormal holes 111, and the plurality of first holes 110 and abnormal holes 111 are arranged on the sub-circuit board at predetermined intervals. The spindle assembly clamps the tool to perform back drilling on each first hole 110 and abnormal hole 111 on the circuit board 10 to be processed.

[0057] In this embodiment, the spindle assembly includes a detection member, which is implemented as a CBD assembly. The spindle clamps a standard rod to detect the conductive properties of the metal on the surface of the circuit board to be processed and the surface of the workbench, and respectively detects the thickness of the plate at each hole position of each circuit board to be processed. For the first hole position 110 and the abnormal hole position 111 of each sub-circuit board on the circuit board to be processed, the CBD can detect the actual thickness, and the theoretical thickness is known. The actual thickness and the theoretical thickness are obtained to prepare for determining and correcting the actual thickness.

[0058] In the control system of the circuit board processing equipment, object parameters corresponding to the circuit boards to be processed are preset, and the adapted object parameters are called to control the spindle assembly to process each hole position on the circuit board to be processed. In order to obtain the back drilling depth, an object parameter determination method is first applied to the circuit board processing equipment. Specifically, Figure 5 As shown, this object parameter determination method includes: obtaining basic object parameters, the basic object parameters include theoretical thickness and actual thickness of multiple hole positions on the circuit board to be processed; comparing the theoretical thickness and actual thickness of each hole position to determine the first hole position and abnormal hole position; searching for the first hole position adjacent to each hole position, and determining the corrected actual thickness of each hole position according to the median or average of the actual thicknesses of the multiple first hole positions searched. According to the corrected actual thickness and theoretical thickness of each hole position, the target object parameters are generated. In the object parameters, the first hole position and abnormal hole position of the circuit board to be processed are corrected, and the corrected actual thickness is determined according to the median or average of the actual thicknesses of the multiple first hole positions searched adjacent to each first hole position or abnormal hole position, which provides more accurate basic data for back drilling processing and improves processing accuracy.

[0059] In the process of generating the target object parameters, a method for detecting the thickness of the circuit board is applied, such as Figure 4 As shown, it specifically includes: detecting the actual thickness of multiple hole positions on the circuit board to be processed; judging the first hole position and the abnormal hole position based on the difference between the actual thickness and the theoretical thickness of each hole position; selecting a target hole position from the multiple first hole positions, searching for the first time the multiple first hole positions adjacent to the target hole position, obtaining the actual thickness of the searched multiple first hole positions, and determining the corrected actual thickness of the target hole position according to the median or average of the actual thickness of the searched multiple first hole positions.

[0060] On the circuit board to be processed, the detection part CBD is first used to detect the actual thickness of multiple holes, and the actual thickness of each hole is compared with the theoretical thickness. When the difference between the two is greater than or equal to the threshold, the hole is judged as an abnormal hole. When the difference between the two is less than the threshold, it is judged as the first hole. The threshold here can be set to 10% of the theoretical thickness. After the first hole is screened out, the abnormal holes are filtered out to avoid the interference of abnormal holes on the sample data, reduce data noise, and improve accuracy.

[0061] Secondly, according to the predetermined path and order, each first hole position 110 is selected as the target hole position 112 in turn, and the 20 first hole positions adjacent to the target hole position 112 are searched for the first time, and the actual thickness of the 20 first hole positions searched is obtained, and the corrected actual thickness of the target hole position is determined according to the median or average value of the 20 actual thicknesses. The 20 first hole positions here are the 20 first hole positions closest to the target hole position, and the search method is to calculate the spacing with the center coordinates of the target hole position 112, sort according to the spacing, intercept the 20 first hole positions with the smallest spacing, and obtain the actual thickness of these 20 first hole positions, and calculate the average value according to the 20 actual thicknesses, and determine this average value as the corrected actual thickness of the target hole position.

[0062] In this embodiment, if Figure 3 As shown, a back-drilling depth determination method is also disclosed. This method for confirming the back-drilling depth can accurately calculate the back-drilling depth based on detecting the thickness of the plate at each hole position on the circuit board to be processed, thereby improving the back-drilling processing accuracy. The method for determining the back-drilling depth includes: obtaining the theoretical thickness and actual thickness of multiple hole positions on the circuit board to be processed; comparing the theoretical thickness and actual thickness of each hole position to determine the first hole position and the abnormal hole position; selecting a target hole position from the multiple first hole positions, searching for multiple first hole positions adjacent to the target hole position for the first time, obtaining the actual thickness of the searched multiple first hole positions, and determining the corrected actual thickness of the target hole position; determining the actual back-drilling depth of the target hole position according to the corrected actual thickness, theoretical thickness and theoretical back-drilling depth of the target hole position.

[0063] In this embodiment, the actual thickness of multiple holes on the circuit board to be processed is detected by CBD, and then the theoretical thickness is obtained, and the actual thickness of the circuit board to be processed at each hole is compared with the theoretical thickness. When the difference between the actual thickness and the theoretical thickness is greater than or equal to a predetermined threshold, it is determined to be an abnormal hole, and when the difference between the actual thickness and the theoretical thickness is less than the predetermined threshold, it is determined to be the first hole. In this embodiment, the predetermined threshold range is 10% of the theoretical thickness.

[0064] According to the predetermined path and sequence, such as Figure 2 As shown, one of the multiple first hole positions 110 is selected as the target hole position 112, and the central coordinates of the target hole position 112 are used as the center of the circle to search for multiple first hole positions 110 near the target hole position 112, and the actual thicknesses of these first hole positions 110 are obtained. The multiple first hole positions 110 are sorted according to the distance from the central coordinates of the target hole position, and the actual thicknesses of the 20 first hole positions 110 with the smallest distance are intercepted, and the average value P1 of the 20 actual thicknesses is calculated.

[0065] The actual thickness of the target hole position is P. The average value P1 is compared with the actual thickness P. If the actual thickness P is within the threshold range of the average value P1, P1 is determined to be the corrected actual thickness of the target hole position 112. If P is not within the threshold range of P1, a second search is performed for multiple first hole positions adjacent to the target hole position. In this embodiment, the threshold range of P1 is: upper limit P1+8%*P1, lower limit P1-8%*P1. In other words, P1 is set with an upper and lower limit error range of 8%.

[0066] The multiple first hole positions 110 adjacent to the target hole position 112 are searched for the second time to obtain the actual thickness of the multiple first hole positions, sort the multiple first hole positions according to the spacing from the center coordinates of the target hole position 112, intercept the 50 first hole positions 110 with the smallest spacing, and calculate the average value P2 of the actual thickness of the 50 first hole positions 110. Similarly, the target hole position P is compared with the average value P2 obtained by the second search. If P is within the threshold range of P2, P2 is determined to be the corrected actual thickness of the target hole position. If P is not within the threshold range of P2, multiple first hole positions adjacent to the target hole position are searched for the third time until P and the average value meet the threshold range requirements. In this embodiment, the threshold range of the average value P2 obtained by the second search is: upper limit P2+10%*P2, lower limit P2-10%*P2. That is, P2 sets an upper and lower limit error range of 10%.

[0067] It should be noted that, whether it is the first search or the second search, the center coordinate of the target hole position 112 is used as the center of the circle to find multiple first hole positions 110 adjacent to the target hole position 112, and multiple searches are performed to obtain multiple samples, thereby reducing the impact of local board warping or deformation on the thickness of the circuit board to be processed. In the first search, the second search, and the subsequent multiple searches that may occur, each search obtains more first hole positions than the previous search, that is, the latter search expands the search range and obtains more first hole positions than the previous search, which helps to improve the accuracy of the sample.

[0068] In this embodiment, the abnormal hole 111 also needs back drilling, but the thickness of the abnormal hole may be greatly affected by various factors such as detection and local deformation of the plate, resulting in abnormal thickness. As with the first hole, the method of searching for multiple adjacent first hole positions is also used to obtain the average value of the 40 adjacent first hole positions, and the average value is determined as the corrected actual thickness of the abnormal hole position, but the abnormal hole position does not need to be compared and judged within the threshold range. It should be noted that, whether it is the first hole position or the abnormal hole position, the abnormal hole position must be filtered out during the search process, and only the first hole position is selected as the sample for obtaining the average value, thereby improving accuracy.

[0069] In this embodiment, after determining the corrected actual thickness of the target hole, the actual backdrilling depth can be determined based on the ratio of the corrected actual thickness to the theoretical thickness and the ratio of the actual backdrilling depth to the theoretical backdrilling depth, with a fixed coefficient K between the two ratios.

[0070] The above-mentioned back-drilling depth determination method, circuit board thickness detection method, and object parameter generation method of this embodiment can, on the one hand, realize independent thickness correction for each hole position on the circuit board to be processed, which can greatly improve the accuracy of the back-drilling depth of each hole position. On the other hand, not only the thickness correction is performed on the normal first hole position, but also the thickness correction can be performed on the abnormal hole position, reducing the back-drilling depth abnormality caused by abnormal thickness, reducing the back-drilling scrap rate, and improving product quality.

[0071] Application scenario 2

[0072] This embodiment takes a 6-axis circuit board processing device as an example to explain in detail the specific application process of the back drilling depth determination method, the circuit board thickness detection method and the object parameter generation method.

[0073] The circuit board processing equipment of this embodiment is the same as that of the first embodiment. The back drilling depth determination method, the method for detecting the circuit board thickness and the object parameter generation method are basically the same as those of the first embodiment. The difference from the first embodiment is that the actual thickness of multiple first hole positions is searched and obtained, and the median of multiple thicknesses is calculated. In this embodiment, the median refers to multiple actual thicknesses arranged in order of size, and a thickness value in the middle is intercepted as the corrected actual thickness. In other words, the median must be the actual thickness of a first hole position, and the mean is the average of multiple actual thicknesses, not necessarily the actual thickness of a certain hole position.

[0074] In this embodiment, when searching for multiple first hole positions adjacent to the target hole position for the first time, the multiple first hole positions are sorted according to the spacing from the center coordinates of the target hole position, and the 11 first hole positions with the smallest spacing are intercepted. The 11 first hole positions are sorted according to the numerical value of the actual thickness, and the actual thickness of the sixth hole position in the middle is selected as the median P3. As in the first embodiment, the actual thickness P of the target hole position is compared with the median P3. If the threshold requirement is met, P3 is determined as the corrected actual thickness of the target hole position. In this embodiment, the threshold range of the median P3 of the first search is: upper limit P3+P3*5%, lower limit P3-P3*5%, that is, the upper and lower limit error range of P3 is 5%. When the actual thickness P and P3 of the target hole position do not meet the threshold range, a second search is performed, and the search range is expanded for the second time. The central coordinate of the target hole position is used as the center of the circle, and multiple adjacent first hole positions are searched. 99 first hole positions are intercepted and sorted according to the spacing. The 99 first hole positions are sorted according to the actual thickness, and the actual thickness of the 50th first hole position in the middle is selected as the median P4. The target hole position P and the median P4 are compared. When both meet the threshold requirements, P4 is determined to be the corrected actual thickness of the target hole position. In this embodiment, the threshold range of P4 is the same as the threshold range of P3: the upper limit P4+P4*5%, the lower limit P4-P4*5%, that is, the upper and lower limit error range of P4 is 5%.

[0075] In this embodiment, for abnormal hole positions, the corrected actual thickness is also determined by searching and selecting the median, which will not be described in detail here.

[0076] Similar to the first embodiment, this embodiment also selects each first hole position as the target hole position in turn, determines the corrected actual thickness of the circuit board to be processed at the target hole position, and then determines the actual backdrilling depth at the target hole position through the proportional relationship between the theoretical thickness at the target hole position and the theoretical backdrilling thickness. This backdrilling depth determination method, circuit board thickness detection method, and object parameter generation method, on the one hand, can realize independent thickness correction for each hole position on the circuit board to be processed, which can greatly improve the accuracy of the backdrilling depth of each hole position. On the other hand, thickness correction can be performed not only for normal first hole positions, but also for abnormal hole positions, thereby reducing backdrilling depth abnormalities caused by abnormal thickness, reducing backdrilling scrap rate, and improving product quality.

[0077] The embodiments of the present disclosure have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements in the marketplace, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein. The scope of the present disclosure is defined by the appended claims.

Claims

1. A method for determining back drilling depth, characterized in that: include: Obtaining theoretical thickness and actual thickness of multiple hole positions on the circuit board to be processed; comparing the theoretical thickness and actual thickness of each hole position to determine the first hole position and the abnormal hole position; Selecting a target hole position from the plurality of first hole positions, searching for a first time a plurality of first hole positions adjacent to the target hole position, obtaining actual thicknesses of the plurality of searched first hole positions, and determining a corrected actual thickness of the target hole position; The actual back-drilling depth of the target hole position is determined according to the corrected actual thickness, the theoretical thickness and the theoretical back-drilling depth of the target hole position.

2. The back drilling depth determination method according to claim 1, characterized in that: The acquiring the actual thicknesses of the plurality of first hole positions that are searched out and determining the corrected actual thickness of the target hole position includes: determining the corrected actual thickness of the target hole position according to the median or average of the actual thicknesses of the plurality of first hole positions that are searched out.

3. The back drilling depth determination method according to claim 2, characterized in that: The actual thickness of the target hole position is compared with the median or the average value, and when the actual thickness of the target hole position is within a preset threshold range of the median or the average value, the median or the average value is determined as the corrected actual thickness of the target hole position.

4. The back drilling depth determination method according to claim 3, characterized in that: When the actual thickness of the target hole position is not within a preset threshold range of the median or the average value, a plurality of first hole positions adjacent to the target hole position are searched for a second time to determine a corrected actual thickness of the target hole position.

5. The back drilling depth determination method according to claim 4, characterized in that: The number of the first hole positions searched for the second time is greater than the number of the first hole positions searched for the first time; or, the range of the second search for the first hole positions is greater than the range of the first search for the first hole positions.

6. The back drilling depth determination method according to claim 1, characterized in that: The comparing of the theoretical thickness and the actual thickness of each hole position to determine the first hole position and the abnormal hole position includes: when the difference between the theoretical thickness and the actual thickness is within a preset threshold range, determining it as the first hole position, and when it is not within the preset threshold range, determining it as the abnormal hole position.

7. The back drilling depth determination method according to claim 1, characterized in that: A first search is performed for a plurality of first hole positions adjacent to the abnormal hole position, actual thicknesses of the plurality of first hole positions searched are acquired, and a corrected actual thickness of the abnormal hole position is determined.

8. The back drilling depth determination method according to any one of claims 1 to 7, characterized in that: The search is to query multiple first hole positions by spreading outward from the target hole position or the abnormal hole position as the center of the circle to determine the number and range of the multiple first hole positions searched.

9. A method for detecting the thickness of a circuit board, characterized in that: Applied to circuit board processing equipment, including: Detecting the actual thickness of multiple holes on the circuit board to be processed; judging the first hole and the abnormal hole based on the difference between the actual thickness and the theoretical thickness of each hole; A target hole position is selected from the plurality of first hole positions, a plurality of first hole positions adjacent to the target hole position are searched for the first time, actual thicknesses of the plurality of searched first hole positions are obtained, and a corrected actual thickness of the target hole position is determined based on a median or an average of the actual thicknesses of the plurality of searched first hole positions.

10. The method for detecting the thickness of a circuit board according to claim 9, characterized in that: A plurality of first hole positions adjacent to the abnormal hole position are searched for the first time, actual thicknesses of the plurality of first hole positions searched are obtained, and a corrected actual thickness of the abnormal hole position is determined according to a median or an average of the actual thicknesses of the plurality of first hole positions searched.

11. A method for generating object parameters, characterized in that: Applied to circuit board processing equipment, the method comprises: Acquire basic object parameters, wherein the basic object parameters include theoretical thickness and actual thickness of a plurality of hole positions on the circuit board to be processed; compare the theoretical thickness and actual thickness of each hole position to determine a first hole position and an abnormal hole position; Searching for a first hole position adjacent to each of the hole positions, and determining a corrected actual thickness of each of the hole positions according to a median or an average of actual thicknesses of the searched first hole positions; The target object parameters are generated according to the corrected actual thickness and theoretical thickness of each hole position.

12. The object parameter generation method according to claim 11, characterized in that: Determine the corrected actual thickness of each first hole position according to the median or average of the actual thicknesses of a plurality of first hole positions searched adjacent to each first hole position; or, The corrected actual thickness of each abnormal hole position is determined according to the median or average of the actual thicknesses of a plurality of first hole positions searched and adjacent to each abnormal hole position.

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